JP4011843B2 - Component mounting apparatus and component delivery method used in the apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus for manufacturing a liquid crystal panel or the like, and more particularly to a component mounting apparatus for mounting an electronic component punched from a film carrier on a substrate by pressure bonding and a component delivery method used in the apparatus. .
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a component mounting apparatus for manufacturing a liquid crystal panel or the like, a component mounting apparatus is known in which an electronic component punched from a film carrier is pressure-bonded and mounted on a substrate. In such a component mounting apparatus, generally, an electronic component punched from a film carrier is delivered between a punching device (punch) and a nozzle, and the electronic component is transferred to a delivery position to a crimping device or the like by moving the nozzle. It has become. Further, the electronic component transferred to the delivery position by the movement of the nozzle is delivered between the nozzle and the head, and the electronic component is transferred from the delivery position to the crimping position by the movement of the head.
[0003]
Here, the above-described punching device (punch), nozzle and head also serve as a suction holding mechanism for holding electronic components by vacuum suction, and by controlling the suction state of these suction holding mechanisms, the delivery side Electronic parts are delivered between the suction holding mechanism and the suction holding mechanism on the receiving side. In addition, each of the punching device (punch), the nozzle, and the head, which are suction holding mechanisms, is provided with a suction sensor for detecting whether or not the electronic component is sucked, and the suction sensor provided in the suction holding mechanism on the receiving side is provided. The vacuum suction state of the suction holding mechanism on the delivery side is released when the electronic component is turned on (the electronic component is sucked), and the suction sensor provided in the suction holding mechanism on the delivery side is turned off (the electronic component is not sucked). At this time, the suction holding mechanism on the receiving side is separated from the suction holding mechanism on the delivery side.
[0004]
[Problems to be solved by the invention]
By the way, in the conventional component mounting apparatus described above, when an electronic component is delivered between a plurality of suction holding mechanisms, both the suction side holding mechanism on the delivery side and the receiving side are simultaneously in a vacuum suction state. When the thickness of the target electronic component is reduced, the electronic component often does not move normally from the delivery side suction holding mechanism to the reception side suction holding mechanism. Note that, in the conventional component mounting apparatus, the occurrence of a suction error is generally determined based on whether or not the suction sensor provided in the suction holding mechanism on the receiving side is turned on. Operators are urged by calls.
[0005]
However, in the conventional component mounting apparatus described above, it is determined that a suction error has occurred when the suction sensor provided in the suction holding mechanism on the receiving side is not turned on. Therefore, when a gap is generated between the electronic component to be delivered and the suction holding mechanism on the receiving side, such as when the type of electronic component is changed to a thin one, suction errors frequently occur, There is a problem that the operation rate is lowered due to the suspension of the component mounting apparatus, and that it takes time to recover.
[0006]
The present invention has been made in consideration of such points, and effectively reduces the occurrence of suction errors when transferring electronic components between a plurality of suction holding mechanisms, thereby improving and restoring the operating rate. It is an object of the present invention to provide a component mounting apparatus and a component delivery method used in the apparatus that can reduce the labor.
[0007]
[Means for Solving the Problems]
As a first solution, the present invention provides a component mounting apparatus for mounting an electronic component on a substrate, a first suction holding mechanism for holding the electronic component mounted on the substrate by vacuum suction, and the first suction. A second suction holding mechanism that receives the electronic component held by the holding mechanism by vacuum suction; a suction sensor that detects whether or not the electronic component is sucked by the second suction holding mechanism; the first suction holding mechanism; A controller for controlling a suction state of the first suction holding mechanism and the second suction holding mechanism based on a detection result of the suction sensor so as to deliver an electronic component to and from the two suction holding mechanisms; The first suction holding mechanism and the second suction holding mechanism are both in a vacuum suction state, the detection result of the suction sensor is judged, and an electronic component is placed in the second suction holding mechanism. When it is determined that the first suction holding mechanism is attached, the vacuum suction state of the first suction holding mechanism is released and a predetermined normal termination process is performed. On the other hand, it is determined that no electronic component is sucked by the second suction holding mechanism. Sometimes, the vacuum suction state of the first suction holding mechanism is released and the detection result of the suction sensor is determined again, and as a result, when it is determined that the electronic component is sucked by the second suction holding mechanism, Provided is a component mounting apparatus that performs normal termination processing.
[0008]
In the first solving means described above, when the controller determines again that the detection result of the suction sensor is not attracted to the second suction holding mechanism, the controller determines a predetermined value. It is preferable to perform the abnormal termination process. The first suction holding mechanism is provided in a punching device that punches out electronic components from a film carrier, and the second suction holding mechanism is provided in a component transfer device that transports electronic components punched out by the punching device. Preferably it is. Furthermore, the first suction holding mechanism is provided in a component transfer device that transfers electronic components punched from the film carrier, and the second suction holding mechanism transfers the electronic components transferred by the component transfer device onto the substrate. It may be provided in another component transfer device.
[0009]
As a second solution, the present invention provides a component delivery method for delivering an electronic component mounted on a substrate between a plurality of suction holding mechanisms, and holding the electronic component by a first suction holding mechanism in a vacuum suction state. A second suction holding mechanism that receives an electronic component from the first suction holding mechanism and a vacuum suction state together with the first suction holding mechanism; and a step of sucking the electronic component by the second suction holding mechanism. Based on the detection result of the suction sensor that detects presence / absence, it is determined whether or not the electronic component is sucked to the second suction holding mechanism, and it is determined that the electronic component is sucked to the second suction holding mechanism. A step of releasing the vacuum suction state of the first suction holding mechanism and performing a predetermined normal termination process, and when it is determined that no electronic component is sucked by the second suction holding mechanism The vacuum suction state of the first suction holding mechanism is released and the detection result of the suction sensor is determined again. As a result, when it is determined that the electronic component is sucked by the second suction holding mechanism, the normal A component delivery method including a step of performing a termination process.
[0010]
In the second solving means described above, even if the detection result of the suction sensor is determined again, if it is determined that the electronic component is not sucked by the second suction holding mechanism, a predetermined abnormal termination process is performed. Preferably, the method further includes the step of performing.
[0011]
According to the first and second solving means of the present invention, when the electronic component is transferred between the first suction holding mechanism and the second suction holding mechanism, the first suction holding mechanism and the second suction holding mechanism are provided. When both are in a vacuum suction state, it is determined whether or not an electronic component is attracted to the first suction holding mechanism, and an abnormality is immediately detected when it is determined that the electronic component is not attracted to the first suction holding mechanism. Since the vacuum suction state of the first suction holding mechanism is released and the second suction holding mechanism is re-determined whether or not the electronic component has been sucked without performing the end process, the suction error is effectively generated. Therefore, the operating rate can be improved and the labor required for recovery can be reduced.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views for explaining an embodiment of a component mounting apparatus according to the present invention.
[0013]
First, the overall configuration of the component mounting apparatus 10 according to the present embodiment will be described with reference to FIG. As shown in FIG. 1, the component mounting apparatus 10 is for mounting an electronic component 42 by pressure bonding on a substrate 43 such as a liquid crystal panel, and punching the electronic component 42 from a tape-shaped film carrier 41. The electronic component 42 punched by the punching device 11 is received at the electronic component receiving position P and transferred from the electronic component receiving position P to the electronic component delivery position H, and transferred by the component transferring device 14. The electronic component 42 is received at the electronic component delivery position H, and a component crimping device 20 that crimps the electronic component 42 onto the substrate 43 is provided.
[0014]
Among these, the punching device 11 has an upper die 12 and a lower die 13 that are arranged to face each other with the film carrier 41 interposed therebetween. Here, a punch (adsorption holding mechanism) 12a is provided on the lower surface of the upper die 12, and a through hole 13a penetrating in the vertical direction is provided on the lower die 13. The upper die 12 is lowered to punch the upper die 12. The electronic component 42 is punched from the film carrier 41 by pushing the 12a into the through hole 13a of the lower mold 13. The punch 12a of the upper mold 12 is provided with a vacuum suction hole 12b so that the electronic component 42 after punching can be held by vacuum suction.
[0015]
The component transfer device 14 includes a nozzle (suction holding mechanism) 15 that holds the electronic component 42 punched by the punching device 11 by vacuum suction, and the electronic component 42 held by the punch 12a of the upper die 12 is lowered to the lower die. It can be received by vacuum suction from below 13 through the through hole 13a. The nozzle 15 is attached to the rotary shaft 18 of the θ-axis drive unit 17 so that the nozzle 15 rotates about its axis. Further, the θ-axis drive unit 17 is provided on the XY-axis drive unit 19, and the nozzle 15 moves in the XY plane together with the θ-axis drive unit 17. The θ-axis drive unit 17 is provided with an elevating mechanism (not shown) that moves the rotary shaft 18 in the vertical direction, and the nozzle 15 is raised and lowered together with the rotary shaft 18.
[0016]
FIG. 2 is a diagram showing a control system for controlling the delivery of the electronic component 42 between the punch 12a of the punching device 11 and the nozzle 15 of the component transfer device 14 in the component mounting apparatus 10 shown in FIG. As shown in FIG. 2, vacuum suction mechanisms 34 and 37 are connected to the punch 12a and the nozzle 15 via vacuum suction tubes 33 and 36, respectively. The vacuum suction pipes 33 and 36 are provided with suction sensors 35 and 38 for detecting whether or not the electronic parts 42 are sucked by the punch 12a and the nozzle 15 based on the pressure change in the vacuum suction pipes 33 and 36, respectively. It has been. Note that the vacuum suction mechanisms 34 and 37 and the suction sensors 35 and 38 are the drive unit of the component mounting apparatus 10 (the lifting mechanism (not shown) of the upper mold 12), the θ-axis drive unit 17, the XY-axis drive unit 19, and index drive. Portion 24, pressurizing cylinders 26, 26, movable table 28, etc.), and the vacuum suction mechanisms 34, 37 are controlled on the basis of the detection results of the suction sensors 35, 38. The adsorption state of 12a and the nozzle 15 can be controlled.
[0017]
Returning to FIG. 1, the component crimping device 20 also serves as a component transfer device that transports the electronic component 42 from the electronic component delivery position H to the electronic component crimping position B, and an index driving unit that rotates the rotating shaft 25 intermittently. 24. Four arms 21 are attached to the rotary shaft 25 of the index drive unit 24 so as to protrude outward, and each of the arms 21 rotates in a certain direction. Each arm 21 supports a thermocompression bonding head (adsorption holding mechanism) 23 via a support member 22 so as to be movable up and down. Here, the thermocompression bonding heads 23 are sequentially positioned at the electronic component delivery position H and the electronic component crimping position B as the arms 21 rotate. Pressure cylinders 26 and 26 are provided at the electronic component delivery position H and the electronic component crimping position B, respectively, and heat is applied by pressure members 27 and 27 supported so as to be movable up and down with respect to the pressure cylinders 26 and 26. The pressure-bonding heads 23 and 23 are pressurized downward. Here, each thermocompression-bonding head 23 is provided with a vacuum suction hole (not shown) on its lower surface so that the electronic component 42 held by the nozzle 15 can be received by vacuum suction. Each thermocompression bonding head 23 is connected to a vacuum suction mechanism (not shown) and a suction sensor (not shown) via a vacuum suction tube (not shown), as in FIG. Under the control of 39, the suction state of each thermocompression bonding head 23 can be controlled by controlling the vacuum suction mechanism based on the detection result of the suction sensor. Thereby, the electronic component 42 is delivered between the nozzle 15 and the thermocompression bonding head 23 at the electronic component delivery position H, and the electronic component 42 held by the thermocompression bonding head 23 at the electronic component crimping position B is the substrate. It is crimped onto 43.
[0018]
The substrate 43 is placed on the movable table 28. The movable table 28 includes a mounting table 32 that holds the substrate 43 by suction, and an X-axis table 29, a Y-axis table 30, and a θ-axis table 31 for moving the mounting table 32 to the X, Y, and θ axes. The substrate 43 moves in the XY plane by driving the X-axis table 29 and the Y-axis table 30, and the substrate 43 rotates in the XY plane by driving the θ-axis table 31. It has become.
[0019]
Next, the operation of the present embodiment having such a configuration will be described with reference to FIGS. FIG. 3 is a diagram for explaining the operation of the control system shown in FIG.
[0020]
Under the control of the controller 39, first, the upper die 12 of the punching device 11 is lowered with respect to the lower die 13 by an elevating mechanism (not shown), and the punch 12a of the upper die 12 is inserted into the through hole 13a of the lower die 13. The electronic component 42 is punched out of the film carrier 41 by being pushed in.
[0021]
At this time, the punch 12a of the upper die 12 is in a vacuum suction state (suction on) by the vacuum suction mechanism 34, and the punched electronic component 42 is held by the delivery-side punch 12a (step 101). The delivery-side punch 12a waits for the receiving-side nozzle 15 to rise in this state.
[0022]
Next, the nozzle 15 is raised to the receiving level of the electronic component 42 held by the punch 12a (step 102). Here, the receiving level is set to a height at which the lower surface (FIG. 2) of the electronic component 42 held by the punch 12a and the electronic component suction surface of the nozzle 15 are substantially at the same level. Further, the vacuum suction mechanism 37 is controlled to bring the nozzle 15 into a vacuum suction state (step 103).
[0023]
After the punch 12a and the nozzle 15 are both brought into the vacuum suction state in this way, it is determined whether or not the electronic component 42 is sucked to the nozzle 15 based on the detection result of the suction sensor 38 (on / off of the suction sensor 38). (Step 104).
[0024]
In step 104, when it is determined that the electronic component 42 is sucked by the nozzle 15 (the suction sensor 38 is on), the vacuum suction state of the punch 12a is released (suction off) (step 105), and a predetermined normal end process is performed. I do. Specifically, it is determined whether or not the electronic component 42 has been removed from the punch 12a based on the detection result of the suction sensor 35 (step 106), and when it is determined that the electronic component 42 has been removed from the punch 12a. The nozzle 15 is lowered (step 107). If it is determined in step 106 that the electronic component 42 has not been removed from the punch 12a, a predetermined abnormal termination process (such as an operator call) is performed (step 110).
[0025]
On the other hand, when it is determined in step 104 that the electronic component 42 is not attracted to the nozzle 15 (the suction sensor 38 is turned off), the vacuum suction state of the punch 12a is released (step 108), and after a predetermined time has elapsed. Then, the detection result of the adsorption sensor 38 is judged again (step 109). In step 109, when it is determined that the electronic component 42 is attracted to the nozzle 15, the process proceeds to step 105, and the normal termination process described above is performed. When it is determined in step 109 that the electronic component 42 is not attracted to the nozzle 15, the above-described abnormal termination process is performed (step 110).
[0026]
When the electronic component 42 is normally delivered between the punch 12a and the nozzle 15 in this manner, the electronic component held by the nozzle 15 by the θ-axis drive unit 17 and the XY-axis drive unit 19 of the component transfer device 14. 42 is transferred from the electronic component receiving position P to the electronic component delivery position H.
[0027]
Thereafter, the thermocompression bonding head 23 in the vacuum suction state, which is positioned at the electronic component delivery position H, is pressurized by the pressure member 27 of the pressure cylinder 26 and falls to the reception level of the electronic component 42 held by the nozzle 15. . As a result, the electronic component 42 is delivered between the nozzle 15 and the thermocompression bonding head 23 at the electronic component delivery position H. In addition, the delivery of the electronic component 24 between the nozzle 15 and the thermocompression bonding head 23 can be performed in the same procedure as the flowchart shown in FIG.
[0028]
The thermocompression bonding head 23 to which the electronic component 42 has been delivered at the electronic component delivery position H is positioned at the electronic component crimping position B as the arms 21 are rotated by the index driving unit 24. Then, at the electronic component crimping position B, the thermocompression bonding head 23 is pressed and lowered by the pressure member 27 of the pressure cylinder 26, and the electronic component 42 held by the thermocompression bonding head 23 is crimped onto the substrate 43. Is done.
[0029]
As described above, according to the present embodiment, when the electronic component 42 is delivered between the punch 12a and the nozzle 15, both the punch 12a and the nozzle 15 are in a vacuum suction state, and then the suction sensor 38 on the receiving side. When it is determined that the electronic component 42 is not attracted to the nozzle 15, the vacuum suction state of the punch 12 a is canceled and the detection result of the suction sensor 35 is immediately performed without performing abnormal termination processing. Therefore, it is possible to effectively reduce the occurrence of an adsorption error and improve the operating rate and reduce the labor required for recovery. That is, a gap is formed between the electronic component 42 held by the punch 12a and the nozzle 15 raised to the receiving level, and the nozzle 15 can suck the electronic component 42 even if the nozzle 15 is in a vacuum suction state. Even when it is determined from the detection result of the suction sensor 38 that the electronic component 42 is not attracted to the nozzle 15, the holding force of the electronic component 42 by the punch 12 a is released by releasing the vacuum suction state of the punch 12 a. Is released or weakened, and the electronic component 42 held by the punch 12 a can be attracted to the nozzle 15 by the vacuum suction force of the nozzle 15. As a result, the occurrence of adsorption errors can be reduced.
[0030]
The present invention is not limited to the embodiment described above. For example, the thermocompression bonding head 23 has been described with reference to an example in which the electronic component 42 is also used as a transfer unit that transfers the electronic component 42 from the electronic component delivery position H to the electronic component crimping position B. Using a thermocompression bonding head 23 in which an electronic component 42 positioned at the electronic component crimping position B is disposed at the electronic component crimping position B by separately providing a component transfer device for transferring to the electronic component crimping position B. You may make it crimp on 43. Moreover, although the electronic component 42 punched out from the film carrier 41 has been described as an example, the present invention is not limited to this, and can be applied to other electronic components such as a chip-shaped electronic component.
[0031]
【The invention's effect】
As described above, according to the present invention, it is possible to effectively reduce the occurrence of a suction error when transferring an electronic component among a plurality of suction holding mechanisms, thereby improving the operating rate and reducing the effort required for recovery. be able to.
[Brief description of the drawings]
FIG. 1 is a diagram showing an overall configuration of an embodiment of a component mounting apparatus according to the present invention.
2 is a diagram showing a control system for controlling delivery of electronic components between a punch of a punching device and a nozzle of a component transfer device in the component mounting apparatus shown in FIG. 1;
FIG. 3 is a diagram for explaining the operation of the control system shown in FIG. 2;
[Explanation of symbols]
10 Component mounting device 11 Punching device 12 Upper die 12a Punch (Suction holding mechanism)
12b Vacuum suction hole 13 Lower mold 13a Through hole 14 Component transfer device 15 Nozzle (Suction holding mechanism)
17 θ-axis drive unit 18 Rotating shaft 19 XY-axis drive unit 20 Component crimping device 21 Arm 22 Support member 23 Thermocompression bonding head (adsorption holding mechanism)
24 Index drive unit 25 Rotating shaft 26 Pressure cylinder 27 Pressure member 28 Movable table 29 X-axis table 30 Y-axis table 31 θ-axis table 32 Mounting table 41 Film carrier 42 Electronic component 43 Substrate P Electronic component receiving position H Electronic component delivery Position B Electronic component crimping position

Claims (6)

In a component mounting apparatus that mounts electronic components on a board,
A first suction holding mechanism for holding electronic components mounted on a substrate by vacuum suction;
A second suction holding mechanism for receiving the electronic component held by the first suction holding mechanism by vacuum suction;
A suction sensor for detecting whether or not the electronic component is sucked by the second suction holding mechanism;
Based on the detection result of the suction sensor, the suction states of the first suction holding mechanism and the second suction holding mechanism are changed so that the electronic component is delivered between the first suction holding mechanism and the second suction holding mechanism. A controller to control,
The controller determines the detection result of the suction sensor after both the first suction holding mechanism and the second suction holding mechanism are in a vacuum suction state, and the electronic component is sucked into the second suction holding mechanism. When it is determined, the vacuum suction state of the first suction holding mechanism is released and a predetermined normal termination process is performed. On the other hand, when it is determined that no electronic component is suctioned by the second suction holding mechanism, When the vacuum suction state of the first suction holding mechanism is released and the detection result of the suction sensor is judged again, and as a result, when it is judged that the electronic component is sucked by the second suction holding mechanism, the normal termination process The component mounting apparatus characterized by performing. The controller performs predetermined abnormal termination processing when it is determined that the electronic component is not attracted to the second suction holding mechanism even if the detection result of the suction sensor is determined again. The component mounting apparatus according to claim 1. The first suction holding mechanism is provided in a punching device that punches out electronic components from a film carrier, and the second suction holding mechanism is provided in a component transfer device that transfers electronic components punched out by the punching device. The component mounting apparatus according to claim 1. The first suction holding mechanism is provided in a component transfer device that transfers electronic components punched from the film carrier, and the second suction holding mechanism transfers other electronic components transferred by the component transfer device onto the substrate. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is provided in a component transfer device. In a component delivery method for delivering electronic components mounted on a substrate between a plurality of suction holding mechanisms,
Holding the electronic component by the first suction holding mechanism in a vacuum suction state;
Setting a second suction holding mechanism that receives electronic components from the first suction holding mechanism to a vacuum suction state together with the first suction holding mechanism;
Determining whether an electronic component has been sucked by the second suction holding mechanism based on a detection result of a suction sensor that detects whether or not the electronic component is sucked by the second suction holding mechanism;
A step of releasing the vacuum suction state of the first suction holding mechanism and performing a predetermined normal end process when it is determined that the electronic component is sucked by the second suction holding mechanism; When it is determined that the electronic component is not sucked, the vacuum suction state of the first suction holding mechanism is released and the detection result of the suction sensor is determined again. As a result, the second suction holding mechanism is And a step of performing the normal termination process when it is determined that the component has been sucked. The method further includes a step of performing a predetermined abnormal termination process when it is determined that the electronic component is not attracted to the second suction holding mechanism even if the detection result of the suction sensor is determined again. The parts delivery method according to claim 5.

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