JP4009367B2 - Spin cleaning / drying method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor wafer spin cleaning and drying method.
[0002]
[Prior art]
In general, as a part of the processing of a semiconductor wafer, after the semiconductor wafer is ground by a grinding apparatus, a process of cleaning and drying by a spin cleaning / drying means incorporated in the grinding apparatus is performed.
In the conventional grinding apparatus, for example, as shown in FIG. 2, the semiconductor wafer W accommodated in the cassette 1 is unloaded by the loading / unloading means 2 and conveyed to the standby area 3, and then ground by the conveying means 4 having a suction pad. The semiconductor wafer W is transported onto the chuck table 6 of the means 5 and sucked and held, and the turntable 7 is rotated to position the semiconductor wafer W under the first rotating grindstone 8. After the rough grinding, the second rotating grindstone 9 Finish grinding by positioning under. Thereafter, when the turntable 7 is rotated and returned to a predetermined position, the ground semiconductor wafer is transferred to the spinner cleaning / drying means 10 by the transfer means 4, where it is cleaned and dried, and then the standby area. 3 and is further carried into the cassette 1 by the carry-in / out means 2.
As shown in FIG. 3, the spinner cleaning / drying means 10 includes a spinner table 12 that rotates at a high speed on an upper portion of a support 11, and a semiconductor wafer W is sucked and held on the spinner table 12 as shown in FIG. Spin cleaning is performed while supplying cleaning water from the cleaning water supply nozzle 13 disposed in the air. After cleaning, air is blown from the air supply nozzle 14 to spin dry. An open / close cover 15 moves up and down.
[0003]
[Problems to be solved by the invention]
In the conventional grinding apparatus, since the cutting water is supplied when the semiconductor wafer W is ground by the grinding means 5, not only water mixed with grinding scraps adheres to the surface to be ground of the semiconductor wafer W, but also A part of the surface also sticks to the suction surface side attracted to the chuck table 6. The ground semiconductor wafer is transported to the spinner cleaning / drying means 10 by the transport means 4 as described above, and is sucked and held by the spinner table 12 to be cleaned and dried, but the surface sucked and held by the spinner table 12 is It is concealed with moisture still attached. Therefore, there is a problem that moisture remains on the suction holding surface, and if the surface is dried after the processing, the moisture will be contaminated.
[0004]
The present invention is made to solve such a conventional problem, and provides a spin cleaning / drying method in which moisture does not remain on the adsorption surface of a semiconductor wafer on a spinner table, and contamination due to moisture does not occur. The purpose is to do so.
[0005]
[Means for Solving the Problems]
As specific means for achieving this object, the present invention includes a chuck table for sucking and holding a semiconductor wafer, a grinding means for grinding the semiconductor wafer while supplying cutting water, and spin cleaning of the ground semiconductor wafer. A spin cleaning / drying method performed by a grinding apparatus including at least a transport unit that transports to a spinner table of a drying unit,
A semiconductor wafer transfer step of removing the semiconductor wafer ground by the transfer means from the chuck table and transferring it to a position where it can be sucked and held on the spinner table of the spin cleaning / drying means,
An air jetting process in which the semiconductor wafer is brought close to or slightly in contact with the spinner table while the transport means holds the semiconductor wafer, and air is jetted from the surface of the spinner table;
A semiconductor wafer suction holding step of sucking and holding the semiconductor wafer on the spinner table after moisture on the surface of the semiconductor wafer placed on the spinner table is removed,
A cleaning step of cleaning the semiconductor wafer by supplying cleaning water to the semiconductor wafer while rotating the spinner table;
After this cleaning process is completed, a spin drying process in which the spinner table is rotated at a high speed to spin dry the semiconductor wafer;
The gist is a spin cleaning / drying method comprising at least the above.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings (the same members as those described above have the same reference numerals).
In FIG. 1, reference numeral 4 denotes transport means. A suction pad 4 b is attached to the tip of the swivel arm 4 a via a spring 4 c, and the chucked semiconductor wafer W is sucked by the suction pad 4 b to chuck the chuck table 6. Then, a semiconductor wafer transfer step of transferring to the spinner table 12 of the spinner cleaning / drying means 10 is performed.
[0007]
An air passage 11 a is provided in the support 11 of the spinner cleaning / drying means 10. The air passage 11 a communicates with a plurality of branch passages 12 a formed in the spinner table 12, and each branch passage 12 a is connected to the spinner table 12. Open on the upper surface of each.
[0008]
The swivel arm 4a of the transfer means 4 is stopped at a position approaching or slightly contacting the spinner table 12 while holding the semiconductor wafer W, and this state is maintained and air is supplied to the air passage 11a of the support 11. The air is ejected from the branch passages 12a of the spinner table 12 and air is ejected for several seconds. Thereby, the moisture adhering to the surface side of the semiconductor wafer W placed on the spinner table 12 is blown off and eliminated.
[0009]
Thereafter, a semiconductor wafer suction / holding step is performed in which the air in the air passage 11a of the support 11 is sucked to suck the semiconductor wafer W through the branch path 12a and sucked and held on the spinner table 12, and the transfer device 4 suction pad 4b is released and revolving arm 4a is retracted.
[0010]
Next, the opening / closing cover 15 is raised and sealed, the spinner table 12 is rotated at a high speed, and a cleaning process is performed for cleaning the semiconductor wafer W while supplying cleaning water from the cleaning water supply nozzle 13.
[0011]
After the cleaning process is completed, a spin drying process is performed in which the semiconductor wafer W is spin-dried by supplying air from the air supply nozzle 14 while the spinner table 12 is rotated at a high speed.
[0012]
After the spin drying process, the opening / closing cover 15 is lowered and opened, the semiconductor wafer W is sucked and transported to the standby area 3 by the transport means 4, and the semiconductor wafer W is put into the cassette 1 by the transporting / unloading means 2 as described above. Carry in.
[0013]
In the grinding apparatus shown in FIG. 2, the spinner cleaning / drying means 10 is provided at one place on one side, but a spinner cleaning / drying means (not shown) is also arranged on the opposite side opposite to this, By arranging the 3 ', the conveying means 4' and the cassette 1 'to face each other, it is possible to improve the grinding efficiency of the semiconductor wafer, or to change or select the processing route as appropriate.
[0014]
【The invention's effect】
As described above, according to the present invention, in the method of spin cleaning and drying after grinding of a semiconductor wafer, immediately before the semiconductor wafer is sucked and held on the spinner table, air is blown from the spinner table to adhere moisture during grinding. Since the surface sucked and held by the spinner table is cleaned, there is an effect of preventing contamination due to moisture drying after processing.
[Brief description of the drawings]
FIG. 1 is an explanatory view of a main part showing an embodiment of a spin cleaning / drying method according to the present invention.
FIG. 2 is a perspective view showing an example of a grinding apparatus.
FIG. 3 is a perspective view showing a conventional spin cleaning / drying means.
FIG. 4 is a schematic sectional view of the same.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Cassette 2 ... Carrying in / out means 3 ... Standby area 4 ... Conveying means 5 ... Grinding means 6 ... Chuck table 7 ... Turntable 8 ... 1st rotating grindstone 9 ... 2nd rotating grindstone 10 ... Spinner washing | cleaning and drying means 11 ... Support 12 ... Spinner table 13 ... Washing water supply nozzle 14 ... Air supply nozzle 15 ... Open / close cover

Claims (1)

A chuck table for sucking and holding the semiconductor wafer; a grinding means for grinding the semiconductor wafer while supplying cutting water; and a transport means for transporting the ground semiconductor wafer to the spinner table of the spin cleaning / drying means. A spin cleaning / drying method performed by a grinding apparatus,
A semiconductor wafer transfer step of removing the semiconductor wafer ground by the transfer means from the chuck table and transferring it to a position where it can be sucked and held on the spinner table of the spin cleaning / drying means,
An air jetting process in which the semiconductor wafer is brought close to or slightly in contact with the spinner table while the transport means holds the semiconductor wafer, and air is jetted from the surface of the spinner table;
A semiconductor wafer suction holding step of sucking and holding the semiconductor wafer on the spinner table after moisture on the surface of the semiconductor wafer placed on the spinner table is removed,
A cleaning step of cleaning the semiconductor wafer by supplying cleaning water to the semiconductor wafer while rotating the spinner table;
After this cleaning process is completed, a spin drying process in which the spinner table is rotated at a high speed to spin dry the semiconductor wafer;
A spin cleaning / drying method comprising at least:

Images