JP3997629B2 - TAB film carrier tape with reinforcing sheet - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a TAB film carrier tape, and particularly to a TAB film carrier tape with a foldable reinforcing sheet having fine pitch leads.
[0002]
[Prior art]
There are two types of film carrier tapes used in the TAB (Tape Automated Bonding) method: slim TAB without bending and flex TAB with bending.
As shown in FIGS. 5A and 5B, a conventional flex TAB accompanied by bending is formed on a flexible polyimide base film 21, a device hole 24 by a mold, a slit hole 23, and a sprocket hole 22. Then, the metal foil is laminated through the heat-resistant adhesive layer 26, and then the photo-etching process is performed to form the lead 27. Further, a resin coating layer 25 is formed on the slit hole 23 from the other surface of the base film 21, and a polyimide resin is screen printed on the slit hole 23 of the base film 21 on which the leads 27 are formed. The overcoat resin layer 29 was formed by applying the resin layer 28 and applying an epoxy resin or an acrylic resin to other portions by screen printing or the like.
[0003]
Furthermore, in recent years, semiconductor devices have been highly integrated and increased in speed, and the market demands a reduction in space and cost, so a resin with flexibility and insulation is used. An attempt has been made to form a coat resin layer by one printing.
[0004]
However, in the conventional flex TAB, in order to obtain stable tape feeding accuracy, the thickness of the base film is set to 50 μm to 125 μm with an emphasis on the conveyance of the tape. However, since the base film having this thickness is not easy to bend, a slit hole is formed in the bent portion, and one or two kinds of flexible and insulating resins are used to form the overcoat layer. Must be formed. For this reason, there has been a problem that the number of manufacturing processes increases, yield decreases, and costs increase.
[0005]
[Problems to be solved by the invention]
The present invention has been made in view of the above problems, and provides a TAB film carrier tape that reduces the manufacturing process of a TAB film carrier tape, is excellent in bending workability, and is compatible with a reduction in space and cost. For the purpose.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems in the present invention, in claim 1, an insulating base film , a sprocket hole provided on the insulating base film, and the insulating base film a lead provided in a region except for the sprocket holes, a TAB tape carrier foldable comprise an overcoat resin layer provided on the lead, a reinforcing sheet provided on the base film side of the insulating The reinforcing sheet is selected from at least one of polyetheretherketone, polyetherimide, polyamideimide, and polyethersulfane, and the thickness of the reinforcing sheet is 10 μm or more and 115 μm or less, and the insulating base film reinforcing Sea thickness and excellent folding properties, characterized in that at 30μm or less It is obtained by the TAB film carrier tape attached.
[0007]
Further, in claim 2, the reinforcing sheet of the TAB film carrier tape with reinforcing sheet according to claim 1 is used by peeling off the reinforcing sheet immediately before the mounting process of an IC chip or the like, and having excellent bending properties This is a film carrier tape for TAB with a sheet.
[0008]
[0009]
[0010]
The TAB film carrier tape with a reinforcing sheet having the above configuration can form high-precision and high-density leads and wiring layers, and is excellent in bendability because the reinforcing sheet is peeled off and used immediately before the mounting process of an IC chip or the like. An IC chip mounting flex TAB can be obtained, and mounting to a liquid crystal display or the like is easy, and the yield can be improved.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described.
The TAB film carrier tape with a reinforcing sheet of the present invention is used in a state in which the reinforcing sheet is bonded until immediately before the manufacturing process of the TAB film carrier tape and the mounting process of the IC chip and the like, and immediately before the mounting process of the IC chip and the like. The reinforcing sheet is peeled off and used as an IC chip mounting flex TAB excellent in bendability.
[0012]
Since the TAB film carrier tape mounts an IC chip or a liquid crystal panel, it can form high-precision and high-density leads and wiring layers, and is required to have dimensional stability and bendability. Therefore, what laminated | stacked 18-36 micrometers copper foil through the adhesive agent of 8-20 micrometers to the insulating base film with a film thickness of 50-125 micrometers is used. In this configuration, since the insulating base film is thick, the radius of curvature is large and the bendability is not good, but high-precision and high-density leads and wiring layers can be formed.
[0013]
On the other hand, in the flexible circuit board, the insulating base film is usually used with a thickness of 25 μm or less, and a copper foil of 18 to 36 μm bonded with an adhesive of about 8 to 20 μm is used. In this configuration, since the base film is thin, the conveyance accuracy and processing accuracy are deteriorated, and it is difficult to form a highly accurate and high-density wiring layer, but the bendability is excellent.
[0014]
In the present invention, the TAB film has excellent transport accuracy and processing accuracy when processing the TAB film carrier tape, can form a high-precision and high-density wiring layer, and has excellent bendability after mounting of an IC chip or the like. I came up with a carrier tape configuration.
Specifically, in order to reduce the thickness of the insulating base film to 30 μm or less and to compensate for the decrease in transportability accompanying the thinning of the base film, a film having a thickness of 10 μm to 115 μm is used as the reinforcing sheet. The TAB film carrier tape with a reinforcing sheet of the present invention is constituted by bonding together, and in the manufacturing process of the TAB film carrier tape, it is processed with the reinforcing sheet attached, so that it has high accuracy and high density. A wiring layer can be formed, and an IC chip mounting flex TAB excellent in bendability can be obtained by peeling and using the reinforcing sheet immediately before the mounting process of the IC chip or the like.
[0015]
Hereinafter, the production method of the TAB film carrier tape with a reinforcing sheet of the present invention will be described.
FIG. 1 (a) is a schematic plan view showing an embodiment of a TAB film carrier tape with a reinforcing sheet of the present invention, and FIG. 1 (b) shows an embodiment of a TAB film carrier tape with a reinforcing sheet of the present invention. A schematic cross-sectional view cut along the line AA, FIGS. 2A to 2C are schematic plan views of main steps of the TAB film carrier tape with a reinforcing sheet of the present invention, and FIGS. ) Shows schematic sectional views of main processes of the TAB film carrier tape with a reinforcing sheet of the present invention.
[0016]
First, a reinforcing sheet 12 is bonded to a base film 11 made of a polyimide resin film with an adhesive, an adhesive layer 15 is formed on the base film 11, and then a device hole 14 and a sprocket hole are used at predetermined positions using a mold. 13 is punched (see FIGS. 2A and 3A).
[0017]
Here, as the reinforcing sheet 12, a resin film made of polyimide, polyetheretherketone, polyetherimide, polyamideimide and polyethersulfane having heat resistance and chemical resistance can be used.
[0018]
Next, a copper foil is thermocompression-bonded and laminated on the surface of the adhesive layer 15 of the base film 11 excluding the sprocket hole 12, and the copper foil is subjected to a patterning process to form the lead 16 including the outer lead 16a, the outer lead 16b, and the inner lead 16c. It forms (refer FIG.2 (b) and FIG.3 (b)).
[0019]
Next, a resin layer having flexibility and insulation is formed at a predetermined position on the base film 11 on which the leads 16 are formed by screen printing or the like to form an overcoat resin layer 17 (FIG. 2C). ) And FIG. 3 (c)).
[0020]
Next, the outer lead 16a, the outer lead 16b, and the inner lead 16c are subjected to electroless Sn plating to obtain a TAB film carrier tape with a reinforcing sheet of the present invention.
[0021]
In the TAB film carrier with a reinforcing sheet having the above-described structure, the base film 11 is thinned to form the overcoat resin layer 17 using a flexible resin coating material, and the reinforcing sheet is provided immediately before the mounting process of the IC chip or the like. Since 12 is peeled off and used, a mounting flex TAB excellent in bendability can be obtained.
[0022]
【Example】
Hereinafter, the present invention will be described in detail by way of examples.
<Example 1>
First, a reinforcing sheet 12 made of a polyamideimide resin film having a thickness of 50 μm is bonded to a base film 11 made of a polyimide resin film having a width of 35 mm and a thickness of 25 μm, and then an adhesive layer 15 is formed on the base film 11. Then, a device hole 14 and a sprocket hole 13 were formed at predetermined positions using a punching die.
[0023]
Next, a 18 μm-thick copper foil is thermocompression-bonded and laminated on the adhesive layer 15 of the base film 11 excluding the sprocket holes 12, and a photosensitive solution is applied on the copper foil of the base film 11 to form a photosensitive layer. A lead pattern was baked on the photosensitive layer and developed to form a resist pattern. Using the resist pattern as a mask, the copper foil was etched and glycated with a film remover to form leads 16 including outer leads 16a, outer leads 16b, and inner leads 16c.
[0024]
Next, a resin coating material prepared so as to exhibit the resin coating physical properties shown in FIG. 4 is screen-printed on the entire surface of the base film 11 on which the leads 16 are formed, and heat-cured to form an overcoat resin layer 17 having a thickness of 20 μm. Formed.
[0025]
Next, the outer lead 16a, the outer lead 16b, and the inner lead 16c were subjected to electroless Sn plating to produce a TAB film carrier tape 1 with a reinforcing sheet of the present invention.
[0026]
<Example 2>
First, a reinforcing plate sheet 12 made of a polyamideimide resin film having a thickness of 100 μm is bonded to a base film 11 made of a polyimide resin film having a width of 35 mm and a thickness of 25 μm, and then an adhesive layer 15 is formed on the base film 11. The device hole 14 and the sprocket hole 13 were punched at predetermined positions using a punching die.
[0027]
Next, the lead 16 including the outer lead 16a, the outer lead 16b, and the inner lead 16c is formed by the same method as in Example 1. The resin film physical properties shown in FIG. 4 are formed on the entire surface of the base film 11 on which the lead 16 is formed. The overcoat resin layer 17 having a thickness of 20 μm was formed by screen printing the resin coating material prepared as shown in FIG.
[0028]
Next, the inner lead 16c and the outer leads 16a, b were subjected to electroless Sn plating to produce a TAB film carrier tape 2 with a reinforcing sheet of the present invention.
[0029]
<Comparative example>
First, an adhesive layer 15 is formed on a base film 11 made of a polyimide resin film having a width of 35 mm and a thickness of 75 μm, and a device hole 14, a sprocket hole 12, an inner lead 16c and an outer lead 16a are formed in the same manner as in the first embodiment. , B containing lead 16 was formed.
[0030]
Next, a resin coating material prepared so as to exhibit the resin coating physical properties shown in FIG. 4 is screen-printed on the entire surface of the base film 11 on which the leads 16 are formed, and heat-cured to form an overcoat resin layer 17 having a thickness of 10 μm. Formed.
[0031]
Next, the inner lead 16c and the outer leads 16a and 16b were subjected to electroless Sn plating to produce a comparative TAB film carrier tape.
[0032]
When the reinforcing sheets of the TAB film carrier tapes 1 and 2 of the present invention obtained in Examples 1 and 2 were peeled off, IC chips and the like were mounted, and the folding assembly was performed at a predetermined folding position. It was confirmed that the bending process can be easily performed.
Furthermore, it was confirmed that it was difficult to perform the bending process when a mounting operation of an IC chip or the like was performed on a comparative TAB film carrier tape and a folding assembly was performed at a predetermined folding position.
[0033]
【The invention's effect】
As described above, the TAB film carrier tape with a reinforcing sheet of the present invention can be easily manufactured by making the base film thin and bonding the reinforcing sheet. For TAB, which can form high-precision and high-density leads and wiring layers, and has excellent bendability by removing the reinforcing sheet just before the mounting process for IC chips, etc. A film carrier tape is obtained.
Further, since it becomes possible to produce a TAB film carrier tape without slit holes, a flexible TAB having fine pitch leads required for TAB can be produced with high yield.
[Brief description of the drawings]
FIG. 1A is a schematic plan view showing an embodiment of a TAB film carrier tape with a reinforcing sheet of the present invention.
(B) is the schematic cross section which cut | disconnected the schematic top view which shows one Example of the TAB film carrier tape with a reinforcement sheet of this invention by the AA line.
FIGS. 2A to 2C are schematic plan views showing main steps of a production process of a TAB film carrier tape with a reinforcing sheet of the present invention.
3 (a) to (c) show the main steps of the production process of the TAB film carrier tape with a reinforcing sheet of the present invention, and the schematic plan views shown in FIGS. 1 (a) to (c) are A- It is the schematic cross section cut | disconnected by A line.
FIG. 4 shows resin film physical properties of an overcoat resin layer of a TAB film carrier tape with a reinforcing sheet of the present invention.
FIG. 5 (a) is a schematic plan view showing a conventional TAB film carrier tape.
(B) shows the schematic cross section which cut | disconnected the typical top view of the film carrier tape for conventional TAB by the BB line.
[Explanation of symbols]
11, 21 ... Base film 12 ... Reinforcement sheets 13, 22 ... Sprocket holes 14, 24 ... Device holes 15, 26 ... Adhesive layer 16 ... Leads 16a, 16b ... Outer leads 16c ... Inner leads 17 …… Overcoat resin layer 18 …… Reinforcing plate 23 …… Slit hole 25 …… Resin coating layer 27a, 27b …… Outer lead 27c …… Inner lead 28 …… Resin layer 29 …… Overcoat resin layer

Claims (2)

An insulating base film ;
A sprocket hole provided on the insulating base film;
A lead provided in a region excluding the sprocket hole on the insulating base film;
A TAB tape carrier foldable comprise an overcoat resin layer provided on the lead,
A reinforcing sheet is provided on the insulating base film side, and the reinforcing sheet is selected from at least one of polyetheretherketone, polyetherimide, polyamideimide, and polyethersulfane, and the thickness of the reinforcing sheet is 10 μm or more. A TAB film carrier tape with a reinforcing sheet having excellent bendability, wherein the film thickness is 115 μm or less, and the film thickness of the insulating base film is 30 μm or less . Foldability superior TAB film carrier tape with a reinforcing sheet according to feature the use by peeling off the reinforcing sheet of reinforcing TAB film carrier tape with sheet according to the mounting process immediately before such as an IC chip in claim 1 .

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