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JP3947667B2 - Device manufacturing method - Google Patents

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Publication number
JP3947667B2
JP3947667B2 JP2001381613A JP2001381613A JP3947667B2 JP 3947667 B2 JP3947667 B2 JP 3947667B2 JP 2001381613 A JP2001381613 A JP 2001381613A JP 2001381613 A JP2001381613 A JP 2001381613A JP 3947667 B2 JP3947667 B2 JP 3947667B2
Authority
JP
Japan
Prior art keywords
flexible substrate
contact group
slit
hole
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001381613A
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Japanese (ja)
Other versions
JP2003188487A (en
Inventor
健一 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2001381613A priority Critical patent/JP3947667B2/en
Publication of JP2003188487A publication Critical patent/JP2003188487A/en
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Publication of JP3947667B2 publication Critical patent/JP3947667B2/en
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  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、基板の接続方法に係わり、特にフレキシブルプリント基板同士の接続機器に関する。
【0002】
【従来の技術】
従来、フレキシブルプリント基板同士を接続する際には、例えばカメラ本体にあるスリット状の穴を通して接続する必要があった。この場合、フレキシブルプリント基板の幅を前記スリットの穴の幅以下に細くして接続していた。
【0003】
【発明が解決しようとする課題】
しかし、フレキシブルプリント基板の幅を前記スリットの穴の幅以下に細くして接続すると、電気的接点が少ないためにフレキシブルプリント基板の接続部での信頼性に欠けるという問題があった。
【0004】
以上の点に鑑みて、本発明の目的は、細いスリットを通すことができ、かつ、電気的接点の面積が大きい接続を実現した機器の製造方法を提供することである。
【0005】
【課題を解決するための手段】
本発明は、貫通する穴部を有する部材と、他の電気基板と電気的に接続を行うための接点群が設けられ、上記穴部の開口よりも寸法の大きい接点群部分を有するフレキシブルプリント基板とを備える機器の製造方法において、上記フレキシブルプリント基板の上記接点群の接点間において折り曲げた状態で、上記接点群部分を上記穴部に通過させ、上記穴部を通過した上記接点群部分を展開し、上記フレキシブルプリント基板と上記他の電気基板とを上記接点群を介して電気的に接続したことを特徴とする。
【0008】
【発明の実施の形態】
本発明の実施形態を以下に図面を用いて説明する。
【0009】
図1は、裏蓋を開けた状態のカメラ本体を背面からみた図である。図1に示すように、カメラ本体10の本体後部カバー11には、スリット12が設けられている。また、図2に示すように、カメラの後部の蓋15には、日付等を表示する液晶部を含む基板16とその基板16を覆う圧板14を備えており、前記基板16からは前記基板16に電気的に接続されたフレキシブル基板13が延びている。前記フレキシブル基板13は、前記スリット12に挿入され、前記カメラ本体10と電気的に接続されるようになっているが、前記フレキシブル基板13に電気的に接続される接点を信頼性向上のために広く取ってあるため、このままでは前記スリット12に挿入できない。
【0010】
次に図3は、図2に示した前記フレキシブル基板13先端部(点線で囲まれた部分)の拡大図である。図3に示すように、 前記フレキシブル基板13先端部は、先端以外の部分と比べて幅が広くなっている。また、前記フレキシブル基板13先端部の円で示したカバーレイ開口部の内側は、電気的接点であり、電極がむき出しとなっている。さらに、前記フレキシブル基板13先端部の横に走っている破断線で前記フレキシブル基板13を折り返すことができる構造になっている。
【0011】
図4は、前記フレキシブル基板13先端部を前記折り曲げの破断線に従って折り曲げ、前記スリット12に挿入する場合を示した図である。図4に示すように、前記フレキシブル基板13先端部を前記折り曲げの破断線に従って折り返すことにより、前記スリット12よりも幅が狭くなり挿入することができるようになる。
【0012】
次に、図5は、前記フレキシブル基板13を前記スリット12に挿入後、前記フレキシブル基板13の先端部を前記破断線に従って展開し、前記カメラ本体10の中にある別のフレキシブル基板17と接続した場合を示した図である。図5に示すように、前記フレキシブル基板13と別のフレキシブル基板17の点線で示した接続部分の面積は、フレキシブル基板の先端部以外の幅よりも大きくなっているため、より確実に接続することができる。
【0013】
次に図6は、図5の点線で示した接続部分の断面図である。図6に示すように、カメラ本体10と前記フレキシブル基板13の間には、例えばゴム等の弾性部材18が設置されており、前記フレキシブル基板13の上には別のフレキシブル基板17、そしてその上には、同様に弾性部材18が設置されている。また、さらに前記別のフレキシブル基板17の上に設置されている弾性部材18の上には、ワッシャー19が設置されており、最後にビス15で固定されている。その上から本体後部カバー11が被さることになる。
【0014】
次に、図7は、前記フレキシブル基板13を前記スリット12に挿入後、前記フレキシブル基板13の先端部を展開したときの拡大図である。図7に示すように、前記スリット12よりも幅を狭く折り曲げられた前記フレキシブル基板13は、前記スリット12に挿入され、通過後前記折り曲げられた先端部分を前記破断線に従って展開する。このとき、前記本体後部カバー11よりもはみ出ない面積であることが望ましい。
【0015】
図8は、前記フレキシブル基板13の折り曲げ線(図8中の一点鎖線)と導電パターンとの関係を示した図である。図8に示すように、折り曲げ線の両側(図8中では幅α)は、電気的接点が露出している円で示したカバーレイ開口部に導電パターン形成しないようにすることが望ましい。
【0016】
また、図9は、前記フレキシブル基板13の先端が別の導電パターンであるフレキシブル基板21を示した図である。図9に示すように、このような導電パターンである場合も、折り曲げ線の両側(図9では幅β)には、導電パターンを形成しないようにすることが望ましい。なお、図9の縦の点線よりも右側の導電パターンが電気的接点が露出しているカバーレイ開口部である。
【0017】
次に、図10は、前記フレキシブル基板13の先端が別の導電パターンであるフレキシブル基板22を示した図である。このフレキシブル基板22の場合は、2カ所で折り曲げて先端部分をスリット12の幅よりも狭くするがこの場合も折り曲げ線の両側には、導電パターンを形成しないようにすることが望ましい。なお、図10の縦の点線よりも右側の導電パターンが電気的接点が露出しているカバーレイ開口部である。
【0018】
次に、図11は、前記フレキシブル基板13の先端が別の導電パターンであるフレキシブル基板23を示した図である。このフレキシブル基板23の場合は、先端部分がスリット12の幅よりも狭くなっており、この状態でスリット12を通過させる。そして、スリット12を通過後、2カ所で縦方向(A)と横方向(B)に折り曲げて接続を行う。また、図12は、前記フレキシブル基板23を折り曲げた状態を示した。
【0019】
次に、図13は、前記フレキシブル基板13の先端が別の導電パターンであるフレキシブル基板24を示した図である。このフレキシブル基板24の場合は、図13の破断線で折り曲げて全体をスリット12の幅よりも狭くする。なお、図13の折り曲げる破断線よりも上の部分のパターンはスリット12挿入後、展開して、例えば、電池室の壁に貼り付ける等して外部機器との電気的接続(通信ライン)として利用する。
【0020】
なお、本発明によれば以下のような構成も可能である。
【0021】
付記1.複数の電気基板を有する機器において、
所定の穴幅を有して貫通する穴部を有する部材と、
上記穴部を通過して他の電気基板と電気的接続を行うための接点群が設けられ、上記所定の穴幅より大きな幅寸法の接点群部分と、
上記接点群部分から導き出される複数のリードパターンが設けられた上記所定の穴幅より小さな幅寸法のリード部とを有し、上記接点群間を折り曲げ可能としたフレキシブルプリント基板と、
を有し、上記他の電気基板と上記フレキシブルプリント基板とを電気的に接続するため、上記接点群部分の上記接点群間を折り曲げ、上記接点群部分を上記穴部に通過させた後、上記折り曲げ部分を展開もしくは折り曲げて上記他の電気基板に接続したことを特徴とする機器。
【0022】
付記2.貫通する穴部を有する部材と、上記穴部を通過して他の電気基板と電気的接続を行うための接点群が設けられた接点群部分を有し、上記接点群間を折り曲げ可能としたフレキシブルプリント基板と、
を有した機器の組立方法において、
上記他の電気基板と上記フレキシブルプリント基板とを電気的に接続するため、上記接点群部分の上記接点群間を折り曲げ、上記接点群部分を上記穴部に通過させ後、上記折り曲げ部分を展開もしくは折り曲げて上記他の電気基板に接続したことを特徴とする機器の組立方法。
【0023】
以上、本発明の実施形態を用いることにより、スリットにスリットの幅よりも広い幅のフレキシブル基板を挿入することができるため、フレキシブル基板を接続する際の信頼性が向上する。また、スリットの形状やフレキシブル基板の形状により、スリットを通過させる前もしくは後に折り曲げることができるため、各接続部材に容易に対応できる。
【0024】
【発明の効果】
本発明を用いることにより、スリットにスリットの幅よりも広い幅のフレキシブル基板を挿入することができるため、フレキシブル基板を接続する際の信頼性が向上する。
【図面の簡単な説明】
【図1】本発明の実施形態に係る裏蓋を開けた状態のカメラ本体の背面図。
【図2】本発明の実施形態に係るカメラの後部の蓋を示す図。
【図3】本発明の実施形態に係る図2に示した前記フレキシブル基板先端部の拡大図。
【図4】本発明の実施形態に係るフレキシブル基板先端部を折り曲げの破断線に従って折り曲げ、スリットに挿入する場合を示した図。
【図5】本発明の実施形態に係るフレキシブル基板をスリットに挿入後、フレキシブル基板13の先端部を破断線に従って展開し、カメラ本体の中にある別のフレキシブル基板と接続した場合を示した図。
【図6】本発明の実施形態に係る図5の点線で示した接続部分の断面図。
【図7】本発明の実施形態に係るフレキシブル基板をスリットに挿入後、フレキシブル基板の先端部を展開したときの拡大図。
【図8】本発明の実施形態に係るフレキシブル基板折り曲げ線と導電パターンとの関係を示した図。
【図9】本発明の実施形態に係るフレキシブル基板の先端が別の導電パターンであるフレキシブル基板を示した図。
【図10】本発明の実施形態に係るフレキシブル基板の先端が別の導電パターンであるフレキシブル基板を示した図。
【図11】本発明の実施形態に係るフレキシブル基板の先端が別の導電パターンであるフレキシブル基板を示した図。
【図12】本発明の実施形態に係るフレキシブル基板を折り曲げた状態を示した図。
【図13】本発明の実施形態に係るフレキシブル基板の先端が別の導電パターンであるフレキシブル基板を示した図。
【符号の説明】
10…カメラ本体、11…本体後部カバー、12…スリット、13…フレキシブル基板、、14…圧板、17、21、22、23、24…フレキシブル基板、15…蓋、16…基板、18…弾性部材、20…ビス
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate connection method, and more particularly to a connection device between flexible printed circuit boards.
[0002]
[Prior art]
Conventionally, when connecting flexible printed boards, it has been necessary to connect through, for example, slit-like holes in the camera body. In this case, the width of the flexible printed circuit board is narrowed to be equal to or smaller than the width of the slit hole.
[0003]
[Problems to be solved by the invention]
However, if the width of the flexible printed board is narrowed to be equal to or smaller than the width of the slit hole, there is a problem that reliability at the connecting portion of the flexible printed board is lacking because there are few electrical contacts.
[0004]
In view of the above points, an object of the present invention is to provide a method for manufacturing a device that can pass through a thin slit and realizes a connection with a large area of electrical contact.
[0005]
[Means for Solving the Problems]
This onset Ming, a member having a hole extending through the contact group is provided for performing other electrical substrate electrically connected to a flexible printed having a large contact group portion dimension than the opening of said holes In a manufacturing method of a device comprising a substrate, the contact group portion is passed through the hole portion in a state of being bent between the contacts of the contact group of the flexible printed circuit board, and the contact group portion that has passed through the hole portion is passed through the hole portion. The flexible printed circuit board and the other electric circuit board are electrically connected via the contact group .
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0009]
FIG. 1 is a view of the camera body as viewed from the back with the back cover opened. As shown in FIG. 1, a slit 12 is provided in the main body rear cover 11 of the camera main body 10. As shown in FIG. 2, the rear cover 15 of the camera is provided with a substrate 16 including a liquid crystal unit for displaying the date and the like, and a pressure plate 14 covering the substrate 16, and from the substrate 16 to the substrate 16. A flexible substrate 13 electrically connected to the substrate extends. The flexible substrate 13 is inserted into the slit 12 and is electrically connected to the camera body 10, but a contact point electrically connected to the flexible substrate 13 is used for improving reliability. Since it is wide, it cannot be inserted into the slit 12 as it is.
[0010]
Next, FIG. 3 is an enlarged view of the distal end portion (portion surrounded by a dotted line) of the flexible substrate 13 shown in FIG. As shown in FIG. 3, the tip of the flexible substrate 13 is wider than parts other than the tip. The inside of the cover lay opening indicated by a circle at the tip of the flexible substrate 13 is an electrical contact, and the electrode is exposed. Further, the flexible substrate 13 can be folded back along a break line running beside the tip of the flexible substrate 13.
[0011]
FIG. 4 is a view showing a case where the distal end portion of the flexible substrate 13 is bent along the breaking line of the bending and inserted into the slit 12. As shown in FIG. 4, the flexible substrate 13 has its tip end folded back according to the breaking line of the bend, so that the width becomes narrower than that of the slit 12 and can be inserted.
[0012]
Next, in FIG. 5, after inserting the flexible substrate 13 into the slit 12, the distal end portion of the flexible substrate 13 is expanded according to the breaking line and connected to another flexible substrate 17 in the camera body 10. It is the figure which showed the case. As shown in FIG. 5, since the area of the connection portion indicated by the dotted line between the flexible substrate 13 and the flexible substrate 17 is larger than the width of the flexible substrate other than the tip portion, the connection should be made more reliably. Can do.
[0013]
Next, FIG. 6 is a cross-sectional view of a connection portion indicated by a dotted line in FIG. As shown in FIG. 6, an elastic member 18 such as rubber is installed between the camera body 10 and the flexible substrate 13, and another flexible substrate 17 is disposed on the flexible substrate 13. Similarly, an elastic member 18 is installed. Further, a washer 19 is installed on the elastic member 18 installed on the other flexible substrate 17, and finally fixed with screws 15. The main body rear cover 11 is covered from above.
[0014]
Next, FIG. 7 is an enlarged view when the distal end portion of the flexible substrate 13 is developed after the flexible substrate 13 is inserted into the slit 12. As shown in FIG. 7, the flexible substrate 13 bent to be narrower than the slit 12 is inserted into the slit 12, and after passing, the bent tip portion is developed according to the breaking line. At this time, it is desirable that the area does not protrude beyond the main body rear cover 11.
[0015]
Figure 8 is a diagram showing a relationship between the bending line of the flexible substrate 13 (one point chain line in FIG. 8) and the conductive pattern. As shown in FIG. 8, it is desirable not to form a conductive pattern on both sides of the fold line (width α in FIG. 8) in the cover lay opening indicated by the circle where the electrical contacts are exposed.
[0016]
FIG. 9 is a view showing a flexible substrate 21 in which the tip of the flexible substrate 13 is another conductive pattern. As shown in FIG. 9, even in the case of such a conductive pattern, it is desirable not to form a conductive pattern on both sides of the fold line (width β in FIG. 9). The conductive pattern on the right side of the vertical dotted line in FIG. 9 is the cover lay opening where the electrical contact is exposed.
[0017]
Next, FIG. 10 is a view showing a flexible substrate 22 in which the tip of the flexible substrate 13 is another conductive pattern. In the case of this flexible substrate 22, it is bent at two places so that the tip portion is narrower than the width of the slit 12, but in this case as well, it is desirable not to form a conductive pattern on both sides of the folding line. Note that the conductive pattern on the right side of the vertical dotted line in FIG. 10 is the cover lay opening where the electrical contact is exposed.
[0018]
Next, FIG. 11 is a diagram showing a flexible substrate 23 in which the tip of the flexible substrate 13 is another conductive pattern. In the case of this flexible substrate 23, the tip portion is narrower than the width of the slit 12, and the slit 12 is allowed to pass through in this state. Then, after passing through the slit 12, the connection is performed by bending in two places in the vertical direction (A) and the horizontal direction (B). FIG. 12 shows a state where the flexible substrate 23 is bent.
[0019]
Next, FIG. 13 is a diagram showing a flexible substrate 24 in which the tip of the flexible substrate 13 is another conductive pattern. In the case of this flexible substrate 24, the entire flexible substrate 24 is bent at the breaking line in FIG. 13 is expanded after the slit 12 is inserted, and is used as an electrical connection (communication line) with an external device, for example, by pasting it on the wall of the battery chamber. To do.
[0020]
In addition, according to this invention, the following structures are also possible.
[0021]
Appendix 1. In a device having a plurality of electric boards,
A member having a hole that penetrates with a predetermined hole width;
A contact group for making electrical connection with another electrical substrate through the hole is provided, and a contact group part having a width dimension larger than the predetermined hole width;
A flexible printed circuit board having a lead portion having a width smaller than the predetermined hole width provided with a plurality of lead patterns derived from the contact group portion, and capable of bending between the contact groups;
In order to electrically connect the other electric board and the flexible printed circuit board, the contact group of the contact group part is bent between the contact groups, and the contact group part is passed through the hole, A device characterized in that the bent portion is unfolded or bent and connected to the other electric substrate.
[0022]
Appendix 2. A member having a through hole and a contact group portion provided with a contact group for passing through the hole to make electrical connection with another electrical substrate, and the contact group can be bent. A flexible printed circuit board;
In a method for assembling a device having
In order to electrically connect the other electric board and the flexible printed board, the contact group of the contact group part is bent between the contact groups, the contact group part is passed through the hole, and then the bent part is expanded or A method for assembling a device, wherein the device is bent and connected to the other electric board.
[0023]
As described above, by using the embodiment of the present invention, a flexible board having a width wider than the width of the slit can be inserted into the slit, so that the reliability when connecting the flexible board is improved. Moreover, since it can be bent before or after passing the slit depending on the shape of the slit or the shape of the flexible substrate, it can be easily adapted to each connecting member.
[0024]
【The invention's effect】
By using the present invention, a flexible substrate having a width wider than the width of the slit can be inserted into the slit, so that the reliability when connecting the flexible substrate is improved.
[Brief description of the drawings]
FIG. 1 is a rear view of a camera body with a back cover opened according to an embodiment of the present invention.
FIG. 2 is a view showing a rear cover of the camera according to the embodiment of the present invention.
3 is an enlarged view of the distal end portion of the flexible substrate shown in FIG. 2 according to the embodiment of the present invention.
FIG. 4 is a view showing a case where a distal end portion of a flexible substrate according to an embodiment of the present invention is bent according to a breaking line of bending and inserted into a slit.
FIG. 5 is a diagram showing a case where a flexible substrate according to an embodiment of the present invention is inserted into a slit, the front end portion of the flexible substrate 13 is expanded according to a broken line, and connected to another flexible substrate in the camera body. .
6 is a cross-sectional view of a connection portion indicated by a dotted line in FIG. 5 according to the embodiment of the present invention.
FIG. 7 is an enlarged view when the distal end portion of the flexible substrate is expanded after the flexible substrate according to the embodiment of the present invention is inserted into the slit.
FIG. 8 is a view showing a relationship between a flexible substrate folding line and a conductive pattern according to an embodiment of the present invention.
FIG. 9 is a view showing a flexible substrate in which the tip of the flexible substrate according to the embodiment of the present invention is another conductive pattern.
FIG. 10 is a view showing a flexible substrate in which the tip of the flexible substrate according to the embodiment of the present invention is another conductive pattern.
FIG. 11 is a view showing a flexible substrate in which the tip of the flexible substrate according to the embodiment of the present invention is another conductive pattern.
FIG. 12 is a diagram showing a state in which a flexible substrate according to an embodiment of the present invention is bent.
FIG. 13 is a view showing a flexible substrate in which the tip of the flexible substrate according to the embodiment of the present invention is another conductive pattern.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Camera body, 11 ... Rear cover of main body, 12 ... Slit, 13 ... Flexible substrate, 14 ... Pressure plate, 17, 21, 22, 23, 24 ... Flexible substrate, 15 ... Cover, 16 ... Substrate, 18 ... Elastic member 20 ... Screw

Claims (2)

貫通する穴部を有する部材と、他の電気基板と電気的に接続を行うための接点群が設けられ、上記穴部の開口よりも寸法の大きい接点群部分を有するフレキシブルプリント基板とを備える機器の製造方法において、A device provided with a member having a through hole and a flexible printed circuit board provided with a contact group for electrically connecting to another electric substrate and having a contact group portion having a dimension larger than the opening of the hole. In the manufacturing method of
上記フレキシブルプリント基板の上記接点群の接点間において折り曲げた状態で、上記接点群部分を上記穴部に通過させ、上記穴部を通過した上記接点群部分を展開し、上記フレキシブルプリント基板と上記他の電気基板とを上記接点群を介して電気的に接続させることを特徴とする機器の製造方法。In the state of being bent between the contacts of the contact group of the flexible printed circuit board, the contact group part is passed through the hole, the contact group part passed through the hole is expanded, and the flexible printed circuit board and the other An electrical substrate is electrically connected to the electrical substrate through the contact group.
折り曲げ線の両側における上記接点群の接点間隔が、他の接点間隔よりも広く形成されているフレキシブルプリント基板を用いることを特徴とする請求項1記載の機器の製造方法。2. The method of manufacturing an apparatus according to claim 1, wherein a flexible printed board is used in which a contact interval of the contact group on both sides of the folding line is wider than other contact intervals.
JP2001381613A 2001-12-14 2001-12-14 Device manufacturing method Expired - Fee Related JP3947667B2 (en)

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JP3947667B2 true JP3947667B2 (en) 2007-07-25

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TWI637669B (en) * 2013-07-12 2018-10-01 易鼎股份有限公司 Wearable assembly method of flexible circuit board and shaft member

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