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JP2003188487A - Equipment - Google Patents

Equipment

Info

Publication number
JP2003188487A
JP2003188487A JP2001381613A JP2001381613A JP2003188487A JP 2003188487 A JP2003188487 A JP 2003188487A JP 2001381613 A JP2001381613 A JP 2001381613A JP 2001381613 A JP2001381613 A JP 2001381613A JP 2003188487 A JP2003188487 A JP 2003188487A
Authority
JP
Japan
Prior art keywords
flexible substrate
slit
printed circuit
circuit board
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001381613A
Other languages
Japanese (ja)
Other versions
JP3947667B2 (en
Inventor
Kenichi Hashimoto
健一 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP2001381613A priority Critical patent/JP3947667B2/en
Publication of JP2003188487A publication Critical patent/JP2003188487A/en
Application granted granted Critical
Publication of JP3947667B2 publication Critical patent/JP3947667B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment through which a fine slit can be passed and which has large-area electrical contacts for connection. <P>SOLUTION: This equipment has the slit (12) and a flexible substrate which is electrically connected to another electric substrate through the slit (12). The front end of the flexible substrate is made bendable and the substrate is connected to the electric substrate by extending or bending the front end of the substrate after the front end is passed through the slit (12). <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、基板の接続方法に
係わり、特にフレキシブルプリント基板同士の接続機器
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board connecting method, and more particularly to a connecting device for connecting flexible printed boards.

【0002】[0002]

【従来の技術】従来、フレキシブルプリント基板同士を
接続する際には、例えばカメラ本体にあるスリット状の
穴を通して接続する必要があった。この場合、フレキシ
ブルプリント基板の幅を前記スリットの穴の幅以下に細
くして接続していた。
2. Description of the Related Art Conventionally, when connecting flexible printed circuit boards, it has been necessary to connect them through, for example, a slit-shaped hole in a camera body. In this case, the width of the flexible printed circuit board is made smaller than the width of the hole of the slit to connect the flexible printed circuit board.

【0003】[0003]

【発明が解決しようとする課題】しかし、フレキシブル
プリント基板の幅を前記スリットの穴の幅以下に細くし
て接続すると、電気的接点が少ないためにフレキシブル
プリント基板の接続部での信頼性に欠けるという問題が
あった。
However, if the width of the flexible printed circuit board is made narrower than the width of the hole of the slit for connection, the reliability of the connection part of the flexible printed circuit board is poor due to the small number of electrical contacts. There was a problem.

【0004】以上の点を鑑みて、本発明の目的は、細い
スリットを通すことができ、かつ、電気的接点の面積が
大きい接続の機器を提供することである。
In view of the above points, an object of the present invention is to provide a connecting device which can pass through a narrow slit and has a large area of an electrical contact.

【0005】[0005]

【課題を解決するための手段】本発明による機器は、複
数の電気基板を有する機器において、貫通する穴部を有
する部材と、上記穴部を通過して他の電気基板と電気的
接続を行うための接点群が設けられた接点群部分を有
し、上記接点群間を折り曲げ可能としたフレキシブルプ
リント基板とを有し、上記他の電気基板と上記フレキシ
ブルプリント基板とを電気的に接続するため、上記接点
群部分を上記穴部に通過させた後、上記折り曲げ部分を
展開もしくは折り曲げて上記他の電気基板に接続したこ
とを特徴とする。
A device according to the present invention, in a device having a plurality of electric boards, has a member having a through hole, and is electrically connected to another electric board through the hole. A flexible printed circuit board having a contact group portion provided with a flexible printed circuit board, the flexible printed circuit board being bendable between the contact group, and electrically connecting the other electric circuit board to the flexible printed circuit board. After passing the contact group portion through the hole, the bent portion is unfolded or bent and connected to the other electric board.

【0006】また、上記フレキシブルプリント基板は、
上記接点群部分の折り曲げ部分には電気的接点を設けて
いないフレキシブルプリント基板を有したことを特徴と
する。
Further, the flexible printed circuit board is
The bent portion of the contact group portion has a flexible printed board having no electrical contact.

【0007】また、上記穴部は所定の穴幅を有し、上記
接点群部分は、上記他の電気基板に接続する際に、展開
もしくは折り曲げたことにより上記穴幅より大きい幅寸
法を有するフレキシブルプリント基板を有したことを特
徴とする機器である。
Further, the hole portion has a predetermined hole width, and the contact point group portion has a width dimension larger than the hole width due to expansion or bending when connecting to the other electric board. A device having a printed circuit board.

【0008】[0008]

【発明の実施の形態】本発明の実施形態を以下に図面を
用いて説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

【0009】図1は、裏蓋を開けた状態のカメラ本体を
背面からみた図である。図1に示すように、カメラ本体
10の本体後部カバー11には、スリット12が設けら
れている。また、図2に示すように、カメラの後部の蓋
15には、日付等を表示する液晶部を含む基板16とそ
の基板16を覆う圧板14を備えており、前記基板16
からは前記基板16に電気的に接続されたフレキシブル
基板13が延びている。前記フレキシブル基板13は、
前記スリット12に挿入され、前記カメラ本体10と電
気的に接続されるようになっているが、前記フレキシブ
ル基板13に電気的に接続される接点を信頼性向上のた
めに広く取ってあるため、このままでは前記スリット1
2に挿入できない。
FIG. 1 is a rear view of the camera body with the back cover opened. As shown in FIG. 1, a slit 12 is provided in a main body rear cover 11 of the camera main body 10. Further, as shown in FIG. 2, the lid 15 at the rear of the camera is provided with a substrate 16 including a liquid crystal part for displaying the date and the like and a pressure plate 14 for covering the substrate 16,
From there, a flexible substrate 13 electrically connected to the substrate 16 extends. The flexible substrate 13 is
Although it is inserted into the slit 12 and electrically connected to the camera body 10, the contacts electrically connected to the flexible substrate 13 are wide for improving reliability. In this state, the slit 1
I can't insert it into 2.

【0010】次に図3は、図2に示した前記フレキシブ
ル基板13先端部(点線で囲まれた部分)の拡大図であ
る。図3に示すように、 前記フレキシブル基板
13先端部は、先端以外の部分と比べて幅が広くなって
いる。また、前記フレキシブル基板13先端部の円で示
したカバーレイ開口部の内側は、電気的接点であり、電
極がむき出しとなっている。さらに、前記フレキシブル
基板13先端部の横に走っている破断線で前記フレキシ
ブル基板13を折り返すことができる構造になってい
る。
Next, FIG. 3 is an enlarged view of a tip portion (a portion surrounded by a dotted line) of the flexible substrate 13 shown in FIG. As shown in FIG. 3, the tip of the flexible substrate 13 is wider than the portion other than the tip. The inside of the cover lay opening indicated by the circle at the tip of the flexible substrate 13 is an electrical contact and the electrode is exposed. Further, the flexible substrate 13 can be folded back along a break line running beside the tip of the flexible substrate 13.

【0011】図4は、前記フレキシブル基板13先端部
を前記折り曲げの破断線に従って折り曲げ、前記スリッ
ト12に挿入する場合を示した図である。図4に示すよ
うに、前記フレキシブル基板13先端部を前記折り曲げ
の破断線に従って折り返すことにより、前記スリット1
2よりも幅が狭くなり挿入することができるようにな
る。
FIG. 4 is a view showing a case where the tip portion of the flexible substrate 13 is bent along the breaking line of the bending and inserted into the slit 12. As shown in FIG. 4, the slit 1 is formed by folding back the tip of the flexible substrate 13 along the breaking line of the folding.
The width is narrower than 2 and it can be inserted.

【0012】次に、図5は、前記フレキシブル基板13
を前記スリット12に挿入後、前記フレキシブル基板1
3の先端部を前記破断線に従って展開し、前記カメラ本
体10の中にある別のフレキシブル基板17と接続した
場合を示した図である。図5に示すように、前記フレキ
シブル基板13と別のフレキシブル基板17の点線で示
した接続部分の面積は、フレキシブル基板の先端部以外
の幅よりも大きくなっているため、より確実に接続する
ことができる。
Next, FIG. 5 shows the flexible substrate 13
After inserting into the slit 12, the flexible substrate 1
3 is a diagram showing a case where the tip end portion of 3 is expanded according to the breaking line and connected to another flexible substrate 17 in the camera body 10. FIG. As shown in FIG. 5, since the area of the connection portion of the flexible substrate 13 and the other flexible substrate 17 indicated by the dotted line is larger than the width of the flexible substrate other than the tip portion, more reliable connection is required. You can

【0013】次に図6は、図5の点線で示した接続部分
の断面図である。図6に示すように、カメラ本体10と
前記フレキシブル基板13の間には、例えばゴム等の弾
性部材18が設置されており、前記フレキシブル基板1
3の上には別のフレキシブル基板17、そしてその上に
は、同様に弾性部材18が設置されている。また、さら
に前記別のフレキシブル基板17の上に設置されている
弾性部材18の上には、ワッシャー19が設置されてお
り、最後にビス15で固定されている。その上から本体
後部カバー11が被さることになる。
Next, FIG. 6 is a cross-sectional view of the connection portion shown by the dotted line in FIG. As shown in FIG. 6, an elastic member 18 such as rubber is installed between the camera body 10 and the flexible substrate 13, and the flexible substrate 1
Another flexible substrate 17 is provided on top of 3, and an elastic member 18 is similarly provided on top of it. Further, a washer 19 is installed on the elastic member 18 installed on the another flexible substrate 17, and finally fixed by a screw 15. The main body rear cover 11 is covered from above.

【0014】次に、図7は、前記フレキシブル基板13
を前記スリット12に挿入後、前記フレキシブル基板1
3の先端部を展開したときの拡大図である。図7に示す
ように、前記スリット12よりも幅を狭く折り曲げられ
た前記フレキシブル基板13は、前記スリット12に挿
入され、通過後前記折り曲げられた先端部分を前記破断
線に従って展開する。このとき、前記本体後部カバー1
1よりもはみ出ない面積であることが望ましい。
Next, FIG. 7 shows the flexible substrate 13
After inserting into the slit 12, the flexible substrate 1
It is an enlarged view when the tip part of 3 is expanded. As shown in FIG. 7, the flexible substrate 13 bent to have a width narrower than that of the slit 12 is inserted into the slit 12, and after passing, the bent tip portion is expanded according to the break line. At this time, the main body rear cover 1
It is desirable that the area does not protrude beyond 1.

【0015】図8は、前記フレキシブル基板13の折り
曲げ線(図8中の破断線)と導電パターンとの関係を示
した図である。図8に示すように、折り曲げ線の両側
(図8では幅α)は、電気的接点が露出している円で示
したカバーレイ開口部に導電パターン形成しないように
することが望ましい。
FIG. 8 is a diagram showing the relationship between the bending line (broken line in FIG. 8) of the flexible substrate 13 and the conductive pattern. As shown in FIG. 8, it is desirable not to form a conductive pattern on both sides of the folding line (width α in FIG. 8) in the cover lay opening indicated by the circle where the electrical contacts are exposed.

【0016】また、図9は、前記フレキシブル基板13
の先端が別の導電パターンであるフレキシブル基板21
を示した図である。図9に示すように、このような導電
パターンである場合も、折り曲げ線の両側(図9では幅
β)には、導電パターンを形成しないようにすることが
望ましい。なお、図9の縦の点線よりも右側の導電パタ
ーンが電気的接点が露出しているカバーレイ開口部であ
る。
Further, FIG. 9 shows the flexible substrate 13
Flexible substrate 21 whose tip has a different conductive pattern
It is the figure which showed. As shown in FIG. 9, even in the case of such a conductive pattern, it is desirable not to form a conductive pattern on both sides (width β in FIG. 9) of the bending line. The conductive pattern on the right side of the vertical dotted line in FIG. 9 is the coverlay opening where the electrical contacts are exposed.

【0017】次に、図10は、前記フレキシブル基板1
3の先端が別の導電パターンであるフレキシブル基板2
2を示した図である。このフレキシブル基板22の場合
は、2カ所で折り曲げて先端部分をスリット12の幅よ
りも狭くするがこの場合も折り曲げ線の両側には、導電
パターンを形成しないようにすることが望ましい。な
お、図10の縦の点線よりも右側の導電パターンが電気
的接点が露出しているカバーレイ開口部である。
Next, FIG. 10 shows the flexible substrate 1
Flexible substrate 2 having a conductive pattern at the tip of 3
It is the figure which showed 2. In the case of this flexible substrate 22, the tip portion is made narrower than the width of the slit 12 by bending it at two places, but in this case also, it is desirable not to form a conductive pattern on both sides of the bending line. The conductive pattern on the right side of the vertical dotted line in FIG. 10 is the coverlay opening where the electrical contacts are exposed.

【0018】次に、図11は、前記フレキシブル基板1
3の先端が別の導電パターンであるフレキシブル基板2
3を示した図である。このフレキシブル基板23の場合
は、先端部分がスリット12の幅よりも狭くなってお
り、この状態でスリット12を通過させる。そして、ス
リット12を通過後、2カ所で縦方向(A)と横方向
(B)に折り曲げて接続を行う。また、図12は、前記
フレキシブル基板23を折り曲げた状態を示した。
Next, FIG. 11 shows the flexible substrate 1
Flexible substrate 2 having a conductive pattern at the tip of 3
It is the figure which showed 3. In the case of this flexible substrate 23, the tip portion is narrower than the width of the slit 12, and the slit 12 is passed in this state. Then, after passing through the slit 12, it is bent at two locations in the vertical direction (A) and the horizontal direction (B) to be connected. Further, FIG. 12 shows a state where the flexible substrate 23 is bent.

【0019】次に、図13は、前記フレキシブル基板1
3の先端が別の導電パターンであるフレキシブル基板2
4を示した図である。このフレキシブル基板24の場合
は、図13の破断線で折り曲げて全体をスリット12の
幅よりも狭くする。なお、図13の折り曲げる破断線よ
りも上の部分のパターンはスリット12挿入後、展開し
て、例えば、電池室の壁に貼り付ける等して外部機器と
の電気的接続(通信ライン)として利用する。
Next, FIG. 13 shows the flexible substrate 1
Flexible substrate 2 having a conductive pattern at the tip of 3
It is the figure which showed 4. In the case of this flexible substrate 24, it is bent along the broken line in FIG. 13 so that the whole is made narrower than the width of the slit 12. The pattern above the breaking line in FIG. 13 is used as an electrical connection (communication line) with an external device by inserting the slit 12 and then unfolding and sticking it to the wall of the battery chamber, for example. To do.

【0020】なお、本発明によれば以下のような構成も
可能である。
According to the present invention, the following configurations are possible.

【0021】付記1.複数の電気基板を有する機器にお
いて、所定の穴幅を有して貫通する穴部を有する部材
と、上記穴部を通過して他の電気基板と電気的接続を行
うための接点群が設けられ、上記所定の穴幅より大きな
幅寸法の接点群部分と、上記接点群部分から導き出され
る複数のリードパターンが設けられた上記所定の穴幅よ
り小さな幅寸法のリード部とを有し、上記接点群間を折
り曲げ可能としたフレキシブルプリント基板と、を有
し、上記他の電気基板と上記フレキシブルプリント基板
とを電気的に接続するため、上記接点群部分の上記接点
群間を折り曲げ、上記接点群部分を上記穴部に通過させ
た後、上記折り曲げ部分を展開もしくは折り曲げて上記
他の電気基板に接続したことを特徴とする機器。
Appendix 1. In a device having a plurality of electric boards, a member having a hole portion having a predetermined hole width and penetrating therethrough, and a contact group for passing through the hole portion and electrically connecting to another electric board are provided. A contact group portion having a width dimension larger than the predetermined hole width, and a lead portion having a width dimension smaller than the predetermined hole width provided with a plurality of lead patterns derived from the contact group portion, A flexible printed circuit board capable of folding between the groups, and in order to electrically connect the other electric circuit board to the flexible printed circuit board, the contact group of the contact group portion is bent, and the contact group is formed. An apparatus, characterized in that, after the portion is passed through the hole, the bent portion is expanded or folded and connected to the other electric board.

【0022】付記2.貫通する穴部を有する部材と、上
記穴部を通過して他の電気基板と電気的接続を行うため
の接点群が設けられた接点群部分を有し、上記接点群間
を折り曲げ可能としたフレキシブルプリント基板と、を
有した機器の組立方法において、上記他の電気基板と上
記フレキシブルプリント基板とを電気的に接続するた
め、上記接点群部分の上記接点群間を折り曲げ、上記接
点群部分を上記穴部に通過させ後、上記折り曲げ部分を
展開もしくは折り曲げて上記他の電気基板に接続したこ
とを特徴とする機器の組立方法。
Appendix 2. A member having a through hole, and a contact group portion provided with a contact group for passing through the hole and making an electrical connection with another electric substrate, and made it possible to fold between the contact groups. In a method of assembling a device having a flexible printed board, in order to electrically connect the other electric board to the flexible printed board, the contact group of the contact group is bent between the contact group, After passing through the hole, the bent portion is unfolded or bent and connected to the other electric board.

【0023】以上、本発明の実施形態を用いることによ
り、スリットにスリットの幅よりも広い幅のフレキシブ
ル基板を挿入することができるため、フレキシブル基板
を接続する際の信頼性が向上する。また、スリットの形
状やフレキシブル基板の形状により、スリットを通過さ
せる前もしくは後に折り曲げることができるため、各接
続部材に容易に対応できる。
As described above, by using the embodiment of the present invention, a flexible board having a width wider than the width of the slit can be inserted into the slit, so that reliability in connecting the flexible board is improved. Further, depending on the shape of the slit or the shape of the flexible substrate, it can be bent before or after passing through the slit, so that it can be easily applied to each connecting member.

【0024】[0024]

【発明の効果】本発明を用いることにより、スリットに
スリットの幅よりも広い幅のフレキシブル基板を挿入す
ることができるため、フレキシブル基板を接続する際の
信頼性が向上する。
By using the present invention, a flexible substrate having a width wider than the width of the slit can be inserted into the slit, so that reliability in connecting the flexible substrate is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施形態に係る裏蓋を開けた状態のカ
メラ本体の背面図。
FIG. 1 is a rear view of a camera body with a back cover opened according to an embodiment of the present invention.

【図2】本発明の実施形態に係るカメラの後部の蓋を示
す図。
FIG. 2 is a diagram showing a rear cover of the camera according to the embodiment of the present invention.

【図3】本発明の実施形態に係る図2に示した前記フレ
キシブル基板先端部の拡大図。
FIG. 3 is an enlarged view of the end portion of the flexible substrate shown in FIG. 2 according to the embodiment of the present invention.

【図4】本発明の実施形態に係るフレキシブル基板先端
部を折り曲げの破断線に従って折り曲げ、スリットに挿
入する場合を示した図。
FIG. 4 is a view showing a case where the tip end portion of the flexible substrate according to the embodiment of the present invention is bent along a breaking line of bending and is inserted into a slit.

【図5】本発明の実施形態に係るフレキシブル基板をス
リットに挿入後、フレキシブル基板13の先端部を破断
線に従って展開し、カメラ本体の中にある別のフレキシ
ブル基板と接続した場合を示した図。
FIG. 5 is a diagram showing a case where the flexible substrate according to the embodiment of the present invention is inserted into a slit, the tip end portion of the flexible substrate 13 is expanded along a breaking line, and the flexible substrate is connected to another flexible substrate in the camera body. .

【図6】本発明の実施形態に係る図5の点線で示した接
続部分の断面図。
FIG. 6 is a cross-sectional view of the connection portion shown by the dotted line in FIG. 5 according to the embodiment of the present invention.

【図7】本発明の実施形態に係るフレキシブル基板をス
リットに挿入後、フレキシブル基板の先端部を展開した
ときの拡大図。
FIG. 7 is an enlarged view of the flexible substrate according to the embodiment of the present invention, after inserting the flexible substrate into the slit and expanding the tip portion of the flexible substrate.

【図8】本発明の実施形態に係るフレキシブル基板折り
曲げ線と導電パターンとの関係を示した図。
FIG. 8 is a view showing a relationship between a flexible substrate bending line and a conductive pattern according to the embodiment of the present invention.

【図9】本発明の実施形態に係るフレキシブル基板の先
端が別の導電パターンであるフレキシブル基板を示した
図。
FIG. 9 is a diagram showing a flexible substrate according to an embodiment of the present invention, in which the tip of the flexible substrate is another conductive pattern.

【図10】本発明の実施形態に係るフレキシブル基板の
先端が別の導電パターンであるフレキシブル基板を示し
た図。
FIG. 10 is a diagram showing a flexible substrate according to an embodiment of the present invention, in which the tip of the flexible substrate is another conductive pattern.

【図11】本発明の実施形態に係るフレキシブル基板の
先端が別の導電パターンであるフレキシブル基板を示し
た図。
FIG. 11 is a view showing a flexible substrate according to an embodiment of the present invention, in which the tip of the flexible substrate is another conductive pattern.

【図12】本発明の実施形態に係るフレキシブル基板を
折り曲げた状態を示した図。
FIG. 12 is a view showing a state in which the flexible board according to the embodiment of the present invention is bent.

【図13】本発明の実施形態に係るフレキシブル基板の
先端が別の導電パターンであるフレキシブル基板を示し
た図。
FIG. 13 is a diagram showing a flexible substrate according to an embodiment of the present invention, in which the tip of the flexible substrate is another conductive pattern.

【符号の説明】[Explanation of symbols]

10…カメラ本体、11…本体後部カバー、12…スリ
ット、13…フレキシブル基板、、14…圧板、17、
21、22、23、24…フレキシブル基板、15…
蓋、16…基板、18…弾性部材、20…ビス
10 ... Camera body, 11 ... Body rear cover, 12 ... Slit, 13 ... Flexible substrate, 14 ... Pressure plate, 17,
21, 22, 23, 24 ... Flexible substrate, 15 ...
Lid, 16 ... Substrate, 18 ... Elastic member, 20 ... Screw

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 複数の電気基板を有する機器において、 貫通する穴部を有する部材と、 上記穴部を通過して他の電気基板と電気的接続を行うた
めの接点群が設けられた接点群部分を有し、上記接点群
間を折り曲げ可能としたフレキシブルプリント基板と、 を有し、上記他の電気基板と上記フレキシブルプリント
基板とを電気的に接続するため、上記接点群部分を上記
穴部に通過させた後、上記折り曲げ部分を展開もしくは
折り曲げて上記他の電気基板に接続したことを特徴とす
る機器。
1. A device having a plurality of electric boards, wherein a member having a through hole and a contact group for passing through the hole and electrically connecting to another electric board are provided. A flexible printed circuit board that has a portion and can be bent between the contact groups, and the electrical contact between the other electric board and the flexible printed circuit board After being passed through, the device is characterized in that the bent portion is expanded or bent and connected to the other electric board.
【請求項2】 上記フレキシブルプリント基板は、上記
接点群部分の折り曲げ部分には電気的接点を設けていな
いフレキシブルプリント基板を有したことを特徴とする
請求項1に記載の機器。
2. The device according to claim 1, wherein the flexible printed circuit board has a flexible printed circuit board in which electrical contacts are not provided in a bent portion of the contact group portion.
【請求項3】 上記穴部は所定の穴幅を有し、上記接点
群部分は、上記他の電気基板に接続する際に、展開もし
くは折り曲げたことにより上記穴幅より大きい幅寸法を
有するフレキシブルプリント基板を有したことを特徴と
する請求項1または請求項2に記載の機器。
3. The flexible portion having a predetermined hole width, and the contact group portion has a width dimension larger than the hole width due to expansion or bending when connecting to the other electric board. The device according to claim 1 or 2, further comprising a printed circuit board.
JP2001381613A 2001-12-14 2001-12-14 Device manufacturing method Expired - Fee Related JP3947667B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001381613A JP3947667B2 (en) 2001-12-14 2001-12-14 Device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001381613A JP3947667B2 (en) 2001-12-14 2001-12-14 Device manufacturing method

Publications (2)

Publication Number Publication Date
JP2003188487A true JP2003188487A (en) 2003-07-04
JP3947667B2 JP3947667B2 (en) 2007-07-25

Family

ID=27592233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001381613A Expired - Fee Related JP3947667B2 (en) 2001-12-14 2001-12-14 Device manufacturing method

Country Status (1)

Country Link
JP (1) JP3947667B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015019060A (en) * 2013-07-12 2015-01-29 易鼎股▲ふん▼有限公司 Method and structure of penetration and combination for flexible circuit board with hinge assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015019060A (en) * 2013-07-12 2015-01-29 易鼎股▲ふん▼有限公司 Method and structure of penetration and combination for flexible circuit board with hinge assembly

Also Published As

Publication number Publication date
JP3947667B2 (en) 2007-07-25

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