JP3790020B2 - Surface mount machine - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface mounter, and more particularly to a surface mounter including a plurality of heads having suction nozzles in a head unit and optical detection means for detecting the suction state of a component based on projection detection. It is.
[0002]
[Prior art]
Conventionally, a head equipped with a suction nozzle is mounted on a movable head unit, and a small electronic component such as an IC is picked up from a tape feeder or the like of a component supply unit and transferred onto a printed circuit board. A surface mounting machine (hereinafter simply referred to as a mounting machine) that is mounted on a predetermined position of a printed circuit board is generally known. Recently, an optical system that detects the projection of a component by irradiating light onto the sucked component. An apparatus has been developed in which an automatic detection means is provided, and based on the detection of the projection, the component suction state, for example, the displacement or inclination of the suction position with respect to the head is checked to correct the mounting position.
[0003]
In particular, a mounting machine has been proposed in which an optical detection means is mounted on the above head unit to check the suction state of the component using the moving period of the head unit from component suction to mounting. In this machine, the irradiation unit and the light receiving unit are arranged at positions facing each other across the space through which the suction nozzle passes, and parallel light is irradiated from the irradiation unit to the sucked component, and the component is projected by the light receiving unit. By detecting the width, the suction state of the component can be checked.
[0004]
[Problems to be solved by the invention]
By the way, in the mounting machine in which the optical detection means is mounted on the head unit as described above, in recent years, a plurality of heads are mounted on the head unit. In this type of mounting machine, It is required to check the suction state of the sucked parts in a short time during the movement of the head unit.
[0005]
For this reason, the optical detection means is configured to simultaneously project the components adsorbed on each head, but generally, as shown in FIG. As shown in FIG. 11, an optical detecting means including an irradiation unit 51 and a light receiving unit 52 that can irradiate and receive light, or an irradiation unit 51 and a light receiving unit for a parallel light beam 53 for each head 50. 52 is provided, and an optical detection means in which these are arranged in a line in the head arrangement direction is performed.
[0006]
However, in the conventional configuration shown in these drawings, if the parts to be sucked up are large, adjacent parts may interfere with each other, and the suction state of both parts may not be examined simultaneously. It is necessary to set a wide interval between the heads assuming the maximum size component to be mounted. Therefore, there is a problem that it is easy to promote an increase in the size of the head unit, specifically, an increase in the size of the head arrangement direction. However, such an increase in the size of the head unit increases the influence of inertia when moving the head unit, and becomes a negative factor for speeding up the mounting process. Therefore, it is necessary to avoid it as much as possible.
[0007]
In the present invention, in view of the above circumstances, the head unit is provided with a plurality of heads each provided with a suction nozzle, and the suction state of the parts sucked by each suction nozzle is checked by an optical detection means mounted on the head unit. An object of the present invention is to provide a surface mounter capable of effectively suppressing an increase in size of the head unit in the surface mounter configured.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, a plurality of heads each having a component suction nozzle are mounted in a line on a head unit, and a light irradiation unit and a light reception unit are provided. In a surface mounter equipped with an optical detection means for examining a component suction state based on the detection of a suctioned component projection, the optical detection means includes a light irradiation unit and a light receiving unit corresponding to each head. The unit detection means is composed of a plurality of unit detection means, and each unit detection means is arranged so that the light irradiation and light reception directions of the unit detection means are the same, and at least one unit detection means is adjacent to the unit detection means. The interval between the heads is set so that the unit detection means partially overlaps the unit detection means adjacent to the unit detection means.
[0009]
According to this apparatus, since the distance between the heads is set so that at least one pair of adjacent unit detection means overlaps in the head arrangement direction, compared with this type of conventional apparatus, Thus, the increase in the size of the head unit in the head arrangement direction can be suppressed by the amount of overlapping of the unit detection means. In addition, since the unit detection means are offset in the vertical direction in this way, even if the parts have sizes that interfere with each other when arranged on the same plane, the suction state of these parts is simultaneously checked by each unit detection means. be able to.
[0010]
In particular, in the above surface mounter, if the unit detecting means are alternately arranged so as to overlap each other, the enlargement of the head unit in the head arranging direction can be more effectively suppressed, An increase in size in the vertical direction can be minimized. Moreover, it becomes easy to make the lifting mechanism structure of each head common.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
[0012]
1 and 2 show an example of a surface mounter according to the present invention. As shown in the figure, on a base 1 of a surface mounter (hereinafter abbreviated as a mounter), a printed circuit board transporting conveyor 2 is arranged, and the printed circuit board 3 is transported on the conveyor 2 to be predetermined. Is stopped at the mounting work position.
[0013]
On the front and rear sides of the conveyor 2, component supply units 4 are respectively provided. Each component supply unit 4 has a plurality of rows of tape feeders 4a, and each tape feeder 4 is a reel that stores and holds small pieces of components such as ICs, transistors and capacitors at predetermined intervals. And a ratchet type feed mechanism at the tape feed end so that the tape is fed out intermittently as the parts are picked up by the head unit 5 to be described later.
[0014]
Above the base 1, a component mounting head unit 5 is provided. The head unit 5 has an X-axis direction (the direction of the conveyor 2) and a Y-axis direction (a direction orthogonal to the X-axis on a horizontal plane). ) Can be moved to.
[0015]
That is, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit is disposed on the fixed rail 7. A support member 11 is disposed, and a nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 extending in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15 so that the head unit 5 can move on the guide member 13. A nut portion (not shown) held by the head unit 5 is screwed onto the ball screw shaft 14. Then, the ball screw shaft 8 is rotated by the operation of the Y-axis servo motor 9 and the support member 11 is moved in the Y-axis direction, and the ball screw shaft 14 is rotated by the operation of the X-axis servo motor 15, thereby the head unit. 5 moves in the X-axis direction with respect to the support member 11.
[0016]
As shown in FIG. 3, the head unit 5 is provided with a plurality of heads. In the illustrated example, four heads 20a to 20d are arranged in a line in the X-axis direction.
[0017]
Each of the heads 20a to 20d can be moved up and down and rotated with respect to the frame of the head unit 5, and although not shown in detail, a lifting drive means using a Z-axis servo motor 24 as a drive source and an R axis. The servomotor 26 is driven by a rotational drive means using a drive source. Further, a nozzle 21 for sucking parts is provided at the lower end of each of the heads 20a to 20d. At the time of picking up the parts, negative pressure is supplied to the nozzle 21 from negative pressure supply means (not shown), and suction by the negative pressure is performed. Parts are attracted by force.
[0018]
The head unit 5 is further provided with a laser unit 30 (unit detection means) for detecting the suction state of the parts sucked by the nozzles 21 based on the projection, corresponding to the heads 20a to 20d.
[0019]
As shown in FIG. 4, the laser unit 30 includes a laser generating unit 31a (irradiating unit) and a detector 31b (light receiving unit) facing each other across a space through which the nozzles 21 of the heads 20a to 20d move up and down. And is configured to detect the projection of the component by irradiating the adsorbed component with a parallel light beam 32.
[0020]
Here, the arrangement of the laser units 30 and the heads 20a to 20d will be described in more detail. As shown in FIGS. 3 and 5, each laser unit 30 is irradiated with parallel light beams 32 and receives light in the same direction. In addition, the laser units 30 arranged adjacent to each other are alternately offset up and down. In the illustrated example, the laser unit 30 corresponding to the heads 20a and 20c and the laser unit 30 corresponding to the heads 20b and 20d are relatively vertically offset.
[0021]
And each head 20a-20d is set so that the space | interval of head 20a-20d may be narrowed as much as possible in the range which the parallel beam of each laser unit 30 is not interrupted by head 20a-20d, and according to this By arranging the laser units 30, the adjacent heads 20a to 20d are alternately arranged in the vertical direction. At this time, the arrangement of the heads 20a to 20d is set in consideration of the arrangement of the tape feeder 4a so that the components can be simultaneously sucked from the component supply unit 4 by the plurality of heads 20a to 20d. In FIG. 5, the laser unit 30 located on the upper side (that is, the laser unit 30 corresponding to the heads 20 a and 20 c) is hatched to facilitate understanding of the positional relationship between the laser units 30.
[0022]
According to the mounting machine configured as described above, at the time of mounting, the components 20 are sucked from the component suction unit 4 by the heads 20a to 20d of the head unit 5, and then each suction component is attached to each laser unit as shown in FIG. By raising to a height position corresponding to 30, the projection of each component is detected by each laser unit 30 in correspondence between the laser generator 31 a and the detector 31 b, and the suction state of each component is examined simultaneously. Can do. In particular, mounting efficiency can be improved by performing such projection detection while the head unit 5 is moving, that is, while the head unit 5 is moved to the mounting position after the components are picked up.
[0023]
Moreover, due to the configuration of the head unit 5, as described above, the adjacent laser units 30 are alternately offset up and down, and the intervals between the heads 20a to 20d are such that the adjacent laser units 30 overlap each other. Since the intervals between the heads 20a to 20d are set so as to be as narrow as possible, the head unit 5 is equipped with a plurality of heads 20a to 20d and a laser unit 30 corresponding thereto. Compared with this type of mounting machine, there is a feature that the enlargement of the head unit 5 in the X-axis direction can be effectively suppressed.
[0024]
That is, in this type of conventional mounting machine (the apparatus shown in FIG. 10) having a plurality of heads and corresponding laser units in the head unit, when the target parts become large, the parts interfere with each other and project each part. There is a possibility that it cannot be detected at the same time. For this reason, when the size of the target component increases, it is necessary to set the head interval wide according to the size, and it is easy to facilitate the increase in size of the head unit in the X-axis direction.
[0025]
However, according to the mounting machine of the above embodiment, as described above, even if the intervals between the heads 20a to 20d are set as narrow as possible so that the adjacent laser units 30 overlap each other, Since the laser units 30 are alternately offset up and down, for example, as shown in FIG. 7, even if the components are arranged on the same plane and interfere with each other, the adsorption state of each component is changed to the laser. Unit 30 can be examined simultaneously. Therefore, as compared with the conventional mounting machine of this type, an increase in the size of the head unit 5 in the X-axis direction can be suppressed by the overlapping amount of the laser unit 30.
[0026]
By the way, in the configuration of the head unit 5 as described above, in the case shown in FIG. 7, if the mounting order of the components by the heads 20a to 20d is set to unlimited, the components may interfere with each other and fall off. . For example, a component (for example, a component sucked by the head 20a) that detects projection by the laser unit 30 located on the upper side is picked up by a component (for example, the head 20b) that detects projection by the laser unit 30 located on the lower side. If an attempt is made to mount the component before the component), the components may interfere with each other and fall off when the head is raised and lowered. Similarly, there is a problem of component interference when the component is attracted. Therefore, in the mounting machine described above, it is necessary to control the mounting operation so as to avoid such interference between components at the time of suction and mounting of the components.
[0027]
FIG. 8 is a flowchart showing an example of such a sucking and mounting operation. Hereinafter, this sucking and mounting operation will be described. Note that although the laser unit 30 is used to perform component recognition (determination of adsorption failure and detection of displacement of the adsorption position) between adsorption and mounting, the component recognition process itself has been conventionally known and will be omitted.
[0028]
In this flow, first, the head unit 5 is moved to the first component suction position (n = 1) of the component supply unit 4 to suck the components (steps S1 to S3). The components are sucked in order from the heads 20a and 20c (hereinafter referred to as the upper heads 20a and 20c) corresponding to the laser unit 30 disposed on the upper side of the laser unit 30. At this time, if possible, the components 20a and 20c or the heads 20b and 20d are simultaneously suctioned.
[0029]
When the suction of the component at the suction position is completed, it is determined whether there is another component to be sucked (step S4). If there is, the head unit 5 is moved to the next component suction position of the component supply unit 4. (N + 1) is moved (step S5), and the components are similarly picked up.
[0030]
Next, it is determined whether or not there is a mounted component, that is, whether or not a component to be mounted on the head unit 5 is sucked (step S6). If there is a mounting component, an initial setting of the mounting order m (step S7) is performed, and then it is determined whether or not the m-th head whose mounting order is set in advance is the upper heads 20a and 20b. (Step S8).
[0031]
Here, when the head is not the upper head, the head unit 5 is moved to the target position (step S9), and the component sucked by the head is mounted on the printed circuit board 3, and the process proceeds to step S7 (step S7). Step S10). On the other hand, when the head is the upper head in step S8, it is determined whether or not the suction component interferes with other components that are not mounted (step S11). If there is no interference, the process proceeds to step S9. Then, the component is mounted. If the components interfere with each other in step S11, the process proceeds to step S12.
[0032]
In step S12, data relating to the number of heads is incremented, and it is determined whether or not the data (m + 1) exceeds the number of heads (step S13). If not, the process returns to step S8 and exceeds it. If so, the process returns to step S6.
[0033]
When the mounting of all the parts sucked by the heads 20a to 20d is thus completed (NO in step S6), the process returns to the start.
[0034]
According to such a mounting operation, while adopting the configuration of the head unit 5 as described above, it is possible to reliably prevent interference between components when the components are sucked and mounted by the heads 20a to 20d.
[0035]
By the way, the mounting machine of the said embodiment is an example of the surface mounting machine based on this invention, The specific structure can be suitably changed in the range which does not deviate from the summary of this invention.
[0036]
For example, in the above-described embodiment, the heads 20a to 20d are configured to be alternately offset up and down in the X-axis direction, but are arranged on the right side (right side in the figure) as shown in FIG. The head may always be offset downward, and each of 20a to 20d may be arranged stepwise. In short, if the adjacent heads are arranged vertically offset, the specific arrangement is appropriately selected in consideration of the specific configuration such as the head unit 5 and the lifting stroke of the heads 20a to 20d. What should I do?
[0037]
However, according to the configuration as shown in FIG. 3, since there is not much difference in the lifting stroke of each head 20a-20d at the time of component suction mounting, it is easy to apply a common lifting mechanism for the heads 20a-20d, Further, compared with the configuration shown in FIG. 9, there is an advantage that an increase in size of the head unit 5 in the vertical direction can be suppressed.
[0038]
In addition to the configuration in which all the laser units 30 are vertically offset from each other as in the above-described embodiment, a part of the laser units 30 are arranged to be offset, for example, corresponding to the heads 20a to 20c. The laser units 30 may be arranged side by side at the same height as in the prior art, and the laser units 30 corresponding to the remaining heads 20d may be offset vertically with respect to the other laser units 30.
[0039]
【The invention's effect】
As described above, according to the present invention, in the surface mounter in which a plurality of heads are mounted on the head unit and the optical detection means for detecting the projection of the component attracted to each head is mounted, the optical detection means Is composed of a plurality of unit detection means having a light irradiation part and a light receiving part corresponding to each head, and each unit detection means is arranged so that the light irradiation and light reception directions of each unit detection means are in the same direction. In addition, at least one unit detection unit is offset up and down with respect to the adjacent unit detection unit, and the interval between the heads is set so that the unit detection unit partially overlaps the adjacent unit detection unit. Therefore, as compared with the conventional surface mounter of this type, it is possible to suppress an increase in the size of the head unit in the head arrangement direction by the amount of overlapping of the unit detection means.
[0040]
In particular, in this surface mounter, if each unit detection means is arranged so that each unit detection means alternately overlaps vertically, it is possible to more effectively suppress the enlargement of the head unit in the head arrangement direction. In addition, it is possible to minimize the size of the head unit in the vertical direction. Moreover, it becomes easy to make the lifting mechanism structure of each head common.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing an example of a surface mounter to which the present invention is applied.
FIG. 2 is a schematic front view of the same.
FIG. 3 is a front view showing a configuration of a head unit.
FIG. 4 is a schematic plan view showing a configuration of a laser unit.
FIG. 5 is a schematic plan view showing a positional relationship between each head and a laser unit in the head unit.
FIG. 6 is a main part front view of the head unit showing an example of a state in which the sucked parts are arranged at a predetermined projection detection position of the laser unit.
FIG. 7 is a front view of the main part of the head unit showing another example of a state in which the sucked component is disposed at a predetermined projection detection position of the laser unit.
FIG. 8 is a flowchart illustrating an example of the mounting operation.
FIG. 9 is a schematic front view showing another arrangement example of laser units.
FIG. 10 is a schematic plan view showing the relationship between a head and a laser unit in a conventional apparatus.
FIG. 11 is a schematic plan view showing a relationship between a head and a laser unit in a conventional apparatus.
[Explanation of symbols]
5 Head units 20a to 20d Head 21 Nozzle 24 R-axis servo motor 26 Z-axis servo motor 30 Laser unit 31a Irradiation section 31b Detector

Claims (2)

A plurality of heads having nozzles for picking up parts are mounted in a line on the head unit, and have a light irradiation part and a light receiving part, and parts are detected based on detection of projections of the parts picked up by the nozzles. In the surface mounter equipped with the optical detection means for examining the adsorption state, the optical detection means is composed of a plurality of unit detection means having a light irradiation part and a light receiving part corresponding to each head, and each unit detection The unit detection means is arranged so that the light irradiation and light receiving directions of the means are the same direction, and at least one unit detection means is vertically offset with respect to the adjacent unit detection means, and the unit detection means The surface mounter is characterized in that the interval between the heads is set so as to partially overlap the unit detecting means adjacent thereto. 2. The surface mounter according to claim 1, wherein the unit detecting means are alternately arranged so as to overlap vertically.

Images