JP3337753B2 - Lead abnormality inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead abnormality inspection apparatus for detecting an abnormality of a lead such as an IC when mounting an electronic component on a printed circuit board.

[0002]

2. Description of the Related Art Heretofore, electronic components such as a flat package IC (hereinafter abbreviated as "IC") and the like are well known in which a plurality of leads are arranged side by side on a package. I have. In such an IC, due to deformation of the leads, some of the leads may be floating above other leads, or the pitch between adjacent leads may be narrower (wider). When the IC having the irregularities is mounted on the substrate, the leads may be disconnected or short-circuited, resulting in poor conduction.

[0003] Therefore, in an electronic component mounting machine (hereinafter abbreviated as "mounting machine") in which an IC is sucked by a suction nozzle and automatically mounted on a substrate, the above-mentioned inconvenience is prevented before mounting. Fig. 6 shows the state of the leads of each IC.
Inspection and sorting are performed by an apparatus as shown in FIG.

In FIG. 1, reference numeral 60 denotes a light beam type inspection apparatus (hereinafter, abbreviated as an inspection apparatus) provided with an irradiation section 62 for irradiating a light beam 66 and a light receiving section 64 vertically opposed to each other. Generally, 60 is provided on the base of the mounting machine within the movable area of the suction nozzle.

When an IC lead inspection is performed by the inspection device 60, as shown in FIG. 1, the IC 57 is sucked by the suction nozzle 50, and then the suction nozzle 50 is moved, so that the lead of the IC 57 is subjected to the inspection. It is arranged at a predetermined inspection position so as to block the light beam 66 of the device 60. That is, by detecting the light beam 66 irradiated from the irradiation unit 62 and passed between the leads of the IC 57 and incident on the light receiving unit 64, the abnormality of the lead of the IC 57 is detected.

[0006]

The above-mentioned IC5
Electronic components such as 7 have been increasingly miniaturized due to today's technological progress, and it is desired that the inspection device 60 as described above can also cope with such miniaturized electronic components. However, since the inspection device 60 has a structure in which the irradiation unit 62 and the light reception unit 64 are vertically opposed to each other, as shown in FIG. 6B, a lead inspection of an extremely small IC 58 is performed. If this is attempted, the suction nozzle 50 and the inspection device 60 will interfere with each other, and the IC5
8 lead inspection may be difficult or impossible.

Further, since the inspection device 60 is provided in the movable area of the suction nozzle 50 on the base of the mounting machine as described above, for example, when the suction nozzle 50 malfunctions or the like occurs. As described above, the suction nozzle 50 and the inspection device 60 interfere with each other, which causes a problem that the inspection device 60 or the suction nozzle 50 is damaged.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and in any case, leads of an electronic component can be made without causing interference between a suction nozzle and an inspection device and without being affected by the size of the electronic component. It is an object of the present invention to provide a lead abnormality inspection device capable of performing abnormality detection.

[0009]

According to the present invention, a suction nozzle for sucking an electronic component is provided above a base so as to be movable and rotatable over a certain range in a horizontal direction and a vertical direction. A light beam detecting means comprising a light receiving portion and a light receiving portion is arranged on a base, and a suction nozzle for sucking an electronic component having a lead array is moved to move the electronic component between the irradiation portion and the light receiving portion of the light beam detecting device. In the apparatus for detecting an abnormality of the lead of the electronic component based on the projection detection of the light passing through the lead row of the electronic component by performing the irradiation of the light and interposing the light in the lead of the electronic component, Of the rows, only one of the lead rows is illuminated and received at a predetermined angle from obliquely upward to obliquely downward or obliquely downward from obliquely upward to the irradiating section of the light beam type detecting means. And the part is arranged in an inclined state with respect to the suction nozzle, and one of the irradiation part or the light receiving part located above is disposed outside the horizontal movement range of the suction nozzle, while The component located below the component sucked at the lower end of the suction nozzle at the height position at the time of inspection of the lead row is disposed.

[0010]

According to the present invention, a light beam is irradiated on one lead row of an electronic component sucked by a suction nozzle at a predetermined angle from obliquely upward to obliquely downward or from obliquely downward to obliquely upward. by Rukoto provided with irradiation of light type detecting means to be received and the light receiving portion is inclined with respect to the suction nozzle, the one disposed either irradiation portion and the light receiving unit,
It is possible to perform offset by Tei Runode against the suction nozzle, even in very small parts as long as capable of adsorbing the electronic component by the suction nozzle, the inspection of the lead without causing interference between the suction nozzle and the light type detecting means .

The upper part of the light receiving part or the irradiating part is located outside the horizontal movement range of the suction nozzle, and the lower part is located at the height position at the time of inspection of the lead row. Since it is arranged below the part sucked at the nozzle lower end, for example, at the time of lead inspection,
Even if a malfunction occurs in the movement of the suction nozzle, there is no interference between the suction nozzle and the light receiving unit or the irradiation unit. Therefore, the suction nozzle or the light beam detection is performed by the collision between the suction nozzle and the light beam detection unit. There is no danger of damaging the means.

[0012]

Embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 to 4 show the structure of an electronic component mounter to which the lead abnormality inspection apparatus of the present invention is applied.
As shown in FIG. 1, a conveyor 2 for transporting a printed board is arranged on a base 1 of an electronic component mounting machine (hereinafter, abbreviated as a mounting machine), and a printed board 3 is transported on the conveyor 2. At a predetermined mounting work position.

At the side of the conveyor 2, a component supply unit 4
Is arranged. The component supply unit 4 includes a plurality of rows of tape feeders 4a. Each of the tape feeders 4a stores and holds small pieces of electronic components such as ICs, transistors, and capacitors at predetermined intervals, and a tape is a reel. And a ratchet feeding mechanism is provided at the tape feed-out end, so that the tape is fed out intermittently as chip components are picked up by the head unit 5 described later.

Above the base 1, a head unit 5 for mounting components is provided. The head unit 5 is movable in an X-axis direction (the direction of the conveyor 2) and a Y-axis direction (a direction orthogonal to the X axis on a horizontal plane).

That is, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 driven to rotate by a Y-axis servomotor 9 are disposed on the base 1. A head unit support member 11 is disposed on the support member 11, and a nut portion 12 provided on the support member 11 is screwed to the ball screw shaft 8. A guide member 13 extending in the X-axis direction and a ball screw shaft 14 driven by an X-axis servomotor 15 are disposed on the support member 11 so that the head unit 5 can move on the guide member 13. A nut portion (not shown) provided in the head unit 5 is screwed to the ball screw shaft 14. The ball screw shaft 8 is rotated by the operation of the Y-axis servo motor 9 to move the support member 11 in the Y-axis direction, and the ball screw shaft 14 is rotated by the operation of the X-axis servo motor 15, thereby causing the head unit to rotate. 5 moves in the X-axis direction with respect to the support member 11.

The head unit 5 is provided with a suction nozzle 10 for sucking electronic components. Suction nozzle 1
0 is a Z-axis servomotor 16 for lifting and lowering the suction nozzle attached to the head unit 5 and R for rotating the suction nozzle.
The shaft servomotor 17 allows the head unit 5 to move up and down and rotate.

On the other hand, on the base 1, the component supply unit 4
On the side of the laser unit 2 as a light beam type detecting means
0 is provided. The laser unit 20 has an irradiation device 18 and a light receiving device 19 provided opposite to each other.
While a and 21b are arranged side by side, a pair of light receiving sections 22a and 22b are arranged in the light receiving device 19 side by side. As shown in FIGS. 3 and 4, laser beams La and Lb (light beams) are emitted from the laser irradiators 21a and 21b, respectively, and these laser beams La and Lb are emitted.
Are crossed to irradiate the light receiving units 22a and 22b. That is, the intersection of the laser beams La and Lb is the inspection position R of the laser unit 20 with respect to the leads of the electronic component described later.

Further, in the laser unit 20, the laser beams La and Lb emitted from the laser irradiators 21a and 21b are emitted from obliquely downward to obliquely upward of the electronic components sucked by the suction nozzle 10. like,
In other words, the irradiation device 18 emits the laser beams La and Lb at a predetermined angle with respect to the axial direction of the suction nozzle 10.
And the light receiving device 19 is provided at an angle, and furthermore, as shown in FIG. 4 (the upper side in FIG. 4).

Next, the lead inspection of the electronic component in the mounting machine will be described. In this embodiment,
As shown in FIGS. 3 and 4, as the electronic component 23, a lead row 2 including a plurality of leads 25 is provided on four side surfaces of the package.
A flat package IC provided with 4a to 24d is applied, and a lead inspection is performed in each lead row 24a to 24d.
The case where the floating and sinking of the lead 25 is inspected will be described.

First, when the suction nozzle 10 picks up the electronic component 23 by sucking the center of the package of the electronic component 23 placed on the component supply unit 4, the suction nozzle 10 moves and the electronic component 23 is moved to the laser unit. 20
And the lead inspection of the electronic component 23 is performed. Specifically, as shown in FIG.
The suction nozzle 10 is moved up and down and rotated so that the tip of each lead 25 in the lead row 24a of the electronic component 23 can pass through the intersection of the laser beams La and Lb, that is, the inspection position R, and then from the solid line position shown in FIG. It is moved toward the broken line position (the direction of the white arrow in FIG. 4). Then, as the electronic component 23 is moved, the tips of the leads 25 of the electronic component 23 are moved to the respective laser beams La and L at the inspection position R.
The inspection of the lead is performed by blocking b. That is, when no abnormality occurs in the lead 25, the lead 25 passes through the inspection position R (arrow A in FIG. 5A),
As a result, the laser beams La and Lb are simultaneously cut off, and the light receiving signals of the light receiving sections 22a and 22b are simultaneously turned off (shown in FIG. 5B). On the other hand, when any one of the leads 25 is floating, the raised lead 25 moves above the inspection position R as shown by the arrow B in FIG. As a result, the timing at which the laser beam La and the laser beam Lb are cut off by the lead 25 is shifted as shown in FIG. Specifically, the light receiving signal of the light receiving unit 22a is turned off first, and thereafter, the light receiving signal of the light receiving unit 22b is turned off. Further, when the lead 25 is sinking, the sinking lead 25 moves below the inspection position R as shown by the arrow C in FIG.
As shown in FIG. 5C, the light receiving signals of the light receiving portions 22a and 22b are turned off first, and then the light receiving signals of the light receiving portion 22a are turned off. In other words, in the laser unit 20, the floating or sinking of the lead 25 is detected by detecting a shift in the timing at which the light receiving signals of the light receiving units 22a and 22b are turned off.

When the electronic component 23 is moved to the position shown by the broken line in FIG. 4, the lead inspection for the lead row 24a is completed, and then the suction nozzle 10 is rotated 90 ° in the direction of the arrow 26 in FIG. The lead inspection is performed on the lead row 24b while being moved in the direction of the dashed arrow in FIG.
Further, as described above, the lead row 24c, the lead row 2
The lead inspection for 4d is sequentially performed.

The leads 2 of the electronic component 23
5 at the inspection position R by each of the laser beams La and Lb formed between the irradiation device 18 and the light receiving device 19,
In the laser unit 20 for inspecting the abnormality of the lead 25, when the electronic component 23 is extremely small, for example, when the electronic component has a size substantially equal to the suction surface of the suction nozzle 10, the inspection of the lead 25 is performed. Suction nozzle 10
Is likely to interfere with the laser unit 20. However, in the laser unit 20, the light receiving device 19 is offset obliquely upward with respect to the irradiation device 18, and the laser light La, Lb is
3, the laser beam La and Lb are tilted with respect to the axial direction of the suction nozzle 10, so that the laser irradiation unit and the light receiving unit are vertically opposed. Unlike a conventional inspection apparatus in which the suction nozzle 10 is arranged in a vacuum, if the electronic component can be sucked by the suction nozzle 10, even if it is an extremely small component, the lead inspection can be performed without causing interference between the suction nozzle 10 and the laser unit 20. Can be done.

Further, in the laser unit 20, as described above, the light receiving device 19 is offset obliquely upward with respect to the irradiation device 18, and the light receiving device 19 is moved in the Y-axis direction of the suction nozzle 10 as shown in FIG. Since it is arranged outside the limit W of the movable range, for example, even if a malfunction occurs in the movement of the suction nozzle 10 in the Y direction during the lead inspection, as shown by a two-dot chain line in FIG. Suction nozzle 10
And the light receiving device 19 do not interfere with each other.
0, or there is no possibility that the laser unit 20 may be damaged.

In the above embodiment, the present invention is applied to the case where the laser beams La, L emitted from the laser irradiators 21a, 21b are used.
b, the inspection position R is formed by intersecting the inspection position R, and the laser unit 20 detects floating or sinking of the lead 25 based on the projection detection of the lead 25 of the electronic component 23 passing through the inspection position R. However, the present invention is also applicable to, for example, an apparatus that irradiates a plurality of parallel laser beams to inspect the interval between the leads 25 of the electronic component 25, that is, the pitch between leads.
In addition to those using laser light, the present invention is also applicable to a light beam type inspection apparatus including a light emitting unit such as an LED and a light receiving unit such as a line sensor.

In the above embodiment, the laser beams La, L
b is radiated obliquely downward from the electronic component 25, but may be radiated obliquely downward from the electronic component 25.

Further, in the above-described embodiment, an example in which the present invention is applied to an electronic component mounting machine has been described. However, the present invention can be configured as a single inspection apparatus.

[0028]

As described above, according to the present invention, among the lead rows of the electronic components sucked by the suction nozzle, only one of the lead rows is obliquely obliquely downward from above or obliquely downward from obliquely below. Light rays shine at a predetermined angle facing upwards,
The irradiating part and the light receiving part are arranged to receive light, and the upper part of the irradiating part or the light receiving part is arranged outside the horizontal movement range of the suction nozzle, while the lower part is arranged Since the light beam type inspection means is arranged below the component sucked at the lower end of the suction nozzle at the height position at the time of lead row inspection, interference between the suction nozzle and the inspection device may occur in any case. And the lead abnormality of the electronic component can be detected without being influenced by the size of the electronic component.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component mounter to which a lead abnormality inspection device of the present invention is applied.

FIG. 2 is a front view of FIG.

FIG. 3 is a perspective view showing a laser unit.

FIG. 4 is a top view showing the laser unit.

FIG. 5A is a schematic front view showing a moving path of a lead of an electronic component at an inspection position of a laser unit, and FIG.
Is a schematic diagram showing a light receiving signal at the light receiving section when the lead moves along arrow A in FIG. (A), and (c) shows a light receiving signal at the light receiving section when the lead moves along arrow C in FIG. (D) is a schematic diagram showing a light receiving signal in the light receiving unit when the lead moves in the direction of arrow B in FIG. (A).

FIG. 6A is a front view showing a conventional light beam type inspection apparatus, and FIG. 6B is a front view showing a case where a small electronic component is inspected by the conventional light beam type inspection apparatus.

[Explanation of symbols]

 Reference Signs List 10 suction nozzle 18 irradiation device 19 light receiving device 20 laser unit 21a, 21b laser irradiation unit 22a, 22b light receiving unit 23 electronic component 25 lead La, Lb laser light R inspection position W limit of movable range of suction nozzle

Claims (1)

(57) [Claims] 1. A light beam type comprising an irradiating unit and a light receiving unit, wherein a suction nozzle for sucking an electronic component is mounted above the base so as to be movable and rotatable over a certain range in the horizontal and vertical directions. The detection means is arranged on the base, and the suction nozzle which sucks the electronic component having the lead row is moved, so that the electronic component is interposed between the irradiation part and the light receiving part of the light beam type detection means, and the light irradiation is performed. In the apparatus for detecting an abnormality of the lead of the electronic component based on the projection detection of the light beam passing through the lead array of the electronic component, the light beam may be one of the lead arrays of the electronic component. The irradiation unit and the light receiving unit of the light beam type detecting means are opposed to the suction nozzle so that the light is emitted and received only at a predetermined angle from obliquely upward to obliquely downward or obliquely downward from obliquely upward. One that is while being arranged in a state of being inclined, those located above of the irradiation unit or the light receiving portion is Ru is arranged outside the movement range of the horizontal direction of the suction nozzle
The lower one is at the height of the lead row inspection.
Arranged below the part sucked at the lower end of a certain suction nozzle
A lead abnormality inspection apparatus characterized by being performed.