JP3782294B2 - Resist coating processing apparatus and resist coating processing method - Google Patents

Description

【００８８】
例えば、従来のレジスト液使用量が３０ｍｌの場合と、スクロール塗布のレジスト液使用量が１５．０ｍｌの場合とを比較すると、レジスト液の広がり部分の直径は２３０〜２４０ｍｍで、ほぼ同等になっており、スクロール塗布の場合には、レジスト液の使用量が従来のほぼ半分で同等のレジスト広がり面積を確保することが可能であることが確認された。
【００８９】
また、素ガラスの基板に塗布ムラなくレジスト液を塗布できるレジスト液の使用量は、従来では２５ｍｌであったのに対し、スクロール塗布では１７．５ｍｌであり、レジスト液の使用量をほぼ２／３に削減できることが確認された。
【００９０】
（実施例２）
パターン付きの基板の中心にレジスト液を吐出して基板の回転により拡散させる従来の場合と、パターン付きの基板にレジスト液をスクロール状に塗布する場合とについて実験を行った。実験結果を表２に示す。
【００９１】
【表２】

【００９２】
パターン付きの基板に塗布ムラなくレジスト液を塗布できるレジスト液の使用量は、従来では３０ｍｌであったのに対し、スクロール塗布の場合には、１７．５ｍｌであり、レジスト液の使用量をほぼ半分に削減できることが確認された。
【００９３】
（実施例３）
レジスト液吐出ノズルとして、上述の図８の（ａ）に示すスリットタイプのものと図８の（ｃ）に示すクマデタイプを用い比較実験を行った。スリットタイプでは吐出幅を１０ｍｍとし、スリット幅を０．８ｍｍとした。またクマデタイプでは吐出管を１１本、吐出幅を２０ｍｍとし、吐出管の穴径を０．３ｍｍとした。これらを用いて、素ガラスの基板にレジスト液をスクロール状に塗布した。
【００９４】
レジスト液の使用量を２０ｍｌとした時、図９に示すように、スクロール状に吐出されたレジスト液の間に、隙間ができるか否かの判別を行った。すなわち、図９の（ａ）に示すように基板上のレジストが円形になった場合を良好（○）とし、（ｂ）に示すように渦巻き状になった場合を不良（×）とした。その結果を表３に示す。
【００９５】
【表３】

【００９６】
吐出幅が１０ｍｍであるスリットタイプのノズルの場合には、レジスト塗布直後のレジスト塗布部分の直径が２６０ｍｍ以下であるときには、図９の（ａ）に示すように、スクロール状に吐出されたレジスト液の間に隙間はできず、塗布状態は良好であるが、この直径が２８０ｍｍ以上であるときには、図９の（ｂ）に示すように、スクロール状に吐出されたレジスト液の間に、隙間ができ、塗布状態は不良となっている。
【００９７】
一方、吐出幅が２０ｍｍであるクマデタイプのノズルの場合には、レジスト塗布直後の直径が３３０ｍｍ以下であるときには、図９の（ａ）に示すように、スクロール状に吐出されたレジスト液の間に隙間はできず、塗布状態は良好であるが、この直径が３５０ｍｍ以上であるときには、図９の（ｂ）に示すように、スクロール状に吐出されたレジスト液の間に隙間ができ、塗布状態は不良となっている。
【００９８】
すなわち、レジスト液をスクロール状に塗布する塗布方式では、ノズルの吐出幅が広い場合のほうが、隙間なく塗布することができる塗布可能面積を広くできることが確認された。
【００９９】
次に、同様にレジスト使用量を変えて、従来の基板中心にレジスト液を吐出して塗布する場合（センター吐出）、上記吐出幅１０ｍｍのスリットタイプのノズルを用いてスクロール塗布を行った場合、および上記吐出幅２０ｍｍのクマデタイプのノズルを用いてスクロール塗布を行った場合について、回転前レジスト直径を測定した。その結果を表４に示す。
【０１００】
【表４】

【０１０１】
表４に示すように従来のセンター吐出の場合には、レジスト液の使用量が２５ｍｌ以上でないと、塗布ムラが生起されたのに対し、スクロール塗布の場合には、スリットタイプのノズルを用いた場合およびクマデタイプのノズルを用いた場合のいずれも１８．５ｍｌまで塗布ムラが生じなかった。また回転前レジスト直径については、センター吐出の場合にはレジスト吐出量が３０ｍｌでも回転前レジスト直径が２４０ｍｍであったのに対し、スクロール塗布の場合には、１８．５ｍｌでもスリットタイプで２５０ｍｍ、クマデタイプで３００ｍｍとなった。このことからスクロール塗布によりレジスト液の使用量を従来に比べて削減できることが確認された。
【０１０２】
また、スクロール塗布方式の中で、吐出幅が１０ｍｍであるスリットタイプのノズルと吐出幅が２０ｍｍであるクマデタイプのノズルを比較した場合、いずれのレジスト使用量においても吐出幅が広いクマデタイプの方が回転前レジスト直径が大きいことが確認された。
【０１０３】
（実施例４）
次に、スクロール塗布した場合の膜厚均一性について把握した。表５にレジスト吐出時間およびレジスト使用量を変化させてスクロール塗布した場合の吐出後のレジスト直径および膜厚均一性を示す。表５に示すように、吐出時間が長いほど中心部膜厚が厚くなり、周辺部が薄くなる傾向がある。図１０は吐出時間１８．５ｓｅｃでレジスト使用量が２８ｍｌとしてスクロール塗布を行った場合と、センター吐出を行った場合とで対角線上の膜厚プロファイルを示すグラフである。このグラフから明らかなように、吐出時間が長く、レジスト使用量が多い場合であっても、センター吐出の場合よりも多少膜厚均一性が悪くなるのみであることが確認された。このことから、スクロール塗布では吐出時間およびレジスト使用量を調整することにより、センター吐出の場合と同等な膜厚均一性が得られることが把握される。
【０１０４】
【表５】

【０１０５】
【発明の効果】
以上説明したように、本発明によれば、レジスト液吐出ノズルから基板にレジスト液を吐出しながら、レジスト液吐出ノズルを基板上で移動させると同時に基板を回転させ、これにより、レジスト液吐出ノズルと基板とに相対的なスクロール動作をさせながら、レジスト液を基板上にスクロール状に塗布するので、レジスト液の吐出量がそれ程多くなくても、レジスト液を基板上の広い面積に亘って広げることができ、レジスト液が拡散しにくい場合であっても、少ないレジスト液吐出量でレジスト液を基板上に均一に塗布することができる。
【０１０６】
この場合に、レジスト液吐出ノズルを扁平状にレジスト液を吐出するように構成することにより、吐出幅を広くすることができ、スクロール状に吐出されたレジスト液の間に隙間ができることを回避することができる。そのため、基板上に塗布されたレジスト液が全体として円形状になり、塗布ムラを防止することができる。
【図面の簡単な説明】
【図１】 本発明が適用されるＬＣＤのカラーフィルターの塗布・現像処理システムを示す平面図。
【図２】 レジスト塗布処理ユニット（ＣＴ）、乾燥処理ユニット、およびエッジリムーバー（ＥＲ）を示す概略平面図。
【図３】 レジスト塗布処理ユニット（ＣＴ）、乾燥処理ユニット、およびエッジリムーバー（ＥＲ）を示す概略側面図。
【図４】 レジスト液吐出ノズルアームの平面図および側面図。
【図５】 本発明の一実施形態に係るレジスト塗布処理ユニット（ＣＴ）を模式的に示す平面図。
【図６】 本発明の一実施形態に係るレジスト塗布処理ユニット（ＣＴ）の制御系を示す概略図。
【図７】 本発明の一実施形態に係るレジスト塗布処理ユニット（ＣＴ）に用いるレジスト液吐出ノズルの側面図および正面図。
【図８】 レジスト塗布処理ユニット（ＣＴ）に用いるレジスト液吐出ノズルの例を模式的に示す図。
【図９】 スクロール塗布直後のレジストの塗布状態を示す模式図。
【図１０】 センター吐出の場合とスクロール塗布の場合について膜厚プロファイルを示すグラフ。
【図１１】 本発明の他の実施形態におけるレジスト液吐出ノズルの一例を示す断面図。
【図１２】 本発明の他の実施形態におけるレジスト液吐出ノズルの他の例を示す断面図。
【図１３】 図１２に示したレジスト液吐出ノズルにおける針状部材の一形態を示す概略図。
【図１４】 図１２に示したレジスト液吐出ノズルにおける針状部材の他の形態を示す概略図。
【図１５】 図１２に示したレジスト液吐出ノズルにおける針状部材のまた他の形態を示す部分的な概略図。
【図１６】 図１５に示したレジスト液吐出ノズルをノズル洗浄機構で洗浄している状態を示す断面図。
【図１７】 本発明のまた他の実施形態におけるレジスト液吐出ノズルを示す概略断面図。
【図１８】 本発明のさらに他の実施形態におけるレジスト液吐出ノズルを用いてレジスト液を塗布している状態を示す上面図。
【図１９】 本発明のさらにまた他の実施形態におけるレジスト液吐出ノズルの例を示す概略図。
【図２０】 本発明のさらに別の実施形態におけるレジスト液吐出ノズルの例を示す概略側面図。
【符号の説明】
２２；レジスト塗布処理ユニット（ＣＴ）
５１；スピンチャック
５５；レジスト液吐出ノズルアーム
５６ａ〜５６ｄ；色彩レジスト液吐出ノズル
５７ａ〜５７ｄ；色彩レジストの供給管
８１；吐出口
９０；コントローラ
９１；ノズル移動機構
９２；基板回転機構
Ｇ；カラーフィルター用基板[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a resist coating processing apparatus and a resist coating processing method for coating a resist solution on a substrate such as a color filter of a color liquid crystal display (LCD).
[0002]
[Prior art]
  In the manufacture of color filters for color liquid crystal displays (LCDs), four color resists (red, green, blue, and black) are applied to a rectangular glass substrate, exposed, and developed. A color filter is formed by a so-called photolithography technique.
[0003]
  In such a color filter photolithography process, a color resist coating process and an exposure / development process are performed for each color. That is, for example, a red color resist is applied, exposed and developed, then a green color resist is applied, exposed and developed, and then the same processing is performed for blue and black.
[0004]
  Among the processing steps described above, in each color resist coating step, a rectangular substrate is carried into a resist coating unit and mounted on a spin chuck, and each color is placed from the resist solution discharge nozzle to approximately the center of the substrate while the substrate is stationary. The color resist solution is discharged, and then the substrate is rotated by a spin chuck, and each color resist solution is diffused by centrifugal force to form each color resist on the substrate.
[0005]
[Problems to be solved by the invention]
  By the way, a pattern is formed on the surface of the color filter, and the resist solution does not diffuse in a perfect circle due to this influence. Due to this influence, there is a possibility that the resist solution may remain uncoated during the rotational film formation, and the amount of resist used increases to eliminate the unpainted state. In addition, unlike normal resist solutions used for semiconductor wafers and the like, the color resist solution contains a pigment or resin for color, so when rotating the substrate to diffuse the color resist solution, The color resist solution is difficult to diffuse, and even if the same amount of resist solution is supplied, the resist diffusion area decreases, and the amount of resist solution used for coating on the entire surface of the substrate increases. On the contrary, if the amount of the resist solution used is not increased, the resist diffusion area directly decreases, so that film formation after rotation becomes impossible.
[0006]
  Such a phenomenon occurs not only in the color filter but also in other substrates due to the fact that the frictional resistance of the substrate is large due to the pattern or the like or the viscosity of the resist solution is high.
[0007]
  Therefore, even in such a case, it is desired to reduce the resist as much as possible without increasing the amount of resist solution discharged from the resist solution discharge nozzle and to apply the resist solution uniformly on the substrate. ing.
[0008]
  The present invention has been made in view of such circumstances, and a resist coating processing apparatus capable of uniformly coating a resist solution on a substrate with a small resist solution discharge amount even when the resist solution is difficult to diffuse, and An object of the present invention is to provide a resist coating method.
[0009]
[Means for Solving the Problems]
  In order to solve the above problems, the present invention is a resist coating apparatus for applying a resist solution to a substrate,
  Resist solution discharge that has a nozzle body and a large number of needle-like members provided in a row in the nozzle body and formed with a resist solution flow hole therein, and discharges the resist solution in a flat shape on the substrate A nozzle,
  A nozzle moving mechanism for moving the resist solution discharge nozzle;
  A nozzle rotation mechanism for rotating the nozzle body;
  A substrate rotation mechanism that rotates the substrate;
Comprising
  While the resist solution is discharged from the resist solution discharge nozzle onto the substrate, the resist solution discharge nozzle is moved on the substrate by the nozzle moving mechanism, and at the same time, the substrate is rotated by the substrate rotation mechanism, and the resist solution discharge nozzle and the substrate are rotated. When the resist solution discharge nozzle is moved outward from the center of the substrate by the nozzle moving mechanism, the direction of the row formed by the needle-like members is determined by the substrate rotating mechanism. The resist coating apparatus is characterized in that the resist solution is applied onto the substrate in the form of a scroll while rotating the nozzle body by the nozzle rotating mechanism so as to approach the tangential direction of the substrate rotating direction.
[0010]
  Moreover, the present invention is a resist coating processing apparatus for applying a resist solution to a substrate,
  A resist solution discharge nozzle for discharging the resist solution in a flat shape on the substrate;
  A nozzle moving mechanism for moving the resist solution discharge nozzle;
  A nozzle rotation mechanism for rotating the nozzle body;
  A substrate rotation mechanism that rotates the substrate;
Comprising
  While the resist solution is discharged from the resist solution discharge nozzle onto the substrate, the resist solution discharge nozzle is moved on the substrate by the nozzle moving mechanism, and at the same time, the substrate is rotated by the substrate rotation mechanism, and the resist solution discharge nozzle and the substrate are rotated. And a resist solution discharged in a flat shape from the resist solution discharge nozzle when the nozzle movement mechanism moves the resist solution discharge nozzle from the center of the substrate to the outside. The resist liquid is applied onto the substrate in a scroll shape while rotating the nozzle body by the nozzle rotation mechanism so that the discharge width direction of the nozzle approaches the tangential direction of the direction in which the substrate rotation mechanism rotates the substrate. A resist coating apparatus is provided.
[0011]
  Further, the present invention is a resist coating processing apparatus for sequentially coating a plurality of color resist solutions on a substrate,
  A nozzle body and a plurality of needle-like members provided in a row in the nozzle body and having a resist solution flow hole formed therein;For each color resist solutionProvidedOn the boardFlatA plurality of resist solution discharge nozzles for discharging a color resist solution;
  A nozzle moving mechanism for moving the plurality of resist solution discharge nozzles;
A nozzle rotation mechanism for rotating the nozzle body;
  A substrate rotation mechanism for rotating the substrate;
  A controller that adjusts and controls the movement speed of the resist liquid discharge nozzle and the rotation speed of the substrate in multiple stages according to the type of color resist liquid;
Comprising
  While discharging one color resist solution from the resist solution discharge nozzle to the substrate, the resist solution discharge nozzle is moved on the substrate by the nozzle moving mechanism, and at the same time, the substrate is rotated by the substrate rotation mechanism to discharge the resist solution. A relative scroll operation is performed between the nozzle and the substrate so that the color resist solution is applied onto the substrate in a scroll shape, and the movement speed of the resist solution discharge nozzle and the rotation speed of the substrate are controlled by the controller. Control for each color resist solutionAnd
  When the nozzle moving mechanism moves the resist solution discharge nozzle from the center of the substrate to the outside, the direction of the row formed by the needle-shaped members is tangent to the direction in which the substrate rotating mechanism rotates the substrate. Rotate the nozzle body to approach the directionThere is provided a resist coating apparatus characterized by the above.
[0012]
  Further, the present invention is a resist coating method for applying a resist solution to a substrate,
  Resist solution discharge that has a nozzle body and a large number of needle-like members provided in a row in the nozzle body and formed with a resist solution flow hole therein, and discharges the resist solution in a flat shape on the substrate The substrate is rotated simultaneously with moving the resist solution discharge nozzle on the substrate while discharging the resist solution from the nozzle to the substrate, and a relative scroll operation is performed between the resist solution discharge nozzle and the substrate, and When the resist solution discharge nozzle is moved from the center of the substrate to the outside, the nozzle body is rotated by the nozzle rotation mechanism so that the direction of the row formed by the needle-like members approaches the tangential direction of the direction in which the substrate rotation mechanism rotates the substrate. A resist coating method is provided in which the resist solution is applied in a scroll form on a substrate while rotating the substrate.
[0013]
  Further, the present invention is a resist coating method for applying a resist solution to a substrate,
  The resist solution discharge nozzle that discharges the resist solution in a flat shape onto the substrate moves the resist solution discharge nozzle on the substrate while discharging the resist solution onto the substrate, and at the same time rotates the substrate. When the resist solution discharge nozzle is moved from the center of the substrate to the outside, the direction of the discharge width of the resist solution discharged in a flat shape from the resist solution discharge nozzle is changed. And applying the resist solution in a scroll form on the substrate while rotating the nozzle body by the nozzle rotation mechanism so that the substrate rotation mechanism approaches a tangential direction of the substrate rotation direction. I will provide a.
[0014]
  According to the present invention, while the resist solution is discharged from the resist solution discharge nozzle onto the substrate, the resist solution discharge nozzle is moved on the substrate and simultaneously the substrate is rotated, whereby the resist solution discharge nozzle and the substrate are relatively moved. Since the resist solution is applied in a scroll form on the substrate while performing a smooth scrolling operation, the resist solution can be spread over a wide area on the substrate even if the resist solution discharge amount is not so large. Even when it is difficult to diffuse, the resist solution can be uniformly applied onto the substrate with a small amount of the resist solution discharged.
[0015]
  In the resist coating apparatus, the resist solution discharge nozzle is preferably configured to discharge the resist solution in a flat shape. When the resist solution is applied onto the substrate in the form of a scroll, if the nozzle discharge port is circular, for example, and the discharge width is narrow, a gap is created between the resist solution discharged in the scroll shape, Although there is a possibility of causing uneven coating, the resist discharge nozzle can be widened by adopting a structure that can discharge the resist solution in a flat shape, and the resist discharged in a scroll shape It is possible to avoid a gap between the liquids. Therefore, the resist solution applied on the substrate becomes circular as a whole, and coating unevenness can be prevented. Specifically, the tip of the resist solution discharge nozzle is formed into a slit shape or flattened in this manner by having a large number of needle-like members having resist solution flow holes formed therein. Resist can be discharged.
[0016]
  Furthermore, it is preferable that the nozzle moving mechanism is configured to move the resist solution discharge nozzle outward from the approximate center of the substrate. By doing in this way, since the resist liquid discharge direction and the diffusion direction are the same, the possibility of uneven coating can be eliminated. Conversely, when the resist solution discharge nozzle is configured to move from the outside toward the approximate center of the substrate, the substrate is rotated and the resist solution is diffused by the centrifugal force. The direction and the direction of diffusion are opposite, and there is a risk of uneven coating.
[0017]
  Further, the nozzle moving mechanism preferably has a variable nozzle moving speed. Thus, the amount of resist solution applied can be adjusted by changing the moving speed of the nozzle in accordance with the application state of the resist solution. Specifically, it is preferable to decrease the moving speed as the resist solution discharge nozzle moves to the outside of the substrate. Accordingly, when the resist solution is applied in a scroll form on the substrate while performing a scroll operation relative to the resist discharge and the substrate, the application amount of the resist solution on the inner peripheral side and the outer peripheral side can be equalized. .
[0018]
  Furthermore, it is preferable that the rotation speed of the substrate rotation mechanism is variable. Thus, the resist solution application amount can be adjusted by changing the substrate rotation speed in accordance with the application state of the resist solution.
[0019]
  Furthermore, it is preferable that the rotation speed of the substrate by the substrate rotation mechanism is maintained so that the outer periphery of the resist solution on the substrate does not spread radially. Thereby, it is possible to prevent the resist solution from being wasted due to the outer periphery of the resist solution being scattered from the substrate outer periphery to the outside.
[0020]
  The control mechanism controls the nozzle moving mechanism and the substrate rotating mechanism, and the control mechanism moves the resist liquid discharge nozzle by the nozzle moving mechanism when the coating liquid is being discharged from the resist liquid discharge nozzle to the substrate. It is preferable that the substrate is rotated by the substrate rotating mechanism to perform a relative scroll operation between the resist solution discharge nozzle and the substrate. In this case, it is preferable that the control mechanism controls the moving speed of the nozzle and the rotating speed of the substrate during the coating process.
[0021]
  Furthermore, a plurality of resist solution discharge nozzles can be configured to be integrally held at the tip of one nozzle arm. As a result, for example, when applying red, green, blue, and black color resist solutions, it is possible to cope only by moving the nozzle arm, so that resist application can be performed very efficiently.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
  FIG. 1 is a plan view showing an LCD color filter coating / development processing system to which the present invention is applied.
[0023]
  This coating / development processing system includes a cassette station 1 on which a cassette C that accommodates a plurality of color filter substrates G is placed, and a plurality of processing units for performing a series of processes including resist coating and development on the substrate G. The processing unit 2 and an interface unit 3 for transferring the substrate G between the exposure apparatus (not shown) are provided. The cassette station 1 and the interface unit 3 are arranged at both ends of the processing unit 2, respectively. Has been.
[0024]
  The cassette station 1 includes a transport mechanism 10 for transporting the substrate G between the cassette C and the processing unit 2. Then, the cassette C is loaded and unloaded at the cassette station 1. Further, the transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the cassette arrangement direction, and the transport arm 11 can transport the substrate G between the cassette C and the processing unit 2. Done.
[0025]
  The processing section 2 is divided into a front stage section 2a, a middle stage section 2b, and a rear stage section 2c. Each of the processing sections 2 has transport paths 12, 13, and 14 at the center, and each processing unit is disposed on both sides of these transport paths. Yes. And between these, the relay parts 15 and 16 are provided.
[0026]
  The front section 2a includes a main transport device 17 that can move along the transport path 12, and two cleaning units (SCRs) 21a and 21b are arranged on one side of the transport path 12, and the transport path On the other side of 12, heat treatment units 25 and 26 each having two heat treatment devices (HP) stacked in two upper and lower stages, and a cooling process in which cooling processing devices (COL) are stacked in two upper and lower stages. A unit 27 is arranged.
[0027]
  The middle section 2b includes a main transport device 18 that can move along the transport path 13. On one side of the transport path 13, a resist coating processing unit (CT) 22 for applying a color resist, And an edge remover (ER) 23 for removing the color resist on the peripheral edge of the substrate G, and a drying processing unit 40 is provided between the resist coating unit (CT) 22 and the edge remover (ER) 23. It has been. On the other side of the conveyance path 13, a heating processing unit 28 in which two heat processing devices (HP) are vertically stacked, and a heating in which a heating processing device (HP) and a cooling processing device (COL) are vertically stacked. A processing / cooling processing unit 29 and a cooling processing unit 30 in which two cooling processing devices (COL) are vertically stacked are arranged.
[0028]
  Further, the rear stage portion 2 c includes a main transport device 19 that can move along the transport path 14, and three development processing units 24 a, 24 b, 24 c are arranged on one side of the transport path 14, On the other side of the conveyance path 14, a heat treatment unit 31 in which two heat treatment apparatuses (HP) are vertically stacked, and a heat treatment apparatus (HP) and a cooling treatment apparatus (COL) are vertically stacked. Two heating / cooling processing units 32, 33 are arranged.
[0029]
  In the processing unit 2, only a spinner system unit such as the cleaning processing unit 21a, the resist processing unit 22, and the development processing unit 24a is disposed on one side of the conveyance path, and the heating processing unit is disposed on the other side. Only a thermal processing unit such as a cooling processing unit is arranged.
[0030]
  The main transfer devices 17, 18, and 19 each include a two-direction X-axis drive mechanism, a Y-axis drive mechanism, and a vertical Z-axis drive mechanism in a horizontal plane, and further rotate around the Z-axis. A drive mechanism is provided, and arms 17a, 18a, 19a for supporting the substrate G are provided.
[0031]
  Further, a chemical solution supply unit 34 is disposed at a portion of the relay units 15 and 16 on the spinner system unit arrangement side, and a space 35 for maintenance is provided.
[0032]
  The main transfer device 17 transfers the substrate G to and from the arm 11 of the transfer mechanism 10, loads / unloads the substrate G to / from each processing unit of the front stage 2 a, and further transfers the substrate to / from the relay unit 15. It has a function to deliver G. The main transfer device 18 transfers the substrate G to and from the relay unit 15, and loads and unloads the substrate G to / from each processing unit of the middle stage 2 b, and further transfers the substrate G to and from the relay unit 16. It has a function to perform. Further, the main transfer device 19 transfers the substrate G to and from the relay unit 16, loads and unloads the substrate G to / from each processing unit of the rear-stage unit 2 c, and transfers the substrate G to and from the interface unit 3. It has a function to perform. In addition, the relay parts 15 and 16 also function as a cooling plate.
[0033]
  The interface unit 3 includes an extension 36 that temporarily holds a substrate when the substrate is transferred to and from the processing unit 2, two buffer stages 37 that are provided on both sides of the substrate and that are provided with buffer cassettes, and these And a transfer mechanism 38 for carrying in and out the substrate G between the exposure apparatus and the exposure apparatus (not shown). The transport mechanism 38 includes a transport arm 39 that can move on a transport path 38 a provided along the direction in which the extensions 36 and the buffer stage 37 are arranged. The transport arm 39 allows the substrate G to move between the processing unit 2 and the exposure apparatus. Is carried.
  By consolidating and integrating the processing units in this way, it is possible to save space and improve processing efficiency.
[0034]
  In the coating / development processing system configured as described above, the substrate G in the cassette C is transported to the processing unit 2, and the processing unit 2 first scrubbers at the cleaning units (SCR) 21 a and 21 b of the front-stage unit 2 a. After being washed and heated and dried by one of the heat treatment devices (HP) of the heat treatment units 25 and 26, it is cooled by one of the cooling treatment devices (COL) of the cooling treatment unit 27.
[0035]
  Thereafter, the substrate G is transported to the middle stage 2b, and a color resist is applied by the resist coating processing unit (CT) 22 and dried by the drying processing unit 40, and an excess of the peripheral edge of the substrate G by the edge remover (ER) 23. Color resist is removed. Thereafter, the substrate G is pre-baked by one of the heat treatment apparatuses (HP) in the middle stage portion 2b and cooled by the lower cooling process apparatus (COL) of the unit 29 or 30.
[0036]
  Thereafter, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. Then, the substrate G is again carried in through the interface unit 3 and developed in any of the development processing units (DEV) 24a, 24b, and 24c. The developed substrate G is subjected to a post-baking process in any one of the heat treatment apparatuses (HP) in the rear stage part 2c, and then cooled in any cooling processing apparatus (COL) in the rear stage part 2c. .
[0037]
  Such a series of processes for each color is executed according to a preset recipe. For example, the substrate G that has been subjected to red coating / exposure / development processing is sequentially subjected to green, blue, and black coating / exposure / development processing. In the resist coating processing unit (CT) 22 as will be described later. Each color is processed in substantially the same manner except that nozzles of different colors are used. The substrate of the completed color filter is accommodated in a predetermined cassette on the cassette station 1 by the main transfer devices 19, 18, 17 and the transfer mechanism 10.
[0038]
  Next, a resist coating processing unit (CT), a reduced pressure drying processing unit (VD), and an edge remover (ER) provided in such a color filter resist coating / development processing system will be described. 2 and 3 are a schematic plan view and a schematic side view showing a resist coating processing unit (CT), a vacuum drying processing unit (VD), and an edge remover (ER).
[0039]
  As shown in FIGS. 2 and 3, the resist coating unit (CT) 22, the reduced pressure drying unit (VD) 40, and the edge remover (ER) 23 are integrally arranged on the same stage. . The substrate G on which a predetermined color resist is applied by the resist coating processing unit (CT) 22 is transported to the vacuum drying processing unit (VD) 40 along the guide rails 43 by the pair of transport arms 41, and this vacuum drying processing unit. The substrate G dried by (VD) 40 is transported to the edge remover (ER) 23 along the guide rails 43 by a pair of transport arms 42.
[0040]
  The resist coating unit (CT) 22 is a spin chuck 51 that can horizontally rotate and holds the substrate G, surrounds the upper end of the spin chuck 51, and surrounds the substrate G held by the spin chuck 51. A rotating cup 52 having a bottomed opening with a cylindrical opening, a lid (not shown) that covers the upper end opening of the rotating cup 52, and a coater cup 53 that is fixedly disposed so as to surround the outer periphery of the rotating cup 52. Yes. When the color resist to be described later is dropped, the substrate G is rotated by the spin chuck 51 with the lid open, and when the color resist is diffused, the substrate G is rotated by the spin chuck 51 and at the same time the lid ( The rotating cup 52 in a closed state (not shown) is rotated. An outer cover 54 is provided on the outer periphery of the coater cup 53.
[0041]
  The resist coating unit (CT) 22 has a resist solution discharge nozzle arm 55 for discharging color resists of four colors (red, green, blue, and black) onto a rectangular substrate G made of glass. ing. When the color resist is dropped, the tip of the resist solution discharge nozzle arm 55 is moved from the retracted position shown in FIG.
[0042]
  As shown in detail in FIG. 4, at the tip of the resist discharge nozzle arm 55, a red color resist nozzle 56a, a green color resist nozzle 56b, a blue color resist nozzle 56c, and a black color resist nozzle 56d and a thinner nozzle 56e are provided. Resist supply pipes 57a to 57d are connected to the resist solution discharge nozzles 56a to 56d for the respective color resists, and these resist supply pipes 57a to 57d are accommodated in two large diameter pipes 58a and 58b. Each resist supply pipe is connected to two tanks (not shown) as resist supply sources. The thinner nozzle 56e is connected to a thinner supply source (not shown) via a thinner supply pipe 57e.
[0043]
  Since it is configured in this manner, it is easy to apply a color resist on the substrate G by one of the resist liquid discharge nozzles 56a to 56d for the color resist, and then perform the coating process using nozzles of other colors. It is. For example, even if the color of the resist applied to the next substrate is different, it can be easily coped with by changing the nozzle.
[0044]
  The reduced-pressure drying processing unit 40 includes a low chamber 61 and an upper chamber 62 that is provided so as to cover the low chamber 61 and that keeps the internal processing chamber airtight. The low chamber 61 is provided with a stage 63 on which the substrate G is placed. Four exhaust ports 64 are provided at each corner of the low chamber 61, and exhaust gas communicated with the exhaust port 64 is provided. The pipe 65 (FIG. 3) is connected to an exhaust pump (not shown) such as a turbo molecular exhaust pump, whereby the gas in the processing chamber between the low chamber 61 and the upper chamber 62 is exhausted, and a predetermined degree of vacuum, For example, the pressure is reduced to 0.1 Torr. It should be noted that the stage 63 is not provided with a suction mechanism, and the substrate G is simply placed thereon. The stage 63 is provided with a pin (not shown) for transferring the substrate G so as to protrude and retract. In order not to adversely affect the processing of the substrate, these pins are arranged at positions where they abut against portions other than the processing region of the substrate.
[0045]
  An edge remover (ER) 23 that performs end surface processing of the substrate G is provided with a stage 71 for placing the substrate G, and two corner portions on the stage 71 are provided for positioning the substrate G. Two alignment mechanisms 72 are provided. As described above, the stage 63 of the vacuum drying processing unit (VD) 40 is not provided with an adsorption mechanism and merely has the substrate G placed thereon, so that the end face resist by the edge remover (ER) 23 is used. Prior to the removal process, the alignment mechanism 72 aligns the substrate G.
[0046]
  At positions corresponding to the four sides of the substrate G, four remover heads 73 for removing excess color resist from the edges of the four sides of the substrate G are provided. Each remover head 73 has a substantially U-shaped cross section so as to discharge thinner from the inside, and is moved along the four sides of the substrate G by a moving mechanism (not shown). Therefore, each remover head 73 can remove excess color resist adhering to the edges of the four sides of the substrate G while moving along each side of the substrate G to discharge thinner.
[0047]
  In the present embodiment, the resist coating unit (CT) 22 discharges each color resist solution onto the substrate G from any one of the resist solution discharge nozzles 56a to 56d as shown in FIG. Then, the nozzle arm 55 is moved in the direction of the arrow to move the resist solution discharge nozzles 56a to 56d on the substrate, and at the same time, the substrate G is rotated in the direction of the arrow by the spin chuck 51. As a result, a relative scroll operation occurs between the resist solution discharge nozzles 56a to 56d and the substrate G, and each color resist solution is applied onto the substrate G in a scroll shape. At this time, as shown in FIG. 6, the resist solution discharge nozzles 56 a to 56 d are moved together with the nozzle arm 55 by the nozzle moving mechanism 91, and the substrate G on the spin chuck 51 is rotated by the substrate rotating mechanism 92. The nozzle moving mechanism 91 and the substrate rotating mechanism 92 are controlled by the controller 90 to realize the above-described relative scroll operation. Further, the nozzle moving mechanism 91 has a variable speed when moving the nozzle, and the substrate rotating mechanism 92 also has a variable rotating speed. These moving speed and rotating speed are also controlled by the controller 90. For example, the moving (swinging) speed of the resist solution discharge nozzles 56a to 56d and the rotation speed of the substrate G can be controlled in multiple stages, and can be adjusted and controlled as appropriate depending on the type of the color resist solution.
[0048]
  The nozzle moving mechanism 91 is configured to move (swing) the nozzle arm 55 so as to move the resist solution discharge nozzles 56a to 56d outward from the approximate center of the substrate G. By doing in this way, since the resist liquid discharge direction and the diffusion direction are the same, the possibility of uneven coating can be eliminated. Conversely, when the resist solution discharge nozzles 56a to 56d are configured to move from the outside toward the approximate center of the substrate, the substrate G is rotated and the resist solution is diffused by the centrifugal force. For this reason, the direction of ejection and the direction of diffusion are opposite, which may cause coating unevenness, which is not preferable. However, it is possible to move the resist solution discharge nozzles 56a to 56d from the outside toward the substantial center of the substrate for other purposes.
[0049]
  Further, the nozzle moving mechanism 91 is configured to decrease the moving speed as the resist solution discharge nozzles 56 a to 56 d move (swing) outward of the substrate G by the nozzle arm 55. Accordingly, when the color resist solution is applied in a scroll form on the substrate G while the resist solution discharge nozzles 56a to 56d and the substrate G are scrolled relative to each other, the inner and outer color resist solutions are applied. The application amount can be made uniform.
[0050]
  For example, when the nozzle moving mechanism 91 for driving the nozzle arm 55 is configured by a stepping motor and the number of pulses of the resist solution discharge nozzles 56a to 56d is substantially at the center of the substrate G, the movement (swing) is set to 320 pps, for example. The speed is relatively high, but gradually or gradually decreases from 320 pps to 250 pps as the resist solution discharge nozzles 56a to 56d are moved (swinged) outward from the approximate center of the substrate G. Can be configured.
[0051]
  Further, the rotation speed of the substrate G by the substrate rotation mechanism 92 is preferably maintained so that the outer periphery of the resist solution on the substrate does not spread radially. Thereby, it is possible to prevent the resist solution from being wasted due to the outer periphery of the resist solution being scattered from the substrate outer periphery to the outside. The lower limit value of the rotation speed of the substrate G is set to be equal to or higher than the rotation speed necessary for the color resist solution to diffuse on the substrate G. In consideration of this, the rotation speed of the substrate G is appropriately selected in the range of, for example, 30 to 40 rpm according to the type of the color resist solution.
[0052]
  The resist solution discharge nozzles 56a to 56d are configured to discharge the resist solution in a flat shape. Specifically, for example, as shown in FIGS. 7A and 7B, a flat discharge port 81 having a wide color resist discharge width is provided. Thereby, the color resist solution is discharged onto the substrate G in a strip shape.
[0053]
  As shown in FIG. 8A, the resist solution discharge nozzles 56a to 56d may be configured so that the resist solution corresponds to the expansion of the slit-like discharge port 81 without being present inside. In this case, the discharge width of the discharge port 81 is limited to 10 to 15 mm, and it is difficult to widen it further.
[0054]
  On the other hand, as shown in FIG. 8B, a plurality of partition plates 82 are provided inside the resist solution discharge nozzles 56a to 56d so that the color resist solution is guided to the outside. The discharge width of 81 can be made wider than in the case of FIG. 8A, and for example, a discharge width of 20 to 100 mm can be secured.
[0055]
  Further, in order to discharge the resist solution in a flat shape, an arc-shaped plate 83 in which a large number of small holes are formed is provided at the tips of the resist solution discharge nozzles 56a to 56d as shown in FIG. Also, it may be a Kumade type in which a large number of injection needle-like discharge tubes 84 having small holes continuous to the small holes provided in the plate 83 are attached radially. Also in this case, the discharge width can be made wider than in the case of FIG. 8A, and for example, a discharge width of 20 to 100 mm can be ensured. In this case, the hole diameter of the discharge pipe 84 is, for example, 0.3 mm.
[0056]
  Next, processing of the substrate in the resist coating processing unit (CT) 22, the reduced-pressure drying processing unit (VD) 40, and the edge remover (ER) 23 that are integrally configured in this manner will be described.
[0057]
  First, in the resist coating processing unit (CT) 22, a nozzle 56a of a predetermined color resist, for example, a red color resist is caused to reach the center of the spin chuck 51 (the center of the substrate G), as shown by the arrow in FIG. The substrate G is rotated while being moved radially outward by the nozzle arm 55, and the red color resist solution is discharged onto the substrate G. Thereby, the resist solution is applied to the substrate G in a scroll shape. Thereafter, the number of rotations of the substrate G is increased to, for example, about 800 rpm, the resist solution is spread to every corner of the substrate G, and the thickness of the resist film is adjusted.
[0058]
  Since the resist solution can be spread over a wide area on the substrate G even when the discharge amount of the resist solution is not so large by applying in the scroll shape in this way, the pigment is included as in this embodiment. Even when a highly viscous color resist is used or when the resist solution is difficult to diffuse, such as when the substrate G is a color filter substrate with a pattern, the resist solution can be applied onto the substrate with a smaller resist solution discharge amount. It can be applied uniformly.
[0059]
  When the color resist solution is applied onto the substrate G in a scroll shape, if the discharge ports of the resist solution discharge nozzles 56a to 56d are, for example, circular and the discharge width is narrow, the color resist discharged in the scroll shape. Between the liquids, there is a gap in the form of a mosquito coil, which may cause uneven application. However, as described above, by configuring the resist solution discharge nozzles 56a to 56d to discharge the resist solution in a flat shape, the discharge width can be widened, and the color applied on the substrate G in a scroll shape. It is possible to avoid the formation of a gap in the resist solution. Therefore, the resist solution can be applied in a substantially circular shape on the substrate, and uneven application can be prevented (see FIG. 9).
[0060]
  Prior to the discharge of the resist solution, thinner may be supplied from the thinner nozzle 56e to the center of the substrate G, and the substrate G may be rotated to spread over the entire surface of the substrate G.
[0061]
  In this way, the substrate G coated with the red color resist is transferred to the reduced-pressure drying processing unit 40 by the transfer arm 41, the gas in the processing chamber between the low chamber 61 and the upper chamber 62 is exhausted, and a predetermined amount is obtained. When the pressure is reduced to 0.1 Torr, for example, the solvent such as thinner in the color resist is evaporated to some extent, and the solvent in the resist is gradually released to accelerate the drying of the resist without adversely affecting the resist. It is possible to effectively prevent transfer from occurring on the substrate G.
[0062]
  The dried substrate G is transported to the edge remover (ER) 23 by the transport arm 42 and aligned by the alignment mechanism 72, and then the four remover heads 73 are moved along each side of the substrate G to be discharged. The excess color resist attached to the edges of the four sides of the substrate G is removed by the thinner. In this case, since the applied resist film is dried to some extent by the reduced-pressure drying processing unit (VD) 40, the resist can be removed very easily.
[0063]
  Thereafter, another substrate G is carried into the resist coating processing unit (CT) 22, and the resist of the same red or other color is applied. In the case of the same color, the same operation can be repeated, and even in the case of different colors, it is very easy to deal with the same process by simply dropping another color resist from different color nozzles. Can do.
[0064]
  On the other hand, the substrate G coated with the above-described red color resist is subjected to exposure / development processing, and after being washed again, it is carried into a resist coating processing unit (CT) 22 to be subjected to a second color resist, for example, green. The green color resist is applied to the substrate G from the color resist nozzle 56b, and the above-described processing steps are similarly repeated. Similarly, a third color resist such as blue is applied, and a fourth color resist such as black is applied.
[0065]
  Next, another embodiment of the present invention will be described.
  FIG. 11 is a cross-sectional view showing an example of a resist solution discharge nozzle in the present embodiment.
  As shown in FIG. 11, the resist solution discharge nozzle 110 has a nozzle body 111, an introduction port 113 for introducing a resist solution provided on the upper portion of the nozzle body 111, and a lower portion of the nozzle body 111. And a plurality of needle-like members 115 having resist through holes therein. A storage chamber 112 for storing a resist solution is provided inside the nozzle body 111, the introduction port 113 communicates with the upper surface of the storage chamber 112, and the resist flow holes of the many needle-like members 115 are at one end thereof. Communicates with the lower part of the storage chamber 112. Further, the upper surface of the storage chamber 112 has an inclined portion 114 that is inclined so that a portion communicating with the introduction port 113 is higher.
[0066]
  With such a configuration, the resist solution supplied from the resist solution supply means (not shown) through the inlet 113 is stored in the storage chamber 112, and the inside of each acicular member 115 from the lower portion of the storage chamber 112. Are discharged onto the substrate G through the resist flow holes.
[0067]
  At this time, the resist solution is temporarily stored in the storage chamber 112 before being discharged onto the substrate G, and the upper surface of the storage chamber 112 is inclined so that the portion communicating with the inlet 113 is higher. Therefore, bubbles contained in the resist solution supplied from the resist solution supply means float inside the storage chamber 112 while the resist solution is stored in the storage chamber 112, and follow the inclined portion 114. To the inlet 113 and discharged. Therefore, it is possible to prevent the bubbles contained in the resist solution from adversely affecting the resist solution coating process.
[0068]
  FIG. 12 is a cross-sectional view showing another example of a resist solution discharge nozzle in the present embodiment.
  As shown in FIG. 12, the resist solution discharge nozzle 120 includes a nozzle body 122, an introduction port 124 for introducing a resist solution provided on the upper portion of the nozzle body 122, and a large number connected to the upper surface of the nozzle body 122. Needle-shaped member 121. A storage chamber 123 for storing a resist solution is provided inside the nozzle body 122, and the resist solution flow hole provided in the needle-shaped member 121 communicates with the upper surface of the storage chamber at the communication portion 125. ing. Each needle member 121 has a curved portion 126 that descends after the flow of the resist solution flowing through the inside rises.
[0069]
  With such a configuration, the resist solution supplied from the resist solution supply means (not shown) through the introduction port 124 fills the storage chamber 123, and the inside of each needle-shaped member 121 from the communication portion 125 on the upper surface of the storage chamber 123. Then, the direction of flow is bent by the curved portion 126, the inside of each needle member 121 is lowered, and the needle G is discharged onto the substrate G from the tip of each needle member 121. After the resist solution is applied onto the substrate G in this way, the resist solution discharge is terminated by stopping the supply of the resist solution from the resist solution supply means (not shown). At this time, by stopping the supply of the resist solution, the driving force for the resist solution to rise in the needle-like member 121 is lost, so that the resist solution remaining in the storage chamber 123 after the supply of the resist solution is stopped is lost. It is no longer spilled on the substrate G through the inside of the shaped member 121, and a defect due to spilling of the resist solution can be prevented.
[0070]
  Further, in the resist solution discharge nozzle 120, as shown in FIG. 12, the upper surface of the storage chamber 123 is inclined so that the communication portion 125 side is higher, so that the resist solution supply is stopped. It is possible to more reliably prevent spillage of the resist solution.
[0071]
  Further, in such a resist solution discharge nozzle that discharges the resist solution from the needle-like member, the resist solution discharge nozzle is disposed above the substrate G rotated by the substrate rotating mechanism 92, as shown in FIG. In this case, the needle-like member 121 may be provided so as to be inclined to the outside of the substrate G. By doing so, since the resist solution is discharged from the tip of the needle-shaped member 121 toward the outside of the rotating substrate G, the resist solution easily spreads outside the substrate G, and the resist solution is more evenly distributed. Application can be performed. In FIG. 13, the axis C indicates the central axis when the substrate rotation mechanism 92 rotates the substrate.
[0072]
  Further, as shown in FIG. 14, the needle-like member 121 may be provided so that the inclination angle toward the outside increases as going outward. Thereby, the resist solution can be discharged over a wider range.
[0073]
  Furthermore, as shown in FIG. 15, adjacent needle-like members 121 may be coupled by a coupling member 151. As a result, as shown in FIG. 16, when the nozzle cleaning mechanism 161 discharges thinner from the thinner discharger 162 to clean the resist solution discharge nozzle, the thinner is supplied to each needle member 121 through the coupling member 151. Therefore, it can wash | clean efficiently.
[0074]
  FIGS. 13 to 16 show the form of the needle-like member 121 in the example of the resist solution discharge nozzle shown in FIG. 12, respectively, but the Kumade type resist solution discharge nozzle shown in FIG. Also in the resist solution discharge nozzle shown in FIG. 11, each effect can be obtained by adopting the same configuration as described above.
[0075]
  Next, another embodiment of the present invention will be described.
  FIG. 17 is a schematic cross-sectional view showing a resist solution discharge nozzle in the present embodiment.
  As shown in FIG. 17, the resist solution discharge nozzle 170 is arranged so as to form a row in the nozzle body 171 and the nozzle body 171, and a large number of needle-like members 172 that discharge the resist solution from the tip thereof. A pump 173 is provided for each needle-like member 172 and supplies a resist solution to each needle-like member 172, and a controller 174 that controls the operation of each pump 173.
[0076]
  By doing so, it is possible to apply the resist solution while controlling each pump 173 by the control unit 174 and individually controlling the discharge amount of the resist solution from each needle-like member 172. Thus, a resist film can be formed uniformly.
[0077]
  Next, still another embodiment of the present invention will be described.
  FIG. 18 is a top view showing a state in which a resist solution is applied onto the substrate G using the resist solution discharge nozzle in the present embodiment.
  As shown in FIG. 18, the resist solution discharge nozzle 180 has a nozzle body 181 provided at the tip of the nozzle arm 55 and a needle-like shape that is arranged in a row on the nozzle body 181 and discharges the resist solution from the tip. A member 183 and a nozzle rotating mechanism 182 capable of rotating the nozzle body 181 are provided.
[0078]
  When the resist solution is applied to the substrate G with the resist solution discharge nozzle 180 having such a configuration, the nozzle moving mechanism 91 (not shown in FIG. 18) while discharging the resist solution from the tip of each needle-like member 183. The nozzle arm 55 moves the resist solution discharge nozzle 181 outward from the center of the substrate G, and at the same time, the substrate G is rotated by the substrate rotation mechanism 92 (not shown in FIG. 18). At this time, as the resist solution discharge nozzle 180 is moved outward from the center of the substrate G, the nozzle rotation mechanism 182 causes the direction of the row formed by the needle-like members 183 to approach the tangential direction of the rotation direction 184 of the substrate G. Thus, the nozzle body 181 is rotated. In this way, the resist solution can be applied uniformly on the inside and outside of the substrate G.
[0079]
  Next, still another embodiment of the present invention will be described.
  FIG. 19 is a schematic view showing a state in which a resist coating process is performed using the resist solution discharge nozzle in the present embodiment.
  As shown in FIG. 19, the resist solution discharge nozzle 190 has a slit-like discharge port, and is attached to the nozzle body 191 that discharges the resist solution wide with respect to the substrate G, and the nozzle body 191. A distance sensor 192 that measures the distance between the substrate 191 and the substrate G; a lifting mechanism 194 that lifts and lowers the nozzle body 191; and a control unit 193 that controls the operation of the lifting mechanism 194 based on the measurement result of the distance sensor 192. ing.
[0080]
  In the resist solution discharge nozzle 190, the distance between the nozzle body 191 and the substrate G is measured by the distance sensor 192 while discharging the resist solution from the nozzle body 191, and the control unit 193 controls the nozzle body 191 based on the measured value. The nozzle body 191 is controlled to move up and down by operating the lifting mechanism 194 so that the distance between the nozzle G and the substrate G is constant.
[0081]
  In the case of a slit type nozzle that has a slit-like discharge port and discharges the resist solution wide with respect to the substrate G, the width of the resist solution discharged onto the substrate G changes when the distance between the substrate G and the nozzle changes. In this embodiment, since the distance between the substrate G and the nozzle body 191 is controlled to be constant, this variation in the width of the resist solution is prevented, and the resist solution is made uniform. Can be discharged in width.
[0082]
  Next, still another embodiment of the present invention will be described.
  FIG. 20 is a schematic side view of a resist solution discharge nozzle according to the present embodiment.
  As shown in FIG. 20, the resist solution discharge nozzle 200 includes a nozzle body 201, a resist solution flow hole formed therein, a needle-like member 202 that discharges the resist solution from the tip, and the needle-like member 202. A bubble sensor 203 for detecting bubbles contained in the resist solution flowing therethrough. The resist application / development processing means provided with the resist solution discharge nozzle is controlled by a control unit 204 that performs predetermined control based on the detection result from the bubble sensor 203, and a control unit 204 to output a warning signal. A warning device 205 is provided.
[0083]
  The needle-like member 202 is preferably made of a transparent and highly solvent-resistant material, such as polymethylpentene, for example, in order to detect bubbles contained in the resist solution flowing therethrough by the bubble sensor 203. .
[0084]
  With the configuration as described above, the resist solution is applied while detecting bubbles contained in the resist solution flowing through the needle-like member 202 by the bubble sensor 203, and the control unit 204 is detected from the detection result from the bubble sensor 203. If it is determined that the resist solution contains bubbles, the control unit 204 stops the resist coating / development processing device and operates the alarm generation device 205 to control to generate an alarm. be able to. The stop of the resist coating / development processing apparatus and the generation of an alarm may be controlled so as to perform only one of them. Further, the control unit 204 determines whether the amount of bubbles contained in the resist solution exceeds a predetermined threshold based on the detection result from the bubble sensor 203, and the amount of bubbles in the resist solution is determined. When the threshold value is exceeded, the resist coating / developing apparatus may be stopped.
[0085]
  In addition, this invention is not limited to the said embodiment and Example, A various deformation | transformation is possible. For example, in the above embodiment, the resist coating process in the color filter has been described. However, the present invention is not limited to this, and the present invention can be applied to a resist coating process on other substrates such as an LCD substrate and a semiconductor substrate.
[0086]
【Example】
  (Example 1)
  An experiment was conducted for a conventional case where a resist solution is discharged to the center of a raw glass substrate and diffused by rotation of the substrate, and for a case where the resist solution is applied in a scroll shape to the raw glass substrate. The experimental results are shown in Table 1.
[0087]
[Table 1]

[0088]
  For example, when the conventional resist solution usage amount is 30 ml and the scroll coating resist solution usage amount is 15.0 ml, the diameter of the spread portion of the resist solution is 230 to 240 mm, which is almost the same. In the case of the scroll coating, it was confirmed that the resist spread area can be secured with almost half the amount of the resist solution used.
[0089]
  In addition, the amount of resist solution that can be applied to an uncoated glass substrate without uneven coating is 25 ml in the past, but 17.5 ml in scroll coating, and the amount of resist solution used is almost 2 / It was confirmed that it can be reduced to 3.
[0090]
  (Example 2)
  An experiment was conducted for a conventional case in which a resist solution is discharged to the center of a substrate with a pattern and diffused by the rotation of the substrate, and for a case in which the resist solution is applied in a scroll shape to a substrate with a pattern. The experimental results are shown in Table 2.
[0091]
[Table 2]

[0092]
  The amount of resist solution that can be applied to a substrate with a pattern without application unevenness is 30 ml in the past, whereas in the case of scroll coating, it is 17.5 ml. It was confirmed that it could be cut in half.
[0093]
  (Example 3)
  A comparative experiment was conducted using the slit type nozzle shown in FIG. 8A and the Kumade type shown in FIG. 8C as the resist solution discharge nozzle. In the slit type, the discharge width was 10 mm and the slit width was 0.8 mm. In the Kumade type, 11 discharge pipes, a discharge width of 20 mm, and a hole diameter of the discharge pipe of 0.3 mm were used. Using these materials, a resist solution was applied in a scroll shape to a substrate of raw glass.
[0094]
  When the usage amount of the resist solution was 20 ml, as shown in FIG. 9, it was determined whether or not there was a gap between the resist solutions discharged in a scroll shape. That is, the case where the resist on the substrate was circular as shown in (a) of FIG. 9 was judged as good (◯), and the case where it was spiraled as shown in (b) was judged as poor (x). The results are shown in Table 3.
[0095]
[Table 3]

[0096]
  In the case of a slit type nozzle having a discharge width of 10 mm, when the diameter of the resist coating portion immediately after the resist coating is 260 mm or less, as shown in FIG. There is no gap between them, and the applied state is good, but when this diameter is 280 mm or more, as shown in FIG. 9B, there is no gap between the resist solutions discharged in a scroll shape. The application state is poor.
[0097]
  On the other hand, in the case of a Kumade type nozzle having a discharge width of 20 mm, when the diameter immediately after the resist application is 330 mm or less, as shown in FIG. There is no gap, and the application state is good, but when this diameter is 350 mm or more, as shown in FIG. 9B, a gap is formed between the resist solutions discharged in a scroll shape, and the application state Is bad.
[0098]
  In other words, it was confirmed that, in the coating method in which the resist solution is applied in a scroll shape, the area that can be applied without gaps can be increased when the nozzle discharge width is wide.
[0099]
  Next, similarly, when the resist usage is changed and the resist solution is discharged and applied to the center of the conventional substrate (center discharge), when the scroll application is performed by using the slit type nozzle having the discharge width of 10 mm, The resist diameter before rotation was measured in the case where scroll coating was performed using a Kumade type nozzle having a discharge width of 20 mm. The results are shown in Table 4.
[0100]
[Table 4]

[0101]
  As shown in Table 4, in the case of conventional center discharge, if the amount of the resist solution used is not 25 ml or more, coating unevenness occurred, whereas in the case of scroll coating, a slit type nozzle was used. In both cases and when using a Kumade type nozzle, coating unevenness did not occur up to 18.5 ml. As for the resist diameter before rotation, in the case of center discharge, the resist discharge diameter was 240 mm even when the resist discharge amount was 30 ml, whereas in the case of scroll coating, 18.5 ml was 250 mm for the slit type and Kumade type. It became 300mm. From this, it was confirmed that the amount of the resist solution used can be reduced by scroll coating as compared with the prior art.
[0102]
  Also, in the scroll coating method, when comparing a slit type nozzle with a discharge width of 10 mm and a Kumade type nozzle with a discharge width of 20 mm, the Kumade type with a wider discharge width is rotated at any resist usage. It was confirmed that the diameter of the previous resist was large.
[0103]
  (Example 4)
  Next, the film thickness uniformity when scroll coating was applied was grasped. Table 5 shows the resist diameter and film thickness uniformity after ejection when scroll coating is performed while changing the resist ejection time and the amount of resist used. As shown in Table 5, the longer the discharge time, the thicker the central film thickness and the thinner the peripheral area. FIG. 10 is a graph showing the film thickness profiles on the diagonal lines when the scroll application is performed with a discharge time of 18.5 sec and the resist usage amount is 28 ml, and when the center discharge is performed. As is clear from this graph, it was confirmed that even when the discharge time is long and the amount of resist used is large, the film thickness uniformity is only slightly worse than in the case of center discharge. From this, it is understood that the film thickness uniformity equivalent to the center discharge can be obtained by adjusting the discharge time and the resist usage amount in the scroll coating.
[0104]
[Table 5]

[0105]
【The invention's effect】
  As described above, according to the present invention, while discharging the resist solution from the resist solution discharge nozzle to the substrate, the resist solution discharge nozzle is moved on the substrate and simultaneously the substrate is rotated. The resist solution is applied on the substrate while scrolling relative to the substrate, so that the resist solution is spread over a wide area on the substrate even if the amount of the resist solution is not so large. Even when the resist solution is difficult to diffuse, the resist solution can be uniformly applied on the substrate with a small amount of the resist solution discharged.
[0106]
  In this case, by configuring the resist solution discharge nozzle to discharge the resist solution in a flat shape, it is possible to widen the discharge width and to avoid a gap between the resist solution discharged in a scroll shape. be able to. Therefore, the resist solution applied on the substrate becomes circular as a whole, and coating unevenness can be prevented.
[Brief description of the drawings]
FIG. 1 is a plan view showing a coating / development processing system for a color filter of an LCD to which the present invention is applied.
FIG. 2 is a schematic plan view showing a resist coating processing unit (CT), a drying processing unit, and an edge remover (ER).
FIG. 3 is a schematic side view showing a resist coating unit (CT), a drying unit, and an edge remover (ER).
FIG. 4 is a plan view and a side view of a resist solution discharge nozzle arm.
FIG. 5 is a plan view schematically showing a resist coating unit (CT) according to an embodiment of the present invention.
FIG. 6 is a schematic diagram showing a control system of a resist coating unit (CT) according to an embodiment of the present invention.
FIGS. 7A and 7B are a side view and a front view of a resist solution discharge nozzle used in a resist coating unit (CT) according to an embodiment of the present invention. FIGS.
FIG. 8 is a diagram schematically showing an example of a resist solution discharge nozzle used in a resist coating unit (CT).
FIG. 9 is a schematic diagram showing a resist application state immediately after scroll application.
FIG. 10 is a graph showing a film thickness profile for center discharge and scroll coating.
FIG. 11 is a sectional view showing an example of a resist solution discharge nozzle according to another embodiment of the present invention.
FIG. 12 is a sectional view showing another example of a resist solution discharge nozzle according to another embodiment of the present invention.
13 is a schematic view showing an embodiment of a needle-like member in the resist solution discharge nozzle shown in FIG.
14 is a schematic view showing another form of a needle-like member in the resist solution discharge nozzle shown in FIG.
15 is a partial schematic view showing still another form of a needle-like member in the resist solution discharge nozzle shown in FIG.
16 is a cross-sectional view showing a state in which the resist solution discharge nozzle shown in FIG. 15 is being cleaned by a nozzle cleaning mechanism.
FIG. 17 is a schematic sectional view showing a resist solution discharge nozzle according to still another embodiment of the present invention.
FIG. 18 is a top view showing a state in which a resist solution is applied using a resist solution discharge nozzle according to still another embodiment of the present invention.
FIG. 19 is a schematic view showing an example of a resist solution discharge nozzle according to still another embodiment of the present invention.
FIG. 20 is a schematic side view showing an example of a resist solution discharge nozzle in still another embodiment of the present invention.
[Explanation of symbols]
  22: Resist coating unit (CT)
  51; Spin chuck
  55; Resist solution discharge nozzle arm
  56a-56d; Color resist solution discharge nozzle
  57a-57d; Color resist supply pipe
  81; discharge port
  90; controller
  91; Nozzle movement mechanism
  92; substrate rotation mechanism
  G: Substrate for color filter

Claims (10)

A resist coating processing apparatus for applying a resist solution to a substrate,
Resist solution discharge that has a nozzle body and a large number of needle-like members provided in a row in the nozzle body and formed with a resist solution flow hole therein, and discharges the resist solution in a flat shape on the substrate A nozzle,
A nozzle moving mechanism for moving the resist solution discharge nozzle;
A nozzle rotation mechanism for rotating the nozzle body;
A substrate rotation mechanism for rotating the substrate,
While the resist solution is discharged from the resist solution discharge nozzle onto the substrate, the resist solution discharge nozzle is moved on the substrate by the nozzle moving mechanism, and at the same time, the substrate is rotated by the substrate rotation mechanism, and the resist solution discharge nozzle and the substrate are rotated. When the resist solution discharge nozzle is moved outward from the center of the substrate by the nozzle moving mechanism, the direction of the row formed by the needle-like members is determined by the substrate rotating mechanism. The resist coating apparatus is characterized in that the resist solution is applied onto the substrate in a scroll shape while rotating the nozzle body by the nozzle rotating mechanism so as to approach the tangential direction of the substrate rotating direction. A resist coating processing apparatus for applying a resist solution to a substrate,
A resist solution discharge nozzle for discharging the resist solution in a flat shape on the substrate;
A nozzle moving mechanism for moving the resist solution discharge nozzle;
A nozzle rotation mechanism for rotating the nozzle body;
A substrate rotation mechanism for rotating the substrate,
While the resist solution is discharged from the resist solution discharge nozzle onto the substrate, the resist solution discharge nozzle is moved on the substrate by the nozzle moving mechanism, and at the same time, the substrate is rotated by the substrate rotation mechanism, and the resist solution discharge nozzle and the substrate are rotated. And a resist solution discharged in a flat shape from the resist solution discharge nozzle when the nozzle movement mechanism moves the resist solution discharge nozzle from the center of the substrate to the outside. The resist liquid is applied onto the substrate in a scroll shape while rotating the nozzle body by the nozzle rotation mechanism so that the discharge width direction of the nozzle approaches the tangential direction of the direction in which the substrate rotation mechanism rotates the substrate. A resist coating apparatus. A resist coating processing apparatus for sequentially applying a plurality of color resist solutions to a substrate,
It has a nozzle body and a large number of needle-like members provided in a row in the nozzle body and formed with a resist solution flow hole, and is provided for each color resist solution. A plurality of resist solution discharge nozzles for discharging the color resist solution in a flat shape ,
A nozzle moving mechanism for moving the plurality of resist solution discharge nozzles;
A nozzle rotation mechanism for rotating the nozzle body;
A substrate rotation mechanism for rotating the substrate;
A controller that adjusts and controls the movement speed of the resist liquid discharge nozzle and the rotation speed of the substrate in multiple stages according to the type of color resist liquid;
While discharging one color resist solution from the resist solution discharge nozzle to the substrate, the resist solution discharge nozzle is moved on the substrate by the nozzle moving mechanism, and at the same time, the substrate is rotated by the substrate rotation mechanism to discharge the resist solution. A relative scroll operation is performed between the nozzle and the substrate so that the color resist solution is applied onto the substrate in a scroll shape, and the movement speed of the resist solution discharge nozzle and the rotation speed of the substrate are controlled by the controller. Control each color resist solution ,
When the nozzle moving mechanism moves the resist solution discharge nozzle from the center of the substrate to the outside, the direction of the row formed by the needle-shaped members is tangent to the direction in which the substrate rotating mechanism rotates the substrate. A resist coating apparatus characterized by rotating a nozzle body so as to approach a direction . The needle-like member is connected to said upper surface of the nozzle body, according to claim 1 or claim 3 characterized in that it has a curved portion such as the flow of the resist liquid flowing through the internal descends after rising Resist coating processing equipment. The plurality of needle-like members are provided so as to be inclined to the outside of the substrate when the resist solution discharge nozzle is disposed above the substrate rotated by the substrate rotation mechanism. The resist coating apparatus according to claim 1, claim 3, or claim 4 . It said plurality of needle-like member, according to claim 1, characterized in that the inclination angle of the outwardly toward the outer large, resist coating processing apparatus according to claim 3, claim 4 or claim 5. The resist coating apparatus according to claim 1, 3, 4, 5, or 6 , further comprising a foam sensor that detects foam in the needle-like member. 8. The resist coating process according to claim 1 , wherein the nozzle moving mechanism reduces the moving speed as the resist solution discharge nozzle moves outward of the substrate. 9. apparatus. A resist coating method for applying a resist solution to a substrate,
Resist solution discharge that has a nozzle body and a large number of needle-like members provided in a row in the nozzle body and formed with a resist solution flow hole therein, and discharges the resist solution in a flat shape on the substrate The substrate is rotated simultaneously with moving the resist solution discharge nozzle on the substrate while discharging the resist solution from the nozzle to the substrate, and a relative scroll operation is performed between the resist solution discharge nozzle and the substrate, and When the resist solution discharge nozzle is moved from the center of the substrate to the outside, the nozzle body is rotated by the nozzle rotation mechanism so that the direction of the row formed by the needle-like members approaches the tangential direction of the direction in which the substrate rotation mechanism rotates the substrate. The resist coating method is characterized in that the resist solution is applied onto the substrate in a scroll shape while rotating the substrate. A resist coating method for applying a resist solution to a substrate,
The resist solution discharge nozzle that discharges the resist solution in a flat shape onto the substrate moves the resist solution discharge nozzle on the substrate while discharging the resist solution onto the substrate, and at the same time rotates the substrate. When the resist solution discharge nozzle is moved from the center of the substrate to the outside, the direction of the discharge width of the resist solution discharged in a flat shape from the resist solution discharge nozzle is changed. And applying the resist solution in a scroll form on the substrate while rotating the nozzle body by the nozzle rotation mechanism so that the substrate rotation mechanism approaches a tangential direction of the substrate rotation direction. .

Images