CN105487353A - Liquid coating device - Google Patents
Liquid coating device Download PDFInfo
- Publication number
- CN105487353A CN105487353A CN201410538091.4A CN201410538091A CN105487353A CN 105487353 A CN105487353 A CN 105487353A CN 201410538091 A CN201410538091 A CN 201410538091A CN 105487353 A CN105487353 A CN 105487353A
- Authority
- CN
- China
- Prior art keywords
- liquid
- nozzle cover
- nozzle
- inlet
- flow passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 30
- 239000011248 coating agent Substances 0.000 title abstract description 9
- 238000000576 coating method Methods 0.000 title abstract description 9
- 239000012530 fluid Substances 0.000 claims description 13
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Abstract
The invention relates to wafer processing equipment in the semiconductor industry, in particular to a liquid coating device for coating a developing liquid. The liquid coating device comprises a nozzle cover and a nozzle main body, wherein the nozzle cover is in sealing connection with the nozzle main body, and a sealed cavity is formed in the middle of the nozzle cover and the nozzle main body; a liquid inlet is formed in the nozzle cover; a spiral flow passage is formed in the nozzle main body, and liquid outlet holes for draining the developing liquid are formed in the flow passage; the developing liquid inflowing from the liquid inlet flows into the flow passage and drains from the liquid outlet holes, and the developing liquid is coated on the surface of a whole wafer simultaneously; and exhaust holes are formed in the nozzle cover. The spiral flow passage and the liquid outlet holes are formed in the liquid coating device disclosed by the invention, the developing liquid flows out from the liquid outlet holes through the spiral flow passage, and the developing liquid can be coated on the surface of the whole wafer simultaneously through the liquid outlet holes in spiral distribution, so that the surface of the wafer is uniformly developed, and the yield of the product wafer is guaranteed; and the exhaust holes are formed in the nozzle cover of the liquid coating device, so that non-uniformity and bubbles of the developing liquid caused by unsmooth exhaust are avoided.
Description
Technical field
The present invention relates to semicon industry wafer processing apparatus, specifically a kind of liquid application device for being coated with developer solution.
Background technology
The wafer after to exposure is needed to carry out development operation in SIC (semiconductor integrated circuit) manufacture process.For the wafer of 12 cun, existing developing liquid coating device needs to carry out developer solution coating through specific path to crystal column surface.Due to path restriction, it is variant that developer solution is coated on the crystal column surface time everywhere, causes crystal column surface development time everywhere different, develop uneven, reduce product wafer yield.
Summary of the invention
The object of the present invention is to provide a kind of liquid application device for being coated with developer solution.This liquid application device can carry out developer solution coating to whole crystal column surface simultaneously, avoids the development non-uniform phenomenon caused due to development time difference to occur.
The object of the invention is to be achieved through the following technical solutions:
The present invention includes nozzle cover and nozzle body, wherein nozzle cover and nozzle body are tightly connected, middle formation airtight chamber, and described nozzle cover is provided with inlet, and described nozzle body has spiral helicine runner, is provided with the fluid hole of discharging developer solution in this runner; The developer solution flowed into by described inlet flow in described runner, and discharges from described fluid hole, coats the surface of whole wafer simultaneously.
Wherein: described nozzle cover is provided with vent port; The longitudinal center line of described inlet and the axial centerline parallel of vent port, and respectively perpendicular to described nozzle body; Described fluid hole is by spiral distribution, corresponding with the spiral trajectory of described runner; Described nozzle cover is the coniform of hollow, and its top is provided with inlet, and the edge of described nozzle cover lower end is tightly connected by O-ring seal and described nozzle body.
Advantage of the present invention and good effect are:
1. liquid application device of the present invention has spiral helicine runner and fluid hole, developer solution is flowed out from fluid hole by spiral helicine runner, developer solution can be coated on whole crystal column surface by the fluid hole of spiral distribution simultaneously, crystal column surface is developed evenly, ensure that product wafer yield.
2. nozzle cover of the present invention has vent port, avoid being vented the uneven and bubble of the developer solution freely do not caused.
Accompanying drawing explanation
Fig. 1 is perspective view of the present invention;
Fig. 2 is front sectional view of the present invention;
Fig. 3 is the structural representation of nozzle body of the present invention;
Wherein: 1 is nozzle cover, 2 is inlet, and 3 is vent port, and 4 is nozzle body, and 5 is O-ring seal, and 6 is airtight chamber, and 7 is runner, and 8 is fluid hole.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figures 1 to 3, the present invention includes nozzle cover 1 and nozzle body 4, wherein nozzle cover 1 is the coniform of hollow, and its top is provided with inlet 2, and the edge of nozzle cover 1 lower end is tightly connected by O-ring seal 5 and nozzle body 4.Nozzle cover 1 is provided with vent port 3, and this vent port 3 is positioned at the side of inlet 2, is arranged on the hypotenuse of nozzle cover 1 axial cross section side.The longitudinal center line of inlet 2 and the axial centerline parallel of vent port 3, and respectively perpendicular to nozzle body 4.
Nozzle body 4 is discoid, and outward flange is tightly connected by O-ring seal 5 and nozzle cover 1, and centre is split into airtight chamber 6.Nozzle body 4 has spiral helicine runner 7, in this runner 7, be provided with the fluid hole 8 of discharging developer solution; This fluid hole 8 is by spiral distribution, corresponding with the spiral trajectory of runner (7).
Principle of work of the present invention is:
Seal with O-ring seal 5 between nozzle cover 1 and nozzle body 4, form airtight chamber 6, prevent developer solution from leaking.Developer solution flows into airtight chamber 6 from inlet 2, flows in spiral helicine runner 7, and discharges from the fluid hole 8 of Spiral distribution, coats the surface of whole wafer simultaneously.Developer solution is covered with airtight chamber 6 gradually, and in airtight chamber 6, original gas is discharged from vent port 3.
Claims (5)
1. a liquid application device, it is characterized in that: comprise nozzle cover (1) and nozzle body (4), wherein nozzle cover (1) and nozzle body (4) are tightly connected, middle formation airtight chamber (6), described nozzle cover (1) is provided with inlet (2), described nozzle body (4) has spiral helicine runner (7), in this runner (7), be provided with the fluid hole (8) of discharging developer solution; The developer solution flowed into by described inlet (2) flow in described runner (7), and discharges from described fluid hole (8), coats the surface of whole wafer simultaneously.
2., by liquid application device according to claim 1, it is characterized in that: described nozzle cover (1) is provided with vent port (3).
3., by liquid application device according to claim 2, it is characterized in that: the longitudinal center line of described inlet (2) and the axial centerline parallel of vent port (3), and respectively perpendicular to described nozzle body (4).
4., by the liquid application device described in claim 1 or 2, it is characterized in that: described fluid hole (8) is by spiral distribution, corresponding with the spiral trajectory of described runner (7).
5. by the liquid application device described in claim 1 or 2, it is characterized in that: what described nozzle cover (1) was hollow is coniform, its top is provided with inlet (2), and the edge of described nozzle cover (1) lower end is tightly connected by O-ring seal (5) and described nozzle body (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410538091.4A CN105487353A (en) | 2014-10-13 | 2014-10-13 | Liquid coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410538091.4A CN105487353A (en) | 2014-10-13 | 2014-10-13 | Liquid coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105487353A true CN105487353A (en) | 2016-04-13 |
Family
ID=55674417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410538091.4A Withdrawn CN105487353A (en) | 2014-10-13 | 2014-10-13 | Liquid coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105487353A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106200271A (en) * | 2016-08-31 | 2016-12-07 | 武汉华星光电技术有限公司 | Coating machine |
| CN106938222A (en) * | 2017-02-09 | 2017-07-11 | 武汉华星光电技术有限公司 | A kind of light blockage coating device and nozzle |
| CN108654944A (en) * | 2017-03-28 | 2018-10-16 | 财团法人工业技术研究院 | dispensing device and method |
| CN108828908A (en) * | 2018-06-27 | 2018-11-16 | 山东傲天环保科技有限公司 | A kind of development liquid processing device |
| WO2023050198A1 (en) * | 2021-09-29 | 2023-04-06 | 华为技术有限公司 | Developing device, developing method, and dispensing developing system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162513A (en) * | 1990-10-25 | 1992-06-08 | Nec Corp | Developing nozzle for photoresist film |
| JP2001113217A (en) * | 1999-08-10 | 2001-04-24 | Tokyo Electron Ltd | Resist coating apparatus and resist coating method |
| CN101055417A (en) * | 2006-04-12 | 2007-10-17 | 中芯国际集成电路制造(上海)有限公司 | Sprinkler device |
| CN101644903A (en) * | 2008-08-07 | 2010-02-10 | 和舰科技(苏州)有限公司 | Developing solution spray head |
| CN202502983U (en) * | 2012-04-01 | 2012-10-24 | 南通富士通微电子股份有限公司 | Semiconductor wafer spraying liquid etching system |
| CN103019048A (en) * | 2012-12-20 | 2013-04-03 | 清华大学深圳研究生院 | Developing spray nozzle |
| CN203437271U (en) * | 2013-07-09 | 2014-02-19 | 京东方科技集团股份有限公司 | Coating device |
| WO2014149898A1 (en) * | 2013-03-15 | 2014-09-25 | Applied Materials, Inc. | Complex showerhead coating apparatus with electrospray for lithium ion battery |
-
2014
- 2014-10-13 CN CN201410538091.4A patent/CN105487353A/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162513A (en) * | 1990-10-25 | 1992-06-08 | Nec Corp | Developing nozzle for photoresist film |
| JP2001113217A (en) * | 1999-08-10 | 2001-04-24 | Tokyo Electron Ltd | Resist coating apparatus and resist coating method |
| CN101055417A (en) * | 2006-04-12 | 2007-10-17 | 中芯国际集成电路制造(上海)有限公司 | Sprinkler device |
| CN101644903A (en) * | 2008-08-07 | 2010-02-10 | 和舰科技(苏州)有限公司 | Developing solution spray head |
| CN202502983U (en) * | 2012-04-01 | 2012-10-24 | 南通富士通微电子股份有限公司 | Semiconductor wafer spraying liquid etching system |
| CN103019048A (en) * | 2012-12-20 | 2013-04-03 | 清华大学深圳研究生院 | Developing spray nozzle |
| WO2014149898A1 (en) * | 2013-03-15 | 2014-09-25 | Applied Materials, Inc. | Complex showerhead coating apparatus with electrospray for lithium ion battery |
| CN203437271U (en) * | 2013-07-09 | 2014-02-19 | 京东方科技集团股份有限公司 | Coating device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106200271A (en) * | 2016-08-31 | 2016-12-07 | 武汉华星光电技术有限公司 | Coating machine |
| CN106938222A (en) * | 2017-02-09 | 2017-07-11 | 武汉华星光电技术有限公司 | A kind of light blockage coating device and nozzle |
| CN108654944A (en) * | 2017-03-28 | 2018-10-16 | 财团法人工业技术研究院 | dispensing device and method |
| CN108828908A (en) * | 2018-06-27 | 2018-11-16 | 山东傲天环保科技有限公司 | A kind of development liquid processing device |
| CN108828908B (en) * | 2018-06-27 | 2021-11-19 | 上海德迈世欧化工有限公司 | Developing solution processing device |
| WO2023050198A1 (en) * | 2021-09-29 | 2023-04-06 | 华为技术有限公司 | Developing device, developing method, and dispensing developing system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105487353A (en) | Liquid coating device | |
| US10741427B2 (en) | Coating apparatus for reducing waste of coating liquid, method for recycling coating liquid by utilization of the same, and method for cleaning the same | |
| SG10201901404XA (en) | Washing device and washing method | |
| TW201611909A (en) | Chemical liquid discharge mechanism, liquid processing apparatus, chemical liquid discharge method, and storage medium | |
| US20160153570A1 (en) | Auto-switching tee joint, device and method for washing and drying clamps | |
| CN103871938A (en) | Rinse tank for rinsing semiconductor wafer | |
| CN105045049A (en) | Developing nozzle with exhaust passages | |
| CN103984213A (en) | Uniform outflow development nozzle having pressure equalization flow channel | |
| CN105225999B (en) | Wafer bearing platform | |
| CN204431035U (en) | A kind of grinding table top | |
| CN114114858B (en) | A glue nozzle seat bearing device and glue coating and developing equipment | |
| US10186434B2 (en) | Nozzle and etching apparatus | |
| TWM481772U (en) | Fluid nozzle | |
| CN206509292U (en) | A kind of wafer cleaning mechanism | |
| CN109300808A (en) | A kind of semiconductor device for wet-treating crystal round fringes | |
| CN104624430A (en) | Device for preventing residual liquid from dripping | |
| CN106267886B (en) | A liquid distributor in an extraction tower and its working method | |
| TWM482444U (en) | Fluid nozzle and fluid nozzle apparatus | |
| CN103977932B (en) | Integrated morphology pre-wet paste nozzle | |
| KR20140060968A (en) | Fluid mixing device | |
| JP2016156092A5 (en) | ||
| CN206584897U (en) | Wet chemical treatment apparatus | |
| CN103805998A (en) | Silicon wafer wet etching device and silicon wafer wet etching method | |
| CN106363264B (en) | A kind of electric spark-erosion perforation adds the method protected to exit face in working hour | |
| TWI704419B (en) | Photoresist nozzle and using method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
|
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160413 |