JP3724498B2 - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP3724498B2 JP3724498B2 JP2004280288A JP2004280288A JP3724498B2 JP 3724498 B2 JP3724498 B2 JP 3724498B2 JP 2004280288 A JP2004280288 A JP 2004280288A JP 2004280288 A JP2004280288 A JP 2004280288A JP 3724498 B2 JP3724498 B2 JP 3724498B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- wavelength
- emitting element
- fluorescent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
2・・・メタルステム
3・・・メタルポスト
4・・・樹脂モールド
5・・・蛍光染料
Claims (1)
- 発光素子を樹脂で包囲してなる発光ダイオードにおいて、
前記発光素子は青色領域に発光ピークを有する可視光を発光し、n型及びp型に積層されてなる窒化ガリウム系化合物半導体発光素子であって、
前記発光素子を包囲する樹脂中に蛍光染料又は蛍光顔料が添加されており、
前記蛍光染料又は蛍光顔料は420nm〜440nm付近の波長によって励起されて発光するものであり、
前記蛍光染料又は蛍光顔料は発光素子からの可視光により励起されて、励起波長よりも長波長の可視光を出して発光ダイオードの視感度を良くすることを特徴とする発光ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004280288A JP3724498B2 (ja) | 2004-09-27 | 2004-09-27 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004280288A JP3724498B2 (ja) | 2004-09-27 | 2004-09-27 | 発光ダイオード |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003067318A Division JP2003234513A (ja) | 2003-02-04 | 2003-02-04 | 蛍光染料又は蛍光顔料が添加された波長変換発光ダイオード用樹脂 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005158166A Division JP3808892B2 (ja) | 2005-05-30 | 2005-05-30 | 発光ダイオード |
JP2005158167A Division JP3920296B2 (ja) | 2005-05-30 | 2005-05-30 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004363635A JP2004363635A (ja) | 2004-12-24 |
JP3724498B2 true JP3724498B2 (ja) | 2005-12-07 |
Family
ID=34056604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004280288A Expired - Lifetime JP3724498B2 (ja) | 2004-09-27 | 2004-09-27 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3724498B2 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009041237A1 (ja) | 2007-09-27 | 2009-04-02 | Showa Denko K.K. | Ⅲ族窒化物半導体発光素子 |
US7868340B2 (en) | 2008-05-30 | 2011-01-11 | Bridgelux, Inc. | Method and apparatus for generating white light from solid state light emitting devices |
US8659034B2 (en) | 1996-03-26 | 2014-02-25 | Cree, Inc. | Solid state white light emitter and display using same |
US9219014B2 (en) | 2011-05-24 | 2015-12-22 | Panasonic Intellectual Property Management Co., Ltd. | Manufacturing method of light emitting elements, and manufacturing apparatus of light emitting elements |
US9739444B2 (en) | 2007-03-05 | 2017-08-22 | Intematix Corporation | Light emitting diode (LED) based lighting systems |
US10204888B2 (en) | 2011-04-13 | 2019-02-12 | Intematix Corporation | LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion |
US10234725B2 (en) | 2015-03-23 | 2019-03-19 | Intematix Corporation | Photoluminescence color display |
US10557594B2 (en) | 2012-12-28 | 2020-02-11 | Intematix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3995011B2 (ja) * | 2005-10-31 | 2007-10-24 | 日亜化学工業株式会社 | 発光ダイオード |
JP5355184B2 (ja) | 2009-03-31 | 2013-11-27 | Jx日鉱日石エネルギー株式会社 | 全芳香族サーモトロピック液晶ポリエステル樹脂組成物、成形体及びledリフレクター |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5441660Y1 (ja) * | 1970-02-18 | 1979-12-05 | ||
JPS5079379U (ja) * | 1973-11-24 | 1975-07-09 | ||
JPS5270783A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Semiconductor luminescent unit |
JPS603794B2 (ja) * | 1977-12-15 | 1985-01-30 | 株式会社東芝 | 発光表示装置 |
DE3117571A1 (de) * | 1981-05-04 | 1982-11-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Lumineszenz-halbleiterbauelement |
JPS62147366U (ja) * | 1986-03-11 | 1987-09-17 | ||
JPS63180A (ja) * | 1986-06-19 | 1988-01-05 | Seiko Epson Corp | 青色発光素子及びその製造方法 |
JPS6413161A (en) * | 1987-07-07 | 1989-01-18 | Canon Kk | Printer |
JPH0614564B2 (ja) * | 1987-07-13 | 1994-02-23 | 日本電信電話株式会社 | 半導体発光素子 |
JP2795932B2 (ja) * | 1989-11-09 | 1998-09-10 | 出光興産株式会社 | エレクトロルミネッセンス素子 |
JPH0367462U (ja) * | 1989-10-31 | 1991-07-01 | ||
JP2553342Y2 (ja) * | 1989-12-08 | 1997-11-05 | シャープ株式会社 | 発光ダイオードランプ |
JPH03203388A (ja) * | 1989-12-29 | 1991-09-05 | Matsushita Electric Ind Co Ltd | 半導体発光素子およびその製造方法 |
JP2749984B2 (ja) * | 1990-08-30 | 1998-05-13 | 田中貴金属工業株式会社 | フルート用パイプの製造方法 |
JPH05152609A (ja) * | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2003234513A (ja) * | 2003-02-04 | 2003-08-22 | Nichia Chem Ind Ltd | 蛍光染料又は蛍光顔料が添加された波長変換発光ダイオード用樹脂 |
-
2004
- 2004-09-27 JP JP2004280288A patent/JP3724498B2/ja not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8659034B2 (en) | 1996-03-26 | 2014-02-25 | Cree, Inc. | Solid state white light emitter and display using same |
US8860058B2 (en) | 1996-03-26 | 2014-10-14 | Cree, Inc. | Solid state white light emitter and display using same |
US8963182B2 (en) | 1996-03-26 | 2015-02-24 | Cree, Inc. | Solid state white light emitter and display using same |
US9698313B2 (en) | 1996-03-26 | 2017-07-04 | Cree, Inc. | Solid state white light emitter and display using same |
US9739444B2 (en) | 2007-03-05 | 2017-08-22 | Intematix Corporation | Light emitting diode (LED) based lighting systems |
WO2009041237A1 (ja) | 2007-09-27 | 2009-04-02 | Showa Denko K.K. | Ⅲ族窒化物半導体発光素子 |
US7868340B2 (en) | 2008-05-30 | 2011-01-11 | Bridgelux, Inc. | Method and apparatus for generating white light from solid state light emitting devices |
US10263163B2 (en) | 2008-05-30 | 2019-04-16 | Bridgelux, Inc. | Method and apparatus for generating white light from solid state light emitting devices |
US10204888B2 (en) | 2011-04-13 | 2019-02-12 | Intematix Corporation | LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion |
US9219014B2 (en) | 2011-05-24 | 2015-12-22 | Panasonic Intellectual Property Management Co., Ltd. | Manufacturing method of light emitting elements, and manufacturing apparatus of light emitting elements |
US10557594B2 (en) | 2012-12-28 | 2020-02-11 | Intematix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
US10234725B2 (en) | 2015-03-23 | 2019-03-19 | Intematix Corporation | Photoluminescence color display |
Also Published As
Publication number | Publication date |
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JP2004363635A (ja) | 2004-12-24 |
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