JP3651798B2 - Optical disk manufacturing method and manufacturing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical disk manufacturing method and an optical disk manufacturing apparatus having a plurality of recording surfaces.
[0002]
[Prior art]
Technologies for increasing the recording capacity with optical discs have been developed and spread, and the recording capacity tends to be further increased. For example, there is an optical disk having a four-layer structure and recording two layers from both sides and having a recording capacity of 17 GB called DVD-18. As a method for manufacturing this type of optical disk, for example, there are the following publications.
[Patent Document 1] JP-A-10-283682
[Patent Document 2] Japanese Patent Publication No. 8-23941
In these optical disc manufacturing methods, a stamper is used for each layer in the recording surface manufacturing process, and the interface between the stamper and the adhesive layer is peeled off, and information by pit rows is transferred to the adhesive layer. A reflective film is formed on the surface of the adhesive layer where the pits are formed.
[0003]
In such a manufacturing method, since a plurality of stamper processes must be sequentially performed, the length of all manufacturing processes is increased accordingly. Further, the process using the stamper needs to be strictly managed in a clean room, and it is not efficient to provide the process using the stamper alternately with the bonding process having different process properties.
[0004]
In order to solve such problems, the following disk manufacturing method has been proposed. This manufacturing method uses a disk substrate 1 that finally becomes one side of the optical disk and a dummy disk 2 ′ that is peeled off and removed in a later process, as shown in FIG. The disc substrate 1 is the same as a normal one, and is made of a transparent plastic material such as polycarbonate. A semi-transparent reflection formed by thinly depositing gold and pits 1a for recording information on one surface. A film 1b is provided.
[0005]
The dummy disk 2 ′ is formed by molding a material such as polymethyl methacrylate resin, and has a pit 2′a for recording information and a reflective film 2′b formed by thinly depositing aluminum on one side. This dummy disk 2 ′ has substantially the same shape, size and thickness as the disk substrate 1.
[0006]
The disc substrate 1 and the dummy disc 2 'are bonded to each other through the adhesive layer 3 made of an ultraviolet curable adhesive on the surfaces of the reflective films 1b and 2'b. In this case, the adhesive strength at the interface between the disk substrate 1 and the reflective film 1b is such that the dummy disk 2 'is made of a material such as polymethyl methacrylate resin that is easily peeled off from the reflective film 2'b. Any of the adhesive strength at the boundary between 'and its reflective film 2'b, the adhesive strength at the interface between the adhesive layer 3 and the reflective film 1b of the disk substrate 1, and the adhesive strength at the boundary between the adhesive layer 3 and the reflective film 2'b Smaller and easier to peel off. Reference numeral 4 denotes a central hole between the disk substrate 1 and the dummy disk 2 ′.
[0007]
After the disk substrate 1 and the dummy disk 2 ′ are bonded together in this way, a peeling force is applied between them, and the dummy disk 2 ′ is pulled between the dummy disk 2 ′ and the reflective film 2′b. Remove and remove. In this state, a recording layer 1a such as pits, a reflective film 1b, an adhesive layer 3, a recording layer 2′a, and a reflective film 2′b are sequentially provided on one surface of the disk substrate 1. By bonding two disk substrates having such a structure so that the recording layer and the reflective film are located inside, a DVD having a recording capacity of 17 GB called DVD-18 as described at the beginning can be obtained.
[0008]
However, since it is impossible as a practical problem to sufficiently reduce the adhesive strength at the interface between the dummy disk 2 ′ and the reflective film 2′b, it must be applied between the peeling external force of a certain size or more. Don't be. At this time, it should be a peeling method suitable for mass production without adversely affecting the disk substrate 1 when the dummy disk 2 'is peeled off. The same applies to the case of peeling between the dummy disk and the adhesive or the reflective film and the adhesive as necessary. As techniques for solving such problems, there are patent documents as shown below.
[Patent Document 3] Japanese Patent Application Laid-Open No. 2001-52378
[Patent Document 4] Japanese Patent Application Laid-Open No. 2002-197731
The outline of the techniques disclosed in these patent documents will be described. The disk substrate and the member to be peeled (corresponding to the dummy disk) bonded together by an adhesive are pushed open from the center opening side of the disk. A preliminary peeling process for peeling a part of the member to be peeled from the substrate, and a member to be peeled from the disk substrate by supplying a compressed gas between the disk substrate and the peeled member partially peeled and expanded in the preliminary peeling step. The main feature is that it comprises a peeling step for peeling the film. According to the techniques described in these patent documents, the member to be peeled can be peeled off from the disk substrate reliably in a short time and without damaging the information and the reflective film or information transferred to the adhesive. .
[0009]
[Problems to be solved by the invention]
However, even if the member to be peeled once completely peeled off from the disk substrate, if the compressed gas is stopped immediately in the peeled state, the member to be peeled will be in close contact with the disk substrate and will be peeled off despite being folded or peeled off. It was confirmed that there are many cases where it becomes difficult.
The present invention solves such problems, and an air flow is allowed to flow between the disk substrate and the member to be peeled after peeling, preferably until the member to be peeled is removed from the disk substrate. It is characterized by.
[0010]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the first invention is a compressed gas between a disk substrate and a member to be peeled between the disk substrate and the member to be peeled from the center opening side between the disk substrate and the member to be peeled. In the method of manufacturing an optical disc comprising the step of peeling the member to be peeled from the disc substrate by supplying In order to prevent the peeled member once peeled from coming into close contact with the disc substrate as the disc substrate and the peeled member are peeled, the disc substrate and the peeled material are separated from the compressed gas. Switch to a gas for preventing adhesion that has a flow rate that is higher than the flow rate at which the member is not in close contact, and that has a flow rate that is less than the flow rate at which both or one of the disk substrate and the member to be peeled does not flutter. An optical disc manufacturing method is provided.
[0011]
In a second aspect based on the first aspect, the adhesion preventing gas starts to supply the compressed gas. Until the disk substrate and the member to be peeled are peeled off Provided is a method for producing an optical disc, wherein supply is started when a predetermined time has elapsed.
[0012]
According to a third aspect of the present invention, in the first aspect, the supply of the compressed gas is stopped when it is detected that the member to be peeled is peeled off from the disk substrate. Provide a method.
[0013]
In a fourth aspect based on the first aspect, the member to be peeled off of Provided is a method of manufacturing an optical disc, characterized in that supply of the adhesion preventing gas is started when peeling from the disc substrate is detected.
[0014]
In order to solve the above-mentioned problem, the fifth invention supplies compressed gas between the disk substrate and the member to be peeled from the center opening side between the disk substrate and the member to be peeled bonded together by an adhesive. Then, in the optical disc manufacturing apparatus provided with a peeling means for peeling between the disk substrate and the member to be peeled, after the peeling means starts supplying the compressed gas Set to time setting means When time passes Close the first on-off valve While stopping the supply of the compressed gas, Opening the second on-off valve, the flow rate is not less than the flow rate at which the disk substrate and the member to be peeled are not in close contact, and the flow rate is not greater than the flow rate at which both or one of the disk substrate and the member to be peeled does not flutter. Flow velocity Provided is an optical disc manufacturing apparatus comprising a valve control / drive unit for starting supply of an adhesion preventing gas.
[0015]
In order to solve the above-described problem, the sixth invention supplies compressed gas between the disk substrate and the member to be peeled from the center opening side between the disk substrate and the member to be peeled bonded together by an adhesive. An optical disk manufacturing apparatus having a peeling means for peeling between the disk substrate and the member to be peeled, further comprising a sensor for detecting that the member to be peeled is peeled from the disk substrate. When the peeling is detected, the peeling means stops the supply of the compressed gas, Supplying an adhesion preventing gas at a flow rate not less than a flow rate at which the disk substrate and the member to be peeled are not in close contact with each other and at a flow rate not greater than a flow rate at which both or one of the disk substrate and the member to be peeled does not flutter. Start An optical disk production apparatus characterized by the above is provided.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
1 to 6 are drawings shown in the above-mentioned Patent Document 4 (Japanese Patent Laid-Open No. 2002-197731). Using these drawings, the disk substrate and the member to be peeled off at the time of manufacturing the optical disk according to the present invention are shown. An example of peeling will be described.
[0024]
First, FIG. 1 shows an outline of an overall view of a manufacturing apparatus in which a peeling apparatus is used. Reference numeral 10 denotes a normal bonding of a disk substrate 1 and a member to be peeled 2 with an adhesive layer 3 as shown in FIG. 11 is a turntable having a plurality of functional positions to be described, and 12 is a disk for transferring the bonded disk substrate 1 and peeled member 2 from the bonding apparatus 10 to the disk receiving position 11a of the turntable 11. The transfer mechanism 13 removes the adhesive protruding from between the disc substrate 1 and the member to be peeled 2 when the disc comes from the receiving position 11a to the adhesive removing position 11b as the turntable 11 rotates. Adhesive removal mechanism, 14 is a static elimination / clearance that removes dust and the like adhering to the disk at the cleaning position 11c. Since the disc 15 is transported with the peeled member 2 on the lower side and the disc substrate 1 on the upper side so that the disc is not damaged on the turntable 11 from the receiving position 11a to the reversing position 11d. This is a reversing mechanism that reverses at the reversing position 11d and moves the member 2 to be peeled upward.
[0025]
Next, reference numeral 16 denotes a mechanical pre-peeling mechanism. As will be described in detail later, mechanical force is applied between the disk substrate 1 and the member to be peeled 2 at the pre-peel position 11e so that the inner peripheral portions thereof are moved. Partially peel off. Reference numeral 17 denotes a compressed gas blown between the disk substrate 1 and the member to be peeled 2 to completely peel them off, and supply a gas for preventing adhesion according to the present invention, which will be described later. A gas pressure peeling mechanism for discharging from the peeling position 11f to the recycle box 18, 19 is a static elimination / cleaning mechanism for removing charged charges and dust from the disk at the static elimination position 11g, and 20 is an inner peripheral portion and an outer peripheral portion of the disc substrate 1. This is an adhesive processing mechanism that processes the adhesive so that it does not interfere with the DVD when the two disk substrates 1 are bonded together as described above.
[0026]
Although described in Patent Document 4, a specific configuration of the mechanical preliminary peeling mechanism 16 and a preliminary peeling method will be described below with reference to FIGS. FIG. 2 shows the state of the preliminary peeling position 11e. When the turntable 11 stops at the preliminary peeling position 11e, the disk support 21 and the mechanical preliminary peeling mechanism 16 are lifted through the opening (not shown) of the turntable 11. The disk substrate 1 and the member to be peeled 2 that are bonded to each other on the turntable are supported by the disk holder 21. In this state, the wedge portion 16 a which is the head of the mechanical preliminary peeling mechanism 16 is positioned in the central hole 4 of the disk substrate 1 and the member to be peeled 2. The level of the leading end portion 16a ′ of the wedge portion 16a of the mechanical pre-peeling mechanism 16 is set so as to be within the gap between the disc substrate 1 and the central hole 4 of the member 2 to be peeled.
[0027]
The three wedge parts 16a1, 16a2 and 16a3 capable of expanding and contracting which constitute the main part of the mechanical pre-peeling mechanism 16 each have a planar figure that forms a fan shape that spreads at an angle of 120 degrees. Each of these three wedge portions is integrally formed and supported by the corresponding column portion 16b. The three strut portions 16b are coupled to a normal drive mechanism (not shown) so that the expansion / contraction operation and the ascending / descending operation can be performed. When the three wedge portions 16a1, 16a2, and 16a3 are reduced in diameter, that is, in contact with each other, the maximum diameter of the wedge portions is the center hole 4 of the disc substrate 1 and the member to be peeled 2 and the opening of the disc pedestal 21. It is manufactured to be smaller than the inner diameter. Here, the three wedge portions 16a1, 16a2, and 16a3 shown in FIGS. 3 and 4 have the same configuration and perform the same operation, and therefore are treated as the wedge portion 16a in other drawings for convenience of explanation.
[0028]
When the turntable 11 stops at the preliminary peeling position 11e, although not shown, the three wedge portions 16a having a reduced diameter rise through the openings of the turntable 11 and the disk cradle 21 and the tips 16a of the respective wedge portions 16a are lifted. 2 does not come into contact with the disk substrate 1 and the inner peripheral surfaces 1a and 2a of the member 2 to be peeled off, and is attached to the bonded disk substrate 1 and the substrate supported on the disk support 21 on the turntable as shown in FIG. It stops at a level where the tip 16a 'of the wedge portion is located in the gap X between the peeling member 2. In this state, since suction is performed through the suction passage 22 provided in the disk cradle 21, the disk substrate 1 is attracted to the disk cradle 21 and is stably positioned.
[0029]
Next, the three wedge portions 16a are operated to expand the diameter, that is, radially outward by a driving device (not shown), and the tips 16a 'of the respective wedge portions are moved between the disk substrate 1 and the member 2 to be peeled. It enters the gap X between them and gives a force to spread. As a result, as shown in FIG. 6 in which only the left side of FIG. 5 is enlarged, the adhesive strength at the boundary between the disk substrate 1 and the reflective film 1b and the adhesive strength at the interface between the adhesive layer 3 and the reflective film 1b of the disk substrate 1 are obtained. Further, peeling Y occurs at the inner peripheral portion of the interface between the member to be peeled 2 and the reflective film 2b having a lower adhesive strength than any of the adhesive strengths at the boundary between the adhesive layer 3 and the reflective film 2b.
[0030]
Next, the disk substrate 1 and the member to be peeled 2 mechanically peeled off as described above are completely peeled off by an apparatus as shown in FIG. FIG. 7 is a sectional view thereof. The peeling device 25 is roughly composed of a head 26 and a head pin 27 on which the disk substrate 1 and the member 2 to be peeled are placed. The head 26 is a metallic short cylindrical object having a disk-like upper surface structure similar to a so-called record turntable, and a pressurizing chamber 26A is provided at the center upper part. An inlet 26B that is connected to the pressurizing chamber 26A and functions as an air passage for applying air pressure is provided. On the upper surface of the head 26, there is an annular rim 26C surrounding the pressure chamber 26A, and the center hole 4 of the disk substrate 1 is inscribed on the outer circumference of the rim 26C. An annular relief groove 26D is provided on the outer periphery of the rim 26C. In the disk portion further outside the escape groove 26D, for example, suction holes 26E are vertically penetrating at 45 ° intervals concentrically with the center hole. The bottom portion of the head 26 is tightened with a bolt (not shown) in a mutual fitting portion 29 while forming a vacuum chamber 28, and is airtightly fitted to the base block 30.
[0031]
The head pin 27 is a metallic piece-like object, and has a head portion 27A whose diameter is slightly smaller than the diameter of the central hole 4 of the disk substrate 1 and the member 2 to be peeled, and a shaft portion 27B that supports the head portion 27A. The shaft portion 27B includes a fixing portion 27C that fixes the bottom portion of the pressurizing chamber 26A of the head 26 with a screw portion (not shown). The shaft portion 27 </ b> B is a columnar shape having a diameter smaller than the diameter of the central hole 4 of the disk substrate 1 and the member 2 to be peeled, and forms a pressurizing chamber 26 </ b> A between the vertical inner wall of the head 26.
[0032]
Further, the head portion 27 </ b> A is slidable with respect to the inner peripheral wall of the center hole 4 of the disc substrate 1 and the member to be peeled 2. Therefore, it can be placed on the head 26 from above the head pin 27 through the disk substrate 1 and the central hole 4 of the member 2 to be peeled, and at this time, the head 27A serves as a guide and the member 2 to be peeled off. Since the edge of the center hole is in contact with the head portion 27A, the pressurizing chamber 26A substantially constitutes an airtight chamber.
[0033]
When the member to be peeled 2 is peeled off using the peeling device 25 configured as described above, the disk substrate 1 and the member to be peeled 2 are sucked through the suction holes 26E and sucked and fixed to the upper surface of the head 26. Thereafter, when air pressure of, for example, 3 kg / square centimeter is applied from the first compressed air source (not shown) through the inlet 26B, this compressed air is supplied into the pressurized chamber 26A through the path indicated by the arrow. As can be seen from FIG. 7, the information recording layer and the adhesive layer are not formed on the center hole 4 side of the disk substrate 1 and the member 2 to be peeled by a predetermined dimension from the center hole. A space exists, and the compressed air from the pressurized chamber 26 </ b> A enters the space and acts to expand the space between the disk substrate 1 and the member to be peeled 2 from the center hole side.
[0034]
As described above, the gap Y on the central hole 4 side of the disc substrate 1 and the member to be peeled 2 is already the inner peripheral portion of the interface between the surface of the member to be peeled 2 itself and the reflective film 2b by mechanical preliminary peeling. If the compressed air is supplied thereto, the member to be peeled 2 is easily peeled from the reflective film 2b by the force of the compressed air. This interfacial debonding first delaminates from the delaminated interface in the vicinity of the pressurizing chamber 26A, and then spreads rapidly in a radially outward direction in a substantially concentric manner. Since this peeling is performed by air pressure, the possibility of damaging the reflective film 2b at the interface is extremely small. The above-described peeling is disclosed in the above-mentioned Patent Document 4. However, when the disk substrate 1 and the member to be peeled 2 are easily peeled off, mechanical preliminary peeling is unnecessary, and mechanical peeling is not necessary. Only peeling with a strong force or peeling with a compressed gas may be performed.
[0035]
In addition to the first pressure regulating valve C1 and the first on-off valve D1 provided in the middle of the first gas flow path B1 from the common compressed gas source A shown in FIG. It is supplied to the inlet 26B through the first flow regulating valve F1 and the first filter G1. In the embodiment of the present invention, in addition to the second pressure regulating valve C2 and the second on-off valve D2 provided in the middle of the second gas flow path B2 from the common compressed gas source A, the second The gas for preventing adhesion can be supplied to the inlet 26B through the flow rate adjusting valve F2 and the second filter G2. The first on-off valve D1 and the second on-off valve D2 are controlled to open / close by a signal from the valve control / drive unit E. The first pressure regulating valve C1 and the flow rate regulating valve F1, and the second pressure regulating valve C2 and the flow rate regulating valve F2 are manually adjusted. The pressure gauge H1 so that the pressure of the adhesion preventing gas supplied to the inlet 26B through the second gas flow path B2 is normally lower than the pressure of the compressed gas supplied through the first gas flow path B1. The pressure adjustment valves C1 and C2 are used while adjusting the scale of H2. The adhesion preventing gas is usually air, but may be nitrogen gas or the like.
[0036]
Next, the operation will be described. When the first on-off valve D1 is opened by the signal from the valve control / drive unit E and the compressed gas whose pressure is adjusted by the first pressure regulating valve C1 is supplied from the compressed gas source A to the inlet 26B, By a time setting means (not shown) such as a timer built in the control / drive unit E, a predetermined time (for example, about 1 second) from the time when the first on-off valve D1 is opened, that is, the supply start time of the compressed gas. When the time elapses, the first on-off valve D1 is closed, and the compressed gas is not supplied to the pressurized chamber 26A. The predetermined time K (for example, about 1 second) is a time for which the member to be peeled 2 is peeled from the disk substrate 1 by the compressed gas, and is a time set in advance by an experiment. Therefore, when the predetermined time K elapses, the member to be peeled 2 is peeled from the disk substrate 1, and the compressed gas is not supplied between the disk substrate 1 and the member to be peeled 2.
[0037]
On the other hand, the valve control / drive unit E opens the valve by giving a signal to the second on-off valve D2 at the same time as the predetermined time K elapses by counting the time of the built-in time setting means (not shown). The prevention gas is supplied to the inlet 26B. When the second on-off valve D2 is opened, the second pressure regulating valve C2 is adjusted in advance so as to supply a gas having an appropriate pressure. Here, the adjustment of the second pressure regulating valve C2 and the flow rate regulating valve F2 is performed by applying an adhesion preventing gas more than the degree to which the member to be peeled 2 peeled from the disk substrate 1 does not adhere to the disk substrate 1 to the disk substrate 1. If the flow rate of the adhesion preventing gas is large and the flow velocity is too large, both or one of the disk substrate 1 and the member 2 to be peeled will flutter. Below flow rate that does not cause fluttering of It is performed so that the gas for preventing adhesion can flow. That is, the flow rate of the gas for preventing adhesion flowing between the disk substrate 1 and the member to be peeled 2 is not less than the degree to which the member to be peeled 2 peeled from the disk substrate 1 does not adhere to the disk substrate 1, and It is adjusted to the extent that both or one of 2 does not flutter. If such fluttering occurs, the reflective film or the information layer may be damaged, which is not preferable.
[0038]
Therefore, in this embodiment, when the predetermined time K elapses after the compressed gas is supplied, the gas is switched to the adhesion preventing gas having a lower flow rate and a slower flow rate. However, when it is easy to peel between the disk substrate 1 and the member 2 to be peeled, the pressure of the compressed gas is adjusted to be weak, and the amount of the compressed gas flowing between the disk substrate 1 and the member 2 to be peeled is Since the flow rate is low and the flow rate is naturally low, the disk substrate 1 and the member to be peeled 2 are kept flowing even if the compressed gas continues to flow without closing the first on-off valve D1 until the member to be peeled 2 is removed from the disk substrate 1. When both or one side is not fluttered, it is not always necessary to close the first on-off valve D1 and open the second on-off valve D2 at the same time as described above. There is no need to switch.
[0039]
Thereafter, the base block 30 and the head 26 are lowered by a drive mechanism (not shown), and the disk substrate 1 and the member 2 to be peeled are placed on the turntable 11 in the lowering process. Then, the peeled member 2 that has been peeled off is discharged to the recycle box 18. At this time, the valve control / drive unit E closes the second on-off valve D2 to stop the gas for preventing adhesion that has flowed between the disk substrate 1 and the member to be peeled 2 from the compressed gas source A, or for adhesion. When switching to the gas for prevention is not performed, the 1st on-off valve D1 is closed and the compressed gas with the low pressure which was flowing between the disk substrate 1 and the to-be-separated member 2 from the compressed gas source A is stopped. . As a result, the disk substrate 1 having the reflection film 1b and the reflection film 2b left on the surface of the adhesive 3 is left on the turntable 11, and is sent to the next static elimination / cleaning position 11g.
[0040]
In the embodiment, the mechanical preliminary peeling and the fluid peeling are performed at the same position, and the periphery of the central opening of the disk substrate 1 and the member 2 to be peeled is expanded by a mechanical force by partial peeling by mechanical force. In this state, the compressed gas can be blown between the disk substrate 1 and the member to be peeled 2 to remove the member to be peeled 2 in the same manner.
[0041]
In the above embodiment, switching from the compressed gas to the adhesion preventing gas was performed according to the passage of a predetermined time. However, a pressure sensor (not shown) is provided in the pressurization chamber 26A or in the vicinity of the inlet 26B, and the pressure When the sensor detects an instantaneous drop in pressure, the signal is supplied to the valve control / drive section E, and the valve control / drive section E sends a signal to the first and second on-off valves D1, D2 by the signal. The first on-off valve D1 is closed to stop the supply of the compressed gas, and the second second on-off valve D2 is opened to pass the adhesion preventing gas between the disk substrate 1 and the member 2 to be peeled. It is also possible to prevent the member 2 to be peeled once supplied and from being attached to the disk substrate 1. Here, when the member to be peeled 2 is peeled off from the disk substrate 1, the gas resistance rapidly decreases, so that the pressure in the vicinity of the inlet 26B or in the pressurizing chamber 26A rapidly decreases. The pressure sensor (not shown) detects the sudden decrease in the atmospheric pressure and generates the signal. Also in this embodiment, if the pressure of the compressed gas is low and the flow rate is such that both or one of the disk substrate 1 and the member to be peeled 2 does not flutter, without switching from the compressed gas to the adhesion preventing gas, The compressed gas may flow as it is.
[0042]
Further, in the above embodiment, the adhesive strength at the boundary between the member to be peeled 2 and the reflective film 2b is the adhesive strength at the interface between the adhesive layer 3 and the reflective film 1b of the disk substrate 1, and the adhesive layer 3 and the reflective film 2b. Although the example in which the adhesive strength is smaller than any of the boundary strengths and easily peeled off has been described, the member 2 to be peeled may be a stamper made of a flexible material. In this case, a reflecting film is not formed on the stamper (not shown), and pits for recording information are formed, and the pits are transferred to the adhesive after the stamper is peeled off. . On the surface of the adhesive, if necessary, a reflective layer or one or more recording layers are formed in a subsequent process.
[0043]
【The invention's effect】
As described above, according to the present invention, when a member to be peeled is peeled off in a manufacturing process of an optical disk or the like, the recording film and the reflective film on the disk substrate are automatically and shortly affected without being adversely affected. Since it can be reliably peeled off in time, an optical disc suitable for mass production can be realized.
[Brief description of the drawings]
FIG. 1 is a view for explaining an optical disk manufacturing apparatus including an optical disk preliminary peeling mechanism according to the present invention.
FIG. 2 is a partial cross-sectional view (diameter-reduced state) for explaining an embodiment of an optical disk preliminary peeling mechanism according to the present invention.
FIG. 3 is a top view (diameter-reduced state) for explaining an embodiment of the optical disk preliminary peeling mechanism according to the present invention.
FIG. 4 is a top view (diameter-expanded state) for explaining an embodiment of the optical disk preliminary peeling mechanism according to the present invention.
FIG. 5 is a partial cross-sectional view (diameter-expanded state) for explaining an embodiment of the optical disk preliminary peeling mechanism according to the present invention.
FIG. 6 is a partially enlarged cross-sectional view (diameter-expanded state) for explaining an embodiment of the optical disk preliminary peeling mechanism according to the present invention.
FIG. 7 is a partial cross-sectional view of a gas peeling mechanism for explaining the present invention.
FIG. 8 is a view showing a gas supply mechanism for explaining the present invention.
FIG. 9 is a view showing a cross section of an optical disc.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Disc substrate 2 ... Member to be peeled
3 ... Adhesive 4 ... Center hole of disc
10 ... Laminating device 11 ... Turntable
12 ... Disc transfer mechanism 13 ... Adhesive removal mechanism
14 ... Static elimination / cleaning mechanism 15 ... Reversing mechanism
16 ... Mechanical preliminary peeling mechanism 16 '... Mechanical partial peeling mechanism
16a ... Wedge part 16b ... Post part
17 ... Gas pressure peeling mechanism 18 ... Recycle box
19 ... Static elimination / cleaning mechanism 20 ... Adhesive treatment mechanism
21 ... Disc pedestal 22 ... Suction passage
25 ... peeling device 26 ... head
26A ·· Pressurizing chamber 26A 26B ·· Inlet
26C ・ ・ Rim 26D ・ ・ Escape groove
26E ・ ・ Suction hole
27 ... Head pin 28 ... Vacuum chamber
29 ... Fitting part 30 ... Base block
A1 ... compressed gas source
B1, B2 ... first and second gas flow paths
C1, C2 ... first and second pressure regulating valves
D1, D2 ... First and second on-off valves
E ... Valve control / drive unit
F1, F2 ... Flow rate adjustment valve
G1, G2 ... Filter
H1, H2 ... Pressure gauge

Claims (6)

The compressed gas is supplied between the disk substrate and the member to be peeled between the disk substrate and the member to be peeled bonded together by an adhesive from the center opening side, and the member to be peeled is removed from the disk substrate. In the manufacturing method of the optical disk provided with the process of peeling,
In order to prevent the peeled member once peeled from coming into close contact with the disc substrate as the disc substrate and the peeled member are peeled, the disc substrate and the peeled material are separated from the compressed gas. Production of an optical disc characterized by switching to a gas for preventing adhesion that has a flow rate not less than the flow rate at which the member is not in close contact, and at a flow rate that is not greater than the flow rate at which both or one of the disk substrate and the member to be peeled does not flutter. Method. In claim 1,
The adhesion preventing gas starts to be supplied when a predetermined time elapses from when the compressed gas is supplied to when the disk substrate and the member to be peeled are peeled off . Production method. In claim 1,
A method of manufacturing an optical disc, wherein the supply of the compressed gas is stopped when it is detected that the member to be peeled is peeled from the disc substrate. In claim 1,
Wherein when the peeling is detected from the disc substrate of the peeling member, a manufacturing method of the optical disc, characterized in that the supply of the adhesion-preventing gas is started. Between the disk substrate and the member to be peeled, a compressed gas is supplied between the disk substrate and the member to be peeled from the center opening side between the disk substrate and the member to be peeled bonded together by an adhesive. In an optical disc production apparatus provided with a peeling means for peeling off
When the time set in the time setting means elapses after the peeling means starts supplying the compressed gas , the first on-off valve is closed to stop the supply of the compressed gas, and the second opening / closing Opening the valve to prevent adhesion of the flow rate above the flow rate at which the disk substrate and the member to be peeled do not adhere to each other and the flow rate below the flow rate at which both or one of the disk substrate and the member to be peeled do not flutter. A device for producing an optical disc, comprising a valve control / driving unit for starting supply of a working gas. Between the disk substrate and the member to be peeled, a compressed gas is supplied between the disk substrate and the member to be peeled from the center opening side between the disk substrate and the member to be peeled bonded together by an adhesive. In an optical disc production apparatus provided with a peeling means for peeling off
A sensor for detecting that the member to be peeled is peeled from the disk substrate; and when the sensor detects the peeling, the peeling means stops the supply of the compressed gas, and the disk substrate The supply of the gas for preventing adhesion is started at a flow rate not less than the flow rate at which the member to be peeled is not in close contact, and at a flow rate not higher than the flow rate at which both or one of the disk substrate and the member to be peeled does not flutter. An optical disc production apparatus.

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