JP3565302B2 - Electroless gold plating method - Google Patents
Electroless gold plating method Download PDFInfo
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- JP3565302B2 JP3565302B2 JP30603496A JP30603496A JP3565302B2 JP 3565302 B2 JP3565302 B2 JP 3565302B2 JP 30603496 A JP30603496 A JP 30603496A JP 30603496 A JP30603496 A JP 30603496A JP 3565302 B2 JP3565302 B2 JP 3565302B2
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- JP
- Japan
- Prior art keywords
- gold
- electroless
- gold plating
- plating
- electroless gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【０００１】
【発明の属する技術分野】
本発明は、無電解金めっき方法に関する。
【０００２】
【従来の技術】
従来の無電解金めっき液は、通常、金イオン、金イオンの錯化剤、還元剤、ｐＨ調整剤、安定剤等を含んでおり、安定剤には、ポリエチレングリコール系界面活性剤、鉛イオン、タリウムイオン、窒素含有化合物、硫黄化合物等を用いており、これらの安定剤の働きは、析出表面以外での溶液中の自己分解反応を抑制するものである。
また、従来、接栓端子部やワイヤボンディング用端子部のように硬い素地を必要とする箇所には、下地にニッケルめっきを行った上で金めっきを行っており、通常は、下地ニッケル上に置換金めっき皮膜を形成した後に、上記の組成の無電解金めっき液を用いて、無電解金めっき皮膜を形成している。
【０００３】
【発明が解決しようとする課題】
ところが、無電解金めっき液に、ポリエチレングリコール系界面活性剤等の安定剤を添加した場合、無電解金めっき液の自己分解が抑制されると共にめっき析出も抑制されて、無電解金めっきの析出むらが発生するという課題がある。
【０００４】
本発明は、析出むらの抑制に優れた無電解金めっき方法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明の無電解金めっき方法は、金イオン、金イオンの錯化剤、還元剤、ｐＨ調整剤、ポリエチレングリコール系界面活性剤を含む無電解金めっき液を用いる下地ニッケル上への無電解金めっき方法において、下地ニッケル上に無電解パラジウムめっき皮膜を形成し、無電解パラジウムめっき皮膜上に置換金めっき皮膜を形成し、置換金めっき皮膜上に無電解金めっき皮膜を形成することを特徴とする。
【０００６】
【発明の実施の形態】
本発明のめっき液の金イオン源には、シアン化金カリウム、亜硫酸金ナトリウム、塩化金酸ナトリウム等の水溶性金塩、金イオンの錯化剤には、シアン化物イオン、亜硫酸イオン、チオ硫酸イオン、塩素イオン等の水溶性イオン、還元剤には、水素化ホウ素ナトリウム、ジメチルアミンボラン、ヒドラジン、チオ尿素、アスコルビン酸ナトリウム、ｐＨ調整剤には、水酸化ナトリウム等のアルカリ類、塩酸等の酸類等が使用できる。
【０００７】
ポリエチレングリコール系界面活性剤には、エチレングリコール鎖（−ＣＨ２−ＣＨ２−Ｏ−）を有するものが使用でき、他にこれの水酸基を、アルキルエーテル化したり、燐酸エステル等のエステル等にしたものが使用でき、分子量も１００以上であれば良い。たとえば、ポリエチレングリコール１０００、ポリエチレングリコールモノエチルエーテル２０００、ポリエチレングリコール燐酸エステル等がある。
【０００８】
下地ニッケルには、金属ニッケル、電解ニッケルめっき、無電解ニッケルめっきのうちいずれでも使用でき特に限定しない。
また、無電解パラジウムめっきには、めっき液中のパラジウムイオンを還元剤の働きによって、ニッケル表面にパラジウムを析出させるものであれば使用でき特に限定しない。
置換金めっきには、下地のパラジウムと溶液中の金イオンとの置換反応によって、パラジウム表面に金皮膜を形成するものであれば使用でき、無電解金めっきには、めっき液中の金イオンが金イオンの還元剤の働きによって、金表面に金を析出させるものであれば使用でき、特に限定しない。
【０００９】
【実施例】
実施例
銅張り積層板を穴あけ、スルホールめっき、エッチングレジスト形成、エッチング、はんだレジスト形成後の導体パターンの露出した銅端子上に、以下の処理を行う（いずれも浸漬処理）。
【００１０】
【表１】
比較例
銅張り積層板を穴あけ、スルホールめっき、エッチングレジスト形成、エッチング、はんだレジスト形成後の導体パターンの露出した銅端子上に、以下の処理を行う。
【００１２】
【表２】
実施例１と比較例１で得たプリント配線板の無電解金めっき表面を観察した結果、実施例１は、パターン回路全面が金色であるのに対して、比較例１は部分的に黒色であり析出むらが発生した。
【００１４】
【発明の効果】
このように、本発明の無電解金めっき方法は析出むらのない無電解金めっき皮膜を形成することに優れている。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electroless gold plating method.
[0002]
[Prior art]
Conventional electroless gold plating solutions usually contain gold ions, a complexing agent for gold ions, a reducing agent, a pH adjuster, a stabilizer, and the like. , Thallium ions, nitrogen-containing compounds, sulfur compounds, and the like, and the function of these stabilizers is to suppress self-decomposition reaction in a solution other than at the surface of the deposition.
In addition, conventionally, in places requiring a hard base such as a plug terminal section or a wire bonding terminal section, a gold plating is performed after a nickel plating is performed on a base, and usually, a nickel plating is performed on the base nickel. After forming the displacement gold plating film, the electroless gold plating film is formed using the electroless gold plating solution having the above composition.
[0003]
[Problems to be solved by the invention]
However, when a stabilizer such as a polyethylene glycol-based surfactant is added to the electroless gold plating solution, the self-decomposition of the electroless gold plating solution is suppressed and the plating deposition is also suppressed. There is a problem that unevenness occurs.
[0004]
An object of the present invention is to provide an electroless gold plating method that is excellent in suppressing unevenness in deposition.
[0005]
[Means for Solving the Problems]
The electroless gold plating method of the present invention is a method for electroless gold plating on an underlying nickel using an electroless gold plating solution containing gold ions, a complexing agent for gold ions, a reducing agent, a pH adjuster, and a polyethylene glycol-based surfactant. In the plating method, an electroless palladium plating film is formed on an underlying nickel, a replacement gold plating film is formed on the electroless palladium plating film, and an electroless gold plating film is formed on the replacement gold plating film. I do.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
The gold ion source of the plating solution of the present invention includes water-soluble gold salts such as potassium potassium cyanide, sodium gold sulfite, and sodium chloroaurate, and complexing agents for gold ions include cyanide ion, sulfite ion, and thiosulfate. Ions, water-soluble ions such as chloride ions, reducing agents include sodium borohydride, dimethylamine borane, hydrazine, thiourea, sodium ascorbate, pH adjusters include alkalis such as sodium hydroxide, hydrochloric acid, etc. Acids and the like can be used.
[0007]
As the polyethylene glycol-based surfactant, those having an ethylene glycol chain (—CH 2 —CH 2 —O—) can be used. In addition, the hydroxyl group of the surfactant is converted to an alkyl ether or an ester such as a phosphoric ester. What is necessary is just to be able to use a thing and the molecular weight should be 100 or more. For example, there are polyethylene glycol 1000, polyethylene glycol monoethyl ether 2000, polyethylene glycol phosphate, and the like.
[0008]
As the base nickel, any of metal nickel, electrolytic nickel plating, and electroless nickel plating can be used, and there is no particular limitation.
The electroless palladium plating is not particularly limited as long as it can deposit palladium on the nickel surface by the action of a reducing agent for palladium ions in the plating solution.
For the displacement gold plating, any metal that forms a gold film on the surface of palladium by a substitution reaction between the underlying palladium and gold ions in the solution can be used. For electroless gold plating, gold ions in the plating solution are used. Any material can be used as long as it causes gold to precipitate on the gold surface by the action of the reducing agent of gold ions, and is not particularly limited.
[0009]
【Example】
EXAMPLE The copper-clad laminate was drilled, through-hole plated, formed with an etching resist, etched, and the following processing was performed on the exposed copper terminals of the conductor pattern after the formation of the solder resist (all were immersion processing).
[0010]
[Table 1]
COMPARATIVE EXAMPLE A copper-clad laminate is perforated, through-hole plating, etching resist formation, etching, and the following processing are performed on the exposed copper terminals of the conductor pattern after solder resist formation.
[0012]
[Table 2]
As a result of observing the electroless gold-plated surfaces of the printed wiring boards obtained in Example 1 and Comparative Example 1, in Example 1, the entire pattern circuit was gold, whereas Comparative Example 1 was partially black. Precipitation unevenness occurred.
[0014]
【The invention's effect】
As described above, the electroless gold plating method of the present invention is excellent in forming an electroless gold plating film having no uneven deposition.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30603496A JP3565302B2 (en) | 1996-11-18 | 1996-11-18 | Electroless gold plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30603496A JP3565302B2 (en) | 1996-11-18 | 1996-11-18 | Electroless gold plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10147884A JPH10147884A (en) | 1998-06-02 |
| JP3565302B2 true JP3565302B2 (en) | 2004-09-15 |
Family
ID=17952280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30603496A Expired - Lifetime JP3565302B2 (en) | 1996-11-18 | 1996-11-18 | Electroless gold plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3565302B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8124174B2 (en) | 2007-04-16 | 2012-02-28 | C. Uyemura & Co., Ltd. | Electroless gold plating method and electronic parts |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6485831B1 (en) * | 1999-05-13 | 2002-11-26 | Shin-Etsu Chemical Co., Ltd. | Conductive powder and making process |
| US6136702A (en) * | 1999-11-29 | 2000-10-24 | Lucent Technologies Inc. | Thin film transistors |
| JP2003073847A (en) | 2001-08-29 | 2003-03-12 | Araco Corp | Method for manufacturing bilayer structural material with corrosion resistance |
| JP5526462B2 (en) * | 2006-04-18 | 2014-06-18 | 日立化成株式会社 | Electroless gold plating solution and electroless gold plating method |
| JP6017726B2 (en) * | 2014-08-25 | 2016-11-02 | 小島化学薬品株式会社 | Reduced electroless gold plating solution and electroless gold plating method using the plating solution |
| JP7080781B2 (en) | 2018-09-26 | 2022-06-06 | 株式会社東芝 | Porous layer forming method, etching method, article manufacturing method, semiconductor device manufacturing method, and plating solution |
-
1996
- 1996-11-18 JP JP30603496A patent/JP3565302B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8124174B2 (en) | 2007-04-16 | 2012-02-28 | C. Uyemura & Co., Ltd. | Electroless gold plating method and electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10147884A (en) | 1998-06-02 |
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