JP3502557B2 - Method for manufacturing non-contact IC card - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a contactless IC card, for example, a contactless IC card used for a railway commuter pass, a ski lift ticket, a door entry / exit management card, electronic money and the like. The present invention relates to a manufacturing method.

[0002]

2. Description of the Related Art A non-contact IC card has features such as a large storage capacity and a security function, as well as the convenience of not having to insert the card into a slot of a card reader. In recent years, it has been widely used for railway commuter passes, ski lift tickets, door entry / exit management cards, electronic money, etc.

Non-contact IC cards are classified into a contact type, a proximity type, a proximity type, etc. according to the difference in data communication distance. Generally, data communication is performed by an electromagnetic induction method.
Among them, the proximity-type non-contact IC card that uses a short wave with a frequency of 13.56 MHz is expected to be adopted in railway commuter tickets, telephone cards, etc. in the future, and will be the mainstream of non-contact IC cards.

This non-contact IC card has a coil for an antenna and an IC chip built-in, and transmits / receives to / from the outside through the coil for the antenna. As the coil, a metal foil such as silver foil is etched, or a coil is used. There are copper winding coils and those printed with a conductive paste such as silver paste, but those printed with a conductive paste to form a circuit pattern are widely used.

Hereinafter, a conventional method for manufacturing a non-contact IC card will be concretely shown in FIGS.

As shown in FIG. 14, the conventional non-contact IC card 1 has a polyethylene terephthalate circuit pattern 5 (coil pattern 2 and connection circuit pattern 5b) including an antenna coil pattern for transmission / reception with the outside. It is printed with a conductive paste on the substrate sheet 1a. The electrode portion 4a of the IC chip 3 is mounted and connected to the mounting portion 7a formed on the inner end portion of the coil pattern 2, while the mounting portion 7b formed on the connection circuit pattern 5b has another portion of the IC chip 3 mounted thereon. One electrode part 4b is mounted and connected. The mounting portion 7b is the outer end portion 5 of the coil pattern 2.
It is connected to a through a jumper wire 6.

The manufacturing process of this non-contact IC card 1 is shown in FIG.
5 will be described below with reference to FIGS. 16 and 17.

In step # 1, a circuit pattern 5 including the antenna coil pattern 2 is printed on the surface of the substrate sheet 1a with a conductive paste. The IC chip 3 often has bumps or plating bumps formed by a wire bonding method on electrode portions 4a and 4b provided on the back surface. The line width of the mounting portions 7a and 7b formed so as to correspond to the electrode portions 4a and 4b of the IC chip 3 is 1: 1 or wider than the width of the electrode portions 4a and 4b. For example, when the electrode portions 4a and 4b are 100 μm square, the thickness is 100 to 150 μm. A silver paste is preferably used as the conductive paste. The conductive paste is printed by screen printing, offset printing, gravure printing, or the like, and is formed, for example, by a method in which the thickness of the emulsion is 10 μm through a 165 mesh / inch mask.

At step # 2, components such as the IC chip 3 and the jumper wire 6 are mounted. The electrode parts 4a and 4b of the IC chip 3 are respectively formed on the substrate sheet 1 as shown in FIG.
It is mounted on the mounting portions 7a and 7b of the circuit pattern formed on a.

In step # 3, the conductive paste is hardened to fix the component mounted in step # 2.

In step # 4, a cover sheet 1b made of polyethylene terephthalate is made to face the substrate sheet 1a constructed as described above as shown in FIG. 17, and a card is formed by a laminating process in which heat and pressure are applied.

FIG. 18 shows the finished shape of the non-contact IC card 1 manufactured as described above. The jumper wire 6 has a covering portion 6a in which an intermediate portion of a conducting portion made of a conductor is covered with an insulator, the conducting portion 6b is exposed at both ends, and the thickness thereof is about 0.1 mm. Stuff used.

The contactless IC card 1 usually does not have a built-in battery, and receives radio waves from the outside by the antenna coil pattern 2 and uses the induced power to process information by the IC chip 3. Information is exchanged with the card reader.

[0014]

However, the above conventional non-contact IC card manufacturing method has the following problems.

As shown in FIGS. 17 and 18, the cover sheet 1b is opposed to the substrate sheet 1a on which components such as the IC chip 3 and the jumper wires 6 are mounted, and the card is formed by the laminating process as described above. At this time, the IC chip 3 sinks into the softened substrate sheet 1a due to heat and pressure, and the mounting portions 7a and 7b of the circuit pattern formed by the conductive paste are deformed to contact the end faces 3a and 3a of the IC chip 3. Resulting in. Therefore, the mounting portion 7a,
Since a current leaks from the end surface 3a of the IC chip 3 from 7b, there is a problem that the card cannot operate or malfunctions.

Therefore, the present invention solves the above problems and prevents the occurrence of current leakage caused by the sinking of the IC chip into the substrate sheet during the laminating process.
It is intended to manufacture a high-quality non-contact IC card with high productivity.

[0017]

In order to achieve the above object, a first invention of the present application is a circuit pattern including an antenna coil pattern electrically connected to an electrode portion of an IC chip by a conductive paste on a substrate sheet. Is printed, an IC chip is mounted so that the electrode portion is connected to the circuit pattern, the conductive paste is cured, and then a cover sheet is placed on a substrate sheet to form a card by a laminating step in which heat and pressure are applied. In the method of manufacturing a non-contact IC card to be performed, in the mounting range of the IC chip on the substrate sheet,
A backup pattern that is not electrically connected to the electrode portion and that backs up the IC chip in order to prevent the IC chip from sinking into the substrate sheet during the laminating step is formed by printing with a conductive paste. .

According to the first aspect of the present invention, even if the cover sheet presses the substrate sheet during the laminating step, the back surface of the cover sheet is supported by the backup pattern formed on the substrate sheet, so that the IC chip is softened by heat. It is possible to easily manufacture a high-quality card in which no current leaks from the circuit pattern to the end surface of the IC chip without sinking.

In order to achieve the above object, the second invention of the present application mounts an IC chip after printing the circuit pattern on the substrate sheet, cures the conductive paste, and then forms a card by the laminating step. In a method of manufacturing a contact IC card, when a circuit pattern is printed on a substrate sheet, the IC chip is mounted on the substrate sheet so that both ends of the circuit pattern corresponding to a pair of electrode portions of the IC chip do not contact each other. It is characterized in that printing is performed in a wide area in each range.

According to the second aspect of the present invention, even if the cover sheet presses the substrate sheet during the laminating step, the cover sheet is covered by the pair of circuit pattern end portions formed in a large area corresponding to the mounting range of the IC chip. Since the back surface of the sheet is supported, the IC chip does not sink into the heat-softened substrate sheet, and a high-quality card in which no current leaks from the circuit pattern to the end surface of the IC chip can be easily manufactured.

In order to achieve the above object, a third invention of the present application mounts an IC chip after printing the circuit pattern on a substrate sheet, cures a conductive paste, and then forms a card by the laminating step. In the method of manufacturing a contact IC card, after a circuit pattern is printed, an insulating resin made of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting resin and thermoplastic resin is applied to a mounting area of an IC chip on a substrate sheet. Then, after mounting the IC chip so that the electrode portion is connected to the circuit pattern, the insulating resin is simultaneously cured when the conductive paste is cured.

Further, in order to achieve the above object, in the fourth invention, an insulating adhesive sheet is similarly arranged instead of applying the insulating resin.

In order to achieve the above-mentioned object, the fifth invention of the present application mounts an IC chip after printing the circuit pattern on the substrate sheet, cures the conductive paste, and then forms a card by the laminating step. In the method of manufacturing a contact IC card, after the conductive paste is cured, a thermosetting system is applied to a mounting area of the IC chip on the substrate sheet.
Alternatively, an insulating resin made of thermoplastic resin or a mixed resin of thermosetting and thermoplastic is applied to fill the insulating resin in the gap between the substrate sheet and the IC chip, and then the insulating resin is cured. And then the laminating step
It is characterized by making a card by.

In order to achieve the above-mentioned object, the sixth invention of the present application mounts an IC chip after printing the circuit pattern on the substrate sheet, cures the conductive paste, and then forms a card by the laminating step. In the method of manufacturing the contact IC card, after mounting the IC chip so that the electrode portion is connected to the circuit pattern, the I
By applying an insulating resin made of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting and thermoplastic to the mounting area of the C chip, the insulating resin is applied between the substrate sheet and the IC chip. It is characterized in that the insulating resin is simultaneously cured when filling the gap and curing the conductive paste.

According to the third invention to the sixth invention, even if the cover sheet presses the substrate sheet during the laminating step, the insulating material filled in the mounting area of the IC chip supports the back surface of the cover sheet, so that the IC The chip does not sink into the softened substrate sheet due to heat, and there is no leakage of current from the circuit pattern to the IC chip end surface. Even if a sink occurs, it will be between the circuit pattern and the IC chip. Depending on the intervening insulating material, I
It is possible to easily manufacture a high-quality card in which current leakage does not occur at the end surface of the C chip.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 13.

The non-contact IC card 11 of this embodiment has a basic structure other than printing a backup pattern 9 for backing up the IC chip 3 in order to prevent the IC chip 3 from sinking into the substrate sheet 1a during the laminating process. The same as the non-contact IC card 1 shown in the conventional example.
That is, the completed non-contact IC card 11 shown in FIG.
Includes an IC chip 3 and an antenna coil for transmitting / receiving to / from the outside, and includes an antenna coil pattern electrically connected to the electrode portions 4a and 4b of the IC chip 3 with a conductive paste on the substrate sheet 1a. The circuit pattern 5 (coil pattern 2 and connection circuit pattern 5b) is printed, the IC chip 3 is mounted so that the electrode portions 4a and 4b are connected to the mounting portions 7a and 7b of the circuit pattern 5, and the conductive paste is cured. After that, the cover sheet 1b is overlaid on the substrate sheet 1a, and a card is formed by a laminating process in which heat and pressure are applied.

The substrate sheet 1a and the cover sheet 1b are made of polyethylene terephthalate, vinyl chloride, polycarbonate, acrylonitrile butadiene styrene, etc. and have a thickness of about 0.1 mm to 0.5 mm. A silver paste is preferably used as the conductive paste. The conductive paste is printed by screen printing, offset printing, gravure printing, etc.
Increase the emulsion thickness to 10 through a 5 mesh / inch mask.
It is formed by a method of setting the thickness to μm. The jumper wire 6 has a covering portion 6a in which an intermediate portion of a conducting portion made of a conductor is covered with an insulator, and the conducting portion 6b is exposed at both ends, and the thickness thereof is about 0.1 mm. used.

1 to 6 show a first embodiment of the present invention. The feature of the first embodiment is that it diagonally faces the mounting range of the IC chip 3 on the substrate sheet 1a.
The backup pattern 9 that is not electrically connected to the two electrode portions 4a and 4b is formed by the conductive paste.

The manufacturing process of this non-contact IC card 11 is shown in FIG. The steps other than the step of forming the backup pattern 9 are the same as in the conventional example.

In step # 1, the circuit pattern 5 including the antenna coil pattern 2 is printed on the surface of the substrate sheet 1a with a conductive paste. As shown in FIG. 3, the IC chip 3 often has bumps or plated bumps formed by a wire bonding method on the electrode portions 4a and 4b provided on the back surface. The electrode portion 4a of the IC chip 3,
The line width of the mounting portions 7a and 7b formed on the substrate sheet 1a so as to correspond to 4b is 1 times the width of the electrode portions 4a and 4b.
It is formed to be 1 or wider.

In step # 2, as shown in FIG. 4, the backup pattern 9 which is not electrically connected to the electrode portions 4a and 4b is located inside the mounting portions 7a and 7b by a method such as potting and dispensing with a conductive paste. To form a rectangular shape. The process of step # 2 may be performed at the time of step # 1, that is, simultaneously with the printing of the circuit pattern 5.

In step # 3, components such as the IC chip 3 and the jumper wire 6 are mounted.

The electrode portions 4a and 4b of the IC chip 3 are mounted on the mounting portions 7a and 7b formed on the substrate sheet 1a, respectively, as shown in FIG.

In step # 4, the conductive paste is hardened to fix the component mounted in step # 3.

In step # 5, a card is formed by a laminating process in which the cover sheet 1b is opposed to the substrate sheet 1a configured as described above and heat and pressure are applied.

FIG. 6 shows the finished shape of the non-contact IC card 11 manufactured as described above. In addition, the first
The contactless IC card 11 shown in the embodiment is different from the one shown in FIG. 17 shown in the conventional example in that the backup pattern 9 that is not electrically connected to the electrode portions 4a and 4b is applied to the IC chip 3 during the laminating process. Since the IC chip 3 does not sink after being made into a card, it does not cause current leakage from the circuit pattern mounting portions 7a and 7b to the end faces 3a and 3a of the IC chip 3 in order to receive the high quality. The non-contact IC card 11 can be manufactured.

FIG. 7 shows a second embodiment of the present invention. The feature of the second embodiment is that when the circuit pattern 5 is printed on the substrate sheet 1a, the inner end of the antenna coil pattern 2 having the mounting portion 7a and the inner end of the connecting circuit pattern 5b having the mounting portion 7b. That is, the extended patterns 8 and 8 are formed by printing in a wide area so as to substantially correspond to the mounting range of the IC chip 3 on the substrate sheet 1a within a range where they do not contact each other. In the second embodiment, since the expansion patterns 8 and 8 play a role of receiving the pressure applied to the IC chip 3 during the laminating step, there is no sinking of the IC chip 3 after forming the card, and the circuit pattern mounting portion 7a. , 7b to the end face 3a of the IC chip 3 without producing a current leak, a high quality card can be manufactured.

8 to 10 show a third embodiment of the present invention. A feature of the third embodiment is that after the circuit pattern 5 is printed, the mounting range of the IC chip 3 on the substrate sheet 1a and its vicinity are made of a thermosetting system, a thermoplastic resin, or a thermosetting-thermoplastic mixed resin. That is, the insulating resin was applied and cured after mounting the IC chip 3. still,
Instead of applying the insulating resin, an insulating adhesive sheet made of the same mixed resin may be arranged.

FIG. 9 illustrates the manufacturing process when the insulating resin is applied. In step # 1, substrate sheet 1
The circuit pattern 5 including the antenna coil pattern 2 is printed on the surface of a with a conductive paste. In step # 2, the insulating resin 10 as described above is applied by a method such as potting or dispensing. In step # 3, components such as the IC chip 3 and the jumper wire 6 are mounted. In step # 4, conductive paste and insulating resin 1
0 is hardened and the parts mounted in step # 3 are fixed. In step # 5, a card is formed by a laminating process in which the cover sheet 1b is superposed on the substrate sheet 1a configured as described above and heat and pressure are applied. The finished shape of the non-contact IC card 1 manufactured as described above is shown in FIG.

11 and 13 (the same applies to the fifth embodiment).
Shows a fourth embodiment of the present invention. In the fourth embodiment, as shown in FIG. 13, after mounting the IC chip 3, the insulating resin 10 is applied to the mounting range of the IC chip 3 and its vicinity so as to cover the entire outer surface thereof. I am. The material of this insulating resin 10 is the same as that of the third embodiment.

The manufacturing process will be described with reference to FIG. In step # 1, the circuit pattern 5 including the antenna coil pattern 2 is printed on the surface of the substrate sheet 1a with a conductive paste. In step # 2, components such as the IC chip 3 and the jumper wire 6 are mounted. In step # 3, the conductive paste is hardened, and in step # 4, the insulating resin 10 is applied by a method such as potting or dispensing. In step # 5, the insulating resin 10 is cured to fix the component mounted in step # 2. In step # 6, the substrate sheet 1a configured as described above is used.
The cover sheet 1b is overlaid on and the lamination is performed by applying heat and pressure to form a card. In the fourth embodiment, the curing of the insulating resin 10 in step # 5 is
It can be performed at the same time as the laminating step, and the productivity is improved.

As in the fifth embodiment of the present invention shown in FIG. 12, the conductive paste is cured by applying the insulating resin 10 in step # 3 and then simultaneously curing the insulating resin 10 in step # 4. It can also be done and productivity is improved.

FIG. 13 shows the finished shape of the non-contact IC card 11 manufactured in the fourth and fifth embodiments.

[0045]

According to the present invention, when a cover sheet is overlaid on a substrate sheet and a card is formed by a laminating process, the backup pattern and the end portions of the circuit pattern formed in a large area support the back surface of the cover sheet. It is possible to easily manufacture a high-quality card in which the IC chip does not sink into the substrate sheet softened by heat and leakage of current from the circuit pattern to the end surface of the IC chip does not occur. Further, by applying an insulating resin or arranging an insulating adhesive sheet in the mounting area of the IC chip on the substrate sheet, even if the above-mentioned depression occurs during the laminating step, the circuit pattern and the IC chip Since the insulating material is interposed between them, it is possible to completely prevent the occurrence of the above-mentioned current leakage.

[Brief description of drawings]

FIG. 1 is a plan view showing a substrate sheet side of a non-contact IC card according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing a manufacturing process of the same embodiment.

FIG. 3 is a plan view showing the back surface of the IC chip in the same embodiment.

FIG. 4 is a plan view showing a pattern on a substrate sheet according to the same embodiment.

FIG. 5 is a plan view of an essential part showing a mounted state of the IC chip in the same embodiment.

FIG. 6 is a vertical sectional side view of the non-contact IC card according to the same embodiment.

FIG. 7 is a plan view showing a main part of a second embodiment of the present invention.

FIG. 8 is a plan view showing a main part of a third embodiment of the present invention.

FIG. 9 is a flowchart showing a manufacturing process of the same embodiment.

FIG. 10 is a vertical cross-sectional side view of the non-contact IC card according to the same embodiment.

FIG. 11 is a flowchart showing manufacturing steps of the fourth embodiment of the present invention.

FIG. 12 is a flowchart showing manufacturing steps of the fifth embodiment of the present invention.

FIG. 13 is a vertical sectional side view of a non-contact IC card according to fourth and fifth embodiments.

FIG. 14 is a plan view showing a substrate sheet side of a non-contact IC card in a conventional example.

FIG. 15 is a flowchart showing manufacturing steps in a conventional example.

FIG. 16 is a plan view of a main part showing a mounted state of an IC chip of a non-contact IC card in a conventional example.

FIG. 17 is a vertical sectional side view showing a superposed state of a conventional non-contact IC card.

FIG. 18 is a vertical sectional side view of a conventional non-contact IC card.

[Explanation of symbols]

1a Substrate sheet 1b cover sheet 2 Antenna coil pattern 3 IC chips 4a, 4b Electrode part 5 circuit patterns 5b connection circuit pattern 6 jumper wires 7a, 7b mounting part 8 expansion patterns 9 backup patterns 10 Insulating resin 11 Non-contact IC card

─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Yutaka Harada 1-1 Sachimachi, Takatsuki City, Osaka Prefecture Matsushita Electronics Industrial Co., Ltd. (72) Shinji Murakami 1-1 Sachimachi, Takatsuki City, Osaka Matsushita Electronics Within Kogyo Co., Ltd. (56) Reference JP-A-9-8179 (JP, A) JP-A-10-211784 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G06K 19 / 00-19/18 H01L 21/60 H05K 3/46

Claims (12)

(57) [Claims] 1. A circuit pattern including a coil pattern for an antenna electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected so that the electrode portion is connected to the circuit pattern. In the method of manufacturing a non-contact IC card in which a conductive sheet is mounted, the conductive paste is cured, a cover sheet is placed on the substrate sheet, and a card is formed by a laminating process in which heat and pressure are applied. In addition, a backup pattern for backing up the IC chip is printed and formed by a conductive paste to prevent the IC chip from sinking into the substrate sheet during the laminating process without being electrically connected to the electrode portion. And a method for manufacturing a non-contact IC card. 2. The method for producing a non-contact IC card according to claim 1, wherein the printing of the backup pattern is performed simultaneously with the printing of the circuit pattern on the substrate sheet. 3. A circuit pattern including a coil pattern for an antenna electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected so that the electrode portion is connected to the circuit pattern. In the manufacturing method of the non-contact IC card, the circuit pattern is printed on the substrate sheet in which the cover sheet is mounted on the substrate sheet, the cover sheet is overlaid on the substrate sheet, and a card is formed by a laminating process in which heat and pressure are applied. At this time, both ends of the circuit pattern corresponding to the pair of electrode parts of the IC chip are printed and formed in a wide area in the mounting range of the IC chip on the substrate sheet so as not to contact each other. IC card manufacturing method. 4. A circuit pattern including a coil pattern for an antenna electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected so that the electrode portion is connected to the circuit pattern. In the method for manufacturing a non-contact IC card in which the circuit board is mounted, the conductive paste is hardened, the cover sheet is overlaid on the substrate sheet, and a card is formed by a laminating process in which heat and pressure are applied. IC in the seat
Insulating resin consisting of thermosetting resin, thermoplastic resin, or mixed resin of thermosetting and thermoplastic resin is applied to the mounting area of the chip, and after mounting the IC chip so that the electrode portion is connected to the circuit pattern, A method for manufacturing a non-contact IC card, which comprises simultaneously curing an insulating resin when curing a conductive paste. 5. A circuit pattern including an antenna coil pattern electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected so that the electrode portion is connected to the circuit pattern. In the method for manufacturing a non-contact IC card in which the circuit board is mounted, the conductive paste is hardened, the cover sheet is overlaid on the substrate sheet, and a card is formed by a laminating process in which heat and pressure are applied. IC in the seat
An insulating adhesive sheet made of thermosetting resin, thermoplastic resin, or mixed resin of thermosetting resin and thermoplastic resin is arranged in the chip mounting area, and the IC chip is mounted so that the electrode portion is connected to the circuit pattern. After that, when the conductive paste is cured, the insulating adhesive sheet is simultaneously cured, which is a method for manufacturing a non-contact IC card. 6. A circuit pattern including a coil pattern for an antenna electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected so that the electrode portion is connected to the circuit pattern. In a method for manufacturing a non-contact IC card in which a conductive paste is cured, a cover sheet is placed on a substrate sheet, and a card is formed by a laminating process in which heat and pressure are applied, after curing the conductive paste, I in the substrate sheet
By applying an insulating resin made of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting and thermoplastic to the mounting area of the C chip, the insulating resin is applied between the substrate sheet and the IC chip. After filling the gap, the insulating resin is cured , and then the laminating process is used to make a card.
Contactless IC card manufacturing method, characterized in that the Hare. 7. An IC chip is formed on a substrate sheet with a conductive paste.
Antenna coil pattern that is electrically connected to the electrode section
Printed circuit pattern, and the electrode part
The IC chip is mounted to connect with the road pattern
After curing the conductive paste, cover sheet on the substrate sheet
By laminating process of overlapping and applying heat and pressure
In a method for manufacturing a non-contact IC card for card formation, after the conductive paste is cured, the I
In the mounting range of C chip, thermosetting type or thermoplastic type,
Insulating resin consisting of mixed resin of thermosetting and thermoplastic
By applying this insulating resin to the substrate sheet
After filling in the gap between the IC chip and the laminate
A method for manufacturing a non-contact IC card, which comprises curing an insulating resin during a process. 8. A circuit pattern including an antenna coil pattern electrically connected to an electrode portion of an IC chip is printed on a substrate sheet with a conductive paste, and the IC chip is connected so that the electrode portion is connected to the circuit pattern. In the method for manufacturing a non-contact IC card in which the conductive paste is hardened, the cover sheet is overlaid on the substrate sheet, and a card is formed by a laminating process in which heat and pressure are applied, the electrode portion is connected to the circuit pattern. After mounting the IC chip as described above, by applying an insulating resin made of a thermosetting resin, a thermoplastic resin, or a mixed resin of thermosetting and thermoplastic to the mounting area of the IC chip on the substrate sheet, the insulation The gap between the substrate sheet and the IC chip with a conductive resin, and the insulating resin is simultaneously cured when the conductive paste is cured. Contactless IC card manufacturing method, characterized in that. 9. The non-contact type I according to claim 6, wherein the insulating resin is applied so as to cover the outer surface of the IC chip.
C card manufacturing method. 10. A substrate sheet is provided with a circuit pattern electrically connected to an electrode portion of an IC chip, and the substrate sheet has an IC chip mounted so as to be connected to the circuit pattern. In a non-contact IC card in which a cover sheet is laminated and laminated, a backup pattern which is not electrically connected to the electrode portion is formed by a conductive paste in a mounting area of the IC chip on the substrate sheet. Contact IC card. 11. A substrate sheet is formed with a circuit pattern electrically connected to an electrode portion of an IC chip, and the substrate sheet has an IC chip mounted so as to be connected to the circuit pattern. In a non-contact IC card in which cover sheets are laminated and laminated, both ends of the circuit pattern corresponding to a pair of electrodes of the IC chip are formed in wide areas in the mounting range of the IC chip on the substrate sheet. A non-contact IC card characterized by the following. 12. A substrate sheet is provided with a circuit pattern which is electrically connected to an electrode portion of an IC chip, and an IC chip mounted so that the electrode portion is connected to the circuit pattern. In a non-contact IC card laminated with a cover sheet laminated, an insulating resin portion made of a thermosetting resin, a thermoplastic resin, or a mixed resin of a thermosetting resin and a thermoplastic resin is formed in the mounting area of the IC chip on the substrate sheet. A non-contact IC card characterized by being processed.