JP3481016B2 - Terminal for optical fiber array and terminal for optical fiber array equipped with optical semiconductor chip array - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical fiber array terminal for introducing and supporting an optical fiber array into a package space for accommodating an optical semiconductor chip array, and mounting the optical semiconductor chip array on the terminal. The present invention relates to an optical fiber array terminal equipped with the optical semiconductor chip array.

[0002]

2. Description of the Related Art Optical fiber arrays 10 as shown in FIGS. 11A and 11B are often used for optical communication cables of optical communication equipment. The optical fiber array 10 has a ribbon shape and has a structure in which a plurality of optical fibers 10a are arranged side by side and bundled. The optical fiber 10a has a structure in which a fiber core 10b made of a glass material having a predetermined refractive index is coated with a clad 10c made of glass materials having different refractive indexes. The plurality of optical fibers 10a of the optical fiber array 10 are integrally covered with a resin material 10d so as to be bundled.

In an optical communication device, as shown in FIG. 9 or 10, the resin material 10d that covers the periphery of the end portion of the optical fiber array 10 is removed, and the optical fiber 10a is attached to the end portion of the optical fiber array 10. Exposed. The optical fiber 10 exposed at the end of the optical fiber array 10
a is introduced from the outside of the package 30 into the space inside the package 30. Then, the optical fiber 10a is arranged facing the optical semiconductor chip array 20 in which the light emitting elements or the light receiving elements housed in the package 30 are arranged side by side,
The optical axes of the optical fiber 10a and the light receiving element or the light emitting element (not shown) of the optical semiconductor chip array 20 facing the optical fiber 10a are aligned with each other.

At this time, using the optical fiber array terminal 40 as shown in FIG. 9 or 10, the optical fiber 10a is introduced into the package 30 through the introduction port 32 opened in the package 30 at a predetermined portion. Introduced and supported by. The optical fiber array terminal 40 is made of a metal material and is formed separately from the package 30. Then, the flange 42 of the end 40 is joined to the portion of the package 30 made of a metal material around the inlet 32 by laser welding or the like. A light transmission plate 50 such as a glass plate is attached to the inner surface of the package 30 located between the optical fiber array 10 and the optical semiconductor chip array 20, and an introduction port 32 opened in the package 30 is provided from the inside. Light transmission plate 5
It is airtightly covered with 0. And the airtightness of the space inside the package 30 is maintained.

Optical fiber 1 introduced in package 30
The front end surface of 0a is obliquely cut, as shown in FIG. The light emitted from the light emitting elements of the optical semiconductor chip array 20 is prevented from being reflected by the tip surface of the optical fiber 10a and causing mutual interference with the light emitted from the light emitting elements of the optical semiconductor chip array 20. .

[0006]

However, when the optical fiber 10a is introduced and supported in the internal space of the package 30 by using the terminal 40, the flange 42 of the terminal 40 is provided.
When joined to the package 30 portion made of a metal material by laser welding or the like, a stress due to a difference in thermal expansion coefficient between the package 30 and the flange 42 is generated between the package 30 and the flange 42 due to thermal influence of welding or the like. Under stress, package 30
Is distorted. Then, the positional relationship between the optical fiber 10a introduced and supported in the space inside the package 30 by using the terminal 40 and the optical semiconductor chip array 20 housed in the package 30 is out of order. And the optical fiber 10a
The optical axis of the light receiving element or the light emitting element of the optical semiconductor chip array 20 opposite to the optical axis is deviated, and the light cannot be efficiently transmitted without leaking between the optical fiber 10a and the optical semiconductor chip array 20. I got it.

In addition, when the optical fiber 10a is introduced and supported in the internal space of the package 30 by using the terminal 40, the light transmitting plate 50 is interposed between the optical fiber 10a and the optical semiconductor chip array 20. Since the optical fiber 10a cannot be brought close to the optical semiconductor chip array 20, it is extremely difficult to align the optical axis of the optical fiber 10a with the light receiving element or the light emitting element of the optical semiconductor chip array 20 facing the optical fiber 10a. Further, a space for arranging the light transmitting plate 50 is required between the optical fiber 10a and the optical semiconductor chip array 20, and the optical communication module cannot be made compact.

The present invention has been made in view of the above problems, and the optical axis of the optical fiber introduced into the space in the package is set to the optical axis of the light receiving element or the light emitting element of the optical semiconductor chip array which is housed in the package. A terminal for an optical fiber array that can be easily and accurately matched, and a terminal for an optical fiber array (hereinafter, referred to as a terminal) that can make an optical communication module compact, and an optical semiconductor chip array mounted on the terminal. It is an object of the present invention to provide an optical fiber array terminal equipped with the semiconductor chip array (hereinafter, referred to as a terminal equipped with an optical semiconductor chip array).

[0009]

In order to achieve the above-mentioned object, the terminal of the present invention is a fixing device which introduces the introduction port opened in the package into the space inside the package through the introduction port inside the flange which covers the introduction port from the outside. A table is provided, a guide table is extended to the outside of the flange, the optical fiber exposed at the end of the optical fiber array is inserted into the guide hole opened in the flange, and the optical fiber is attached to the fixed table surface. While supporting, the optical fiber array connected to the rear part of the optical fiber is supported on the guide table surface, and the periphery of the optical fiber inserted in the guide hole is hermetically sealed to the inner peripheral wall of the guide hole, and the optical fiber is attached to the optical fiber. The optical fiber is sandwiched between the pressing member and the fixed table by covering the pressing member with the optical semiconductor chip array facing the end of the optical fiber. Thereby the mounting surface to mount is characterized in that provided in the pressing member.

In the terminal of the present invention, it is preferable that a groove is provided on the surface of the pressing member facing the fixed table and an optical fiber is fitted in the groove.

Further, it is preferable that the pressing member is joined to the fixed table.

Further, it is preferable that the fixed table surface and the guide table surface are located substantially on the same plane, and a guide hole is opened in a flange portion near the fixed table surface and the guide table surface. There is.

Further, the flange may be provided with a connection terminal for electrically connecting the inside and the outside of the flange.

The terminal on which the optical semiconductor chip array of the present invention is mounted is characterized in that the optical semiconductor chip array is mounted on the mounting surface of the pressing member of the terminal so as to face the end of the optical fiber.

In the terminal on which the optical semiconductor chip array of the present invention is mounted, it is preferable that the optical semiconductor chip array is mounted on the mounting surface of the pressing member via the subcarrier.

[0016]

In the terminal of the present invention, since the mounting surface for mounting the optical semiconductor chip array is provided on the pressing member sandwiching the optical fiber, the optical semiconductor chip array is brought close to the optical fiber and mounted on the mounting surface of the pressing member. Can be mounted. Then, the optical axis of the light receiving element or the light emitting element of the optical semiconductor chip array can be easily and accurately aligned with the optical axis of the optical fiber.

Further, the periphery of the optical fiber inserted through the guide hole is hermetically sealed to the inner peripheral wall of the guide hole, and the gap between the periphery of the optical fiber and the inner peripheral wall of the guide hole is hermetically sealed with a bonding material. Since it is sealed, it is possible to prevent the airtightness between the inside and the outside of the flange from being impaired through the guide hole.

Further, in the terminal of the present invention in which a groove is provided on the surface of the pressing member facing the fixed table and the optical fiber is fitted in the groove, the optical fiber is fixed in the groove on the surface of the pressing member. Can be fitted and locked.

Further, in the terminal of the present invention in which the pressing member is joined to the fixed table, when the pressing member and the fixed table are made of a metal material, the pressing member made of the metal material is fixed by the metal material. Can be electrically connected to the table.

Further, in the terminal of the present invention in which the fixed table surface and the guide table surface are located substantially on the same plane and the guide hole is opened in the flange portion near the fixed table surface and the guide table surface. The optical fiber inserted through the guide hole can be stably supported on the surface of the fixed table near the guide hole with a small gap. At the same time, the optical fiber array connected to the rear portion of the optical fiber can be stably supported on the surface of the guide table near the guide hole with a small gap.

Further, in the terminal of the present invention in which the flange is provided with the connection terminal for electrically connecting the inside and the outside of the flange, the optical communication of the optical semiconductor chip array, the semiconductor chip and the like arranged inside the flange is provided. The component can be electrically connected to an electronic circuit arranged outside the flange through a connection terminal provided on the flange.

In the terminal on which the optical semiconductor chip array of the present invention is mounted, the optical semiconductor chip array is packaged together with the pressing member having the mounting surface on which the optical semiconductor chip array is mounted, the fixed table and the optical fiber sandwiched between them. It can be introduced into the internal space of the package through the opened introduction port. Then, the introduction port can be covered with a flange from the outside, the flange can be joined to the package portion around the introduction port by welding or the like, and the introduction port can be hermetically sealed with the flange. Then, the optical semiconductor chip array and the optical fiber can be hermetically sealed in the internal space of the package. Further, it is possible to prevent the optical semiconductor chip array and the optical fiber from being adversely affected by dust and moisture.

Further, when the flange is joined to the package portion around the inlet by welding or the like, stress is generated between the flange and the package due to the difference in thermal expansion coefficient between the flange and the package due to the thermal influence of welding or the like. Even if the package is distorted, since the optical fiber and the optical semiconductor chip array are both supported on the same fixed table or mounted via the pressing member, the positional relationship between the optical fiber and the optical semiconductor chip array may change. Can be prevented. Then, it is possible to prevent the optical axis of the light receiving element or the light emitting element of the optical semiconductor chip array from deviating from the optical axis of the corresponding optical fiber.

Further, in a terminal equipped with the optical semiconductor chip array of the present invention in which the optical semiconductor chip array is mounted on the mounting surface of the pressing member via the subcarrier,
The bottom surface of the optical semiconductor chip array can be die-bonded at a low temperature by using gold-tin eutectic solder as a subcarrier while applying vibration to the optical semiconductor chip array. Then, when the optical semiconductor chip array is bonded to the subcarrier, it is possible to prevent the optical semiconductor chip array from receiving high heat and being destroyed.

Next, the subcarrier on which the optical semiconductor chip array is mounted can be mounted on the mounting surface of the pressing member. Then, the mounting position of the subcarrier on the pressing member is adjusted so that the optical axis of the light receiving element or the light emitting element of the optical semiconductor chip array mounted on the subcarrier is placed between the corresponding fixed table and the pressing member. It is possible to match the optical axis of the sandwiched optical fiber.

Next, the subcarrier can be joined to the mount surface of the pressing member by welding or the like at a high temperature without moving the position of the subcarrier. The semiconductor chip array is pressed by the pressing member while the optical axis of the light receiving element or the light emitting element of the optical semiconductor chip array mounted on the subcarrier and the optical axis of the optical fiber are accurately aligned with each other. It can be mounted on the mounting surface of the sub carrier.

At the same time, when the sub carrier is joined to the pressing member by welding or the like, the high heat generated at the joint can be weakened via the sub carrier and indirectly transmitted to the optical semiconductor chip array. Further, it is possible to prevent the optical semiconductor chip array from being destroyed by receiving high heat.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 and 2 show a preferred embodiment of a terminal of the present invention, FIG. 1 is a front sectional view showing a usage state thereof, and FIG. 2 is a side view around the pressing member. less than,
This terminal will be described.

In the figure, reference numeral 102 denotes a plate-shaped flange 102 which covers the inlet 32 opened in the package 30 from the outside.

At substantially the center of the inside of the flange 102,
A fixed table 104, which is introduced into the internal space of the package 30 through the introduction port 32, is provided upright.

At the substantially outer center of the flange 102,
The guide table 106 is extended upright.

The flange 102, the fixed table 104, and the guide table 106 are made of a metal material such as Kovar (iron-nickel-cobalt alloy) or stainless steel.

The surface of the fixed table 104 and the surface of the guide table 106 are located on substantially the same plane. Then, the surface of the fixed table 104 and the guide table 1
A plurality of guide holes 108 are opened side by side at a predetermined pitch in the flange 102 portion near the 06 surface.

Each of the plurality of optical fibers 10a arranged side by side at the end of the optical fiber array 10 and exposed is inserted into the plurality of guide holes 108 from the outside of the flange 102. The optical fiber 10a is stably supported on the surface of the fixed table 104 near the guide hole 108 with a small gap. At the same time, the optical fiber array 10 connected to the rear portion of the optical fiber 10a is stably supported on the surface of the guide table 106 near the guide hole 108 with a small gap.

A metal plating layer (not shown) is formed around the optical fiber 10a exposed at the end of the optical fiber array 10. Then, the periphery of the optical fiber 10a, which is inserted into the guide hole 108, covered with the metal plating layer,
The inner peripheral wall of the guide hole 108 is hermetically sealed with a bonding material (not shown) such as a brazing material. And the guide hole 1
08 around the optical fiber 10a and the guide hole 10
The gap between the inner peripheral wall of 8 and the inner peripheral wall of 8 is hermetically sealed with a bonding material. Then, through the guide hole 108, the flange 102
It prevents the airtightness between the inside and the outside of the.

A plurality of optical fibers 10a supported on the surface of the fixed table 104 are covered with a pressing member 200 made of a block-shaped metal material. The optical fiber 10a is sandwiched between the fixed table 104 and the pressing member 200.

Pressing member 2 facing fixed table 104
On the surface of 00, as shown in FIG.
A plurality of grooves 202 having a V-shaped cross section into which a is fitted are engraved side by side at a predetermined pitch. And those grooves 20
A plurality of optical fibers 10a are fitted side by side into each of the two so as not to move at a predetermined pitch and locked. Then, each of the plurality of optical fibers 10a is positioned and fixed to a predetermined portion on the surface of the fixed table 104.

The surface of the pressing member 200 is joined to the fixed table 104 by brazing, spot welding or the like except for the portion where the groove 202 is formed. The pressing member 200 made of a metal material is electrically connected to the fixed table 104 made of a metal material.

As shown in FIG. 1, an optical fiber 10a having an optical semiconductor chip array 20 having a plurality of light emitting elements or light receiving elements arranged side by side on a fixed table 104 is supported on the tip surface of the pressing member 200. Is provided with a mount surface 220 that is mounted so as to face the end of the.

The tip surface of the end of the optical fiber 10a is shown in FIG.
As shown in (1), the plating layer covering the surface is peeled off by diagonally cutting. And the optical fiber 10a
The diagonally cut tip of the end of the fixed table 10
4 and the pressing member 200. Then, the inside of the obliquely cut tip surface of the end portion of the optical fiber 10a is attached to the mount surface 220 of the tip surface of the pressing member 200.
The optical semiconductor chip array 20 to be mounted later is arranged so as to face a light emitting element or a light receiving element.

The terminals shown in FIGS. 1 and 2 are configured as described above.

Next, a description will be given of a usage example of this terminal, in which the optical semiconductor chip array of the present invention is mounted.

FIG. 3 shows a preferred embodiment of a terminal on which the optical semiconductor chip array of the present invention is mounted, and more specifically, is a front sectional view showing its usage. A terminal equipped with this optical semiconductor chip array will be described below.

In the terminal equipped with the optical semiconductor chip array shown in the figure, the optical semiconductor chip array 20 having a plurality of light emitting elements or light receiving elements arranged side by side is mounted on the mount surface 220 provided on the tip end surface of the pressing member 200. , And is mounted via a block-shaped subcarrier 300 made of a metal material. Specifically, the subcarrier 300 to which the bottom surface of the optical semiconductor chip array 20 is joined is joined to the mount surface 220 provided on the tip surface of the pressing member 200. Then, the optical semiconductor chip array 20 is connected to the optical fiber 10a.
Are arranged so as to face each other and face each other.

At the same time, the bottom portion of the optical semiconductor chip array 20 forming the ground electrode is electrically joined to the pressing member 200 through the subcarrier 300 made of a metal material.

The optical semiconductor chip array 20 includes the array 2
While applying vibration to 0, gold on the surface of the subcarrier 300
Die bonding is performed at low temperature using tin eutectic solder.
Then, the optical semiconductor chip array 20 is connected to the subcarrier 30.
When mounted on 0, the optical semiconductor chip array 20
It is protected from being destroyed by the high heat.

The optical semiconductor chip array 20 is bonded to the subcarrier 300 at a low temperature, and then the subcarrier 300 is joined.
Is mounted on the mounting surface 220, which is the front end surface of the pressing member 200, and is joined to the mounting member 220, whereby the pressing member 200 is mounted.

The sub-carrier 30 on which the optical semiconductor chip array 20 is mounted adjusts the mounting position when mounted on the mount surface 220 at the tip end surface of the pressing member 200. The optical axis of the light emitting element or the light receiving element of the optical semiconductor chip array 20 mounted on the subcarrier 300 is matched with the optical axis of the corresponding optical fiber 10a.

Next, the subcarrier 300 on which the optical semiconductor chip array 20 is mounted is fixed in position so that the mounting surface 220 of the tip end surface of the pressing member 200 is not moved.
Are joined by spot welding or the like. Then, when the sub carrier 300 is joined to the pressing member 200 by welding or the like, the high heat generated at the joining portion is generated by the sub carrier 3
It is weakened via 00 and is indirectly transmitted to the optical semiconductor chip array 20. When the subcarrier 300 is joined to the pressing member 200, the optical semiconductor chip array 20
However, it is prevented from being destroyed by receiving high heat. At the same time, when the sub carrier 300 is joined to the mount surface 220 of the tip end surface of the pressing member 200, the sub carrier 300
The optical axis of the light emitting element or the light receiving element of the semiconductor chip array 20 mounted on the optical fiber 10a
It prevents it from deviating from the optical axis of.

The subcarrier 300 is made of a highly heat conductive material such as copper. Then, the optical semiconductor chip array 2
The heat generated from the light emitting element of
It is designed so that it can be efficiently diffused to zero.

The mounting surface 22 on the front end surface of the pressing member 200
The optical semiconductor chip array 20 mounted on the optical fiber 10a via the subcarrier 300 is arranged so as to face the inside of the obliquely cut front end face of the end portion of the optical fiber 10a.
Then, the light emitted from the light emitting element of the optical semiconductor chip array 20 is reflected on the inside of the obliquely cut front end face of the end portion of the optical fiber 10a and is incident on the optical fiber 10a. The optical axes of the 20 light emitting elements are aligned with the optical axis of the corresponding optical fiber 10a.

Alternatively, the light transmitted through the optical fiber 10a is reflected inside the obliquely cut front end surface of the optical fiber 10a and is incident on the light receiving element of the optical semiconductor chip array 20. The optical axis of the light receiving element of the chip array 20 is aligned with the optical axis of the corresponding optical fiber 10a.

The terminal equipped with the optical semiconductor chip array shown in FIG. 3 is configured as described above.

Next, an example of use of the terminal equipped with this optical semiconductor chip array and its operation will be described.

As shown in FIG. 3, the optical semiconductor chip array 20 is packaged together with the subcarrier 300 on which it is mounted, the pressing member 200 on which it is mounted, the fixed table 104, and the optical fiber 10a sandwiched between them. It is introduced into the space inside the box-shaped package 30 whose upper end is widely opened through the introduction port 32 opened in the side wall of 30.

Next, the inlet 32 is covered with a flange 102 from the outside, and the flange 102 made of a metal material is hermetically joined to the portion of the package 30 made of a metal material around the inlet 32 by laser welding, resistance welding or the like. Then, the inlet 32 is airtightly closed by the flange 102 to prevent the airtightness of the internal space of the package 30 from being impaired through the inlet 32. Along with that, optical semiconductor chip array 2
The bottom portion of the ground electrode of No. 0 has a sub carrier 300 made of a metal material, a pressing member 200, and a fixed table 1.
Through 04 and the flange 102, it is electrically connected to the outer wall made of a metal material that constitutes the ground of the package 30.

Before and after that, the electrode of the optical semiconductor chip array 20 introduced into the space inside the package 30 is connected to the side wall of the package 30 by the ceramic terminal connection line 3.
4 electrically via a wire 80.

Next, the upper opening 36 of the package is covered with the cap 40, and the optical semiconductor chip array 20 and the optical fiber 10a are hermetically sealed in the internal space of the package 30. Then, the optical semiconductor chip array 20 and the optical fiber 1
0a is prevented from being adversely affected by dust and moisture.

After that, a bias voltage is applied between the outer wall of the package 30 constituting the ground and the outer end of the connection terminal 34. Then, a bias voltage is applied between the bottom portion of the optical semiconductor chip array 20 forming the ground electrode and the electrode of the light emitting element of the optical semiconductor chip array. And
Light is generated from the light emitting element.

Then, the light emitted from the light emitting element can be reflected on the inside of the obliquely cut front end face of the end portion of the optical fiber 10a facing the light emitting element and transmitted to the optical fiber 10a.

Alternatively, the light propagating through the optical fiber 10a may be reflected on the inside of the obliquely cut tip surface of the end portion of the optical fiber 10a and be incident on the light receiving element of the optical semiconductor chip array 20 facing it. it can. Then, the amount of current flowing through the light receiving element can be changed in magnitude according to the amount of received light.

Further, an electronic circuit (not shown) arranged outside the package 30 and an electrode of the optical semiconductor chip array 20 housed in the package 30 are connected to a ceramic terminal provided on a side wall of the package 30. By electrically connecting through 34, an optical communication module having a predetermined function can be formed.

In the terminal shown in FIG. 1 or the terminal mounted with the optical semiconductor chip array shown in FIG. 3, a glass terminal (not shown) is provided on the side wall of the package 30 instead of the ceramic terminal. Then, the lead of the glass terminal may be used as the connection terminal 34.

The optical fiber array 10 supported on the surface of the guide table 106 may be fixed to the surface of the guide table 106 with an adhesive so as not to move.

Further, in the usage example of the terminal on which the optical semiconductor chip array shown in FIG. 3 is mounted, the package 30 is used.
An electronic circuit (not shown) may be housed inside. And
The electronic circuit may be electrically connected to the electrode of the optical semiconductor chip array 20 housed in the same package 30 space through the wire 80 to form an optical communication module having a predetermined function.

FIG. 4 shows another preferred embodiment of the terminal of the present invention, more specifically, a front sectional view showing the usage state thereof. The terminal will be described below.

In the terminal shown in the figure, the tip of the pressing member 200 is projected toward the end of the fixed table 104, and the pressing member 2 is pressed.
A mounting surface 220 for mounting the optical semiconductor chip array 20 is provided on the top surface of the leading end of the semiconductor device 00. The optical fiber 1 in which an optical semiconductor chip array 20 to be mounted on the mounting surface 220, which will be described later, is supported on the fixed table 14
The end portion of 0a can be placed close to and facing each other.

The tip of the optical fiber 10a sandwiched between the fixed table 104 and the pressing member 200 is cut into a conical shape, a hemispherical shape or a shape close to them, and the plating layer covering the surface thereof is peeled off. . The light can be transmitted to the inside and outside of the optical fiber 10a through the tip of the optical fiber 10a. At the same time, the pressing member 200
The light emitted from the light emitting element of the optical semiconductor chip array 20 to be mounted on the mounting surface 220 on the top surface of the optical fiber is reflected by the tip surface of the optical fiber 10a toward the light emitting element, and the light emitting element of the optical semiconductor chip array 20 is It is possible to prevent mutual interference with the light emitted from.

The flange 102 is provided with a connection terminal 72 for electrically connecting the inside and outside of the flange 102. Specifically, the through hole 60 is provided in the flange 102, and the lead 70 is inserted through the center of the through hole 60. The lead 70 is hermetically sealed in the through hole 60 via the glass 74. The inner end of the lead 70 protruding inside the flange 102 is crushed into a flat plate shape. Then, the inner end upper surface of the lead 70 crushed into a flat plate shape is mounted on the mount surface 220 of the tip end upper surface of the pressing member 200. It is arranged to be substantially parallel to the upper surface of the electrode.

Others are the same as those of the terminal shown in FIG.

Next, a use example of this terminal, in which the optical semiconductor chip array of the present invention is mounted, will be described.

5 and 6 show a preferred embodiment of a terminal on which the optical semiconductor chip array of the present invention is mounted. FIG. 5 is a front sectional view showing its usage state, and FIG. 6 is its optical semiconductor chip array. FIG. 3 is an enlarged front cross-sectional view of the vicinity of a portion where is mounted. A terminal equipped with this optical semiconductor chip array will be described below.

In the terminal equipped with the optical semiconductor chip array shown in the figure, the optical semiconductor chip array 20 is mounted on the mount surface 220 provided on the top surface of the tip of the pressing member 200 via the block-shaped subcarrier 300. . The optical semiconductor chip array 20 is arranged close to the end of the optical fiber 10a so as to face it.

As shown in FIG. 6, the subcarrier 300 is made of ceramic, and is provided with a metallization layer 340 continuous in a U-shape on its lower inner surface, its bottom surface and its lower outer surface. There is. Then, the bottom surface of the optical semiconductor chip array 20 is die-bonded to the surface of the metallization layer 340 on the inner surface of the lower portion of the subcarrier 300 at a low temperature using gold-tin eutectic brazing while vibrating the array 20. . Then, when the optical semiconductor chip array 20 is mounted on the subcarrier 300, the optical semiconductor chip array 20 is prevented from being destroyed due to high heat.

On the surface of the metallization layer 340 provided on the bottom surface of the subcarrier 300 and the lower outer surface thereof, the metal plate 400 made of Kovar or the like is continuously joined in an L shape. Then, via the metal plate 400, the subcarrier 300 is joined to the mount surface 220 on the top surface of the tip of the pressing member 200 made of a metal material by spot welding or the like.

The optical semiconductor chip array 20 is mounted on the subcarrier 300 and then mounted on the subcarrier 300.
Is mounted on and bonded to the mount surface 220 on the top surface of the tip of the pressing member 200, thereby mounting on the mount surface 220 on the top surface of the tip of the pressing member 200.

The subcarrier 300 on which the optical semiconductor chip array 20 is mounted adjusts the mounting position when mounted on the mount surface 220 on the top surface of the tip of the pressing member 200. The optical axis of the light emitting element or the light receiving element of the optical semiconductor chip array 20 mounted on the subcarrier 300 is aligned with the optical axis of the optical fiber 10a.

Next, the subcarrier 300 on which the optical semiconductor chip array 20 is mounted is joined to the pressing member 200 while keeping its position stationary. Specifically, the subcarrier 300 is provided with the metallization layer 3 on the bottom surface thereof.
40, the mounting surface 220 on the top surface of the tip of the pressing member 200 made of a metal material via the metal plate 400 bonded to the surface.
Are joined by spot welding or the like. Then, when the subcarrier 300 is joined to the pressing member 200, the high heat applied to the joining portion is weakened via the subcarrier 300 and indirectly transmitted to the optical semiconductor chip array 20. Then, when the subcarrier 300 is joined to the mount surface 220 on the top surface of the tip of the pressing member 200, the optical semiconductor chip array 20 is prevented from being destroyed due to high heat. At the same time, the sub carrier 300 is pressed against the pressing member 2
This prevents the optical axis of the light emitting element or the light receiving element of the semiconductor chip array 20 mounted on the subcarrier 300 from being deviated from the optical axis of the corresponding optical fiber 10a when it is bonded to 00.

The subcarrier 300 is formed of a highly heat conductive member such as mullite ceramic. Then, the heat generated from the light emitting element of the optical semiconductor chip array 20 is
The subcarrier 300 can be efficiently diffused.

The bottom portion forming the ground electrode of the optical semiconductor chip array 20 is a metallization layer 340 continuously provided on the lower inner surface and the bottom surface of the subcarrier 300, and a metal plate bonded to the surface of the metallization layer 340. Through 400, it is electrically connected to the pressing member 200 made of a metal material forming the ground.

As shown in FIG. 5, a metallization layer 380 is continuously provided in an inverted L shape on the upper inner surface and the upper surface of the subcarrier 300. Then, the surface of the metallized layer 380 provided on the inner surface of the upper portion of the subcarrier 300 is made substantially parallel to the upper surface of the electrode of the optical semiconductor chip array 20. Then, the metallized layer 380
The surface is electrically connected to the upper surface of the electrode of the optical semiconductor chip array 20 via a wire 80 using a wire bonding device.

The surface of the metallization layer 380 provided on the upper surface of the subcarrier 300 is electrically connected to the upper surface of the inner end of the lead 70 crushed into a plane substantially parallel to the surface via the wire 80 using a wire bonding device. Connected to.
Then, the electrodes of the optical semiconductor chip array 20 are lead 70
Are electrically connected to each other via a metallization layer 380.

The terminal equipped with the optical semiconductor chip array shown in FIGS. 5 and 6 is configured as described above.

Next, an example of use of a terminal equipped with this optical semiconductor chip array and its operation will be described.

As shown in FIG. 5, the optical semiconductor chip array 20 is capped together with the subcarrier 300 on which it is mounted, the pressing member 200 on which it is mounted, the fixed table 104, and the optical fiber 10a sandwiched between them. Inlet 32 opened at the end of the package 30
And is introduced into the internal space of the package 30. And
The introduction port 32 of the package is covered with the flange 102.

Next, the flange 102 made of a metal material.
Is hermetically bonded to the peripheral edge of the package 30 made of a metal material around the inlet 32 by spot welding, resistance welding or the like. Then, the optical semiconductor chip array 20 and the optical fiber 1
0a is hermetically sealed in the space surrounded by the package 30 and the flange 102. Then, the light emitting element or the light receiving element of the optical semiconductor chip array 20 and the optical fiber 10a are prevented from being adversely affected by dust and moisture. At the same time, the pressing member 200 electrically connected to the bottom portion of the optical semiconductor chip array 20 that forms the ground electrode is connected to the outside of the package 30 made of the metal material via the fixed table 104 made of the metal material and the flange 102. Electrically connect to the enclosure.

After that, a bias voltage is applied between the outer wall of the package 30 constituting the ground and the outer end of the connection terminal 72. Then, a bias voltage is applied between the bottom portion of the optical semiconductor chip array 20 forming the ground electrode and the electrode of the light emitting element of the optical semiconductor chip array 20. Then, light is generated from the light emitting element.

Then, the light emitted from the light emitting element can be transmitted to the optical fiber 10a through the conical end surface of the optical fiber 10a facing the light emitting element.

Alternatively, the light transmitted through the optical fiber 10a can be made incident on the light receiving element of the optical semiconductor chip array 20 facing it through the conical end face of the optical fiber 10a. Then, the amount of current flowing through the light receiving element can be changed in magnitude according to the amount of received light.

Further, an electronic circuit (not shown) arranged outside the package 30 and an electrode of the optical semiconductor chip array 20 are electrically connected to each other through the connection terminal 72 to form an optical communication module having a predetermined function. .

In the use example of the terminal having the optical semiconductor chip array shown in FIG. 5, the package 30 is used.
An electronic circuit (not shown) may be housed inside and the electronic circuit may be electrically connected to the electrodes of the optical semiconductor chip array 20 housed within the same package 30. Then, an optical communication module having a predetermined function may be formed.

In the terminal shown in FIG. 4 or the terminal having the optical semiconductor chip array shown in FIG. 5, a ceramic terminal (not shown) is hermetically fitted to the flange 102 instead of the lead 70. You may wear it. Then, the ceramic terminal may be used as the connection terminal 72 that electrically connects the inside and the outside of the flange 102.

In addition, in the terminal shown in FIG. 1 or 4 or the terminal mounted with the optical semiconductor chip array shown in FIG. 3 or 5, the pressing member 200 is not provided with the groove 202 and is pressed. The optical fiber 10a may be simply sandwiched between the member 200 and the fixed table 104. Then, the optical fiber 10a may be positioned and fixed to a predetermined portion on the surface of the fixed table 104, and even in such a case, the terminal shown in FIG. 1 or 4, or the optical semiconductor chip shown in FIG. 3 or FIG. It is possible to form a terminal having almost the same operation as the terminal on which the array is mounted. However, in such a case, the surface of the pressing member 200 is lifted from the surface of the fixed table 104 by the outer diameter of the optical fiber 10a, and the pressing member 200 made of a metal material and the fixed table 104 are not electrically connected. Therefore, a protrusion (not shown) is provided on a part of the pressing member 200 and the protrusion is bonded to the fixed table 104, or the pressing member 200 and the fixed table 104 are separately electrically connected by a wire or the like. There is a need to.

In the terminal shown in FIG. 1 or 4, or the terminal equipped with the optical semiconductor chip array shown in FIG. 3 or 5, as shown in FIG. 7 or 8, the pressing member 200 is used. May be formed of a high thermal conductive member such as copper, and the optical semiconductor chip array 20 may be directly die-bonded to the mount surface 220 provided on the pressing member 200 by low-temperature bonding using a conductive adhesive or the like. Even so,
It is possible to form a terminal having substantially the same operation and effect as the terminal shown in FIG. 1 or 4 or the terminal mounted with the optical semiconductor chip array shown in FIG. 3 or 5.

Further, in the terminal shown in FIG. 1 or 4 or the terminal on which the optical semiconductor chip array shown in FIG. 3 or 5 is mounted, the pressing member 200, the fixed table 104,
The flange 102 or the guide table 106 may be formed of ceramic or the like. However, in such a case, the optical semiconductor chip array 20 mounted directly or via the subcarrier 300 on the mounting surface 220 of the pressing member or the ground electrode at the bottom of the mounted optical semiconductor chip array 20 constitutes the ground of the package 30. It is necessary to separately electrically connect to a connecting terminal (not shown) for ground provided on the outer wall made of a metal material or the package 30 by using a connecting means (not shown) such as a wire.

[0096]

As described above, according to the terminal of the present invention or the terminal equipped with the optical semiconductor chip array of the present invention, the optical fiber exposed at the end of the optical fiber array is used as the optical semiconductor chip array. Can be placed close together. Then, the optical axis of the optical fiber can be easily and accurately aligned with the optical axis of the light receiving element or the light emitting element of the optical semiconductor chip array.

Further, when the flange is joined to the package by welding or the like, even if the package is distorted by the thermal stress applied to the package, the optical axis of the optical fiber and the corresponding light emitting element or light receiving element of the optical semiconductor chip array is changed. It is possible to reliably prevent the positional relationship from going wrong. Then, the light emitted from the light emitting element of the optical semiconductor chip array can be accurately incident on the corresponding optical fiber. At the same time, the light emitted from the end of the optical fiber can be accurately incident on the corresponding light receiving element of the optical semiconductor chip array.

Further, it is not necessary to interpose a light transmitting plate between the optical semiconductor chip array and the optical fiber,
The optical communication module can be made compact.

[Brief description of drawings]

FIG. 1 is a front sectional view showing a usage state of a terminal of the present invention.

FIG. 2 is a side view around the pressing member of the terminal of the present invention.

FIG. 3 is a front sectional view showing a usage state of a terminal on which the optical semiconductor chip array of the present invention is mounted.

FIG. 4 is a front sectional view showing a usage state of the terminal of the present invention.

FIG. 5 is a front sectional view showing a usage state of a terminal on which the optical semiconductor chip array of the present invention is mounted.

FIG. 6 is an enlarged front sectional view around an optical semiconductor chip array of a terminal equipped with the optical semiconductor chip array of the present invention.

FIG. 7 is a front sectional view showing a usage state of a terminal equipped with the optical semiconductor chip array of the present invention.

FIG. 8 is a front sectional view showing a usage state of a terminal equipped with the optical semiconductor chip array of the present invention.

FIG. 9 is a front sectional view showing a usage state of a conventional terminal.

FIG. 10 is a perspective view showing a usage state of a conventional terminal.

FIG. 11A is a side view of the optical fiber array, and FIG.
FIG. 3 is a plan view of an optical fiber array.

[Explanation of symbols]

10 optical fiber array 10a optical fiber 20 Optical semiconductor chip array 30 packages 32 entrance 34 Connection terminal 40 Optical fiber array terminal 50 Light transmission plate 60 through holes 70 leads 72 Connection terminal 80 wires 102 flange 104 fixed table 106 guide table 108 Guide hole 200 pressing member 202 groove 220 mounting surface 300 subcarriers 340, 380 Metallized layer 400 metal plate

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Claims (7)

(57) [Claims] 1. A which fixed table to extend to the package space through said inlet opening has been inlet inside the flange which covers from the outside the package Rutotomoni,
The guide table is provided on the outside of the flange, by inserting the optical fiber end of the optical fiber array to the guide hole opened in the flange, to support the optical fiber on the fixed table surface, before Symbol optical fiber array Is supported on the surface of the guide table, and an optical fiber is placed in the guide hole.
It sealed the bus to the airtight, and before Symbol fixed table the optical fiber
And a pressing member for sandwiching between an optical semiconductor chip array in the pressing member is opposed to an end portion of the optical fiber tower
A terminal for an optical fiber array, which is provided with a mounting surface for mounting . Wherein grooves are provided on the surface it faces the fixed table of the pressing member, the optical fiber terminal for array of claim 1, wherein the fitting the optical fiber to the groove. 3. The optical fiber array terminal according to claim 1, wherein the pressing member is joined to the fixed table. 4. A a fixed table surface and the guide table surface is positioned substantially on the same plane, the light off before notated lunge
The fiber array and the optical fiber are arranged in a substantially straight line.
A terminal for an optical fiber array according to claim 1, 2 or 3, wherein a guide hole for inserting the optical fiber is opened. 5. A flange according to claim 1 having a connection terminal for electrically connecting the inside and outside of that through the flange,
The terminal for optical fiber array according to 3 or 4. 6. The mounting surface of Claim 1, 2, 3, 4 or 5, wherein the pressing member of the terminal for an optical fiber array, the optical semiconductor chip array mounted to face the end of the optical fiber <br / > An optical fiber array terminal equipped with an optical semiconductor chip array. 7. The optical semiconductor chip array, an optical fiber terminal for array optical semiconductor chip array is mounted according to claim 6, wherein the mounting via a sub-carrier to the mounting surface of the pressing member.