JP3402392B2 - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JP3402392B2 JP3402392B2 JP30450093A JP30450093A JP3402392B2 JP 3402392 B2 JP3402392 B2 JP 3402392B2 JP 30450093 A JP30450093 A JP 30450093A JP 30450093 A JP30450093 A JP 30450093A JP 3402392 B2 JP3402392 B2 JP 3402392B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- printed wiring
- wiring board
- multilayer printed
- glass fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims description 33
- 239000003365 glass fiber Substances 0.000 claims description 24
- 239000011229 interlayer Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000002759 woven fabric Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 4
- 238000009941 weaving Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 239000000203 mixture Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- -1 glycidyl ester Chemical class 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】本発明は、たて/よこ異方性が小
さく、寸法安定性に優れた印刷配線板用プリプレグ及び
多層印刷配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg for printed wiring boards and a multilayer printed wiring board which have small vertical / horizontal anisotropy and are excellent in dimensional stability.
【0002】[0002]
【従来の技術】印刷配線板の高密度化に伴い、多層印刷
配線板、銅張積層板等には様々な優れた特性が要求され
ている。特に高多層化、スルーホールの小径化等の促進
によって、ドリル加工性の良好な印刷配線板用プリプレ
グ及び寸法安定性の優れた多層印刷配線板、銅張積層板
が要求されている。2. Description of the Related Art With the increasing density of printed wiring boards, various excellent characteristics are required for multilayer printed wiring boards, copper clad laminates and the like. In particular, due to an increase in the number of layers and a reduction in the diameter of through holes, there is a demand for a prepreg for a printed wiring board having good drilling workability, a multilayer printed wiring board having excellent dimensional stability, and a copper clad laminate.
【0003】一般に多層印刷配線板は、回路を形成した
内層板と、印刷配線板用プリプレグを組合せ積層し、加
熱加圧することによって製造される。小径ドリル加工、
高密度の回路加工にとって時寸法安定性は、重要な特性
となっている。前記寸法安定性を向上させることによっ
てドリル穴あけ時の位置ずれを小さくでき、また多層プ
レス後の回路形成位置合わせも精確にできる。Generally, a multilayer printed wiring board is manufactured by combining and laminating an inner layer board on which a circuit is formed and a prepreg for a printed wiring board, and heating and pressing. Small diameter drilling,
Time-dimensional stability is an important characteristic for high-density circuit processing. By improving the dimensional stability, it is possible to reduce the positional deviation at the time of drilling a hole, and it is possible to accurately align the circuit formation after the multi-layer press.
【0004】寸法安定性を向上させる手段としては、特
開昭59−12490号公報に積層プレス後に積層板を
加熱することにより歪みをとる方法が開示され、また特
開昭59−64349号公報には、印刷配線板用プリプ
レグ製造に用いるガラス繊維織布のたて糸とよこ糸の打
ち込み本数差を0から5本の範囲内とする方法が開示さ
れている。As a means for improving the dimensional stability, JP-A-59-12490 discloses a method of removing strain by heating a laminated plate after laminating press, and JP-A-59-64349. Discloses a method in which the difference in the number of warp yarns and weft yarns of a glass fiber woven fabric used for producing a prepreg for a printed wiring board is set within a range of 0 to 5.
【0005】[0005]
【発明が解決しようとする課題】しかし、積層板を加熱
することによって歪みをとり寸法安定性をとる方法は、
新たに加熱処理工程を加えなければならず、製造時間が
増えるうえ熱エネルギーも消費する。打ち込み本数差を
0から5本の範囲内とする方法は、寸法安定性に効果が
あるものの、プリプレグ1枚で内層板を製造する際や多
層印刷配線板用プリプレグ枚数を1枚とするような厚み
の薄い多層印刷配線板製造においては、たて、よこ異方
性が大きくなるという問題が発生する。また、層間接着
用プリプレグを層間2枚使用する場合でもたて、よこ異
方性が大きくなってしまう。However, the method of removing strain by heating the laminated plate to obtain dimensional stability is as follows.
A new heat treatment process must be added, which increases the manufacturing time and consumes heat energy. Although the method of setting the difference in the number of punched wires within the range of 0 to 5 is effective in dimensional stability, it is difficult to manufacture the inner layer board with one prepreg or when the number of prepregs for a multilayer printed wiring board is set to one. In the production of a thin multilayer printed wiring board, there arises a problem that the vertical anisotropy becomes large. Further, even when two interlayer adhesive prepregs are used, the horizontal anisotropy becomes large.
【0006】特に、印刷配線板用プリプレグの重さが2
0g/m2から170g/m2のプリプレグは、重さ18
0g/m2から200g/m2のプリプレグに対し剛性が
小さくなることからたて、よこ異方性が大きくなる傾向
を示し、高密度回路を形成しにくいといった問題点が発
生していた。Particularly, the weight of the prepreg for the printed wiring board is 2
A prepreg of 0 g / m 2 to 170 g / m 2 has a weight of 18
Since the rigidity becomes small with respect to the prepreg of 0 g / m 2 to 200 g / m 2 , there is a tendency that the lateral anisotropy becomes large, and it is difficult to form a high-density circuit.
【0007】本発明は、層間接着用プリプレグを層間1
枚しか使用しないような薄い多層印刷配線板においても
寸法安定性に優れ、たて、よこ異方性を小さくできる多
層印刷配線板に関する。According to the present invention, a prepreg for adhesion between layers is used as an interlayer 1
The present invention relates to a multilayer printed wiring board which is excellent in dimensional stability even in the case of using only a thin multilayer printed wiring board and which can reduce the horizontal anisotropy.
【0008】[0008]
【課題を解決するための手段】本発明は、ガラス繊維織
布に樹脂を含浸させた層間接着用プリプレグを内層回路
板の両側に配置し、該層間接着用プリプレグの外側に銅
はくを積層した後加熱加圧して製作される多層印刷配線
板において、該層間接着用プリプレグに用いるガラス繊
維織布の重さが20g/m2から110g/m2であり、
フィラメント径が3μmから8μmであって、層間接着
用プリプレグの繊維たて方向と内層回路板に使用するプ
リプレグの繊維たて方向を直交させることを特徴とする
多層印刷配線板である。SUMMARY OF THE INVENTION According to the present invention, an interlayer adhesive prepreg obtained by impregnating a glass fiber woven resin with a resin is arranged on both sides of an inner layer circuit board, and a copper foil is laminated on the outside of the interlayer adhesive prepreg. In a multilayer printed wiring board manufactured by heating and pressurizing, the weight of the glass fiber woven fabric used for the interlayer prepreg is 20 g / m 2 to 110 g / m 2 ,
A multilayer printed wiring board having a filament diameter of 3 μm to 8 μm and having a fiber warp direction of an interlayer bonding prepreg and a fiber warp direction of a prepreg used for an inner layer circuit board are orthogonal to each other.
【0009】本発明に使用される樹脂又は樹脂組成物と
しては、熱硬化性樹脂、熱可塑性樹脂が用いられる。熱
硬化性樹脂としては、エポキシ樹脂及びその組成物、ポ
リイミド樹脂及びその組成物、シアネート樹脂及びその
組成物、フェノール樹脂及びその組成物、ポリエステル
樹脂及びその組成物等がある。また、エポキシ樹脂とし
ては、ビスフェノールA型エポキシ樹脂、ビスフェノー
ルF型エポキシ樹脂、ビスフェノールS型エポキシ樹
脂、フェノールノボラック型エポキシ樹脂、クレゾール
ノボラック型エポキシ樹脂、脂環式エポキシ樹脂、グリ
シジルエステル型エポキシ樹脂、グリシジルアミン型エ
ポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアネ
ート型エポキシ樹脂、及びそれらのハロゲン化物、水素
添加物などがあり数種類を併用することもできる。また
前記樹脂を混合する方法、温度には制限はない。As the resin or resin composition used in the present invention, a thermosetting resin or a thermoplastic resin is used. Examples of the thermosetting resin include epoxy resin and its composition, polyimide resin and its composition, cyanate resin and its composition, phenolic resin and its composition, polyester resin and its composition, and the like. As the epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl There are amine-type epoxy resins, hydantoin-type epoxy resins, isocyanate-type epoxy resins, and halides and hydrogenates thereof, and several types can be used together. There is no limitation on the method of mixing the resin and the temperature.
【0010】熱可塑性樹脂としては、テフロン樹脂及び
その組成物、ポリエチレン、ポリプロピレン及びその組
成物がある。The thermoplastic resin includes Teflon resin and its composition, polyethylene, polypropylene and its composition.
【0011】ガラス繊維の種類としては、重さ20g/
m2から110g/m2のものを用いる。理由は、重さが
軽くなるほど寸法変化に影響をあたえるためである。The type of glass fiber weighs 20 g /
m 2 to 110 g / m 2 is used. The reason is that the lighter the weight, the more it affects the dimensional change.
【0012】ガラス繊維のフィラメント径は0.003
mmから0.008mmが好ましい。理由は、フィラメ
ント径が細いほど剛性がなく、寸法変化に影響をあたえ
るためである。The filament diameter of the glass fiber is 0.003
mm to 0.008 mm is preferable. The reason is that the smaller the filament diameter is, the less rigid it is, which affects the dimensional change.
【0013】また、ガラス繊維織布の織密度は、たて/
よこ=1.1から1.45の範囲内にするのが好まし
い。The woven density of the glass fiber woven fabric is warp /
It is preferable that the width is within the range of 1.1 to 1.45.
【0014】本発明多層印刷配線板では、内層板に使用
するプリプレグのガラス繊維織布たて方向と、層間接着
用プリプレグのガラス繊維織布たて方向を直交させるこ
とが必要である。内層板を2枚以上使用する場合は、内
層板のガラス繊維織布たて方向をすべて同方向とし、層
間接着用プリプレグのガラス繊維織布たて方向を直交さ
せるように内層板間にはさみ込ませる。In the multilayer printed wiring board of the present invention, it is necessary to make the glass fiber woven warp direction of the prepreg used for the inner layer board and the glass fiber woven warp direction of the interlayer adhesion prepreg orthogonal to each other. When using two or more inner layer boards, make sure that the glass fiber woven warp directions of the inner layer boards are all the same direction, and sandwich between the inner layer boards so that the glass fiber woven warp directions of the interlayer prepreg are orthogonal to each other. No
【0015】[0015]
【作用】ガラス繊維織布のたて方向を直交させることに
より、たて方向の熱膨張係数とよこ方向の熱膨張係数の
違いを相殺させることにより、たて、よこの寸法変化異
方性を小さくすることができる。The vertical direction of the woven glass fiber cloth is made orthogonal to each other to cancel out the difference between the thermal expansion coefficient in the vertical direction and the thermal expansion coefficient in the horizontal direction. can do.
【0016】[0016]
【実施例】実施例1
以下の物質を合成しワニスを得た。
ビスフェノールAノボラック型エポキシ樹脂 85重量部
ビスフェノールAノボラック樹脂 15重量部
ジシアンジアミド 1.9重量部
イミダゾール 0.18重量部
メチルセロソルブ 30重量部
メチルエチルケトン 1.0重量部
該ワニスをフィラメント径5μm、重さ48g/m2、
織密度比たて/よこ=1.30のガラス繊維織布に含浸
し、層間接着用プリプレグを得た。また、該ワニスをフ
ィラメント径7μm、重さ107g/m2、織密度比た
て/よこ=1.18のガラス繊維織布に含浸し、内層板
用プリプレグを得た。該内層板用プリプレグ1枚の両側
に厚さ35μmの銅はくを配置し、加熱温度175℃、
加圧加熱時間100分、加圧30kg/cm2で加熱加
圧し多層板用内層板を得た。該多層板用内層板を回路加
工後、その両側に該多層板用内層板のガラス繊維織布た
て方向と層間接着用プリプレグのガラス繊維織布たて方
向が直交するように層間接着用プリプレグを配置し、更
にその両側に厚さ35μm銅はくを配置した後、加熱温
度175℃、加圧加熱時間100分、加圧30kg/c
m2の条件で加圧加熱し4層板を得た。Example 1 A varnish was obtained by synthesizing the following materials. Bisphenol A novolac type epoxy resin 85 parts by weight Bisphenol A novolac resin 15 parts by weight Dicyandiamide 1.9 parts by weight Imidazole 0.18 parts by weight Methyl cellosolve 30 parts by weight Methyl ethyl ketone 1.0 parts by weight The varnish has a filament diameter of 5 μm and a weight of 48 g / m 2 ,
A glass fiber woven fabric having a woven density ratio warp / weft = 1.30 was impregnated to obtain a prepreg for interlayer adhesion. Further, the varnish was impregnated into a glass fiber woven cloth having a filament diameter of 7 μm, a weight of 107 g / m 2 , and a woven density ratio of warp / width = 1.18 to obtain a prepreg for an inner layer board. A copper foil having a thickness of 35 μm is arranged on both sides of one prepreg for the inner layer board, and a heating temperature is 175 ° C.
The inner layer plate for a multilayer plate was obtained by heating and pressurizing at a pressure of 30 kg / cm 2 for 100 minutes under pressure and heating. After the circuit processing of the inner layer plate for multilayer boards, the prepreg for interlayer bonding is arranged so that the glass fiber woven warp direction of the inner layer board for multilayer plates and the glass fiber woven cloth warp direction of the interlayer bonding prepreg are orthogonal to each other on both sides thereof. And a copper foil having a thickness of 35 μm on both sides thereof, heating temperature 175 ° C., pressure heating time 100 minutes, pressure 30 kg / c.
A 4-layer plate was obtained by heating under pressure under the condition of m 2 .
【0017】実施例2
実施例1に使用したワニスをフィラメント径7μm、重
さ107g/m2、織密度比たて/よこ=1.18のガ
ラス繊維織布に含浸し層間接着用プリプレグを得た以外
実施例1と同様の方法で4層板を得た。Example 2 The varnish used in Example 1 was impregnated into a glass fiber woven fabric having a filament diameter of 7 μm, a weight of 107 g / m 2 and a weaving density ratio of warp / weft = 1.18 to obtain a prepreg for interlayer adhesion. A four-layer board was obtained in the same manner as in Example 1 except for the above.
【0018】実施例3
内層回路板の両側に層間接着用プリプレグを2枚づつ配
置した以外実施例1と同様の方法で4層板を得た。Example 3 A four-layer board was obtained in the same manner as in Example 1 except that two prepregs for interlayer adhesion were arranged on both sides of the inner layer circuit board.
【0019】比較例1
多層板用内層板のガラス繊維織布たて方向と層間接着用
プリプレグのガラス繊維織布たて方向が平行(同方向)
になるように配置した以外実施例1と同様の方法で4層
板を得た。Comparative Example 1 The glass fiber woven warp direction of the inner layer board for a multilayer board and the glass fiber woven cloth warp direction of the interlayer prepreg are parallel (same direction).
A four-layer board was obtained in the same manner as in Example 1 except that the four-layer board was arranged so that
【0020】比較例2
多層板用内層板のガラス繊維織布たて方向と層間接着用
プリプレグのガラス繊維織布たて方向が平行(同方向)
になるように配置した以外実施例2と同様の方法で4層
板を得た。Comparative Example 2 The glass fiber woven warp direction of the inner layer board for a multilayer board and the glass fiber woven cloth warp direction of the interlayer prepreg are parallel (same direction).
A four-layer board was obtained in the same manner as in Example 2 except that the four-layer board was arranged in the following manner.
【0021】比較例3
多層板用内層板のガラス繊維織布たて方向と層間接着用
プリプレグのガラス繊維織布たて方向が平行(同方向)
になるように配置した以外実施例3と同様の方法で4層
板を得た。Comparative Example 3 The glass fiber woven fabric warp direction of the inner layer plate for multilayer board and the glass fiber woven fabric warp direction of the interlayer prepreg are parallel (same direction).
A four-layer board was obtained in the same manner as in Example 3 except that the four-layer board was arranged so that
【0022】実施例、比較例について4層板のたてとよ
この寸法変化を測定し、結果を表1に示す。For the examples and comparative examples, the dimensional changes of the vertical and horizontal four-layer plates were measured, and the results are shown in Table 1.
【0023】[0023]
【表1】 [Table 1]
【0024】表1の補足説明たて、よこの寸法変化の基
準値を内層板の回路形成用フィルムとし、該基準値を初
期値として寸法変化を測定した。またσは標準偏差を示
す。As a supplementary explanation of Table 1, the standard value of the dimensional change was used as the circuit forming film of the inner layer plate, and the dimensional change was measured with the standard value as the initial value. Further, σ indicates a standard deviation.
【0025】[0025]
【発明の効果】本発明によれば、たて/よこ異方性が小
さく、寸法安定性に優れた印刷配線板用プリプレグ及び
多層印刷配線板を得ることができる。According to the present invention, it is possible to obtain a prepreg for printed wiring boards and a multilayer printed wiring board having small vertical / horizontal anisotropy and excellent dimensional stability.
Claims (2)
間接着用プリプレグを内層回路板の両側に配置し、該層
間接着用プリプレグの外側に銅はくを積層した後加熱加
圧して製作される多層印刷配線板において、該層間接着
用プリプレグに用いるガラス繊維織布の重さが20g/
m2から110g/m2であり、フィラメント径が3μ
mから8μmであって、織密度が、たて/よこ=1.1
から1.45であって、該層間接着用プリプレグの繊維
たて方向と内層回路板に使用するプリプレグの繊維たて
方向を直交させることを特徴とする多層印刷配線板。1. A prepreg for interlayer adhesion, which is obtained by impregnating a glass fiber woven cloth with a resin, is arranged on both sides of an inner layer circuit board, and copper foil is laminated on the outside of the prepreg for interlayer adhesion, followed by heating and pressurizing. In a multilayer printed wiring board according to the present invention, the weight of the glass fiber woven fabric used for the interlayer prepreg is 20 g /
m 2 to 110 g / m 2 and filament diameter is 3μ
m to 8 μm and the weaving density is warp / width = 1.1
From a 1.45, multilayer printed wiring board, characterized in that for orthogonal fiber freshly direction of the prepreg used in the fiber freshly direction and the inner layer circuit board of the interlayer adhesive prepreg.
使用することを特徴とする請求項1記載の多層印刷配線
板。2. The multilayer printed wiring board according to claim 1, wherein only one interlayer adhesive prepreg is used.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30450093A JP3402392B2 (en) | 1993-12-06 | 1993-12-06 | Multilayer printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30450093A JP3402392B2 (en) | 1993-12-06 | 1993-12-06 | Multilayer printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07162156A JPH07162156A (en) | 1995-06-23 |
JP3402392B2 true JP3402392B2 (en) | 2003-05-06 |
Family
ID=17933783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30450093A Expired - Lifetime JP3402392B2 (en) | 1993-12-06 | 1993-12-06 | Multilayer printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3402392B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3324916B2 (en) * | 1995-10-16 | 2002-09-17 | 日東紡績株式会社 | Glass cloth, prepreg, laminated board and multilayer printed wiring board |
-
1993
- 1993-12-06 JP JP30450093A patent/JP3402392B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH07162156A (en) | 1995-06-23 |
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