JP3354632B2 - Shoe insole - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shoe insole,
The present invention relates to a technology effective when applied as an insole for shoes that can improve reliability or safety.

[0002]

2. Description of the Related Art For example, a method of manufacturing shoes includes a step of temporarily fixing an insole to the bottom side of a mold with a nail, and covering an outer periphery of the temporarily fixed mold and the outer periphery of the insole with the upper being covered therein. A step of forming by fixing to the bottom with an adhesive or the like, a step of forming a flat surface by cutting or polishing the middle bottom of the upper after the forming, and a step of extracting nails used for temporary fixing after this step And fixing the shoe sole to the insole after removing the nail with an adhesive or the like, and removing the mold from the shoe after fixing the shoe sole.

[0003]

In the above-mentioned method for manufacturing shoes, since the temporary fixing of the insole to the mold is performed by nails, a step of removing the nails is necessary. In some cases, the nail may not be extracted in the extraction step, or the nail may remain on the shoe after the production is completed due to incompleteness.

[0004] Since the remaining nails may damage the user's feet or the like and impair the reliability or safety of the shoes, for example, a predetermined process such as an inspection of the remaining temporary fixing nails is required. Even after such treatment, nails may remain. Therefore, for example, it is conceivable to temporarily fix the insole to the mold with a pressure-sensitive adhesive. However, it has been known that there is a problem that the insole is separated from the mold during temporary storage or transportation.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an insole that can be securely fixed to a mold without leaving nails and without peeling off from the mold during manufacturing, temporary storage and transportation. Is to provide. The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0006]

In order to achieve the above object, the midsole of the shoe according to the present invention is provided with a hot air outlet from an outlet opened on the bottom surface.
An inner layer of the shoe temporarily fixed to the bottom surface of the shoe mold in which a flow passage through which air can be blown is formed, wherein an adhesive layer for temporarily fixing the mold is formed corresponding to the outlet. The adhesive is characterized in that the adhesive cures and adheres in a predetermined temperature range and melts at a temperature outside the temperature range. Alternatively, the shoe midsole of the present invention is a shoe midsole temporarily fixed to the bottom surface of a shoe mold provided with a heating element on a bottom surface side, and is temporarily fixed to the mold. An agent layer is formed corresponding to the heating element,
The adhesive is characterized in that it is hardened and adhered within a predetermined temperature range and melts at a temperature outside the temperature range.

In this case, it is possible to adopt a structure in which the adhesive is an adhesive which is hardened at room temperature and melted by heating. Also,
The structure may be such that the adhesive layer is partially formed on the toe side. Further, the adhesive may have a structure containing a vinyl copolymer as a main component.

[0008]

According to the midsole of the present invention described above, the adhesive in the adhesive layer is melted at a temperature outside the above-mentioned predetermined temperature range, and the midsole is polymerized on the bottom side of the mold so that the predetermined temperature can be obtained. By curing and bonding the adhesive according to the temperature range, the adhesive can be temporarily fixed to the mold. As a result, the nail for temporary fixing is not required, and the nail for temporary fixing can be reliably prevented from remaining. it can.

[0009] Further, such an effect makes it unnecessary to inspect the remaining nails, so that the manufacturing process can be simplified and the cost can be reduced. Thus, it is possible to reliably prevent the user's foot from being damaged, and to improve the reliability or safety of the shoe. Further, since the adhesive of the adhesive layer formed on the upper surface side of the insole is formed as the above-mentioned adhesive and has a large adhesive force, the insole is not used during production, temporary storage, and transportation. The temporary fixing to the mold can be reliably performed without peeling from the mold.

Further, when the temporary stop is released, the mold can be separated from the midsole by applying a temperature outside the above-mentioned temperature range to the adhesive in the midsole and melting it. The demolding process is not hindered, and as a result, it can be optimally used as an insole used in this type of shoe manufacturing method.

[0011]

Embodiment 1 FIGS. 1 to 3 are explanatory views showing a method for manufacturing shoes manufactured using an insole according to an embodiment of the present invention, and FIG. 4 is a mold used in the method for manufacturing shoes. FIG. 5 is a sectional view of the mold. For example, as shown in FIGS. 4 and 5, the mold 1 used in the shoe manufacturing method of the present embodiment has a main body 2 made of two divided members 2A and 2B made of resin or the like, and this divided member 2A. , 2B plate 3 made of metal or the like that is superimposed by nailing or the like on the bottom side
A and 3B are provided, and the divided members 2A and 2B are relatively swingable as shown in the direction of the arrow in FIG.

In the mold 1 of this embodiment, a flow passage 4 through which hot air flows is formed inside the main body 2. Channel 4
The opening 5 of the die 1 is opened above the dividing member 2B, and the outlet 6 of the flow passage 4 is opened at the toe side of the mold 1 on the dividing member 2B side. As shown in FIG. 4, the outlet 6 is formed by a circular hole 7 and a notch 8 extending radially from the periphery of the circular hole 7, and as shown in FIG. Is formed in a tapered shape that gradually descends from the bottom toward the bottom side of the mold 1.

In the shoe manufacturing method according to the present embodiment, the mold 1 as described above is used. As a first step, as shown on the left side of FIG. FIG.
The adhesive 9 is partially applied to the upper surface of the toe side of the midsole 10 so as to substantially correspond to the portion indicated by the one-dot chain line) to form an adhesive layer. The insole 10 is formed by bonding coarse cloth to the bottom surface of paper. The adhesive 9 used is one that cures and adheres in a predetermined temperature range and that melts and peels off at a temperature outside the temperature range. As the adhesive 9 of this embodiment, a synthetic adhesive mainly containing a vinyl copolymer which is hardened at room temperature and melted by heating is used. This synthetic adhesive has a white translucent hue, a stick shape, a softening point of 89 ° C, and a melt viscosity of 180 °.
C is 1200 CPS, the average open time is 50 seconds at 20 ° C., and the adhesive compatibility is high for wood and paper, and medium for metal and synthetic resin.

The application of the adhesive 9 is performed by using the
In this embodiment, the adhesive 9 may be applied to the insole 10 in advance and stored for a required number of times, and the stored insole 10 may be used at the time of manufacturing shoes. I decided to use it. Next, as a second step, after the adhesive 9 of the insole 10 is heated and melted, the insole 10 is polymerized on the bottom surface of the mold 1 as shown on the right side of FIG. Is cured at room temperature, and the insole 10 is adhered to the mold 1 and temporarily fixed. When the adhesive 9 is heated and melted,
Hot air is supplied to the inlet 5 from a hot air source (not shown), and is blown from the outlet 6 to the adhesive 9 on the midsole 10 through the flow passage 4. That is, hot air is blown from the mold 1 side to the inner bottom 10 side to the adhesive 9 of the inner bottom 10 to heat and melt the adhesive 9. In this case, the adhesive 9 of the midsole 10 may be pressed against a heating means (not shown) different from the above-mentioned hot air source to heat and melt the same.

In the third step, as shown on the left side of FIG.
The outer periphery of the temporarily fixed mold 1 and the inner bottom 10 is covered with an upper 11 and is fixed to the inner bottom 10 with an adhesive or the like to form. In the fourth step, the bottom surface of the midsole 10 of the upper 11 after molding is formed into a flat shape by cutting or polishing with a sander or the like.

In the fifth step, as shown on the right side of FIG.
A shoe sole 12 is fixed to the insole 10 with an adhesive or the like. In the sixth step, as shown on the left and right sides of FIG. 3, a temperature outside the above-described predetermined temperature range is added to the adhesive 9 and melted to release the temporary fixing of the insole 10 to the mold 1, The mold 1 is removed from the shoe.

When releasing the temporary fixing, hot air is supplied from a hot air source (not shown) to the inlet 5 and blown from the outlet 6 to the adhesive 9 on the midsole 10 through the flow passage 4. That is, hot air is applied to the adhesive 9 of the midsole 10 from the mold 1 side to the midsole 1.
Spraying toward the 0 side melts the adhesive 9 and releases it. When the mold 1 is removed from the shoe, the mold is removed by mechanical means or manually.

The midsole 10 of the present embodiment has the structure as described above. In this case, according to the midsole 10 of this embodiment, the adhesive 9 of the adhesive layer is melted at a temperature outside the above-mentioned predetermined temperature range, and the midsole 10 is polymerized on the bottom side of the mold 1. By hardening and bonding the adhesive 9 in the predetermined temperature range, the adhesive 9 can be temporarily fixed to the mold 1, and as a result, the nail for temporary fixing is not required, and the remaining nail for temporary fixing is eliminated. It can be reliably prevented.

Further, such an effect makes it unnecessary to inspect the remaining nails, so that the manufacturing process can be simplified and the cost can be reduced. Thus, it is possible to reliably prevent the user's foot from being damaged, and to improve the reliability or safety of the shoe. Furthermore, since the adhesive 9 of the adhesive layer formed on the upper surface side of the insole 10 is formed as the above-mentioned adhesive and has a large adhesive force, the adhesive 9 can be used during production, temporary storage, transportation and the like. The bottom 10 can be securely and temporarily fixed to the mold 1 without being separated from the mold 1.

When releasing the temporary fixing, the mold 1 can be separated from the midsole 10 by applying a temperature outside the above-mentioned temperature range to the adhesive 9 of the midsole 10 and melting it. Therefore, the step of removing the mold 1 is not hindered, and as a result, it can be optimally used as the insole 10 used in this type of shoe manufacturing method.

[0021]

[Embodiment 2] FIG. 6 is a sectional view showing a mold according to another embodiment of the present invention. In the mold 1 of the second embodiment, a heating element 13 made of an electric heating element is provided on the bottom surface side. When power is supplied to the heating element 13 through a lead wire 14, the heating element 13 generates heat. The adhesive 9 on the midsole 10 is melted by the heat generated by the body 13. That is, the temporary fixing of the insole 10 to the mold 1 and the heating and melting of the adhesive 9 at the time of releasing the temporary fixing are performed by the heat generated by the heating element 13.

As mentioned above, the invention made by the inventor has been specifically described based on the embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made without departing from the gist of the invention. Needless to say. For example, in the above-described embodiment, the mold 1 including the main body 2 made of resin or the like and the metal plate 3 which is in contact with the bottom surface side is used. It is possible to use a mold 1 consisting only of a metal or a mold 1 consisting only of a metal such as aluminum.

In addition, the insole 10 in the above-mentioned embodiment is formed by bonding a coarse cloth to the bottom side of paper. In the present invention, for example, the insole 10 made of resin or leather is used. Etc. can be used. Also,
In the first embodiment, a means for supplying hot air from a hot air source to the inlet 5 is used when the temporary fixing from the mold 1 of the insole 10 and the heating and melting of the adhesive 9 for releasing the temporary fixing are performed. However, in the present invention, it is also possible to supply steam to the inlet 5 instead of the hot air from the hot air source, and to heat and melt the adhesive 9 by heating the steam.

Furthermore, in the above embodiment, when the temporary fixing from the mold 1 of the insole 10 and the heating and melting of the adhesive 9 for releasing the temporary fixing, in the first embodiment,
Although a hot air unit is used and the heating element 13 made of an electric heating element is used in the second embodiment, the present invention is not limited to such a heating mechanism, and may be, for example, an arbitrary one such as electromagnetic induction heating. Can be used.

Further, as the adhesive 9 in the above embodiment, a synthetic adhesive mainly composed of a vinyl copolymer which is cured by heating at room temperature and which is heat-meltable is used. The application is not limited to a simple application, and an arbitrary adhesive can be applied.

[0026]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows. (1) According to the midsole of the present invention, the adhesive of the adhesive layer is melted at a temperature outside the above-mentioned predetermined temperature range, and the midsole is polymerized on the bottom side of the mold, and the predetermined temperature range is obtained. By curing and bonding the adhesive, the nail can be temporarily fixed to the mold. As a result, the nail for temporary fixing is not required, and the temporary nail can be reliably prevented from remaining. (2) Due to the above-described effects, it is not necessary to inspect the remaining nails, so that the manufacturing process can be simplified and the cost can be reduced. The foot can be reliably prevented from being damaged, and the reliability or safety of the shoe can be improved. (3) Since the adhesive of the adhesive layer formed on the upper surface side of the insole is an adhesive as described above and has a large adhesive strength,
The insole can be securely temporarily fixed to the mold without being peeled off from the mold during production, temporary storage, transportation, and the like.

When releasing the temporary fixing, the mold can be separated from the midsole by applying a temperature outside the above-mentioned temperature range to the adhesive at the midsole and melting it. The demolding process is not hindered, and as a result, it can be optimally used as an insole used in this type of shoe manufacturing method.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a method of manufacturing a shoe manufactured using an insole according to one embodiment of the present invention.

FIG. 2 is an explanatory view showing a method of manufacturing the shoe.

FIG. 3 is an explanatory view showing a method of manufacturing the shoe.

FIG. 4 is a bottom view showing a mold used in the shoe manufacturing method.

FIG. 5 is a sectional view of the mold.

FIG. 6 is a cross-sectional view showing a mold according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mold 2 Main body 2A Dividing member 2B Dividing member 3A plate 3B plate 4 Flow passage 5 Inlet 6 Outlet 7 Circular hole 8 Cut 9 Adhesive 10 Midsole 11 Upper 12 Shoe sole 13 Heating element 14 Lead wire

Claims (4)

(57) [Claims] 1. Hot air is blown out from an outlet opening at the bottom
An inner sole of the shoe temporarily fixed to the bottom surface of the shoe mold in which the flow passage to be formed is formed, and an adhesive layer for temporary fastening to the mold is formed corresponding to the outlet; An insole characterized in that the adhesive hardens and adheres within a predetermined temperature range and melts at a temperature outside the temperature range. 2. An inner sole of a shoe temporarily fixed to the bottom surface of a shoe mold provided with a heating element on a bottom surface side, wherein the adhesive layer for temporarily fixing the mold is formed by the heating element. An insole formed in such a manner that the adhesive cures and adheres in a predetermined temperature range and melts at a temperature outside the temperature range. 3. The insole according to claim 1, wherein the adhesive is an adhesive which is hardened at room temperature and meltable by heating. 4. The midsole according to claim 1, wherein the adhesive is mainly composed of a vinyl copolymer.