JP3349111B2 - Surface mount type light emitting diode and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted light-emitting diode which can be surface-mounted on a motherboard and a method of manufacturing the same, and more particularly to a surface-light-emitting type in which the wavelength of a light-emitting diode element is changed to change the emission color. The present invention relates to a mounting type light emitting diode.

[0002]

2. Description of the Related Art Conventionally, as a wavelength conversion type light emitting diode of this type, for example, the one shown in FIG. 14 is known (Japanese Patent Laid-Open No. 7-99345). This is a lead frame type light emitting diode 1. A concave portion 3 is provided in a metal post 2 on one side of the lead frame, and a light emitting diode element 4 is placed and fixed in the concave portion 3. The other side of the lead frame is connected to the metal stem 5 by a bonding wire 6, while the concave portion 3 is filled with a resin material 7 mixed with a fluorescent substance for wavelength conversion and the like, and the whole is made of a transparent shell. It has a structure sealed with an epoxy resin 8. In the light emitting diode 1 having such a structure, the light emission wavelength of the light emitting diode element 4 is converted by the resin material 7 filled in the concave portion 3, so that the light emitting diode element 4 originally emits light. Light emission different from the color can be applied.

[0003]

By the way, the fluorescent substance for wavelength conversion and the like mixed in the resin material 7 has the property of being easily aged by external ultraviolet rays or the like. Since the entire light emitting diode 1 is only sealed with the transparent epoxy resin 8, there is a problem that the fluorescent substance is easily affected by external ultraviolet rays.

Accordingly, a first object of the present invention is to make the structure of the light emitting diode a surface mount type and to make the wavelength conversion material such as the fluorescent substance less susceptible to external ultraviolet rays. It is to suppress aging of the wavelength conversion material.

A second object of the present invention is to prevent the brightness of the light emitting diode from being reduced due to the structure which is hardly affected by ultraviolet rays.

[0006]

According to a first aspect of the present invention, there is provided a surface mount type light emitting diode, comprising: a light emitting diode element mounted on an upper surface of a glass epoxy substrate; A light-emitting diode provided with a resin sealing body that seals the light-emitting diode element by filling the light-emitting diode element with a reflective frame disposed around the light-emitting diode element; A first resin sealing body for sealing the diode element, a second resin sealing body filled on the upper surface side of the glass epoxy substrate including the reflection frame while leaving the outer peripheral portion of the upper surface of the glass epoxy substrate; 2 on the top and peripheral sides of the resin sealing body
A third cap-shaped third resin that covers the outer surface of the second resin sealing body and is fixed to the outer periphery of the upper surface of the glass epoxy substrate by adhesive.
A wavelength conversion material is mixed in the first resin sealing body, and the wavelength conversion material is mixed in the second resin sealing body.
A diffuser for diffusing the light is mixed therein, and an ultraviolet absorber is mixed in the third resin sealing body.

According to a second aspect of the present invention, there is provided a surface mount type light emitting diode, wherein an upper surface of the filled first resin sealing body is lower than an upper edge of a reflection frame.

According to a third aspect of the present invention, in the surface mount type light emitting diode, the wavelength conversion material mixed in the first resin is a fluorescent substance made of a fluorescent dye or a fluorescent pigment. I do.

Further, a surface-mounted light emitting diode according to a fourth aspect of the present invention is mixed with the second resin sealing body.
The diffusing agent is characterized in that it is aluminum oxide or silicon dioxide .

[0010] A surface mount type light emitting diode according to a fifth aspect of the present invention is characterized in that a condensing lens portion is formed on an upper surface of the third resin sealing body.

According to a sixth aspect of the present invention, in the surface mounted light emitting diode, the light emitting diode element is a blue light emitting element made of a gallium nitride compound semiconductor or a silicon carbide compound semiconductor. .

According to a seventh aspect of the present invention, there is provided a method for manufacturing a surface mount type light emitting diode, comprising the steps of: forming an electrode pattern on an upper surface of a glass epoxy aggregate substrate; and bonding and fixing a reflection frame on the electrode pattern. Mounting a light-emitting diode element inside the reflection frame and connecting the electrode of the light-emitting diode element to the electrode pattern; and forming a first resin seal in which a wavelength conversion material is mixed in each of the reflection frames. A step of filling the stopper and sealing the light emitting diode elements, and using a mold in which the outer peripheral portion of the upper surface of each glass epoxy substrate is masked, and a diffusing material is mixed on the upper surface side of the glass epoxy aggregate substrate including the reflection frame. A second resin encapsulant filling step and an aggregate of the third resin encapsulant mixed with the ultraviolet absorber are formed in separate steps. The second resin A step of covering the glass epoxy aggregate substrate from above the stationary body and bonding an outer peripheral portion of the upper surface of the glass epoxy aggregate substrate exposed by the mold mask to the aggregate of the third resin sealing body; And cutting each light emitting diode along a cutting line assumed for each size of the substrate constituting each light emitting diode and dividing the light emitting diode into individual light emitting diodes.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a surface mount type light emitting diode and a manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings. 1 to 3 show an embodiment of a surface-mounted light emitting diode according to the present invention. Here, FIG. 1 is a perspective view showing a surface-mounted light-emitting diode, and FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 when the surface-mounted light-emitting diode is mounted on a motherboard. FIG. 2 is a sectional view taken along the line BB in FIG. 1. In the surface-mounted light emitting diode 11 according to this embodiment, a pair of electrodes (for example, a cathode electrode 13 and an anode electrode 14) are pattern-formed on the upper surface of a rectangular glass epoxy substrate (glass epoxy substrate) 12, and the center of the cathode electrode 13 is formed. The light emitting diode element 1 is
5, the upper electrode is connected to the anode electrode 14 by bonding wires 23, and then the upper surface of the glass epoxy substrate 12 is sealed with resin. As shown in FIGS. 2 and 3, the back electrodes 13a and 14a of the cathode electrode 13 and the anode electrode 14 formed on the back side of the glass epoxy substrate 12 are connected to the printed wirings 19a and 19b provided on the motherboard 18, respectively. Conducted.

The lower electrode of the light emitting diode element 15 is fixed to the central electrode portion 20 of the cathode electrode 13 by a conductive adhesive 22, and a cylindrical reflection frame 21 is arranged around the light emitting diode element 15. This reflection frame 21
Is the central electrode part 2 in the same manner as the light emitting diode element 15.
0. Further, the inner peripheral surface is inclined like a slash, and has a function of reflecting light emitted from the light emitting diode element 15 to the inner peripheral surface and condensing the light upward. Note that the inner peripheral surface may be mirror-finished in order to increase the reflectance of light from the light emitting diode element 15.

The light emitting diode element 15 disposed in the reflection frame 21 is a small chip having a substantially cubic shape, and has electrodes on the lower surface and the upper surface, respectively. As described above, the lower electrode is electrically connected to the center electrode portion 20 of the cathode electrode 13 via the conductive adhesive 22, while the upper electrode is connected to the anode electrode 14 by the bonding wire 23. The light emitting diode element 15 in this embodiment includes:
Although the blue light emitting device is made of a silicon carbide compound semiconductor, a blue light emitting device made of a gallium nitride compound semiconductor can also be used.

In this embodiment, a first resin sealing body 25 is filled in the reflection frame 21 for the purpose of converting the wavelength of the light emitting diode element 15. The first resin sealing body 25 is mainly composed of an epoxy-based transparent resin, into which a wavelength conversion material that emits long-wavelength visible light when excited by a blue light-emitting diode element is mixed. For example, a blue light emitting diode can be converted to white light to emit light. As the wavelength conversion material, a fluorescent substance made of a fluorescent dye, a fluorescent pigment, or the like is used. Organic fluorescent substances such as fluorescein and rhodamine are used as fluorescent dyes, and inorganic fluorescent substances such as calcium tungstate are used as fluorescent pigments. The wavelength region to be converted can be adjusted by changing the mixing amount of these fluorescent substances.

As shown in FIGS. 1 to 3, the filling amount of the first resin sealing body 25 is desirably set so that the upper surface thereof is lower than the upper edge 26 of the reflection frame 21. . By doing so, when a plurality of surface-mounted light-emitting diodes 11 are arranged close to each other, light emitted from one light-emitting diode is transmitted to the upper edge 2
6, it is possible to prevent the emission colors of both light emitting diodes from being mixed.

In this embodiment, the upper surface side of the glass epoxy substrate 12 including the reflection frame 21 is provided with a second resin sealing body 27.
Is sealed by. This second resin sealing body 27
Is the emission color after being wavelength-converted by the first resin sealing body 25 is intended to be directly transmitted, epoxy
Aluminum oxide, silicon dioxide, etc. in transparent resin
By mixing the diffusing agent , a more uniform emission color can be obtained. The second resin sealing body 27 is formed without exposing the entire upper surface of the glass epoxy substrate 12 and exposing the outer peripheral portion 12a of the upper surface.

Further, in this embodiment, a third resin sealing body 28 is formed above the second resin sealing body 27. As shown in FIG. 4, the third resin sealing body 28
The recess 30 is formed in a step different from the steps described above, and covers the upper surface 27 a and the peripheral side surface 27 b of the second resin sealing body 27. This recess 30 is provided in the second
A space corresponding to the shape of the resin sealing body 27 is formed, and when the third resin sealing body 28 is covered, the space closely contacts the upper surface 27a and the peripheral side surface 27b of the second resin sealing body 27, respectively. It is formed by a wall surface 30a and a side wall surface 30b. The adhesive 24 is applied to the lower wall surface 30c of the third resin sealing body 28 over the entire circumference, and when the adhesive 24 is put on the second resin sealing body 27, the outer periphery of the upper surface of the glass epoxy substrate 12 is removed. It is adhesively fixed to the portion 12a.

The third resin sealing body 28 is mainly composed of an epoxy-based transparent resin, similar to the second resin sealing body 27, and includes a salicylic acid derivative and 2-hydroxybenzophenone. An ultraviolet absorber such as a derivative is mixed. As described above, the third UV-absorbing agent is mixed.
By covering the outside of the second resin sealing body 27 with the resin sealing body 28, ultraviolet rays from external light are blocked, and as a result, the fluorescent substance mixed in the first resin sealing body 25 is The influence of ultraviolet rays is reduced and aging is suppressed.
Since the third resin sealing body 28 is intended to prevent the aging of the fluorescent substance due to ultraviolet rays, it is sufficient that the third resin sealing body 28 has a thickness that can effectively block ultraviolet rays.

In this embodiment, a hemispherical condenser lens portion 29 is integrally formed at the center of the upper surface of the third resin sealing body 28 so as to protrude. The condenser lens portion 29 is located above the reflection frame 21 and serves as a convex lens for condensing light from the light emitting diode element 15 reflected upward from the inner peripheral surface of the reflection frame 21. Has the function of That is, the light emitted from the light-emitting diode element 15 is divided into a light that goes straight upward and a light that goes upward after being reflected by the inner peripheral surface of the reflection frame 21.
The wavelength is converted by the resin sealing body 25, and the light emission color is further made uniform by the second resin sealing body 27, and then the light is condensed by the condensing lens portion 29, so that high-luminance white light emission can be obtained. Become. The radius of curvature, the shape, and the refractive index of the condenser lens portion 29 are not particularly limited as long as light can be collected. Note that the condenser lens portion 2 is provided on the third resin sealing body 28.
9 may not be provided.

As shown in FIGS. 2 and 3, the surface-mounted light-emitting diode 11 having the above structure can be directly mounted on the upper surface of the motherboard 18. That is, the printed wiring 19 formed on the upper surface of the motherboard 18
a, 19b, the surface mount type light emitting diode 11 is placed upward, and the back electrodes 13 on both right and left sides of the glass epoxy substrate 12 are placed.
The mounting of the light-emitting diode with the height reduced by soldering a and 13b is completed. In this manner, light converted from blue light emission to white light emission is emitted from the surface-mounted light emitting diode 11 mounted on the motherboard 18 while having directivity upward without discoloration.

FIGS. 5 to 13 show a method of manufacturing the surface-mounted light-emitting diode 11 having the above-described configuration. In order to manufacture a large number of light-emitting diodes at the same time, a glass epoxy aggregate substrate 31 is used. FIG. 5 shows an electrode pattern 32 constituting a cathode electrode and an anode electrode for each of the above-mentioned glass epoxy substrates 12 on the glass epoxy aggregate substrate 31.
And the steps up to the formation of the long-hole through-hole portion 33 for partitioning the individual glass epoxy substrates 12.

FIG. 6 shows a process of positioning the reflection frame assembly 35 on the upper surface of the glass epoxy assembly substrate 31, placing the reflection frame 21 at a predetermined position of the electrode pattern 32, and bonding and fixing the same. .

In the next step, as shown in FIG. 7, the light emitting diode elements 15 are placed in the respective reflection frames 21 of the glass epoxy assembly board 31, and the lower electrode of the light emitting diode elements 15 is mounted on the central electrode portion 20. The conductive adhesive 22 is used for bonding. After the light emitting diode element 15 is fixed in a curing furnace, the upper surface electrode of the light emitting diode element 15 and the anode electrode 14 of the glass epoxy aggregate substrate 31 are bonded to the bonding wire 2.
Connect by 3.

FIG. 8 shows a sealing step of the first resin sealing body 25. In this sealing step, the first resin sealing body 25 into which the fluorescent substance has been mixed is poured into each of the reflection frames 21, and is filled above the upper electrode of the light emitting diode element 15. At the time of filling, care is taken so that the upper surface of the first resin sealing body 25 does not reach the upper edge 26 of the reflection frame 21. After the filling, the first resin sealing body 25 is cured by heat in a curing furnace.

FIGS. 9 and 10 show a sealing step of the second resin sealing body 27. FIG. In this sealing step, a mold 36 is set on the upper surface of the glass epoxy aggregate substrate 31, and the second resin sealing body 27 is poured into the mold 36 to simultaneously seal the entire upper surface of the glass epoxy aggregate substrate 31. It is. The mold 36 surrounds the outer periphery of the glass epoxy assembly substrate 31 and at the same time, a mold mask portion 37 in the Y direction along the elongated through-hole portion 33 and a mold mask portion 38 in the X direction orthogonal to this.
The mold mask portions 37 and 38 divide the glass epoxy aggregate substrate 31 into a lattice shape. Second resin sealing body 27 filled on the upper surface of glass epoxy aggregate substrate 31
Is thermally cured by heating in a curing furnace.

FIGS. 11 and 12 show the third resin sealing body 2.
8 shows a sealing step of No. 8; When the mold 36 is removed, the glass epoxy aggregate substrate 31 has a gap 39 formed between the adjacent second resin sealing bodies 27, so that the outer peripheral portion 12a of the upper surface of each glass epoxy substrate 12 is exposed. On the other hand, the third resin sealing body 28 is formed as an aggregate 40 in a separate step, and is covered over the glass epoxy aggregate substrate 31.
Each of the recesses 30 of the assembly 40 is fitted into the second resin sealing body 27, and is bonded to the outer peripheral portion 12a via the adhesive 24 applied to the lower wall surface 30c of the assembly 40 in advance. Thereafter, this is put into a cure furnace to solidify the adhesive 24.

FIG. 13 shows that the light emitting diode element 15 mounted on the glass epoxy assembly substrate 31 is
5 shows a state of being sealed by a three-layer structure of a second resin sealing body 27 and a third resin sealing body 28. As shown in FIGS. 11 and 13, such a glass epoxy aggregate substrate 31 is diced or sliced in a grid along cutting lines 41 and 42 in the X and Y directions assumed on the substrate in advance. Are divided into the surface-mount-side light-emitting diodes 11 as shown in FIG. Each of the divided surface-mounted light emitting diodes 11 is vacuum-adsorbed by an automatic mounting machine (not shown) and transferred onto the motherboard 18.

In each of the above embodiments, the connection method using the bonding wire 23 has been described. However, the present invention is not limited to this. For example, a connection method such as flip chip mounting using solder bumps is also available. Included.

[0031]

As described above, according to the surface mount type light emitting diode of the present invention, the third resin encapsulant in which the outer surface of the second resin encapsulant is mixed with an ultraviolet absorbent. , The wavelength conversion material located inside the second resin sealing body is hardly affected by external ultraviolet rays and the like, and the aging of the wavelength conversion material can be suppressed. The first tree mixed with the wavelength conversion material
The second resin encapsulant mixed with the diffusing agent on the grease encapsulant
Provided, the wavelength was converted by the first resin sealing body.
Emitting color can be emitted more uniformly.

Further, according to the present invention, the third resin sealing body is formed in a separate step, and this is put on the second resin sealing body. Third to the peripheral side of
, And the ultraviolet absorbing effect is further exhibited.

Further, according to the present invention, since the ultraviolet absorbent is mixed only in the third resin sealing body and is not mixed in the second resin sealing body, the luminance of the light emitting diode by the ultraviolet absorber is reduced. Reduction can be minimized.

Further, according to the present invention, since the upper surface of the first resin sealing body filled in the reflection frame is lower than the upper edge of the reflection frame, a plurality of surface-mounted light emitting diodes are arranged close to each other. Even at the time, light emission from one light emitting diode can be blocked by the upper edge of the reflection frame of the other light emitting diode,
The emission colors of both light emitting diodes do not mix.

Further, according to the method of manufacturing a surface-mounted light-emitting diode according to the present invention, a large number of surface-mounted light-emitting diodes can be simultaneously formed on the glass epoxy aggregate substrate, so that the cost can be greatly reduced and the economical effect can be obtained. Is big. Furthermore, in addition to the condensing lens part being molded integrally with the sealing resin encapsulant, automatic mounting on the motherboard is also possible, such as reducing man-hours, improving yield, and improving reliability. Can be.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an embodiment of a surface-mounted light emitting diode according to the present invention.

FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 when the surface-mounted light-emitting diode is mounted on a motherboard.

FIG. 3 is a cross-sectional view taken along the line BB in FIG. 1 when the surface-mounted light emitting diode is mounted on a motherboard.

FIG. 4 is a cross-sectional view when a third resin sealing body made in another process is put on the second resin sealing body.

FIG. 5 is a perspective view showing an electrode pattern forming step when the surface-mounted light emitting diode is manufactured on a collective substrate.

FIG. 6 is a perspective view showing a step of mounting a reflection frame assembly on the assembly substrate.

FIG. 7 is a sectional view showing a step of mounting a light emitting diode element on the collective substrate and performing wire bonding.

FIG. 8 is a cross-sectional view showing a step of sealing the light emitting diode elements on the collective substrate with a first resin sealing body.

FIG. 9 is a perspective view showing a step of sealing the upper portion of the collective substrate with a second resin seal using a mold.

FIG. 10 is a sectional view taken along the line CC of FIG. 9;

FIG. 11 is a perspective view showing a step of sealing an upper portion of the second resin sealing body with a third resin sealing body.

FIG. 12 is a sectional view taken along the line DD in FIG. 11;

FIG. 13 shows a collective substrate sealed with a third resin sealant,
It is sectional explanatory drawing at the time of dividing | segmenting along the cutting line of ay direction.

FIG. 14 is a cross-sectional view illustrating an example of a conventional wavelength conversion type light emitting diode.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Surface mount type light emitting diode 12 Glass epoxy substrate 12a Upper surface outer peripheral part 13 Cathode electrode 14 Anode electrode 15 Light emitting diode element 21 Reflection frame 25 First resin sealing body 26 Upper edge of reflection frame 27 Second resin sealing body 28 3 Resin sealing body 29 Condensing lens part 31 Glass epoxy assembly substrate 36 Mold 40 Aggregation of third resin sealing body 41 Cutting line in X direction 42 Cutting line in Y direction

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-10-242526 (JP, A) JP-A-7-99345 (JP, A) JP-A-61-158606 (JP, A) 109556 (JP, U) Real opening 63-108655 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 33/00 H01L 23/28 H01L 23/29 H01L 23/31 JICST File (JOIS)

Claims (7)

(57) [Claims] 1. A surface-mounted light emitting diode comprising: a light emitting diode element mounted on an upper surface of a glass epoxy substrate; and a resin sealing body filled on the upper surface side of the glass epoxy substrate to seal the light emitting diode element. A reflection frame arranged around the light emitting diode element,
A first resin sealing body filled in the reflection frame and sealing the light emitting diode element, and a second resin filling the upper surface side of the glass epoxy substrate including the reflection frame except for an outer peripheral portion of the upper surface of the glass epoxy substrate. And an outer surface of the second resin-sealed body covered on the upper surface and the peripheral side surface of the second resin-sealed body.
And a cap-shaped third resin sealing body adhered and fixed to an outer peripheral portion of the upper surface of the glass epoxy substrate, wherein a wavelength conversion material is mixed in the first resin sealing body ,
The second resin sealing body has a diffusion for diffusing the wavelength-converted light.
Agent is mixed, and the third resin for sealing body, characterized in that the ultraviolet absorber is mixed a surface mounted light emitting diode. 2. An upper surface of the filled first resin sealing body is lower than an upper edge of a reflection frame.
A surface-mounted light emitting diode as described. 3. The surface-mounted light-emitting diode according to claim 1, wherein the wavelength conversion material mixed into the first resin sealing body is a fluorescent substance made of a fluorescent dye or a fluorescent pigment. 4. Diffusion mixed in the second resin sealing body.
The surface mount type light emitting diode according to claim 1 , wherein the agent is aluminum oxide or silicon dioxide . 5. The surface mounted light emitting diode according to claim 1, wherein a condenser lens portion is formed on an upper surface of the third resin sealing body. 6. The surface-mounted light emitting diode according to claim 1, wherein the light emitting diode element is a blue light emitting element made of a gallium nitride compound semiconductor or a silicon carbide compound semiconductor. 7. A step of forming an electrode pattern on the upper surface of the glass epoxy aggregate substrate and bonding and fixing a reflection frame on the electrode pattern; mounting a light emitting diode element inside each reflection frame; A step of connecting an electrode and the electrode pattern, a step of filling the first resin sealing body in which the wavelength conversion material is mixed into the respective reflection frames, and sealing the light emitting diode element; A step of filling the upper surface side of the glass epoxy aggregate substrate including the reflection frame with a second resin sealing body mixed with a diffusing material, using a mold in which the outer peripheral portion of the upper surface of the glass epoxy substrate is masked; Forming an aggregate of the mixed third resin encapsulant in a separate step, covering the aggregate of the third resin encapsulant on the glass epoxy aggregate substrate from above the second resin encapsulant,
Bonding the outer peripheral portion of the upper surface of the glass epoxy aggregate substrate exposed by the mold mask to the aggregate of the third resin sealing body; and emitting light along respective cutting lines assumed for the glass epoxy aggregate substrate. Cutting the substrate for each size of the substrate constituting the diode and dividing the substrate into individual light emitting diodes.