JP3299160B2 - Electronic component mounting method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting an electronic component at a mounting position on a substrate.

[0002]

2. Description of the Related Art Conventionally, a first observation device (for example, a CCD camera or the like) for observing an electronic component from below and a second observation device (for example, a CCD camera or the like) for observing a mark on a substrate.
A method of mounting electronic components by correcting the mounting position of the electronic components using the two devices is known (for example, JP-A-63-2633). A reference for arbitrary correction (the center of the observation device is large) is determined for each observation device, the amount of correction is determined, and after mounting to an arbitrary mounting target position, the device is actually mounted with the original correct mounting target position. This is a method of setting the amount of deviation from the shifted position as the amount of offset.

[0003]

In the position correction method using two observation devices, an error occurs in the correction amount when the positional relationship between the two observation devices changes. In the electronic component mounting apparatus, when the electronic component mounting apparatus is operated, a position change occurs due to, for example, heat generated from a servomotor, a guide, a ball screw, or the like. For this reason, there has been a problem that mounting accuracy cannot be improved or maintained.

[0004] In view of the above, the present invention provides a method in which one observation criterion is measured simultaneously or individually by two upper and lower observation devices.
It is an object of the present invention to provide an electronic component mounting method and apparatus capable of accurately measuring the positional relationship of a stand observation device and improving the mounting accuracy of electronic components on a substrate.

[0005] Other objects and novel features of the present invention will be clarified in embodiments described later.

[0006]

In order to achieve the above object, an electronic component mounting method according to the present invention comprises a first observation device for observing an electronic component held by a mounting head from below, and a holding device mounted on a mounting stage. by using a second observation apparatus for observing from above the substrate, the electronic component held by the mounting head moves relative to the mounting stage, the mounting
An electronic component mounting method for mounting at a mounting target position on a substrate held by a stage , wherein the electronic component mounting method is common to the first and second observation devices in order to recognize a relative position of the first and second observation devices. Is provided on the mounting stage, and the observation reference is observed by the first and second observation devices, respectively.

Further, in the electronic component mounting method, the recognition of the relative position of the first and second observation devices by observing the observation reference with the first and second observation devices includes the step of: A configuration in which one or a plurality of components are mounted on the substrate, or a configuration in which the configuration is performed at regular intervals may be employed.

An electronic component mounting apparatus according to the present invention includes a mounting stage, a mounting head that moves relative to the mounting stage, a first observation device that observes an electronic component held by the mounting head from below, A second observation device for observing a mounting target position on a substrate held on a mounting stage from above, and the first and second observations for recognizing a relative position of the first and second observation devices. device and a common observation reference, the observation criteria provided in the mounting stage
It is characterized by having.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component mounting method and apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment in which an electronic component 2 held by a mounting head 1 is mounted on a substrate positioned and held by a mounting stage 3. The mounting stage 3
Is a structure for moving a table on which a substrate is positioned and mounted, and constitutes a table moving device. The mounting head 1 and the mounting stage 3 can move relative to each other. Here, the driving axis of the mounting stage 3 is set to the X-axis perpendicular to the paper surface.
(Not shown) (the mounting stage 3 is movable in the X-axis direction), and the driving axis of the mounting head 1 is the Y-axis (the mounting head 1 is the Y-axis).
(Movable in the axial direction).

A first observation device (for example, a CCD camera or the like) 4 for measuring the electronic component 2 is fixed, and the mounting head 1
The electronic component 2 sucked and held at the position is set at a position where an image can be taken from below.

The mounting head 1 has a second observation device (for example, a CCD) for measuring a target position where the electronic component 2 on the substrate is to be mounted (hereinafter referred to as a mounting target position).
Camera 5) on the movement line of the mounting nozzle 1a (the mounting head 1 has for picking up electronic components),
The observation device 5 is configured to move integrally with the mounting head 1. The mounting target position on the substrate is defined by, for example, a positioning mark of an IC or the like provided on the substrate, an electrode pattern to which an electronic component terminal is connected, and the like.

An observation reference mark 6 for examining the positional relationship between two observation devices is provided on the mounting stage 3. At this time, it is important that the observation reference mark 6 can be observed under exactly the same conditions in both the first and second observation devices 4 and 5. In the present embodiment, the observation reference mark 6 is oriented in the X-axis direction.
Installed on the stage 3 that can move
By operating the drive shaft of the jaws 3 , the imaging by the second observation device 5 is enabled, and the observation reference mark 6 is designed to pass through the observation position of the fixed observation first observation device 4. It is possible to measure the relative positions of the two observation devices 4 and 5.

The observation reference mark 6 is, for example, a thin plate having a small through hole or a transparent glass plate having a predetermined pattern.

In this embodiment, when the electronic component 2 to be mounted on the substrate is sucked and held by the mounting head 1 and mounted on the mounting target position of the substrate positioned and mounted on the mounting stage 3, first, Then, the common observation reference mark 6 is observed (imaged) by the second observation devices 4 and 5, and the first and second observation
The mutual positional relationship between the observation devices 4 and 5 is recognized. Then, the position of the electronic component 2 held by the mounting head 1 and the mounting target position on the substrate held by the mounting stage 3 are represented by positional information based on the observation results of the first and second observation devices 4 and 5. The electronic component 2 is mounted by the mounting head 1 at the mounting target position on the substrate.

As described above, the observation reference mark 6 is observed by the first and second observation devices 4 and 5 each time one electronic component mounting operation is performed, and the relative position between the observation devices is updated each time to perform the correction calculation. I do. This cancels out the influence of the position shift of the observation device caused by various disturbances such as heat and vibration,
This solves the problem of the mounting system caused by two observation devices.

The first and second observation devices 4 and 5
The recognition of the relative position of the first and second observation devices 4 and 5 by observing the observation reference mark 6 by the electronic component 2
Is most preferably performed each time one of the first and second observation devices 4 and 5 is mounted on the substrate, or each time a plurality of the relative positions of the first and second observation devices 4 and 5 are mounted, or every fixed time. It may be performed.

According to this embodiment, the following effects can be obtained.

(1) By measuring one observation reference mark 6 simultaneously or individually with the lower and upper observation devices 4 and 5, the positional relationship between the two observation devices 4 and 5 can be accurately measured. . It is important that the observation reference mark 6 can be observed by the two observation devices 4 and 5 under exactly the same conditions.

(2) The measurement of the observation reference mark 6 is performed by
The measurement may be automatically performed once or plural times, or at fixed time intervals. The above means cancels the position change of the observation devices 4 and 5 and the mounting head 1 caused by heat, vibration, and the like. In addition, it is not necessary to adjust the alignment.

[0021]

Although the embodiments of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited to the embodiments and that various modifications and changes can be made within the scope of the claims. There will be.

[0023]

As described above, according to the present invention,
By simultaneously or individually measuring one observation reference provided on the mounting stage with the upper and lower observation devices, the positional relationship between the two observation devices can be accurately measured. Then, the measurement of the observation standard may be automatically measured every one or plural mounting operations, or at regular time intervals, whereby heat,
Changes in the position of the observation device and the mounting head caused by vibrations and the like can be canceled, and adjustment of alignment is not required. Further, even when two observation devices are required due to the device configuration, one observation device can be used. The same positioning accuracy as the configuration by the observation device can be expected.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an embodiment of an electronic component mounting method and apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mounting head 2 Electronic component 3 Mounting stage 4,5 Observation device 6 Observation reference mark

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hitoshi Nakayama 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (56) References JP-A-11-40996 (JP, A) (58) Survey Field (Int.Cl. ⁷ , DB name) H05K 13/04 H05K 13/08

Claims (4)

(57) [Claims] A first observation device for observing the electronic component held by the mounting head from below, and a second observation device for observing the substrate held by the mounting stage from above,
An electronic component held by the mounting head that moves relative to the mounting stage is held by the mounting stage.
An electronic component mounting method for mounting at a mounting target position on a substrate , wherein an observation standard common to the first and second observation devices is used in order to recognize a relative position of the first and second observation devices. Said
An electronic component mounting method provided on a mounting stage, wherein the observation reference is observed by the first and second observation devices, respectively. 2. Recognition of the relative position of the first and second observation devices by observing the observation reference with the first and second observation devices, by using one or more electronic components on the substrate. The electronic component mounting method according to claim 1, wherein the method is performed each time a component is mounted. 3. The electronic device according to claim 1, wherein the relative positions of the first and second observation devices are recognized at regular intervals by observing the observation reference with the first and second observation devices. Component mounting method. 4. A mounting stage, a mounting head relatively moving with respect to the mounting stage, a first observation device for observing an electronic component held by the mounting head from below, and held on the mounting stage. A second observation device for observing the mounting target position on the substrate from above, and an observation standard common to the first and second observation devices for recognizing a relative position between the first and second observation devices. the provided, the electronic component mounting apparatus characterized by the observation reference is provided on the mounting stage.