JP3261883B2 - Electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component on an electronic component provided on a parts feeder by transferring the electronic component to a substrate by a transfer head having a camera for recognizing the substrate.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus, there is known an electronic component mounting apparatus in which an electronic component (hereinafter, referred to as a chip) provided in a parts feeder is transferred and mounted on a substrate by a transfer head having a camera for substrate recognition. Hereinafter, a method of mounting a chip using a conventional electronic component mounting apparatus of such a system will be described.

FIGS. 4 (a), 4 (b) and 4 (c) are partial plan views of a conventional electronic component mounting apparatus, which are shown in the order of operation. FIG. 4A shows a state in which chips are transferred and mounted on a substrate by a transfer head. In the figure, reference numeral 1 denotes a substrate, which is positioned on a guide rail 2 provided with a belt conveyor. . The substrate 1 is conveyed in the N direction, and its front end face is a rod 4 of a cylinder 3 whose stopper is a stopper.
To stop at a predetermined position for positioning.

[0004] Reference numerals 51 to 5n denote parts feeders arranged on the side portions of the guide rails 2, which are chips 1 of various types.
0 is provided. As the parts feeders 51 to 5n,
Tape feeders and tube feeders are frequently used.
Reference numeral 6 denotes a transfer head, which has a nozzle 7 for vacuum-sucking the chip 10 and a camera 8 for substrate recognition.
Is provided integrally. The transfer head 6 is driven by an XY direction moving device (not shown) and horizontally moves in the X direction and the Y direction. Marks A and B, which are characteristic portions for position recognition, are formed diagonally to each other at corners of the substrate 1.
Hereinafter, these marks A and B are referred to as point A and point B, respectively.

In FIG. 4A, the transfer head 6 moves above the parts feeders 51 to 5n, and
Is picked up by vacuum suction with the nozzle 7 and the substrate 1
Is moved above the predetermined coordinate position, and the chip 10 is mounted. In the figure, arrows Q1 to Qn indicate parts feeders 51 to 5 respectively.
n is a trajectory of the transfer head 6 that moves from n to a predetermined coordinate position above the substrate 1 and mounts the chips 10 one after another.

When the mounting of the chip 10 on the substrate 1 is completed, the rod 4 of the cylinder 3 is retracted downward as shown in FIG. 4B, and the substrate 1 is transported to the next step (see arrow N). ). At this time, the transfer head 6 on which the mounting operation has been completed retreats to the retreat position beside the guide rail 2.

Subsequently, as shown in FIG. 4C, the next substrate 1 is conveyed on the guide rail 2 by the belt conveyor and hits the rod 4 of the cylinder 3 and stops. Then, the transfer head 6 moves from the retreat position to the point A (trajectory S1), and observes the point A with the camera 8 to recognize the position. Next, the transfer head 6 moves above the point B (trajectory S
2) Observe point B with camera 8 to recognize its position.
From the recognized positions of the point A and the point B, an accurate position of the substrate 1 is calculated by the computer. Since this calculation method is well known, the description is omitted.

When the points A and B are recognized as described above, as shown by the locus S3, the transfer head 6 is moved from the point B to the parts feeder provided with the chip 10 to be mounted first (in this example, a parts feeder). Thereafter, the chips 10 are transferred and mounted on the substrate 1 one after another as described with reference to FIG.

[0009]

As described above, prior to mounting the chip 10 on the substrate 1, the transfer head 6
Is moved from the retreat position to point A (locus S1 in FIG. 4 (c)), and then to point B (locus S2) to perform board recognition. Of the chip 10 is started. That is, in the above-mentioned conventional method, a step of moving the transfer head 6 from the retreat position to the point A as shown by a locus S1 in FIG. 4C is included, but this step must be performed every time the substrate 1 changes. Therefore, when the chips 10 are mounted on a large number of substrates 1, a large amount of time is lost.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of mounting an electronic component which can reduce a loss time associated with observation of a characteristic portion by a camera and improve a mounting efficiency of a chip.

[0011]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a transfer head provided with a camera when a substrate on which chips have been mounted is carried out to the next step. Is made to wait above the expected position.

More preferably, before the transfer head waits at the expected position, the transfer head is moved above a parts feeder provided with the first electronic component to be mounted on the next substrate to remove the electronic component. After picking up,
It is designed to wait at the expected position.

[0013]

According to the above construction, when the next substrate is transported to the predetermined position, the characteristic portion can be immediately observed by the camera, so that the moving from the retreat position to the position above the characteristic portion is performed as in the conventional method. Loss time required for
In addition, by picking up the first electronic component in advance and waiting, the time required from when the board is transported to a predetermined position to when the first electronic component is mounted on the board can be reduced.

[0014]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIGS. 2A, 2B, and 2C are partial plan views of the same, and FIG. 3 is a block diagram of the control system. In each figure,
The same components as those in the conventional example shown in FIG.

In FIG. 1, a first component supply section 5A and a second component supply section 5B are provided on both sides of the guide rail 2, and part feeders 51 to 5n are respectively provided side by side. Numeral 11 is a nut connected to the transfer head 6 and screwed to a feed screw 12 in the X direction. Motor 1
3 is driven to rotate the feed screw 12, the transfer head 6
Moves in the X direction along the feed screw 12.

A nut 15 is connected to an end of the frame 14 on which the feed screw 12 is provided. Nut 15 is Y
When the motor 17 is driven to rotate the feed screw 16, the transfer head 6 on the frame 14 moves in the Y direction. 18 indicates that the frame 14 is Y
It is a guide rail for guiding movement in the direction. 19
Is a camera for recognizing the chip, which observes the chip 10 vacuum-adsorbed to the lower end of the nozzle of the transfer head 6 from below, and detects the displacement. Reference numeral 3 denotes a cylinder as a stopper, and when the substrate detection sensor 37 (see FIG. 2B) detects the substrate 1, the rod 4 of the cylinder 3 projects upward.

In FIG. 3, motors 13 and 17, transfer head 6, and cylinder 3 are respectively driven by drive circuits 31, 32,
It is connected to a control unit (CPU) 40 via 33 and 34. The board recognition camera 8 provided integrally with the transfer head 6 is connected to a control unit 40 via a recognition circuit 35. Reference numeral 41 denotes a storage unit connected to the control unit 40, which stores coordinates of points A and B, component mounting data, and the like. The numbers 1, 2, 3, ... in the component mounting data
... is the chip number, A, B, C ... are the chip types,
x and y are coordinates of a chip mounted on the substrate 1.

This electronic component mounting apparatus has the above-described configuration. Next, the operation will be described with reference to FIG. FIG. 2A shows the same state as FIG. 4A, in which the transfer head 6 moves above the parts feeders 51 to 5n, and picks up the chip 10 by vacuum suction with the nozzle 7.
The chip 10 is moved above a predetermined coordinate position of the substrate 1 and the chip 10 is mounted. In the figure, arrows Q1 to Qn indicate the parts feeder 5
This is a trajectory of the transfer head 6 that moves from 1 to 5n to a predetermined coordinate position above the substrate 1 and mounts the chips 10 one after another.

When the mounting of all the chips 10 on the substrate 1 is completed, as shown in FIG.
Is pulled down, and the substrate 1 is transported to the next step. At this time, the transfer head 6 after the completion of the mounting operation is moved above the parts feeder (in this example, the parts feeder 53) provided with the chip 10 to be mounted first on the next substrate 1 as shown by the locus R1. And insert the tip 10 into the nozzle 7
Is picked up by vacuum suction, the camera 8 is moved to the expected position of the next point A on the substrate 1 and waits for the next substrate 1 to be transported at this expected position (transfer indicated by a chain line). See head 6).

Next, as shown in FIG. 2 (c), the next substrate 1 is conveyed and hits the rod 4 of the cylinder 3 and stops. At this time, since the camera 8 is waiting at the expected position of the point A, the camera 8 immediately observes the point A,
Observe point B by moving in the direction shown by 2 and further trace R3
Then, the first chip 10 that has been vacuum-adsorbed is mounted on the substrate 1 at a predetermined coordinate position. While the transfer head 6 is moving in the direction indicated by the locus R3,
The correct position of the substrate 1 is calculated from the detected positions of the points A and B, and the chip 10 is mounted at a predetermined coordinate position based on the calculation result. In FIG. 2C,
The second and subsequent chips 10 are mounted one after another by the transfer head 6 moving between the parts feeders 51 to 5n and the substrate 1 as in the case shown in FIG.

[0021]

As described above, according to the present invention, when the next substrate is conveyed to a predetermined position, its characteristic portion can be immediately observed by a camera. Loss time required to move to above the characteristic portion can be eliminated. Also, before the transfer head waits at the expected position, the transfer head is moved above the parts feeder provided with the first electronic component mounted on the next board to pick up the electronic component.
Because it is made to stand by at the expected position, by picking up the first electronic component in advance and waiting,
The time required for mounting the first electronic component on the substrate after the substrate is transported to the predetermined position can also be reduced. Therefore, the loss time when the substrate is changed can be reduced as much as possible, and the mounting efficiency can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2A is a partial plan view of an electronic component mounting apparatus according to one embodiment of the present invention; FIG. 2B is a partial plan view of an electronic component mounting apparatus according to one embodiment of the present invention; Partial plan view of electronic component mounting device

FIG. 3 is a block diagram of a control system of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 4A is a partial plan view of a conventional electronic component mounting apparatus. FIG. 4B is a partial plan view of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Guide rail 6 Transfer head 7 Nozzle 8 Camera 10 Electronic component (chip) 51-5n Parts feeder

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-63-2633 (JP, A) JP-A-2-121399 (JP, A) JP-A-5-55792 (JP, A) JP-A-6-63 247512 (JP, A) JP-A-1-292900 (JP, A) JP-A-4-345300 (JP, A) JP-A-6-69699 (JP, A) JP-A-62-20071 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (2)

(57) [Claims] 1. A first step of transporting a substrate on a transport path and stopping the substrate at a predetermined position, and observing a feature provided on the substrate by a camera provided on a transfer head to determine the position of the substrate. A second step of recognizing; moving the transfer head above a parts feeder to vacuum-suction and pick up an electronic component provided on the parts feeder to a nozzle; and moving the electronic component to a predetermined coordinate position on the substrate. A third step of transferring and mounting; and a fourth step of unloading the substrate to a next step when the mounting of the electronic component on the substrate by the transfer head is completed, A mounting method for the electronic component, wherein the mounting step is performed when the substrate is carried out to the next step in the fourth step. Mounting method of the electronic component, characterized in that the camera, to stand above the expected position of the feature of the next substrate being conveyed in the first step. 2. Prior to a camera provided on the transfer head waiting at the expected position, the transfer head is moved above a parts feeder having electronic components mounted first on the next substrate. 2. The electronic component mounting method according to claim 1, wherein the electronic component is moved and picked up, and then waits at the expected position.