JP3190774B2 - Lead frame for LED lamp and LED display device - Google Patents
Lead frame for LED lamp and LED display deviceInfo
- Publication number
- JP3190774B2 JP3190774B2 JP32655293A JP32655293A JP3190774B2 JP 3190774 B2 JP3190774 B2 JP 3190774B2 JP 32655293 A JP32655293 A JP 32655293A JP 32655293 A JP32655293 A JP 32655293A JP 3190774 B2 JP3190774 B2 JP 3190774B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- lead frame
- led mounting
- light
- leds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、異なる発光色で発光す
る複数のＬＥＤを有するＬＥＤランプに使用されるＬＥ
Ｄランプ用リードフレーム及びこれを用いたＬＥＤ表示
装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LE for use in an LED lamp having a plurality of LEDs emitting light of different colors.
The present invention relates to a lead frame for a D lamp and an LED display device using the same.
【０００２】[0002]
【従来の技術】従来、異なる発光色で発光する２個以上
のＬＥＤを有するＬＥＤランプに使用されるリードフレ
ームとしては、例えば図７に示すようなものがあった。2. Description of the Related Art Conventionally, as a lead frame used for an LED lamp having two or more LEDs emitting light of different colors, for example, there is one shown in FIG.
【０００３】図７は、従来のＬＥＤランプ用リードフレ
ームを示す斜視図である。FIG. 7 is a perspective view showing a conventional LED lamp lead frame.
【０００４】このリードフレームは、２個のＬＥＤをそ
れぞれ載置するための２本のフレーム１０１，１０２
と、２個のＬＥＤとボンディングされる１本の直線フレ
ーム１０３とで構成されている。さらに、フレーム１０
１，１０２の一方の端部には形状が同一のＬＥＤ載置部
１０４，１０５がそれぞれ形成され、それらには、ＬＥ
Ｄを載置するＬＥＤ載置面１０４ａ，１０５ａと光反射
壁面１０４ｂ，１０５ｂとがそれぞれ形成されている。The lead frame has two frames 101 and 102 on which two LEDs are mounted, respectively.
And one linear frame 103 bonded to two LEDs. Further, the frame 10
The LED mounting portions 104 and 105 having the same shape are formed at one end of each of the LED mounting portions 102 and 102.
LED mounting surfaces 104a and 105a on which D is mounted and light reflecting wall surfaces 104b and 105b are formed, respectively.
【０００５】図８（ａ），（ｂ），（ｃ）は、上記のリ
ードフレームの製造方法を示す製造工程図である。FIGS. 8 (a), 8 (b) and 8 (c) are manufacturing process diagrams showing a method for manufacturing the above-described lead frame.
【０００６】まず、図８の（ａ）のような棒状の３本の
フレーム１０１，１０２，１０３を形成し、その後、フ
レーム１０１，１０２の各々のＬＥＤ載置部１０４，１
０５について図８（ｂ）に示すようにそれぞれＶ字形溝
１０１ａ，１０２ａを形成する。そして、図９に示すよ
うな一様の角度θと高さｈの逆皿形のポンチを用い、Ｖ
字形溝１０１ａ，１０２ａをそれぞれプレス加工すれ
ば、図７で示した形状のリードフレームが完成する（図
８（ｃ））。First, three rod-shaped frames 101, 102, and 103 as shown in FIG. 8A are formed, and then the LED mounting portions 104 and 1 of the frames 101 and 102 are formed.
As shown in FIG. 8 (b), V-shaped grooves 101a and 102a are respectively formed for 05. Then, an inverted dish-shaped punch having a uniform angle θ and a height h as shown in FIG.
If the letter-shaped grooves 101a and 102a are pressed, the lead frame having the shape shown in FIG. 7 is completed (FIG. 8C).
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、上記構
成のリードフレームでは、各々のＬＥＤ載置部の形状が
同形であるため、該ＬＥＤ載置部の光の主取り出し方向
への光り取り出し効果は等しくなり、搭載するＬＥＤの
光出力が異なる場合には、この光り取り出し効果を各々
のＬＥＤ載置部によって操作することができなかった。However, in the lead frame having the above-described structure, since the LED mounting portions have the same shape, the LED mounting portions have the same light extraction effect in the main extraction direction of light. In the case where the mounted LEDs have different light outputs, the light extraction effect cannot be operated by each LED mounting portion.
【０００８】そのため、ＬＥＤランプにおける各々のＬ
ＥＤのピーク光出力が異なる場合には、各ＬＥＤに流れ
る電流を変えて明るさのバランスをとるようにしてい
た。ところが、該電流が同一に固定された実装基板上で
は、各ＬＥＤの明るさのバランスをとることができない
という問題があった。Therefore, each L in the LED lamp is
When the peak light output of the ED is different, the current flowing through each LED is changed to balance the brightness. However, there is a problem that the brightness of each LED cannot be balanced on the mounting substrate on which the current is fixed to the same.
【０００９】また、各々の異なるＬＥＤからの発光は、
一般的には各々の角度分布が異なるため、ＬＥＤランプ
に成形した場合に、各色で配光特性が異なるという問題
もあった。The light emission from each different LED is
Generally, since the respective angle distributions are different, there is also a problem that the light distribution characteristics are different for each color when molded into an LED lamp.
【００１０】本発明は、上述の如き従来の問題点を解決
するためになされたもので、その目的は、ＬＥＤに流す
電流を変えることなく、明るさ及び配光特性のバランス
をとることができるＬＥＤランプ用リードフレーム及び
これを用いたＬＥＤ表示装置を提供することである。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to balance brightness and light distribution characteristics without changing a current flowing through an LED. An object of the present invention is to provide an LED lamp lead frame and an LED display device using the same.
【００１１】[0011]
【課題を解決するための手段】上記目的を達成するため
に、第１の発明の特徴は、異なる発光色で発光する複数
のＬＥＤをそれぞれ載置して該各ＬＥＤの第１電極に接
続されるＬＥＤ載置部を各先端にそれぞれ設けたて複数
の第１のフレームと、前記各ＬＥＤの第２の電極とボン
ディングワイヤを介して接続される第２のフレームとを
有するＬＥＤランプ用リードフレームにおいて、前記各
第１のフレームは、その各々のＬＥＤ載置部の光の主取
り出し方向への光取り出し効果が相違するように該各Ｌ
ＥＤ載置部の形状を異ならしめて形成したことにある。In order to achieve the above object, a first aspect of the present invention is characterized in that a plurality of LEDs emitting light of different emission colors are mounted, respectively, and connected to a first electrode of each LED. LED lamp lead frame, comprising: a plurality of first frames each having an LED mounting portion provided at each end thereof; and a second frame connected to a second electrode of each of the LEDs via a bonding wire. In each of the first frames, the respective L frames are arranged such that the light extraction effects of the respective LED mounting portions in the main extraction direction are different.
This is because the ED mounting portion is formed with a different shape.
【００１２】第２の発明の特徴は、前記各第１のフレー
ム及び第２フレームに接続され、前記各ＬＥＤ載置部に
それぞれ搭載されたＬＥＤを表示データに従って駆動す
る駆動装置を有することにある。A feature of the second invention is that a driving device is connected to each of the first frame and the second frame and drives the LED mounted on each of the LED mounting portions in accordance with display data. .
【００１３】[0013]
【作用】上述の如き構成によれば、第１の発明は、例え
ば、ＬＥＤ載置部の形成部分となるリード母材の加工時
に、各々の該ＬＥＤ載置部の形成部分のボリュームを変
え、該ＬＥＤ載置部の形成時に所定の形状を有するポン
チで、そのＬＥＤ載置部の形成部分をプレス加工するこ
とにより、各々の該ＬＥＤ載置部の形状を異ならせる。
これにより、各々のＬＥＤ載置部によって光の主取り出
し方向への光取り出し効果を操作することができるよう
になる。According to the above construction, the first invention changes the volume of each of the LED mounting portions, for example, when processing the lead base material which is to be the LED mounting portion forming portion, When the LED mounting portion is formed, a portion having the predetermined shape is pressed with a punch having a predetermined shape to make the shape of each LED mounting portion different.
Thereby, the light extraction effect in the main light extraction direction can be controlled by each LED mounting portion.
【００１４】第２の発明は、第１の発明のＬＥＤランプ
用リードフレームを用いているので、ＬＥＤランプの明
るさ及び配光特性のバランスが向上し、全体としての表
示品質が良好となる。In the second invention, since the LED lamp lead frame of the first invention is used, the balance between the brightness and the light distribution characteristics of the LED lamp is improved, and the display quality as a whole is improved.
【００１５】[0015]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。図１は、本発明の第１実施例に係るＬＥＤランプ
用リードフレームを示す斜視図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a lead frame for an LED lamp according to a first embodiment of the present invention.
【００１６】このリードフレームは、異なる発光色の２
個のＬＥＤを有するＬＥＤランプ（図示省略）に使用さ
れるもので、該２個のＬＥＤを載置するための２本のフ
レーム１，２のほか、ＬＥＤとボンディングされる１本
の直線フレーム３が設けられている。This lead frame has two emission colors.
Used for an LED lamp (not shown) having two LEDs, two frames 1 and 2 for mounting the two LEDs, and one linear frame 3 bonded to the LEDs. Is provided.
【００１７】フレーム１，２の一方の端部にはＬＥＤ載
置部４，５がそれぞれ形成されている。ＬＥＤ載置部
４，５には、ＬＥＤを載置するＬＥＤ載置面４ａ，５ａ
と光反射壁面４ｂ，５ｂとがそれぞれ形成されている。
ここで、ＬＥＤ載置部４側のＬＥＤ載置面４ａと光反射
壁面４ｂとの外角は４５°であり、ＬＥＤ載置部５側の
ＬＥＤ載置面５ａと光反射壁面５ｂとの外角は３０°で
あり、ＬＥＤ載置面に対する光反射壁面の角度がＬＥＤ
載置部４とＬＥＤ載置部５とでは異なるように設定され
ている。なお、光反射壁面４ｂと光反射壁面５ｂとの高
さは同一である。LED mounting portions 4 and 5 are formed at one end of the frames 1 and 2, respectively. LED mounting portions 4 and 5 have LED mounting surfaces 4a and 5a on which LEDs are mounted.
And light reflecting wall surfaces 4b and 5b are formed respectively.
Here, the outer angle between the LED mounting surface 4a on the LED mounting portion 4 side and the light reflecting wall surface 4b is 45 °, and the outer angle between the LED mounting surface 5a on the LED mounting portion 5 side and the light reflecting wall surface 5b is 30 °, and the angle of the light reflecting wall with respect to the LED mounting surface is LED
The mounting section 4 and the LED mounting section 5 are set differently. The height of the light reflecting wall surface 4b and the height of the light reflecting wall surface 5b are the same.
【００１８】図２（ａ），（ｂ），（ｃ）は、図１のリ
ードフレームの製造方法を示す製造工程図である。FIGS. 2A, 2B and 2C are manufacturing process diagrams showing a method for manufacturing the lead frame of FIG.
【００１９】まず、フレーム母材を加工して図２の
（ａ）のような棒状の３本のフレーム１，２，３を形成
する。このとき、フレーム１，２の各先端部１ａ，２ａ
は、それぞれ最終的に前記ＬＥＤ載置部４，５になる部
分であり、その先端部１ａ，２ａの各ボリュームは、該
ＬＥＤ載置部４，５における各々のＬＥＤ載置面４ａ，
５ａ及び光反射壁面４ｂ，５ｂ等の各所の厚みが等しく
なるように決定する。First, the frame base material is processed to form three rod-shaped frames 1, 2, 3 as shown in FIG. At this time, the tip portions 1a, 2a of the frames 1, 2
Are the portions that eventually become the LED mounting portions 4 and 5, respectively, and the respective volumes of the tip portions 1a and 2a are the LED mounting surfaces 4a and 4a of the LED mounting portions 4 and 5, respectively.
The thickness of each part such as 5a and the light reflecting wall surfaces 4b and 5b is determined to be equal.
【００２０】その後、フレーム１，２の各々のＬＥＤ載
置部４，５について図２（ｂ）に示すようにそれぞれＶ
字形溝１ｂ，２ｂを形成する。そして、図３に示すよう
な角度４５°の傾斜面１１及び角度３０°の傾斜面１２
を有する逆皿形のポンチを用い、傾斜面１１側がＬＥＤ
載置部４のＶ字形溝１ｂに、また、傾斜面１２側がＬＥ
Ｄ載置部５のＶ字形溝２ｂにそれぞれ当たるようにし
て、Ｖ字形溝１ｂ，２ｂをそれぞれプレス加工する。そ
の結果、図１で示した形状のリードフレームが完成する
（図２（ｃ））。Thereafter, as shown in FIG. 2 (b), for each of the LED mounting portions 4, 5 of the frames 1, 2,
The U-shaped grooves 1b and 2b are formed. The inclined surface 11 having an angle of 45 ° and the inclined surface 12 having an angle of 30 ° as shown in FIG.
Using an inverted dish-shaped punch with an inclined surface 11
The V-shaped groove 1b of the mounting portion 4 and the inclined surface 12 side are LE
The V-shaped grooves 1b and 2b are respectively press-worked so as to abut against the V-shaped grooves 2b of the D mounting portion 5, respectively. As a result, the lead frame having the shape shown in FIG. 1 is completed (FIG. 2C).
【００２１】このようにして製造されたリードフレーム
を使用して、次のようにＬＥＤランプを作製する。Using the lead frame manufactured as described above, an LED lamp is manufactured as follows.
【００２２】まず、フレーム１，２のＬＥＤ載置面４
ａ，５ａの上にペレット状のＬＥＤをそれぞれ１個ずつ
載置する。このとき、ＬＥＤの上部がｐ型電極に、その
下部がｎ型電極になり、光の主取り出し方向はＬＥＤの
上部方向となる。その後、この各ＬＥＤの下部のｎ電極
を銀ペーストなどでフレーム１，２に固着させる。First, the LED mounting surfaces 4 of the frames 1 and 2
A pellet-shaped LED is placed on each of a and 5a. At this time, the upper part of the LED is a p-type electrode and the lower part is an n-type electrode, and the main light extraction direction is the upper direction of the LED. Thereafter, the n-electrode under each LED is fixed to the frames 1 and 2 with silver paste or the like.
【００２３】そして、該ＬＥＤのｐ型電極と直線フレー
ム３とを金ワイヤーなどでワイヤーボンディングする。
続いて、レンズ状の鋳型の中の所定位置にワイヤーボン
ディングされた状態の前記フレーム１，２，３を固定
し、そして該鋳型の中に透明エポキシ系樹脂を注入して
焼き固める。この後、鋳型を取り外せば、異なる発光色
の２個のＬＥＤを有するＬＥＤランプが完成する。Then, the p-type electrode of the LED and the straight frame 3 are wire-bonded with a gold wire or the like.
Subsequently, the frames 1, 2, and 3 in a state of being wire-bonded are fixed at predetermined positions in a lens-shaped mold, and a transparent epoxy resin is injected into the mold and hardened. Thereafter, if the mold is removed, an LED lamp having two LEDs of different emission colors is completed.
【００２４】本実施例によれば、例えばＧａＡｌＡｓ系
の赤色ＬＥＤを外角が３０°のＬＥＤ載置部５に搭載し
た場合は、ＬＥＤの印加電流１０ｍＡで２４０ｍｃｄと
なり、外角が４５°のＬＥＤ載置部４に搭載した場合
は、同じ印加電流１０ｍＡで３００ｍｃｄとなる。すな
わち、ＬＥＤ載置部５に搭載した場合は、ＬＥＤ載置部
４に搭載した場合よりもピーク光出力を２０パーセント
程度抑えることができる。According to this embodiment, for example, when a GaAlAs-based red LED is mounted on the LED mounting section 5 having an outer angle of 30 °, the applied current of the LED is 10 mA, the output is 240 mcd, and the LED mounting section having an outer angle of 45 ° is mounted. When mounted on the unit 4, the current is 300 mcd at the same applied current of 10 mA. That is, when mounted on the LED mounting section 5, the peak light output can be suppressed by about 20% as compared with when mounted on the LED mounting section 4.
【００２５】従って、例えば搭載する２個のＬＥＤの光
出力が異なる場合に、各々のＬＥＤに対する印加電流を
変えなくとも、リードフレームのＬＥＤ載置部における
ＬＥＤ載置面と光反射壁面との角度をＬＥＤの光出力に
合わせて変えることにより、２個のＬＥＤの明るさのバ
ランスをとることができる。Therefore, for example, when the light output of two mounted LEDs is different, the angle between the LED mounting surface and the light reflecting wall surface of the LED mounting portion of the lead frame can be changed without changing the current applied to each LED. Is changed in accordance with the light output of the LED, the brightness of the two LEDs can be balanced.
【００２６】また、ＧａＰ系の緑色ＬＥＤとＧａＡｌＡ
ｓ系の赤色ＬＥＤとを、図７に示す従来の各ＬＥＤ載置
面１０４ａ，１０５ａにそれぞれ搭載した場合と、本実
施例の図１の各ＬＥＤ載置面４，５にそれぞれ搭載した
場合とでは、ピーク光出力比（赤色：緑色）が前者は
５：３となるのに対し、後者は５：４となった。この実
験からも明らかなように、本実施例では異なる発光色の
ＬＥＤの明るさのバランスをとることができる。Also, a GaP-based green LED and GaAlA
An s-system red LED is mounted on each of the conventional LED mounting surfaces 104a and 105a shown in FIG. 7 and a case where the red LED is mounted on each of the LED mounting surfaces 4 and 5 of FIG. Then, the peak light output ratio (red: green) was 5: 3 in the former, whereas it was 5: 4 in the latter. As is clear from this experiment, in the present embodiment, the brightness of LEDs of different emission colors can be balanced.
【００２７】さらに、本実施例では、各色のＬＥＤラン
プの配光特性が異なる場合においても、上記同様に配光
特性の相違を軽減することができる。Further, in the present embodiment, even when the light distribution characteristics of the LED lamps of each color are different, the difference in the light distribution characteristics can be reduced as described above.
【００２８】図４は、本発明の第２実施例に係るＬＥＤ
ランプ用リードフレームを示す斜視図である。FIG. 4 shows an LED according to a second embodiment of the present invention.
It is a perspective view which shows the lead frame for lamps.
【００２９】上記第１実施例のリードフレームでは、Ｌ
ＥＤ載置面に対する光反射壁面の角度を各々のＬＥＤ載
置部で異なるように設定したが、本実施例では、光反射
壁面の高さを各々のＬＥＤ載置部で異なるように設定し
たものである。In the lead frame of the first embodiment, L
Although the angle of the light reflecting wall with respect to the ED mounting surface is set to be different in each LED mounting portion, in this embodiment, the height of the light reflecting wall is set to be different in each LED mounting portion. It is.
【００３０】このリードフレームは、２個のＬＥＤを載
置するための２本のフレーム２１，２２と、ＬＥＤとボ
ンディングされる１本の直線フレーム２３とで構成され
ている。フレーム２１，２２の一方の端部にはＬＥＤ載
置部２４，２５がそれぞれ形成され、そのＬＥＤ載置部
２４，２５には、ＬＥＤを載置するＬＥＤ載置面２４
ａ，２５ａと光反射壁面２４ｂ，２５ｂとがそれぞれ形
成されている。This lead frame is composed of two frames 21 and 22 for mounting two LEDs, and one linear frame 23 bonded to the LEDs. LED mounting portions 24 and 25 are formed at one end of the frames 21 and 22, respectively. The LED mounting portions 24 and 25 have LED mounting surfaces 24 on which LEDs are mounted.
a, 25a and light reflecting wall surfaces 24b, 25b, respectively.
【００３１】ＬＥＤ載置面に対する光反射壁面の角度は
ＬＥＤ載置部４とＬＥＤ載置部５とで同一であるが、光
反射壁面２４ｂ，２５ｂの高さが例えばそれぞれ３．０
ｍｍ及び６．５ｍｍというように異なって設定されてい
る。The angle of the light reflecting wall surface with respect to the LED mounting surface is the same for the LED mounting portion 4 and the LED mounting portion 5, but the height of the light reflecting wall surfaces 24b and 25b is, for example, 3.0.
mm and 6.5 mm.
【００３２】このようなリードフレームの製造方法は、
使用するポンチが異なるだけであって上記第１実施例と
同様である。The manufacturing method of such a lead frame is as follows.
This is the same as the first embodiment except that the punch used is different.
【００３３】本実施例に用いるポンチの構造を図５に示
す。すなわち、本実施例のポンチは、高さ３．０ｍｍの
部分３１と高さ６．５ｍｍの部分３２とを有する逆皿形
となっている。FIG. 5 shows the structure of the punch used in this embodiment. That is, the punch of the present embodiment has an inverted dish shape having a portion 31 having a height of 3.0 mm and a portion 32 having a height of 6.5 mm.
【００３４】本実施例によれば、例えばＧａＰ系の緑色
ＬＥＤを高さ６．５ｍｍの光反射壁面を有するＬＥＤ載
置部２５に搭載した場合は、ＬＥＤの印加電流２０ｍＡ
で２１０ｍｃｄとなり、高さ３．０ｍｍの光反射壁面を
有するＬＥＤ載置部２４に搭載した場合は、同じ印加電
流２０ｍＡで１９０ｍｃｄとなる。すなわち、ＬＥＤ載
置部２５に搭載した場合は、ＬＥＤ載置部２４に搭載し
た場合よりもピーク光出力を１０パーセント程度向上さ
せることができる。According to the present embodiment, for example, when a GaP-based green LED is mounted on the LED mounting portion 25 having a light reflecting wall surface of 6.5 mm in height, the applied current of the LED is 20 mA.
And 210 mcd, and 190 mcd at the same applied current of 20 mA when mounted on the LED mounting section 24 having a light reflecting wall surface with a height of 3.0 mm. That is, when mounted on the LED mounting section 25, the peak light output can be improved by about 10% as compared with when mounted on the LED mounting section 24.
【００３５】従って、２個のＬＥＤの光出力が異なる場
合に、各々のＬＥＤに対する印加電流を変えなくとも、
リードフレームのＬＥＤ載置部の光反射壁面の高さをＬ
ＥＤの光出力に合わせて変えることにより、上記第１実
施例と同様に２個のＬＥＤの明るさのバランスをとるこ
とができる。Therefore, when the light output of the two LEDs is different, without changing the current applied to each LED,
The height of the light reflecting wall of the LED mounting part of the lead frame is L
By changing according to the light output of the ED, the brightness of the two LEDs can be balanced as in the first embodiment.
【００３６】また、ＧａＡｌＡｓ系の赤色ＬＥＤとＧａ
Ｐ系の緑色ＬＥＤとを、図７に示す従来の各ＬＥＤ載置
面１０４ａ，１０５ａにそれぞれ搭載した場合と、本実
施例の図４の各ＬＥＤ載置面２４，２５にそれぞれ搭載
した場合とでは、ピーク光出力比（赤色：緑色）が前者
は５：３となるのに対し、後者は５：３．５となった。
この実験からも明らかなように、上記第１実施例と同様
に本実施例でも異なる発光色のＬＥＤの明るさのバラン
スをとることができる。A GaAlAs-based red LED and Ga
A P-type green LED is mounted on each of the conventional LED mounting surfaces 104a and 105a shown in FIG. 7, and a P-type green LED is mounted on each of the LED mounting surfaces 24 and 25 of FIG. Then, the peak light output ratio (red: green) was 5: 3 in the former case, whereas it was 5: 3.5 in the latter case.
As is clear from this experiment, the brightness of LEDs of different emission colors can be balanced in this embodiment as in the first embodiment.
【００３７】さらに、本実施例では、各色のＬＥＤラン
プの配光特性が異なる場合においても、上記第１実施例
と同様に配光特性の相違を軽減することができる。Further, in the present embodiment, even when the light distribution characteristics of the LED lamps of each color are different, the difference in the light distribution characteristics can be reduced as in the first embodiment.
【００３８】図６は、本発明の第３実施例に係るＬＥＤ
表示装置の概略ブロック図である。FIG. 6 shows an LED according to a third embodiment of the present invention.
FIG. 3 is a schematic block diagram of a display device.
【００３９】ＬＥＤ表示装置は、上記第１または第２実
施例のリードフレームを用いて製造されたＬＥＤランプ
群が例えばドット状に配列された表示部４１と、該リー
ドフレームに接続されこの表示部４１のＬＥＤランプ群
を表示データに従って駆動する駆動装置４２とを備えて
いる。The LED display device has a display section 41 in which LED lamp groups manufactured using the lead frame of the first or second embodiment are arranged in, for example, a dot shape, and a display section 41 connected to the lead frame. And a driving device 42 for driving the 41 LED lamp groups according to the display data.
【００４０】このように、本発明のリードフレームを用
いて製造されたＬＥＤランプを使用するＬＥＤ表示装置
は、ＬＥＤランプの明るさ及び配光特性のバランスが優
れ、全体としての表示品質が向上する。As described above, in the LED display device using the LED lamp manufactured by using the lead frame of the present invention, the brightness and the light distribution characteristics of the LED lamp are well balanced, and the display quality as a whole is improved. .
【００４１】[0041]
【発明の効果】以上詳細に説明したように、第１の発明
では、各々のＬＥＤ載置部の光の主取り出し方向への光
取り出し効果が相違するように該各ＬＥＤ載置部の形状
を異ならしめたので、各々発光効率が異なるＬＥＤを搭
載した場合であっても、各々のＬＥＤ載置部によって光
の主取り出し方向への光取り出し効果を操作することが
でき、明るさ及び配光特性のバランスをとることが可能
となる。As described above in detail, in the first aspect, the shape of each LED mounting portion is changed so that the light extracting effect of each LED mounting portion in the main extraction direction is different. Even if LEDs with different luminous efficiencies are mounted, the light extraction effect in the main light extraction direction can be controlled by each LED mounting part, so that brightness and light distribution characteristics are different. Can be balanced.
【００４２】第２の発明は、第１の発明の各ＬＥＤ載置
部にそれぞれ搭載されたＬＥＤを表示データに従って駆
動するので、全体としての表示品質が良好となる。According to the second aspect of the invention, the LEDs mounted on the respective LED mounting portions of the first aspect are driven according to the display data, so that the display quality as a whole is improved.
【図１】本発明の第１実施例に係るＬＥＤランプ用リー
ドフレームを示す斜視図である。FIG. 1 is a perspective view showing a lead frame for an LED lamp according to a first embodiment of the present invention.
【図２】図１のリードフレームの製造方法を示す製造工
程図である。FIG. 2 is a manufacturing process diagram showing a method for manufacturing the lead frame of FIG. 1;
【図３】第１実施例のポンチの構造を示す図である。FIG. 3 is a view showing the structure of the punch of the first embodiment.
【図４】本発明の第２実施例に係るＬＥＤランプ用リー
ドフレームを示す斜視図である。FIG. 4 is a perspective view showing a lead frame for an LED lamp according to a second embodiment of the present invention.
【図５】第２実施例に用いるポンチの構造を示す図であ
る。FIG. 5 is a view showing a structure of a punch used in a second embodiment.
【図６】本発明の第３実施例に係るＬＥＤ表示装置の概
略ブロック図である。FIG. 6 is a schematic block diagram of an LED display device according to a third embodiment of the present invention.
【図７】従来のＬＥＤランプ用リードフレームを示す斜
視図である。FIG. 7 is a perspective view showing a conventional LED lamp lead frame.
【図８】図７のリードフレームの製造方法を示す図であ
る。FIG. 8 is a view illustrating a method of manufacturing the lead frame of FIG. 7;
【図９】従来のリードフレームの製造に用いるにポンチ
の構造を示す図である。FIG. 9 is a view showing a structure of a punch used for manufacturing a conventional lead frame.
１，２，３，２１，２２，２３ フレーム ４，５，２４，２５ ＬＥＤ載置部 ４ａ，５ａ，２４ａ，２５ａ ＬＥＤ載置面 ４ｂ，５ｂ，２４ｂ，２５ｂ 光反射壁面 ４１ 表示部 ４２ 駆動装置 1,2,3,21,22,23 Frame 4,5,24,25 LED mounting part 4a, 5a, 24a, 25a LED mounting surface 4b, 5b, 24b, 25b Light reflection wall surface 41 Display part 42 Drive unit
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 33/00 G09F 9/33 H01L 23/48 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 33/00 G09F 9/33 H01L 23/48
Claims (2)
それぞれ載置して該各ＬＥＤの第１電極に接続されるＬ
ＥＤ載置部を各先端にそれぞれ設けた複数の第１のフレ
ームと、前記各ＬＥＤの第２の電極とボンディングワイ
ヤを介して接続される第２のフレームとを有するＬＥＤ
ランプ用リードフレームにおいて、 前記各第１のフレームは、その各々のＬＥＤ載置部の光
の主取り出し方向への光取り出し効果が相違するように
該各ＬＥＤ載置部の形状を異ならしめて形成したことを
特徴とするＬＥＤランプ用リードフレーム。1. A plurality of LEDs, each of which emits light of a different emission color, are mounted thereon and connected to a first electrode of each LED.
An LED having a plurality of first frames each having an ED mounting portion provided at each end, and a second frame connected to a second electrode of each LED via a bonding wire.
In the lamp lead frame, each of the first frames is formed so that the shape of each LED mounting portion is different so that the light extraction effect of each LED mounting portion in the main extraction direction of light is different. A lead frame for an LED lamp, characterized in that:
び前記第２フレームに接続され、前記各ＬＥＤ載置部に
それぞれ搭載されたＬＥＤを表示データに従って駆動す
る駆動装置を有することを特徴とするＬＥＤ表示装置。2. A driving device connected to each of the first frame and the second frame according to claim 1 and driving LEDs mounted on each of the LED mounting portions in accordance with display data. LED display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32655293A JP3190774B2 (en) | 1993-12-24 | 1993-12-24 | Lead frame for LED lamp and LED display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32655293A JP3190774B2 (en) | 1993-12-24 | 1993-12-24 | Lead frame for LED lamp and LED display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07183581A JPH07183581A (en) | 1995-07-21 |
| JP3190774B2 true JP3190774B2 (en) | 2001-07-23 |
Family
ID=18189106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32655293A Expired - Fee Related JP3190774B2 (en) | 1993-12-24 | 1993-12-24 | Lead frame for LED lamp and LED display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3190774B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6520611B2 (en) | 1993-06-30 | 2003-02-18 | Canon Kabushiki Kaisha | Print head and printer apparatus using the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| JP2007157548A (en) * | 2005-12-06 | 2007-06-21 | Fujinon Corp | Light source device and projector |
| US7829899B2 (en) | 2006-05-03 | 2010-11-09 | Cree, Inc. | Multi-element LED lamp package |
-
1993
- 1993-12-24 JP JP32655293A patent/JP3190774B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6520611B2 (en) | 1993-06-30 | 2003-02-18 | Canon Kabushiki Kaisha | Print head and printer apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07183581A (en) | 1995-07-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100691179B1 (en) | Side emitting type LED package and manufacturing method thereof | |
| CN101499429B (en) | Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package | |
| US7024765B2 (en) | Method of manufacturing surface-emitting backlight by molding contact member integrally with molded case | |
| JP2009527122A (en) | Light emitting device and manufacturing method thereof | |
| JP2004363533A (en) | Method for manufacturing light emitting diode element | |
| JPH1098215A (en) | Light-emitting diode device | |
| JP2001177156A (en) | Side emitting led lamp | |
| JP2002082635A (en) | Color led display device | |
| JP3190774B2 (en) | Lead frame for LED lamp and LED display device | |
| WO2004021459A1 (en) | White light emitting diode and its methode of making | |
| JPH07235624A (en) | Led lamp | |
| JPS61237485A (en) | Manufacture of light-emission display body | |
| JPH07211940A (en) | Planar emission type led light emitting device and its manufacture | |
| JP2004165541A (en) | Light emitting diode and led light | |
| JPH07110660A (en) | Light emitting diode indicator | |
| JP2003077317A (en) | Leg lamp | |
| JP2582096Y2 (en) | Light emitting diode lamp | |
| JP3778597B2 (en) | LED chip die bonding method | |
| JPH07297449A (en) | Led lamp of its manufacture | |
| JPS63293584A (en) | Light emitting display body | |
| JP2951099B2 (en) | Light emitting diode | |
| JPH05114751A (en) | Optical semiconductor device | |
| JP3025726B2 (en) | Manufacturing method of LED lamp for full color display | |
| CN219457651U (en) | Three-crystal four-pin direct-insertion LED lamp | |
| KR100628884B1 (en) | White light emitting diode and method of manufacturing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090518 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090518 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100518 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |