JP3181887B2 - Connected ceramic wiring board, method of manufacturing the same, and method of manufacturing ceramic wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connected ceramic wiring board, a method for manufacturing the same, and a method for manufacturing a ceramic wiring board. The present invention relates to a substrate, a method for manufacturing the same, and a method for manufacturing a ceramic wiring board having the concave portion on a side surface.

[0002]

2. Description of the Related Art Conventionally, in order to electrically connect a ceramic wiring substrate to another substrate or the like, a ceramic wiring substrate having a metallized layer electrically connected to an internal wiring layer is formed on an inner wall surface of a concave portion provided on a side surface. Are known.

As such a ceramic wiring board, for example, there is a ceramic wiring board 101 shown in FIG. The ceramic wiring board 101 has an upper surface 101A,
A lower surface 101B, a first side surface 101C, a second side surface 101D,
It has a substantially rectangular parallelepiped shape having a third side surface 101E and a fourth side surface 101F. On the upper surface 101A side, there is formed an electronic component concave portion 103 for mounting electronic components (not shown) such as a quartz oscillator, a filter, and an integrated circuit chip.
The first side surface 101C and the third side surface 101E are each provided with a semi-cylindrical concave portion 105 at three places. The inner wall surface has a metallized layer 107 and a Ni-Au layer adhered to the surface. A plating layer 108 is formed and is electrically connected to an internal wiring layer (not shown). The size of each recess 105 in the vertical direction in the figure is about two-thirds of the thickness of the ceramic wiring substrate 101, that is, the height of the first side surface 101C, and is formed so as to be biased toward the lower surface 101B. That is,
Unlike the lower surface 101B, the upper surface 101A does not have a recess due to the concave portion 105 on the periphery thereof.

In such a form, for example, the upper surface 1
When the sealing metallization layer 109 is formed on the upper surface 101A and the ceramic wiring board 101 is hermetically sealed by placing a lid member (not shown) on the upper surface 101A, the upper surface 101A has no dent, so that the metallization layer for sealing is formed. 109 can be expanded. Therefore, it is easy to secure the adhesive strength between the lid member and the ceramic wiring board 101.

Incidentally, the ceramic wiring board 101
Conventionally, as shown in FIG. 8, a connected ceramic wiring board 111 in which all adjacent ceramic wiring boards 101 are in contact with each other and connected to each other is manufactured at a time.
A method has been adopted in which the ceramic wiring board 101 is divided into individual pieces at the position of the boundary 113. By manufacturing in this way, the productivity can be increased and the ceramic wiring substrate 101 can be manufactured at low cost.

In this case, the hole in which the metallized layer 107 is formed is, as shown in FIG.
The bottomed hole 115 does not penetrate through the space 115B.
For this reason, when forming a Ni-Au plating layer, it is difficult to uniformly form the plating layer 108 even if ordinary electrolytic plating is performed. This is because the circulation of the plating solution is not good in the bottomed hole 115, or when the connected ceramic wiring board 111 is immersed in the plating solution, air is trapped in the bottomed hole 115 and the bottomed hole 155 It is considered that the plating solution does not spread all the way to the back. If the thickness of the plating layer 108 is non-uniform as described above, when the ceramic wiring board 101 is mounted on another wiring board and soldered, the solder does not flow on the metallization layer 107 and the connection reliability is reduced. Becomes lower. Also, the plating layer 10
8 do not satisfy the thickness standard, and the production yield of the connected ceramic wiring board 111 and the ceramic wiring board 101 is lowered, which is not practical.

Therefore, as shown in FIG. 9, a connected ceramic wiring board 121 having an unnecessary portion 128 between ceramic wiring boards 101 has been considered. The connection ceramic wiring board 121 is located at the boundary 113 of the connection ceramic wiring board 111 shown in FIG.
8 has been inserted. Between the boundary between the ceramic wiring board 101 and the unnecessary portion 128, instead of the cylindrical bottomed hole 115, a bottomed hole 12 having a substantially elliptical opening is provided.
5 are formed so as to open toward the second main surface 101B. A metallized layer 107 is formed on the inner wall surface of the bottomed hole 125. The bottom of the bottomed hole 125 of the unnecessary portion 128 has a return hole 1 communicating the bottomed hole 125 with the first main surface 101A side.
26 are formed. In such a connected ceramic wiring board 121, the bottomed hole 125 in which the metallized layer 107 is formed on the inner wall surface opens not only to the lower surface 101B side but also to the upper surface 101A side. For this reason,
When plating on the metallized layer 107, the bottomed holes 125
By improving the flow of the plating solution therein, the plating layer 108 can be uniformly formed on the metallized layer 107.

[0008]

However, in the connection ceramic wiring board 121, when the ceramic wiring board 101 is divided along the boundary line 123, an unnecessary portion 128 to be discarded is formed. For this reason, the cost of the ceramic wiring board 101 is increased. As described above, conventionally, it has been difficult to manufacture a connected ceramic wiring substrate and a ceramic wiring substrate that have high productivity and can be manufactured at low cost, yet have a high production yield and high connection reliability. .

SUMMARY OF THE INVENTION The present invention has been made in view of the above situation, and has a connection ceramic wiring board in which a plating layer is uniformly formed on a metallized layer in a concave portion and connection reliability of the divided ceramic wiring boards is high. It is an object of the present invention to provide a manufacturing method and a method for manufacturing a ceramic wiring board having the plating layer.

[0010]

Means for Solving the Problems, Action and Effect The solution is to provide a connected ceramic wiring board in which a plurality of ceramic wiring boards having a first main surface and a second main surface are connected in contact with each other. A first break groove formed from the first main surface side on a boundary between the ceramic wiring substrates to be formed, and a straddle between adjacent ceramic wiring substrates, an opening on the second main surface side, and metallization on an inner wall surface. A bottomed hole in which a layer is formed, a part of the first break groove penetrates through the bottom of the bottomed hole, and the bottomed hole and the first break groove communicate with each other. The first break groove has a cross section
Break blade with a constant width base and tip
Insert the entire tip and a part of the base to form
And a firing step, wherein the width of the first break groove on the first main surface is smaller than the diameter of the bottomed hole.

According to the present invention, the connected ceramic wiring board has a bottomed hole which straddles between adjacent ceramic wiring boards and is opened on the second main surface side. In addition, the first ceramic surface formed on the boundary between the adjacent ceramic wiring boards from the first main surface side.
It has a break groove. And, at the bottom of the bottomed hole, the first
The break groove penetrates, and the bottomed hole and the first break groove communicate with each other. That is, the bottomed hole communicates with both the first main surface side and the second main surface side. Therefore, when a plating layer such as Ni-Au plating is formed on the metallized layer formed on the inner wall surface of the bottomed hole for the purpose of preventing oxidation or the like, the plating solution is passed through the bottomed hole to the first main surface. And the second main surface. Further, when the connected ceramic wiring board is immersed in the plating solution, the air is hardly trapped in the bottomed hole, so that the plating solution spreads throughout the bottomed hole.

Therefore, in the connected ceramic wiring board of the present invention, the plating layer can be uniformly formed on the metalized layer on the inner wall surface of the bottomed hole while the plurality of ceramic wiring boards are connected to each other and connected. The yield can be improved. In addition, since a wasteful part can be eliminated when the connecting ceramic wiring boards are separated, an inexpensive connecting ceramic wiring board can be obtained. Also, when the connected ceramic wiring board on which the plating layer is formed is broken along the break grooves to make individual ceramic wiring boards, the bottomed hole is divided into concave portions on the side of the ceramic wiring board, which are uniformly formed. A plating layer is formed. Therefore, a ceramic wiring board having high connection reliability is obtained.

Here, the bottomed hole may be any hole as long as it straddles the adjacent ceramic wiring board and is open on the second main surface side. The shape may be a substantially circular shape or a substantially elliptical shape. An opening may be used. Further, the shape and size of the first break groove can also be changed as appropriate. In particular, in consideration of the opening area of a portion of the bottom surface of the bottomed hole that communicates with the first break groove, a shape and a size may be selected in which plating solution circulation and the like during plating are favorable. Also,
Regarding the break groove formed on the boundary between adjacent ceramic wiring boards, in addition to the first break groove formed from the first main surface side, the second break groove formed from the second main surface side to face the first break groove is formed. A break groove may be provided.

Further, in the above-mentioned connected ceramic wiring substrate, a plated ceramic layer is formed on the metallized layer formed on the inner wall surface of the bottomed hole. good.

The connected ceramic wiring board according to the present invention has a
The bottomed hole opened on the main surface side communicates with the first break groove formed from the first main surface side. For this reason, when the plating layer is formed on the metallized layer having the bottomed holes, the plating solution flows well, and the thickness of the plated layer formed on the metallized layer becomes uniform. Therefore, in the connected ceramic wiring board of the present invention, the plating layer is uniformly formed on the metallized layer on the inner wall surface of the bottomed hole, while the plurality of ceramic wiring boards are in contact with each other and connected. Further, when the connected ceramic wiring substrate is broken by the break grooves and divided into individual pieces, a plating layer is uniformly formed in a concave portion on the side surface of the ceramic wiring substrate formed by dividing the bottomed hole. Therefore, a ceramic wiring board having high connection reliability is obtained.

Further, in the above-mentioned connected ceramic wiring board, the plurality of ceramic wiring boards are characterized in that all the adjacent ceramic wiring boards are in contact with each other and connected to each other. good.

According to the present invention, in the connected ceramic wiring board, all the adjacent ceramic wiring boards are in contact with each other and connected. That is, there is no useless portion in the connection ceramic wiring board when the ceramic wiring board is divided into individual pieces. Therefore, an inexpensive connected ceramic wiring board can be obtained.

Another solution is a first principal surface and a second principal surface.
A method for manufacturing a connected ceramic wiring board in which a plurality of ceramic wiring boards each having a main surface are in contact with and connected to each other, the method including straddling a region corresponding to the adjacent ceramic wiring board, and having an unfired metallized layer on an inner wall surface. One or a plurality of second ceramic green sheets having a through hole formed therein and one or a plurality of first ceramic green sheets having no through hole in a portion corresponding to the through hole of the second ceramic green sheet are laminated. A laminating step of forming a laminate, the entire distal end of the break blade having a base and a distal end having a constant cross-sectional width and a part of the base are pressed in, and at least one or more of the laminates in the laminate First
At a depth that penetrates all of the ceramic green sheets,
A first break groove having a width on the first main surface smaller than the diameter of the through hole is formed on a boundary between regions corresponding to the adjacent ceramic wiring boards from the first ceramic green sheet side. A groove forming step of penetrating the bottom of the bottomed hole formed by the through hole and the exposed surface in the through hole of the first ceramic green sheet to communicate the bottomed hole and the first break groove; And a firing step of firing the laminate.

According to the present invention, in the laminating step, one or a plurality of first ceramic green sheets and one or a plurality of second ceramic green sheets are sequentially laminated to form a laminate of ceramic green sheets. At this time,
A through hole formed in the second ceramic green sheet;
A bottomed hole is formed by the exposed surface in the through hole of the first ceramic green sheet. Then, in the groove forming step, while forming the first break groove from the first main surface side, penetrating the bottom of the bottomed hole formed in the laminating step,
The bottomed hole communicates with the first break groove. That is, in order to make the bottomed hole also communicate with the first main surface side, there is no need to provide an unnecessary portion, and it is not necessary to separately penetrate the bottom portion of the bottomed hole in a separate step, and simultaneously with the formation of the first break groove. I can do it. For this reason,
The working process can be simplified, and the connected ceramic wiring board can be manufactured at low cost.

In the connected ceramic wiring board manufactured by the manufacturing method of the present invention, the bottomed hole opened on the second main surface side also communicates with the first main surface side. For this reason, when forming a plating layer on the metallized layer formed on the inner wall surface of the bottomed hole, the plating solution easily flows between the first main surface and the second main surface through the bottomed hole. In addition, since the air is hardly trapped in the bottomed hole, the plating solution spreads throughout the bottomed hole. Therefore, the plating layer can be formed uniformly on the metallized layer, and the yield can be improved. Further, since unnecessary portions can be eliminated when the connected ceramic wiring board is divided into the ceramic wiring boards, a more inexpensive connected ceramic wiring board can be obtained.

Here, with respect to the through holes formed in the second ceramic green sheets, when there are a plurality of second ceramic green sheets, the through holes are formed in advance for each of the second ceramic green sheets, and then laminated. What should I do? Alternatively, the second ceramic green sheets may be laminated with no through-hole formed, and the through-hole may be formed at a time later. Further, the unfired metallized layer formed on the inner wall surface of the through-hole also
When there are a plurality of ceramic green sheets, an unfired metallized layer may be formed for each second ceramic green sheet in advance and then laminated. After laminating the second ceramic green sheets, an unfired metallized layer may be formed in the through hole.

Further, in the above method for manufacturing a connected ceramic wiring board, the method further comprises a plating layer forming step of forming a plating layer on the metallized layer on the inner wall surface of the bottomed hole after the firing step. It is preferable to use a method for manufacturing a connected ceramic wiring board.

According to the present invention, after the firing step, a plating layer is formed on the metallized layer on the inner wall surface of the bottomed hole. At this time, since the bottomed hole communicates with both the first main surface side and the second main surface side, the plating solution easily flows between the two main surfaces through the bottomed hole. Spread all over the hole. Therefore, the plating layer can be formed uniformly on the metallized layer, and the yield can be improved. Further, the ceramic wiring board obtained by breaking the connected ceramic wiring board manufactured by the manufacturing method of the present invention by breaking it with a break groove has a uniform plating layer in the concave portion on the side surface formed by dividing the bottomed hole. The connection reliability is high.

Another solution is a first principal surface and a second principal surface.
A method for manufacturing a ceramic wiring board, comprising: a main surface; and a side surface having a concave portion in which a metallized layer and a plating layer are formed. One or more second ceramic green sheets provided with through holes having a metallized layer, and one or more first ceramic green sheets having no through holes in portions of the second ceramic green sheets corresponding to the through holes A laminating step of forming a laminated body by laminating, and pressing and inserting the entire distal end and a part of the base of the break blade having a base and a distal end having a constant cross-sectional width, and at least the A first break groove having a depth penetrating all of the one or more first ceramic green sheets and having a width on the first main surface smaller than a diameter of the through hole; A bottom having a through hole and an exposed surface in the through hole of the first ceramic green sheet formed on the boundary between the regions corresponding to the adjacent ceramic wiring substrates from the first ceramic green sheet side; The bottomed hole and the first
A groove forming step of communicating with the break groove; a firing step of firing the laminate to form a connected ceramic wiring substrate; and after the firing step, a plating layer is formed on the metalized layer on the inner wall surface of the bottomed hole. Forming a plated layer, and breaking the connected ceramic wiring substrate at the first break groove, dividing the bottomed hole into the concave portions, and dividing the connected ceramic wiring substrate into the ceramic wiring substrates. A method for manufacturing a ceramic wiring board, comprising:

According to the present invention, in the groove forming step, the first break groove is formed and penetrates the bottom of the bottomed hole so that the bottomed hole communicates with the first break groove. Therefore, the working process can be simplified, and the ceramic wiring board can be manufactured at low cost. Furthermore, after the firing step, when forming a plating layer on the metallized layer on the inner wall surface of the bottomed hole,
Since the bottomed hole in which the metallized layer is formed communicates with both main surfaces, the plating solution easily flows through the bottomed hole, and the plating solution spreads throughout the bottomed hole. Therefore, the plating layer can be formed uniformly on the metallized layer, and the yield can be improved.

Further, the ceramic wiring board broken in the individual process has a high reliability of connection because the plated layer is uniformly formed in the concave portion on the side surface formed by dividing the bottomed hole. Further, in the individual process, unnecessary portions do not need to be formed between the ceramic wiring boards, so that an inexpensive ceramic wiring board can be obtained, for example, a large number of ceramic wiring boards can be manufactured. Therefore, according to the present invention, it is possible to manufacture a product having high productivity and high connection reliability while being a ceramic wiring board having high productivity and being inexpensively manufactured.

[0027]

(Embodiment 1) Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The ceramic wiring board 1 manufactured in this embodiment is
This is shown in FIG. This ceramic wiring board 1 has 3.
It has a substantially rectangular parallelepiped shape of 8 × 3.8 × 1.1 mm, and has a first main surface (upper surface) 1A, a second main surface (lower surface) 1B, and a first side surface 1.
C, a second side face 1D, a third side face 1E, and a fourth side face 1F. On the first main surface 1A side, a step-shaped concave part 3 for an electronic component is formed for mounting a quartz oscillator (not shown). Further, on the first main surface 1A, an outer peripheral edge 1AM and an inner peripheral edge 1AN of the first main surface 1A are provided in order to place a lid member (not shown) on the ceramic wiring board 1 and hermetically seal it.
A metallized layer 9 for sealing having a substantially square shape, which is slightly lowered from each other, is formed.

The first side surface 1C and the third side surface 1E are each provided with a semicylindrical concave portion 5 (diameter 0.3 mm, height 0.8 mm) at three places. A metallized layer 7 and a Ni-Au plated layer 8 adhered to the surface are formed on the inner wall surface, and the metallized layer 7 is electrically connected to an internal wiring layer (not shown). These recesses 5 are formed so as to be biased toward the second main surface 1B. That is, unlike the outer peripheral edge of the second main surface 1B, the outer peripheral edge 1AM of the first main surface 1A does not have a recess due to the semi-cylindrical concave portion 5. For this reason, the metallization layer 9 for sealing is expanded to the vicinity of the outer peripheral edge 1AM of the first main surface regardless of the presence or absence of the concave portion 5, and is formed in a wide square shape without a dent.

Next, the connected ceramic wiring board according to the present embodiment will be described with reference to FIG. The connected ceramic wiring board 11 is formed by connecting all the adjacent ceramic wiring boards 1 in contact with each other. On the boundary 12 between the adjacent ceramic wiring boards 1, a first break groove 13 (width 0.2 mm on the first main surface 1A) is formed from the first main surface 1A side. In addition, the bottomed hole 15 extending between the adjacent ceramic wiring boards 1
The opening is formed on the main surface 1B side. A metallized layer 7 is formed on the inner wall surface 15B of the bottomed hole 15, and a Ni-Au plating layer 8 is further adhered to the surface.

A part of the first break groove 13 penetrates through the bottom 14 of the bottomed hole 15, and the bottomed hole 15 and the first break groove 1 are formed.
3 is in communication. More specifically, an opening having a width of 0.05 to 0.08 mm is formed by the first break groove 13 at a substantially center of the substantially circular bottom surface 15A of the bottomed hole 15, and the bottomed hole 15 and the first break are formed. The groove 13 is in communication. Therefore, the bottomed hole 15 opens not only to the second main surface 1B side but also to the first main surface 1A side. When the connected ceramic wiring board 11 is broken along the first break groove 13 and divided into individual ceramic wiring boards 1, the bottomed holes 15 are formed in the axial direction (vertical direction in the figure) by two.
It is divided into semi-cylindrical concave portions 5 on the first side surface 1C and the third side surface 1E, respectively (see FIG. 1).

Next, a method of manufacturing the above-described connected ceramic wiring board and the ceramic wiring board will be described with reference to FIGS. First, in the laminating step, FIG.
As shown in (a) and (b), a laminate 21 of ceramic green sheets is formed. Specifically, FIG.
As shown in (a), a lower ceramic green sheet 25 (second ceramic green sheet) is prepared in which the substantially plate-shaped area corresponding to the ceramic wiring board 1 is in contact with and connected to each other. Lower ceramic green sheet 25
In advance, a through-hole 32 is formed at a predetermined position so as to extend between regions corresponding to the adjacent ceramic wiring boards 1 in advance, and further,
The unfired metallized layer 3 is formed on the inner wall surface 32B of the through hole 32.
6 is also formed. An unsintered wiring layer (not shown) is formed on the upper surface 25A, and is connected to the unsintered metallized layer.

A central through-hole 28 corresponding to the ceramic wiring board 1 and having a second through hole 28 substantially in the center, and a square-shaped area is formed by a central ceramic green sheet 24 connected to and in contact with each other.
(Second ceramic green sheet) is prepared. The center ceramic green sheet 24 also has a through hole 31 extending between regions corresponding to the adjacent ceramic wiring boards 1 in advance.
Is drilled at a predetermined position, and the inner wall surface 3 of the through hole 31 is
An unfired metallized layer 35 is formed on 1B. Also,
Also on the upper surface 24A of the central ceramic green sheet 24,
An unsintered wiring layer (not shown) is formed and connected to the unsintered metallized layer 35.

Then, the central ceramic green sheet 24 and the lower ceramic green sheet 25 are aligned and overlapped. At this time, the through-hole 31 of the central ceramic green sheet 24 and the through-hole 32 of the lower ceramic green sheet 25 are coaxially overlapped to form a substantially cylindrical through-hole 33. The unfired metallized layers 35 and 36 in the through holes 32 and 33 are also connected to form one unfired metallized layer 7A.

Next, as shown in FIG. 3B, a first through hole 27 is provided substantially at the center corresponding to the ceramic wiring board 1,
An upper ceramic green sheet 23 (first ceramic green sheet) is prepared in which the braille-shaped regions are in contact with and connected to each other. Then, the upper ceramic green sheet 23 is aligned and superimposed on the center ceramic green sheet 24 of the stacked body of the center ceramic green sheet 24 and the lower ceramic green sheet 25 to obtain a stacked body of ceramic green sheets. 21 are formed.

A portion of the upper ceramic green sheet 23 corresponding to the through hole 30 penetrating the center ceramic green sheet 24 and the lower ceramic green sheet 25 has no through hole. Therefore, the through hole 3
0 and the exposed surface 23 </ b> A in the through hole of the upper ceramic green sheet 23 form the bottomed hole 15. Also, the first through hole 27 of the upper ceramic green sheet 23 and the second through hole 28 of the central ceramic green sheet 24
A step-shaped concave part 3 for an electronic component is formed.

Next, in the groove forming step, as shown in FIG. 3C, along the boundary 12 between the regions corresponding to the adjacent ceramic wiring boards 1 from the first main surface 1A side (upper side in the figure). A first break groove 13 is formed. At the same time, the bottomed hole 15 and the first break groove 13 are communicated with each other so as to penetrate the bottom portion 14 of the bottomed hole 15. By this step, the bottomed hole 15 having the unfired metallized layer 7A on the inner wall surface 15B is connected not only to the second main surface 2B side but also to the first main surface 2A side.

Specifically, in the present embodiment, as shown in FIG. 4, the first break groove 13 is formed using a break blade. In order for the bottomed hole 15 and the first break groove 13 to communicate with each other, the depth of the first break groove 13 needs to be at least not less than the depth penetrating the upper ceramic green sheet 23. Here, the first break blade P1 is inserted into the ceramic green sheet laminate 21 to a depth of about half the thickness of 1.1 mm to form the first break groove 13 having a depth of about half the thickness of the laminate 21. are doing. The first break blade P1 has a base P1B and a tip P1A.
Consists of The base P1B has a cross-sectional width of 0.2 mm. The tip P1A has a substantially triangular shape with the tip opened by 30 degrees, and has a height (length) of 0.37 mm.

When pressing with the first break blade P1,
The entire tip portion P1A of the first break blade P1 and the base portion P1B
Of the first break blade P1 is formed, and a first break groove 13 having substantially the same shape as the outer shape of the first break blade P1 is formed. When pressed in this way, the bottom 14 of the bottomed hole 15
Penetrates, and the bottomed hole 15 and the first break groove 13 communicate with each other. In addition, as described above, a width of 0.0 mm, which is in communication with the first break groove 13, is provided at the approximate center of the bottom
An opening 15C of 5 to 0.08 mm is formed.

Next, in the firing step, as shown in FIG. 5 (a), when the laminated body 21 is fired, the connected ceramic wiring boards 11 connected to the plurality of ceramic wiring boards 1 are connected.
Can be. At this time, the unfired metallized layer 7A on the inner wall surface 15B of the bottomed hole 15 is fired to form the metallized layer 7. After the firing, in a plating layer forming step, electrolytic plating is performed by a known method to prevent oxidation of the metallized layer 7 formed on the inner wall surface 15B of the bottomed hole 15 and improve solderability. A Ni plating layer (2.0 μm in thickness) and an Au plating layer (1.0 in thickness)
μm) is formed.

Thereafter, as shown in FIG. 5B, the connected ceramic wiring board 11 is broken along the first break grooves 13 to obtain individual ceramic wiring boards 1. At this time, the cylindrical bottomed hole 1 of the connection ceramic wiring board 11 is formed.
5 are divided into two in the axial direction, so that the first side surface 1C and the third side surface 1E of the ceramic wiring board 1
Each has a semi-cylindrical concave portion 5. Thus, the connected ceramic wiring board 11 and the ceramic wiring board 1 are manufactured.

The connected ceramic wiring board 11 of the present embodiment
The relationship between the presence or absence of communication of the bottomed hole 15 and the thickness of the plating layer 8 was examined as follows. As described above, the connected ceramic wiring board 11 was manufactured, and the thickness of the plating layer 8 deposited on the metallized layer 7 was measured. The thickness of the plating layer 8 was measured for each of the Ni plating layer and the Au plating layer. The number of the connected ceramic wiring boards 11 used as the measurement samples is 30, and the number of the bottomed holes 15 per connected ceramic wiring board 11 is:
Therefore, for a total of 150 bottomed holes 15,
Measure the thickness of each plating layer from 4 to 0.2 mm,
The average was determined.

As a first comparative example, the break grooves 13
Was not formed, and a connection ceramic wiring board (see FIG. 8) different from the present embodiment in that the bottom of the bottomed hole did not communicate with the first main surface side was manufactured. It was measured. As Comparative Example 2, a connected ceramic wiring board having a through hole penetrating between the first main surface and the second main surface and having a metallized layer formed on the inner wall surface instead of the bottomed hole 15 is manufactured. The measurement was performed in the same manner as in the present embodiment. The results are summarized in Table 1.

[0043]

[Table 1]

As can be seen from Table 1 above, in the first embodiment, N
Both the i-plated layer and the Au-plated layer are sufficiently thick and uniformly formed. On the other hand, in Comparative Example 1, Ni
The thickness of both the plating layer and the Au plating layer is 0.1μ
m and hardly formed. In particular, in Comparative Example 1, the plating layer tended to become thinner as it approached the bottom of the bottomed hole.

This is because, in the first embodiment, the metallized layer 7
Is formed in the bottomed hole 15 in which the first
It is considered that this is due to the fact that both the main surface 1A and the second main surface 1B are connected. That is, when forming the plating layer 8,
The plating solution is passed through the bottomed hole 15 to the first main surface 1A and the second main surface 1A.
It is considered that the plating layer 8 is formed uniformly since it flows between the main surface 1B. Further, since air is hardly trapped in the bottomed hole 15, the plating solution is applied to the inner wall surface 1 of the bottomed hole 15.
It is thought that this is because the whole 5B is distributed.

On the other hand, as can be seen from Table 1, the plating layer can be formed uniformly even in the connected ceramic wiring substrate of Comparative Example 2. However, in this connected ceramic wiring board, since the metallized layer is formed on the inner wall surface of the through hole penetrating between the two main surfaces, when the ceramic wiring substrate is divided into individual pieces, the outer peripheral edge of the first main surface also penetrates. The depression is formed by the concave portion formed by dividing the hole. Therefore, the sealing metallization layer cannot be extended to the vicinity of the outer peripheral edge as in the first embodiment, so that the hermetic reliability when the lid member is placed and the ceramic wiring board is hermetically sealed is low.

As described above, in the connected ceramic wiring board 11 of this embodiment, the bottomed hole 15 is
B, as well as the first main surface 1A, the plated layer 8 can be uniformly formed on the metallized layer 7 formed on the inner wall surface 15B of the bottomed hole 15, thereby improving the yield. Can be done. In addition, the first break groove 1
3, the bottomed hole 15 also communicates with the first main surface 1A side.
Can be connected in contact with each other. For this reason, there is no wasteful part when dividing the connected ceramic wiring board 11 into the ceramic wiring boards 1. Therefore, compared to the connection ceramic wiring board having an unnecessary portion, the connection ceramic wiring board 1 can be manufactured at a lower cost.

Further, the shape of the metallized layer 9 for sealing is not restricted by the concave portion 5, and the airtight reliability can be improved. In the case where the connected ceramic wiring board 11 on which the plating layer 8 is formed is broken at the first break groove 13 to obtain individual ceramic wiring boards 1, the bottomed hole 1
Since the plating layer 8 is uniformly formed in the concave portion 5 formed by dividing the ceramic wiring substrate 5, the ceramic wiring substrate 1 has high connection reliability when being connected to another wiring substrate or the like. Also,
If the connection ceramic wiring board 11 and the ceramic wiring board 1 are manufactured by the manufacturing method of the present embodiment, in the groove forming step, the first break grooves 13 are formed from the first main surface 1A side.
Is formed, and the bottomed hole 15 and the first break groove 13 can be communicated with each other through the bottom portion 14 of the bottomed hole 15. Therefore, unlike the related art, there is no need to create an unnecessary portion and separately communicate the bottomed hole 15, and it can be performed simultaneously with the formation of the first break groove 13. Therefore,
The working process can be simplified, and the connected ceramic wiring board 11 and the ceramic wiring board 1 can be manufactured at low cost.

(Modification) Next, a modification of the first embodiment will be described. In the present modification, the connected ceramic wiring board is provided with a first break groove 4 formed from the first main surface 1A side as a break groove.
3 and a second break groove 44 formed from the second main surface 1B side in opposition thereto (see FIG. 6).

In manufacturing this connected ceramic wiring board, the laminating step of laminating the ceramic green sheets is the same as in the first embodiment. In the groove forming step, as shown in FIG. 6, the boundary 12 between the regions corresponding to the adjacent ceramic wiring boards 1 is formed from the first main surface 1A side of the ceramic green sheet laminate 51 formed in the laminating step.
Along with inserting the first break blade P1,
A second break blade P2 opposed to the first break blade P1
Is inserted from the second main surface 1B side.

Specifically, the first break blade P1 similar to that of the first embodiment is inserted to a depth sufficiently penetrating the upper ceramic green sheet 23 (first ceramic green sheet). At this time, the entire tip portion P1A of the first break blade P1 enters the stacked body 51, and the first break groove 43 corresponding to the shape of the tip portion P1A is formed. The first break groove 43 is formed through the bottom 14 of the bottomed hole 15 and communicates with the bottomed hole 15. Therefore, the bottomed hole 15 is
A state is established in which both surfaces of the first main surface 1A and the second main surface 1B are communicated. On the other hand, the second break blade P2 is inserted to a depth of about half the thickness of the lower ceramic green sheet 25.
At this time, a part of the front end P2A of the second break blade P2 enters the laminate 51, and substantially V corresponding to the shape of the front end P2A.
A letter-shaped second break groove 44 is formed. Note that the second break blade P2 has a front end P2A and a base P2B,
It has the same shape as the first break blade P1.

Thereafter, a firing step of firing the laminate 51,
The plating layer forming step of forming the plating layer 8 on the metallized layer 7 is the same as in the first embodiment. Also,
By the individual process, the same ceramic wiring board 1 as in the first embodiment is manufactured. Also in this modification, the same effects as those of the first embodiment can be obtained for the connected ceramic wiring board, the method for manufacturing the same, and the method for manufacturing the ceramic wiring board 1.

In the above, the present invention has been described with reference to the respective embodiments. However, the present invention is not limited to the above embodiments, and it can be said that the present invention can be appropriately modified and applied without departing from the gist thereof. Not even. For example, in each of the above embodiments, the second ceramic green sheet having the through hole 30 is composed of a plurality of layers, that is, two layers of the center ceramic green sheet 24 and the lower ceramic green sheet 25, and the portion corresponding to the through hole 30. First without through-hole
Although the ceramic green sheet is a connected ceramic wiring board composed of one layer of the upper ceramic green sheet 23, the present invention is not limited to this. Also included are those in which the second ceramic green sheet is composed of a single layer and those in which the first ceramic green sheet is composed of a plurality of layers.

In each of the above embodiments, the first break grooves 13, 43 and the second break groove 44 are formed by pressing. However, before or after firing of the connected ceramic wiring substrate, a laser or the like is used. Alternatively, the break grooves 13 and the like can be formed. Further, in each of the above embodiments, the ceramic wiring board 1 in which the crystal oscillator is housed in the electronic component recess 3 provided on the first main surface 1A side and the first main surface 1A is hermetically sealed with a lid member. Although shown, it is not limited to this. For example, the present invention can be applied to a ceramic wiring substrate having no concave portion.

[Brief description of the drawings]

FIG. 1 is a diagram showing a ceramic wiring board according to a first embodiment.

FIG. 2 is a view showing a connected ceramic wiring board according to the first embodiment.

FIGS. 3A and 3B are diagrams showing a connection ceramic wiring board and a method of manufacturing the ceramic wiring board according to the first embodiment, and FIG.
Shows a state in which the center ceramic green sheet and the lower ceramic green sheet are superimposed, (b) shows a state in which the upper ceramic green sheet is superimposed to form a laminate, and (c) shows a state in which a first break groove is formed in the laminate. This shows the formed state.

FIG. 4 is a view showing the connection ceramic wiring board and the method for manufacturing the ceramic wiring board according to the first embodiment, showing a state in which a first break blade is pressed on the laminate.

FIGS. 5A and 5B are diagrams showing a connection ceramic wiring board and a method of manufacturing the ceramic wiring board according to the first embodiment, and FIG.
Shows a fired connected ceramic wiring board, and (b) shows
The ceramic wiring board divided into pieces is shown.

FIG. 6 is a diagram illustrating a method for manufacturing a connected ceramic wiring board and a ceramic wiring board according to a modification of the first embodiment, and illustrates a state where a first break blade and a second break blade are pressed on a laminate.

FIG. 7 is a diagram showing a ceramic wiring board according to the related art.

FIG. 8 is a view showing a connected ceramic wiring board according to the related art.

FIG. 9 is a view showing a connected ceramic wiring board having unnecessary portions according to the related art.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Ceramic wiring board 1A 1st main surface 1B 2nd main surface 1C 1st side surface 1E 3rd side surface 5 Depression 7 Metallization layer 7A Unfired metallization layer 8 Plating layer 11 Connected ceramic wiring substrate 12 Boundary (between ceramic wiring substrates) 13 43, first break groove 14 (bottomed hole) bottom 15 bottomed hole 15B (bottomed hole) inner wall surface 21 laminate 23 upper ceramic green sheet (first ceramic green sheet) 23A through-hole exposed surface 24 center Ceramic green sheet (second ceramic green sheet) 25 Lower ceramic green sheet (second ceramic green sheet) 30 Through hole

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-9-74151 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23/12

Claims (6)

(57) [Claims] A plurality of ceramic wiring boards each having a first main surface and a second main surface, wherein said plurality of ceramic wiring boards are connected to each other and connected to each other; A first break groove formed from the first main surface side, and a bottomed hole which straddles between the adjacent ceramic wiring boards, is open on the second main surface side, and has a metallized layer formed on an inner wall surface; A part of the first break groove penetrates through the bottom of the bottomed hole, and the bottomed hole communicates with the first break groove, and the first break groove has a constant cross-sectional width. Base and destination are
The entire tip portion of the break blade having an end portion and the
What is fired after inserting and forming a part of the base
, And the connecting ceramic wiring board width on the first main surface of the first break groove being less than the diameter of the bottomed hole. 2. The connected ceramic wiring board according to claim 1, wherein a plating layer is formed on the metallized layer formed on the inner wall surface of the bottomed hole. Wiring board. 3. The connected ceramic wiring board according to claim 1, wherein all of the plurality of adjacent ceramic wiring boards are in contact with each other and are connected to each other. Connected ceramic wiring board. 4. A method for manufacturing a connected ceramic wiring board in which a plurality of ceramic wiring boards having a first main surface and a second main surface are connected in contact with each other, wherein a plurality of ceramic wiring boards are provided between adjacent regions corresponding to said ceramic wiring boards. One or more second ceramic green sheets having a through hole having an unfired metallized layer on the inner wall surface,
A laminating step of forming a laminated body obtained by laminating one or a plurality of first ceramic green sheets having no through hole in a portion corresponding to the through hole of the second ceramic green sheet, and a base having a constant cross-sectional width The entire tip portion and a part of the base portion of the break blade having a tip portion and a tip portion are pressed into the first portion and the first ceramic green sheet at a depth penetrating at least all of the one or more first ceramic green sheets. A first break groove whose width on the main surface is smaller than the diameter of the through hole is formed on the boundary between the regions corresponding to the adjacent ceramic wiring boards from the first ceramic green sheet side, and A groove that penetrates the bottom of the bottomed hole formed by the through hole and the exposed surface in the through hole of the first ceramic green sheet to communicate the bottomed hole with the first break groove. And forming step, the manufacturing method of the connecting ceramic wiring board characterized in that it and a firing step of firing the laminate. 5. The method for manufacturing a connected ceramic wiring board according to claim 4, wherein after the firing step, a plating layer forming step of forming a plating layer on a metallized layer on an inner wall surface of the bottomed hole is performed. A method for manufacturing a connected ceramic wiring board, comprising: 6. A method for manufacturing a ceramic wiring board, comprising: a first main surface, a second main surface, and a side surface having a concave portion on which a metallized layer and a plating layer are formed, wherein the adjacent ceramic wiring substrate is provided. One or a plurality of second ceramic green sheets in which a through hole having an unfired metallized layer is formed on the inner wall surface, straddling between regions corresponding to
A laminating step of forming a laminated body obtained by laminating one or a plurality of first ceramic green sheets having no through hole in a portion corresponding to the through hole of the second ceramic green sheet, and a base having a constant cross-sectional width The entire tip portion and a part of the base portion of the break blade having a tip portion and a tip portion are pressed into the first portion and the first ceramic green sheet at a depth penetrating at least all of the one or more first ceramic green sheets. A first break groove whose width on the main surface is smaller than the diameter of the through hole is formed on the boundary between the regions corresponding to the adjacent ceramic wiring boards from the first ceramic green sheet side, and A groove that penetrates the bottom of the bottomed hole formed by the through hole and the exposed surface in the through hole of the first ceramic green sheet to communicate the bottomed hole with the first break groove. A forming step, a firing step of firing the laminate to form a connected ceramic wiring board, and a plating layer forming step of forming a plating layer on the metallized layer on the inner wall surface of the bottomed hole after the firing step. And breaking the connected ceramic wiring substrate at the first break groove, dividing the bottomed hole into the concave portions, and dividing the divided holes into the ceramic wiring substrates. Manufacturing method of wiring board.