JP3180124B2 - Lead pin taping for circuit connection and lead pin mounting method using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead pin taping for holding lead pins led out for circuit connection from a printed board, an alumina board, or the like, and to a method for mounting lead pins using the same.

In general, in a circuit board such as a printed board or an alumina board, a plurality of lead pins from a predetermined side are led out from a predetermined side for circuit connection and mounted.

Conventionally, in order to attach the above-mentioned lead pins to a circuit board, the lead pins are handled individually and applied to the board surface of the circuit board, and connected and fixed to a circuit pattern by soldering, welding, bonding or the like. I have.

[0004] However, mounting lead pins one by one as a single item is not only extremely time-consuming and inefficient, but also requires a high degree of precision by arranging lead pins one by one at a predetermined interval. Is difficult.

[0005]

SUMMARY OF THE INVENTION The present invention provides a circuit connection which can extremely easily handle lead pins, can be efficiently fixed to a circuit board with high accuracy, can cope with high-speed and continuous processing, and can be mass-produced. And a lead pin mounting method using the same.

[0006]

According to a first aspect of the present invention, there is provided a lead pin taping for circuit connection, in which through holes for pitch feed and positioning are provided at regular intervals along a longitudinal direction. A plurality of necessary circuit-connecting lead pins are held in a multiple sequence at a plurality of set intervals by a tape having a plurality of necessary pins.

In the lead pin taping according to the second aspect of the present invention, a plurality of sets of circuit-connecting lead pins are held by a heat-resistant paper tape in a plurality at a set interval. Have been.

In the lead pin taping according to a third aspect of the present invention, the lead pins are led out and held inside an opening provided at the center of the tape.

According to a fourth aspect of the present invention, in a method of mounting a lead pin using lead pin taping, a heat-resistant tape having through holes for pitch feeding and positioning provided at regular intervals along a longitudinal direction. In this way, multiple sets of required circuit-connecting lead pins are held in multiples at regular intervals, and the tape is fed in pitches through holes to intermittently connect one set of circuit-connecting lead pins. In addition to being positioned and conveyed, the lead pins for connecting the circuit are positioned and fixed at predetermined positions on the circuit board by heat welding while being aligned with the circuit board supplied by another means.

[0010]

In the lead pin taping for circuit connection according to the first aspect of the present invention, a plurality of lead pins for circuit connection are arranged in a group and held in multiples with a pitch feedable tape. Since the lead pins can be sent to the circuit board mounting process by tape transport, not only can they be handled very easily, but also multiple lead pins can be mounted and fixed to the circuit board while holding them with tape, so mounting work can be performed with high precision, efficiency, and speed. I can do it. In addition, since a plurality of lead pins are arranged in a set and held in multiples by a heat-resistant tape, even when the lead pins are attached to the circuit board by heat welding, troubles such as the tape being blown occur. Nothing.

In the lead pin taping according to the second aspect of the present invention, a plurality of sets of circuit-connecting lead pins are held in a plurality at a predetermined interval by a heat-resistant paper tape in multiple rows at a predetermined interval. Even when the lead pins are attached to the circuit board by heat welding, troubles such as fusing of the tape do not occur.

In the lead pin taping according to the third aspect of the present invention, the lead pin is positioned inside the opening provided at the center of the tape and held, so that the lead pin can be covered and protected because the tape is wound up. Can be held stably in a pitch feedable manner.

According to a fourth aspect of the present invention, there is provided a lead pin mounting method using lead pin taping, in which a plurality of lead pins are pitch-fed one by one with a tape and aligned with a circuit board supplied by another means. By simultaneously attaching and fixing a plurality of pins to the circuit board, the lead pins can be efficiently and accurately attached to the circuit board, and productivity can be improved. In addition, since the lead pins for circuit connection are held and transported by a tape having heat resistance, even if the lead pins are attached to the circuit board by heating and welding, it is possible to prevent the occurrence of troubles such as melting of the tape, and to transport the tapes afterwards. There is no hindrance.

[0014]

FIG. 1 is a plan view of a lead pin taping for circuit connection according to an embodiment of the present invention, and FIG. 2 is a side view of a tape 1. In the drawing, reference numeral 1 denotes a heat-resistant tape continuously formed in a belt shape, and 2, 2... Denote lead pins held in a multiple shape by the tape 1.

The tape 1 is formed of a carrier tape 10 serving as a base tape, and an adhesive tape 11 for fixing the lead pins 2, 2,... To the carrier tape 10. The tape 1 is provided with through holes 12 for pitch feeding and positioning of the tape 1 at regular intervals in the longitudinal direction.

At the center of the tape surface, there are through holes 12,
.. Are provided at predetermined intervals as spaces for positioning the lead pins 2, 2,. The tape 1 is preferably formed using heat-resistant paper, and can be configured at low cost as the lead pins 2, 2,... Held by the tape 1 are fixed to the circuit board by heat welding.

The lead pins 2, 2,... Are positioned on the inside of the openings 13, 13,. A plurality of necessary pieces can be arranged in a set at a predetermined interval corresponding to the mounting interval, and can be held in multiples by the tape 1. Also, the lead pins 2, 2
Can be led out and held so as to correspond to two opposite sides of the circuit board by arranging a plurality of sets on the left and right sides of each of the openings 12, 12,.

FIG. 3 is a plan view showing a lead pin taping according to another embodiment of the present invention. In the taping, the lead frame 3 is cut out and formed.
Are arranged in a group and a plurality of plate-like lead terminals 2, 2... In the case of the lead frame 3, a plurality of the lead terminals 2, 2... Are arranged and integrally formed from a continuous edge in a strip shape, and the heat-resistant tape 1 is adhered to the strip edge as a carrier tape 10. Can be configured as lead pin taping.

FIG. 4 is a plan view showing a lead pin taping according to still another embodiment of the present invention. In this taping, a set of lead pins 2, 2,... Is positioned at openings 13, 13,. It is configured as a lead pin taping holding 2, 2,....

By using the above-described lead pin taping, by arranging the transporting process of the lead pin taping in parallel with the manufacturing process of the circuit board, the lead pins 2, 2,.
Can be fed to the mounting position on the circuit board. In the mounting position of the lead pins, the lead pins 2, 2,... Are positioned in the through holes 12, 12,..., And applied to the circuit board supplied by another means, and the circuit of the circuit board is heated and welded by soldering, welding, bonding or the like. Since it is connected and fixed to the pattern, it can be attached to the circuit board.

After the connection is fixed, the axis of the lead pins 2, 2,... Is cut with a cutter or the like, and the lead pins 2, 2,. Thereafter, the lead pins 2, 2,... May be separated from the tape 1 in the final process after the pitch is fed with the circuit board and post-processing is performed on the circuit board.

[0022]

As described above, according to the lead pin taping according to the present invention, the lead pins for circuit connection can be sent to the mounting process on the circuit board by tape transport, so that they can be handled very easily, with high accuracy, efficiency, and speed. Since a plurality of lead pins are arranged in a set and held in multiples with a heat-resistant tape, even when the lead pins are attached to a circuit board by heating and welding, occurrence of trouble due to tape fusing can be prevented.

In addition, a plurality of circuit-connecting lead pins arranged in a set at a predetermined interval by a heat-resistant paper tape are held in multiples at a plurality of set intervals, so that it can be constructed at low cost. Since the tape is taken up by holding the lead pin inside the opening provided at the center position of the tape, the lead pin can be covered and protected, and the tape can be held stably and pitch-feedable.

In the method of mounting lead pins using lead pin taping according to the present invention, a plurality of lead pins are pitch-fed by a set of a plurality of tapes and aligned with a circuit board supplied by another means, and a plurality of the circuit boards are simultaneously mounted. By attaching and fixing to the board, the lead pins can be easily handled and can be efficiently and accurately attached to the circuit board, thereby improving productivity. Further, even if the lead pins are attached to the circuit board by heat welding, it is possible to prevent troubles such as tape fusing and to prevent trouble in subsequent tape conveyance.

[Brief description of the drawings]

FIG. 1 is a plan view showing a lead pin taping for circuit connection according to an embodiment of the present invention.

FIG. 2 is a side view showing the lead pin taping of FIG. 1;

FIG. 3 is a plan view showing a lead pin taping for circuit connection according to another embodiment of the present invention.

FIG. 4 is a plan view showing a lead pin taping for circuit connection according to still another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat resistant tape 12, 12 ... Through-hole for pitch feed and positioning 13, 13 ... Opening 2,2 ... Lead pin for circuit connection

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/00-13/04 B65D 63/10

Claims (4)

(57) [Claims] 1. A plurality of sets of circuit-connecting lead pins arranged at regular intervals by a heat-resistant tape having through holes for pitch feed and positioning at regular intervals along the longitudinal direction. Lead pin taping for circuit connection characterized by being held in multiple rows. 2. The lead pin according to claim 1, wherein a plurality of sets of circuit-connecting lead pins are held in series at a plurality of set intervals by a heat-resistant paper tape. taping. 3. The lead pin taping according to claim 1, wherein the lead pin is led out and held inside an opening provided at a center position of the tape. 4. A plurality of sets of required circuit connection lead pins are arranged in a required plurality by a heat-resistant tape having through holes for pitch feed and positioning provided at regular intervals along the longitudinal direction. Hold the tape in multiples at intervals, feed the tape in pitches through holes, intermittently position and transport the set of lead pins for circuit connection one by one, and align it with the circuit board supplied by another means. Wherein said lead pins for circuit connection are mounted and fixed at predetermined positions on a circuit board by heat welding.