JPH02130997A - Electronic component mounting on substrate - Google Patents

Abstract

PURPOSE:To perform a consistent automatic treatment by a method wherein a plurality of sheets of substrates are respectively placed on lower jigs and transfer, a printing of solder, placing of electronic component, placing of upper jig, an insertion of lead and a reflow treatment are performed en bloc from the first of an assembly line to the end of the line. CONSTITUTION:Reflow lower jigs 38, on which a plurality of sheets of substrates are respectively placed, are sucked one sheet by one sheet by a lower jig loader 31 and are fed to a positioning table part 40 of a solder printer 33 by s transferring machine 32. The jigs 38 are positioned by the table 40, sucked and fixed, are carried directly under a printing mask and are performed a printing of a cream solder. Then, the jigs 38 are transferred to component placing devices 9 and 10 by a belt conveyor 4 to place components, reflow upper jigs 29 are respectively superposed on the jigs 38 by an upper jig superposing machine 35, leads 3 are automatically inserted in lead holding grooves 29a of the jigs 29 by 8 lead inserting machine 36 and the points of the leads are abutted on the substrates. Then, the jigs 38 with the jigs 29 superposed on them are sent to a reflow furnace 12 by a conveyor 12a and both jigs 38 and 29 are soldered to each other. The jigs 29 are sucked using vacuum by vacuum suction holes 38c of placing recessed parts 38a of the substrates 1 of the jigs 38 and the external shape of the jigs 38 and the dimension and positions of suction holes (not shown in the diagram) of a receiving plate of the table 40 are standardized. By this constitution, the whole process can be automatized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] According to the present invention, electronic components and leads are soldered and attached to a wiring-coated board. This invention relates to a method for mounting electronic components onto a board.

[Conventional technology]

Figure 8g6 is a schematic diagram showing the 111 configuration of the mounting assembly twin using the conventional method of mounting electronic components on a board.
A board loader that picks up each board one by one and supplies it to a transfer machine 6; 7 a solder printer that transfers the board 1 that has been picked up to the transfer machine 6 one by one and screen-prints cream solder; 8 a solder printer that prints solder; 9.10 Belt conveyor for conveying the substrate 1
A component placement device 11 places various electronic components other than leads at predetermined locations on a solder-printed board 1, and 11 is a work conveyor section that manually places the leads.

A reflow lower jig (
The reflow upper jig (hereinafter referred to as the "upper jig") 29 is placed on top of the reflow upper jig (hereinafter referred to as the "upper jig"), and each lead of the upper jig 29 holds the plurality of leads. The upper jig 2 is inserted into the groove and temporarily held by the lower jig 28.
A reflow jig 2F consisting of 9 stacked on top of each other was brought in.
The solder printing machine 7 is a reflow furnace that heats and welds solder. The solder printing machine 7 is shaped like K as shown in FIG.
The print mask 1 is supported rotatably in the direction of arrow A around the center, and is rotated by a vertical cylinder 6.
A squeegee part that places cream solder on the substrate 1, moves the system squeegee in the direction B by the cylinder 18, and transfers the cream solder onto the substrate 1 through the printing mask 14a;
Reference numeral 19 denotes a positioning table portion for the substrate, which is moved to a predetermined printing position in the Y-axis direction by a pair of guide support rods 20 on both sides.

The positioning table part 19 is shown in FIG. 8 and FIG. 21a is penetrated, and the pipe connection joint 25 is attached to the base 21, which is connected to the vacuum suction source.
A receiving plate attached to the top has a suction groove 22a communicating with the communication hole 21a, and a plurality of vacuum suction holes 2 branched from this groove.
023a and 231) are mounted on the receiving plate 22, and 24a and 241) are fixed positioning plates for the ZX-axis direction and the Y-axis direction, and 24a and 241) are provided for the
A movable positioning plate in the axial direction positions and fixes the substrate 1 placed on the receiving plate 22 against the fixed positioning plates 23a and 23b.
It is shown in an exploded view and a sectional view in FIG. 0 and FIG. 11. In the figure, 27 is a reflow jig and is configured in a linear manner. The reflow lower jig 28 has a mounting recess 28a formed in the center of the upper surface for positioning and mounting a plurality of substrates l, and a positioning hole 28b is provided in the lower jig 029 on which the substrate 1 is mounted. The upper reflow jig is superimposed on the reflow tool 28, and the fixed alignment bin 30 is fitted into the alignment hole 281 of the lower jig and aligned. The first JL29 is provided with a large number of lead holding grooves 29a, and when a lead 3 is inserted into each of these holding grooves 29aK, each lead 3 is positioned and supported.

The tip comes into contact with cream solder at a predetermined location on the board 1.

A conventional method for mounting electronic components on a board will be explained with reference to FIG. First, the substrates 1 are taken out one by one from the substrate loader section 5 and supplied to the positioning table section 19 of the solder printing machine via the transfer section 11II6.Here, as shown in FIG. The placed substrate 1 is positioned in the X-axis and Y-axis directions, and is suctioned and held by the vacuum suction holes 221).

The table section 19 in this state is moved directly below the printing mask 14a as shown in FIG.
Print cream solder on the top surface of the board 1 where electronic components are to be placed and where the leads 3 are to be connected. Next, as shown in Figure @6, the board 1 is placed on the belt conveyor 8.
The board 1 in this state is transferred to the next process component placement device 9.10, where various electronic components such as semiconductor devices, resistors, and capacitors except for the leads 3 are placed at predetermined locations. 11, where, as shown in Figures 10 and 11, 1 manual operation #),
A plurality of substrates 1 are placed in the mounting recess 28a of the lower jig 28, the upper jig 29 is placed on top of the lower jig 28, the leads 3 are inserted into each lead holding groove 29a, and the tips are placed on the substrate. 1
As shown in FIG. 6, the reflow jig 27 with the leads 3 arranged on the board 1 is put into the reflow oven 12 by the conveyor 12a, and each electronic component 2 is brought into contact with the top.
Then, the leads 3 are soldered and welded to the wiring on the substrate 1.

In this way, the board that has been assembled with the child parts mounted is
Shown in Figure 12. Various electronic components 2 such as semiconductor devices, resistors, capacitors, etc., and leads 3 are attached to a board 1 on which printed wiring is soldered.

[Problems to be Solved by the Invention] In the conventional method of mounting electronic components on a board as described above, in the printing process and the heavy component mounting process.

Since each board 1 is processed one by one, the time ratio required for transporting and processing each board 1 is low.

In the solder printing machine 7, there is a problem that the throughput of the board mounting and assembly fins is significantly reduced, such as the need to change the setup of the positioning table section 19 for each size of the various boards 1. Since manual work is required to insert and hold the lead 3, the chip position may be misaligned.

There was a problem in that it hindered consistent automation up to solder reflow.

This invention was made to solve these problems. Multiple boards are printed with cream solder at once, electronic components are mounted, IJ + cards are placed, and soldered in a reflow oven. Welding improves productivity and facilitates integrated automation of board component mounting and assembly. The purpose is to obtain a method for mounting electronic components on a board.

[Means to solve the problem]

A method for mounting electronic components on a board according to the present invention is as follows.

From the beginning of the assembly process, multiple boards are lined up, positioned, and placed on the reflow jig, and then vacuum-adsorbed.

The lower jig is fed to a solder printing machine, and the board group is printed with cream solder all at once.Then, this lower jig is transferred to a component placement device, electronic components are placed on it, and this lower jig is Transfer the upper jig to the upper jig placement machine, stack the lower jig upper IJ flow upper jig, transfer this reflow jig to the lead insertion machine, and insert the leads into the multiple lead holding grooves of the upper jig. Then, the tip thereof is brought into contact with a predetermined position on the board, and the reflow jig in this state is placed in a reflow oven to solder-weld each electronic component and each lead to each corresponding board.

[Effect]

In this invention, a plurality of boards are placed on the lower jig, and transported, solder printed, and electronic parts are placed all at once from the beginning to the completion of the TT 1,000-component mounting assembly twin.

Place the jig on the reflow and insert and hold the lead.

Processing is performed in a reflow oven, improving productivity.

-Comprehensive automation is possible〇 [Embodiment] Fig. 1 is a schematic plan view showing the configuration of a mounting assembly twin according to an embodiment of the method for mounting electronic components on a board according to the present invention. 9, 10, 12 , 12a are the same as the above-mentioned conventional one. In FIG. 0, 31 is a lower jig loader that sucks and supplies a reflow lower jig on which a plurality of substrates 1 are placed side by side, one by one.

The reflow jig having the above-mentioned lower reflow jig 38 is
It is shown in an exploded view and a sectional view in FIG.

In the figure, 37 is a reflow jig, and the lower reflow jig (hereinafter referred to as the "lower jig") is configured in a linear manner.
38 is formed with a mounting recess 38a in which a plurality of substrates 1 are arranged and positioned in the center of the upper surface.

0 placement opening 3 in which a 91 positioning hole 38b is provided
At the bottom of 8a, vacuum suction holes 3 are provided at positions relative to each substrate 1.
A reflow upper jig (hereinafter referred to as "upper jig") 29 is placed above the n lower jig 38 where the alignment bin 3 is provided.
0 into the alignment hole 381).

The upper jig 29 is provided with a large number of lead holding grooves 29a so that the leads 3 are inserted and held in the lead insertion process.
゛It is pressed so that its tip comes into contact with the cream solder at a predetermined location on the board 10.Returning to Fig. 1, the lower jig 38 on which a plurality of ゛boards are placed is transferred via the FJI 32 and printed with solder. 1! The solder printing machine 33 transferred to the i33 screen prints cream solder all at once on each board 1 on the lower jig 3 days.

34 is a belt conveyor that conveys a lower jig 38 on which each board 1 is printed with solder, and 35 is a lower jig 38 that accommodates each board 1 on which electronic components are mounted.

The upper jig overlapping @, 36 for overlapping the upper jig 29 is a lead insertion machine that inserts the leads 3 into each lead holding groove 29a of the overlapping upper jig 29, respectively.

The solder printing machine 33 positions and fixes the lower jig 29 with a positioning table section 40, and screen prints a plurality of boards 1 at once with cream solder, but the other mechanisms are as shown in FIG. 7 above. The positioning tape AalS40 is similar to the solder printing W17, and the positioning tape AalS40 has a K shape as shown in the cross-sectional view and cross-sectional view in FIGS. In the supported base, a suction groove 41a is provided and a communication hole 411) is penetrated therethrough, and a pipe connection joint 22 is attached thereto to connect it to a vacuum suction source. Reference numeral 42 denotes a receiving plate mounted on the base 41, which is provided with a suction hole 42 & branching from the suction lm 41a, and a vacuum suction hole 38 of the lower jig 38 placed thereon.
They are connected to c.

43a and 431) were mounted on the receiving plate 42. The fixed positioning plates 44a and 44b in the X-axis direction and the Y-axis direction are movable positioning plates in the X-axis direction and the Y-axis direction, and they fix the lower jig 38 on which a plurality of substrates l are placed and placed on the receiving plate 42. The positioning plates 43a and 43b are pressed to position and fix the substrates. Each substrate l is sucked into each suction hole 38c, and the lower jig 38 is also sucked into the receiving plate 42. The component mounting method will be explained with reference to FIG. 32 to the positioning table section 40 of the solder printing machine 33. Here, as shown in FIG. 4, the lower jig 38 placed on the pedestal 42 is
It is positioned in the Y-axis direction and held by suction in the suction hole 42a.

The table section 40 in this state is moved directly below the printing mask 9a, similar to that shown in FIG. 7, and cream solder is printed at the locations where electronic components are scheduled to be placed and where the leads are scheduled to be connected on the top surface of each board l. .

Next, as shown in FIG. 1, the lower jig 38 is conveyed by the belt conveyor 34 to the component mounting device 9.10 for the next process.
Here, various electronic components other than the leads 3 are placed at predetermined locations on each board 1.

The lower jig 38 in this state is sent to the upper jig layering machine 35.

Position the upper jig 29 on the lower jig 38 and overlap and join them.Insert the lead into the reflow jig 37 in this state @36
Here, the leads 3 are automatically inserted into each lead holding groove 29a of the upper jig 29, and their tips are brought into contact with the upper surface of the substrate.

The reflow jig 37 thus constructed is sent to the reflow furnace 12 by the conveyor 12a, and each electronic component 2 and each lead 3 is soldered onto the board l.

In this way, as shown in FIG.
and lead 3 are mounted.

Vacuum suction holes 3 are provided in the mounting recess 38a of the lower reflow jig 38.
8o is provided, each board 1 in the solder printing machine 33 is positioned by a lower jig 38, and each is vacuum suctioned, so that it can be used in an automatic machine from the beginning of one assembly process. Furthermore, if the external dimensions of the lower jig 38, the number of boards accommodated, and the dimensions and positions of the suction holes 42a of the receiving plate 42 of the positioning table section 40 of the solder printing machine 33 are standardized, the external dimensions of the board l will change slightly. However, the number of setup changes for each dimension is greatly reduced.

In addition, since a plurality of substrates 1 are transported in units of lower jigs at once from the beginning of one assembly process, automatic placement and insertion of upper jigs 29 and leads 3 are carried out in one stack, making it easy to create continuous twins. .

In the above embodiment, the mounting recess 38a of the lower jig 38 is sized to match the entire outer shape of the plurality of substrates 1, and is positioned at one location to accommodate the plurality of substrates 1.

A plurality of placement recesses may be provided so that each substrate 1 can be positioned and accommodated separately. Even if the external shape of the board is not rectangular or a combination of different types of boards, it can be handled by providing a mounting recess shaped to accommodate and position the board according to the external shape. ] As mentioned above, according to Hakuaki, a reflow lower jig that can position and accommodate multiple boards and vacuum suction is used from the beginning of the assembly process.

Multiple boards are transported in bulk at the lower reflow jig position, solder printing, electronic component placement, reflow upper jig stacking,
Since the lead is inserted and processed in a reflow oven, the electronic component mounting and assembly process can be fully automated throughout the entire process, greatly improving processing capacity and increasing productivity.

[Brief explanation of the drawing]

Figure 1 is a schematic cross-sectional view showing the construction of an assembled twin according to an embodiment of the method of mounting electronic components on a board by Tomyo Akira, and Figures 2 and 3 are similar to the assembled twin of Figure 1. Exploded perspective view and cross-sectional view of the rear row jig used, Figures 4 and 5
The figures are a top view and a sectional view of the positioning table section of the solder printing machine shown in FIG. 1. Figure 6 is a schematic diagram showing the purchase of a mounting assembly twin using the conventional method of mounting electronic components on a board, Figure 7 is a side view of the solder printing machine shown in Figure 6, and Figures 8 and 9 are A cross-sectional view and a cross-sectional view of the positioning table part of the solder printing machine in Figure 7, 8
Figure g1O and Figure @11 are an exploded perspective view and a sectional view of a reflow jig used after the work conveyor section of the assembly twin shown in Figure 6, and Figure 12 is a mounting method according to an embodiment of the present invention and a conventional mounting method. 0 is a perspective view showing an example of a board that has been mounted and assembled by the method. 0 1... Board, 2... Electronic component, 3... Lead, 9
．． N. ... Parts included Ii! Machine, 12... Reflow oven, 29
... IJ 70-upper jig, 29a... Lead holding mechanism, 33... Solder printing machine. 35...Upper jig stacking machine, 36...Lead insertion machine, 3
8... Lower reflow jig, 38a... Placement recess, 38
C...Vacuum suction hole

Claims (1)

[Claims] An electronic component mounting method in which cream solder is printed on a board, electronic components are subsequently placed, the tips of a plurality of leads are brought into contact with the board, and the electronic components and leads are soldered and welded in a reflow oven. In this method, a reflow lower jig with a mounting recess formed on the upper surface and a plurality of vacuum suction holes at the bottom of the mounting recess is used from the beginning of the mounting assembly twin, and multiple substrates are placed in the mounting recess. A method for mounting electronic components on a board, characterized in that electronic components and leads are mounted on a plurality of boards at once by arranging and positioning them, respectively, using a reflow lower jig.