JP3180042B2 - Resin molding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for molding a resin by transfer molding, and more particularly, to an apparatus for molding a component such as an electronic component provided on a frame material such as a lead frame. is there.

[0002]

2. Description of the Related Art When encapsulating and molding an electronic component such as a semiconductor device using a thermosetting resin such as a phenol resin, an epoxy resin, or an unsaturated polyester resin, transfer molding has been generally performed. The mold of the transfer molding apparatus is formed by providing a resin flow path such as a pot and a cavity and a runner connecting the pot and the cavity, and an injection plunger is provided in the pot so as to be movable forward and backward. Then, a resin material such as a thermosetting resin is supplied to the pot, and while the resin material is heated in the pot, the injection plunger is advanced to pressurize the resin material in the pot. The resin material is melted by pressure, and the resin material is injected into the cavity from the resin flow path to perform molding. When the resin material to be supplied into the pot is powdery, the resin material filled in the hopper is measured by a measuring means,
A predetermined amount of the measured resin material is conveyed to a pot and thrown into the pot.

[0003]

When the resin material to be supplied to the pot in the above-mentioned conventional example is powdery and granular, when the powdery and granular resin material is supplied into the pot and molded, The air between the particles may be simultaneously entrained when the resin material is injected into the cavity, and a molded product may have void defects. In addition, since the powdery resin material is supplied from a hopper having an open upper surface, fine powder floats in this portion, which causes a problem that the working environment is deteriorated.

Therefore, conventionally, a tablet is used in which a powdery resin material is pressed and compressed to expel air between particles. The tablet thus formed by compression is supplied to a pot, and thereafter, the tablet is heated in the pot and pressurized by an injection plunger as in the above, and the molding is performed. However, this method requires a molding step for tableting when manufacturing the resin material, which requires man-hours and equipment for manufacturing tablets having various types of tablet diameters and weights, which leads to an increase in cost. Was something. In addition, there is a problem in that the tableting resin material takes a long time to be melted in a pot, and the molding cycle is delayed.

[0005] The present invention has been made in view of the above points, and does not require the use of a tablet-shaped resin material.
It is an object of the present invention to provide a resin molding apparatus that can obtain a product with less void defects and that does not have a possibility of deteriorating the working environment due to fine powder.

[0006]

According to a first aspect of the present invention, there is provided a resin molding apparatus, comprising: a molding die apparatus for transfer molding; and a material for measuring and supplying the resin material in the form of powder. And a cavity 2 for injecting and molding a resin into the molding die apparatus A, and the resin material 1 measured and supplied by the material measurement and supply apparatus B and melted. The pot 3 has a pot 3 to be injected into the cavity 2. The resin material 1 supplied to the pot 3 is melted and the resin material 1 is once compressed in the pot 3 to melt air therein. It has a compression and injection means for injecting the resin material 1 which has expelled and expelled this air into the cavity 2, and the material metering device B is provided with an opening 5 of a cartridge-shaped container 4 containing the powdery resin material 1. Detachable Container mounting portion 6 attached to the stationary
And a measuring means for measuring the granular resin material 1 supplied from the container 4 attached to the container attaching portion 6 ,
The hoist is placed on the auxiliary hopper 56 provided in the material
The hopper main body 35 is placed and the lower part of the hopper main body 35 is mounted.
Insert the mounting part 39 on the auxiliary hopper 56 and connect
Next, a container mounting portion provided on the upper portion of the hopper body 35
6 into the female thread 9b of the cartridge-shaped container 4
The container 4 is taken into the hopper body 35 by screwing the male screw portion 9a.
And a shutter 38 that can be opened and closed on the hopper body 35
Is provided . A fixed amount of powdery resin material 1 measured by the material metering device B is supplied to the pot 3, the resin material 1 is melted in the pot 3, and the resin material 1 is injected from the pot 3 into the cavity 2 to perform molding. Can be.
At this time, even if the powdery resin material 1 is supplied to the pot 3,
Once the resin material 1 is compressed in the pot 3, the air of the resin material 1 is expelled, and the resin material 1 from which the air is expelled can be injected into the cavity 1 for molding. Even void-free products can be molded. In addition, by melting the powdery resin material 1 in the pot 3, the melting of the resin material 1 in the pot 3 can be accelerated, and the molding cycle can be improved. In addition, since the powdery and granular resin material 1 is supplied and measured from the cartridge-shaped container 4, fine material is not generated in the material measuring and supplying device B, so that the working environment can be prevented from being deteriorated. In addition, the resin material 1 in the form of powder is contained.
The shutter 5 is inserted into the mouth 5 of the cartridge
External thread portion of the mouth portion 5 of the hopper body 35 in a state in which 8 closed
9a by screwing the female screw 9b of the container mounting portion 6 to the container mounting portion 6.
And attach the hopper body 35 to the mouth 5 of the container 4
After that, the container 4 is turned upside down to assist the hopper body 35
The hopper body 35 is placed on the hopper 56 and
To the hopper 56, and
The resin material 1 stored in the container 4 by opening the
And the resin material 1 in the form of powder is not leaked.
Supply, and the dust rises further to improve the working environment.
Powder from the cartridge-shaped container 4 so as not to make it worse
The granular resin material 1 can be easily supplied.

In the resin molding apparatus of the second aspect, a molding die apparatus A for forming a resin molded portion by transfer molding on a part provided on a frame material such as a lead frame 8;
A frame input device C for inputting the frame material into the molding die device A; a frame extracting device D for extracting the frame material having the resin molded portion formed by the molding die device A from the molding die device A; A material metering and feeding device B for metering and feeding the material 1, a cavity 2 for injecting a resin into the molding die device A to form the above-mentioned component, and a resin material 1 measured by the material metering and feeding device B And a pot 3 for injecting the molten resin material 1 into the cavity 2 while the resin material 1 supplied to the pot 3 is melted in the pot 3 once. The material 1 is compressed to expel air of the resin material 1 and has a compression / injection means for injecting the resin material 1 having expelled the air into the cavity 2. Housing the cartridge-like container 4
A container mounting portion 6 for detachably attaching the mouth 5 of the container,
Measuring means for measuring the granular resin material 1 supplied from the container 4 attached to the container attaching portion 6 ;
The hopper is placed on the auxiliary hopper 56 provided in the metering device B.
-Place the main body 35 on the lower side of the hopper
Connect the attachment part 39 by inserting it on the auxiliary hopper 56
And a container mounting portion 6 provided on an upper portion of the hopper body 35.
The male part of the mouth part 5 of the cartridge-shaped container 4 is
The container 4 is taken into the hopper body 35 by screwing the screw portion 9a.
And a shutter 38 that can be opened and closed on the hopper body 35
It is characterized by having been provided . The frame material is charged into the molding die device A by the frame charging device C and set, and the fixed amount of the powdery resin material 1 measured by the material metering device B is supplied to the pot 3. The resin material 1 is injected from the pot 3 into the cavity 2 and molded, and the frame material resin-molded into the frame material parts can be removed from the molding die apparatus A by the frame removal device D. Automatic resin molding of parts. At this time, even if the powdery and granular resin material 1 is supplied to the pot 3, the resin material 1 is once compressed in the pot 3 to expel the air of the resin material 1, and the expelled resin material 1 is injected into the cavity 1. Even if the powdery resin material 1 is used, a product without voids can be formed. In addition, by melting the powdery resin material 1 in the pot 3, the melting of the resin material 1 in the pot 3 can be accelerated, and the molding cycle can be improved. In addition, since the powdery and granular resin material 1 is supplied and measured from the cartridge-shaped container 4, fine material is not generated in the material measuring and supplying device B, so that the working environment can be prevented from being deteriorated. In addition, the resin material 1 in the form of powder is contained.
A shutter 38 is inserted into the mouth 5 of the cartridge-shaped container 4.
The hopper body 35 with the male thread 9
a by screwing the female screw part 9b of the container mounting part 6
The hopper body 35 was attached to the mouth 5 of the container 4.
Thereafter, the container 4 is turned upside down, and the hopper body 35 is
The hopper body 35 is placed on the
To the hopper 56 and shut
The resin material 1 contained in the container 4 is opened by opening the
It can be supplied by dropping, and the resin material 1 in the form of powder does not leak.
And the dust is soared further that the working environment is bad.
Powder from the cartridge-shaped container 4 so that
Resin material 1 can be easily supplied.

Further, in the invention of claim 3, in claim 1 or claim 2, the means for compressing and injecting the pot 3 comprises the step of closing the resin flow path 10 from the pot 3 to the cavity 2 inside the pot 3. The resin material 1 is pressurized by the injection plunger 7 and the molten resin material 1 is compressed once to expel the air of the resin material 1 and expel the air, and then open the flow from the pot 3 to the cavity 2 to open the pot 3.
It is characterized in that the molten resin material 1 is pressurized by the injection plunger 7 to supply the resin material 1 to the cavity 2. In this case, the resin material 1 is compressed by the injection plunger 7 to expel air, and the resin material 1 can be injected from the pot 3 into the cavity 2 by the injection plunger 7, so that the compression and injection means can be configured with a simple structure.

[0009]

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The overall structure of a resin molding apparatus is shown in FIG.
3 includes a molding die apparatus A, a material measuring and supplying apparatus B, a frame input apparatus C, a frame removing apparatus D, a supply magazine section E, a storage magazine section F, and the like. The molding die apparatus A is for performing transfer molding, and is configured as shown in FIGS. The mold is formed from a lower mold 11 and an upper mold 12 so that a cavity 2 is formed between the upper and lower molds 11 and 12. The lower mold 11 has a cylindrical sleeve 11a.
A pot 3 having an open top surface is formed in the sleeve 11a. A cull recess 13 is formed in the lower surface of the upper die 12 so as to face the pot 3. The lower runner 1 communicates with the cavity 2 on the upper surface of the lower mold 11.
4 is provided on the lower surface of the upper mold 12 with upper runners 15 extending from the periphery of the cull recess 13 respectively.
When closing the mold 12, the resin flow path 10 is formed by a lower runner 14 and an upper
Is formed. The resin flow path 10 allows the pot 3 and the cavity 4 to communicate with each other.

An ejector pin 16 is mounted so as to be vertically movable through the upper die 12. The ejector pin 16 is disposed at a position such that its lower end faces the upper runner 15 of the resin flow path 10.
Is moved forward (downward), the tip of the ejector pin 16 enters the upper runner 15 and the upper runner 1
5 is closed so as to close the resin flow path 10. By retreating (moving up) the ejector pin 16, the ejector pin 16 is removed from the upper runner 15.
The resin flow path 10 is opened by removing the front end portion.
Thus, the resin flow path 10 is formed by the ejector pins 16.
An opening / closing part for opening / closing is formed. The ejector pin 16 forming this opening / closing portion is preferably provided in the vicinity of the pot 3, so that the ejector pin 16 is provided in the upper runner 15 portion.

A mold comprising upper and lower dies 11, 12 is provided with a plurality of cavities 2 and each cavity 2 is connected to a pot 3 via a resin flow path 10 so that multi-cavity molding can be performed. is there. The mold has a multi-pot structure by providing a plurality of pots 3. In FIG. 4, reference numeral 17 denotes an upper mounting plate for mounting the upper die 12, 18 denotes a lower die mounting plate for mounting the lower die 11,
Each has a hole 19 through which a heater as a heating means is passed.
The upper mounting plate 17 to which the upper die 12 is mounted is supported by the upper base 20, and the lower mounting plate 18 to which the lower die 11 is mounted is supported by the lower base 21, respectively. 21 is driven up and down by a drive mechanism. This drive mechanism is cleaner when driven electrically, but may be hydraulic. 4, reference numeral 22 denotes a rod of a driving cylinder for driving the injection plunger 7, reference numeral 23 denotes a cavity ejector pin provided in each cavity 2, and reference numeral 24 denotes a cavity ejector pin 23.
It is an ejector plate for operating the. The rear end of the ejector pin 16 provided with the resin flow path 10 is connected to an ejector plate 25, and the ejector plate 25 is attached to a tip end of a rod 27 of an ejector pin driving device 26. Therefore, by operating the ejector pin drive device 26, the ejector pin 16 can be driven forward and backward. As the ejector pin driving device 26, an electric type or a hydraulic type is used. In FIG. 4, reference numeral 28 denotes a spring.

In performing molding using the molding die apparatus A configured as described above, a lead frame 8 is loaded as a frame material from a frame loading apparatus C described later with the upper and lower dies 11, 12 open. At the same time, a fixed amount of powdery resin material 1 such as a thermosetting resin which is measured and sent by a material metering device B described later is supplied, and the upper and lower dies 11 and 12 are clamped as shown in FIG. I do. When the mold is clamped in this manner, the resin flow path 10 is closed by the ejector pins 16. The upper and lower dies 11 and 12 of the mold are heated by a heating means, and the resin material 1 supplied into the pot 3 is heated.
Is to be heated. After supplying the resin material 1 into the pot 3 in this manner, the injection plunger 7 is moved to the position shown in FIG.
Move forward as shown in (b). At this time, the resin flow path 10 is closed by the ejector pins 16, and the resin material 1 in the pot 3 cannot flow out to the resin flow path 10. It is pressurized and compressed as it moves forward. By compressing the resin material 1 in this manner, the air between the particles of the powdery resin material 1 is expelled, and the air in the pot 3 can also be expelled. The air expelled between the particles of the resin material 1 and the inside of the pot 3 is supplied to the lower mold 11 and the upper mold 1.
The liquid is discharged through a clearance between the injection plunger 7 and the pot 3, a clearance between the injection plunger 7 and the pot 3, a clearance between the ejector pin 16 and the resin flow path 10, and the like. At this time, by forcibly exhausting the air using a vacuum device or the like, the air discharging effect can be further enhanced.

After compressing the resin material 1 as described above, the ejector pin 16 is retracted (moved upward) as shown in FIG.
To open the resin flow path 10 and the injection plunger 7
Advance further. At this point, the resin material 1 in the pot 3 is in a completely molten state by heating and pressing. When the resin flow path 10 is opened as described above, the resin material 1 in the pot 3 is pressurized by the injection plunger 7. Of the resin material 1 flows into the resin flow path 10 and passes through the resin flow path 10 to form the cavity 2.
Injected into. By injecting the injection plunger 7 forward until the tip of the injection plunger 7 slightly protrudes from the parting line surfaces of the upper and lower dies 11, 12,
As shown in FIG. 5D, the injection of the resin material 1 into the cavity 2 is completed. As described above, when the resin material 1 is injected into the cavity 2 while controlling the operation of the injection plunger 7 and the ejector pin 16, the air between the particles of the resin material 1 is compressed and expelled as described above. However, the cavity 2 is not filled with the resin material 1 with the air mixed therein. Further, since the resin material 1 is melted while being pressed and compressed, the melting of the resin material 1 can be uniformed, and the resin material 1 can be smoothly injected into the cavity 2. After the molten resin material 1 is injected into the cavity 2 as described above, the resin material 1 is cured in the cavity 2. At this time, since air is not mixed into the resin material 1 as described above, it is possible to prevent the occurrence of void defects or the like in the molded product. After the curing is completed, the upper and lower molds 1
Open molds 1 and 12 and ejector pin 2 for cavity
The molded product in the cavity 2 can be protruded at 3 to take out the molded product.

Next, the structure of the supply magazine section E will be described. A plurality of magazine racks 30 are provided in the supply magazine section E.
Can be arranged side by side, and a lead frame 8 as a frame material can be supplied from the magazine rack 30 at the right end in FIG. A large number of lead frames 8 are mounted on each magazine rack 30 in two rows on the left and right, and two lead frames 8 can be supplied at a time. The right end of the plurality of magazine racks 30 supplies the lead frame 8 to the next process, and the remaining left magazine rack 30 supplies the next lead frame 9 when the right magazine rack 30 becomes empty. belongs to. The lead frame 8 has a component such as an electronic component attached thereto, and the component is sealed and molded by the molding apparatus A described above.
When sending out the lead frame 8 from the magazine rack 30, as shown in FIG.
The pusher 31 pushes out the two lead frames 8 at the same time. At this time, the lead frames 8 of the magazine rack 30 are sequentially pushed out from the bottom, and the magazine racks 30 are sequentially lowered as the lead frame 8 is pushed out. A take-up roller 32 is disposed on the side where the lead frame 8 is pushed out of the magazine rack 30. The lead frame 8 pushed out of the magazine rack 30 is taken up by the take-up roller 32 and is placed below the frame loading device C. It can be placed on the preheat table 33 arranged. In the case of this example, two preheat tables 33 are arranged in parallel, and two lead frames 8 are placed on each preheat table 33 so that the lead frames 8 can be preheated. The two preheat tables 33 are movable in the left-right direction.
After the two lead frames 8 are placed on the preheat table 33, the lead frame 8 sent out in the same manner as described above is placed on the other preheat table 33. The pre-heat table 33 is provided with a positioning unit 34.
After the lead frame 8 has been sent and placed as described above, the positioning unit 34 is driven as shown by the arrow to
As shown in (1), the lead frame 8 on the preheat table 33 can be positioned with the positioning receiving portion 34a. After positioning the lead frame 8, the preheat table 33 returns to the original position. A frame loading device C is arranged above the preheat table 33, and the lead frame positioned and set on the preheat table 33 is chucked and loaded into the lower mold 11 from above the preheat table 33. I have. That is, in the case of this example, four lead frames 8 can be chucked at the same time and four can be loaded at the same time.

The material metering and feeding device B is shown in FIGS.
It is configured as shown in FIG. The hopper body 35 is formed in a cylindrical shape such as a cylindrical shape or a rectangular tube shape.
6 are provided. One opening of the through hole 36 is formed as a large-diameter circular container mounting portion 6, and a female screw portion 9b is provided on the inner periphery . The other opening of the through hole 36 is formed as a funnel-shaped resin material supply section 37 whose inner diameter becomes smaller as the outlet 37a. The outlet 37a of the resin material supply unit 37 is passed between the opposing side surfaces of the hopper body 35.
A shutter 38 is provided so as to traverse. Locking pieces 38a and 38b are provided at both ends in the longitudinal direction of the shutter 38 so as to be bent. The locking pieces 38a and 38b abut on the side surface of the hopper body 35 to lock the shutter 38 in the longitudinal direction. It is slidable in the direction. The shutter 38 has an opening / closing opening (not shown).
By matching the opening / closing opening of the shutter 38 with the outlet 37a, the opening 37a of the resin material supply unit 37 is opened, and the shutter 38 is slid to open / close the opening 37a.
The outlet 37a of the resin material supply unit 37 is closed by shifting the position so as not to coincide with the above. Further, a device mounting portion 39 is provided so as to protrude from a surface of the hopper body 35 on which the outlet 37a of the resin material supply portion 37 is formed.
The device mounting portion 39 is disposed so as to cover the shutter 38 and is fixed to the hopper body 35 with screws, and an outlet 37 a of the resin material supply portion 37 is opened through the device mounting portion 39. On both side surfaces of the device mounting portion 39, slide locking pieces 40 are protruded.

On the other hand, the cartridge-shaped container 4 is formed of a plastic poly-container such as polyethylene or polyethylene terephthalate, and a mouth 5 is provided on the upper part thereof. The mouth 5 is formed in a cylindrical shape, and
Is is provided with a male screw portion 9a, it is formed so as to be screwed into the female screw portion 9b of the container mounting portion 6 of the hopper body 35. Their to the container 4 accommodated by filling the resin material 1 of the granules granules, such as like or powdery or granular and powdery and are mixed particulate, the male screw portion 9a of the mouth portion 5 of the cap lid 41 A cap lid 41 is attached to the mouth 5 by screwing an inner thread 42 on the inner periphery. The opening of the mouth 5 is closed by the cap lid 41 so that the inside of the container 4 can be sealed. Since the resin material 1 can be sealed in the container 4 as described above, foreign substances can be prevented from being mixed into the resin material 1, and nitrogen gas or the like is sealed in the container 4 to perform a nitrogen purge. That makes things easier. Also, a desiccant such as silica gel can be added. Further, by forming the container 4 to be transparent or translucent, it is easy to check the contents and the remaining amount.

In FIG. 8 and FIG. 9, reference numeral 43 denotes a base plate which is supported and fixed above a base 44 by a column 45. A resin material measuring device 46 is attached to the upper surface of the base plate 43. The resin material measuring device 46 is formed as shown in FIG. 11 by providing a measuring rotor 49 in a circular cavity 48 of a casing 47, and a measuring concave portion 50 is provided on the outer periphery of the measuring rotor 49. is there. The volume of the measuring recess 50 can be freely adjusted by a bulk adjusting plunger 51. The metering rotor 49 is connected to the rotary actuator 5 via a coupling 52.
3 and the position where the measuring recess 50 faces the inlet 54 on the upper surface of the casing 47 and the outlet 5 of the casing 47.
5 is rotated and driven at an angle in a range between the position facing the fifth position. The resin material 1 flows from an auxiliary hopper 56, which will be described later, into the inflow port 54.
When the measuring concave portion 50 faces the inlet 54, the resin material 1 is filled into the measuring concave portion 50 from the inlet 54. When the measuring rotor 49 is rotated, only the resin material 1 filled in the measuring concave portion 50 is sent to the outlet 55 and the outlet 5
5, the amount of the resin material 1 measured in the measuring recess 50 can be discharged from the outlet 55. The resin material 1 measured in the measuring concave portion 50 of the measuring rotor 49 is discharged from the chute 57 provided on the lower surface of the resin material measuring device 46 below the outlet 55, The discharged resin material 1 is put into a receiving basin 58 disposed below the chute 57. The receiving tray 58 is attached to the tip of a moving plate 59, and the moving plate 59 is driven by a cylinder device or the like so as to move forward from the position shown in FIG. A shutter plate 61 slidably driven by a cylinder device 60 is attached to the receiving tray 58 so that the lower opening can be opened and closed. The moving plate 59 is advanced in the direction of the arrow in FIG. 58 is positioned above the input box 63 of the input head 62, the cylinder device 60 is operated to slide the shutter plate 61, and
By opening the opening on the lower surface of 8, the resin material 1 can be charged from the receiving cell 58 to the input cell 63.
The input head 62 is driven together with the frame input device C, and the input head 62 includes a molding die device A.
A charging tub 63 is provided corresponding to each of the pots 3. The resin material 1 is distributed in the receiving tub 58 and charged into each of the charging tubs 63, and then the molding head A is used by the charging head 62.
The resin material 1 can be simultaneously supplied to the plurality of pots 3.

A pedestal plate 64 is mounted on the upper surface of the resin material measuring device 43, and an auxiliary hopper 56 is mounted on the pedestal plate 64. Auxiliary hopper 56
Is provided with a through hole 65 penetrating vertically, and is attached to a pedestal plate 64 by fixing a mounting plate 66 provided on the lower surface to a bolt 67. The lower portion of the through hole 65 has a resin material input portion 6 whose diameter becomes smaller toward the lower end.
8, the outlet 68 a at the lower end of the resin material charging section 68 is provided with a mounting plate 66 and a pedestal plate 64.
Through the resin material measuring device 46.
The auxiliary hopper 56 has an outlet 6 of the resin material charging section 68.
A shutter 69 is provided so as to cross 8a. At both ends in the longitudinal direction of the shutter 69, locking pieces 69a. 69b
The shutter 69 is slidable in a range in which the locking pieces 69a and 69b abut against the side surface of the auxiliary hopper 56 and are locked, and the shutter 69 is slid in this manner. Thereby, the outlet 68a of the resin material charging section 68 is opened and closed. Further, a hopper fixing plate 70 is attached to the upper surface of the auxiliary hopper 56.
Guide rails 71, 71 are attached to both sides of the upper surface. Each of the guide rails 71 has a locking receiving piece 72 provided on an upper portion of an inner side surface thereof over the entire length and is formed in a substantially inverted L-shaped cross section. Through hole 6 of auxiliary hopper 56
5 is an auxiliary hopper 5 through a hopper fixing plate 70.
6 is opened on the upper surface.

The resin material 1 is accommodated in the cartridge-shaped container 4 and transported while being sealed with the cap lid 41. In order to supply the resin material 1 from the container 4, first, As shown in FIG. 11A, the cap lid 41 is removed from the mouth 5 of the container 4 by turning the cap lid 41, and then the hopper body 3 is attached to the mouth 5 of the container 4.
5 is attached. The hopper main body 35 can be attached to the container 4 by turning the hopper main body 35 and screwing the female screw 9b into the male screw 9a of the mouth 5 of the container 4 as shown in FIG. At this time, the outlet 37 a of the resin material supply section 37 of the hopper body 35 is closed by the shutter 38.

After the hopper main body 35 is attached to the mouth 5 of the container 4 as described above, as shown in FIG.
Is turned upside down and mounted on the auxiliary hopper 56. Since the outlet 37a of the resin material supply unit 37 of the hopper body 35 is closed by the shutter 38, the resin material 1 in the container 4 flows out of the mouth 5 when the container 4 is turned upside down and turned upside down. There is no. And the auxiliary hopper 56
The device mounting portion 39 of the hopper body 35 is slid and inserted into guide rails 71, 71 provided at the upper ends of the guide rails 71, 71, and the device mounting portion 39 is inserted into the locking receiving pieces 72 of the guide rails 71, 71.
Of the container 4 by locking the slide locking pieces 73 of
And the hopper body 35. In FIG. 8, reference numeral 74 denotes a stopper provided on the hopper fixing plate 70. The stopper 74 is positioned so that the device mounting portion 39 inserted between the guide rails 71 abuts on the stopper. In this manner, the container 4 and the hopper body 35 can be mounted. By pulling and sliding the shutter 38 of the hopper body 35, the outlet 37a of the resin material supply unit 37 is opened, and the resin housed in the container 4 is opened. The material 1 can be supplied from the opening 5 through the through hole 36 of the hopper body 35 and dropped from the outlet 37 a of the molding material supply unit 37. Resin material 1 as described above
By attaching the hopper body 35 to the container 4 containing the container, the container 4 can be mounted in a cartridge type. Therefore, dust may soar as in the case where the resin material 1 is charged from a packing bag or a packing case. Will be gone. When the container 4 is empty, the guide rail 7
After removing the device mounting portion 39 inserted into the first and the first 71, the container 4 is removed together with the hopper main body 35, and after removing the hopper main body 35 from the container 4, the cap lid 41 is reattached to the container 4 and the maker of resin material 1 It is used for returning and again housing and transporting the resin material 1. As described above, the container 4 can be used repeatedly as many times as a passage for transporting the resin material 1, and it is possible to generate industrial waste without disposable like a conventional packing bag or packing case. Can be reduced.

The hopper body 35 includes an auxiliary hopper 56.
The resin material 1 supplied through the hopper main body 35 is temporarily attached to the auxiliary hopper 33.
After the shutter 38 of the hopper body 35 is closed, the shutter 69 of the auxiliary hopper 56 is opened to be supplied to the resin material measuring device 46. When the resin material 1 is directly supplied from the hopper body 35 to the resin material measuring device 46, the weight of the resin material 1 in the container 4 passes through the through-hole 36 of the hopper body 35.
Is added to the resin material 1 filled in the measuring concave portion 50 of the measuring rotor 49, and the weight of the resin material 1 added in this manner varies depending on the amount of the resin material 1 in the container 4. Therefore, the amount of the resin material 1 measured by the resin material measuring device 46 varies depending on the amount of the resin material 1 remaining in the container 4, and the measurement accuracy deteriorates. Therefore, an auxiliary hopper 56 is provided to prevent the resin material 1 remaining in the container 4 from affecting the resin material measuring device 46 with the auxiliary hopper 56, and the amount of the resin material 1 remaining in the container 4 depends on the amount of the resin material 1 remaining in the container 4. The amount of the resin material 1 measured by the resin material measuring device 46 is prevented from fluctuating.

The frame take-out device D has a take-out head 76 as shown in FIG. 14, and the take-out head 76 has a chuck portion 77 for holding the lead frame 8 resin-molded into a component. Then, the lead frame 8 resin-molded by the molding die apparatus A is gripped and held by the chuck portion 77, and the lead frame 8 can be taken out to the take-out portion 85 by the take-out head 76.
The take-out section 85 is provided with two take-out tables 78 so that the lead frames 8 taken out two by two by the frame take-out device D can be placed in order. Also, a punching plate 79 is arranged on the take-out head 76, and when the lead frame 8 is taken out to the take-out table 78, the cull runner 80 of the lead frame 8 can be taken out by the punching plate 79. I have. The cal runner 80 punched here is collected in a collection box 81.

The storage magazine F is constructed as follows. Magazine racks 83 are arranged side by side in the storage magazine section F, and the magazine rack 83 at the left end in FIG.
The lead frame 8 can be stored therein. Each magazine rack 83 can accommodate a large number of lead frames 8 vertically in two rows on the left and right. The leftmost one of the plurality of magazine racks 83 is for accommodating the lead frame 8, and the remaining right magazine rack 83 is empty for accommodating the lead frame 8 next. As shown in FIG. 15, the lead frame 8 taken out from the take-out table 78 as shown in FIG.
Each of them is pushed by the storage shooter 84 and stored in the magazine rack 83. At this time, the lead frames 8 are stored in the magazine rack 83 in order from the bottom, and the magazine racks 83 descend sequentially as the lead frames 8 are stored. 2
The two take-out tables 78 are freely movable in the left-right direction. After the two lead frames 8 are stored in the magazine rack 83 from one take-out table 78, the take-out table 78 is moved to move the other take-out table 78.
And two lead frames 8 can be stored in a magazine rack 83.

Next, the overall operation of the resin molding apparatus configured as described above will be described. The two lead frames 8 are pushed from the magazine rack 30 of the supply magazine section E to the pushers 31.
And the lead frame 8 pushed out by the pusher 31 is taken out by the take-up roller 32 and
It is placed on one of the preheat tables 33. One preheat table 3
When the lead frame 8 is placed on the lead frame 3, the positioning unit 34 is driven to position the lead frame 8 on the preheat table 33 with the positioning receiving portion 34a.
The preheat table 33 is moved, and the next two lead frames 8 are moved to the magazine rack 30 in the same manner as described above.
From the other preheat table 33. After positioning the lead frame 8, the preheat table 33 returns to the original position.

As described above, at the same time when the lead frame 8 is supplied from the supply magazine section E and positioned, the resin material 1 is measured and supplied by the material measuring and supplying device B as follows. The resin material 1 supplied from the container 4 is measured by the above-described resin material measuring device 46 and discharged from the chute 57. The resin material 1 discharged from the chute 57 is charged into the receiving box 58, and is input from the receiving box 58. Input box 6 for head 62
It is thrown into 3. This operation is repeated by the number of the input boxes 63, and the resin material 1 is input into all the input boxes 63. The lead frame 8 is chucked by the frame loading device C in a state where the resin material 1 has been loaded into all the loading boxes 63 in this manner, and the lead frame 8 is sent to the molding die apparatus A together with the loading boxes 63.

When the lead frame 8 is loaded by the frame loading device C as described above, the upper and lower dies 11, 12 of the molding die device A are in the opened state, and the lead frame 8 is positioned at a predetermined position of the lower die 11. The lead frame 8 is set to correspond to the cavity 2. At this time, the resin material 1 is simultaneously charged into each pot 3 from the charging box 63. Then, the upper and lower dies 11, 12 are clamped to be formed. When the mold is clamped, the resin flow path 10 is closed by the ejector pins 16. The upper and lower molds 11 and 12 of the mold are heated by a heating means, so that the resin material 1 supplied into the pot 3 is heated. After the resin material 1 is supplied into the pot 3 as described above, the injection plunger 7 is advanced. At this time, the resin flow path 10 is closed by the ejector pins 16 and the resin material 1 in the pot 3 is
Since the resin material 1 cannot flow out to zero, the resin material 1 in the pot 3 is pressurized and compressed as the injection plunger 7 advances. By compressing the resin material 1 in this way, the air between the particles of the powdery resin material 1 is expelled. After the resin material 1 is compressed as described above, the ejector pins 16 are retracted to open the resin flow path 10, and the injection plunger 7 is further advanced. At this point,
The resin material 1 in the pot 3 is in a completely molten state by heating and pressurizing. When the resin flow path 10 is opened as described above, the resin material 1 in the pot 3 is pressurized by the injection plunger 7. Flows into the resin flow path 10 and is injected into the cavity 2 through the resin flow path 10 to be molded. After the curing is completed, the upper and lower dies 11 and 12 are opened, the lead frame 8 in the cavity 2 is protruded by the ejector pin 23 for the cavity, and the lead frame 8 can be taken out.

After taking out the lead frame 8 in this manner, the lead frame is gripped by the chuck 77 of the take-out head 76 of the frame take-out device D (the cull runner 80 is held in vacuum), and the lead frame 8 is taken out.
Are placed on the take-out table 78 two by two. Then, when the lead frame 8 is taken out to the take-out table 78, the cull runner 80 of the lead frame 8 is punched and removed by the punching plate 79. The lead frames 8 taken out from the take-out table 78 as described above are pushed two by two by the storage shooter 84 and housed in the magazine rack 83.
After the two lead frames 8 are stored in the magazine rack 83, the take-out table 78 is moved, and the two lead frames 8 are stored in the magazine rack 83 from the other take-out table 78.

Although the present invention has been described with reference to the case of supplying and molding a fixed-size lead frame 8 cut to a predetermined length, the present invention may be applied to the case of continuously supplying and molding a hoop-shaped lead frame 8. It can be implemented similarly.

[0030]

According to a first aspect of the present invention, there is provided a molding die apparatus for transfer molding, and a material measuring and supplying apparatus for measuring and supplying a powdery resin material. Since it has a cavity for injecting and molding resin and a pot for supplying the resin material measured by the material metering device and injecting the melted resin material into the cavity, a fixed amount of powder and granules measured by the material metering device is provided. The resin material is supplied to the pot, the resin material is melted in the pot, and the resin material is injected into the cavity from the pot to form the resin material. Has a compression and injection means for compressing the resin material in the pot once to expel the air of the resin material while injecting the resin material into the cavity. Therefore, even if a powdery resin material is supplied to the pot, the resin material is once compressed in the pot to expel the air of the resin material, and the resin material expelled from the air can be injected into the cavity and molded. It can mold products without voids even when using powdery and granular resin materials.Furthermore, by melting powdery and granular resin materials in the pot, the resin material in the pot can be melted quickly and the molding cycle can be improved. In addition, the material metering / supplying device further includes a container mounting portion for detachably attaching a mouth of a cartridge-shaped container containing the granular resin material, and a powder and granular material supplied from the container mounted on the container mounting portion. And a measuring means for measuring the amount of the resin material, so that the powdery and granular resin material can be supplied and measured from the cartridge-shaped container, and fine powder is generated by the material measuring and supplying device. All SANYO work environment can be so as not to be bad without or, also
Hopper on the auxiliary hopper provided in the material metering device
Places the main body to assist the device mounting part at the bottom of the hopper main body
Connect by inserting on the hopper and on the hopper body
Cartridge on the female thread of the container mounting part provided in the part
Screw the male thread of the mouth of the container into the container
And a shutter that can be opened and closed freely on the hopper body.
A cartridge containing powdery resin material
At the mouth of the container, open the hopper with the shutter closed.
Connect the body to the external thread of the mouth.
Attach by screwing and attach the hopper body to the mouth of the container
After opening, turn the container upside down and lift the hopper
And place the hopper body on the auxiliary hopper
Connection, and open the shutter of the hopper body.
Capable of dropping and supplying resin material contained in a container
It can be supplied so that the powdery resin material does not leak.
To prevent dust from rising and deteriorating the work environment
Powder resin material from a cartridge-shaped container
Ru Der what can be supplied.

According to the invention of claim 2 of the present invention, a molding die apparatus for forming a resin molded portion by transfer molding on parts provided on a frame material such as a lead frame, and a molding die apparatus for applying the frame material to a molding die apparatus A frame feeding device for feeding, a frame take-out device for taking out a frame material having a resin molded portion formed by the molding die device from the molding die device, and a material measuring / feeding device for measuring and supplying a powdery resin material are provided. Since the molding die apparatus has a cavity for injecting a resin and molding into the above-mentioned parts, and a pot for supplying the resin material measured by the material metering device and injecting the molten resin material into the cavity, The frame material is charged into the molding die device by the frame charging device and set. The fixed amount of the powdery resin material measured by the material metering device is supplied to the pot. The resin material is melted in a pot, the resin material is injected into the cavity from the pot and molded, and the frame material resin-molded into a frame material part can be taken out of the molding die device by a frame take-out device. In addition, resin molding of frame material parts can be automatically performed. In addition, while the powdery and granular resin material supplied to the pot is being melted, the resin material is once compressed in the pot to release the air of the resin material. Since there is a compression and injecting means for injecting the resin material which has expelled and expelled this air into the cavity, even if the powdery and granular resin material is supplied to the pot, the resin material is once compressed in the pot to release the air of the resin material. The resin material that has been expelled and this air has been expelled can be injected into the cavity to be molded, and a void-free product can be molded using powdered resin material And a kill things,
In addition, the resin material in the pot can be melted in the pot so that the resin material in the pot can be melted quickly and the molding cycle can be improved. A container mounting portion for detachably attaching the mouth of the container, and a measuring means for measuring the granular resin material supplied from the container mounted on the container mounting portion. all SANYO possible so as not to deteriorate without working environment to fine granular resin material can metered supply of a material metering device or generated, also material meter
Place the hopper body on the auxiliary hopper provided in the
Place the device mounting section below the hopper body on the auxiliary hopper
To the top of the hopper body.
Insert a cartridge-shaped container into the female thread
Screw the male thread at the mouth of the
The hopper has a shutter that can be opened and closed.
And a cartridge-like container containing powdery resin material
At the mouth of the container, put the hopper body with the shutter closed.
For screwing the female thread of the container mounting part to the male thread of the mouth
And attached the hopper body to the mouth of the container
After that, the container is turned upside down and the hopper body is
And insert the hopper body into the auxiliary hopper
Connect and open the shutter of the hopper body to open the container
Can be supplied by dropping the resin material contained in
Therefore, the powdery resin material can be supplied so as not to leak.
Make sure that dust does not soar and the working environment is adversely affected.
Easy supply of granular resin material from cartridge-shaped container
Ru Der what can be.

According to a third aspect of the present invention, in the first or second aspect, the means for compressing and injecting the pot comprises the resin material in the pot with the resin flow path from the pot to the cavity closed. The molten resin material in the pot is injected by pressing the injection plunger to compress the molten resin material once to expel the air of the resin material and expel the air, and then open the flow from the pot to the cavity to inject the molten resin material in the pot. Pressurized to supply the resin material to the cavity, so the injection plunger compresses the resin material to expel air, and the injection plunger allows the resin material to be injected from the pot into the cavity and compressed with a simple structure And an injection means.

[0033]

[Brief description of the drawings]

FIG. 1 is an overall plan view of a resin molding apparatus according to an example of an embodiment of the present invention.

FIG. 2 is a front view of the same.

FIG. 3 is a side view of the same.

FIG. 4 is a cross-sectional view of the molding die apparatus of the same.

FIGS. 5 (a), (b), (c) and (d) are cross-sectional views for explaining a state in which molding is performed by the molding die apparatus of the above.

FIG. 6 is an explanatory diagram illustrating a state in which a lead frame is supplied from the supply magazine unit according to the first embodiment.

FIG. 7 is an explanatory diagram of a state in which the lead frame is positioned.

FIG. 8 is a side view of the same material supply and weighing device.

FIG. 9 is a front view of the same material supply and weighing device.

FIG. 10 is a reduced side view of FIG. 8;

FIGS. 11 (a), (b) and (c) are explanatory views of the state of use of the above container.

FIGS. 12 (a) and 12 (b) are cross-sectional views illustrating the operation of the above resin material measuring device.

FIG. 13 is an explanatory diagram for explaining distribution to the input boxes.

FIG. 14 is an explanatory diagram illustrating a state where a lead frame is placed on the takeout table according to the first embodiment.

FIGS. 15A and 15B are views for explaining a storage state of the lead frame in the storage magazine part, in which FIG. 15A is a schematic plan view and FIG.
Is a schematic front view.

[Description of Signs] A Molding device B Material supply device C Frame feeding device 1 Resin material 2 Cavity 3 Pot 4 Container 5 Mouth 6 Container mounting portion 7 Injection plunger 8 Lead frame 9a Male screw portion 9b Female screw portion

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-251635 (JP, A) JP-A-64-59925 (JP, A) JP-A-59-2326 (JP, A) 57750 (JP, A) JP-A-55-133937 (JP, A) JP-A-57-166399 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B29C 45/00-45 / 24 B29C 45/46-45/63

Claims (3)

(57) [Claims] 1. A molding die device for transfer molding, and a material metering and feeding device for measuring and supplying a powdery and granular resin material, a cavity for injecting and molding a resin into the molding die device, It has a pot in which the resin material measured by the material metering device is supplied and the molten resin material is injected into the cavity. In this pot, the powdery resin material supplied to the pot is temporarily melted and melted. The compression and injection means for compressing the resin material to expel the air of the resin material at the same time and injecting the resin material expelled from the air into the cavity, and the material metering device has a cartridge-like shape containing a powdery resin material. A container mounting portion for detachably attaching the mouth of the container, and a measuring means for measuring the powdery and granular resin material supplied from the container mounted on the container mounting portion. Equipped, provided in the material metering device
Place the hopper body on the auxiliary hopper
Insert the device mounting section at the bottom of the main unit onto the auxiliary hopper
Attach the container at the top of the hopper body
Male thread on the mouth of the cartridge-shaped container on the female thread on the part
And attach the container to the hopper body.
A resin molding device comprising a body provided with a shutter that can be opened and closed . 2. A molding die apparatus for forming a resin molded portion by transfer molding on a part provided on a frame material such as a lead frame, a frame loading apparatus for charging the frame material into a molding die apparatus, and a molding die. The molding device includes a frame take-out device for taking out a frame material having a resin molded portion formed from the molding die device from the molding die device, and a material metering / feeding device for measuring and supplying a granular resin material. A cavity for injecting and molding the above-mentioned parts, and a pot for injecting the molten resin material into the cavity while the resin material measured by the material metering device is supplied,
In this pot, the resin material is compressed once in the pot to expel the air of the resin material while melting the granular resin material supplied to the pot, and the resin material expelled from the air is injected into the cavity. Having means,
The material metering / supplying device weighs the granular resin material supplied from the container attached to the container attaching portion to which the mouth of the cartridge-shaped container accommodating the granular resin material is detachably attached. Equipped with weighing means
And, relieved on the auxiliary ho wrapper provided on the material metering device
Place the printer body on the lower side of the hopper
Connect to the auxiliary hopper by plugging in, and the hopper body
Insert the cartridge into the female thread of the container
Screw the male thread at the mouth of the container into the hopper body
Shutter that can be opened and closed on the hopper body with the container attached
Resin molding apparatus, wherein a provided. And a means for compressing and injecting the molten resin material by pressing the resin material in the pot with an injection plunger while the resin flow path from the pot to the cavity is closed. The air is expelled from the material and the air is expelled, and then the flow from the pot to the cavity is opened to press the molten resin material in the pot with an injection plunger to supply the resin material to the cavity. The resin molding device according to claim 1 or 2, wherein