JP3134701B2 - Flux coating device and coating method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for applying a flux to a solder portion formed on an electrode of a substrate.

[0002]

2. Description of the Related Art Prior to soldering an electronic component on an electrode of a circuit pattern on a substrate, a flux is applied to a solder portion formed in advance on the electrode. Hereinafter, a conventional flux application method will be described.

FIG. 4 is a side view of a conventional flux coating apparatus. Reference numeral 1 denotes a substrate on which solder portions 3 are formed in advance on electrodes 2 of a circuit pattern formed on the upper surface. The solder portion 3 is formed by a solder leveler, solder plating, or the like. Reference numeral 4 denotes a table on which the substrate 1 is arranged.

[0004] Reference numeral 5 denotes a screen mask, which is held by a mask holder 6. The screen mask 5 is made of a thin stainless steel plate, and a pattern hole 7 is formed at a position corresponding to the solder portion 3. A squeegee 8 slides on the screen mask 5 in the direction of the arrow to apply a flux 9 on the solder portion 3 through the pattern hole 7. As the table 4, a movable table capable of horizontally moving the substrate 1 in the X direction or the Y direction in order to position the solder portion 3 of the substrate 1 and the pattern hole 7 of the screen mask 5 is used.

[0005]

As described above, conventionally, the flux 9 is screen-printed and applied on the solder portion 3 using the screen mask 5 having the pattern holes 7 formed therein. However, with such conventional means,
Since the screen mask 5 having the pattern holes 7 suitable for the substrate 1 must be manufactured every time the type of the substrate 1 changes, there is a problem that the manufacture of the screen mask 5 is troublesome and the cost increases. there were. In particular, in recent years, the circuit pattern of the substrate 1 has been refined, and the pattern of forming the pattern holes 7 of the screen mask 5 has also been refined. Therefore, the production of the screen mask 5 has tended to become more and more difficult.

Accordingly, an object of the present invention is to provide a flux coating apparatus and a coating method which can eliminate the need for a screen mask having pattern holes.

[0007]

For this purpose, the present invention provides a plate, a squeegee for applying a thin flux to the surface of the plate by sliding over the plate with a clearance therebetween, and a squeegee facing the plate. The flux applied to the plate is transferred onto a solder portion formed on an electrode of the substrate by vertically moving the plate relative to the substrate, where the substrate is disposed. A flux application device is configured from up and down movement means , and between the plate and the squeegee,
The same size as the substrate exposing the surface of the plate
With a mask plate with an opening of size
This mask plate ensures the clearance,
By sliding the squeegee on this mask plate,
Apply flux to the plate through the opening
And sea urchin.

A first step of applying a thin flux on the plate by sliding a squeegee with a clearance on the plate, and driving up and down moving means to move the plate relative to the substrate. And a second step of transferring the flux onto a solder portion formed on an electrode of the substrate by vertically moving the flux , and constitutes a flux coating method , and in the first step,
A table of the plate is provided between the plate and the squeegee.
An opening approximately the same size as the substrate that exposes the surface is opened.
This mask play is performed with the mask plate
The clearance is secured by the
Slide the squeegee on the
Lux was applied to the plate .

[0009]

According to the above construction, when the solder portion formed on the electrode of the substrate is brought into contact with the flux applied on the plate, the flux is transferred to the solder portion. This eliminates the need for a screen mask in which pattern holes are formed, and makes it possible to easily apply a flux onto solder portions of various types of substrates.

[0010]

Next, embodiments of the present invention will be described with reference to the drawings. Figure 1 is a side view of the solid施例the flux coating apparatus of the present invention, FIG. 2 is a plan view of a mask plate to be used in the coating apparatus of the flux, FIG 3 (a) (b) ( c) is the same flux It is a partial expanded sectional view of the application part of an application device.

In FIG. 1, reference numeral 1 denotes a substrate on which an electrode 2 of a circuit pattern is formed, and a solder portion 3 is formed on the electrode 2. Reference numeral 10 denotes a table as an arrangement portion of the substrate 1. Above the table 10, a mask plate 11 is provided. As shown in FIG. 2, the mask plate 11 includes a plate (described later) 2
Large opening 1 exposing the entire surface or almost the entire surface of 2
2 is open. The size of the opening 12 is substantially the same as that of the substrate 1. Reference numeral 13 denotes a squeegee, which is driven by moving means (not shown) to slide on the mask plate 11. The squeegee 13 is moved up and down by means (not shown) such as a cylinder so that the mask plate 11
The upper surface is freely accessible. 14 is a flux.

In FIG. 1, a cylinder 20 is provided between a mask plate 11 and a table 10. The cylinder 20 has a plurality of rods 21 and the rods 2
A plate 22 is held at the front end of the plate 1. Therefore, when the rod 21 of the cylinder 20 protrudes and retracts, the plate 22 moves up and down. The cylinder 20 is a rotating shaft 2 of a bearing 23.
4 is rotatably mounted on the shaft. When the motor 25 is driven, the cylinder 20 moves up and down 18 around the rotation shaft 24.
The plate 22 is turned upside down by 0 °.

The apparatus for applying the flux 14 is constructed as described above. Next, the operation of applying the flux 14 will be described. First, referring to FIG.
To raise the plate 22 from the solid line position to the chain line position (arrow A). In this state, the upper surface of the plate 22 is close to the lower surface of the mask plate 11 as illustrated. Then, when the squeegee 13 is slid right and left on the mask plate 11, the flux 14 is applied as a thin film through the opening 12 by the thickness of the mask plate 11. That is, the mask plate 11 is for applying the flux 14 to the plate 22 at a constant thickness while securing a clearance between the plate 22 and the squeegee 13 by the thickness of the mask plate 11. The liquid surface of the flux 14 applied on the plate 22 becomes a horizontal surface by the squeegee 13.

Next, the rod 21 is retracted so that the plate 2
2 is moved down and separated from the mask plate 11, and the motor 25 is driven to rotate the cylinder 20 on the rotating shaft 24.
Is rotated downward by 180 ° (arrow B). The cylinder 20 and the plate 22 indicated by broken lines show the state at this time, and the flux 14 is thinly attached to the lower surface of the inverted plate 22. At this time, the substrate 1 is waiting on the table 10. FIG. 3A shows the state at this time.

After the plate 22 and the substrate 1 are thus opposed to each other, the rod 21 of the cylinder 20 is protruded to lower the plate 22, and the flux 14 attached to the lower surface of the 3 (see arrow C and FIG. 3B). Since the solder portion 3 protrudes from the upper surface of the substrate 1, only the solder portion 3 contacts the horizontal surface of the flux 14. Next, when the rod 21 of the cylinder 20 is retracted, the plate 22 is raised, and FIG.
As shown in (c), the flux 14 is transferred onto the upper surfaces of the solder portions 3 at a plurality of locations at once. The substrate 1 on which the flux 14 has been applied as described above is sent to the next step (not shown), and electronic components are mounted on the flux 14. Thereafter, the substrate 1 is sent to a heating furnace and heated to a temperature equal to or higher than the melting temperature of the solder portion 3, so that the electrodes of the electronic component are soldered to the electrodes 2 of the substrate 1.

[0016]

[0017]

[0018]

[0019]

[0020]

As described above, according to the present invention, an expensive screen mask conventionally required for each type of substrate can be dispensed with, and a predetermined amount of flux can be applied on the solder portions of various types of substrates. It can be easily applied. It is sufficient opening a large opening in the or mask plate to expose the plate, its manufacture is simple Kiwate, and since the mask plate as the size of the substrate is changed slightly can be shared, the substrate The frequency of replacement of the mask plate due to the change of the product type is low, so that the burden on the operator involved in the replacement can be remarkably reduced, and the loss time involved in the replacement can be reduced.

Further, since it is not necessary to align the solder portion of the substrate with the pattern hole of the screen mask as in the above-described conventional method, the arrangement portion for arranging the substrate has a complicated structure, is expensive, and is difficult to operate and maintain. It is no longer necessary to use a troublesome conventional movable table, and there is no need for operating time or software for this positioning.Thus, the overall tact time can be significantly shortened, work efficiency can be increased, and costs can be reduced. Many effects can be obtained.

[Brief description of the drawings]

Side view of the flux coating apparatus of the real施例Next Patent

Plan view of a mask plate to be used in the coating apparatus of the flux of the real施例of the present invention; FIG

[3] (a) a partially enlarged cross-sectional view of the coating portion of the flux coating apparatus of the real施例 real partial enlarged sectional view of the coating portion of the flux coating apparatus施例(b) the invention of the present invention (c ) partially enlarged sectional view of the coating portion of the flux coating apparatus of the real施例of the present invention

FIG. 4 is a side view of a conventional flux coating device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Electrode 3 Solder part 10 Table 11 Mask plate 12 Opening 13 Squeegee 14 Flux 20 Cylinder

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/34 503 B05C 9/00

Claims (2)

(57) [Claims] 1. A plate, a squeegee for applying a thin flux to the surface of the plate by sliding on the plate with a clearance, and a substrate disposing portion for disposing a substrate facing the plate. Vertical movement means for transferring the flux applied to the plate to a solder portion formed on an electrode of the substrate by vertically moving the plate relative to the substrate ,
And between the plate and the squeegee, the plate
An opening of approximately the same size as the substrate exposing the surface of
This mask plate is opened with a mask plate
The above clearance is secured by the rate
Slide the squeegee on the rate and pass through the opening
A flux applying device for applying the flux to the plate . 2. A first step of applying a thin flux on the plate by sliding a squeegee with a clearance on the plate, and driving a vertical moving means to move the plate relative to the substrate. manner by vertical movement, the saw including a second step of transferring the flux on the solder portion formed on the electrode of the substrate, said first
In the process, between the plate and the squeegee,
Substantially the same size as the substrate that exposes the surface of the plate
With a mask plate with an opening
The above clearance is secured by the mask plate of
Slide the squeegee on the mask plate
A method for applying a flux, comprising applying a flux to the plate through an opening .