JP3128401B2 - Component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for picking up a component from a component supply unit by a mounting head and mounting the component on a board, and is mainly used in an electronic circuit board assembly process.

[0002]

2. Description of the Related Art In an apparatus for mounting an electronic component on a circuit board, a board position or a circuit pattern position on the board is often confirmed by recognition means in order to perform accurate mounting. An example of the apparatus can be found in JP-A-60-1900. Further, there has been proposed an apparatus for automatically confirming data on components in order to prevent erroneous mounting of components or running out of components. An example is an apparatus described in JP-A-5-37180.

[0003]

It is costly to provide separate means for collecting information about the board and information about the parts. The present invention seeks to solve this point.

[0004]

According to the present invention, an image pickup section for photographing a board for recognizing the board is provided on a mounting head, and the component supply unit is provided with data or component supply information on the component held by the mounting head. A display section for data relating to the unit itself is provided at a location at the same level as the substrate, and the image pickup section photographs this display section to collect information. Further, a sensor for detecting a mark attached to the substrate is provided in the mounting head, and information is collected by sensing the display unit of the component supply unit provided at the same level as that of the substrate as before. It was taken.

[0005]

Each time the substrate is set, the mounting head moves above the substrate, and the image pickup section photographs a predetermined portion of the substrate to obtain desired information. Also, when the component supply unit is set, the mounting head moves above the component supply unit as necessary, and the imaging unit photographs the display unit to obtain desired information. In a case using a sensor, each time the substrate is set, the mounting head moves above the substrate, and the sensor detects a mark on the substrate to obtain desired information. If necessary, the mounting head moves above the component supply unit,
The sensor obtains desired information from the display unit.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The first invention will be described with reference to FIGS. The component mounting apparatus 10 mounts electronic components on the circuit board 1, has a box-shaped base 11, and arranges various components on a table section 12 on the upper surface thereof. That is, 13 is a conveyor section passing through the center of the table section 12, 1
Reference numeral 4 denotes a first component supply unit disposed on one side of the conveyor unit 13, and reference numeral 15 denotes a second component supply unit disposed on the opposite side of the conveyor 13. The conveyor unit 13 plays a role of sending and sending the circuit board 1.

[0007] The first component supply unit 14 is formed by arranging a plurality of component supply units 16 in a horizontal row. Each of the component supply units 16 is of a type in which components are supplied using a component supply tape in which components are stored at a constant pitch. No. 4,735,341), which is well known, and a detailed description thereof will be omitted.

The second component supply section 15 is mainly composed of a cabinet 17 installed beside the base 11.
The positioning part 18 installed on the upper part also becomes a part of the component. The cabinet 17 is equipped with a rectangular coordinate robot 19, which is a multi-lead component 2 such as a flat pack IC from a tray (not shown) in the cabinet 17.
Is picked up and placed on the positioning unit 18. In the positioning section 18, the plurality of jaws push the multi-lead component 2 so as not to bend the lead, thereby roughly positioning the lead. Thereafter, the mounting head described later approaches the positioning section 18 and picks up the multi-lead component 2.

An XY stage 2 is provided above the table section 12.
0 is set. The XY stage 20 is connected to the table 12
The pillars 21 rising from the four corners of the
It is supported high above. Reference numeral 22 denotes a bridge part which forms a part of the XY stage 20 and connects the upper ends of the two columns 21 in the direction of the short side of the table part 12. 23
Is a linear slide guide which is also a part of the XY stage 20, and connects the upper ends of two columns 21 to the table 12
Are connected in the long side direction. The two linear slide guides 23 support the X motion block 24. X motion block 24
Receives power from a ball screw 25 bridged between two bridge portions 22 and a motor 26 for rotating the ball screw 25, and moves along a linear slide guide 23. X
The moving block 24 has a built-in Y moving unit that supports the mounting head 30 and moves the mounting head 30 in a direction perpendicular to the linear slide guide 23. The mechanism of movement of the Y motion unit is based on the ball screw and the motor, similarly to the X motion block.

The mounting head 30 is supported by the XY stage 20 in a suspended state, and a vertically movable spindle 31 is provided.
It has. The spindle 31 has a vacuum passage (not shown) inside, and a nozzle 32 connected to the vacuum passage is mounted at the lower end. The nozzle 32 is detachable.

Reference numeral 40 denotes a positioning part 1 of the second component supply part 15.
8 is a nozzle replacement unit arranged next to the nozzle replacement unit 8. The nozzle replacement unit 40 always holds a plurality of types of replacement nozzles 32 and replaces the nozzle 32 at the lower end of the spindle 31 in accordance with the type of component. However, the mechanism is not the gist of the present invention, and will be described. And JP-A-59-69992, JP-A-63-16700, and JP-A-1-121138.
It is only stated that a mechanism as described in Japanese Unexamined Patent Application Publication No. H10-19764 is adopted.

The conveyor section 13 has a fixed rail section 51 and a movable rail section 52. "Movable" of the movable rail portion 52 means that the distance between the movable rail portion 52 and the fixed rail portion 51 can be adjusted. Both the fixed rail portion 51 and the movable rail portion 52 have a belt 53 on the inner surface, and convey the circuit board 1 by this. A positioning means for stopping the circuit board 1 at a fixed position is provided in the middle of the conveyor section 13, but this is not shown.

A substrate support 60 is provided between the fixed rail 51 and the movable rail 52. The board supporting section 60 supports the circuit board 1 positioned on the conveyor section 13 from below, and prevents the circuit board 1 from bending even when the spindle 31 applies pressure. As in the device described in JP-A-59-29492, the board supporting portion 60 supports the circuit board 1 with a plurality of backup pins 61. Substrate support 6
Next to 0, a backup pin stocker 62 that holds a backup backup pin 61 is placed.

The mounting head 30 has a first imaging unit 71 and a second imaging unit 71.
An imaging unit 72 is attached, and a third imaging unit 73 is arranged beside the conveyor unit 13. Each of the first imaging unit 71, the second imaging unit 72, and the third imaging unit 73 is mainly configured by an industrial television camera. The first image pickup unit 71 is used for recognizing a reference mark (fiducial mark) printed on the circuit board 1, and the second image pickup unit 72 is used for recognizing a foot pattern (multi-lead) also printed on the circuit board 1. It is used for recognizing a land pattern for soldering the lead of the component 3. Third
The imaging unit 73 is installed beside the positioning unit 18 so as to look upward, and is used for recognition of the multi-lead component 2.

The component supply unit 16 is provided with a display section 80. The display unit 80 shown in the figure is configured by a metal tag protruding horizontally from the side surface of the component supply unit 16. The display unit 80 is placed at the same level as the circuit board 1.
On the upper surface of the display unit 80, information on the components held by the component supply unit 16 (component type, number, etc.) or information (type, structure, etc.) on the component supply unit itself is displayed.
Symbols, numbers, bar codes, etc. are displayed. The display is made by direct printing on the tag or pasting a piece of paper or tape. A liquid crystal display device or an LED display device can be used instead of the tag.

The automatic control system of the component mounting apparatus 10 is as shown in FIG. Reference numeral 100 denotes a main body control unit, and the central processing unit is a central processing unit 101, which has a memory 10
2. CRT 103 and keyboard 104 are attached.
The CRT 103 and the keyboard 104 are provided on a console section 90 in front of the base 11. Central processing unit 101
Is connected to the lighting controller 10 via the bus line 105.
6. XY stage controller 107, mounting head controller 108, nozzle replacement unit controller 109, conveyor unit controller 110, board support unit controller 111, component supply unit controller 112 . The lighting controller 106 controls a lighting unit 113, and the lighting unit 113 includes a first imaging unit 71, a second imaging unit 72,
This is a collective designation of lighting units (not shown) that are combined with the third imaging unit 73, respectively.

A recognition unit 120 is provided separately from the main body control unit 100. This is because the central processing unit 121 and the attached memory 12
2, an A / D conversion unit 125 and an image processing unit 126 connected to the CRT 123 and the central processing unit 121 via a bus line 124. The A / D converter 125 is connected to the first imaging unit 71, the second imaging unit 72, and the third imaging unit 73. The central processing unit 121 is connected to the central processing unit 101 of the main body control unit 100 via a communication line 130. A communication line 131 with an external device is also connected to the central processing unit 101.

The component mounting apparatus 10 operates as follows.
When the conveyor section 13 positions the circuit board 1 on the board support section 60, the backup pins 61 move up to support the circuit board 1. An adhesive has already been applied to the circuit board 1 at a location where components are to be mounted. Next, the mounting head 3
0 starts operation. First, the positional deviation of the circuit pattern on the circuit board 1 is checked. That is, the reference mark of the circuit board 1 is photographed by the first imaging unit 71, and the image is recognized by the recognition unit 120.
The analysis is performed by The displacement of the circuit pattern is caused by the movement of the XY stage 20 when the mounting head 30 picks up the component from the first component supply unit 14 or the second component supply unit 15 and mounts the component on the circuit board 1. Is corrected by

In the case of the multi-lead component 2, the mounting head 3
After 0 is picked up from the positioning unit 18, the third imaging unit 73 checks the positional deviation with respect to the nozzle 32, and the second imaging unit 72 also checks the position of the foot pattern, and based on the result, the XY stage 20. Position and spindle 3
1 is corrected.

When a new component supply unit 16 is set, the mounting head 30 causes the first imaging unit 71 to display the display unit 8.
Position above zero. Then, the image of the display unit 80 captured by the first imaging unit 71 is analyzed by the recognition unit 120, and it is checked whether the correct component supply unit 16 is set. In this case, the distance from the first imaging unit 71 to the display unit 80 is equal to the distance when the circuit board 1 is photographed.
There is no need to change the focus of the imaging unit 71. Note that the image can be captured using the second imaging unit 72.

FIG. 4 shows the second invention. The mounting head 30 is replaced with an image pickup unit composed of an industrial TV camera, and the sensor 7
4 are deployed. The sensor 74 detects a mark (a kind mark, a bad mark indicating good or bad) attached to the circuit board 1, and the display unit 80 on the other side.
It is also useful for collecting information from The display on the display section 80 needs to be simplified following the mark on the substrate.
As the sensor 74, a limited reflection type sensor having a limited distance to the detection target can be used.

[0022]

According to the present invention, information relating to a component or a component supply unit can be collected using an imaging unit or a sensor provided for board recognition, and the configuration is simplified. Further, since the display unit is placed at the same level as the substrate, when switching the recognition target from the substrate to the display unit or vice versa, a focusing operation is not required, and a mechanism therefor is not required.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of a component mounting device.

FIG. 2 is a side view of a main part.

FIG. 3 is a block diagram showing a control system.

FIG. 4 is a side view of a main part showing the second invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 10 Component mounting device 16 Component supply unit 30 Mounting head 71 1st imaging part 72 2nd imaging part 74 Sensor 80 Display part

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/02 H05K 13/08

Claims (2)

(57) [Claims] 1. An apparatus for picking up a component from a component supply unit by a mounting head and mounting the component on a substrate, wherein an imaging unit for photographing the substrate for recognizing the substrate is provided in the mounting head, Is provided with a display section for data relating to the parts held therein or for the data relating to the component supply unit itself at a location at the same level as the substrate, and collecting information from this display section by the imaging section. A component mounting device, characterized in that: 2. A device for picking up a component from a component supply unit by a mounting head and mounting the component on a substrate, wherein a sensor for detecting a mark attached to the substrate is provided on the mounting head, and the component supply unit includes: A display unit for displaying data relating to the parts to be held or data relating to the component supply unit itself is provided at a location at the same level as that of the substrate, and information is collected from the display unit by the sensor. A component mounting device characterized by the following.