JP3128168U - Diode element device for terminal box for solar cell - Google Patents

Abstract

Provided is a diode element device for a terminal box for a solar cell that can be easily mounted, has excellent heat dissipation, and can be miniaturized.
An outer periphery 2b of a first conductive electrode body 2 of a diode element 1 formed by mounting a chip diode 3 in a cylinder 2a of a cylindrical bottomed first conductive electrode body 2 is provided on a terminal plate 13. From the columnar portion 9 having a lower end surface having an area equal to or larger than the electrode area of the upper surface electrode, and the wide conductor plate 10 connected to the columnar portion 9, the upper surface electrode 8 of the chip diode 3 is inserted into the circular hole 14. The lower surface 9 a of the columnar portion 9 of the second conductive electrode 5 is connected, and the distal end portion 16 of the wide conductor plate 10 is welded to the other terminal plate 13.
[Selection] Figure 3

Description

  The present invention relates to a diode element device housed in a terminal box of a solar cell.

    In general, in a solar cell, a plurality of solar cells BS1, BS2,..., BSN are connected in series as shown in FIG. In this type of solar cell, diodes are connected in parallel to the respective solar cells BS1, BS2,..., BSN so that a high reverse bias voltage is not applied to the cells that do not contribute to power generation due to the shadow of sunlight. D1, D2,..., DN are connected for bypass. In FIG. 9, diodes D1, D2,..., DN are housed in a terminal box TB having terminals T1, T2,..., TN + 1 for connecting cells BS1, BS2,. is doing. These diodes D1, D2,..., DN are connected to terminals T1 to T2, T2 to T3,..., TN to TN + 1, respectively, in the terminal box TB.

  In order to improve heat dissipation, the bypass diode used here is a mesa-structured glass passivation type bare chip type, as shown in FIG. Has an anode electrode, this anode electrode is connected to the outside by a flat electrode plate 31 via a high-temperature solder 35, and also has a cathode electrode in the N layer, and this cathode electrode is also via a high-temperature solder 36 A flat electrode plate 32 connected to the outside is used (see, for example, Patent Document 1).

Further, the inventor of the present application attaches a chip diode having electrodes on the lower surface and the upper surface of the bare chip portion made of the P layer and the N layer inside the cylindrical bottomed electrode body, and this electrode It comprises a diode element formed by filling a cylindrical body of a body to form a package part, and a terminal plate provided with a circular hole for mounting a cylindrical electrode body of this diode element, and the circular hole of the terminal plate In addition, a diode element device for a solar cell in which the outer periphery of a cylindrical electrode body of a diode element is inserted is proposed (see Patent Document 2).
JP 2002-158324 A Utility Model Registration No. 3114603

  In the solar cell diode described in Patent Document 1 described above, some heat dissipation can be ensured, but both the electrodes of the diode element must be soldered to produce a solar cell diode element device, which is troublesome in production. The problem remains. Moreover, in the diode element device for solar cells described in Patent Document 2, the cylindrical first conductive electrode body of the diode element is inserted into a circular hole provided in the terminal plate. Although the mounting has become very easy, the second conductive electrode body above the diode element is a rod-shaped conductive electrode body, so there are still some difficulties in terms of heat dissipation, and sufficient heat dissipation is achieved. If it tried to obtain, there was a problem that there was a limit in miniaturizing the diode element including the chip diode and the second electrode body.

  The present invention has been made by paying attention to the above-mentioned problems, and has as its object to provide a diode element device for a terminal box for a solar cell, which is excellent in assembly workability and heat dissipation and can be miniaturized. .

    In the diode element device of the terminal box for a solar cell according to the present invention, the chip diode is mounted inside the cylindrical bottomed first conductive electrode body, and the second conductive is directed from the upper part of the chip diode to the outside. A diode element provided with a body electrode and a terminal part for connecting a solar cell to one end of each, and a circular hole for mounting a diode element is provided on at least one adjacent side, and they are arranged electrically separated from each other A plurality of terminal plates, wherein the first conductor electrode of the diode element is inserted into the circular hole, and the second conductor electrode of the diode element is connected to the adjacent terminal plate. In the diode element device of the terminal box for a solar cell, the columnar portion having the lower surface of the second conductor electrode not less than the area of the upper surface electrode of the chip diode and having the lower surface as the bottom surface It formed so as to protrude from the cylindrical portion upper surface of the first conductive electrode body upward, a wide conductive plate than the columnar section, characterized by being configured to be connected to the adjacent terminal board.

  In the diode element device of the terminal box for a solar cell according to the present invention, it is preferable that the second conductor electrode is formed by integrally forming the columnar portion and the wide conductor plate.

  In the diode element device for a solar cell terminal box according to the present invention, the second conductor electrode may be configured such that the wide conductor plate extends above the center of the upper surface of the columnar portion.

  Moreover, in the diode element device for a terminal box for a solar cell according to the present invention, the second conductor electrode includes the columnar body and the wide conductor plate individually, and the wide conductor plate is the columnar portion. It may be soldered or welded.

  According to this device, the second conductive electrode has a lower end surface having an area equal to or larger than the upper surface electrode area of the chip diode, and a columnar portion having the lower end surface as a bottom surface of the first conductive electrode body. Since it is formed so as to protrude upward from the upper surface of the cylindrical portion and is connected to the adjacent terminal plate by a conductor plate having a width equal to or greater than the diameter of the columnar body, the heat generated in the diode element is Heat is dissipated through the large columnar portion of the second conductive electrode body and the wide conductor plate. As a result, sufficient heat dissipation is obtained, and the entire diode element and the entire solar cell terminal box can be reduced in size.

    Hereinafter, the present invention will be described in more detail with reference to embodiments. FIG. 1 shows a diode element used in an embodiment of the present invention. FIG. 1 (a) is a plan view thereof, and FIG. 1 (b) is a cross-sectional view taken along line AA of FIG. FIG. This diode element 1 includes a cylindrical first bottom conductive electrode body 2, a chip diode 3 provided in a cylinder interior 2a of the conductive electrode body 2, and a space in the cylinder interior 2a. And the second conductive electrode body 5 provided on the upper surface of the chip diode 3.

  The first conductive electrode body 2 is made of CU (copper), and innumerable irregularities are alternately formed in the vertical direction on the outer periphery 2b, that is, protrusions and grooves are alternately formed.

  The chip diode 3 includes an electrode (anode) 7 provided on the lower surface of the chip portion 6 composed of a P layer and an N layer, and an electrode (cathode) 8 provided on the upper surface.

  The second conductive electrode body 5 is the most characteristic feature of the present invention. The columnar portion 9 provided on the upper portion of the chip diode 3 and the wide conductor integrally formed on the side from above the columnar portion 9. It consists of the board 10 and is formed with CU (copper). The columnar portion 9 is a cylinder, and the lower surface 9a in contact with the upper surface of the chip diode 3 is set wider than the rectangular surface 3a on the upper surface of the chip diode 3, and the lower surface 9a of the columnar portion 9 is The upper surface 8a is connected to the upper surface electrode 8 by a high temperature solder layer 12 so as to cover the upper surface 3a. As shown in FIG. 2, the columnar portion 9 protrudes upward from the upper portion 2 c of the first conductive electrode body 2. Here, the columnar portion 9 has a cylindrical shape, but may have a rectangular shape, that is, a prismatic shape, similarly to the shape of the chip diode 3. The wide conductor plate 10 extends in the lateral direction from above the columnar portion 9, and the width thereof is set to be equal to or larger than the diameter of the columnar portion 9. The other end (tip 16) of the wide conductor plate 10 is welded or soldered to another terminal plate different from the terminal plate 13 into which the first conductive electrode body 2 is inserted into the circular hole 14, as will be described later. Attached.

  In the chip diode 3, the lower surface electrode 7 is connected to the bottom surface 2 d of the cylinder interior 2 a of the first conductive electrode body 2 with a high temperature solder 11. Further, the upper surface electrode 8 is connected to the lower surface 9 a of the columnar portion 9 of the second conductive electrode body 5 through a high temperature solder 12. A package portion 4 is formed by filling the inside of the cylinder 2 a of the first conductive electrode body 2 and the space of the chip diode 3 with epoxy resin. The chip diode 3 is completely sealed from the outside by the package portion 4.

  As shown in FIG. 3, the diode element device of the embodiment solar cell terminal box using the diode element is provided with a circular hole 14 in the terminal plate 13 of the flat CU (copper) terminal box. The outer peripheral portion 2b of the conductive electrode body 2 of the diode element 1 described above is inserted into the circular hole 14 by pressure bonding. The circular hole 14 of the terminal board 13 is set to be slightly smaller than the outer circumferential circle of the electrode body 2 of the diode element 1 and the outer circumferential portion 2b of the electrode body 2 is formed to be uneven. The diode element is strongly bonded to the terminal board 13, does not leave by external force, and has good heat dissipation. Furthermore, the second conductive electrode body 5 is composed of a columnar portion 9 provided on the upper portion of the chip diode 3 and a wide conductor plate 10 integrally formed on the side of the columnar portion 9 from the upper side. Therefore, the heat dissipation from the chip diode 3 can be further improved.

  Next, the diode element device of the terminal box for a solar cell shown in FIG. 4 which is a more specific embodiment of the present invention will be described. In this embodiment, four terminal plates 13A, 13B, 13C, and 13D are arranged in the horizontal direction in the terminal box TB. Each of the terminal boards 13A, 13B, 13C, and 13D is formed of CU (copper), and the thickness is the same although the length and width are different from each other. Each terminal plate 13A,..., 13D has terminals T1,..., T4 for connecting the solar cells BS1, BS2, BS3 from the outside.

  The terminal plates 13A, 13B, and 13C are formed with circular holes 14A, 14B, and 14C having the same diameter, although the positions thereof are different. The circular holes 14A, 14B, and 14C are respectively provided with bypass diode elements. 1A, 1B and 1C are attached. The diode elements 1A and 1B used here have different polarities, and the diodes 1B and 1C have the same polarity.

  The terminal plate 13D disposed between the terminal plates 13A and 13B is not provided with a circular hole into which the diode element is inserted, and is provided with welded portions 15A and 15B. Further, a welding portion 15C is also provided on the terminal board 13B. The welded portions 15A, 15B, and 15C are higher than the other surfaces of the terminal plates and protrude in a trapezoidal shape, facilitating welding. The connection to the welds 15A, 15B, 15C may be a solder connection.

  The diode element 1A has a polarity opposite to that described with reference to FIG. 1, and the diode chip having the wide conductor plate 10A composed of the P layer and the N layer as described above is inserted into the cylindrical bottomed electrode body 2A. The electrode (cathode) on the lower surface of the N layer is mounted on the inner surface of the electrode body 2A, and the electrode (anode) on the upper surface of the P layer is connected to the columnar portion 9A. As shown in FIG. 5, the wide body plate 10A formed integrally with the columnar portion 9A is bent at the front end portion 16A and positioned at the welded portion 15A of the terminal plate 13D. Here, the front end portion 16A The welded portion 15A is welded by spot welding.

  In addition, the diode element 1B has a diode chip composed of a P layer and an N layer inserted into the cylindrical bottomed electrode body 2B in the opposite direction to that of the diode element 1A (same polarity as that shown in FIG. 1). The electrode (anode) on the lower surface of the P layer is bonded to the inner surface of the electrode body 2B, and the electrode (cathode) on the upper surface of the N layer is connected to the columnar portion 9B. As shown in FIG. 6, the wide conductor plate 10B formed integrally with the columnar portion 9B is bent, and the tip portion 16B is located at the welded portion 15B of the terminal plate 13D. The welded portion 15B is welded by spot welding.

  Further, in the diode element 1C, similarly to the diode element 1B, a diode chip having an N layer as an upper part and a P layer as a lower part is inserted into an electrode body 2C having a cylindrical bottom, and an electrode (anode) on the lower surface of the P layer ) Is bonded to the inner surface of the electrode body 2C, and the electrode (cathode) on the upper surface of the N layer is connected to the columnar portion 9C. As shown in FIG. 5, the wide conductor plate 10C formed integrally with the columnar portion 9C is also bent and its tip portion 16C is positioned at the weld portion 15C of the terminal plate 13D, where it is welded to the tip portion 16C. Part 15C is welded by spot welding.

  In addition, as for the diode element 1 used for embodiment of this invention, as shown in FIG. 1, although the 2nd conductor electrode formed in the upper surface of the chip diode 3 is desirable to form integrally, it replaces with this. As shown in FIG. 7, the columnar portion 9 and the wide conductor plate 10 may be prepared as separate bodies and connected (or welded) with a solder layer 17.

  Furthermore, as shown in FIG. 8, the second conductor electrode 5 is integrally formed, but the wide conductor plate 10 is formed so as to extend upward from the center portion of the columnar portion 9. When the front end portion 16 is connected to the terminal plate, the wide conductor plate 10 may be bent halfway.

The diode element for solar cells used by one Embodiment of this invention is shown, (a) is the top view, (b) is another sectional drawing cut | disconnected by AA of (a). It is a side view of the diode element for solar cells shown to (a) of FIG. It is sectional drawing which shows the diode element apparatus of the embodiment type solar cell terminal box using the diode element for solar cells. It is a top view which shows arrangement | positioning of the terminal board and diode element of the diode element apparatus of the other specific embodiment solar cell terminal box of this invention. It is sectional drawing cut | disconnected by BB of the diode element apparatus of the terminal box for solar cells shown in FIG. It is sectional drawing cut | disconnected by CC of the diode element apparatus of the terminal box for solar cells shown in FIG. It is sectional drawing which shows the other example of the diode element for solar cells used by embodiment of this invention. It is sectional drawing which shows the further another example of the diode element for solar cells used by embodiment of this invention. It is a circuit diagram which shows the connection of the battery cell and bypass diode of a common solar cell. It is sectional drawing which shows an example of a common solar cell diode element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Diode element 2 1st conductive electrode body 3 Chip diode 4 Package part 5 2nd conductive electrode body 6 Chip part 7 Lower surface electrode 8 Upper surface electrode 9 Columnar part 10 Wide conductive board 11 Lower surface high temperature solder 12 Upper surface high temperature solder 13 Terminal board 14 Circular hole 15 welded part

Claims (4)

A diode element in which a chip diode is mounted inside a cylindrical bottomed first conductive electrode body, and a second conductive electrode is provided from the top of the chip diode to the outside, and a solar element at one end A plurality of terminal plates each having a terminal portion for connecting a battery, provided with a circular hole for mounting a diode element in at least one of adjacent ones, and electrically spaced apart from each other; and the diode In the diode element device of the solar cell terminal box, the first conductor electrode of the element is inserted into the circular hole, and the second conductor electrode of the diode element is connected to the adjacent terminal plate.
The second conductor electrode has a lower end surface having an area equal to or larger than the electrode area of the chip diode, and a columnar portion having the lower end surface as a bottom surface projects upward from the upper surface of the cylindrical portion of the first conductive electrode body. A diode element device for a terminal box for a solar cell, which is configured to be connected to the adjacent terminal plate with a conductor plate wider than the columnar portion.   2. The diode element device for a terminal box for a solar cell according to claim 1, wherein the second conductor electrode is formed by integrally forming the columnar portion and the wide conductor plate. 3.   3. The diode element device for a solar cell terminal box according to claim 2, wherein the second conductor electrode is formed by extending the wide conductor plate above the center of the upper surface of the columnar portion. 2. The second conductor electrode, wherein the columnar portion and the wide conductor plate are individually configured, and the wide conductor plate is soldered or welded to the columnar portion. The diode element device of the terminal box for solar cells according to 1.

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