JP3117012B2 - Card edge type connector provided with pad inside and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card edge type connector for connecting a printed board and a receptacle connector, and more particularly, to a printed board having a large number of pads.

[0002]

2. Description of the Related Art A conventional card edge type connector will be described with reference to FIG.

[0003] The card edge type connector is composed of a printed circuit board 1 and a receptacle connector 11, and the connected state is shown in FIG. 4. The printed circuit board 1 is a central layer 2 made of prepreg, a first intermediate layer 3 laminated on both outer sides of the central layer 2, and laminated on both outer sides of the first intermediate layer 3. It is composed of a second intermediate layer 4 made of prepreg, and outer copper foils (the outer copper foil pads 5 'are pattern-formed thereon) laminated on both outer sides of the second intermediate layer 4, respectively. The first intermediate layer 3 is a core material 3 made of glass epoxy resin.
Copper foils 3B and 3C are respectively laminated on both sides of A.

On the other hand, the receptacle connector 11 has a base 11A made of synthetic resin, a flat plate 11B extending perpendicularly from the outer edge of one surface of the base 11A, and fixed near the outer edge of the base 11A. And a pair of outer connector leads 11D curved inwardly in a convex shape.

In the connection state shown in FIG. 4, outer copper foil pads 5 'formed on both outer copper foils of printed circuit board 1
It comes into contact with a pair of outer connector leads 11D of the receptacle connector 11.

[0006]

In the conventional card edge type connector, both outer metal foil pads of the printed circuit board only contact a pair of outer connector leads of the receptacle connector. However, recently, due to an increase in the number of metal foil pads on a printed circuit board, the interval between a large number of contacts has been narrowed. For this reason, an accident has occurred in which the contacts are erroneously short-circuited due to incomplete insertion of the printed circuit board. Also, due to the increase in the number of contacts, the area of the printed circuit board increases, and the connector must be enlarged.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve the drawbacks of the conventional card edge type connector and to provide a small card edge type connector by increasing the number of pads and reducing the area of the printed circuit board. is there.

[0008]

The present invention employs the following means to solve the above-mentioned problems.

1. A printed circuit board and a receptacle connector, wherein one groove is formed inside the printed circuit board, an inner pad is exposed on an inner layer surface facing the groove, and an outer pad is exposed on both outer surfaces of the printed circuit board. A pair of inner connector leads and a pair of outer connector leads are provided on the receptacle connector, and the inner pad and the inner connector lead are in contact with each other, and the outer pad and the outer connector lead are in contact with and separated from each other. A card edge type connector in which a plurality of the grooves are formed, and a plurality of sets of the pair of inner connector leads are provided on the inside.

[0010] 2. A center layer made of prepreg, a first intermediate layer laminated on both outer sides of the center layer and having inner pads, a second intermediate layer made of prepreg laminated outside each of the first intermediate layers, Laminated on the outside of the second intermediate layer,
A method of manufacturing a card edge type connector comprising an outer layer having an outer pad, wherein a groove is formed between inner surfaces of the first intermediate layers to expose the inner pads,
The receptacle connector corresponding to the printed circuit board is provided with a pair of inner connector leads and a pair of outer connector leads so that the inner pads and the outer pads can be in contact with and separated from each other. A method for manufacturing a card edge type connector in which pads are also provided inside formed by insertion and extraction.

3. A center layer made of prepreg, a first intermediate layer laminated on both outer sides of the center layer and having inner pads, a second intermediate layer made of prepreg laminated outside each of the first intermediate layers, Laminated on the outside of the second intermediate layer,
A method of manufacturing a card edge type connector comprising an outer layer having an outer pad, wherein a groove is formed between inner surfaces of the first intermediate layers to expose the inner pads,
The receptacle connector corresponding to the printed circuit board is provided with a pair of inner connector leads and a pair of outer connector leads so that the inner pads and the outer pads can be in contact with and separated from each other, and the groove is drilled. A method for manufacturing a card edge type connector in which pads are also provided inside the formed connector.

4. A center layer made of prepreg, a first intermediate layer laminated on both outer sides of the center layer and having inner pads, a second intermediate layer made of prepreg laminated outside each of the first intermediate layers, Laminated on the outside of the second intermediate layer,
A method of manufacturing a card edge type connector comprising an outer layer having an outer pad, wherein a groove is formed between inner surfaces of the first intermediate layers to expose the inner pads,
A pair of inner connector leads and a pair of outer connector leads are provided on the receptacle connector corresponding to the printed circuit board so that the inner and outer pads can be in contact with and separated from each other, and the groove is formed by laser processing. A method for manufacturing a card edge type connector in which pads are also provided inside the formed connector.

5. A plurality of wiring layers, a plurality of insulating layers, first and second grooves provided on side surfaces, a first surface parallel to the plurality of wiring layers and facing each other to form the first groove; A second surface, one of the plurality of wiring layers, a first wiring layer provided on the first surface and exposed in the first groove, and one of the plurality of wiring layers; A second wiring layer provided on the second surface and exposed in the first groove, a third surface and a fourth surface parallel to the plurality of wiring layers and facing each other to form the second groove; A third wiring layer provided on the third surface, which is one of the plurality of wiring layers and is exposed in the second groove, and a third wiring layer, which is one of the plurality of wiring layers, And a fourth wiring layer provided on the fourth surface and exposed in the second groove.

[0014]

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A card edge type connector in which pads are also provided inside two embodiments of the present invention will be described.

First, a first embodiment of the present invention will be described with reference to FIGS.

The card edge type connector comprises a printed circuit board 1 and a receptacle connector 11. In FIG. 2A showing the first stage of the manufacturing process, the printed circuit board 1 includes a prepreg center layer 2 serving as a center thereof, first intermediate layers 3 laminated on both outer sides of the center layer 2, respectively.
It comprises a second intermediate layer 4 made of prepreg laminated on both outer sides of the first intermediate layer 3 and an outer copper foil 5 laminated on both outer sides of the second intermediate layer 4 respectively. First intermediate layer 3
Is formed by laminating inner layer copper foils 3B and 3C on both sides of a core material 3A made of glass epoxy resin. The length of the central layer 2 is set shorter than the lengths of the other layers.

In FIG. 2B showing the second stage of the manufacturing process, one end of both inner copper foils 3B and 3C are removed.
An inner layer pattern is formed on both inner layer copper foils 3B.
The spacer 21 is inserted into the space 6 formed by the intermediate layer 3 and one end surface of the center layer 2.

In FIG. 2C showing the third stage of the manufacturing process, the central layer 2, both first intermediate layers 3,
The two second intermediate layers 4 and the outer copper foils 5 are laminated in close contact.

In FIG. 2D showing the fourth stage of the manufacturing process, when an outer layer pattern is formed on both outer layer copper foils 5 and the spacer 21 is removed from the space 6, a groove 7 is formed there.

In FIG. 2E showing the fifth stage of the manufacturing process, both outer copper foils 5, both second intermediate layers 4, and both core materials 3 are shown.
A is chamfered in a tapered shape. Thus, the printed circuit board 1 is manufactured.

On the other hand, the receptacle connector 11 has a base 11A made of a synthetic resin, a flat plate 11B extending perpendicularly from the outer edge of one surface of the base 11A, and fixed near the center of the base 11A. It comprises a pair of inner connector leads 11C that are curved outwardly and a pair of outer connector leads 11D that are fixed near the outer edge of the base 11A and whose distal ends are curved inwardly.

Printed circuit board 1 and receptacle connector 1
1 is shown in FIG. In this state, the inner copper foil pads 3B 'formed on the inner copper foils 3B of both first intermediate layers 3 of the printed circuit board 1 are connected to the receptacle connector 11
Contact with a pair of inner connector leads 11C. Also,
Outer copper foil pads 5 ′ formed on both outer copper foils 5 of printed circuit board 1 are in contact with a pair of outer connector leads 11 </ b> D of receptacle connector 11.

Next, a second embodiment of the present invention will be described with reference to FIG.

The printed circuit board 1 of the first embodiment has
The printed circuit board 1 of the second embodiment differs from the printed circuit board 1 of the first embodiment in that it has three first intermediate layers 3 while having three first intermediate layers 3. In this respect, the printed circuit boards 1 of both embodiments are the same.

On the other hand, the receptacle connector 11 of the first embodiment has one set of a pair of inner connector leads 11C, whereas the receptacle connector 11 of the second embodiment has the three first intermediate connectors described above. Corresponding to layer 3,
The first point is that two pairs of inner connector leads 11C are provided.
The receptacle connector 11 of the embodiment is different from the receptacle connector 11 of the embodiment, and the rest is the same as the receptacle connector 11 of both embodiments.

In the first embodiment, the spacer 21 is used to form the groove 7. However, means such as drilling or laser processing can be used.

[0028]

As is apparent from the above description, according to the present invention, by increasing the number of pads on a printed circuit board and reducing the area, a small card edge type connector that does not cause an erroneous short circuit accident can be provided. Can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a card edge type connector provided with pads inside a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a manufacturing process of a card edge type connector in which pads are also provided inside the first embodiment of the present invention, and the manufacturing processes are sequentially shown in (a) to (e).

FIG. 3 is a cross-sectional view of a card edge type connector in which pads are also provided inside a second embodiment of the present invention.

FIG. 4 is a sectional view of a conventional card edge type connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Center layer (prepreg) 3 1st intermediate layer 3A Core material (glass epoxy resin) 3B Inner layer copper foil 3B 'Inner copper foil pad 3C Inner layer copper foil 4 2nd intermediate layer (prepreg) 5 Outer layer copper foil 5' Outer copper foil pad 6 Space 7 Groove 11 Receptacle connector 11A Base 11B Flat plate 11C Inner connector lead 11D Outer connector lead 21 Spacer

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01R 12/18 H01R 43/00 H05K 1/02 H05K 1/11

Claims (5)

(57) [Claims] 1. A printed circuit board comprising a printed circuit board and a receptacle connector, wherein one groove is formed inside the printed circuit board, inner pads are exposed on inner surfaces of the groove opposite to each other, and both outer surfaces of the printed circuit board are exposed. An outer pad is exposed, the receptacle connector is provided with a pair of inner connector leads and a pair of outer connector leads, the inner pad and the inner connector lead, and the outer pad and the outer connector lead, A card edge type connector in which pads are provided inside, wherein a plurality of the grooves are formed, and a plurality of sets of the pair of inner connector leads are provided. 2. A central layer made of prepreg, a first intermediate layer laminated on both outer sides of the central layer and having inner pads,
A method of manufacturing a card edge type connector comprising: a second intermediate layer made of prepreg laminated outside each of the first intermediate layers; and an outer layer laminated outside each of the second intermediate layers and having an outer pad. Forming a groove between the inner surfaces of the first intermediate layers to expose the inner pads, and contacting and separating the inner pads and the outer pads with a receptacle connector corresponding to the printed circuit board. A pair of inner connector leads and a pair of outer connector leads so that the groove can be formed by inserting and extracting a spacer. Production method. 3. A central layer made of prepreg, a first intermediate layer laminated on both outer sides of the central layer and having inner pads,
A method of manufacturing a card edge type connector comprising: a second intermediate layer made of prepreg laminated outside each of the first intermediate layers; and an outer layer laminated outside each of the second intermediate layers and having an outer pad. Forming a groove between the inner surfaces of the first intermediate layers to expose the inner pads, and contacting and separating the inner pads and the outer pads with a receptacle connector corresponding to the printed circuit board. Providing a pair of inner connector leads and a pair of outer connector leads so as to be able to perform the process, and forming the groove by drilling. 4. A central layer made of prepreg, a first intermediate layer laminated on both outer sides of the central layer and having inner pads,
A method of manufacturing a card edge type connector comprising: a second intermediate layer made of prepreg laminated outside each of the first intermediate layers; and an outer layer laminated outside each of the second intermediate layers and having an outer pad. Forming a groove between the inner surfaces of the first intermediate layers to expose the inner pads, and contacting and separating the inner pads and the outer pads with a receptacle connector corresponding to the printed circuit board. Providing a pair of inner connector leads and a pair of outer connector leads so as to form the groove, and forming the groove by laser processing. 5. A plurality of wiring layers, a plurality of insulating layers, first and second grooves provided on side surfaces, and the first grooves are formed in parallel with and facing the plurality of wiring layers. A first surface and a second surface, the first surface being one of the plurality of wiring layers;
A first wiring layer provided on the second surface and exposed in the first groove; and a second wiring layer provided on the second surface and being one of the plurality of wiring layers and exposed in the first groove. A third wiring layer, a third surface and a fourth surface parallel to the plurality of wiring layers and facing each other and forming the second groove, and the third surface being one of the plurality of wiring layers. A third wiring layer provided in the second groove and exposed in the second groove; and a fourth wiring provided on the fourth surface and being one of the plurality of wiring layers and exposed in the second groove. And a printed circuit board.