JP3077348B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting electronic components on a substrate.
Electronic component mounting apparatus and electronic component mounting method
Things.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus for mounting electronic components (hereinafter, also referred to as chips) such as ICs and LSIs on a substrate, a chip of a parts feeder is transferred while moving a transfer head in an XY direction by an XY table. After being picked up by being picked up by a nozzle of a head and recognized by a recognition unit such as a camera to recognize the positional deviation of the lead of the chip, the positional deviation is corrected and transferred to and mounted on a substrate. .

FIG. 5 is a perspective view of a conventional electronic component mounting apparatus. Reference numeral 101 denotes a tray feeder, and 102, a transfer head provided on an XY table 103. The nozzle 104 is moved up and down on the tray feeder 101 to pick up the chip P, and is moved onto the recognition unit 105 to move the lead L of the chip P. After detecting the position shift in the XYθ directions, the position shift is corrected and transferred to the substrate S positioned by the positioning unit 106.

Next, the recognition unit 105 will be described. Reference numeral 107 denotes a case, and a camera 108 for observing the chip P sucked by the nozzle 104 is provided. Reference numeral 109 denotes a transparent stage provided on the case, around which a ring-shaped light source 110 is provided. 111 is a light source 110
It is a milky white disk-shaped light diffusion plate that scatters the illumination light irradiated from the nozzle, and is attached to the nozzle 104. When the transfer head 102 reaches above the stage 109, the light source 1
The illumination light emitted from 10 is scattered above the chip P by the light diffusing plate 111, whereby the silhouette of the chip P is clearly observed by the camera 108, and
Of the lead L is detected.

[0005]

However, according to the conventional means, when the chip P is larger than the light diffusing plate 111, the leads L of the chip P protrude from the light diffusing plate 111, so that the leads L are clearly observed. There was a problem that it was not possible. As such a large chip, for example, QF
There are P and connectors. As a means for solving such a problem, it is conceivable to increase the size of the light diffusion plate 111. However, due to the layout design of the transfer head 102, there is a limit in increasing the size of the light diffusion plate 111. .

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an electronic component mounting apparatus and an electronic component mounting method provided with a recognizing means capable of recognizing a large electronic component using a camera.

[0007]

An electronic component mounting apparatus according to the present invention is provided.
The positioning part of the board, the supply part of the electronic components,
Suck the nozzle of the transfer head below the head movement path.
Recognition means for observing the mounted electronic component, and the transfer head
With an XY table for moving the scanner in the XY directions
In the component mounting apparatus, the recognizing means may be provided on the nozzle.
A camera that observes the leads of the sucked electronic components from below
And a light diffusing plate, and the light diffusing plate is adsorbed to the nozzle.
Means for inserting and removing electronic components above and below the leads
And a light source that irradiates light to the light diffusion plate.
You. Also, the electronic component mounting method of the present invention provides a method for supplying electronic components.
The electronic components provided in the unit are sucked into the nozzles of the transfer head.
Picking up and moving the XY table
Moving the mounting head above the recognition means;
Drive means to move the light diffusing plate to the
The light from the light source.
Recognize the position of the lead by irradiating the scattering plate with a camera
By driving the XY table, the electronic parts can be positioned
Move it over the positioned substrate, and
Work to mount electronic components on a board after correcting for misalignment
And including .

[0008]

In each of the above constructions, the light diffusing plate is transferred to
Of electronic components adsorbed to the nozzle of the pad
The light from the light source toward the light diffusion plate.
To recognize the position of the lead. In this case, the XY table
To move electronic components in the X and Y directions
Thereby, leads on a plurality of sides can be recognized. Further, in this case, when the light diffusion plate obstructs the movement of the electronic component, the access means is driven to retract the light diffusion plate. When the positional deviation of the lead is detected in this way, the chip is mounted on the substrate after correcting the positional deviation. In this way, the present means can detect the displacement of the lead on each side while moving the electronic component in the X direction or the Y direction with respect to the light diffusion plate, and thus extend from each side of the large electronic component. The displacement of the lead can be detected.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of the electronic component mounting apparatus. 1
Denotes an X table, and 2 denotes a Y table, on which a transfer head 3 is mounted. Reference numeral 4 denotes a nozzle mounted on the transfer head 3. S denotes a substrate, which is clamped and positioned by a positioning portion 6 provided on the transport path 5. 7
Is a supply unit of chips P, and is a tray feeder 8 in which large-sized chips P with leads such as QFP and SOP are stored.
Has been deployed. The nozzle 4 is moved up and down on the tray feeder 8 to pick up the chip P, and the XY table 1
2 is driven and transferred onto the substrate S.

In FIGS. 1 and 2, reference numeral 9 denotes a transfer head.
3, a recognition means provided below the moving path of 3 , the case 10; a ring-shaped light source 11 provided to surround the transparent stage 16 on the upper surface of the case 10 and irradiating light upward; It is provided on the side of this case 10,
CC for observing the chip P adsorbed by the nozzle 4 from below
A D camera 13 is provided. A long plate-shaped light diffusion plate 14 that scatters the illumination light emitted from the light source 11 is provided on the upper surface of the side portion of the case 10. This light diffusion plate 14
For example, a milky white acrylic plate or the like is used.

Reference numeral 17 denotes a mounting bracket for the light diffusing plate 14. A slider 19 which slides on a guide rail 18 extending in the Y direction is provided below the mounting bracket. A cylinder 20 is provided on the side of the guide rail 18, and the rod 2
One end is connected to the mounting bracket 17. When the rod 21 of the cylinder 20 protrudes and retracts, the guide rail 1
The slider 19 slides along 8, and the light diffusion plate 14 is moved in and out of the transparent stage 16. That is, the above components 17 to 21 constitute an access unit that allows the light diffusion plate 14 to enter and exit the transparent stage 16.

This apparatus has the above-described configuration, and the operation will be described next. In FIG. 1, the chip P picked up by the nozzle 4 is transferred onto the transparent stage 16 by driving the XY tables 1 and 2, and stops at the position a directly above the transparent stage 16 (see FIG. 3). In FIG. 3, the light diffusing plate 14 projects from the chain line position to the solid line position by driving the cylinder 20, and covers one side of the chip P. Here, the lead L1 at the side end of one side is connected to the camera 1
3 to detect a positional shift in the XYθ directions (see also FIG. 4).

Next, with the light diffusing plate 14 protruding,
The chip P is transferred in the Y1 direction and stopped at the position b, and the lead L2 at the other end of this side is observed. Then chip P
Is transported in the X1 direction and stopped at the position c, the upper side of the other side of the chip P is covered with the light diffusion plate 14, and the lead L3 at the side end of the other side is observed. If the light diffusing plate 14 hinders the movement of the nozzle 4 when the chip P is moved in the X1 direction, the cylinder 20 is driven to temporarily retract the light diffusing plate 14 to the position indicated by the dashed line. Next, the chip P is transferred in the Y2 direction and stopped at the d position, and the lead L at the other end of this side is moved.
Observe 4. The leads L1 to L4 are connected as described above.
When observing with the camera 13, the light emitted from the light source 11
Is scattered by the light diffusion plate 14. As described above, when the chip P is moved in the X and Y directions above the transparent stage 16, the light diffusion plate 1 is placed above the leads L extending from the four sides of the chip P.
4, the leads L1 to L4 can be clearly observed, and the positional deviation can be accurately detected. In particular, in this embodiment, all the leads L1 to L4 are observed in a small area A (see FIG. 3) near the optical center of the camera 13 while moving the chip P in the XY directions as described above. In addition, optical errors due to lens distortion and the like can be minimized.

When the detection of the displacement of the lead L is completed as described above, the chip P is transferred and mounted on the substrate S by driving the XY tables 1 and 2 after correcting the displacement. The substrate S on which the mounting of the chip P is completed is sent to a post-processing step by the conveyor 5. The displacement in the XY directions is corrected by correcting the movement stroke of the XY tables 1 and 2, and the displacement in the θ direction is corrected by rotating the nozzle 4.

The present invention is not limited to the above embodiment. For example, by providing a disk-shaped light diffusing plate of a conventional means in a nozzle, a small chip can be observed by a light diffusing plate of a conventional means, and a large chip can be observed. Shaped chip is the light diffusing plate 14 of this means.
May be observed.

In the above embodiment, the leads L1 to L4 at the side end portions of each side are observed. However, it is optional to observe which lead L to detect the positional deviation. It is also possible to observe a large number of leads L and detect each position shift, and obtain the average value.

[0017]

As described above, according to the present invention, a light diffusion plate is positioned above a lead extending from each side of an electronic component, the lead is clearly observed, and the displacement is precisely detected. Therefore, there is no need to provide a large light diffusion plate on the transfer head side, which is particularly advantageous as a means for observing large electronic components.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a perspective view of an electronic component mounting apparatus according to the present invention.

FIG. 3 is a plan view during observation of leads of the electronic component by the camera.

FIG. 4 is a side view of the camera during observation of leads of an electronic component.

FIG. 5 is a perspective view during observation of leads of an electronic component by a camera according to conventional means.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 X table 2 Y table 3 Transfer head 4 Nozzle 6 Positioning part 7 Supply part of an electronic component 9 Recognition means 11 Light source 13 Camera 14 Light diffusing plate 20 In / out means P Electronic component S board

Claims (2)

(57) [Claims] 1. A positioning unit for a substrate, a supply unit for electronic components, a recognizing means for observing an electronic component which is located below a moving path of the transfer head and is sucked by a nozzle of the transfer head, and In an electronic component mounting apparatus provided with an XY table for moving a head in the XY directions, the recognition means observes a lead of the electronic component adsorbed by the nozzle from below, a light diffusion plate, and a light diffusion plate. An electronic component mounting apparatus, comprising: an insertion / removal unit for inserting and extracting a plate above and below a lead of an electronic component adsorbed by the nozzle; and a light source for irradiating light to the light diffusion plate . 2. An electronic component provided in an electronic component supply unit.
A process of picking up by picking up the nozzle of the transfer head
Drive the XY table to recognize the transfer head
To move to the side and drive the access means to diffuse the light
The plate is placed above the leads of the electronic components adsorbed by the nozzle.
Move the camera and irradiate the light diffuser plate with the light from the light source.
The step of recognizing the position of the lead and the driving of the XY table
To move the electronic components on the substrate positioned on the positioning part.
And correct the electronic component's misalignment
Mounting the electronic component on the substrate by using
Electronic component mounting method.