JP2971349B2 - Wire bonding method for sheet-like circuit material - Google Patents
Wire bonding method for sheet-like circuit materialInfo
- Publication number
- JP2971349B2 JP2971349B2 JP28406694A JP28406694A JP2971349B2 JP 2971349 B2 JP2971349 B2 JP 2971349B2 JP 28406694 A JP28406694 A JP 28406694A JP 28406694 A JP28406694 A JP 28406694A JP 2971349 B2 JP2971349 B2 JP 2971349B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- bonding
- wire
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/85951—Forming additional members, e.g. for reinforcing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【産業上の利用分野】本発明はシ−ト状回路材のワイヤ
−ボンディング方法に関し、特に、基板の厚みが２５μ
ｍ以下の薄型フレキシブルプリント回路板のワイヤ−ボ
ンディングに有用なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method for a sheet-like circuit material, and more particularly, to a method for bonding a substrate having a thickness of 25 .mu.m.
It is useful for wire bonding of a thin flexible printed circuit board having a thickness of less than m.
【０００２】[0002]
【従来の技術】フレキシブルプリント回路板におけるワ
イヤ−ボンディングを行う場合、前工程でチップをボン
ドしたフレキシブルプリント回路板を台座上に、高剛性
の押え治具で固定し、チップと導体との間をワイヤ−ボ
ンディングしている。2. Description of the Related Art When performing wire bonding on a flexible printed circuit board, the flexible printed circuit board to which the chip has been bonded in the previous process is fixed on a pedestal with a highly rigid holding jig, and the space between the chip and the conductor is formed. Wire-bonded.
【０００３】しかしながら、この方法では、治具の台座
へのセット並びに解除の作業を必要とする、フレキシブ
ルプリント回路板の回路パタ−ンやチップの種類に応じ
て多種類の押え治具を用意しておく必要がある、台座が
曲面である場合は、押え治具によるフレキシブルプリン
ト回路板の固定が不可である等の不具合がある。かかる
不具合を解消するために、フレキシブルプリント回路板
を台座に両面粘着テ−プで接着し、この接着固定により
フレキシブルプリント回路板の移動を防止してワイヤ−
ボンディングを行うことが知られている。However, in this method, various types of holding jigs are required in accordance with the circuit pattern of the flexible printed circuit board and the type of chip, which requires the work of setting and releasing the jig on the base. If the pedestal has a curved surface, there is a problem that the fixing jig cannot fix the flexible printed circuit board. In order to solve such a problem, the flexible printed circuit board is adhered to the base with a double-sided adhesive tape.
It is known to perform bonding.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、この両
面粘着テ−プを使用する方法では、ワイヤ−ボンディン
グしたフレキシブルプリント回路板を台座から取出すの
に、フレキシブルプリント回路板を強制的に引張って剥
離するか、両面粘着テ−プの粘着剤を溶剤で溶解するか
によらざるを得ず、前者の場合はフレキシブルプリント
回路板の損傷（特に、基板厚みが２５μｍ以下の薄型の
場合）、ボンドワイヤ−の断線、チップの破損等が懸念
され、後者の場合は、作業の長時間化の問題が招来され
る。However, in the method using the double-sided adhesive tape, the flexible printed circuit board is forcibly pulled and peeled to remove the wire-bonded flexible printed circuit board from the pedestal. It is unavoidable to dissolve the adhesive of the double-sided adhesive tape with a solvent. In the former case, the flexible printed circuit board is damaged (particularly, when the substrate is thinner than 25 μm), and the bond wire is not used. In the latter case, there is a problem that the operation is lengthened.
【０００５】而して、一般に、両面粘着テ−プの接着面
積を広くするほど、上記フレキシブルプリント回路板の
台座への固定安定性を向上させ得るが、これに伴い、上
記強制的剥離時のフレキシブルプリント回路板の破損の
危険性や作業の長時間化が顕著となり、他方、両面粘着
テ−プの接着面積を小さくするほど、上記強制的剥離時
のフレキシブルプリント回路板の破損の危険性や作業の
長時間化を抑制できるが、これに伴い、フレキシブルプ
リント回路板の固定状態が不安定となり、ワイヤ−ボン
ディングの失敗率が増大する。[0005] Generally, as the bonding area of the double-sided adhesive tape is increased, the stability of fixing the flexible printed circuit board to the pedestal can be improved. The risk of breakage of the flexible printed circuit board and the prolonged working time become remarkable.On the other hand, as the bonding area of the double-sided adhesive tape is reduced, the risk of breakage of the flexible printed circuit board at the time of the forced peeling is reduced Although a prolonged operation can be suppressed, the fixing state of the flexible printed circuit board becomes unstable and the failure rate of wire bonding increases.
【０００６】従来、仮固定用に使用する粘着テ−プとし
て、常時は、通常の接着力を呈し、剥離は、加熱による
接着力の減少のもとで容易に行い得る熱剥離性粘着テ−
プが公知である。Conventionally, as an adhesive tape used for temporary fixing, a normal adhesive force is always exhibited, and a peelable adhesive tape which can be easily peeled off with a decrease in adhesive force by heating.
Are known.
【０００７】本発明者等の試験結果によれば、この熱剥
離性粘着テ−プを使用して上記フレキシブルプリント回
路板の台座への固定を行い、上記ワイヤ−ボンディング
を超音波圧着法により行えば、フレキシブルプリント回
路板の安定な固定のもとで高品質のワイヤ−ボンディン
グを行い得、しかもワイヤ−ボンディング後のフレキシ
ブルプリント回路板を安全に台座から取出すことが可能
であることが判明した。According to the test results of the present inventors, the flexible printed circuit board is fixed to a pedestal using the heat-peelable adhesive tape, and the wire bonding is performed by an ultrasonic crimping method. For example, it has been found that high-quality wire-bonding can be performed under stable fixing of the flexible printed circuit board, and that the flexible printed circuit board after wire-bonding can be safely removed from the pedestal.
【０００８】本発明は、かかる試験結果を基礎として発
明されたものであり、その目的は、フレキシブルプリン
ト回路板が極薄であっても、容易に高品質で安全にワイ
ヤ−ボンディングを行い得るシ−ト状回路材のワイヤ−
ボンディング方法を提供することにある。The present invention has been made on the basis of the test results, and an object of the present invention is to provide a system capable of easily performing high-quality and safe wire bonding even when a flexible printed circuit board is extremely thin. -Wires for circuit material
It is to provide a bonding method.
【０００９】[0009]
【課題を解決するための手段】本発明に係るシ−ト状回
路材のワイヤ−ボンディング方法は、加熱によって接着
力が低下する熱剥離性粘着テ−プでシ−ト状回路材を台
座に接着し、該シ−ト状回路材のワイヤ−ボンディング
を超音波圧着法により行い、而るのち、加熱により上記
熱剥離性粘着テ−プの接着力を低下させたうえで、上記
シ−ト状回路材を台座から取出すことを特徴とする構成
であり、熱剥離性粘着テ−プには、粘着剤が加熱発泡性
であるものを使用することができる。According to the wire bonding method for a sheet-like circuit material according to the present invention, the sheet-like circuit material is mounted on a pedestal with a heat-peelable adhesive tape whose adhesive strength is reduced by heating. After bonding, wire bonding of the sheet-like circuit material is performed by an ultrasonic pressure bonding method. After that, the bonding force of the heat-peelable pressure-sensitive adhesive tape is reduced by heating, and then the sheet is bonded. The configuration is characterized in that the circuit material is removed from the pedestal, and the heat-peelable pressure-sensitive adhesive tape may be a heat-foamable pressure-sensitive adhesive.
【００１０】以下、図面を参照しつつ本発明の構成を説
明する。通常、プリント回路板へのチップの実装は、チ
ップをプリント回路板に固着（例えば、エポキシ樹脂接
着剤による固着、プリフォ−ムによる加熱接着）するチ
ップボンディング工程、このチップと回路導体との間を
ワイヤ−ボンディングするワイヤ−ボンディング工程を
経て行われ、本発明は、通常、ワイヤ−ボンディング工
程において実施される。図１の（イ）乃至図１の（ハ）
は、本発明に係るワイヤ−ボンディング方法を示す説明
図である。The configuration of the present invention will be described below with reference to the drawings. Normally, mounting a chip on a printed circuit board involves a chip bonding step of fixing the chip to the printed circuit board (for example, fixing with an epoxy resin adhesive, or heating and bonding with a preform). The wire bonding is performed through a wire bonding process, and the present invention is generally performed in the wire bonding process. 1 (a) to 1 (c) of FIG.
FIG. 3 is an explanatory view showing a wire-bonding method according to the present invention.
【００１１】図１の（イ）乃至図１の（ハ）において、
１はチップボンディング工程から送られてきたフレキシ
ブルプリント回路板であり、チップ２が固着されてい
る。３はコンベアに取付けられた硬質の台座である。４
は熱剥離性の両面粘着テ−プであり、ある温度Ｔ0（熱
剥離温度）以下においては、所定の接着力を呈し、その
温度Ｔ0以上で接着力が減少する特性を有し、上記温度
Ｔ0で発泡する発泡剤を通常の粘着剤を基材の両面に塗
布したものを使用できる。In FIGS. 1 (a) to 1 (c),
Reference numeral 1 denotes a flexible printed circuit board sent from a chip bonding step, to which a chip 2 is fixed. 3 is a rigid pedestal attached to the conveyor. 4
Heat-peelable double-sided adhesive tape is - flop, in the following a certain temperature T 0 (thermal release temperature) exhibits a predetermined adhesive strength, have the property of adhesion decreases at that temperature T 0 or more, the a foaming agent which foams at temperatures T 0 the normal adhesive can be used which was applied to both sides of the substrate.
【００１２】本発明により、フレキシブルプリント回路
板のワイヤ−ボンディングを行うには、まず、図１の
（イ）に示すように、所定の寸法に裁断した熱剥離性両
面粘着テ−プ４を台座３に接着し、次いで、図１の
（ロ）に示すように、フレキシブルプリント回路板１に
おけるチップ固着箇所とその近傍部分１０を前記熱剥離
性両面粘着テ−プ４上に接着する。In order to perform wire bonding of a flexible printed circuit board according to the present invention, first, as shown in FIG. 1A, a heat-peelable double-sided adhesive tape 4 cut to a predetermined size is mounted on a pedestal. Then, as shown in FIG. 1 (b), the chip-fixed portion of the flexible printed circuit board 1 and its neighboring portion 10 are bonded onto the heat-peelable double-sided adhesive tape 4.
【００１３】このようにして、フレキシブルプリント回
路板１を台座３に接着した後、通常の超音波圧着法によ
り、図１の（ハ）に示すように、チップと回路板の導体
との間をワイヤ−ボンディングｂする。而るのちは、コ
ンベアの走行により加熱炉に通過させ、加熱により熱剥
離性粘着テ−プの接着力を減じ、図１の（ニ）に示すよ
うに、台座３からワイヤ−ボンディングプリント回路板
１を取出し、これにてワイヤ−ボンディングを終了す
る。After bonding the flexible printed circuit board 1 to the pedestal 3 in this manner, as shown in FIG. 1C, the gap between the chip and the conductor of the circuit board is formed by a normal ultrasonic pressure bonding method. Perform wire-bonding b. Thereafter, the conveyor is passed through a heating furnace by running, and the adhesive force of the heat-peelable adhesive tape is reduced by heating, and as shown in FIG. 1 is taken out, and the wire bonding is completed.
【００１４】上記フレキシブルプリント回路板に実装す
る電子部品としては、ＨＩＣ等のチップ以外に、超小型
のハ−ドディスク用部品等も対象とされる。本発明は、
後述するように、フレキシブルプリント回路板に実質
上、引張り力を作用させることなくワイヤ−ボンディン
グでき、基板のプラスチックフィルムの厚みが２５μｍ
以下の薄型フレキシブルプリント回路板へのワイヤ−ボ
ンディングに有利に適用できる。The electronic components mounted on the flexible printed circuit board include not only chips such as HICs but also ultra-compact hard disk components. The present invention
As will be described later, the flexible printed circuit board can be wire-bonded substantially without exerting a tensile force, and the thickness of the plastic film of the substrate is 25 μm.
The present invention can be advantageously applied to wire bonding to the following thin flexible printed circuit boards.
【００１５】本発明において、超音波圧着法によるワイ
ヤ−ボンディングは、通常の条件のもとで行われ、チッ
プ温度は常温〜１５０℃、超音波周波数は２０HZ〜６０
HZであり、ワイヤ−には２０μｍφ〜５００μｍφのAu
線またはAL線が使用される。In the present invention, the wire bonding by the ultrasonic pressure bonding method is performed under ordinary conditions, the chip temperature is from ordinary temperature to 150 ° C., and the ultrasonic frequency is from 20 Hz to 60 Hz.
HZ, and the wire has an Au of 20 μmφ to 500 μmφ.
Lines or AL lines are used.
【００１６】本発明において使用する熱剥離性両面粘着
テ−プにおいては、超音波エネルギ−の吸収を極力小と
するように、基材に硬質プラスチックフィルム、好まし
くはエンジニアリングプラスチックフィルムを使用し、
両面それぞれの熱剥離性粘着層の厚みは、通常の粘着テ
−プの粘着剤層の厚みよりも薄くすることが有利であ
る。In the heat-peelable double-sided pressure-sensitive adhesive tape used in the present invention, a hard plastic film, preferably an engineering plastic film, is used as a base material so as to minimize absorption of ultrasonic energy.
It is advantageous that the thickness of the heat-peelable pressure-sensitive adhesive layer on each side be smaller than the thickness of the pressure-sensitive adhesive layer of a normal pressure-sensitive adhesive tape.
【００１７】上記の超音波圧着条件の如何によっては、
超音波エネルギ−のワイヤ−ボンディング箇所への伝達
効率を高めるために、図２の（イ）に示すように、台座
３とフレキシブルプリント回路板１との間に硬質金属板
５を配置し、その周囲においてフレキシブルプリント回
路板１を台座３に熱剥離性両面粘着テ−プ４により接着
すること、または、図２の（ロ）に示すように、硬質金
属板５に孔を設けこの孔に熱剥離性粘着剤４０を充填し
た粘着テ−プ４でフレキシブルプリント回路板１を台座
３に接着することができる。図２の（イ）並びに（ロ）
において、２はチップを、ｂはボンディングするワイヤ
−をそれぞれ示している。Depending on the above ultrasonic pressure bonding conditions,
As shown in FIG. 2A, a hard metal plate 5 is disposed between the pedestal 3 and the flexible printed circuit board 1 in order to increase the efficiency of transmitting ultrasonic energy to the wire bonding portion. Affixing the flexible printed circuit board 1 to the pedestal 3 with a heat-peelable double-sided adhesive tape 4 around the perimeter, or providing a hole in the hard metal plate 5 as shown in FIG. The flexible printed circuit board 1 can be adhered to the pedestal 3 with an adhesive tape 4 filled with a peelable adhesive 40. (A) and (b) in FIG.
In the figure, 2 indicates a chip, and b indicates a wire to be bonded.
【００１８】本発明において、熱剥離性粘着テ−プに
は、その熱剥離温度（接着力の低下開始温度）が超音波
圧着法ワイヤ−ボンディング時のチップ温度（常温〜１
５０℃）からできるだけ離れたものを使用することが安
全であり、熱剥離温度が７０℃〜１８０℃の範囲内にあ
るものを使用することが好ましい。In the present invention, the heat-peelable pressure-sensitive adhesive tape has a heat-peeling temperature (a temperature at which the adhesive force starts to decrease) at a chip temperature (normal temperature to 1 ° C) at the time of wire bonding by the ultrasonic pressure bonding method.
(50 ° C.) as far as possible, and it is preferable to use one having a thermal peeling temperature in the range of 70 ° C. to 180 ° C.
【００１９】なお、熱剥離温度が１３０℃以上の熱剥離
性粘着テ−プを使用すれば、チップをほぼ１２０℃に加
熱し、加熱圧着しつつ超音波圧着を行う熱圧着併用超音
波圧着法によるワイヤ−ボンディング（サ−モソニック
法）を使用することも可能である。If a heat-peelable pressure-sensitive adhesive tape having a heat-peeling temperature of 130 ° C. or more is used, the chip is heated to approximately 120 ° C., and is subjected to ultrasonic pressure bonding while performing heat pressure bonding. It is also possible to use wire bonding (thermosonic method) according to the following method.
【００２０】[0020]
【作用】加熱（７０℃〜１８０℃程度）によって接着力
が減少する熱剥離性粘着テ−プでフレキシブルプリント
回路板を台座に接着し、この接着固定したフレキシブル
プリント回路板に超音波圧着法によりワイヤ−ボンディ
ングしており、このワイヤ−ボンディング温度のもとで
は、上記熱剥離性粘着テ−プの接着力が安定に保持され
るから（熱剥離性粘着テ−プの温度が熱離型温度にまで
達しない）、フレキシブルプリント回路板を安定に固定
して高品質のワイヤ−ボンディングを行うことができ
る。The flexible printed circuit board is bonded to the pedestal with a heat-peelable adhesive tape whose adhesive strength is reduced by heating (about 70 ° C. to 180 ° C.). Wire bonding is performed, and the adhesive force of the heat-peelable pressure-sensitive adhesive tape is stably maintained at the wire-bonding temperature (the temperature of the heat-peelable pressure-sensitive adhesive tape is set to a heat release temperature. ), And the flexible printed circuit board can be stably fixed to perform high-quality wire bonding.
【００２１】そして、ワイヤ−ボンディングの後は、加
熱により熱剥離性粘着テ−プの接着力を減じたうえで
（通常、接着力をほぼ０としたうえで）、ワイヤ−ボン
ディングフレキシブルプリント回路板を台座から取出し
ているから、フレキシブルプリント回路板の破損やボン
ドワイヤ−の断線等を確実に排除してそのフレキシブル
プリント回路板を安全に取出すことができる。また、熱
剥離性粘着テ−プに加熱発泡により接着力の低下するも
のを使用することにより、短時間の加熱で済み、作業の
迅速性を保証できる。After the wire bonding, the adhesive force of the heat-peelable pressure-sensitive adhesive tape is reduced by heating (usually, the adhesive force is reduced to almost zero), and then the wire-bonding flexible printed circuit board is heated. Is removed from the pedestal, so that the flexible printed circuit board can be safely taken out by reliably removing breakage of the flexible printed circuit board, disconnection of the bond wire, and the like. Further, by using a heat-peelable pressure-sensitive adhesive tape whose adhesive strength is reduced by heating and foaming, heating can be performed in a short time, and quick operation can be ensured.
【００２２】[0022]
〔実施例〕フレキシブルプリント回路板には、厚み２５
μｍのポリエチレンテレフタレ−トフィルムを基板とす
るものを使用し、熱剥離性両面粘着テ−プには熱剥離温
度が９０℃の日東電工（株）製−熱剥離性両面粘着テ−
プ、商品名リバアルファＮｏ３１９５（厚み１００μｍ
のポリエチレンテレフタレ−トフィルムの両面に厚み３
０μｍにて発泡剤添加粘着剤を塗布、熱剥離前の接着力
は３２０g/20mm，熱剥離後の接着力は０、加熱温度１０
０℃のもとで接着力を０にするのに必要な加熱時間は約
１秒である）を使用した。[Example] A flexible printed circuit board has a thickness of 25.
A heat-peelable double-sided pressure-sensitive adhesive tape manufactured by Nitto Denko Corporation and having a heat-peeling temperature of 90 ° C. is used.
Riba Alpha No. 3195 (Thickness 100 μm
Thickness 3 on both sides of polyethylene terephthalate film
A foaming agent-added adhesive is applied at 0 μm, the adhesive strength before thermal peeling is 320 g / 20 mm, the adhesive strength after thermal peeling is 0, and the heating temperature is 10
The heating time required to bring the adhesion to zero at 0 ° C. is about 1 second).
【００２３】上記フレキシブルプリント回路板にＨＩＣ
をエポキシ樹脂接着剤でボンディングし、更にそのフレ
キシブルプリント回路板を上記の熱剥離性粘着テ−プに
よりアルミ台座上に接着し、Au線で超音波圧着法により
ワイヤ−ボンディングした。而るのち、加熱温度１００
℃のオ−ブンで６０秒加熱し、オ−ブンから取出した。HIC is used for the flexible printed circuit board.
Was bonded with an epoxy resin adhesive, and the flexible printed circuit board was bonded on an aluminum pedestal with the above-mentioned heat-peelable adhesive tape, and wire-bonded with an Au wire by an ultrasonic pressure bonding method. After that, heating temperature 100
Heated in an oven at 60 ° C for 60 seconds and removed from the oven.
【００２４】この実施例において、フレキシブルプリン
ト回路板は実質上、剥離しており、軽い力で台座から分
離できた。また、試料数４０箇のもとでのワイヤ−ボン
ディングの成功率（１０ｇの引張り力に耐えるものを成
功とした）は１００％であった。In this example, the flexible printed circuit board was substantially peeled off and could be separated from the pedestal with a light force. In addition, the success rate of wire-bonding under the number of samples of 40 (100 mm tensile strength was regarded as success) was 100%.
【００２５】〔比較例１〕実施例に対し、リバアルファ
Ｎｏ３１９５に代え、接着力が３２０g/20mmの通常の両
面粘着テ−プを使用し、ワイヤ−ボンディング後、直ち
に、フレキシブルプリント回路板を台座から強制的に引
張って取出した。これ以外の条件は実施例に同じとし
た。この比較例でのワイヤ−ボンディングの成功率は、
実施例と相違するところはなかったが、ワイヤ−ボンデ
ィングフレキシブルプリント回路板の取出し時にボンド
ワイヤ−が断線したものがあった。COMPARATIVE EXAMPLE 1 An ordinary double-sided adhesive tape having an adhesive strength of 320 g / 20 mm was used in place of Riva Alpha No. 3195, and the flexible printed circuit board was immediately mounted on the pedestal after wire bonding. And was forcibly pulled out. Other conditions were the same as in the example. The success rate of wire-bonding in this comparative example is
Although there was no difference from the embodiment, the bond wire was broken when the wire-bonding flexible printed circuit board was taken out.
【００２６】〔比較例２〕実施例に対し、リバアルファ
Ｎｏ３１９５に代え、接着力が５０g/20mmの低粘着力両
面粘着テ−プを使用し、ワイヤ−ボンディング後、直ち
に、フレキシブルプリント回路板を台座から取出した。
これ以外の条件は実施例に同じとした。この比較例で
は、フレキシブルプリント回路板の固定が不安定であ
り、ワイヤ−ボンディングの成功率が５０％以下であっ
た。[Comparative Example 2] A flexible printed circuit board was used immediately after wire bonding, using a low-adhesion double-sided adhesive tape having an adhesive strength of 50 g / 20 mm instead of Riva Alpha No. 3195. Removed from pedestal.
Other conditions were the same as in the example. In this comparative example, the fixation of the flexible printed circuit board was unstable, and the success rate of wire-bonding was 50% or less.
【００２７】[0027]
【発明の効果】本発明に係るシ−ト状回路材のワイヤ−
ボンディング方法によれば、ワイヤ−ボンディングの固
定を安定に行うことができから、高品質のワイヤ−ボン
ディングを保証でき、しかも、ワイヤ−ボンディングは
フレキシブルプリント回路板を実質的に引張ることなく
台座から取出すことができるから、ボンドワイヤ−の断
線や回路板自体の損傷を確実に排除してワイヤ−ボンデ
ィングフレキシブルプリント回路板を次の工程に移送で
きる。従って、本発明によれば、フレキシブルプリント
回路板が極薄であっても、容易に高品質で安全にワイヤ
−ボンディングを行うことが可能になる。The wire of the sheet-like circuit material according to the present invention.
According to the bonding method, the wire-bonding can be stably fixed, so that high-quality wire-bonding can be guaranteed, and the wire-bonding is removed from the pedestal without substantially pulling the flexible printed circuit board. Therefore, the wire-bonded flexible printed circuit board can be transferred to the next step while reliably preventing the breakage of the bond wire and the damage of the circuit board itself. Therefore, according to the present invention, even if the flexible printed circuit board is extremely thin, it is possible to easily perform high-quality and safe wire bonding.
【図１】本発明を作業手順で示す説明図である。FIG. 1 is an explanatory diagram showing the present invention in a work procedure.
【図２】本発明におけるフレキシブルプリント回路板の
台座への異なる固定構造を示す説明図である。FIG. 2 is an explanatory view showing a different fixing structure of a flexible printed circuit board to a pedestal according to the present invention.
１ フレキシブルプリント回路板 ２ チップ ３ 台座 ４ 熱剥離性粘着テ−プ ｂ ボンディングワイヤ− DESCRIPTION OF SYMBOLS 1 Flexible printed circuit board 2 Chip 3 Pedestal 4 Heat peelable adhesive tape b Bonding wire
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小林 勢樹 大阪府茨木市下穂積１丁目１番２号 日 東電工株式会社内 (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/60 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Seiki Kobayashi 1-2-1, Shimohozumi, Ibaraki-shi, Osaka Nippon Denko Corporation (58) Field surveyed (Int. Cl. 6 , DB name) H01L 21/60
Claims (3)
着テ−プでシ−ト状回路材を台座に接着し、該シ−ト状
回路材のワイヤ−ボンディングを超音波圧着法により行
い、而るのち、加熱により上記熱剥離性粘着テ−プの接
着力を低下させたうえで、上記シ−ト状回路材を台座か
ら取出すことを特徴とするシ−ト状回路材のワイヤ−ボ
ンディング方法。1. A sheet-like circuit material is adhered to a pedestal with a heat-peelable adhesive tape whose adhesive strength is reduced by heating, and wire-bonding of the sheet-like circuit material is performed by an ultrasonic pressure bonding method. Thereafter, the sheet-like circuit material is taken out from the pedestal after the adhesive force of the heat-peelable pressure-sensitive adhesive tape is reduced by heating. Bonding method.
である請求項１記載のシ−ト状回路材のワイヤ−ボンデ
ィング方法。2. The wire bonding method for a sheet-like circuit material according to claim 1, wherein the pressure-sensitive adhesive of the heat-peelable pressure-sensitive adhesive tape is heat-foamable.
〜１８０℃である請求項１または２記載のシ−ト状回路
材のワイヤ−ボンディング方法。3. The heat-peelable adhesive tape has a heat-peeling temperature of 70 ° C.
The wire bonding method for a sheet-like circuit material according to claim 1 or 2, wherein the temperature is 180 to 180 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28406694A JP2971349B2 (en) | 1994-10-25 | 1994-10-25 | Wire bonding method for sheet-like circuit material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28406694A JP2971349B2 (en) | 1994-10-25 | 1994-10-25 | Wire bonding method for sheet-like circuit material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08124975A JPH08124975A (en) | 1996-05-17 |
| JP2971349B2 true JP2971349B2 (en) | 1999-11-02 |
Family
ID=17673853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28406694A Expired - Fee Related JP2971349B2 (en) | 1994-10-25 | 1994-10-25 | Wire bonding method for sheet-like circuit material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2971349B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005175071A (en) * | 2003-12-09 | 2005-06-30 | Shin Etsu Polymer Co Ltd | Thin substrate fixing tool |
| TWI435397B (en) * | 2010-08-06 | 2014-04-21 | Univ Nat Chiao Tung | Soft micro system structure and manufacturing method thereof |
| JP2014017453A (en) * | 2012-07-11 | 2014-01-30 | Fujitsu Semiconductor Ltd | Semiconductor device and method for manufacturing the same |
-
1994
- 1994-10-25 JP JP28406694A patent/JP2971349B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08124975A (en) | 1996-05-17 |
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