JP2945089B2 - Tape sticking device for wafer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The apparatus for attaching tape to a wafer according to the present invention is used for attaching tape to one surface of a semiconductor wafer.

(Prior Art) In a post-manufacturing process of a semiconductor wafer, a protective tape is attached to a front surface thereof, and a tape attached to a frame on a rear surface is attached to protect the semiconductor wafer from damage during cutting.

In this case, the tape is attached in a vacuum chamber of the tape attaching device so that air bubbles do not enter between the film and the semiconductor wafer. FIG. 8 shows a conventional tape application device. This is because, after the inside of the vacuum chamber B is evacuated to a predetermined degree of vacuum by a vacuum evacuation device, the film C attached to the support frame E is moved onto the semiconductor wafer A by an arrow by a roller D provided in the chamber B. Pressing from the z direction, moving the roller D in the direction of the arrow y while rotating the roller D in the direction of the arrow x in the same figure, pressing the film C against the semiconductor wafer A, and pushing out bubbles between the semiconductor wafer A and the film C. Was.

Incidentally, an adhesive is previously applied to the back surface of the film C, and the two are adhered only by pressing the film C against the semiconductor wafer A.

(Problems to be Solved by the Invention) However, in the conventional vacuum bonding apparatus, the roller D
Drive device F for rotating or moving the roller
Must be provided in the vacuum chamber B, so that the capacity in the chamber B increases. When the capacity is increased as described above, the amount of evacuation of the vacuum chamber B is increased. Therefore, a large-capacity evacuation device is required to increase the degree of vacuum in the chamber B, and the vacuum device is large and the cost is high. . Further, in order to operate the roller D in a vacuum, it is necessary to seal various parts including the roller driving device F, so that the structure becomes complicated and the device becomes more expensive.

(Object of the Invention) It is an object of the present invention to provide an inexpensive device for attaching tape to a wafer, which does not use rollers as in the prior art, has a small vacuum exhaust device, has a simple structure, and is inexpensive.

(Means for Solving the Problems) As shown in FIGS. 1 to 6, a tape affixing apparatus for a wafer according to the present invention is configured such that a semiconductor set on a wafer support table 5 in a vacuum chamber B in the vacuum chamber B. In a tape affixing device for attaching a film C to one surface of a wafer A on a semiconductor wafer, a press device 1 for pressing the film C against the semiconductor wafer A is provided above the wafer support table 5 in the vacuum chamber B. The pressing portion 2 is formed by enriching a soft material having a restoring property, and the pressing surface 3 of the pressing portion 2 is formed so as to gradually bend and project toward the film C from the outside toward the center. It is characterized by becoming.

(Operation) In the tape affixing apparatus for a wafer according to the present invention, since the pressing portion 2 is formed of a soft material and is gradually curved and protruded from the outer periphery toward the center portion, the second portion is provided by a vacuum exhaust device (not shown). After evacuating the inside of the vacuum chamber B to a predetermined degree of vacuum, as shown in FIG.
When the pressing portion 2 is lowered in the direction of the arrow t in FIG.
The central portion protrudes by being pressed by the pressing surface 3 of.

When the pressing unit 2 is further lowered from this state by the pressing device 1, as shown in FIG.
Is pressed against the semiconductor wafer A via the film C and is deformed in accordance with the shape of the semiconductor wafer A, and the film C is gradually pressed from the center toward the outside toward the semiconductor wafer A, and the film C Bubbles between the semiconductor wafer A and the semiconductor wafer A are pushed outward from the center. Further, if the pressing device 1 is pushed out or the wafer receiving table 5 on which the semiconductor wafer A is placed is pushed out in the direction of arrow w in FIG. As a result, the bubbles between the film C and the semiconductor wafer A are extruded to the outside, and the two adhere to each other.

(Embodiment) A shown in FIG. 1, which is an embodiment of the apparatus for affixing a tape to a wafer according to the present invention, is a semiconductor wafer.

B in the figure is a vacuum chamber, which is an upper body 10 and a lower body.
11 is divided into upper and lower parts. A vacuum exhaust device (not shown) is connected to an exhaust port 12 provided in the upper body 10. An O-ring is provided on the joint surface between the upper body 10 and the lower body 11.
13 is attached so that the airtightness in the vacuum chamber B is maintained when the two are joined. In FIG. 1, reference numeral 1 denotes a pressing device, which is an upper body 10 of a vacuum chamber B.
Mounted on The press device 1 is for pressing a film C against a semiconductor wafer A, and is composed of a cylinder 15 attached to the outside of the body 10 and a pressing portion 2 provided inside the body 10. The pressing portion 2 is attached to a rod 15a of the cylinder 15, and moves up and down in the vertical direction (arrows ab) of FIG. Of course, an O-ring 16 is interposed between the rod 15a and the upper body 10 so as to maintain the airtightness in the vacuum chamber B.

The pressing portion 2 is formed by enriching a soft material having a restoring property, and the pressing portion 2 is mounted on the lower surface of a metal mounting plate 17 made of aluminum or the like. As this soft material, for example, a rubber-like material having a hardness of about 20 degrees with a rubber hardness specified by JISA can be used, and the film C and the semiconductor wafer A will not be damaged if the hardness is at such a level. A harder material than that is not preferable because the wafer A may be damaged when the semiconductor wafer A is pressed through the film C.

Moreover, the pressing portion 2 is formed such that the pressing surface 3 is gradually curved and protrudes from the outer periphery toward the central portion. In this embodiment, the projecting amount of the pressing surface 3 is about 0.5 to 1.0 mm with respect to the entire height of the pressing portion 2 of 4 to 6 mm.

E in FIG. 1 is a support frame provided below the lower body 11 of the vacuum chamber B. The lower surface of the film C is attached to the support frame E. Incidentally, an adhesive is applied to the back surface of the film C in advance as in the prior art.

A numeral 5 shown in FIG. 1 is a wafer receiving table provided in the lower body 11 of the vacuum chamber B. The wafer receiving table 5 is formed by an arrow c- in FIG.
It is designed to be raised and lowered in the d direction. An O-ring 22 is provided between the rod 20a and the lower body 11, and the guide 21 and the lower body 11
An O-ring 24 is mounted between the two.

In FIG. 1, reference numeral 25 denotes an upper body elevating device for elevating and lowering the upper body 10 in the directions of arrows ef of FIG.
This is a lower body elevating device for elevating and lowering in the −h direction, and the upper body 10 and the lower body 11 are abutted or separated by these devices. These lifting devices 25 and 26 have the same structure, and each of them has a lifting cylinder 27 for moving the upper body 10 or the lower body 11 in the vertical direction, and an upper body 10 or a lower body.
Arms 28 and 29 for guiding the movement of the eleventh stage are provided.

In this embodiment, the apparatus for setting the film C stuck on the support frame E in the vacuum chamber B has been described in detail. However, in the tape sticking apparatus for a wafer according to the present invention, for example, as shown in FIG. The film C may be continuously fed between the upper body 10 and the lower body 11 of the divided vacuum chamber B, and the film C may be sandwiched between the upper body 10 and the lower body 11.

(Effects of the Invention) The tape sticking apparatus for a wafer according to the present invention has the following effects.

. Since the air bubbles between the film C and the semiconductor wafer A are gradually and reliably extruded from the center to the outside and the two adhere to each other, the conventional roller D is used for bonding the film C and the semiconductor wafer A. No need. As a result, a driving device F for rotating and moving the roller D is not required, so that the capacity of the vacuum chamber B can be reduced, and a small and inexpensive tape sticking device for a wafer can be obtained.

. Since a small and inexpensive vacuum evacuation device for evacuating the inside of the vacuum chamber B can be used, the whole device becomes compact. Further, since the mechanism for moving the press device 1 is simplified, the inside of the vacuum chamber B is easily airtight, and the cost is further reduced.

[Brief description of the drawings]

FIG. 1 is a partially sectional front view showing an embodiment of a tape sticking apparatus for a wafer according to the present invention, FIGS. 2 to 6 are explanatory views of the use of the apparatus, and FIG. FIG. 8 is a partial sectional front view showing another embodiment of the tape sticking apparatus, and FIG. 8 is a partial sectional front view showing a conventional tape sticking apparatus. 1 is a pressing device 2 is a pressing part 3 is a pressing surface 5 is a wafer support A is a semiconductor wafer B is a vacuum chamber C is a film

Claims (1)

(57) [Claims] In a vacuum chamber B, the chamber B
In a tape sticking apparatus for attaching a film C to one surface of a semiconductor wafer A set on a wafer support 5 in the vacuum chamber B, the wafer support 5 in the vacuum chamber B
A pressing device 1 for pressing a film C against a semiconductor wafer A is provided above the semiconductor device A. A pressing portion 2 of the pressing device 1 is formed of a resilient soft material, and a pressing surface 3 of the pressing portion 2 has an outer surface. A tape sticking device for a wafer, wherein the tape sticking device is formed so as to gradually bend toward the film C side and project toward the center portion from the center.