JP2914294B2 - Heat pipe radiator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiator for a heat pipe, and more particularly to a heat radiator for a high heat generating device mounted on a satellite.

[0002]

Conventionally, this type of heat pipe heat dissipation device, for example as shown in the actual fairness 3-38838 discloses, in the substrate for integrated circuits, are used for the purpose of heat dissipation of the circuit.

[0003] Fig. 6 shows the above-mentioned Japanese Utility Model Publication No. 3-38838.
FIG. 7 is a schematic perspective view showing an example of a conventional heat-dissipating heat pipe heat dissipating device disclosed in the publication .
It is sectional drawing cut | disconnected along a line and seen in the direction of the arrow.

[0004] In FIGS. 6 and 7, the circuit 1 to be dissipated
7 , a triangular closed cavity 8 shown in FIG. 7 is provided in the inside of the plate 7 and a condensable fluid 9 is put in the plate 7 as a radial heat pipe to transfer heat generated by the circuit 10 in the in-plane direction of the plate 7. This is a device that dissipates heat generated by the circuit 10 by making the plate 7 have a uniform temperature distribution.

[0005]

However, FIG.
The technique shown in FIG. 7 has the following problems.

[0006] The first problem is that ICs and Ls are used as heating elements.
Because it is targeted at SI, the calorific value is large, and
Large satellite-borne equipment lacks heat transfer capability.

[0007] The reason is that the heat pipe has a small capillary force and a small heat transport capability because the heat source circuit is small and the plate is cut into a groove to form a heat pipe.

[0008] The second problem is that it is affected by gravity.

The reason is that, as described above, the heat transport ability is small, and the gravity easily affects the capillary force of the heat pipe.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances, and an object of the present invention is to solve the above-mentioned drawbacks inherent in the prior art and to improve the heat transfer capability of a heat source. It is another object of the present invention to provide a novel heat pipe radiator that can easily perform a test even when subjected to gravity in a ground test of a high heat generating device mounted on an artificial satellite.

[0011]

To achieve the above object, the heat pipe radiator according to the present invention can efficiently radiate heat to a high heat source. More specifically, instead of the conventional triangular groove, a single heat pipe is embedded in the panel (3 in FIG. 1), and the heat pipes are connected to each other by a heat pipe connecting fitting (4 in FIG. 1). It is composed.

[0012]

According to the present invention, the heat generated by the high heat-generating device attached at the center of the panel is uniformly diffused to the panel by the heat pipes radially embedded inside the panel, and the heat is efficiently radiated. Further, by attaching the heat pipe connecting fittings between the heat pipes, the heat coupling in the circumferential direction of the panel is strengthened, and the heat can be more efficiently radiated.

[0013]

Next, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 (a) and 1 (b) show a first embodiment of the present invention, wherein (a) is a front view and (b) is a side view.

Referring to FIG. 1, a first embodiment according to the present invention has a large number of grooves 5 as shown in FIG. A large number of heat pipes 3 into which the heat pipes 6 are sealed are embedded in the panel 1. Further, in order to strengthen the thermal connection between the radial embedded heat pipes 3, heat pipe connecting fittings 4 made of metal or the like having good thermal conductivity are attached between the embedded heat pipes 3, The heat transfer force in the circumferential direction of the panel 1 is increased.

Next, the operation of the first embodiment according to the present invention will be described in detail with reference to FIG.

FIG. 2 is a sectional view taken along the line AA 'of FIG. 1B and viewed in the direction of the arrow.

Referring to FIG. 2, heat generated by the high heat-generating device 2 mounted above the center of the panel 1 is generated by a heat pipe 3 radially embedded inside the panel 1 in a heat flow direction 11. Along the inside of the panel 1 and is efficiently radiated to the outside.

The heat pipe 3 embedded in the panel 1 has a working fluid 6 and a number of grooves 5 inside as shown in FIG. This many grooves (grooves) 5
This allows for a greater amount of heat transport than the prior art described above.

Further, since the heat pipes 3 are thermally strongly connected to each other by the heat pipe connecting fittings 4, even if the heat generation in the high heat generating device 2 is uneven in the plane, uniform heat radiation to the plane of the panel 1 is achieved. Becomes possible.

Further, as shown in FIG. 4, in the ground performance test of the heat pipe 3 embedded in the panel 1, when the panel 1 is inclined with respect to gravity,
Capillary force 1 which is a circulating force of working fluid 6 of heat pipe 13
Because 5 is affected by gravity, the heat pipe 13
The heat transport ability is reduced due to the slope of the heat transport. However, on the contrary, the heat pipe 14 in which the direction of gravity and the capillary force 15 are the same increases the heat transport force.

As described above, since the heat pipes 3 are buried radially with respect to the panel 1, even when the panel 1 is inclined, one or more heat pipes 3 always transport heat, and Heat can be dissipated.

Further, as described above, since the heat pipes 3 are thermally strongly connected to each other by the heat pipe connecting fittings 4, the heat of the heat pipes 3 can be easily transferred to the adjacent heat pipes 3. This makes it possible to efficiently radiate heat from the high heat-generating device 2 even when the panel 1 is inclined.

Next, a second embodiment according to the present invention will be described with reference to the drawings.

FIG. 5 shows a second embodiment according to the present invention.
Among them, (a) is a front view and (b) is a side view.

Referring to FIGS. 5A and 5B, in the second embodiment according to the present invention, two heat pipes 3 centering on a high heat generator 2 are embedded in the panel 1. Further, in order to strengthen the thermal coupling between the embedded heat pipes 3, a heat pipe connecting fitting 4 'made of a metal having good thermal conductivity is attached between the embedded heat pipes 3.

The description of the operation is similar to that of the first embodiment. Although the heat transfer capacity of the entire panel 1 is lower than the heat pipes 3 installed radially as described above, as a countermeasure against the effects of gravity in the ground test, if there are at least two heat pipes 3, the effect of gravity is exerted. It can also operate.

[0028]

The present invention is constructed and operates as described above, and according to the present invention, the following effects can be obtained.

The first effect is that a large amount of heat can be efficiently radiated. As a result, good heat radiation of the high heat generating device is enabled.

The reason is that a heat pipe having a large number of grooves (grooves) is radially embedded in the panel, and a heat pipe connecting fitting is attached between the heat pipes.

The second effect is that the influence of gravity is small in the ground test. This facilitates ground testing.

The reason is the same as that of the first effect.

[Brief description of the drawings]

FIGS. 1 (a) and 1 (b) are a front view and a side view showing a first embodiment of a heat pipe radiator according to the present invention.

FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1 (b) and viewed in a direction of an arrow.

FIG. 3 is a cross-sectional view of the heat pipe taken along a line BB ′ in FIG. 1B and viewed in a direction of an arrow.

FIG. 4 is a cross-sectional view cut along a line CC ′ in FIG. 1A and tilted obliquely.

FIGS. 5A and 5B are a front view and a side view showing a second embodiment according to the present invention.

FIG. 6 is a perspective view showing a conventional heat dissipation device.

FIG. 7 is a sectional view taken along line DD ′ of FIG. 6 and viewed in the direction of the arrow.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Panel 2 ... High heat generation equipment 3 ... Embedded heat pipe 4 ... Heat pipe connection fitting 5 ... Groove (groove) 6 ... Working fluid 7 ... Plate material 8 ... Triangular closed cavity 9 ... Condensable fluid 10 ... Circuit 11 ... Heat 12 Heat dissipation 13 Heat pipe whose heat transfer is difficult due to the influence of gravity 14 Heat pipe whose heat transfer force has increased due to the influence of gravity 15 Capillary force of the heat pipe

Claims (1)

(57) [Claims] 1. A heat dissipating apparatus using a heat pipe, wherein a plurality of heat pipes radially embedded in a panel around a high heat generating device;
As the thermal coupling means for thermally coupling the
The plurality of panels are disposed in the panel area immediately below the heat equipment.
Good heat conductive metal connecting each end of the heat pipe
With a heat pipe connection fitting formed by
A large number of grooves are formed in the longitudinal direction of the inner peripheral surface of each heat pipe.
Heat pipe radiator device being characterized in that form.