JP2834674B2 - MR type magnetic head and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an MR type magnetic head and a method of manufacturing the same.

[0002]

2. Description of the Related Art An MR type magnetic head is formed by patterning an MR layer in a belt shape along a medium sliding surface and adding bias means for applying an appropriate bias magnetic field to the MR layer. . When a magnetic field of a magnetic signal recorded on the medium acts on the MR layer in addition to the bias magnetic field, the resistance of the MR layer changes in proportion to the change in the magnetic field acting on the MR layer. The magnetic signal is reproduced by detecting the change in the resistance value.

As an example of such an MR type magnetic head, there is a hard magnetic lateral bias structure as disclosed in Japanese Patent Application Laid-Open No. Hei 3-125311. Specifically, as shown in FIG. 11, an MR layer 2 is formed on a substrate 1 as shown in FIG.
Is formed, and a lead layer 3 for applying a lateral bias to the MR layer 2 is bonded to a side surface of the MR layer 2.
Power supply and signal detection (data reading) are performed via such a joint surface.

In the example shown in the figure, the lead layer 3 is provided on one side surface of the MR layer 2.
The lead layer is also connected to the side surface on the opposite side. As shown, the side surface of the MR layer 2 is inclined at an angle θ, and the tip A of the lead layer 3 is located somewhere on the inclined surface (side surface) (or the upper surface of the MR layer 2). . Then, a portion from the lower end of the side surface of the MR layer 2 to the tip A is a bonding surface between the MR layer 2 and the lead layer 3, in other words,
The area from the point A to the opposite point A (not shown) is a sense area.

[0005] Each of the layers 2 and 3 may be formed by laminating layers made of a plurality of materials as shown in the figure, or may be formed of a single layer. The upper part of each of the layers 2 and 3 is covered with a protective layer 4.

[0006]

However, in the above-mentioned conventional MR type magnetic head, the formation position of the tip A of the lead layer 3 is shifted due to a problem in the accuracy of the manufacturing process. That is, if the state shown in FIG. 5 is the innermost point, for example, the state varies within the range shown in d in the figure. Then, the sense region also fluctuates, and it becomes impossible to obtain desired characteristics as designed.

Although errors in the manufacturing process are smaller than in the case of manufacturing the lead layer 3 but are slight in the case of manufacturing the MR layer 2, the thickness of each layer and the inclination angle θ may vary. Then, since the position of the tip A is determined by the relative position of the MR layer 2 and the lead layer 3, it varies due to a double manufacturing error, and the amount of variation also increases.

Further, the side surface of the MR layer 2 has a gradual inclination angle near the upper end smaller than the above-mentioned angle θ due to the manufacturing process. If the thickness of the CoCrPt layer varies in the example of (1), the position of the tip A greatly varies, and the above problem appears remarkably.

SUMMARY OF THE INVENTION The present invention has been made in view of the above background, and has as its object to solve the above-mentioned problems and to accurately form (as designed) a bonding range between an MR layer and a lead layer. Accordingly, it is an object of the present invention to provide an MR type magnetic head capable of accurately determining a sense region and obtaining stable characteristics without variation, and a method of manufacturing the same.

[0010]

In order to achieve the above object, in an MR type magnetic head according to the present invention, an MR layer disposed directly on a substrate or on a predetermined layer is joined to a side surface of the MR layer. A lead layer made of a conductive metal material formed at a predetermined position on the substrate;
MR having an R layer and a protective layer covering the surface of the lead layer
In the type magnetic head, an insulating layer having a predetermined thickness is provided on the upper surface of the MR layer so as to cover the entire surface thereof, and the side surface of the MR layer and the side surface of the insulating layer are continuous with each other. Both side surfaces of the layer are inclined surfaces, and the M
Of the inclination angle θ of the side surface of the R layer and the side surface of the insulating layer,
The inclination angle of the connection side portion with the MR is made equal, and
The inclination angle of the upper side of the side surface of the insulating layer is configured to be smaller than the inclination angle θ of the side surface of the MR layer, and the lead layer is added to the side surface of the MR layer. It was configured to be joined (claim 1).

In the manufacturing method for manufacturing the MR type magnetic head having the above structure, a predetermined number of MR materials having a magnetoresistance effect are directly or indirectly disposed on a substrate, and an insulating material is provided on the MR material. Place material and then MR
By exposing and developing the material and the insulating material to remove unnecessary portions, the side surfaces of the MR material and the insulating material become continuous inclined surfaces, and the inclination angle of the side surface of each material is reduced by the MR angle. The MR layer and the insulating layer are formed by molding the material from the material to the middle of the insulating material into a predetermined shape such that the angle of inclination on the upper side of the insulating material is smaller than the same angle of inclination θ. Next, a lead layer made of a conductive metal material is formed on the substrate so as to be bonded to at least the side surfaces of the MR layer and the insulating layer, and thereafter, the exposed surfaces of the insulating layer and the lead layer are protected. Layer.

Further, an MR for achieving the above object is provided.
Another configuration of the type magnetic head includes an MR layer disposed directly on a substrate or on a predetermined layer, and a conductive layer formed at a predetermined position on the substrate so as to be joined on the side and top surfaces of the MR layer. A lead layer made of a metal material having
In an MR type magnetic head including a layer and a protective layer covering the surface of the lead layer, an insulating layer having a predetermined thickness is formed on the MR layer such that both side edges of the upper surface of the MR layer are exposed by predetermined dimensions. An MR type magnetic head, wherein the lead layer is bonded to a side surface of the MR layer, an exposed upper surface, and at least a side surface of the auxiliary insulating layer.

In the manufacturing method for manufacturing the MR type magnetic head having such a configuration, a predetermined number of MR materials having a magnetoresistive effect are arranged directly or indirectly on a substrate.
An insulating material is disposed on the MR material. At this time, at least two times of the exposure and development processing and the etching processing are performed after the MR material and the insulating material are stacked and arranged, or the exposure and development processing and the etching processing are performed each time each material is formed. To form MR layers and insulating layers having different shapes and dimensions. Next, a lead layer made of a conductive metal material is formed on the substrate so as to be bonded to at least the side surfaces of the MR layer and the insulating layer and the exposed portions at both ends of the upper surface of the MR layer. Further, the lead layer is manufactured by covering the exposed surface with a protective layer.

[0014]

According to the first invention (claims 1 and 2), the lead layer is connected to the MR layer and the side surface of the insulating layer formed thereon. By the way, power supply and signal detection are not naturally performed on the joint surface between the insulating layer and the lead layer. Therefore,
The actual path / junction surface where power supply and signal detection are performed is the junction surface between the lead layer and the MR layer.
The boundary between the R layer and the insulating layer. Therefore, even if the tip position of the lead layer varies due to a manufacturing error or the like, the upper end position of the bonding surface with the MR layer that determines the sense region does not change.
Therefore, the sense region is affected only by errors in manufacturing the MR layer and the insulating layer, and the error is very small as compared with the error in manufacturing the lead layer. It will be well determined (as designed).
When the MR layer and the insulating layer are formed at the same time, the upper portion becomes gentle (the inclination angle θ ′ is small (compared to the inclination angle θ of the MR layer)). Therefore, as shown in FIGS. 3 and 4, when a bending point C where the inclination angle becomes gentle occurs in the middle of the insulating layer, the inclination angle θ of the side surface of the MR layer becomes steep over the whole. Therefore, even if the thickness of each layer is not as designed, there is a boundary S between the MR layer and the insulating layer above the bending point C (the inclination angle θ ′ is small).
The position of the boundary S (existing position in the horizontal direction that determines the sense area) does not greatly change. Therefore, the boundary S
The accuracy of the position can be accurately determined, and the sensing area can be made constant.

In the second invention (claims 3 and 4),
As described above, the lead layer and the MR layer are joined not only to the side surfaces of the MR layer but also to both end portions of the exposed upper surface of the MR layer. Therefore, the sensing area has the contact surface width between the insulating layer and the MR layer regardless of the position of the tip of the lead layer.
Then, the insulating layer can be accurately formed by performing etching after exposure and development processing.
The width of the sense region is accurately determined.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of an MR type magnetic head and a method for manufacturing the same according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a first embodiment of an MR type magnetic head according to the present invention.

As shown in FIG. 1, an MR layer 11 having a predetermined shape is disposed directly or indirectly via a predetermined layer on a substrate 10 made of AlTiC, ferrite or the like. The MR layer 11 has an inclined surface (inclination angle θ) in which the side surface is inclined (in the illustrated example, only one side is shown as in the conventional example, and the omitted portion is line-symmetric from the center. ing).

In this embodiment, the MR layer 11 is formed by laminating a plurality of magnetoresistive materials (MR materials). That is, a first MR layer 12 made of FeNiRh is provided on a substrate, a second MR layer 13 made of Ta is provided thereon, and a third MR layer 14 made of FeNi is provided thereon. In this example, the respective materials are laminated in a predetermined order as described above. However, the order of lamination is not limited to this example, and the materials to be used and the number of layers to be laminated are arbitrary, and a single layer may be used.

Here, in the present invention, the insulating layer 15 is provided so as to cover the MR layer 11, that is, the entire upper surface of the third MR layer 14. This insulating layer 15 is made of Al ₂ O ₃ in this example. Further, the side surface of the MR layer 11 and the side surface of the insulating layer 15 are continuously inclined surfaces, and more specifically, a gentle inclined surface from the middle of the side surface of the insulating layer 15. The gentle slope is due to a request from a manufacturing process described later, and is because the MR layer 11 and the insulating layer 15 are simultaneously formed by performing a predetermined process such as exposure and development. That is, the insulating layer 1 has a curved surface that is gently curved by a predetermined distance from above.
By appropriately controlling the thickness of 5, a gentle bending point is arranged in the insulating layer 15. In other words, the side surface of the MR layer 11 is formed so as to maintain a steep inclined surface (inclination angle θ).

A lead layer 16 is provided at a predetermined position on the substrate 10 so as to be joined to both sides of the MR layer 11 and the insulating layer 15. The lead layer 16 is also called a hard magnetic bias layer (see Japanese Patent Application Laid-Open No. 3-125311, etc.), and is connected to the side surface of the MR layer 11 so as to exhibit electrical and magnetic continuity. Is done. And, as a material to be used, a metal material having conductivity is used,
In particular, it is preferable to use metallurgy such as CoCr, CoPt, and CoCrPt. Also, this lead layer may be configured by using a predetermined metal material as a single layer or by laminating a plurality of layers.

In this embodiment, the first lead layer 17 made of CoCrPt is used as a base, and the second lead layer 18 made of Ta, the third lead layer 19 made of W, and
The fourth lead layer 20 made of a is sequentially laminated. Further, gold or the like can be used instead of tungsten (W). The thickness of the lead layer 16 is determined so as to provide a desired amount of bias flux.

The lead layer 16 (first lead layer 17) is directly connected to the side surfaces of the MR layer 11 and the insulating layer 15. In this embodiment, the tip A of the lead layer 16 is It is formed so as to reach the upper surface of the insulating layer 15. Further, a protective layer 21 made of Al ₂ O ₃ is formed on the exposed surfaces of the insulating layer 15 and the lead layer 16 having the above-described configuration so as to cover the layers 15 and 16.

With such a configuration, even if the leading end position A of the lead layer 16 varies within the range of the region d due to a manufacturing error or the like, the upper end position of the bonding surface with the MR layer 11 that determines the sense region is not changed. , Boundary S between MR layer 11 and insulating layer 15
Is constant.

Next, an embodiment of a method of manufacturing an MR type magnetic head according to the present invention will be described. First, as shown in FIG. 2, the FeNiRh film 12 ', the Ta film 13', the FeNi film 14 'and the Al ₂
The O ₃ films 15 ′ are laminated in a predetermined thickness in this order. Each of the films 12 'to 15' can be manufactured while controlling its thickness by, for example, sputtering.

Next, by performing exposure and development using a predetermined mask or the like and removing unnecessary portions, the MR layer 11 (first MR layer 1) having an inclined surface having continuous side surfaces as shown in FIG.
2, the second MR layer 13, the third MR layer 14) and the insulating layer 15
To form As described above, since the MR layer 11 and the insulating layer 15 are formed at the same time, a bending point C where the inclination angle becomes gentle occurs in the middle of the insulating layer 15 as shown in FIG. When this is schematically illustrated, as shown in FIG.
The bending point C is located above the boundary S between the first insulating layer 15 and the insulating layer 15. Therefore, the inclination angle θ of the side surface of the MR layer 11 becomes steep over the entirety. Therefore, even if the thickness of each layer is not as designed, the position of the boundary S (the sensing area is determined) as compared with the case where the boundary S exists above the bending point C (the inclination angle θ ′ is small). Lateral position)
Does not fluctuate significantly. Therefore, the accuracy of the position of the boundary S can be accurately determined, and the sense area can be made constant.

Next, the MR layer 1 is formed in the same manner as in the prior art.
A lead layer 16 is formed so as to be connected to predetermined portions of the side surface of the insulating layer 15 and the side surface and upper surface of the insulating layer 15, and a protective layer is further provided so as to cover those upper surfaces. A head is manufactured. When the lead layer 16 is formed, even if the positioning accuracy of the leading end A of the lead layer 16 is low, it does not affect the sense region. In other words, an MR type magnetic head having desired characteristics can be manufactured even if manufacturing errors are managed relatively roughly.

FIG. 5 shows a second embodiment of the MR type magnetic head according to the present invention. As shown in the figure, an MR layer 26 having a predetermined shape is disposed directly or indirectly via a predetermined layer on a substrate 25 made of AlTiC, ferrite or the like. In this drawing, although schematically illustrated, this M
The R layer 26 is also composed of a predetermined plurality of layers, like the MR layer 11 of the first embodiment.

An insulating layer 27 is provided so as to cover a predetermined portion of the upper surface of the MR layer 26. This insulating layer 26
Although this embodiment is also configured using Al2O3, it is not limited to this as in the first embodiment. Here, in the present embodiment, the insulating layer 15 is formed so as to cover the front surface of the upper surface of the MR layer 11 in the first embodiment, but both sides 26a of the upper surface of the MR layer 26 are exposed by a predetermined dimension t. In that it is formed in

Also in this example, the substrate 2 is bonded so that the MR layer 26 and the side surfaces 26b and 27a of the insulating layer 27 are joined.
5, the lead layer 28 is provided at a predetermined position on the upper surface 5 of the MR layer 26. As described above, the upper surface both ends 26a of the MR layer 26 are exposed.
a. Further, due to manufacturing errors, the lead layer 2
In consideration of variations in the position of the tip of 8, the upper end 27 b of the insulating layer 27 is also joined.

The lead layer 28 may be composed of a plurality of layers as in the first embodiment, or may be composed of a single layer. Further, a protective layer (not shown) made of Al ₂ O ₃ is formed on the exposed surfaces of the insulating layer 27 and the lead layer 28 having the above-described configuration so as to cover the layers 27 and 28.

With this configuration, even if the position of the leading end of the lead layer 28 varies due to a manufacturing error or the like, the length of the sensing region becomes the length of the bottom surface of the insulating layer 27 and becomes constant.
The length of the bottom surface of the insulating layer 27 can be accurately manufactured by various manufacturing processes described later.

Next, a method of manufacturing an MR type magnetic head according to the present invention for manufacturing the MR type magnetic head of the second embodiment will be described. First, as shown in FIG. 6A, an MR film 26 'having a predetermined thickness is formed on the entire surface of the substrate 25, and an insulating film 27' is formed on the MR film 26 '.
To form Each film is manufactured by controlling its thickness by, for example, sputtering.

Next, after a resist is applied to the entire upper surface of the insulating film 27 ', exposure and development are performed using a predetermined mask or the like, and unnecessary portions are removed, so that a predetermined length as shown in FIG. A resist 30 is formed. The length of the bottom surface of the resist 30 is equal to the length of the sense region.

Next, predetermined etching is performed. Then, the insulating film 27 'not covered with the resist 30 is removed. At this time, the resist 30 is also removed by a predetermined thickness. As a result, only the portion covered by the resist 30 'remains as shown in FIG.

Thereafter, a registry move process is performed, and as shown in FIG. 7A, the insulating layer 27 having a predetermined size and shape is exposed at a predetermined position on the surface of the MR film 26 '. In this state, the insulating layer 27 and the exposed MR film 26 '
By applying a resist so as to cover the surface of the substrate and exposing and developing to remove unnecessary portions, the insulating layer 27 is covered and a part of the upper surface of the MR film 26 'as shown in FIG. Is formed to cover the resist. Note that the contact width between the resist 31 and the MR film 26 'is the final M width.
The exposure width t (see FIG. 5) of both ends 26a of the upper surface of the R layer 26 is matched. Next, a second etching is performed to remove the MR film 26 'which is not covered with the resist 31, so that the upper surface is removed by a predetermined thickness to reduce the thickness of the resist 31 as shown in FIG. ', The MR film covered under remains, and an MR layer 26 is formed.

Thereafter, after the remaining resist 31 'is removed, the leads are joined so as to be joined to both sides of the side surface and the top surface of the MR layer 26 and both ends of the side surface and the top surface of the insulating layer 15 in the same manner as in the prior art. By forming layers and further providing a protective layer so as to cover their upper surfaces, an MR type magnetic head as shown in FIG. 5 is manufactured.

According to this method, the width of the resist 30 formed by the first exposure and development processing becomes the width of the sense area as it is, and the size of the resist pattern formed by exposure and development can be accurately determined. After all, the width of the sense region can be set accurately. When the lead layer is formed, even if the positioning accuracy of the tip is poor, it does not affect the sensing area, and an MR type magnetic head having desired characteristics can be manufactured even if manufacturing errors are managed relatively roughly. be able to.

FIGS. 8 and 9 show another method for manufacturing the MR type magnetic head having the structure shown in FIG. In the method shown in FIGS. 6 and 7 described above, after the MR film and the insulating film are stacked, photolithography and etching are performed twice, and if the portions (sizes) of the insulating film and the MR film to be removed are different. In this example, both ends of the upper surface of the MR layer are exposed. However, in this example, the layers are stacked while sequentially forming layers of a predetermined shape and size.

That is, as shown in FIG. 8A, first, an MR film 26 'having a predetermined thickness is formed on the upper surface of the substrate 25 over the entire surface. Then, after applying a resist on the entire upper surface of the MR film 26 ', exposure and development are performed using a predetermined mask or the like, and unnecessary portions are removed, thereby forming a resist 32 having a predetermined length as shown in FIG. To form The length of the bottom surface of the resist 32 is equal to the width of the top surface of the finally formed MR layer.

Next, predetermined etching is performed. Then, the MR film 26 'not covered with the resist 32 is removed. At this time, the resist 32 is also removed by a predetermined thickness. As a result, only the portion covered with the resist 32 'remains as shown in FIG.
Thereafter, a registry move process is performed, and an MR film 26 having the same size and shape as the final product is exposed and arranged at a predetermined position on the upper surface of the substrate 25 as shown in FIG.

In this state, an insulating film 27 'is formed by sputtering or the like so as to cover the MR layer 26 and the exposed surface of the substrate 25 (FIG. 9A). And the insulating film 2
By applying a resist to the entire upper surface of 7 'and exposing and developing to remove unnecessary portions, a resist 3 covering a part of the upper surface of the insulating film 27' as shown in FIG.
Form 3 The width of the bottom surface of the resist 33 is
The width of the insulating layer in the final product, that is, the width of the sense region is made equal.

Next, etching is performed to form a resist 33.
By removing the insulating film 27 'not covered with
As shown in FIG. 4C, the insulating film covered by the thinned resist 33 'whose upper surface has been removed by a predetermined thickness remains, and the insulating layer 27 is formed.

After that, the remaining resist 33 'is removed by a removing process, and then the MR layer 2 is formed in the same manner as in the prior art.
6, a lead layer is formed so as to be joined to both end portions of the side and top surfaces of the insulating layer 27 and both end portions of the side surface and the top surface of the insulating layer 27, and a protective layer covering these upper surfaces is formed as shown in FIG.
An R-type magnetic head is manufactured.

FIG. 10 shows still another method for manufacturing the MR type magnetic head having the structure shown in FIG. First, the processing shown in FIGS. 8A to 8D is performed to form an MR layer 26 having a predetermined shape on the substrate 25. Next, a resist is applied to the front surface of the exposed surface and exposed and developed to remove a predetermined portion of the applied resist. At this time, the resist 34 corresponding to the portion where the insulating layer is to be formed is removed in a reverse taper shape (FIG. 10).
(A)).

Next, an insulating film 27 'is formed on the front surface of the exposed surface by sputtering or the like (see FIG. 3B). After that, lift-off is performed, the resist 34 is peeled off, and the MR layer 26 is removed.
Only the insulating film directly sputtered on the upper surface of the
7 is formed (see FIG. 3C).

Thereafter, the MR layer 2 is formed in the same manner as in the prior art.
6, a lead layer is formed so as to be joined to both end portions of the side and top surfaces of the insulating layer 27 and both end portions of the side surface and the top surface of the insulating layer 27, and a protective layer covering these upper surfaces is formed as shown in FIG.
An R-type magnetic head is manufactured.

[0047]

As described above, in the MR type magnetic head and the method of manufacturing the same according to the present invention, the actual bonding surface where power supply and signal detection are performed is insulated so as to cover the entire surface of the lead layer. When the layers are arranged, the lead layer and the MR
When the upper surface of the MR layer is exposed at both ends, the upper surface of the MR layer becomes a bonding surface between the side surface and the exposed upper surface, and the upper end is a boundary between the MR layer and the insulating layer. Becomes

Therefore, even if the leading end position of the lead layer varies due to a manufacturing error or the like, the upper end position of the joining surface with the MR layer that determines the sense region does not change, so that the joining range between the MR layer and the lead layer can be accurately determined. (As designed), so that the sense region can be determined with high accuracy. Therefore, stable characteristics without variation can be obtained.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing a first embodiment of an MR type magnetic head according to the present invention.

FIG. 2 is one of process charts for explaining a first embodiment of a method of manufacturing an MR type magnetic head according to the present invention.

FIG. 3 is a schematic diagram for explaining the operation and effect of the present embodiment.

FIG. 4 is a schematic diagram for explaining the operation and effect of the present embodiment.

FIG. 5 is a partial sectional view showing a second embodiment of the MR type magnetic head according to the present invention.

FIG. 6 is one of the process charts for explaining a second embodiment of the method of manufacturing the MR type magnetic head according to the present invention.

FIG. 7 is one of process charts for explaining a second embodiment of the method of manufacturing the MR type magnetic head according to the present invention.

FIG. 8 is one of the process diagrams for explaining another example of the second embodiment of the method of manufacturing the MR type magnetic head according to the present invention.

FIG. 9 is one of the process charts for explaining another example of the second embodiment of the method of manufacturing the MR type magnetic head according to the present invention.

FIG. 10 is a process chart for explaining still another example of the second embodiment of the method of manufacturing the MR type magnetic head according to the present invention;
One.

FIG. 11 is a partial sectional view showing an example of a conventional MR type magnetic head.

[Explanation of symbols]

 10, 25 substrate 11, 26 MR layer 15, 27 insulating layer 16, 28 lead layer

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shigenori Suzuki 5-36-11 Shimbashi, Minato-ku, Tokyo Inside Fuji Electric Chemical Co., Ltd. (56) References JP-A-3-125311 (JP, A) JP-A JP-A-4-143914 (JP, A) JP-A-7-254113 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) G11B 5/31 G11B 5/39

Claims (4)

(57) [Claims] 1. An MR layer disposed directly on a substrate or on a predetermined layer, and a conductive metal material formed at a predetermined position on the substrate so as to be joined at a side surface of the MR layer. An MR type magnetic head comprising: a lead layer; a protective layer covering the surface of the MR layer; and a protective layer covering the surface of the lead layer. The side surface of the layer and the side surface of the insulating layer are made continuous, and the side surface of the MR layer and the side surface of the insulating layer are both inclined surfaces, the inclination angle θ of the side surface of the MR layer, and the side surface of the insulating layer. Wherein the inclination angle of the connection side portion with the MR is made equal, and the inclination angle of the upper side of the side surface of the insulating layer is smaller than the inclination angle θ of the side surface of the MR layer; Adding a layer to the sides of the MR layer; An MR type magnetic head which is also joined to at least the side surface of the layer. 2. An MR material having a predetermined number of magnetoresistive effects is disposed directly or indirectly on a substrate, and an insulating material is disposed on the MR material. Exposure and development to remove unnecessary parts, the side surfaces of the MR material and the insulating material become continuous inclined surfaces, and the inclination angles of the side surfaces of the respective materials change from the MR material to the middle of the insulating material. And forming an MR layer and an insulating layer by forming the upper layer of the insulating material into a predetermined shape that is smaller than the same tilt angle θ at the same tilt angle θ. And forming a lead layer made of a conductive metal material on the substrate so as to be bonded to the side surface of the insulating layer, and then covering the insulating layer and the exposed surface of the lead layer with a protective layer. Production method of the MR magnetic head. 3. An MR layer disposed directly on a substrate or on a predetermined layer, and a conductive metal material formed at a predetermined position on the substrate so as to be joined at side surfaces and an upper surface of the MR layer. And a protective layer covering the surface of the MR layer and the MR layer, wherein both side edges of the upper surface of the MR layer are exposed on the MR layer by a predetermined dimension. An MR type magnetic head, wherein an insulating layer having a predetermined thickness is provided, and the lead layer is bonded to a side surface of the MR layer, an exposed upper surface, and at least a side surface of the insulating layer. 4. An MR material having a predetermined number of magnetoresistive effects is disposed directly or indirectly on a substrate, an insulating material is disposed on the MR material, and at least after the MR material and the insulating material are stacked and disposed, 2
By performing exposure and development processing and etching processing twice or by performing exposure and development processing and etching processing each time each material is formed, an MR layer and an insulating layer having different shapes and dimensions are formed. Then, at least the MR layer And forming a lead layer made of a conductive metal material on the substrate so as to be bonded to side surfaces of the insulating layer and exposed portions at both ends of the upper surface of the MR layer, and thereafter, exposing the insulating layer and the lead layer. A method for manufacturing an MR type magnetic head in which a surface is covered with a protective layer.