JP2828116B2 - Solid-state imaging device - Google Patents

Abstract

PURPOSE:To obtain the solid-state image pickup element which can be made smaller by arranging a first connection means performing electrical connection between the solid-state image pickup element and an IC chip and a second connection means extended from the solid-state image pickup element without through the IC chip on different side-part sides in the solid-state image pickup element and the IC chip. CONSTITUTION:This solid-state image pickup element is the one equipped with the solid-state image pickup element and an IC chip 66, and a CCD chip 61 and the IC chip 66 are connected by face bonding, further, an inner lead 62 performing the electrical connection between the CCD chip 61 and the IC chip 66 and an external lead 68 used as inner lead extended from the CCD chip 61 without through the IC chip 66 are arranged on the side-part side different each other in the CCD chip 61 and the IC chip 66. Thus, the minituarization of the solid-state image pickup element can be realized in comparison to arranging on the same side as the lead 62 and the lead 68.

Description

The present invention relates to a solid-state imaging device having a solid-state imaging device and an IC chip.

[Prior art] In recent years, by inserting an elongated insertion portion into a body cavity,
2. Description of the Related Art Endoscopes capable of observing organs in a body cavity and the like and performing various treatments using a treatment tool inserted into a treatment tool channel as necessary are widely used.

Also, as shown in JP-A-63-272180, etc.,
An electronic endoscope provided with a solid-state imaging device at the distal end of the insertion section is also used. The solid-state imaging device often includes a solid-state imaging device such as a CCD and an IC chip for driving the solid-state imaging device and amplifying an output signal.

By the way, in the endoscope, it is desired to reduce the diameter of the insertion portion for reasons such as reduction of patient's pain, and therefore, it is also desired to reduce the size of the solid-state imaging device provided at the distal end of the insertion portion of the electronic endoscope. .

[Problems to be Solved by the Invention] However, conventionally, as disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 63-272180, an IC chip is provided on a substrate connected to a solid-state imaging device. There is a problem that the whole becomes large.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a solid-state imaging device that includes a solid-state imaging device and an IC chip and that can be reduced in size.

[Means for Solving the Problems] A solid-state imaging device according to the present invention comprises a solid-state imaging device, an IC chip connected to the solid-state imaging device by face bonding, and a solid-state imaging device and the IC chip. And a second connecting means extending from the solid-state imaging device without the intermediary of the IC chip, wherein the first connecting means and the first connecting means are electrically connected to each other. The second connection means, the solid-state imaging device and the
They are arranged on different sides of the IC chip.

[Operation] In the present invention, the solid-state imaging device and the IC chip are connected to each other by face bonding to reduce the size of the solid-state imaging device. Further, the first connection unit and the second connection unit are connected to different sides. By placing it on the side of the
In addition, the size of the solid-state imaging device can be reduced as compared with a case where the second connection unit is arranged on the same side.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

1 to 5 relate to a first embodiment of the present invention. FIG. 1 is a cross-sectional view of a solid-state imaging device, and is a cross-sectional view taken along line AA of FIG. 2, and FIG. FIG. 3 is a plan view and FIG.
FIG. 4 is a cross-sectional view taken along the line BB of FIG. 4, FIG. 4 is a cross-sectional view of the distal end side of the endoscope insertion section, and FIG.

As shown in FIG. 5, the endoscope 1 has an elongated and flexible insertion section 2 and a large-diameter operation section 3 connected to the rear end of the insertion section 2. A flexible universal cord 4 extends laterally from the operation unit 3, and a connector 5 is provided at an end of the universal cord 4. The connector 5 is connected to the light source device 21. A signal code 22 extends from the connector 5, and a connector 23 is provided at an end of the signal code 22. The connector 23 is connected to a video processor 24. The video processor 24 is connected to a monitor 25, a VTR deck 26, a video printer 27, a video disk 28, and the like.

The insertion portion 2 includes, in order from the distal end, a rigid distal end portion 7, a bendable bending portion 8, and a flexible tube 9 having flexibility.

As shown in FIG. 4, the distal end portion 7 is a distal component member.
10, and a tip cover 41 is attached to the tip component member 10. This tip component 10 and tip cover 41
Are provided with an illumination window, an observation window, an air supply / water supply port, and a forceps channel port.

A light distribution lens (not shown) is mounted inside the illumination window, and a light guide (not shown) made of a fiber bundle is connected to the rear end of the light distribution lens. The light guide is inserted through the insertion section 2, the operation section 3 and the universal cord 4 and connected to the connector 5. Then, illumination light emitted from a light source lamp in the light source device 21 is incident on an incident end of the light guide.

Further, inside the observation window, the imaging unit 30 including the objective optical system 43 and the solid-state imaging device 60 is provided. The solid-state imaging device 60 is provided with a CCD chip 61 and an I / O chip as shown in FIGS.
It has a C chip 66. The substrate 49 is attached to the solid-state
The signal line 32 is connected through the insertion section 2, the operation section 3, the universal cord 4, the connector 5, and the signal cord 22 to be connected to the connector 23. And the CCD
The chip 61 is driven by a video processor 24 connected via the connector 23, and an output signal of the CCD chip 61 is processed by the video processor 24 for a video signal. The video signal from the video processor 24, the monitor 25, VTR deck 26,
The data is input to a video printer 27, a video disk 28, and the like.

An air / water supply tube (not shown) is connected to the air / water supply port. The air / water supply tube is inserted through the insertion section 2, the operation section 3, and the universal cord 4, and is connected to the connector 5. A forceps channel tube 35 is connected to the forceps channel opening via a channel connection pipe 59. The forceps channel tube 35 is inserted through the insertion section 2 and connected to a forceps insertion port (not shown) provided in the operation section 3.

The bending portion 8 has a bending tube formed by connecting a large number of substantially cylindrical joint pieces 11, 12, ... so as to be rotatable about a joint shaft 13, and an outer peripheral portion of the bending tube has a curved rubber. Coated with 14. A flexible tube 9 is connected to the rear end of the rearmost joint piece.

For example, four angle wires 17 for bending operation are inserted into the insertion portion 2, and the distal end portion of the angle wire 17 is fixed to the foremost joint piece 11 by a wire guide 15. A wire receiver 18 is provided at a predetermined interval on the inner peripheral portion of the joint piece after the second joint piece 12 from the distal end side.
17 is inserted. The angle wire 17 is pushed and pulled by an angle operation knob provided on the operation section 3, whereby the bending section 8 is bent in the up / down / left / right directions.

 Next, the imaging unit 30 will be described in detail.

A first lens frame 42 is fixed to an observation through-hole formed in the distal end component 10 and the distal end cover 41 by an imaging unit fixing screw 33. On the first lens frame 42, an objective front lens 44 constituting an objective optical system 43 is mounted. A second lens frame 45 is fixed inside the first lens frame 42, and another lens system of the objective optical system 43 is mounted on the second lens frame 45. An element frame 47 is connected to a rear end of the second lens frame 45, and a solid-state imaging device 60 is fixed to the element frame 47. The substrate 49 on which the electronic component 50 is mounted is connected to the external leads 60a of the solid-state imaging device 60. The signal line 32 is connected to the board 49 via a cable fixing member 51. The signal line 32 is a coaxial cable, a cable core wire 52 is connected to the board 49, and a shield wire 54 is connected to the solid-state imaging device 60 and the board 49.
Is electrically connected to a shield member 56 that covers the cover with a conductive adhesive. In addition, the cable core wire 52, the shield wire 54
Are covered with an insulating tube 53 and a covering tube 55, respectively.

The outer periphery of the shield part 56 and the connection part of the cable 32 are covered with an insulating heat-shrinkable tube 57.

Next, the configuration of the solid-state imaging device 60 will be described with reference to FIGS.

The solid-state imaging device 60 has the CCD chip 61,
An insulating material 69 is attached to the back surface of the chip 61. An IC chip 66 is provided on the back side of the insulating material 69. As shown in FIG. 1, around the image area of the CCD chip 61, a plurality of bumps (protrusion electrodes) 63 for inputting and outputting signals to and from the outside are provided. These bumps 63
Are provided above, on the right side and on the left side of the image area of the CCD chip 61 in FIG. These bumps 63
The right and left bumps are for inputting and outputting signals to and from the IC chip 66, and the upper bumps are
This is for inputting and outputting signals to and from the outside without passing through the IC chip 66. On the right and left bumps 63. One end of the inner lead 62 is bonded. As shown in FIG. 1, this inner lead 62
CCD chip passing through the left and right sides in Fig. 2 of D chip 61
The other end is bent so as to be parallel to the back surface of the CCD chip 61. An inner lead / external lead 68 is bonded to the upper bump 63. This inner lead and external lead
The reference numeral 68 extends to the back side of the IC chip 66 through the upper side of the CCD chip 61 and the IC chip in FIG. 2, as shown in FIG. The extended portion of the lead 68 is the external lead 60a.

On the other hand, on the periphery of the surface of the IC chip 66 on the CCD chip 66 side,
Bumps 63 are provided at positions corresponding to the inner leads 62, that is, on the right and left sides in FIG. This bump 63 has an inner lead and an external lead 64
Is bonded at one end. As shown in FIG. 1, the inner lead / external lead 64 extends to the rear surface of the IC chip 66 through the left and right sides of the IC chip in FIG. The extension of this lead 64 is also an external lead
60a.

A bump 63 is provided on one of the opposing portions of the inner lead 612 on the CCD chip 61 side and the inner lead / external lead 64 on the IC chip 66 side. The leads 64 are electrically connected.

On the image area of the CCD chip 61, a cover glass 65 is fixed in a range exceeding the image area. The whole of the above components, except for the surface of the cover glass 65 and the portions that become the external leads 60a of the leads 64 and 68, is sealed with a light-shielding sealing resin 67.

The leads 62 and 64 are made of a metal foil such as a copper foil, and serve as lines for processing a signal from the CCD chip 61 by the IC chip 66. Some of the leads 62 do not actually exchange signals, and the leads 64 connected to the dummy 62 input and output signals to and from the IC chip 66. The lead 68 is a line for directly driving the CCD chip 61 without passing through the IC chip 61.

Note that the number of lines connected to the CCD chip 61 and the IC chip 66 is not limited to the illustrated one, and may be increased or decreased.

Next, a method of assembling the solid-state imaging device 60 will be described.

First, the inner leads 62 are bonded to the CCD chip 61 by the bumps 63. Note that the insulating material 69 is
Add to 1. Next, an inner lead / external lead 64 is bonded to the IC chip 66 with the bump 63. next,
The CCD chip 61 and the IC chip 66 are face-bonded with the bumps 63. At this time, the inner lead 62 and the inner lead / external lead 64 are connected by the bump 63.
Next, the cover glass 65 is fixed in a range exceeding the image area of the CCD chip 61. Next, the assembly assembled in the steps so far is entirely sealed with a sealing resin 67.

As described above, according to the present embodiment, the solid-state imaging device 60 is miniaturized by connecting the CCD chip 61 and the IC chip 66 by face bonding. Further, an inner lead 62 for making an electrical connection between the CCD chip 61 and the IC chip 66 and an inner lead / external lead 68 extended from the CCD chip 61 without passing through the IC chip 66 are connected to the CCD.
Since they are arranged on different sides of the chip 61 and the IC chip 66, the size of the solid-state imaging device 60 can be reduced as compared with the case where the leads 62 and 68 are arranged on the same side. If the leads 62 and 68 are arranged on the same side, the side on which these leads 62 and 68 are arranged becomes long.

6 and 7 relate to a second embodiment of the present invention.
The figure is a sectional view of the solid-state imaging device, and FIG. 7 is a plan view of the solid-state imaging device.

As shown in FIG. 6, the solid-state imaging device 60 according to the present embodiment includes:
Base member made of ceramic, glass epoxy, etc.
It has a CCD chip 61 bonded and fixed on 72. This C
A plurality of bumps 70 are provided on the right and left sides of the image area of the CD chip 61 in FIG. Inner leads 71 are bonded to the bumps 70.
Connection leads 73 are fixed to the left and right sides of the base member 62 in FIG. 7 by brazing or the like. The upper end of the lead 73 in FIG.
Are electrically connected by a bonding agent 74 such as solder or conductive adhesive. The connection lead 73 is a base member.
The base member 72 extends to the rear surface side and is bent so as to be parallel to the rear surface of the base member 72.

An IC chip 66 is provided on the back surface of the base member 72. On the surface of the IC chip 66 on the side of the CCD chip 66, a plurality of bumps 75 are provided on the left and right in FIG.
A plurality of bumps 76 are provided above and below in FIG. The connection lead 73 is bonded to the bump 75. One end of an inner lead / external lead 64 is bonded to the bump 76.
This inner lead / external lead 64 is the seventh chip of the IC chip.
The lead 64 extends through the upper and lower sides in the figure to the back side of the IC chip 66.
It has become.

On the image area of the CCD chip 61, a cover glass 65 is adhered and fixed in a range exceeding the image area. The whole of the above components, except for the surface of the cover glass 65 and the portion that becomes the external lead 60a of the lead 64, is sealed with the light-shielding sealing resin 67.

The connection lead 73 is an inner lead / external lead 64
It is thicker than it is. The bumps 70, 75,
Reference numeral 76 is made of solder, copper, aluminum, gold, or the like. The leads 64, 71, 73 are made of copper, gold, Kovar, or the like.

Next, a method of assembling the solid-state imaging device 60 will be described.

First, the bumps 70 are formed on the CCD chip 61. Next, an inner lead 71 is bonded to the bump 70. Next, cover glass 65 is placed on the image area of CCD chip 61.
Adhesively fixed. Next, the connection lead 73 is fixed to the base member 72 by brazing or the like. Next, the CCD chip 61 is adhesively fixed on the base member 72. Next, the inner lead 71 and the connection lead 73 are joined with the joining agent 74. Next, bumps 75 and 76 are provided on the IC chip 66 at the same time. The bumps 75 and the bumps 76 are of the same type, and are provided only at different positions. Next, an inner lead / external lead 64 is bonded to the bump 76. At this point, the leads 64 extend to the side of the IC chip 66. Next, connection leads 73 are bonded to the bumps 76. Next, the inner and external leads 64 are bent toward the back surface of the IC chip 66. Next, the assembly assembled in the steps so far is entirely sealed with a sealing resin 67.

Other configurations, operations and effects are the same as those of the first embodiment.

Here, an example of a method for manufacturing a solid-state imaging device will be described with reference to FIG.

As shown in FIG. 8 (a), a CCD 81 as a solid-state imaging device in this example has a bonding pad 82 on the upper side, for example, on the right side, and an insulating material 83 is adhered and fixed to the rear and right sides. ing. On the other hand, an inner lead 84 connected to the bonding pad 82 is provided on a reinforcing material (base film) 85, and
It has been extended from 86. A bump 86 is provided at an end of one surface of the extension of the inner lead. An external lead 87 made of Kovar or the like is attached to the other surface of the extension of the inner lead 84.

Then, as shown in FIG. 8 (b), after the pump 86 of the inner lead 84 is bonded to the bonding pad 82 of the CCD 81, the inner lead 84 is positioned at reference numeral 89.
Cut 84 and remove reinforcement 85. Next, FIG. 8 (c)
As shown in (5), the inner lead 84 is bent on the right side and the back side of the CCD 81, and the outer lead 87 is positioned on the back side of the CCD 81. Finally, as shown in FIG. 8 (d), the outer lead 87 is sealed with a sealing resin 88 except for a portion to be a lead foot.

By manufacturing the solid-state imaging device by such a method, it is possible to reduce the size of the solid-state imaging device and to improve the assemblability.

Next, referring to FIG. 9 and FIG.
An example of a miniaturized solid-state imaging device having a chip will be described.

FIG. 9 is a plan view of the solid-state imaging device, and FIG. 10 is a cross-sectional view of the solid-state imaging device.

In this example, a CCD chip 91 is bonded and fixed on an insulating material 99, and a plurality of bumps 93 are provided on the side of the image area 101 of the CCD chip 91. One end of an inner lead 92 is bonded to the bump 93. This inner lead 92 extends to the back side of the CCD chip 61 through the left and right sides of the CCD chip 61 in FIG.
It is bent so as to be parallel to the back surface of the CD chip 61. On the back side of the CCD chip 91, an IC chip 96 smaller than the CCD chip 91 is provided. This IC chip 96
Is bonded to the other end of the inner lead 92 via a bump 93. A pin grid 100 is electrically and mechanically connected to the bottom surface of the CCD chip 91 on the side of the IC chip 96, and the pin grid 100 forms an external lead. Also, CCD chip 91
On the image area 101, a cover glass 95 is fixed in a range exceeding the image area 101. The whole of the above components, except for the surface of the cover glass 95 and the portion of the pin grid 100 that becomes the lead foot, is sealed with the light-shielding sealing resin 97.

With such a configuration, the size of the solid-state imaging device is reduced.

Next, an example of a solid-state imaging device in which the transfer direction of a CCD pixel signal can be identified will be described with reference to FIGS. 11 and 12.

FIG. 11 is a plan view of the solid-state imaging device, and FIG. 12 is a cross-sectional view of the solid-state imaging device.

The solid-state imaging device of this example has substantially the same configuration as the example shown in FIGS. 9 and 10, except that the sealing resin 97 is color-coded in the vertical direction of the CCD 91.
In this example, the horizontal direction in FIG. 11 is the vertical direction in the CCD 91, and the pixel signal transfer direction is the direction indicated by the arrow 103 in FIG. In this example, the sealing resin 97 is color-coded at the vertical center of the CCD 91, the upper side of the CCD 91 is black sealing resin 97A, and the lower side is the blue sealing resin 9A.
7B. Reference numeral 104 in FIG. 12 indicates a weld line (joint of different color resins).

As described above, the sealing resin is color-coded in the vertical direction of the CCD 91, so that the pixel signal transfer direction 103 of the CCD 91 is changed.
Can be easily visually identified in appearance.

Note that the present invention is not limited to an electronic endoscope, and can be applied to various imaging devices.

[Effects of the Invention] As described above, according to the present invention, a solid-state imaging device
A first connection means for connecting the IC chip to the IC chip by face bonding, and further, a first connecting means for electrically connecting the solid-state imaging device and the IC chip, and a second connection extending from the solid-state imaging device without passing through the IC chip; Since the connecting means are arranged on different sides, there is an effect that the solid-state imaging device having the solid-state imaging device and the IC chip can be reduced in size.

[Brief description of the drawings]

1 to 5 relate to a first embodiment of the present invention.
The figure is a cross-sectional view of the solid-state imaging device, and is a cross-sectional view taken along line AA of FIG. 2, FIG. 2 is a plan view of the solid-state imaging device, FIG. 3 is a cross-sectional view taken along line BB of FIG. FIG. 5 is a sectional view of the distal end side of the endoscope insertion section, FIG. 5 is an explanatory view showing the entire endoscope system, and FIGS. 6 and 7 relate to a second embodiment of the present invention. 7 is a cross-sectional view of the solid-state imaging device, FIG. 7 is a plan view of the solid-state imaging device, FIGS. 8A to 8D are explanatory views showing an example of a method for manufacturing the solid-state imaging device, FIGS. 9 relates to an example of a miniaturized solid-state imaging device having a solid-state imaging device and an IC chip, FIG. 9 is a plan view of the solid-state imaging device, FIG. 10 is a cross-sectional view of the solid-state imaging device, and FIGS. The figure relates to an example of a solid-state imaging device in which the transfer direction of a CCD pixel signal can be identified. FIG. 11 is a plan view of the solid-state imaging device, and FIG. 12 is a cross-sectional view of the solid-state imaging device. 1 Endoscope, 60 Solid-state imaging device 61 CCD chip, 62 Inner lead 63 Bump, 66 IC chip 68 Inner lead and external lead

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroshi Hasegawa 2-43-2 Hatagaya, Shibuya-ku, Tokyo O-limpus Optical Industry Co., Ltd. (72) Inventor Hiromasa Suzuki 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 25/04

Claims (1)

(57) [Claims] 1. A solid-state imaging device, an IC chip connected to the solid-state imaging device by face bonding,
A first connection unit for performing an electrical connection between the solid-state imaging device and the IC chip, and a second connection unit extending from the solid-state imaging device without passing through the IC chip, The solid-state imaging device according to claim 1, wherein the first connection means and the second connection means are arranged on different sides of the solid-state imaging device and the IC chip.