JP2818733B2 - Wiring flooring - Google Patents
Wiring flooringInfo
- Publication number
- JP2818733B2 JP2818733B2 JP6229758A JP22975894A JP2818733B2 JP 2818733 B2 JP2818733 B2 JP 2818733B2 JP 6229758 A JP6229758 A JP 6229758A JP 22975894 A JP22975894 A JP 22975894A JP 2818733 B2 JP2818733 B2 JP 2818733B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- base material
- intermediate layer
- substrate
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009408 flooring Methods 0.000 title claims description 25
- 239000000463 material Substances 0.000 claims description 128
- 239000010410 layer Substances 0.000 claims description 79
- 239000000758 substrate Substances 0.000 claims description 37
- 239000011229 interlayer Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 description 25
- 239000004745 nonwoven fabric Substances 0.000 description 22
- 239000000203 mixture Substances 0.000 description 12
- 229920000728 polyester Polymers 0.000 description 12
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 239000000123 paper Substances 0.000 description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000002759 woven fabric Substances 0.000 description 4
- 238000013329 compounding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920003043 Cellulose fiber Polymers 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Installation Of Indoor Wiring (AREA)
- Floor Finish (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、カーペット類と床面と
の間に介装されてケーブルを配線するために使用される
配線用床材の改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a wiring floor material which is interposed between a carpet and a floor and used for wiring a cable.
【０００２】[0002]
【従来の技術】従来、床面に接着する一方の面に樹脂シ
ートを貼着し、他方の面に粘着剤層を介して離型紙を積
層した緩衝材を有する、ケーブルを配線するために使用
される床材が、例えば特開平４−２８１９５６号公報に
より提案されている。2. Description of the Related Art Conventionally, a resin sheet is adhered to one surface to be adhered to a floor surface and a release material is laminated on the other surface via an adhesive layer. For example, Japanese Patent Application Laid-Open No. 4-281956 proposes a floor material to be used.
【０００３】この床材は、カーペットの敷設にあたって
離型紙面から所定の深さをもって緩衝材に所望の幅で平
行な２本の切断線を入れ、この切断線間の緩衝材を取り
去ってケーブル配線用の溝を形成するものである。When laying a carpet, two parallel cutting lines of a desired width are inserted into the cushioning material at a predetermined depth from the release paper when the carpet is laid, and the cushioning material between the cutting lines is removed to perform cable wiring. To form a groove for use.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、かかる
従来の配線用床材は、緩衝材全体が同一の材質（例えば
ポリウレタン）からなるため、平行な２本の切断線間の
緩衝材を取り去る際に、たとえ切断線に沿った切込み深
さが一定である場合にも、取り去る緩衝材の厚さを規制
することができず、長さ方向に均一な底面深さをもつ溝
を形成することは不可能であった。また、切断線間から
取り去る緩衝材が細く強力が低い場合には、同緩衝材を
取り去る際に簡単に切れてしまうため、溝形成の作業を
極めて面倒にしているという問題もあった。However, in such a conventional wiring floor material, since the entire cushioning material is made of the same material (for example, polyurethane), it is difficult to remove the cushioning material between two parallel cutting lines. However, even if the cutting depth along the cutting line is constant, the thickness of the cushioning material to be removed cannot be regulated, and it is impossible to form a groove having a uniform bottom depth in the length direction. It was possible. In addition, when the cushioning material to be removed from between the cutting lines is thin and low in strength, the cushioning material is easily cut off when the cushioning material is removed, so that there is a problem that the work of forming the groove is extremely troublesome.
【０００５】本発明は、かかる従来の問題点を解消し、
所望の幅と深さとを有する配線用溝を極めて容易に且つ
確実に形成することができるケーブル配線用床材の提供
を課題とするものである。[0005] The present invention solves such a conventional problem,
It is an object of the present invention to provide a flooring material for cable wiring in which a wiring groove having a desired width and depth can be formed very easily and reliably.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記課題を解
決するために以下の手段を採用する。すなわち、本発明
はシート状基材に形成される配線用溝の底部に対応する
基材内部に、少なくとも上面を同基材から容易に剥離し
得る程度に弱く接着したシート状物からなる中間層を少
なくとも１層介在させ、且つ基材上面から、中間層の少
なくとも上面に達する深さの切り込み線を、予め適宜間
隔をおいて縦方向及び／又は横方向に複数本設けた配線
用床材を第１番目の要旨とし、また、シート状基材に形
成される配線用溝の底部に対応する基材内部に、下面が
同基材から容易に剥離し得る程度に弱く接着されると共
に、上面が下面よりも基材に対し強く接着されたシート
状物からなる中間層を、少なくとも１層介在させ、且つ
基材上面から、中間層の少なくとも下面に達する深さの
切り込み線を、予め適宜間隔を置いて縦方向及び／又は
横方向に複数本設けた配線用床材を第２番目の要旨と
し、更に、シート状基材に形成される配線用溝の底部に
対応する基材内部に、容易に層間剥離し得る積層シート
状物からなり、且つその上面及び下面が積層シート状物
の層間接着より強く基材に接着された中間層を、少なく
とも１層介在させ、且つ基材上面から、少なくとも中間
層の層間に達する深さの切り込み線を、予め適宜間隔を
置いて縦方向及び／又は横方向に複数本設けた配線用床
材を第３番目の要旨とし、また、シート状基材に形成さ
れる配線用溝の底部に対応する基材位置で、同基材が上
下に分割され、上部基材と下部基材とが相互に容易に剥
離し得る程度に直接弱く接着されてなり、好ましくは上
部基材の上面から、下部基材の少なくとも上面に達する
深さの切り込み線を縦方向及び／又は横方向に適宜間隔
を置いて複数本設けた配線用床材を第４番目の要旨とす
るものである。The present invention employs the following means to solve the above-mentioned problems. That is, the present invention provides an intermediate layer made of a sheet-like material that is weakly adhered to the inside of the base corresponding to the bottom of the wiring groove formed in the sheet-like base at least so that the upper surface can be easily peeled off from the base. the interposed at least one layer, and the substrate top surface, at least reach the upper surface the depth of score lines of the intermediate layer, the longitudinal and / or transverse to the plurality of arranged wiring flooring at a previously appropriate intervals The first aspect is that the lower surface is weakly adhered to the inside of the base material corresponding to the bottom of the wiring groove formed in the sheet-shaped base material so that the lower surface can be easily peeled off from the base material. An intermediate layer made of a sheet-like material that is more strongly adhered to the substrate than the lower surface, at least one layer is interposed, and a cut line having a depth from the upper surface of the substrate to at least the lower surface of the intermediate layer is formed. At appropriate intervals in the longitudinal direction and / or Is a second gist of a plurality of wiring floor materials provided in the lateral direction, and furthermore, a laminate that can be easily delaminated inside the base material corresponding to the bottom of the wiring groove formed in the sheet-like base material. At least one intermediate layer made of a sheet-like material and having its upper surface and lower surface adhered to the substrate more strongly than the interlayer adhesion of the laminated sheet-like material is interposed, and reaches at least the interlayer of the intermediate layer from the upper surface of the substrate. A third aspect is a wiring floor material in which a plurality of cut lines having a depth are provided in advance in a vertical direction and / or a horizontal direction at appropriate intervals, and a wiring groove formed in a sheet-like base material. At the position of the base material corresponding to the bottom of the base material, the same base material is divided into upper and lower parts, and the upper base material and the lower base material are directly and weakly adhered to each other so that they can be easily separated from each other. A score line that extends from the upper surface to at least the upper surface of the lower substrate The fourth gist is a wiring flooring material in which a plurality of wiring floors are provided at appropriate intervals in the vertical and / or horizontal directions.
【０００７】[0007]
【作用】以下本発明を作用と共に図に基づいて詳細に説
明する。図１は本発明の第１番目の要旨に係わる配線用
床材の一例を示す断面図、図２はその平面図であり、こ
れらの図において符号１はシート状の基材、符号２はシ
ート状物からなる中間層、符号３は基材１の形態を保持
するため基材１の一面に積層される中間層２と同様の材
質をもつ支持材（この支持材の使用は必須ではない）で
ある。The operation of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing an example of a wiring floor material according to the first aspect of the present invention, and FIG. 2 is a plan view thereof. In these figures, reference numeral 1 denotes a sheet-like base material, and reference numeral 2 denotes a sheet. Reference numeral 3 denotes a support having the same material as that of the intermediate layer 2 laminated on one surface of the substrate 1 to maintain the shape of the substrate 1 (use of the support is not essential). It is.
【０００８】基材１の材質は、中間層の上部と下部とで
異なっていても同じでもよく、またその種類は中間層の
上部の基材は溝の切り込みが容易に形成できるものでな
ければならないが、中間層の下部の基材は溝の切り込み
を形成する必要がないので特に限定されず、樹脂、ゴ
ム、木材、金属及びその他の各種無機材料等何れも使用
可能である。なお、上部下部共ポリ塩化ビニル（ＰＶ
Ｃ）、ポリウレタン、エチレン−酢酸ビニル共重合体等
の合成樹脂及び各種廃棄物から分離再生したこれらの合
成樹脂の再生品並びにこれらの発泡体が好適に用いられ
る。The material of the base material 1 may be different or the same between the upper and lower portions of the intermediate layer. The type of the base material is such that the groove on the upper portion of the intermediate layer cannot be easily formed. However, the base material under the intermediate layer is not particularly limited because it is not necessary to form grooves, and any of resin, rubber, wood, metal, and other various inorganic materials can be used. The upper and lower parts are made of polyvinyl chloride (PV
C), synthetic resins such as polyurethane and ethylene-vinyl acetate copolymer, and regenerated products of these synthetic resins separated and regenerated from various wastes, and foams thereof are suitably used.
【０００９】中間層を構成するシート状物としては、不
織布、織物、編物、紙、フィルム（離型剤又は接着剤を
塗布して形成される膜を含む）及び薄板等いずれも使用
可能であり、溝の切り込み形成時にその下部まで切り込
む必要のない場合はその材質も特に限定されない。As the sheet-like material constituting the intermediate layer, any of nonwoven fabric, woven fabric, knitted fabric, paper, film (including a film formed by applying a release agent or an adhesive), and a thin plate can be used. If it is not necessary to cut all the way into the groove when forming the cut, the material is not particularly limited.
【００１０】中間層２は、基材１の内部において、形成
される配線用溝の底部に対応する位置に配置されると共
に、その上面を基材１と容易に剥離し得る程度に弱く接
着しており、他方下面は、上面と同様に基材１に対して
弱く接着していても、或いは上面より強く接着していて
も差し支えない。The intermediate layer 2 is disposed inside the substrate 1 at a position corresponding to the bottom of the wiring groove to be formed, and has its upper surface weakly adhered to the substrate 1 to such an extent that it can be easily peeled off. On the other hand, the lower surface may be weakly adhered to the substrate 1 similarly to the upper surface, or may be more strongly adhered to the upper surface.
【００１１】かかる中間層２としては、基材１と接着性
の小さいシート状物、例えば基材をポリ塩化ビニルで構
成した場合は、ガラス繊維、セルロース繊維、ポリエス
テル繊維、ポリオレフィン繊維、又はポリアミド繊維等
単独又はこれらを２種以上混合した繊維布帛（不織布、
織物、編物等）、及びポリエステル、ポリオレフィン、
ポリアミド等のフィルム、並びに公知の離型紙等が好適
に用いられる。また中間層として予め形成されたシート
状物を用いないで、下部基材の上面に離型剤又は基材に
対して接着力の弱い接着剤を塗布し、その上に上部基材
を積層して両者間に離型剤又は接着剤の薄膜からなる中
間層を形成する方法も好ましい方法である。The intermediate layer 2 is a sheet-like material having low adhesiveness to the substrate 1, for example, when the substrate is made of polyvinyl chloride, glass fiber, cellulose fiber, polyester fiber, polyolefin fiber, or polyamide fiber. Or a fiber cloth (nonwoven fabric, non-woven fabric,
Fabrics, knits, etc.), polyesters, polyolefins,
Films such as polyamide and known release papers are suitably used. Also, without using a sheet-like material formed in advance as an intermediate layer, a release agent or an adhesive having a low adhesive strength to the base material is applied to the upper surface of the lower base material, and the upper base material is laminated thereon. A method of forming an intermediate layer comprising a thin film of a release agent or an adhesive between the two is also a preferable method.
【００１２】このように構成された床材を用いて配線用
溝を形成する方法について説明すると、図１及び図２の
例では、基材１の上面から中間層２の上面に達するまで
の４本一組の平行な切り込み線４、５が所定の間隔をも
って予めそれぞれ縦横に切り込まれている。縦方向に細
い配線用溝を形成する場合は、図３の左側に示すよう
に、４本の切り込み線４のうち、内側２本の切り込み線
４間に存在する基材１の一部１ａを引き剥すと、中間層
２の上面は基材１から容易に剥離し得る程度に弱く接着
されているため、該基材１の引き剥される部分１ａは中
間層２の上面から僅かな力で簡単に引き剥され、それに
よって所望の幅と深さとを有する配線用溝６を均整に形
成することができる。A method of forming a wiring groove using the floor material thus configured will be described. In the example shown in FIGS. 1 and 2, the wiring groove from the upper surface of the base material 1 to the upper surface of the intermediate layer 2 is formed. The set of parallel cutting lines 4 and 5 are cut in advance vertically and horizontally at predetermined intervals. In the case where a thin wiring groove is formed in the vertical direction, as shown on the left side of FIG. 3, a part 1a of the substrate 1 existing between the two inner cut lines 4 among the four cut lines 4 is removed. When peeled off, the upper surface of the intermediate layer 2 is weakly adhered to the substrate 1 so that it can be easily peeled off. The wiring groove 6 having the desired width and depth can be uniformly formed by being easily peeled off.
【００１３】なお、中間層２の下面も上面と同様に基材
１と弱く接着している場合は、切り込み線４を中間層２
の下面に達する切り込み深さとしておけば、基材の一部
１ａを中間層２の下面から該中間層２の一部と共に引き
剥がすことが可能となり、また、基材の一部１ａを中間
層２の上面から引き剥がす場合は、前記切り込み線４の
深さは中間層２の上面に達する深さとすることで対応で
きる。If the lower surface of the intermediate layer 2 is also weakly adhered to the substrate 1 like the upper surface, the cut line 4 is
If the cutting depth reaches the lower surface of the intermediate layer 2, a part 1a of the base material can be peeled off from the lower surface of the intermediate layer 2 together with a part of the intermediate layer 2, and the part 1a of the base material can be separated from the intermediate layer 2. 2 can be dealt with by setting the depth of the cut line 4 to a depth reaching the upper surface of the intermediate layer 2.
【００１４】また、太い配線用の溝を形成する場合は、
図３の右側に示すように、４本の切り込み線４に沿った
切り込みのうち、外側の２本の切り込み線４間に存在す
る基材１の一部１ｂを中間層２の上面（又は下面）から
引き剥すことによって、上述の場合と同様に、容易且つ
確実に所定の幅と深さとを有する配線用溝７を均整に形
成することができる。In the case of forming a thick wiring groove,
As shown on the right side of FIG. 3, of the cuts along the four cut lines 4, a part 1 b of the substrate 1 existing between the two outer cut lines 4 is attached to the upper surface (or lower surface) of the intermediate layer 2. ), The wiring groove 7 having a predetermined width and depth can be easily and reliably formed in a uniform manner as in the above-described case.
【００１５】なお、予め設ける切り込み線４の数を５本
以上とすることにより、溝幅の選定範囲を更に広げるこ
とが可能であり、また、図４に示す如く中間層２，２′
を２層とすれば、溝の深さも、中間層２までの浅い溝と
中間層２′までの深い溝との何れかを適宜選定して形成
することが可能であり、更に中間層の数を３層以上にし
て、溝深さの選定範囲を更に広げることも可能である。
この場合、複数の中間層２，２′の上下における基材１
の色を変えておけば、中間層の位置と数を容易に判断す
ることができる。By setting the number of cut lines 4 provided in advance to 5 or more, it is possible to further widen the selection range of the groove width, and as shown in FIG. 4, the intermediate layers 2 and 2 '.
Is formed into two layers, the depth of the groove can be formed by appropriately selecting either a shallow groove up to the intermediate layer 2 or a deep groove up to the intermediate layer 2 '. Can be made three or more layers to further widen the selection range of the groove depth.
In this case, the base material 1 above and below the plurality of intermediate layers 2, 2 '
If the color of is changed, the position and number of the intermediate layer can be easily determined.
【００１６】また、図５の右上に示す如く、縦横の配線
用溝を交差するように設ければ、ケーブル８を交差溝に
沿って屈曲して配線することも可能である。この場合
に、縦横の交差部における隅部９を斜めに切り込んで、
該隅部９の３角部分も引き剥がして取り除けば、ケーブ
ル８を容易に屈曲配線することができるようになる。If the vertical and horizontal wiring grooves are provided so as to cross each other as shown in the upper right of FIG. 5, the cable 8 can be bent by being bent along the crossing grooves. In this case, the corner 9 at the vertical and horizontal intersection is cut diagonally,
If the triangular portion of the corner 9 is also peeled off and removed, the cable 8 can be easily bent and wired.
【００１７】[0017]
【００１８】図６は、本発明の第２番目の要旨に係わる
配線用床材を用いて、配線用溝を形成する場合の一例を
示す配線用床材の断面図であり、同図の配線用床材にお
いては、切り込み線４を中間層２の下面に達する深さに
まで切り込むものであり、しかも中間層２の下面を基材
１と容易に剥離し得る程度に弱く接着すると共に、中間
層２の上面を下面よりも基材１に対して強く接着させて
いるため、基材１の一部１ａ、１ｂを引き剥がすと、こ
れら基材１の一部１ａ、１ｂはその下面に中間層２の一
部を付着させたまま引き剥がされることになる。こうし
て、引き剥がされる基材１の一部１ａ、１ｂは、中間層
２の一部によって補強された状態で中間層２の下面から
僅かの力で引き剥がされるため、たとえこれら基材１の
一部１ａ，１ｂが細くて強力の低いものであったとして
も、引き剥がす際に切断されることなく、配線用溝を迅
速且つ確実に形成することができるという利点をもつ。FIG. 6 is a cross-sectional view of a wiring floor material showing an example in which a wiring groove is formed using the wiring floor material according to the second aspect of the present invention. In the flooring material for use, the score line 4 is cut to a depth reaching the lower surface of the intermediate layer 2, and the lower surface of the intermediate layer 2 is weakly adhered to the substrate 1 so as to be easily peeled off. Since the upper surface of the layer 2 is more strongly adhered to the substrate 1 than the lower surface, when the portions 1a and 1b of the substrate 1 are peeled off, the portions 1a and 1b of the substrate 1 It will be peeled off with a part of the layer 2 attached. In this way, the parts 1a and 1b of the substrate 1 to be peeled off are peeled off with a small force from the lower surface of the intermediate layer 2 in a state where they are reinforced by a part of the intermediate layer 2; Even if the portions 1a and 1b are thin and low in strength, there is an advantage that the wiring groove can be formed quickly and reliably without being cut when peeling.
【００１９】なお、中間層２の下面を基材から容易に剥
離し得る程度に弱く接着させると共に、その上面を下面
より基材１に対して強く接着させる具体的な方法として
は、例えば基材１をポリ塩化ビニルで構成した場合に
は、ポリエステル、ポリオレフィン、若しくはポリアミ
ド等の繊維７０％とポリビニルアルコールからなるバイ
ンダー繊維３０％とからなる混合不織布を用いると共
に、その不織布構造をバインダー繊維が不織布の上面に
多量偏在するようにするか、或いは上記繊維１００％か
らなる不織布を用いて片面エンボス加工を施し、下面を
平坦なフィルム状にすると共に上面に凹凸を施して、上
面における基材樹脂との接着面積及びアンカー効果を大
きくするとか、上記繊維１００％からなる不織布や、ポ
リエステル、ポリオレフィン、若しくはポリアミド等の
フィルム又は薄板の下面に離型剤を塗布するとか、下面
にのみ離型剤を塗布した離型紙を用いる等の各種の方法
を挙げることができる。As a specific method of bonding the lower surface of the intermediate layer 2 weakly to such an extent that the intermediate layer 2 can be easily peeled off from the substrate and bonding the upper surface thereof to the substrate 1 more strongly than the lower surface, for example, When 1 is composed of polyvinyl chloride, a mixed nonwoven fabric composed of 70% of fibers such as polyester, polyolefin, or polyamide and 30% of binder fibers composed of polyvinyl alcohol is used, and the nonwoven fabric has a structure in which the binder fibers are formed of a nonwoven fabric. Either a large amount is unevenly distributed on the upper surface, or a single-sided embossing process is performed using a nonwoven fabric made of 100% of the above-mentioned fibers, the lower surface is formed into a flat film shape, and the upper surface is unevenly formed. To increase the bonding area and anchor effect, or to use a non-woven fabric made of 100% of the above fibers, polyester, or polyolefin Fin, or Toka applied to the lower surface of the film or sheet such as a polyamide release agent, it may be mentioned various methods such as using a release paper coated with only release agent to the lower surface.
【００２０】図７は、本発明の第３番目の要旨に係わる
配線用床材を用いて、配線用溝を形成した場合の一例を
示す配線用床材の断面図であり、同図の配線用床材にお
いては、中間層２は、容易に層間剥離し得る上層２ａと
下層２ｂとを積層したシート状物からなり、且つその上
面及び下面が積層シート状物の層間接着より強く基材１
に接着されていると共に、切り込み線４，５に沿って基
材１の上面から中間層２の層間に達する深さの切り込み
が形成されているので、基材の一部１ａ、１ｂを引き剥
がすと、これら１ａ、１ｂはその下面に中間層２の上層
２ａの一部が付着したまま、この上層２ａの一部により
補強された状態で上層と下層との積層面から僅かの力で
引き剥がされるから、この場合も図６の例と同様に、１
ａ及び１ｂが細くて強力の低いものであっても、引き剥
がす際に切断されることがなく、配線用溝を迅速且つ確
実に形成することができるという効果を奏する。FIG. 7 is a cross-sectional view of a wiring floor material showing an example in which a wiring groove is formed using the wiring floor material according to the third aspect of the present invention. In the flooring material, the intermediate layer 2 is made of a sheet-like material in which an upper layer 2a and a lower layer 2b that can be easily delaminated are laminated, and the upper surface and the lower surface thereof are stronger than the interlayer adhesion of the laminated sheet-like material.
And a cut is formed along the cut lines 4 and 5 from the upper surface of the base material 1 to a depth reaching between the layers of the intermediate layer 2, so that a part 1a and 1b of the base material is peeled off. These parts 1a and 1b are peeled off from the laminated surface of the upper layer and the lower layer with a small force while the upper layer 2a is partially reinforced while the part of the upper layer 2a is adhered to the lower surface thereof. Therefore, in this case, as in the example of FIG.
Even if a and 1b are thin and low in strength, they are not cut off when peeled off, so that the effect that the wiring groove can be formed quickly and reliably can be obtained.
【００２１】また、この場合の中間層２を構成する積層
シート状物としては、例えば基材１をポリ塩化ビニルで
構成した場合は、ガラス繊維、セルロース繊維、ポリエ
ステル繊維、ポリオレフィン繊維、ポリアミド繊維等単
独又はこれらを２種以上混合した繊維と、ポリビニルア
ルコールからなるバインダー繊維との混合不織布を２枚
軽度に積層接着した積層繊維不織布を使用すれば、該積
層繊維不織布の上面と下面は基材１を構成する樹脂と相
溶性の高いポリビニルアルコール樹脂からなるバインダ
ー繊維により基材１と強く接着するが、積層繊維不織布
の積層面は基材１を構成する樹脂とほとんど接触しない
ので、容易に層間剥離し得る状態に保持することができ
る。その他、軽度に融着させるか又は接着力の弱い接着
剤で軽度に接着させた２枚の不織布、織物、編物、紙、
フィルム、薄板等も好適に使用できる。In this case, as the laminated sheet material constituting the intermediate layer 2, for example, when the substrate 1 is made of polyvinyl chloride, glass fiber, cellulose fiber, polyester fiber, polyolefin fiber, polyamide fiber, etc. When a laminated nonwoven fabric obtained by lightly laminating and bonding two nonwoven fabrics of a single or a mixture of two or more of these and a binder fiber made of polyvinyl alcohol is used, the upper and lower surfaces of the laminated nonwoven fabric are made of a base material 1 Strongly adheres to the base material 1 by binder fibers made of polyvinyl alcohol resin having high compatibility with the resin constituting the base material. However, since the laminated surface of the laminated fiber non-woven fabric hardly comes into contact with the resin constituting the base material 1, it is easily delaminated. Can be maintained. In addition, two nonwoven fabrics, woven fabrics, knitted fabrics, papers, which are lightly fused or lightly bonded with an adhesive having a low adhesive strength,
Films, thin plates and the like can also be suitably used.
【００２２】図８は、本件の第４番目の要旨に係わる配
線用床材の一例を示す断面図であり、同図の配線用床材
においては、第１番目〜第３番目の発明において用いら
れているような中間層２が存在せず、上部基材１Ａと下
部基材１Ｂとが相互に容易に剥離し得る程度に直接接着
しており、且つ切り込み線４が上部基材の上面から下部
基材の上面に達する深さまで設けてあるので、基材の一
部１ａ及び１ｂを図３に示す場合と同様に引き剥がす
と、図９に示す如く１ａ及び１ｂは上部基材１Ａと下部
基材１Ｂとの界面から弱い力で容易に引き剥がすことが
できる。FIG. 8 is a cross-sectional view showing an example of a wiring flooring according to the fourth aspect of the present invention. In the wiring flooring shown in FIG. The upper substrate 1A and the lower substrate 1B are directly adhered to each other to such an extent that they can be easily separated from each other, and the cut line 4 is formed from the upper surface of the upper substrate. Since it is provided to the depth reaching the upper surface of the lower base material, when a part of the base material 1a and 1b is peeled off in the same manner as shown in FIG. 3, as shown in FIG. It can be easily peeled off from the interface with the substrate 1B with a weak force.
【００２３】上部基材１Ａと下部基材１Ｂとを容易に剥
離し得る程度に弱く直接接着させる具体的な方法として
は、例えば押出機から押し出された直後の樹脂製シート
状物又はカレンダーロールにて加熱圧延されている樹脂
製シート状物に他のシート状物を重ね合わせてプレスロ
ールにて両者を圧着させる方法が好適に利用できる。As a specific method for directly bonding the upper base material 1A and the lower base material 1B weakly to such an extent that the upper base material 1A and the lower base material 1B can be easily peeled off, for example, a resin sheet or a calender roll immediately after being extruded from an extruder is used. A method in which another sheet-like material is overlapped on a resin-made sheet-like material that has been hot-rolled, and both are pressure-bonded by a press roll can be suitably used.
【００２４】なお、本発明の配線用床材は、５０ｃｍ角
等のタイルカーペットと同じ大きさで使用することも、
或いは広幅、長尺のシート状物として使用することも可
能であり、更に本発明の配線用床材の上面に敷設するカ
ーペットとして、例えば特開昭６１−２７３３１５号公
報に開示されている自己粘着性タイルカーペットを用い
れば、配線からタイルカーペットの敷設までの作業を極
めて簡単に行うことが可能となる。また形成された溝
に、ケーブルを配線した後、カーペット上から加わる外
力に充分耐え得る強度を有する樹脂製又は金属製等のケ
ーブル保護カバーを被せておけば、カーペット上から加
わる外力によるケーブルの損傷を防止することができ
る。この場合のカバーの形状は、床材全体を覆う板状カ
バーであってもよいし、或いは図８に示すようなケーブ
ル８だけを覆う断面がコ字形のカバー１０であってもよ
く、また、配線用溝が交差する部分には、図１１及び図
１２に示す如き平面が八角形状で４本の脚部１２を有す
るカバー１１を用いることもできる。The wiring flooring material of the present invention may be used in the same size as a tile carpet of 50 cm square or the like.
Alternatively, it can be used as a wide and long sheet-like material. Further, as a carpet to be laid on the upper surface of the wiring floor material of the present invention, for example, a self-adhesive disclosed in JP-A-61-273315 is disclosed. Using a sex tile carpet makes it possible to extremely easily perform the operations from wiring to laying the tile carpet. In addition, if a cable protection cover made of resin or metal having sufficient strength to withstand the external force applied from the carpet is placed on the formed groove after the cable is wired, the cable may be damaged by the external force applied from the carpet. Can be prevented. In this case, the shape of the cover may be a plate-like cover that covers the entire flooring material, or a cover 10 having a U-shaped cross section that covers only the cable 8 as shown in FIG. At the portion where the wiring grooves intersect, a cover 11 having an octagonal plane and four legs 12 as shown in FIGS. 11 and 12 can be used.
【００２５】[0025]
【実施例】以下、本発明を実施例に基づいて更に具体的
に説明する。EXAMPLES Hereinafter, the present invention will be described more specifically based on examples.
【００２６】「実施例１」表面をテフロンコーティング
したガラス繊維織物からなるコンベアベルト上に、目付
６０ｇ／ｍ2 のポリエステル繊維不織布を支持材として
供給し、その上面に以下の組成からなる第１塩化ビニル
ゾルを２ｍｍの厚さに塗布し、その上面に前記支持材と
同一構造のポリエステル繊維不織布を中間層として供給
し、更にその上面に以下の組成からなる第２塩化ビニル
ゾルを５ｍｍ厚さに塗布して、熱処理装置内において、
温度２００℃、時間１０分の条件で加熱ゲル化した。Example 1 A polyester fiber nonwoven fabric having a basis weight of 60 g / m 2 was supplied as a support onto a conveyor belt made of a glass fiber fabric having a surface coated with Teflon, and a first chloride having the following composition was provided on the upper surface thereof. A vinyl sol is applied to a thickness of 2 mm, a polyester fiber nonwoven fabric having the same structure as the support material is supplied as an intermediate layer on the upper surface, and a second vinyl chloride sol having the following composition is further applied to the upper surface to a thickness of 5 mm. In the heat treatment apparatus,
It gelled by heating under the conditions of a temperature of 200 ° C. and a time of 10 minutes.
【００２７】 ［第１塩化ビニルゾル］ ［第２塩化ビニルゾル］ 塩化ビニル １００部 １００部 可塑剤（ＤＰＯ） ８８部 ９０部 炭酸カルシュウム ４００部 ４５０部 安定剤 １部 １部 顔料（カーボンブラック） ２部 顔料（酸化鉄とＤＯＰの ２部 混合物：レンガ色） このようにして形成された積層体を５０ｃｍ角に打ち抜
き、更に図１及び図２に示す如く縦横の溝形成用の切り
込み線４，５に沿って各々４本（切り込み線の間隔：１
０ｍｍ，１５ｍｍ，１０ｍｍ、深さ：５ｍｍ）切込み、
本発明の第１番目の要旨に係わる配線用床材を製造し
た。[First Vinyl Chloride Sol] [Second Vinyl Chloride Sol] Vinyl chloride 100 parts 100 parts Plasticizer (DPO) 88 parts 90 parts Calcium carbonate 400 parts 450 parts Stabilizer 1 part 1 part Pigment (carbon black) 2 parts Pigment (2 parts mixture of iron oxide and DOP: brick color) The laminate thus formed is punched into a 50 cm square, and further along the cut lines 4 and 5 for forming vertical and horizontal grooves as shown in FIGS. 1 and 2. 4 each (interval between cut lines: 1
0mm, 15mm, 10mm, depth: 5mm)
A wiring flooring according to the first aspect of the present invention was manufactured.
【００２８】得られた配線用床材を、配線現場において
図３に示す如く基材の一部１ａ，１ｂを引き剥がしたと
ころ、各々が中間層２の上面から僅かの力で簡単に引き
剥がされ、幅１５ｍｍ、深さ５ｍｍと、幅３５ｍｍ、深
さ５ｍｍとの均一な幅と深さを有する配線用溝６、７が
形成された。As shown in FIG. 3, the obtained wiring floor material was peeled off a part of the base material 1a, 1b at the wiring site, and each was easily peeled off from the upper surface of the intermediate layer 2 with a slight force. As a result, wiring grooves 6 and 7 having a uniform width and depth of 15 mm in width and 5 mm in depth, and 35 mm in width and 5 mm in depth were formed.
【００２９】「実施例２」中間層として、クラフト紙の
上面にシリコン樹脂を塗布した離型紙を用いる他は実施
例１と同様にして配線用床材を製造し、配線現場におい
て図３に示す如く基材の一部１ａ，１ｂを引き剥したと
ころ、各々が中間層２の上面から実施例１の場合よりも
更に小さい力で簡単に引き剥がされ、幅１５ｍｍ、深さ
５ｍｍと、幅３５ｍｍ、深さ５ｍｍとの均一な幅と深さ
を有する配線用溝６、７が形成された。Example 2 A flooring material for wiring was manufactured in the same manner as in Example 1 except that a release paper in which silicone resin was applied to the upper surface of kraft paper was used as the intermediate layer, and the wiring floor was shown in FIG. When the portions 1a and 1b of the base material were peeled off as described above, each of them was easily peeled off from the upper surface of the intermediate layer 2 with a smaller force than in the case of Example 1, and the width was 15 mm, the depth was 5 mm, and the width was 35 mm And wiring grooves 6 and 7 having a uniform width and depth of 5 mm.
【００３０】「実施例３」表面をテフロンコーティング
したガラス繊維織物からなるコンベアベルト上に、目付
６０ｇ／ｍ2 のポリエステル繊維不織布を支持材として
供給し、その上面に実施例１と同じ第１塩化ビニルゾル
を２ｍｍの厚さに塗布し、プレヒーターでその表面を加
熱してべたつかない程度にゲル化した後、その上面にシ
リコン樹脂をスプレー処理してシリコン樹脂の薄膜を中
間層として形成し、更にその上面に実施例１と同じ第２
塩化ビニルゾルを５ｍｍ厚さに塗布して、熱処理装置内
において、温度２００℃、時間１０分の条件で加熱ゲル
化した。Example 3 A polyester fiber nonwoven fabric having a basis weight of 60 g / m 2 was supplied as a support onto a conveyor belt made of a glass fiber woven fabric whose surface was coated with Teflon. After applying a vinyl sol to a thickness of 2 mm and heating the surface with a pre-heater to gel to a degree that does not stick, the silicon resin is sprayed on the upper surface to form a thin film of the silicon resin as an intermediate layer. On its upper surface, the second
The vinyl chloride sol was applied to a thickness of 5 mm, and gelled by heating at 200 ° C. for 10 minutes in a heat treatment apparatus.
【００３１】このようにして形成された積層体を用いて
実施例１と同様に配線用床材を製造し、配線現場におい
て図３に示す如く基材の一部１ａ，１ｂを引き剥したと
ころ、各々が中間層２の上面から実施例２の場合と同様
に小さい力で簡単に引き剥がされ、幅１５ｍｍ、深さ５
ｍｍと、幅３５ｍｍ、深さ５ｍｍとの均一な幅と深さを
有する配線用溝６、７が形成された。Using the laminate thus formed, a flooring material for wiring was manufactured in the same manner as in Example 1, and portions 1a and 1b of the base material were peeled off at the wiring site as shown in FIG. , Each of which is easily peeled off from the upper surface of the intermediate layer 2 with a small force as in the case of the second embodiment, and has a width of 15 mm and a depth of 5 mm.
The wiring grooves 6 and 7 having a uniform width and depth of 35 mm and a width of 35 mm and a depth of 5 mm were formed.
【００３２】「実施例４」表面をテフロンコーティング
したガラス繊維織物からなるコンベアベルト上に、目付
６０ｇ／ｍ2 のポリエステル繊維不織布を支持材として
供給し、その上に実施例１と同様の組成からなる上記第
１塩化ビニルゾルを２ｍｍの厚さに塗布し、その上面に
ポリエステル繊維７０％とポリビニルアルコール系繊維
３０％からなる混合不織布であって、上面側にポリビニ
ルアルコール系繊維の約８０％を偏在させた目付６０ｇ
／ｍ2 の不織布を中間層として供給し、更にその上面に
実施例１と同様の組成からなる上記第２塩化ビニルゾル
を５ｍｍ厚さに塗布して、熱処理装置内において、温度
２００℃、時間１０分の条件で加熱ゲル化した。Example 4 A polyester fiber nonwoven fabric having a basis weight of 60 g / m 2 was supplied as a support onto a conveyor belt made of a glass fiber woven fabric whose surface was coated with Teflon. The above-mentioned first vinyl chloride sol is applied to a thickness of 2 mm, and a mixed non-woven fabric comprising 70% of polyester fiber and 30% of polyvinyl alcohol-based fiber on the upper surface thereof, and about 80% of the polyvinyl alcohol-based fiber is unevenly distributed on the upper surface side. Weight 60g
/ M 2 of non-woven fabric as an intermediate layer, the above-mentioned second vinyl chloride sol having the same composition as in Example 1 was applied to a thickness of 5 mm on the upper surface thereof, and the temperature was set to 200 ° C. for 10 hours in a heat treatment apparatus. The mixture was gelled by heating under the conditions of minutes.
【００３３】このようにして形成された積層体を５０ｃ
ｍ角に打ち抜き、更に実施例１と同様に溝形成用の切り
込み線４，５に沿って各々４本（切り込み線の間隔：１
０ｍｍ、１５ｍｍ、１０ｍｍ）の切り込みを形成して、
本発明の第２番目の要旨に係わる配線用床材を製造し
た。The laminate thus formed was placed on a 50c
Punched into an m-square, and four each along the cut lines 4 and 5 for forming grooves (interval of cut lines: 1
0 mm, 15 mm, 10 mm)
A wiring flooring according to the second aspect of the present invention was manufactured.
【００３４】得られた配線用床材を配線現場において、
図６に示す如く、基材の一部１ａ，１ｂを引き剥したと
ころ、各々中間層２の一部と一体となって途中で破断す
ることなく僅かな力で簡単に引き剥がされ、幅１５ｍ
ｍ、深さ５ｍｍと、幅３５ｍｍ、深さ５ｍｍとの均一な
幅と深さを有する配線用溝６，７が形成された。At the wiring site, the obtained wiring floor material is used.
As shown in FIG. 6, when the parts 1a and 1b of the base material were peeled off, they were easily peeled off with a slight force without being broken on the way together with each part of the intermediate layer 2 and a width of 15 m.
The wiring grooves 6 and 7 having uniform widths and depths of m, a depth of 5 mm, a width of 35 mm, and a depth of 5 mm were formed.
【００３５】「実施例５」中間層として、クラフト紙の
下面にシリコン樹脂を塗布した離型紙を用いる他は実施
例４と同様にして配線用床材を製造し、図６に示す如く
基材の一部１ａ，１ｂを引き剥がしたところ、各々中間
層２の一部と一体となって途中で破断することなく実施
例４の場合よりも更に小さな力で簡単に引き剥がされ、
幅１５ｍｍ、深さ５ｍｍと、幅３５ｍｍ、深さ５ｍｍと
の均一な幅と深さを有する配線用溝６，７が形成され
た。Example 5 A flooring material for wiring was manufactured in the same manner as in Example 4 except that a release paper in which a silicone resin was applied to the lower surface of kraft paper was used as an intermediate layer, and a base material as shown in FIG. When the parts 1a and 1b are peeled off, they are easily peeled off together with a part of the intermediate layer 2 with a smaller force than in the case of Example 4 without being broken on the way.
Wiring grooves 6 and 7 having a uniform width and depth of 15 mm in width and 5 mm in depth, and 35 mm in width and 5 mm in depth were formed.
【００３６】「実施例６」表面をテフロンコーティング
したガラス繊維織物からなるコンベアベルト上に、目付
６０ｇ／ｍ2 のポリエステル繊維不織布を支持材として
供給し、その上面に実施例１と同様の組成からなる上記
第１塩化ビニルゾルを２ｍｍの厚さに塗布し、その上面
にポリエステル繊維７０％とポリビニルアルコール系繊
維３０％からなる目付６０ｇ／ｍ2 の混合不織布を２枚
積層した積層不織布を中間層として供給し、更にその上
に実施例１と同様の組成からなる上記第２塩化ビニルゾ
ルを５ｍｍ厚さに塗布して、熱処理装置内で、温度２０
０℃、時間１０分の条件で加熱ゲル化した。Example 6 A polyester fiber nonwoven fabric having a basis weight of 60 g / m 2 was supplied as a support onto a conveyor belt made of a glass fiber fabric whose surface was coated with Teflon, and the same composition as in Example 1 was applied to the upper surface thereof. The above-mentioned first vinyl chloride sol is applied to a thickness of 2 mm, and a laminated non-woven fabric obtained by laminating two mixed non-woven fabrics having a basis weight of 60 g / m 2 composed of 70% of polyester fibers and 30% of polyvinyl alcohol-based fibers as an intermediate layer on the upper surface thereof. Then, the second vinyl chloride sol having the same composition as that of Example 1 was applied thereon to a thickness of 5 mm, and then heated at a temperature of 20 mm in a heat treatment apparatus.
It gelled by heating at 0 ° C. for 10 minutes.
【００３７】このようにして形成された積層体を５０ｃ
ｍ角に打ち抜き、更に実施例１と同様に溝形成用の切り
込み線４，５に沿って各々４本（切り込み線の間隔：１
０ｍｍ、１５ｍｍ、１０ｍｍ）切り込みを形成して、本
発明の第３番目の要旨に係わる配線用床材を製造した。The laminate thus formed is placed in a 50c
Punched into an m-square, and four each along the cut lines 4 and 5 for forming grooves (interval of cut lines: 1
(0 mm, 15 mm, 10 mm) cuts were formed to manufacture a wiring flooring according to the third aspect of the present invention.
【００３８】得られた配線用床材を配線現場において、
図７の如く基材１の一部１ａ，１ｂを引き剥がしたとこ
ろ、各々中間層の上層２ａの一部と一体となって途中で
破断することなく僅かな力で簡単に引き剥がされ、幅１
５ｍｍ、深さ５ｍｍと、幅３５ｍｍ、深さ５ｍｍとの均
一な幅と深さを有する配線用溝６，７が形成された。At the wiring site, the obtained wiring floor material is used.
As shown in FIG. 7, when the parts 1a and 1b of the base material 1 were peeled off, they were easily peeled off with a small force without breaking along the way together with a part of the upper layer 2a of the intermediate layer. 1
Wiring grooves 6 and 7 having uniform widths and depths of 5 mm, a depth of 5 mm, a width of 35 mm, and a depth of 5 mm were formed.
【００３９】「実施例７」下記物質及び配合比からなる
組成物を加熱混練した後カレンダーロールにて加熱圧延
し冷却して厚さ２ｍｍのシートを形成した。次いで同じ
組成物をカレンダーロールにて厚さ５ｍｍに加熱圧延し
ながら、先に形成した厚さ２ｍｍのシートと重ね合わせ
てプレスロールにて両者を圧着した。Example 7 A composition having the following substances and compounding ratios was heated and kneaded, then heated and rolled on a calender roll and cooled to form a sheet having a thickness of 2 mm. Next, while the same composition was heated and rolled to a thickness of 5 mm using a calender roll, the sheet was superimposed on the previously formed sheet having a thickness of 2 mm, and both were pressed with a press roll.
【００４０】このようにして形成された積層体を５０ｃ
ｍ角に打ち抜き、更に実施例１と同様に溝形成用の切り
込み線４，５に沿って各々４本（切り込み線の間隔：１
０ｍｍ、１５ｍｍ、１０ｍｍ）下部基材１Ｂに達する切
り込みを形成して、本発明の第４番目の要旨に係わる配
線用床材を製造した。The laminate thus formed was placed on a 50c
Punched into an m-square, and four each along the cut lines 4 and 5 for forming grooves (interval of cut lines: 1
(0 mm, 15 mm, 10 mm) A notch reaching the lower substrate 1B was formed to produce a wiring flooring according to the fourth aspect of the present invention.
【００４１】得られた配線用床材を配線現場において、
図１０の如く基材１の一部１ａ，１ｂを引き剥がしたと
ころ、各々上部基材１Ａと下部基材１Ｂとの界面から僅
かな力で簡単に引き剥がされ、幅１５ｍｍ、深さ５ｍｍ
と、幅３５ｍｍ、深さ５ｍｍとの均一な幅と深さを有す
る配線用溝６，７が形成された。At the wiring site, the obtained flooring material for wiring is used.
As shown in FIG. 10, when the parts 1a and 1b of the base material 1 were peeled off, they were easily peeled off from the interface between the upper base material 1A and the lower base material 1B with a slight force, and the width was 15 mm and the depth was 5 mm.
And wiring grooves 6 and 7 having a uniform width and depth of 35 mm in width and 5 mm in depth.
【００４２】塩化ビニル １００部 可塑剤（ＤＯＰ） ６０部 炭酸カルシウム ２００部 ステアリン酸バリウム ５部 カーボンブラック １部 「実施例８」下記物質及び配合比からなる組成物を押出
機に供給し、厚さ５ｍｍに押し出しながら実施例７で用
いたのと同じ厚さ２ｍｍのシートと重ね合わせ、プレス
ロールにて両者を圧着した。Vinyl chloride 100 parts Plasticizer (DOP) 60 parts Calcium carbonate 200 parts Barium stearate 5 parts Carbon black 1 part "Example 8" A composition comprising the following substances and a compounding ratio was supplied to an extruder, and the thickness was adjusted. While being extruded to 5 mm, the sheet was overlapped with a sheet having the same thickness of 2 mm as used in Example 7, and both were pressed by a press roll.
【００４３】このようにして形成された積層体を用い
て、実施例７と同様にして配線用床材を製造し、配線現
場において、実施例７と同様に配線用溝を形成したとこ
ろ、実施例７と同様に均一な幅と深さを有する配線用溝
６，７が形成された。Using the laminate thus formed, a wiring floor material was manufactured in the same manner as in Example 7, and a wiring groove was formed at the wiring site in the same manner as in Example 7. As in Example 7, wiring grooves 6 and 7 having uniform width and depth were formed.
【００４４】アタクチックポリプロピレン １００部 炭酸カルシウム ２００部 「実施例９」下記物質及び配合比からなる組成物を押出
機に供給し、厚さ５ｍｍに押し出し、その表面を再加熱
しながら、厚さ２ｍｍのケイ酸カルシウム板と重ね合わ
せてプレスロールにて両者を圧着した。Atactic polypropylene 100 parts Calcium carbonate 200 parts Example 9 A composition comprising the following substances and the following compounding ratio was fed to an extruder, extruded to a thickness of 5 mm, and the surface was reheated to a thickness of 2 mm. And then pressed together with a press roll.
【００４５】このようにして形成された積層体を用い
て、実施例７と同様にして配線用床材を製造し、配線現
場において、実施例７と同様に配線用溝を形成したとこ
ろ、実施例７と同様に均一な幅と深さを有する配線用溝
６，７が形成された。Using the laminate thus formed, a wiring floor material was manufactured in the same manner as in Example 7, and a wiring groove was formed at the wiring site in the same manner as in Example 7. As in Example 7, wiring grooves 6 and 7 having uniform width and depth were formed.
【００４６】エチレン−酢酸ビニル共重合体 １００部 炭酸カルシウム １００部 パラフィン ２０部Ethylene-vinyl acetate copolymer 100 parts Calcium carbonate 100 parts Paraffin 20 parts
【００４７】[0047]
【発明の効果】上述の如く構成された本発明によれば、
特定の中間層を基材内部に介在させるか又は中間層を介
在させずに上部基材と下部基材とを弱く接着させ、且つ
基材上面から配線用溝の底部に達する深さの切り込み線
を、予め縦方向及び／又は横方向に適宜間隙をおいて、
複数本設けてあるので、現場において均一な幅と深さを
有する配線用溝を極めて容易且つ確実に形成することが
できるという優れた効果を奏するものである。According to the present invention configured as described above,
A cut line with a depth reaching the bottom of the wiring groove from the upper surface of the base material, with a specific intermediate layer interposed inside the base material or weakly bonding the upper base material and the lower base material without the intermediate layer. With an appropriate gap in the vertical and / or horizontal direction in advance,
Since a plurality of wiring grooves are provided, an excellent effect that a wiring groove having a uniform width and depth can be formed very easily and reliably in the field can be obtained.
【図１】本発明の第１番目の要旨に係る配線用床材の代
表的な構成例を示す断面図である。FIG. 1 is a cross-sectional view showing a typical configuration example of a wiring flooring according to a first aspect of the present invention.
【図２】同配線用床材の平面図である。FIG. 2 is a plan view of the wiring floor material.
【図３】同配線用床材を用いて配線用溝を形成した場合
の一例を示す断面図である。FIG. 3 is a cross-sectional view showing an example of a case where a wiring groove is formed using the wiring floor material.
【図４】本発明の第１番目の要旨に係る配線用床材の他
の構成例を示す断面図である。FIG. 4 is a sectional view showing another configuration example of the wiring flooring according to the first aspect of the present invention.
【図５】図１の配線用床材を用いて、縦横交差部に屈曲
した配線用溝を形成した例を示す配線用床材の平面図で
ある。5 is a plan view of a wiring floor material showing an example in which a wiring groove bent at a vertical and horizontal intersection is formed by using the wiring floor material of FIG. 1;
【図６】本発明の第２番目の要旨に係る配線用床材を用
いて配線用溝を形成した場合の一例を示す配線用床材の
断面図である。FIG. 6 is a cross-sectional view of a wiring floor material showing an example in which a wiring groove is formed using the wiring floor material according to the second aspect of the present invention.
【図７】本発明の第３番目の要旨に係わる配線用床材を
用いて配線用溝を形成した場合の一例を示す配線用床材
の断面図である。FIG. 7 is a cross-sectional view of a wiring floor material showing an example in which a wiring groove is formed using the wiring floor material according to the third aspect of the present invention.
【図８】配線用溝におけるケーブルの保護状態の一例を
示す説明図である。FIG. 8 is an explanatory diagram showing an example of a protection state of a cable in a wiring groove.
【図９】本発明の第４番目の要旨に係る配線用床材の代
表的な構成例を示す断面図である。FIG. 9 is a cross-sectional view showing a typical configuration example of a wiring flooring according to a fourth aspect of the present invention.
【図１０】本発明の第４番目の要旨に係わる配線用床材
を用いて配線用溝を形成した場合の一例を示す配線用床
材の断面図である。FIG. 10 is a cross-sectional view of an example of a case where a wiring groove is formed using a wiring floor material according to a fourth aspect of the present invention.
【図１１】配線用溝同志の交差部におけるケーブルの保
護状態の一例を示す説明図である。FIG. 11 is an explanatory diagram showing an example of a protection state of a cable at an intersection of wiring grooves.
【図１２】同保護カバーの斜視図である。FIG. 12 is a perspective view of the protective cover.
１ 基材 １ａ 引き剥がされる基材の一部 １ｂ 引き剥がされる基材の一部 １Ａ 上部基材 １Ｂ 下部基材 ２ 中間層 ２′ 中間層 ２ａ 中間層の上層 ２ｂ 中間層の下層 ３ 支持材 ４ 切り込み線 ５ 切り込み線 ６ 配線用溝 ７ 配線用溝 ８ ケーブル ９ 配線用溝の交差部の隅部 １０ ケーブル保護カバー １１ 溝交差部におけるケーブル保護カバー １２ （保護カバー）脚部 Reference Signs List 1 base material 1a part of base material to be peeled 1b part of base material to be peeled 1A upper base material 1B lower base material 2 middle layer 2 'middle layer 2a middle layer upper layer 2b middle layer lower layer 3 support material 4 Cut lines 5 Cut lines 6 Wiring grooves 7 Wiring grooves 8 Cables 9 Corners of intersections of wiring grooves 10 Cable protective covers 11 Cable protective covers at groove intersections 12 (Protective cover) legs
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中島 勲 岐阜県養老郡養老町室原10番地 三菱バ ーリントン株式会社岐阜事業所内 (72)発明者 安部 健司 東京都中央区日本橋浜町二丁目62番６号 三菱バーリントン株式会社内 (72)発明者 前山 日出男 埼玉県和光市白子１−27−21 サンシャ インヒル内前山通信工業株式会社内 (72)発明者 石渡 祐彦 東京都北区赤羽３丁目６番25−302号 (56)参考文献 特開 平４−281956（ＪＰ，Ａ) 特開 昭53−89230（ＪＰ，Ａ) 実開 昭58−141043（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) E04F 15/18 E04F 15/16──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Isao Nakajima 10 Murohara, Yoro-cho, Yoro-gun, Gifu Prefecture Inside the Gifu Office of Mitsubishi Burlington Co., Ltd. (72) Inventor Kenji Abe 2-62-6 Nihonbashi-Hamacho, Chuo-ku, Tokyo No. Mitsubishi Burlington Co., Ltd. (72) Inventor Hideo Maeyama 1-27-21 Shiroko, Wako-shi, Saitama Prefecture Sunsha Inhill Uchimaeyama Communication Industry Co., Ltd. (72) Inventor Yuhiko Ishiwata 3-6-25, Akabane, Kita-ku, Tokyo No. 302 (56) References JP-A-4-281956 (JP, A) JP-A-53-89230 (JP, A) JP-A-58-144103 (JP, U) (58) Fields investigated (Int. . 6 , DB name) E04F 15/18 E04F 15/16
Claims (4)
部に対応する基材内部に、少なくとも上面を同基材から
容易に剥離し得る程度に弱く接着したシート状物からな
る中間層を少なくとも１層介在させ、且つ基材上面か
ら、中間層の少なくとも上面に達する深さの切り込み線
が、予め縦方向及び／又は横方向に適宜間隔をおいて複
数本設けてなることを特徴とする配線用床材。1. An intermediate layer made of a sheet-like material that is weakly adhered to the inside of the base corresponding to the bottom of the wiring groove formed in the sheet-like base so that at least the upper surface can be easily peeled off from the base. And at least one cut line having a depth reaching the at least upper surface of the intermediate layer from the upper surface of the base material is provided at predetermined intervals in the vertical and / or horizontal directions in advance. Flooring for wiring.
部に対応する基材内部に、下面が同基材から容易に剥離
し得る程度に弱く接着されると共に、上面が下面よりも
基材に対し強く接着されたシート状物からなる中間層
を、少なくとも１層介在させ、且つ基材上面から、中間
層の少なくとも下面に達する深さの切り込み線が、予め
縦方向及び／又は横方向に適宜間隙をおいて複数本設け
てなることを特徴とする配線用床材。2. A lower surface is weakly adhered to the inside of the base material corresponding to the bottom of the wiring groove formed in the sheet-shaped base material such that the lower surface can be easily separated from the base material, and the upper surface is lower than the lower surface. At least one intermediate layer composed of a sheet-like material strongly adhered to the substrate is interposed, and a cut line having a depth reaching from the upper surface of the substrate to at least the lower surface of the intermediate layer is formed in advance in the longitudinal direction and / or the horizontal direction. A flooring material for wiring, comprising a plurality of wiring members provided at appropriate intervals in a direction.
部に対応する基材内部に、容易に層間剥離し得る積層シ
ート状物からなるとともに、その上面及び下面が積層シ
ート状物の層間接着より強く基材に接着された中間層
を、少なくとも１層介在させ、且つ基材上面から少なく
とも中間層の層間に達する深さの切り込み線が、予め縦
方向及び／又は横方向に適宜間隙をおいて複数本設けて
なることを特徴とする配線用床材。3. A laminate sheet which can be easily delaminated inside a substrate corresponding to the bottom of a wiring groove formed in the sheet substrate, and the upper and lower surfaces of which are formed of the laminate sheet. At least one intermediate layer adhered to the substrate more strongly than the interlayer adhesion is interposed, and a cut line having a depth reaching at least between the layers of the intermediate layer from the upper surface of the substrate is appropriately spaced in the vertical and / or horizontal directions in advance. A flooring material for wiring characterized by comprising a plurality of wiring members.
部に対応する基材位置で、同基材が上下に分割されると
ともに、上部基材と下部基材とが相互に容易に剥離し得
る程度に直接弱く接着され、且つ下部基材の少なくとも
上面に達する深さの切り込み線が、縦方向及び／又は横
方向に適宜間隔を置いて複数本設けられてなることを特
徴とする配線用床材。4. The base material is vertically divided at a base position corresponding to the bottom of the wiring groove formed in the sheet-like base material, and the upper base material and the lower base material are easily separated from each other. A plurality of cut lines, which are weakly adhered directly to the extent that they can be peeled and have a depth reaching at least the upper surface of the lower substrate, are provided at appropriate intervals in the vertical and / or horizontal directions. Flooring for wiring.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6229758A JP2818733B2 (en) | 1993-12-22 | 1994-09-26 | Wiring flooring |
| KR1019940033037A KR0166606B1 (en) | 1993-12-07 | 1994-12-07 | Flooring material for wiring |
| US08/351,540 US5489458A (en) | 1993-12-07 | 1994-12-07 | Flooring material for wiring |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32409593 | 1993-12-22 | ||
| JP5-324095 | 1993-12-22 | ||
| JP6229758A JP2818733B2 (en) | 1993-12-22 | 1994-09-26 | Wiring flooring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07229281A JPH07229281A (en) | 1995-08-29 |
| JP2818733B2 true JP2818733B2 (en) | 1998-10-30 |
Family
ID=26528979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6229758A Expired - Fee Related JP2818733B2 (en) | 1993-12-07 | 1994-09-26 | Wiring flooring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2818733B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002213030A (en) * | 2001-01-16 | 2002-07-31 | Kanebo Ltd | Heat insulating/sound absorbing execution method for building and heat insulating/sound absorbing material used therefor |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5206577B2 (en) * | 2009-04-28 | 2013-06-12 | 住友電装株式会社 | WIRE HARNESS MODULE, METHOD FOR PRODUCING THE WIRE HARNESS MODULE, AND VEHICLE MOUNTING STRUCT |
| JP5464953B2 (en) * | 2009-09-28 | 2014-04-09 | 住商メタレックス株式会社 | Air conditioner installed under flooring flooring and method of replacing flooring in a room where this air conditioner is installed |
| JP6090152B2 (en) * | 2013-12-25 | 2017-03-08 | 株式会社オートネットワーク技術研究所 | Wire harness module |
| JP2021017741A (en) * | 2019-07-19 | 2021-02-15 | 藤澤建機株式会社 | Floor panel, and floor structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5389230A (en) * | 1977-08-27 | 1978-08-05 | Takiron Co | Floor material |
| JPS58141043U (en) * | 1982-03-17 | 1983-09-22 | 東リ株式会社 | carpet tile |
| JPH04281956A (en) * | 1991-03-11 | 1992-10-07 | Yoshihiko Ishiwatari | Wiring method |
-
1994
- 1994-09-26 JP JP6229758A patent/JP2818733B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002213030A (en) * | 2001-01-16 | 2002-07-31 | Kanebo Ltd | Heat insulating/sound absorbing execution method for building and heat insulating/sound absorbing material used therefor |
| JP4644860B2 (en) * | 2001-01-16 | 2011-03-09 | エンデバーハウス株式会社 | Thermal insulation and sound absorbing material for buildings |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07229281A (en) | 1995-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0612361B1 (en) | Resilient foam-backed carpet and method of preparation | |
| EP0420661B1 (en) | Carpet tile and method of preparing same | |
| NO960810D0 (en) | Slightly durable dimensionally stable flooring, and method of making such | |
| BE1026702B1 (en) | Subfloor | |
| EP3548243A1 (en) | Floor tile and process for manufacturing thereof | |
| JP2818733B2 (en) | Wiring flooring | |
| US5489458A (en) | Flooring material for wiring | |
| US4617210A (en) | Self sticking carpet tiles | |
| GB2063710A (en) | Adhesive tape for floor coverings or the like | |
| US4122224A (en) | Wall and floor coverings | |
| EP3634744B1 (en) | Vapor impermeable flooring underlayment | |
| CA2413796A1 (en) | Process for manufacturing flooring using recycled materials | |
| US20030209306A1 (en) | Process for manufacturing flooring using recycled materials | |
| JPS6328954Y2 (en) | ||
| JPS6254669B2 (en) | ||
| JP3494985B2 (en) | Curing board | |
| JP4189542B2 (en) | Non-woven | |
| JPH0635754B2 (en) | Rollable floor coverings and method for manufacturing the same | |
| JP3156203U (en) | Simple construction flooring | |
| JP2002054075A (en) | Material for laid linoleum flooring and method for processing the same | |
| JP2009281129A (en) | Carpet tile and vinyl tile for simple construction, and continuous manufacturing method and laying method thereof | |
| JPH07264750A (en) | Under-carpet material for cable laying | |
| JPH04339957A (en) | Floor material for direct sticking | |
| DE7119180U (en) | Layable floor covering in the form of panels |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070821 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080821 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080821 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090821 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090821 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100821 Year of fee payment: 12 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100821 Year of fee payment: 12 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100821 Year of fee payment: 12 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100821 Year of fee payment: 12 |
|
| R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100821 Year of fee payment: 12 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100821 Year of fee payment: 12 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100821 Year of fee payment: 12 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100821 Year of fee payment: 12 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110821 Year of fee payment: 13 |
|
| LAPS | Cancellation because of no payment of annual fees |