JP2786343B2 - Large current circuit board - Google Patents
Large current circuit boardInfo
- Publication number
- JP2786343B2 JP2786343B2 JP3159398A JP15939891A JP2786343B2 JP 2786343 B2 JP2786343 B2 JP 2786343B2 JP 3159398 A JP3159398 A JP 3159398A JP 15939891 A JP15939891 A JP 15939891A JP 2786343 B2 JP2786343 B2 JP 2786343B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- thick
- circuit conductor
- conductor
- large current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、大電流を流す厚肉の回
路導体を有する大電流回路基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-current circuit board having a thick circuit conductor through which a large current flows.
【０００２】[0002]
【従来の技術】大電流回路基板は、パワー回路や電源回
路など大電流を流す回路に使用されるもので、電流容量
を大きくするため、通常の回路基板（信号回路用）より
厚肉の回路導体が用いられている。2. Description of the Related Art A large-current circuit board is used for a circuit that flows a large current such as a power circuit or a power supply circuit. In order to increase the current capacity, the circuit board is thicker than a normal circuit board (for a signal circuit). Conductors are used.
【０００３】図４に大電流回路基板の使用状態を示す。
大電流回路基板11はガラスエポキシ基板などからなる絶
縁基板12に、所定の回路パターンに形成された厚肉回路
導体13を固定してなるものである。この回路基板11の片
面には、トランジスタモジュール、コンデンサ、抵抗な
どのパワー回路用部品14、15がネジ16により取り付けら
れるが、これらの部品は通電により発熱するため、部品
14、15の底面側にはヒートシンク17を取り付けて放熱を
よくしている。FIG. 4 shows a state of use of a large current circuit board.
The large current circuit board 11 is formed by fixing a thick circuit conductor 13 formed in a predetermined circuit pattern to an insulating board 12 made of a glass epoxy board or the like. Power circuit components 14, 15 such as a transistor module, a capacitor, and a resistor are mounted on one side of the circuit board 11 with screws 16, but these components generate heat when energized.
A heat sink 17 is attached to the bottom surface side of 14 and 15 to improve heat radiation.
【０００４】[0004]
【発明が解決しようとする課題】しかし部品はその種類
によって高さが異なる(図では２種類のみを示すが実際
にはもっと多い）ため、ヒートシンク17は最も高さの高
い部品14に直接固定し、それより高さの低い部品15とヒ
ートシンク17の間には高さ調整片18を介在させて高さを
そろえるようにしている。しかしこのような構造では、
部品点数が多くなり、組立が面倒であると共に、高さ調
整片18を介在させた部品の放熱性がわるくなる。このた
め高さをそろえた特注部品を使用することもあるが、こ
れはコスト高になる欠点がある。However, since the height of the component differs depending on the type (only two types are shown in the figure, there are actually more), the heat sink 17 is directly fixed to the component 14 having the highest height. A height adjusting piece 18 is interposed between the component 15 having a lower height and the heat sink 17 so as to make the height uniform. But with such a structure,
The number of parts is increased, the assembly is troublesome, and the heat radiation of the parts with the height adjusting piece 18 interposed is deteriorated. For this reason, custom-made parts having the same height may be used, but this has a disadvantage of increasing costs.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記のような
課題を解決した大電流回路基板を提供するもので、その
構成は、絶縁基板に所定の回路パターンに形成された厚
肉回路導体を固定してなる大電流回路基板において、厚
肉回路導体が、平坦な厚肉回路導体と、部品接続部が絶
縁基板固定部に対して段差を有する段差付き厚肉回路導
体とからなり、段差付き厚肉回路導体の段差は、その導
体に接続される部品と平坦な厚肉回路導体に接続される
部品との高さの差に対応させてあることを特徴とする。SUMMARY OF THE INVENTION The present invention provides a large-current circuit board which solves the above-mentioned problems, and comprises a thick circuit conductor formed in a predetermined circuit pattern on an insulating substrate. In a large-current circuit board, the thick circuit conductor is made up of a flat thick circuit conductor and a stepped thick circuit conductor in which the component connection part has a step with respect to the insulating substrate fixing part. The step of the attached thick circuit conductor is characterized in that it corresponds to a height difference between a component connected to the conductor and a component connected to a flat thick circuit conductor.
【０００６】[0006]
【作用】従来の大電流回路基板は厚肉回路導体がすべて
平坦であるが、本発明の大電流回路基板は平坦な厚肉回
路導体と段差付き厚肉回路導体とが混在している。平坦
な厚肉回路導体には最も高さの高い部品が接続され、段
差付き厚肉回路導体にはそれより高さの低い部品が接続
される。段差付き厚肉回路導体の段差は部品の高さの差
に対応させてあるので、この大電流回路基板に部品を取
り付けると、部品の底面が同じ高さにそろうから、各部
品をヒートシンクに直接取り付けることが可能となる。In the conventional large current circuit board, the thick circuit conductors are all flat, but in the large current circuit board of the present invention, the thick circuit conductor having a flat surface and the thick circuit conductor having a step are mixed. The tallest component is connected to the flat thick circuit conductor, and the lower component is connected to the stepped thick circuit conductor. The steps of the thick circuit conductor with steps correspond to the differences in the heights of the components.When components are mounted on this high-current circuit board, the bottom surfaces of the components are aligned at the same height. It can be attached.
【０００７】[0007]
【実施例】以下、本発明の実施例を図面を参照して詳細
に説明する。図１および図２は本発明の一実施例を示
す。この大電流回路基板11は、絶縁基板12に平坦な厚肉
回路導体13と段差付き厚肉回路導体19を固定したもので
ある。段差付き厚肉回路導体19は、その部品接続部19ａ
が平坦な絶縁基板固定部19ｂに対し厚さ方向に段差を有
するものである。絶縁基板12には段差のある部品接続部
19ａを落とし込むための穴20が形成されている。Embodiments of the present invention will be described below in detail with reference to the drawings. 1 and 2 show one embodiment of the present invention. This large-current circuit board 11 has a flat thick circuit conductor 13 and a stepped thick circuit conductor 19 fixed to an insulating substrate 12. The stepped thick circuit conductor 19 is connected to its component connection portion 19a.
Has a step in the thickness direction with respect to the flat insulating substrate fixing portion 19b. Component connection part with step on insulating substrate 12
A hole 20 for dropping 19a is formed.
【０００８】この大電流回路基板11の使用状態を図３に
示す。平坦な厚肉回路導体13には最も高さの高い部品14
が接続され、段差付き厚肉回路導体19にはそれより高さ
の低い部品15が接続される。段差付き厚肉回路導体19の
段差は部品14と15の高さの差に対応させてある。したが
って部品14、15を取り付けると、部品14、15の底面が同
じ高さにそろい、各部品14、15をヒートシンク17に直接
取り付けることができる。FIG. 3 shows how the large current circuit board 11 is used. The tallest component 14 in the flat thick circuit conductor 13
Are connected to the stepped thick circuit conductor 19, and a component 15 having a lower height is connected thereto. The step of the thick circuit conductor 19 with a step corresponds to the difference in height between the components 14 and 15. Therefore, when the components 14 and 15 are mounted, the bottom surfaces of the components 14 and 15 are flush with each other, and the components 14 and 15 can be directly mounted on the heat sink 17.
【０００９】[0009]
【発明の効果】以上説明したように本発明に係る大電流
回路基板は、高さの低い部品を取り付ける厚肉回路導体
に段差をつけてあるので、部品を取り付けた場合、各部
品の底面の高さがそろい、各部品をヒートシンクに直接
取り付けることができる。このため従来使用していた高
さ調整片が不要となり、回路組立が簡単になると共に、
高さの低い部品の放熱性が良好になる利点がある。As described above, the large current circuit board according to the present invention has a step on the thick circuit conductor on which a low-height component is mounted. The uniform height allows each component to be mounted directly to the heat sink. This eliminates the need for the conventionally used height adjustment pieces, simplifies circuit assembly, and
There is an advantage that the heat radiating property of a component having a low height is improved.
【図１】 本発明に係る大電流回路基板の一実施例を示
す平面図。FIG. 1 is a plan view showing one embodiment of a large current circuit board according to the present invention.
【図２】 図１のＡ−Ａ線における断面図。FIG. 2 is a sectional view taken along line AA in FIG.
【図３】 図１および図２に示す大電流回路基板の使用
状態を示す断面図。FIG. 3 is a sectional view showing a use state of the large current circuit board shown in FIGS. 1 and 2;
【図４】 従来の大電流回路基板の使用状態を示す正面
図。FIG. 4 is a front view showing a usage state of a conventional large current circuit board.
11：大電流回路基板 12：絶縁基板 13：平坦な厚
肉回路導体 14、15：部品 17：ヒートシンク 19：段差付き厚
肉回路導体 19ａ：部品接続部 19ｂ：絶縁基板固定部 20：穴11: Large current circuit board 12: Insulating board 13: Flat thick circuit conductor 14, 15: Component 17: Heat sink 19: Stepped thick circuit conductor 19a: Component connection section 19b: Insulation board fixing section 20: Hole
───────────────────────────────────────────────────── フロントページの続き (72)発明者 望月 肇 東京都千代田区丸の内２丁目６番１号 古河電気工業株式会社内 (56)参考文献 特開 昭56−67981（ＪＰ，Ａ) 実開 平２−45667（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/02 H05K 3/20──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hajime Mochizuki 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (56) References JP-A-56-67981 (JP, A) 2-45667 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 1/02 H05K 3/20
Claims (1)
れた厚肉回路導体を固定してなる大電流回路基板におい
て、厚肉回路導体が、平坦な厚肉回路導体と、部品接続
部が絶縁基板固定部に対して段差を有する段差付き厚肉
回路導体とからなり、段差付き厚肉回路導体の段差は、
その導体に接続される部品と平坦な厚肉回路導体に接続
される部品との高さの差に対応させてあることを特徴と
する大電流回路基板。1. A large-current circuit board comprising a thick circuit conductor formed in a predetermined circuit pattern fixed to an insulating substrate, wherein the thick circuit conductor is insulated from a flat thick circuit conductor and a component connecting portion. It consists of a stepped thick circuit conductor having a step with respect to the board fixing part, and the step of the stepped thick circuit conductor is
A large current circuit board adapted to correspond to a difference in height between a component connected to the conductor and a component connected to a flat thick circuit conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3159398A JP2786343B2 (en) | 1991-06-04 | 1991-06-04 | Large current circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3159398A JP2786343B2 (en) | 1991-06-04 | 1991-06-04 | Large current circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0563316A JPH0563316A (en) | 1993-03-12 |
| JP2786343B2 true JP2786343B2 (en) | 1998-08-13 |
Family
ID=15692905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3159398A Expired - Lifetime JP2786343B2 (en) | 1991-06-04 | 1991-06-04 | Large current circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2786343B2 (en) |
-
1991
- 1991-06-04 JP JP3159398A patent/JP2786343B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563316A (en) | 1993-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |