JP2695402B2 - Substrate vacuum processing method and substrate vacuum processing apparatus - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus in a semiconductor manufacturing process such as an etching apparatus, a plasma CVD apparatus, and a sputtering apparatus. BACKGROUND OF THE INVENTION Recent progress in semiconductor manufacturing process technology has been remarkable, and a type of processing a 1 μm pattern has appeared even in a dry etching apparatus, and has been receiving attention. As such miniaturization progresses, the substrate becomes larger in diameter, and accordingly, the throughput per occupied floor area of the semiconductor manufacturing apparatus (the number of processed substrates per time) is improved and the manufacturing process technology is diversified. Is a major issue. In order to solve such demands, it is necessary to reduce the size of the apparatus and perform multipurpose processing using a plurality of vacuum processing chambers. A vacuum processing module that can configure or organize a system by freely changing the number of chambers has been required. On the other hand, in a conventional type in which a module in which a vacuum processing chamber and a substrate transfer line in the atmosphere can be added as disclosed in, for example, Japanese Patent Application Laid-Open No. 57-128929, can be added, the air quality is poor. Since the substrate is transported to the next vacuum processing chamber through the inside, it is not suitable for application to a process step in which processing is transferred to the next vacuum processing chamber during processing. 57-394
In the type in which substrates are transferred between several vacuum processing chambers and one buffer chamber and continuously processed as disclosed in Japanese Patent No. 30, the number of vacuum processing chambers is fixed and the process is changed. There is no freedom to change the number of vacuum processing chambers in response to line changes, and it is difficult to use. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing method and a substrate processing apparatus capable of improving the yield in the substrate processing process and improving the throughput. Another object of the present invention is to provide a substrate processing method and a processing apparatus capable of shortening the substrate processing time and improving the throughput. SUMMARY OF THE INVENTION The present invention is a vacuum processing chamber and a substrate transfer means.
It has a vacuum transfer space where is placed and a cassette inside
The vacuum reserve chamber and the orientation of the substrate removed from the cassette.
Orientation flat matching to align the hula in a vacuum-exhausted space
The substrate processing means is the vacuum processing unit.
The processed substrate transferred from the chamber to the vacuum transfer space
The first substrate holder to be held, and the vacuum processing chamber
Align the orientation flat with the orientation flat alignment means while the substrate is present.
The next substrate that has been processed and has been processed in the vacuum processing chamber.
To the vacuum processing chamber where the substrate of
The next substrate that has been aligned from
A second substrate holder to hold, from the vacuum processing chamber
Transporting the processed substrate to the vacuum transport space, and
Aligning the orientation flat from the vacuum transfer space to the vacuum processing chamber
It is possible to independently carry the next substrate after finishing
It is characterized by having been constituted as follows . Another feature of the present invention is a vacuum processing chamber and a substrate.
A vacuum transfer space where the transfer means is located and a cassette inside
The vacuum reserve chamber that has the
With orientation flat aligning means for aligning in a closed space,
The substrate transfer means includes a first substrate holder and a second substrate holder.
A method of operating a vacuum processing apparatus having a tool, comprising: a: an orientation flat of the substrate taken out from the cassette.
Aligning the orientation flat with the orientation flat aligning means, and b: aligning the orientation flat aligned substrate with the first substrate
A step of holding with a placing tool and carrying it to the vacuum processing chamber, c: an orientation flat of the next substrate taken out from the cassette
Aligning the orientation flat with the orientation flat aligning means, and d: setting the second substrate after the orientation flat alignment to the second substrate.
Holding the substrate with a device for holding the substrate, e: vacuuming the substrate processed in the vacuum processing chamber.
Hold the first substrate from the processing room to the vacuum transfer space.
Holding and transporting, f: by the second substrate fitting with the orientation flat aligned
The next substrate being held is transferred from the vacuum transfer space to the
Transporting to an empty processing chamber, g: the process of c while the substrate is in the vacuum processing chamber.
And step d), h: the step e and the step f are independently performed.
That is what you do . According to the present invention, since the orientation flat alignment of the substrate is performed in the space evacuated, the accumulation and adhesion of dust on the surface to be processed of the substrate is suppressed as compared with the orientation flat alignment in the atmosphere. It Therefore, the yield in semiconductor manufacturing can be improved. According to another aspect of the present invention, since the orientation flat alignment of the substrate in the space is performed while the substrate is being processed in the vacuum processing chamber, the processing time can be shortened and the throughput can be improved. Can be improved. An embodiment of the present invention will be described with reference to FIGS. In FIG. 1, a vacuum processing apparatus includes a buffer chamber 10 capable of evacuating, and a vacuum processing chamber 2 provided in the buffer chamber 10.
0 and the buffer chamber 1 capable of transporting the substrate 30 in the direction of arrow A.
And a vacuum opening / closing means 4 such as a gate valve and a partition provided on the side wall of the buffer chamber 10 at both ends of the first substrate transfer means.
0, 41 and, in this case, a gate valve provided on the side wall corresponding to the vacuum processing chamber 20 at right angles to the side wall on which the vacuum opening / closing means 40, 41 are provided and sandwiching the first substrate transfer means. Of the buffer chamber 10 through the vacuum opening / closing means 50 and 51 of FIG.
The second substrate transporting means (which transports the substrate 30 in the directions of arrows B and C via the other vacuum opening / closing means 50 and 51 between the pre-vacuum chamber 60 provided in the apparatus and the first substrate transporting means ( A substrate transfer means (not shown) provided on the substrate transfer path of the first substrate transfer means and corresponding to the vacuum processing chamber 20, and a connection between the substrate transfer means and the vacuum processing chamber 20. And a third substrate carrying means (not shown) for carrying the substrate 30 in the direction of the arrow D between them. In this case, in the vacuum preparatory chamber 60, a cassette table (not shown) of a cassette elevating device (not shown) for driving the substrate cassettes 70 and 71 up and down corresponds to the other vacuum opening / closing means 50 and 51 so as to be able to go up and down. It is installed inside. The first to third substrate transfer means and the substrate transfer means will be described in more detail with reference to FIG. In FIG. 2, the first substrate carrying means is a belt carrying device 80, and the belt carrying device 80 is entirely moved up and down by an elevating device, for example, a cylinder 81, and a belt 83 is driven by a motor 82. Is driven to rotate. The second substrate transfer means includes belt transfer devices 90 and 100 provided in the vacuum preliminary chamber 60 and belt transfer devices 110 provided in the buffer chamber 10 with the other vacuum opening / closing means 50 and 51 interposed therebetween. 120. The pulleys 91 and 92 of the belt conveying device 90 and the belt 93 wound around the pulleys 91 and 92 endlessly correspond to the cassette table 131 of the cassette elevating device 130, and the cassette table 131 is raised to the highest position. It is arranged so that it is located above it even at the point of time. The belt 93 is driven to rotate by a motor 94. The belt conveyance device 110 is driven to rotate the belt 112 by the motor 111, and the end of the belt conveyance device 110 on the side of the belt conveyance device 80 does not hinder one of the movements of the belt 83 of the belt conveyance device 80. Pulley 113 bent at the end of V-shape
Are provided between the belts 83 of the belt transport device 80. The belt 93 of the belt conveying device 90 and the belt 112 of the belt conveying device 110 are at the same level, and the distance between the belt conveying device 90 and the belt conveying device 110 on the other side of the vacuum opening / closing means 50 is: It has a size that does not hinder the delivery of the substrate 30. Belt transport device 10
No. 0 pulleys 101, 102 and the belt 103 wound around the pulleys 101, 102 endlessly are
The belt 103 is rotationally driven by the motor 104. The belt conveying device 120 is driven to rotate the belt 122 by the motor 121, and the end of the belt conveying device 120 on the side of the belt conveying device 80 is moved up and down by one of the belts 83 of the belt conveying device 80 similarly to the belt conveying device 110. The pulley 123 is bent in a V-shape so as not to obstruct the position, and is provided so as to be located between the belts 83 of the belt conveying device 80. The belt conveyor 10
Belt 103 of 0 and belt 12 of the belt conveying device 120
2 is at the same level, and the distance between the other ends of the belt transfer device 100 and the belt transfer device 120 on the side of the vacuum opening / closing means 51 has a size that does not hinder the delivery of the substrate 30. Further, the pulley 11 of the belt conveying device 110
The distance between the pulley 3 and the pulley 114 corresponding to the pulley 113 is
The size of the belt 30 is such that the substrate 30 can be prevented from dropping and can be satisfactorily transferred, and the distance between the pulley 123 of the belt conveying device 120 and the pulley 124 corresponding to the pulley 123 is the same. The belt conveying device 80 is driven to move up and down so that the level of the belt 83 is equal to or lower than the level of the belts 112 and 122 of the belt conveying devices 110 and 120. The substrate delivery means 140 is provided with the belt conveying device 8
Substrate table 141 smaller than the dimension between belts 83
And an elevating device, for example, a cylinder 142. The substrate table 141 is provided at a position corresponding to the vacuum processing chamber 20, in this case, at a position between the belt transfer devices 110 and 120, so as to pass between the belts 83 of the belt transfer device 80 and to be able to move up and down by the cylinder 142. I have. The third substrate transfer means includes an arm transfer device 1
50,160. The arm transfer device 150 includes a board scooping tool 151, an arm 152, and a rotation device, for example, a pulse motor 153. Pulse motor 15
3 is between the belt transfer device 80 and the vacuum processing chamber 20,
The pulse motor 15 is provided on one side (the left side in FIG. 2) of a line connecting the center of the substrate table 141 of the substrate delivery means 140 and the center of the substrate electrode 21 of the vacuum processing chamber 20.
3 is provided with one end of an arm 152. A board scooping tool 151 is provided at the other end of the arm 152. The arm transfer device 160 is composed of a substrate scooping tool 161, an arm 162, and a rotating device, for example, a pulse motor 163. Pulse motor 163
Is the other side of the line connecting the center of the substrate table 141 of the substrate transfer means 140 and the center of the substrate electrode 21 of the vacuum processing chamber 20 between the belt transfer device 80 and the vacuum processing chamber 20 (FIG. 2). , And the pulse motor 163 is provided with one end of an arm 162. Arm 16
The other end of 2 is provided with a board scooping tool 161.
In this case, the board scooping tools 151, 161, the arm 15
The sizes of 2, 162 are the same as those of the substrate table 141 and the substrate electrode 21 when the substrate 30 is placed on the substrate table 141 and the substrate electrode 21.
The substrate scooping tools 151 and 161 have dimensions that allow scooping. Further, the arms 152 and 162 are provided with the substrate scooping tool 15
1 and 161, the substrate 30 is partially rotated by the pulse motors 153 and 163 so that the substrate 30 can be conveyed between the substrate table 141 and the substrate electrode 21. In this case, the arm 15
In the operation planes of Nos. 2, 162, the arm 152 is the upper surface, and the arm 1 is
Unlike the lower surface at 62, for example, when the substrate 30 is transferred from the substrate table 141 to the substrate electrode 21 by the arm transfer device 150, the transfer of the substrate 30 from the substrate electrode 21 to the substrate table 141 by the arm transfer device 160 is inhibited. Not to be. The cassette elevating device 130 includes a cassette table 131, an elevating rod 132 which is suspended from the cassette table 131 and has a screw formed at a lower end thereof, and a motor 13.
3 and a gear 135 meshed with the gear 134 and having a lower end of the lifting rod 132 screwed into the gear 134. The substrate electrode 21 is a rack and pinion mechanism 2
2 is driven up and down by the rotation of the motor 23. Further, a claw 24 for supporting the substrate is provided at the center of the substrate electrode 21 so as to be able to move up and down by a lifting device, for example, a cylinder 25. The claw 24 is driven to move up and down between a position where the surface thereof is equal to or lower than the surface of the substrate electrode 21 and a position where the substrate rakes 151 and 161 of the arm transfer devices 150 and 160 and the substrate 30 can be transferred. In the vacuum processing apparatus shown in FIGS. 1 and 2,
The following substrate processing can be performed. First, the cassette table 131 corresponding to the other vacuum opening / closing means 50 is lowered to the lowermost position, and the cassette table (not shown) corresponding to the other vacuum opening / closing means 51 is raised to the uppermost position. Other vacuum switching means 5
For example, the cylinders 52 and 53 are closed by driving the cylinders 52 and 53, and the communication between the buffer chamber 10 and the vacuum preparatory chamber 60 is air-tightly cut off. Communication with the outside is also airtightly shut off. In this state, the buffer chamber 10 is evacuated to a predetermined pressure by operating a vacuum exhaust device (not shown). On the other hand, when the outside is on the atmospheric side, a predetermined number of substrates 30 are opened by opening an atmospheric vacuum opening / closing means (not shown) such as a door provided in the vacuum preliminary chamber 60. Loaded with a substrate cassette (hereinafter abbreviated as a supply cassette) 70 and an empty substrate cassette (hereinafter, abbreviated as a substrate cassette) for collecting a substrate.
A collection cassette 71 is carried in, and the supply cassette 70 is placed on a cassette table 131 corresponding to the other vacuum opening / closing means 50, and the collection cassette 71 is placed in another vacuum opening / closing means 51.
Are placed on the cassette tables corresponding to. Thereafter, the atmospheric vacuum opening / closing means is closed, and the vacuum preliminary chamber 60 is
The pressure in the buffer chamber 10 is reduced and evacuated by a vacuum evacuator (not shown). Then, the cylinder 52
Drives the other vacuum opening / closing means 50 to open, whereby the buffer chamber 10 communicates with the vacuum preparatory chamber 60. Under this condition, the motor 133 is driven and the cassette table 131 is lowered by one pitch, whereby the substrate 3 loaded in the lowermost portion of the supply cassette 70, in this case, the substrate 3.
0 is placed on the belt 93. Thereafter, the belt 93 is driven to rotate by the motor 94 and the substrate 30
Is conveyed to another vacuum opening / closing means 50 side, and is passed through another vacuum opening / closing means 50 to a belt 112 driven to rotate by a motor 111. The substrate 30 transferred to the belt 112 is transported to the belt transport device 80 side. At this time, the entire belt conveying device 80 is lowered by the cylinder 81 so that the level of the belt 83 is lower than the level of the belt 112. Thereafter, the substrate 30 is moved to the pulleys 113 and 114.
The entire belt transporting device 80 is raised by the cylinder 81 so that the level of the belt 83 becomes equal to or higher than the level of the belt 112 when the substrate 30 is transported to such an extent that the substrate 30 is transferred from the belt 112 to the belt 83. . The substrate 30 transferred to the belt 83 is conveyed to a position corresponding to the substrate table 141 by driving of the motor 82, and then received by the substrate table 141 by lifting the substrate table 141 by the cylinder 142. The substrate 30 received on the substrate table 141 is aligned with the orientation flat by, for example, an orientation flat alignment device 170. Thereafter, the substrate 30 is transferred to, for example, a substrate holder 151 and the arm 152 is rotated by the pulse motor 153 toward the vacuum processing chamber 20 to thereby rotate the buffer chamber 10.
Is transported above the substrate electrode 21 in the vacuum processing chamber 20. Thereafter, the claw 24 is raised by the cylinder 25, so that the substrate 30 of the substrate placing tool 151 is received by the claw 24. After that, the substrate placing tool 15 with the substrate 30 passed over the nail 24
1 is retracted to the buffer chamber 10 outside the vacuum processing chamber 20. Then, the claw 24 is lowered by the cylinder 25 so that the surface thereof is below the surface of the substrate electrode 21,
The substrate 30 is passed from the nail 24 to the substrate electrode 21 and placed thereon. After that, it is composed of a partitioning flange 180, a bellows 181 laid across the back surface of the flange 180 and the bottom wall of the buffer chamber 10, and an elevating device for driving the flange 180 up and down, for example, a cylinder 182. The buffer chamber 10 and the vacuum processing chamber 20 are partitioned by the partitioning means 183. In this state, first, the electrode interval between the substrate electrode 20 and a counter electrode (not shown) provided above the substrate electrode 30 in the vacuum processing chamber 20 so as to oppose the substrate electrode 30 is adjusted to an appropriate interval by driving the motor 23. Adjusted. Thereafter, the process gas is introduced into the vacuum processing chamber 20 at a controlled flow rate, and the pressure of the vacuum processing chamber 20 is adjusted to the processing pressure by driving a vacuum exhaust device (not shown). Thereafter, a high frequency power is applied to the substrate electrode 21 from a power source connected to the substrate electrode 21, for example, a high frequency power source (not shown), so that a glow is applied between the counter electrode and the substrate electrode 21. Discharge occurs and the process gas turns the process gas into plasma. The substrate 30 placed on the substrate electrode 21 by this plasma is subjected to a predetermined process such as an etching process. During this time, the substrate 30 is taken out of the supply cassette 70 by the above-described operation, transported by the belt transport devices 110 and 80, transferred to the substrate table 141, aligned with the orientation flat, and then transferred to the substrate placing tool 151. After the processing in the vacuum processing chamber 20 is completed, the buffer chamber 10 and the vacuum processing chamber 20 are separated by the partitioning means 183.
Is released, and the vacuum processing chamber 20 becomes the buffer chamber 10
Is again communicated with. Thereafter, the substrate electrode 21 is lowered to a predetermined position, and the claw 24 is raised by the cylinder 25, whereby the processed substrate 30 is removed from the substrate electrode 21 and passed to the claw 24. Then, the substrate mounting tool 161
Is rotated to a position corresponding to the back surface of the substrate 30 transferred to the claw 24, and then the claw 24 is lowered by the cylinder 25, whereby the processed substrate 30 is transferred to the substrate placing tool 161. Thereafter, the substrate 30 transferred to the substrate holder 151 is transferred from the substrate table 141 to the substrate electrode 21, and the processed substrate 30 transferred to the substrate holder 161 is transferred from the substrate electrode 21 to the substrate table 141. Each is transported. The substrate 30 transported to the substrate electrode 21 is subjected to predetermined processing by the above-described operation. During this time, the processed substrate 30 transferred to the substrate table 141 is transferred to the belt 83 of the belt transfer device 80 by lowering the substrate table 141 by the cylinder 142, and then the motor 8 of the belts 83 and 122 is moved.
It is conveyed to the other vacuum opening / closing means 51 side by the rotational drive by 2,121. The delivery of the processed substrate 30 from the belt 83 to the belt 122 is performed by the reverse operation of the delivery of the substrate 30 from the belt 112 to the belt 83. The other vacuum opening / closing means 51 is opened by the driving of the cylinder 53, and the processed substrate 30 conveyed to the other vacuum opening / closing means 51 is driven by rotating the belt 103 by the motor 104. It is carried into the vacuum preparatory chamber 60 via 51, and is then collected in the collection cassette 71 by raising the cassette table by one pitch. Further, the substrate 30 is taken out from the supply cassette 70 by the above-mentioned operation, and the belt conveying device 110,
After being conveyed at 80 and transferred to the substrate table 141 and aligned with the orientation flat, it is transferred to the substrate holder 151. By repeating the above operations, the substrates 30 are taken out of the supply cassette 70 one by one, transferred from the pre-vacuum chamber 60 to the vacuum processing chamber 20 via the buffer chamber 10, and then transferred to the vacuum processing chamber 20. Each sheet is processed at 20,
The processed substrate 30 is conveyed from the vacuum processing chamber 20 to the pre-vacuum chamber 60 via the buffer chamber 10 and is collected one by one in the collection cassette 71. FIG. 3 shows an example in which the vacuum processing apparatus shown in FIGS. 1 and 2 is used as one module and two modules are connected in series via the vacuum opening / closing means 40 and 41. Note that the components in FIG. 3 are all the same as those in FIG. 2, and therefore, the description of the configuration, operation, and the like is omitted. FIG.
4 (a) to 4 (c)
Can be performed. That is, as shown in FIG. 4A, series processing of the substrate 30 in the two vacuum processing chambers 20 of the vacuum processing apparatus connected in series is performed, or as shown in FIG.
4 may be processed in parallel in the two vacuum processing chambers 20 of the vacuum processing apparatus connected in series, or as shown in FIG.
Can be processed in parallel. In such a substrate processing mode, FIG.
In the case of the substrate processing mode shown in (a) and (b), at least one supply cassette (not shown) is set in the vacuum preliminary chamber 60 of the vacuum processing apparatus of the first stage, and the vacuum preliminary chamber 60 of the vacuum processing apparatus of the second stage is set. At least one recovery cassette (not shown) is set in the. In the case of the substrate processing mode shown in FIG. 4C, one supply cassette (not shown) and one recovery cassette (not shown) are set in the vacuum preparatory chamber 60 of each vacuum processing apparatus. Also, FIG.
When the vacuum processing apparatus shown in FIG. 2 is used as one module and two modules are connected in series via the vacuum opening / closing means 40 and 41, the substrate 30 in each vacuum processing apparatus is transferred through the buffer chamber 10. Further, when the vacuum processing apparatus shown in FIGS. 1 and 2 is provided as one module and three or more modules are connected in series via the vacuum opening / closing means 40 and 41, in addition to the substrate processing mode shown in FIG. Substrate processing as shown in FIGS. 5A and 5B can be performed. That is, as shown in FIG. 5A, the substrate 30
In the vacuum processing chamber 20 of the preceding vacuum processing apparatus of the vacuum processing apparatus and the vacuum processing chamber 20 of the middle vacuum processing apparatus in this case, parallel processing is performed first, and then the subsequent vacuum processing apparatus As shown in FIG. 5B, the series processing is performed in the vacuum processing chamber 20 of the vacuum processing chamber 20 of the first and middle vacuum processing apparatuses in which the substrate 30 is connected in series.
In addition to performing the series processing at 0, the series processing can be performed in the vacuum processing chambers 20 of the vacuum processing apparatuses at the first and second stages.
In such a substrate processing mode, two supply cassettes (not shown) are set in the vacuum preparatory chamber 60 of the preceding vacuum processing apparatus, and a collection cassette (not shown) is set in the vacuum preparatory chamber 60 of the subsequent vacuum processing apparatus. ) Are set. When series processing of the substrate 30 is performed in the vacuum processing chamber 20 of each vacuum processing apparatus, one supply cassette is set in the vacuum preparatory chamber 60 of the preceding vacuum processing apparatus, and the vacuum of the subsequent vacuum processing apparatus is set. One collection cassette is set in the spare room. When the substrates 30 are processed in parallel in the vacuum processing chambers of the respective vacuum processing apparatuses, at least one supply cassette is set in the vacuum preparatory chamber of the preceding vacuum processing apparatus, and the collection cassette is set in the vacuum preparatory chamber of the subsequent vacuum processing apparatus. Is set at least one. When each vacuum processing apparatus is independent and the substrates are processed in parallel in the respective vacuum processing chambers, one supply cassette and one recovery cassette are set in the vacuum preliminary chamber of each vacuum processing apparatus. . In addition, even when three or more modules are connected to each other via the vacuum opening / closing means 40 and 41 as one module of the vacuum processing apparatus shown in FIGS. 1 and 2, the substrate 30 in each vacuum processing apparatus is transferred to the buffer chamber 10. It is done by going through. The vacuum processing apparatus of this embodiment has the following effects. (1) The system configuration or organization can be changed by freely changing the number of vacuum processing chambers in response to process changes and line changes. (2) Since the substrate is transferred to the next vacuum processing chamber through the buffer chamber that is evacuated, it can be applied to the process step in which the process is taken over to the next vacuum processing chamber without any problem. . (3) Since the second substrate transfer means and the third substrate transfer means are parallel to each other, the width of the front surface of the vacuum processing apparatus can be reduced, which facilitates multi-module construction. (4) Since the vacuum preparatory chamber is a cassette chamber that can be evacuated, the depth of the vacuum processing apparatus can be reduced, and in a multi-module system, two cassettes can be set in one module. It is possible to extend the cassette set time interval when improving the throughput. (5) Since the arm transfer devices having different operation planes are used as the third substrate transfer means, the substrates can be carried in and out of the vacuum processing chamber at the same time, so that the throughput can be improved. (6) Since multiple modules can perform series processing or parallel processing, the vacuum processing apparatus can be downsized and the throughput per combined floor area can be improved. (7) The opening area of the vacuum opening / closing means provided in the buffer chamber has only to be an area through which one substrate can pass. Therefore, in the case of multiple modules, residual process gas is mixed between the vacuum processing apparatuses. Rarely occurs,
Independence from the process gas in each vacuum processing apparatus can be secured. When the depth of the vacuum processing apparatus is reduced and the continuous processing with other apparatus is aimed at,
As shown in FIG. 6, a vacuum preparatory chamber 60 'is provided in the buffer chamber 10 via the vacuum opening / closing means 40, for example.
A second substrate transfer device (not shown), which is a first substrate transfer means for transferring the substrate 30 in the direction of arrow A, is capable of transferring the substrate 30 in the direction of arrow E via the vacuum opening / closing means 40.
A belt transfer device (not shown) as a substrate transfer means is provided in the vacuum preliminary chamber 60 '. In this case, no other vacuum opening / closing means is required. In the embodiment described above, the vacuum reserve chamber is a vacuum reserve chamber in which the supply cassette and the recovery cassette are loaded and set from the outside, but it is particularly necessary to limit the vacuum reserve chamber to such a vacuum reserve chamber. There is no. For example, a supply cassette and a collection cassette are fixed and set in a vacuum spare chamber, a predetermined number of substrates are loaded from the outside into the supply cassette, and the substrates collected in the collection cassette are taken out of the collection cassette and carried out. May be. Further, the first substrate carrying means may be any one that carries the substrate to and from the vacuum opening / closing means provided in the buffer chamber in addition to the belt carrying device. Also, the second
As the substrate transfer means, other than the belt transfer device, for example, an arm transfer device in which an arm moves straight, an arm transfer device in which an arm rotates, or the like may be used. [0050] According to the present invention, since carrying out the orientation flat alignment of the substrate in a space which is evacuated, deposition of dust in comparison to the orientation flat alignment in the atmosphere to the target surface of the substrate・
Adhesion is suppressed. Therefore, the yield in semiconductor manufacturing can be improved. According to another feature of the present invention, since the orientation flat alignment of the substrate in the space is performed while the substrate is being processed in the vacuum processing chamber, the processing time can be shortened and the throughput can be improved. Can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing one embodiment of a vacuum processing apparatus according to the present invention. FIG. 2 is a perspective configuration diagram of a substrate transfer unit of the vacuum processing apparatus of FIG. FIG. 3 is a perspective view of a substrate transfer means of a vacuum processing apparatus in which two modules of the vacuum processing apparatus of FIG. 1 are connected in series. 4A to 4C are substrate processing mode diagrams in a two-module vacuum processing apparatus. FIGS. 5A and 5B are other substrate processing mode diagrams in a three-module vacuum processing apparatus. FIG. 6 is a plan view showing another embodiment of the vacuum processing apparatus according to the present invention. [Description of References] 10: buffer chamber, 20: vacuum processing chamber, 30: substrate, 4
0, 41: Vacuum opening / closing means, 50, 51: Other vacuum opening / closing means, 60, 60 ': Vacuum spare chamber, 80 to 120: Belt transfer device, 140: Substrate delivery means, 150, 160
... Arm transfer device.

Continuation of front page    (72) Inventor Fumio Shibata               794 Kudamatsu-shi, Yamaguchi Prefecture               Hitachi Kasado Plant (72) Inventor Tsunehiko Tsubone               794 Kudamatsu-shi, Yamaguchi Prefecture               Hitachi Kasado Plant (72) Inventor Keno Kanai               794 Kudamatsu-shi, Yamaguchi Prefecture               Hitachi Kasado Plant                (56) References JP-A-57-149748 (JP, A)                 JP 58-108641 (JP, A)                 JP 57-37847 (JP, A)                 57-39430 (JP, U)                 Actual Development Sho 55-149951 (JP, U)                 58-129633 (JP, U)

Claims (1)

(57) [Claims] Vacuum transfer with vacuum processing chamber and substrate transfer means
A space, a vacuum reserve chamber having a cassette inside, and the cassette
The orientation flat of the substrate taken out from the tray was evacuated.
An orientation flat aligning unit that aligns in space, and the substrate transfer unit transfers the vacuum transfer from the vacuum processing chamber.
A first substrate that holds a processed substrate that is transported to space
While placing the mounting tool and the substrate in the vacuum processing chamber,
It is the next substrate that is aligned by the aligning means.
The above-mentioned vacuum processing in which the processed substrate is carried out in the vacuum processing chamber.
If the orientation flat is transferred from the vacuum transfer space to the processing room,
With a second substrate retainer to hold the next substrate
The processed from the vacuum processing chamber to the vacuum transfer space
Substrate transfer and from the vacuum transfer space to the vacuum processing chamber
The transfer of the next substrate with the orientation flat adjusted
Vacuum characterized by being configured so that it can be operated independently
Processing equipment. 2. The first board fitting and the second board fitting
2. The true of claim 1, wherein the motion planes of the
Empty processing device. 3. The orientation flat aligning means is provided in the vacuum transfer space.
The vacuum processing apparatus according to claim 1, wherein the vacuum processing apparatus is a vacuum processing apparatus. 4. Vacuum transfer with vacuum processing chamber and substrate transfer means
Space, a vacuum reserve chamber with a cassette inside, and a substrate
An orifice that aligns the orientation flat in a vacuum-exhausted space.
And a substrate aligning means, wherein the substrate transporting means includes a first substrate holder and a second substrate holder.
A method of operating a vacuum processing apparatus having a tool, comprising: a: an orientation flat of the substrate taken out from the cassette.
Aligning the orientation flat with the orientation flat aligning means, and b: aligning the orientation flat aligned substrate with the first substrate
A step of holding with a placing tool and carrying it to the vacuum processing chamber, c: an orientation flat of the next substrate taken out from the cassette
Aligning the orientation flat with the orientation flat aligning means, and d: setting the second substrate after the orientation flat alignment to the second substrate.
Holding the substrate with a device for holding the substrate, e: vacuuming the substrate processed in the vacuum processing chamber.
Hold the first substrate from the processing room to the vacuum transfer space.
Holding and transporting, f: by the second substrate fitting with the orientation flat aligned
The next substrate being held is transferred from the vacuum transfer space to the
Transporting to an empty processing chamber, g: the process of c while the substrate is in the vacuum processing chamber.
And step d), h: the step e and the step f are independently performed.
A method of operating a vacuum processing apparatus, characterized in that