JP2682581B2 - Bonding wire shape inspection method - Google Patents
Bonding wire shape inspection methodInfo
- Publication number
- JP2682581B2 JP2682581B2 JP3065604A JP6560491A JP2682581B2 JP 2682581 B2 JP2682581 B2 JP 2682581B2 JP 3065604 A JP3065604 A JP 3065604A JP 6560491 A JP6560491 A JP 6560491A JP 2682581 B2 JP2682581 B2 JP 2682581B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- shape
- inspection
- height
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 9
- 238000007689 inspection Methods 0.000 title description 23
- 239000000758 substrate Substances 0.000 claims description 9
- 238000012545 processing Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、混成集積回路基板等
でのワイヤボンディング後の外観検査時のボンディング
ワイヤの検査方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting a bonding wire at the time of visual inspection after wire bonding on a hybrid integrated circuit board or the like.
【０００２】[0002]
【従来の技術】図２は従来のこの種ボンディングワイヤ
の検査方法を示すもので、図において、１は混成集積回
路基板、２は基板１に半田付や接着等の接合手段によっ
て接合された集積回路（以下ＩＣという）、３はＩＣ２
上のボンディングパッド、４は基板１上のボンディング
パッド、５はボンディングパッド３，４相互間を結ぶた
めに各パッドにボンディングされるワイヤ、６はワイヤ
５に接触してはならない基板１上のパターン、７は検査
装置の自動焦点機能付カメラ、８はカメラ７からの信号
を処理するために設けられ、画像メモリ、焦点判定部、
良否判定部等を有する検査処理部、９は基板１が装架さ
れる検査テーブルである。2. Description of the Related Art FIG. 2 shows a conventional method for inspecting a bonding wire of this type. In FIG. 2, 1 is a hybrid integrated circuit board, and 2 is an integrated circuit which is joined to the substrate 1 by a joining means such as soldering or adhesion. Circuit (hereinafter referred to as IC), 3 is IC2
The upper bonding pad, 4 is a bonding pad on the substrate 1, 5 is a wire bonded to each pad to connect the bonding pads 3, 4 to each other, and 6 is a pattern on the substrate 1 which should not contact the wire 5. , 7 is a camera with an autofocus function of the inspection device, 8 is provided for processing a signal from the camera 7, and includes an image memory, a focus determination unit,
An inspection processing unit having a pass / fail judgment unit and the like, and an inspection table 9 on which the substrate 1 is mounted.
【０００３】この従来のものにおける高さ方向形状検査
方法について説明する。ワイヤボンディングされた混成
集積回路基板１が搬送されて検査位置で停止、固定され
ると、カメラ７はワイヤボンディング時と同様に基板１
やＩＣ２上のボンディング基準マーク等を認識して、あ
らかじめプログラムされているパッド位置など水平（Ｘ
Ｙ）方向の検査用座標データを補正していく。補正終了
後、カメラ７は検査対象であるワイヤ５付近へ移動す
る。そしてＩＣ２上のパッド３の表面等の基準面ｈ0に
カメラ７の焦点を合わせる。しかる後焦点を上下にずら
しながら数μｍのステップでワイヤ５を撮像し、焦点を
ずらした高さｈ1〜ｈ5とワイヤの焦点が合っている部分
を対応させることによりワイヤ高さ方向情報を得る。こ
れらをつなぎあわせることによりワイヤ全体の高さ方向
形状を検出し、基準データと比較して良否を決定する。A height direction shape inspection method in this conventional one will be described. When the wire-bonded hybrid integrated circuit board 1 is transported, stopped and fixed at the inspection position, the camera 7 is operated in the same manner as the wire-bonded board 1.
And the bonding reference marks on the IC2 are recognized to pre-program the pad positions such as horizontal (X
The coordinate data for inspection in the Y direction is corrected. After the correction, the camera 7 moves to the vicinity of the wire 5 to be inspected. Then, the camera 7 is focused on the reference plane h0 such as the surface of the pad 3 on the IC 2. After that, the wire 5 is imaged in steps of several μm while shifting the focus up and down, and the heights h1 to h5 of the defocus are associated with the in-focus portion of the wire to obtain wire height direction information. By connecting these together, the shape of the entire wire in the height direction is detected and compared with the reference data to determine the quality.
【０００４】[0004]
【発明が解決しようとする課題】従来のワイヤ高さ方向
形状検査は以上のように行なうので、ステップ毎に撮像
および処理を繰り返してワイヤ全体にわたり高さ計測を
行なわなければならず、検査処理時間が長くなるという
問題点がある。Since the conventional shape inspection in the wire height direction is performed as described above, it is necessary to repeat the imaging and processing at each step to measure the height over the entire wire. Has the problem of becoming longer.
【０００５】この発明は、このような問題点を解消する
ためになされたもので、高さ計測を簡素化し、検査処理
時間が短縮できるボンディングワイヤの形状検査方法を
得ることを目的とする。The present invention has been made to solve such a problem, and an object thereof is to obtain a bonding wire shape inspection method capable of simplifying the height measurement and shortening the inspection processing time.
【０００６】[0006]
【課題を解決するための手段】この発明に係るボンディ
ングワイヤの形状検査方法は、ＩＣおよびパターン等が
配置された混成集積回路基板上でボンディングされたワ
イヤの形状を検査するに際し、ＩＣエッジ等のワイヤ接
触不可部及びワイヤ最上部におけるワイヤのＸＹ座標位
置及び高さを検出してワイヤの高さ方向の形状を検査す
るようにしたものである。According to the bonding wire shape inspection method of the present invention, when inspecting the shape of a wire bonded on a hybrid integrated circuit substrate on which an IC, a pattern and the like are arranged, an IC edge or the like is detected. XY coordinate position of the wire at the wire non-contact part and the top of the wire
The shape and the shape of the wire in the height direction are inspected by detecting the placement and the height .
【０００７】[0007]
【作用】この発明におけるワイヤの高さの検出は、ワイ
ヤ全体にわたって一様に計測を行なうのでなく、ワイヤ
接触不可部及びワイヤ最上部におけるワイヤのＸＹ座標
位置及び高さを計測するようにしたので、検査処理時間
が短縮でき、高速検査が可能となる。According to the present invention, the height of the wire is not uniformly measured over the entire wire, but the XY coordinates of the wire at the non-contact portion and the uppermost portion of the wire are not measured.
Since the position and height are measured, the inspection processing time can be shortened and high-speed inspection can be performed.
【０００８】[0008]
【実施例】以下、この発明の一実施例を図にもとづいて
説明する。即ち図１において、１〜９は何れも図２に示
す従来のものと同様であるので説明を省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. That is, in FIG. 1, 1 to 9 are the same as the conventional one shown in FIG.
【０００９】このように構成されたものにおいてワイヤ
の高さ方向形状検査を行なうに際し、ワイヤ５の接触不
可部としてＩＣ２のエッジ２１とパターン６とがある場
合について説明する。ワイヤボンディングされた混成集
積回路基板１が搬送されて検査位置で停止、固定される
と、カメラ７はワイヤボンディング時と同様に基板１や
ＩＣ２上のボンディング基準マーク等を認識してあらか
じめプログラムされているパッド位置などの水平（Ｘ
Ｙ）方向の検査用座標データを補正していく。補正終了
後、カメラ７は検査対象であるワイヤ５付近へ移動す
る。しかる後ＩＣ２上のパッド３の表面などの基準面に
焦点をあわせて基準高さｈ0を計測する。次にワイヤ最
上部に焦点をあわせて、その高さｈ1を検出し、同時に
その時の画像を撮像してワイヤ最上部のＸＹ座標を検出
する。またＩＣエッジ２１上のワイヤ高さを検出するた
めＩＣエッジ上のワイヤのあるべき位置を観察しなが
ら、カメラ７を矢印方向即ち高さ方向に走査し、ＩＣエ
ッジ２１上の点が最も焦点が合って明確に認識できたと
きの高さｈ2を最上部と同様に検出する。さらに基板２
上のパターン６上方のワイヤ高さｈ3も同様に検出す
る。このようにして検出された３点の高さおよび位置を
基準値と比較し、高さ方向形状の良否を判定する。これ
らの検出点における高さがすべて合格範囲であってワイ
ヤ全体の高さ方向形状が不合格になることはほとんどな
いといってよく、万一検出点以外でワイヤが極端に変形
している場合でも、それはＸＹ方向の変形を伴う場合が
ほとんどであるので、ＸＹ平面画像でワイヤの曲がり等
を検査する場合に不良として検出できる。こうしてワイ
ヤの高さ方向形状の計測を簡素化でき検査処理時間の短
縮が可能となる。A case will be described in which the edge 21 of the IC 2 and the pattern 6 are the non-contactable portions of the wire 5 when the shape in the height direction of the wire is inspected in the thus configured device. When the wire-bonded hybrid integrated circuit board 1 is conveyed and stopped and fixed at the inspection position, the camera 7 recognizes the bonding reference marks on the board 1 and the IC 2 and is programmed in advance as in the case of wire bonding. The horizontal position (X
The coordinate data for inspection in the Y direction is corrected. After the correction, the camera 7 moves to the vicinity of the wire 5 to be inspected. Thereafter, the reference height h0 is measured by focusing on the reference surface such as the surface of the pad 3 on the IC 2 . Then, the top of the wire is focused and the height h1 thereof is detected, and at the same time, the image at that time is picked up to detect the XY coordinates of the top of the wire. Further, in order to detect the wire height on the IC edge 21, while observing the position of the wire on the IC edge, the camera 7 is scanned in the arrow direction, that is, the height direction, and the point on the IC edge 21 is most focused. The height h2 when it can be clearly recognized is also detected in the same manner as the uppermost part. Further substrate 2
The wire height h3 above the upper pattern 6 is similarly detected. The heights and positions of the three points thus detected are compared with a reference value to determine whether the shape in the height direction is good or bad. It can be said that all the heights at these detection points are within the acceptable range and the shape of the entire wire in the height direction is not likely to be rejected. However, since it is almost always accompanied by deformation in the XY directions, it can be detected as a defect when inspecting the bending of the wire in the XY plane image. In this way, the measurement of the shape of the wire in the height direction can be simplified and the inspection processing time can be shortened.
【００１０】なおこの実施例では自動焦点機能付きカメ
ラを使用した場合について説明したが、カメラ側が固定
されていて検査テーブル側が高さ方向に移動する方式で
も同様の効果が期待できる。In this embodiment, the case where the camera with the autofocus function is used has been described, but the same effect can be expected in a system in which the camera side is fixed and the inspection table side moves in the height direction.
【００１１】またＩＣエッジ２１と基板パターン６が近
接している場合など要検出点が近接している場合は、数
点の検出点を１つの検出点で代表させてもよい。When the IC edge 21 and the substrate pattern 6 are close to each other, such as when the required detection points are close to each other, several detection points may be represented by one detection point.
【００１２】さらにここでは基板にＩＣを混合したもの
に対して、ワイヤボンディングされたワイヤを対象とし
て説明したが、その他種々のボンディングされたワイヤ
に対しても利用できることはいうまでもない。Further, here, the description has been made with respect to the wire-bonded wire for the IC mixed with the substrate, but it goes without saying that it can also be used for various other bonded wires.
【００１３】[0013]
【発明の効果】上記のようにこの発明によるボンディン
グワイヤの形状検査方法は、ボンディングされたワイヤ
の接触不可部及びワイヤ最上部におけるワイヤのＸＹ座
標位置及び高さを計測するようにしたので、高さ方向形
状検査を簡素化でき、検査処理時間を短縮できるという
効果がある。As described above, according to the bonding wire shape inspection method of the present invention , the XY seat of the wire at the non-contact portion of the bonded wire and the wire uppermost portion.
Since the target position and the height are measured, the height direction shape inspection can be simplified and the inspection processing time can be shortened.
【図１】この発明の一実施例を説明する概略構成図であ
る。FIG. 1 is a schematic configuration diagram illustrating an embodiment of the present invention.
【図２】従来のこの種ボンディングワイヤの形状検査方
法を説明する概略構成図である。FIG. 2 is a schematic configuration diagram illustrating a conventional shape inspection method for this type of bonding wire.
１ 混成集積回路基板 ２ ＩＣ ３，４ ボンディングパッド ５ ワイヤ ６ パターン ７ カメラ ８ 検査処理部 ９ 検査テーブル 1 Hybrid Integrated Circuit Board 2 IC 3,4 Bonding Pad 5 Wire 6 Pattern 7 Camera 8 Inspection Processing Section 9 Inspection Table
───────────────────────────────────────────────────── フロントページの続き (72)発明者 川戸 慎二朗 尼崎市塚口本町８丁目１番１号 三菱電 機株式会社 産業システム研究所内 (72)発明者 橋本 学 尼崎市塚口本町８丁目１番１号 三菱電 機株式会社 産業システム研究所内 (56)参考文献 特開 昭63−304144（ＪＰ，Ａ) 特開 平２−247510（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Shinjiro Kawato 8-1-1 Tsukaguchihonmachi, Amagasaki City Mitsubishi Electric Corporation Industrial Systems Research Institute (72) Inventor Manabu Hashimoto 8-1-1 Tsukaguchihonmachi, Amagasaki City No. Mitsubishi Electric Corporation, Industrial Systems Laboratory (56) References JP-A-63-304144 (JP, A) JP-A-2-247510 (JP, A)
Claims (1)
集積回路基板上で、ボンディングされたワイヤの形状を
検査するものにおいて、上記ＩＣのエッジ部等のワイヤ
接触不可部及びワイヤ最上部におけるワイヤのＸＹ座標
位置及び高さを検出して、ワイヤの高さ方向の形状を検
査するようにしたことを特徴とするボンディングワイヤ
の形状検査方法。1. A method for inspecting the shape of a bonded wire on a hybrid integrated circuit substrate on which an IC, a pattern, etc. are arranged, wherein a wire contact-free portion such as an edge portion of the IC and a wire at the top of the wire XY coordinates
A method for inspecting a shape of a bonding wire, characterized by detecting a position and a height to inspect a shape in a height direction of the wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3065604A JP2682581B2 (en) | 1991-03-05 | 1991-03-05 | Bonding wire shape inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3065604A JP2682581B2 (en) | 1991-03-05 | 1991-03-05 | Bonding wire shape inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04277645A JPH04277645A (en) | 1992-10-02 |
| JP2682581B2 true JP2682581B2 (en) | 1997-11-26 |
Family
ID=13291790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3065604A Expired - Fee Related JP2682581B2 (en) | 1991-03-05 | 1991-03-05 | Bonding wire shape inspection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2682581B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4839858B2 (en) * | 2006-01-26 | 2011-12-21 | 富士ゼロックス株式会社 | Remote indication system and remote indication method |
| JP6445943B2 (en) * | 2015-08-24 | 2018-12-26 | 東芝メモリ株式会社 | Measuring method of semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63304144A (en) * | 1987-06-04 | 1988-12-12 | Fujitsu Ltd | Inspecting device for linear object |
| JPH02247510A (en) * | 1989-03-20 | 1990-10-03 | Fujitsu Ltd | Visual inspection equipment |
-
1991
- 1991-03-05 JP JP3065604A patent/JP2682581B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04277645A (en) | 1992-10-02 |
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