JP2555366Y2 - Sensor structure - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor structure, and more particularly to a sensor structure which is easy to manufacture and has a stable quality.

[0002]

2. Description of the Related Art Conventionally, a pressure sensor as shown in FIG. 5 has been known as a general sensor structure. This pressure sensor has a pressure inlet 52 at one end.
And a metal body 51 having the other end opened. A pressure detecting element 53 serving as a sensor element is disposed so as to close the pressure introduction port 52 of the body 51. A circuit board 54 and a metal plate 57 are sequentially arranged, and a connector 58 is provided in a state where the opening at the other end of the body 51 is closed.

The pressure detecting element 53 is connected to a circuit board 54, and the metal plate 57 is provided between the circuit board 54 and connector pins 59 provided on the connector 58.
Is connected via a pin 55 that penetrates a feedthrough capacitor 56 provided at the end.

In order to assemble this pressure sensor,
First, the pressure detecting element 53 and the circuit board 54 are arranged inside the body 51, and the pin 55 provided on the circuit board 54 is passed through the through capacitor 56.
Are provided, and the pins 55 and the through capacitors 56 are soldered.

Next, a connector 58 provided with a connector pin 59 is provided, and a hole 58 formed in the connector 58 is provided.
a, the pins 55 and the connector pins 59 are soldered, and the holes 58 a of the connector 58 are filled with a potting agent 60.
It is designed to be closed and assembled.

However, when the pins 55 and the feedthrough capacitors 56 are soldered, the solder may drop or scatter on the circuit board 54 side, and it is necessary to prevent the solder from dripping or scattering. However, since the metal plate 57 obstructs the field of view and the dripping or scattering of the solder cannot be visually confirmed, there is a problem in quality control.

This invention solves the above-mentioned problems of the prior art, and has a structure in which dripping or scattering of solder can be visually confirmed at the time of soldering. It is an object of the present invention to provide a sensor structure which is easy and has improved quality.

[0008]

In order to achieve the above-mentioned object, the present invention provides a sensor body and a circuit board connected to the sensor element at a predetermined distance inside a metal body having an open end. A metal plate is disposed in the opening of the body , and a feedthrough capacitor provided in the metal plate is inserted therethrough.
Connector pins to be connected to the pins provided on the circuit board.
That there is a sensor structure, to the metal plate, the through-con
A hole for joining is provided separately from the hole for mounting the denser.
When the connector pin is joined to the pin through the hole of
In both cases, after joining both pins, the joining hole is closed with a metal piece.
This means employs a means configured to block .

[0009]

[Function] This invention adopts the above-mentioned means,
Separate from the hole for mounting the feedthrough capacitor provided on the metal plate
The connector pin can be joined to the pin through the hole for
It is possible to join both pins while checking visually.
Can be done. And the hole for joining is
After joining, it can be closed with a metal plate.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention shown in the drawings will be described below. FIGS. 1 to 4 show an embodiment of a sensor structure according to the present invention. The sensor structure in this embodiment is a pressure sensor, which is made of metal having a pressure inlet 2 at one end and an open end at the other end. Body 1
A pressure detecting element 3 serving as a sensor element is disposed inside the pressure detecting element 2 with the pressure inlet 2 closed.
Are arranged at predetermined intervals,
On the other hand, a feedthrough capacitor 6 is inserted into the opening at the other end of the body 1.
A connector 8 to which a metal plate 7 having a joint is provided is provided, and a pin 5 provided on the circuit board 4 and a connector pin 9 provided on the connector 8 are connected by soldering at a soldering portion 13. I have.

As shown in FIG. 2, the connector 8 has a connector pin 9 penetrating at one end and a hole 8a at the other end. The metal plate 7 is provided with a feedthrough capacitor 6 at one end and a hole 7a having a smaller diameter than the hole 8a formed in the connector 8 at the other end.

The connection between the metal plate 7 and the connector 8 is performed by passing a connector pin 9 provided on the connector 8 through a feedthrough capacitor 6 provided on the metal plate 7 as shown in FIGS. At the same time, the hole 8a of the connector 8 and the hole 7a of the metal plate 7
The feedthrough capacitor 6 is connected to the feedthrough capacitor 6 by soldering, the connector pin 9 on the feedthrough capacitor 6 side is bent, and the tip ends thereof are matched with the holes 7a and 8a.

[0013] A pin 5 provided on the circuit board 4 is provided.
The soldering between the connector 8 and the connector pin 9 was such that the connector 8 was arranged so as to close the opening of the body 1 in a state where the metal plate 7 was joined, and the pin 5 was passed through the tip of the connector pin 9. In this state, the process is performed through holes 7a and 8a provided in the metal plate 7 and the connector 8.

After the soldering between the pins 5 provided on the circuit board 4 and the connector pins 9 is completed, a metal piece 11 is disposed in the hole 8a of the connector 8 and brought into contact with the metal plate 7 to make the connector 8 The lower surface side of the hole 8a is closed, and the hole 8a of the connector 8 is filled with the potting agent 10.

Next, the operation of the pressure sensor having the sensor structure configured as described above will be described. First, when pressure is introduced from the pressure introduction port 2, the pressure detection element 3 generates a signal according to the pressure and outputs the signal to the circuit board 4. The circuit board 4 processes a signal generated by the pressure detecting element 3, and outputs the processed signal to the outside via a pin 5 connected to the circuit board 4 and a connector pin 9 connected to the pin 5. Is output. Then, by detecting a signal output from the connector pin 9, the pressure introduced into the pressure inlet 2 can be measured.

The connection between the pins 5 provided on the circuit board 4 and the connector pins 9 by soldering is performed by the metal plate 7.
And through the holes 7a, 8a provided in the connector 8, and since there is no obstruction between the holes 7a, 8a and the circuit board 4, the state of soldering is clear through the holes 7a, 8a. As can be seen, the work can be performed carefully so that the solder does not drip or scatter on the circuit board 4, and there is no defect in the sensor structure, which is effective in quality control.

Further, the pressure detecting element 3, the circuit board 4 and the like are shielded by the metal body 1 and the metal plate 7, and since the feedthrough capacitor 6 is connected to the connector pin 9, noises from the outside are prevented. The shielding effect can be cut off and the hole 7a of the metal plate 7 is closed by the metal piece 11, so that the shielding effect is not reduced and the measurement accuracy is improved.

[0018]

[Effects of the Invention] The present invention is constructed as described above, and is different from the hole for mounting the feedthrough capacitor provided on the metal plate.
Connect the connector pin to the pin through the connecting hole
So both pins can be joined while visually checking
Will be able to do that. Therefore, on the circuit board
Work carefully so that the solder does not drip or scatter.
Work can be carried out, so that solder drips on the circuit board
Eliminate defective products due to
Can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an embodiment of a sensor structure according to the present invention.

FIG. 2 shows an embodiment of a sensor structure according to the present invention;
It is a schematic sectional drawing which shows a connector and a metal plate.

FIG. 3 shows an embodiment of the sensor structure according to the present invention;
It is a schematic sectional drawing which shows the state which penetrated the connector pin of the connector to the penetration capacitor of the metal plate.

FIG. 4 shows an embodiment of the sensor structure according to the present invention;
FIG. 3 is a schematic cross-sectional view showing a state in which a connector pin of a connector is made to penetrate a through capacitor formed of a metal plate, and the connector pin on the through capacitor side is bent.

FIG. 5 is a schematic sectional view showing a conventional sensor structure.

[Explanation of symbols]

 1, 51 ... body 2, 52 ... pressure inlet 3, 53 ... pressure detecting element (sensor element) 4, 54 ... circuit board 5, 55 ... pin 6, 56 ... through capacitor 7, 57 ... ... metal plates 7a, 8a, 58a ... holes 8, 58 ... connectors 9, 59 ... connector pins 10, 60 ... potting agents 11 ... metal pieces 12, 13 ... soldering parts

Claims (1)

(57) [Scope of request for utility model registration] 1. A sensor element and a circuit board connected to the sensor element are disposed at a predetermined interval inside a metal body having one end opened, and a metal plate is placed in an opening of the body.
Arrange and insert the feedthrough capacitor provided on the metal plate
A connector pin to be connected to a pin provided on the circuit board , wherein the metal plate has a hole separate from the hole for mounting the feedthrough capacitor.
A joining hole is provided, and the pin is inserted into the pin through the joining hole.
After joining the connector pins,
A sensor structure, wherein the joining hole is closed with a metal piece .