JP2545695B2 - Cure device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curing device, for example, a semi-finished product in which a predetermined electronic / electrical element such as a semiconductor element or a resistor is mounted on a lead frame, The present invention relates to a curing device for maintaining a predetermined high temperature state after packaging and for uniformizing the coefficient of linear thermal expansion between respective cured parts.

[0002]

2. Description of the Related Art Conventionally, various devices have been used to perform resin packaging of a semiconductor device, a resistor, etc., which has been mounted on a lead frame, with a thermosetting resin and silica etc. Proposed. In this resin packaging, after setting the lead frame in the cavity provided in the molding die device, the mold of the molding die device is closed, and before and after this, the thermosetting resin material is introduced into the cavity. Then, the resin is cured so as to have a cavity shape, and then the mold is opened, and the molding cycle is about 90 seconds. Within this molding time, since it is not possible to eliminate thermal deformation and the like due to the difference in linear thermal expansion coefficient between the respective cured parts, a semi-finished product in a hot state (for example, 180 ° C) immediately after being taken out from the above molding die device can be obtained. A curing device is used which is stored in the curing device for about 6 hours to make the coefficient of linear thermal expansion uniform between the respective cured parts.

The curing device used in this way is
Batch processing type that processes a certain quantity collectively and
A fully automatic device arranged with the above molding device is used, but in both cases, a curing device provided with a large temperature-controlled room with a large heater (for example, a height of 2.5 m,
The width is 3 m and the depth is 1.6 m).

[0004]

However, according to the curing device described above, since a large-sized constant temperature (high temperature) chamber is provided, a large-capacity large heater for maintaining, for example, 180 ° C. is used. As a result, the temperature rise requires significant time and power. Further, when the semi-finished product is taken in and out, the high temperature chamber is brought into a state of communicating with room temperature (normal temperature) when the opening / closing door to be opened / closed is opened and closed, and the temperature is lowered, and it takes time to raise the temperature again.
Moreover, even if the lot number of semi-finished products is small, it is uneconomical to maintain the entire large high temperature chamber at a predetermined set temperature.

Therefore, the curing device of the present invention has been made in view of the above-mentioned problems, and the purpose thereof is a curing device for curing a semi-finished product after resin packaging, which is installed. Provides a curing device that does not occupy much area, can set the high temperature chamber to a desired set temperature within a short time, and can be used regardless of the lot number of semi-finished products immediately after resin packaging, which is highly economical and versatile To do.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems,
In order to achieve the object, the curing device of the present invention is a curing device for performing curing while maintaining a semi-finished product subjected to resin packaging for a predetermined time at a predetermined high temperature state. In order to maintain the temperature of a predetermined temperature for a predetermined time, it is provided separately, and a plurality of temperature-controlled chambers are arranged in parallel with each other, and a cooling means is provided in parallel with the temperature-controlled chamber for cooling. The chamber is provided with a transport means for appropriately transporting the semifinished product and the finished product to and from the cooling chamber and the cooling chamber, and a control device connected to the constant temperature chamber, the cooling chamber and the transport means.

Further, preferably, the heater is composed of a planar heating element arranged on the inner wall surface of the temperature-controlled room, and
The conveying means is composed of a moving part that reciprocates along the direction in which the temperature-controlled room and the cooling chamber are arranged side by side, and a loading / unloading part that is mounted on the moving part and that performs loading / unloading. Then, preferably, the semi-finished product is resin-packaged in lot units, and a predetermined amount is maintained in a predetermined high temperature state for a predetermined time in a lot unit prepared in a mounted state.

[0008]

With the above structure, the semi-finished product with resin packaging is kept at a high temperature, and the transfer device puts it in one of a plurality of temperature-controlled rooms with the opening / closing doors opened and then opened / closed. After the door is closed, a predetermined high temperature state is maintained for a predetermined time. After that, it is taken out from the temperature-controlled room by the transfer device and transferred to a cooling chamber provided with a cooling means, cooled to obtain a cured cured finished product, and transferred from the cooling chamber to the outside.

[0009]

Embodiments of the present invention will be described below with reference to the accompanying drawings. First, FIG. 1 is a fragmentary cutaway view showing the essential parts of the resin packaging device by breaking them, and is not directly related to the present invention. However, by using this resin packaging device, when the resin packaging is carried out in the small lot unit described above, which is one of the objects of the present invention, and a predetermined amount is prepared in a mounted state, Since it is more effective when used with the curing apparatus of the invention, it will be briefly described below.

In the figure, the upper die-related components shown by adding B after each reference number and A after each reference number
The lower die-related components indicated by are attached at predetermined positions of the press device P as shown in the figure, and when the press device P is open, the upper and lower cavity blocks 2
It is configured to be separated from the separation surface (parting line PL) formed between B and 2A.

As described above, the upper and lower cavity blocks 2B and 2A, which are separably provided with the separation surface PL as the boundary surface, are used to form cavities 15B and 15 for molding resin packages.
A is processed and formed as described later. These upper and lower cavity blocks 2B, 2A are fixed to upper and lower backup plates 9A, 9B for positioning each other, respectively.
A guide 13 fixed to the upper backup plate 9B and a guide bush 14 provided on the lower backup plate 9A are used for mutual positioning between 9B and 9B.

On the other hand, the package molded in the cavity 15B and the ejector pin 11B for pushing the runner 5 to the outside from the upper cavity block 2B obtain a pushing force by the movement operation of the ejector pin receiving upper base 12B holding the ejector pin 11B. I am trying. In addition, the ejector pin 11A that pushes out the package formed in the lower cavity 15A from the lower cavity block 2A to the outside obtains a pushing force by the movement of the ejector pin receiving lower base 12A that holds the ejector pin 11A.

The upper and lower ejector pin receiving bases 1
2B and 12A are configured to operate by the pressing force when the pressing device P is opened and the upper and lower springs 25B and 25A. And the mold with the above structure is the upper and lower base 1
It is attached to the press device P via 0A and 10B. Next, the lower cavity 1 of the lower cavity block 2A
Between the gates 5A, a gate 6 is formed so as to communicate with the runner 5. Under the runner 5, the movable runner 1 obtains a driving force from the actuator 8 and moves in the directions of arrows F and J in the figure. It is provided movably.

The shape of the movable runner 1 is not limited to the conventional cylindrical shape in consideration of the arrangement of the cavities, but is formed into a rectangular shape, for example. FIG. 2 is a plan view of the lower cavity block 2A seen from the separation surface PL of FIG. 1, showing an example of the arrangement of the lower cavity 15A, which is the most characteristic part. That is, in this figure,
The lower cavities 15A are formed by “N” along the longitudinal direction of the lower cavity block 2A, and are formed so as to communicate with the horizontally long runners 5 through the gates 6 that communicate with the respective lower cavities 15A. There is. Below the runner 5 provided in this way, a resin material having a fractured shape close to the outer shape of the runner 5 and put into the movable runner 1 is positioned.

Further, the lower cavity block 2A is provided with a positioning pin 20 which inserts a positioning hole 3E formed in the lead frame 3 to position the lead frame 3 relative to the cavity block.
Then, in the upper cavity block 2B, the upper cavities 15B are respectively formed at positions facing the lower cavities 15A, while the shape portions 2C are formed at positions facing the runners 5 of the lower cavity block 2A as shown in FIG. The ejector pin 11 </ b> B is formed so as to pass through the inside thereof, and the forming portion formed inside the runner 5 is pushed out.

According to the resin package device described above,
The movable runner 1 is driven in the direction of arrow F by the operation of the actuator 8, and the thermosetting resin 19 is gradually introduced into the upper and lower cavities 15A and 15B via the gate 6, and the resin filling into the upper and lower cavities 15A and 15B is completed. do it,
The movable runner 1 stops at the final position. After that, the press device P is opened, the mold is opened, and the resin package portion is ejected from the cavities 15B and 15A by the ejecting operation of the ejector pins 11B and 11A. Then, the robot device remains hot (180 ° C.). It is gripped by the chucking hand and is taken out of the mold.

The semi-finished product S, which is resin-packaged through the above steps, is prepared in a state in which a predetermined number is stacked with the lead frame 6 as shown in FIG. The resin packaged semi-finished product S prepared as described above
Is conveyed to the curing device 30 shown in FIG. Here, FIG. 3 is a plan view showing a schematic configuration of the curing device 30. In the figure, the external dimensions of the curing device 30 are formed in a substantially square shape with one side of about 1 m, and can be configured to have a volume approximately half that of a conventional product. This device 30 includes a container 35 for accommodating the semi-finished products S in a stacked state.
The transfer unit is used as an exchange unit to appropriately convey and take out the
I am trying to insert it. The carrier device includes a carriage 41 that moves laterally on a guide 40 disposed on the front side of the device 30, a carrier 42 that moves on an arm 41A that is integrally provided with the carriage 41, and a carrier 42. And a grip portion 43 that is fixed to the grip portion 43 and grips the container 35.

A drive unit 4 for driving the above-mentioned carriage 41
1A, a drive unit (not shown) that drives the grip 43, and a drive unit (not shown) that drives the carrier 42 are connected to the controller 50 by signal lines shown by broken lines in the drawing. As described later, each component is configured to be drive-controlled. On the other hand, the temperature-controlled room 31 for maintaining the semi-finished product S with the resin packaging in a high temperature state of a predetermined 180 ° C. for a predetermined time of 6 to 8 hours is arranged in the moving direction of the carriage 41 of the transfer device as shown in the figure. Four pieces are arranged along the line. In the room 31A of the temperature-controlled room 31, the temperature-controlled room 3
A heater 37, which is a sheet-like heating element disposed on the inner wall surface of 1, and an opening / closing door 38 that is driven to open / close in the arrow direction by a solenoid (not shown) are individually provided. These heaters 37
An electric wire indicated by a broken line is connected to each solenoid between the control devices 50, and is configured to be appropriately energized.

On the other hand, next to the temperature-controlled room 31, a cooling fan 3 is provided.
The cooling chambers 32 provided with 2A are arranged side by side to cool the temperature of the semi-finished product S in a high temperature state to near room temperature. Further, on the right side of the cooling chamber 32, there is provided a stacker chamber 33 for storing the finished product which has been cooled. Further, a timer 52 for measuring elapsed time and a driver 51 for supplying a predetermined driving power to each drive unit are connected to the CPU and the storage device in the control device 50, and via a signal line and an electric wire. It is configured to control the driving of the transport device, the presence / absence detection of the semi-finished product S, the temperature control, the opening / closing of the opening / closing door, and the like.

FIG. 4 is an external perspective view of the curing device 30 and mainly shows the operation of the transport device. In this figure, the semi-finished product S is resin-packaged in lot units, and then a predetermined amount of the semi-finished product S is prepared in a mounted state in the container 35. The lot unit thus prepared is gripped by the gripping part of the transport device, transferred in the direction D1 in the figure, and then set in the temperature-controlled room 31. After this, the open / close door is closed, the temperature is maintained at a predetermined high temperature for a predetermined time, and the curing is completed. After that, the container 35 is grasped by the grasping portion and taken out in the direction of arrow D3. Following this, the product is conveyed in the cooling chamber 32 direction (arrow D4 direction), inserted into the cooling chamber 32 (arrow D5), waits for cooling, is taken out in the arrow D6 direction, and then the product is sent to the stocker chamber 33. Then, the curing process ends.

According to the curing device 30 described above, the time required to raise the temperature of the temperature-controlled room in the past was 30 minutes, but now it can be 10 minutes. Moreover, the capacity of the heater can be changed to 2 KV from the conventional 20 KV.

[0022]

As described above, according to the present invention, a high temperature chamber can be set to a desired set temperature within a short time without occupying a large installation area, and a lot of semi-finished products after resin packaging can be manufactured. It is possible to provide a curing device excellent in economy and versatility such that it can be used regardless of the quantity.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts showing an embodiment of a resin packaging device.

FIG. 2 is a plan view of a cavity block.

FIG. 3 is a plan view showing a schematic configuration of an embodiment of the present invention.

FIG. 4 is an external perspective view for explaining the operation.

[Explanation of symbols]

 1 Movable Runner, 2A Lower Cavity Block, 2B Upper Cavity Block, 19 Thermosetting Resin, 30 Cure Device, 31 Constant Temperature Room, 32 Cooling Room, 33 Stacker Room, 35 Container, 40 Guide, 41 Carriage, 43 Gripping Part, S It is a semi-finished product.

Claims (3)

(57) [Claims] 1. A curing device for curing a semi-finished product subjected to resin packaging for a predetermined time period while maintaining it at a predetermined high temperature state, wherein a heater and an opening / closing door are provided separately and the predetermined time period is reached. A plurality of thermostatic chambers arranged in parallel with each other in order to maintain the predetermined high temperature state, a cooling chamber arranged in parallel with the thermostatic chamber and provided with a cooling means for cooling, and the thermostatic chamber. And a transport means for appropriately transporting the semi-finished product and the finished product into and out of the cooling chamber, and a controller connected to the constant temperature chamber, the cooling chamber and the transporting means. Cure device. 2. The heater is composed of a planar heating element disposed on the inner wall surface of the temperature-controlled room, and the transfer means is arranged along the direction in which the temperature-controlled room and the cooling chamber are arranged in parallel. The curing device according to claim 1, comprising a moving unit that reciprocates, and a loading / unloading unit that is mounted on the moving unit and performs the loading / unloading. 3. The semi-finished product is resin-packaged in lot units, and is maintained in the predetermined high temperature state for the predetermined time in a lot unit prepared in a mounted state for a predetermined amount. The curing device according to claim 1, wherein the curing device is a curing device.