[go: up one dir, main page]

JP2526738Y2 - Cleaning equipment for dicing machine - Google Patents

Cleaning equipment for dicing machine

Info

Publication number
JP2526738Y2
JP2526738Y2 JP1990067474U JP6747490U JP2526738Y2 JP 2526738 Y2 JP2526738 Y2 JP 2526738Y2 JP 1990067474 U JP1990067474 U JP 1990067474U JP 6747490 U JP6747490 U JP 6747490U JP 2526738 Y2 JP2526738 Y2 JP 2526738Y2
Authority
JP
Japan
Prior art keywords
cutting
nozzle
dicing machine
flange
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990067474U
Other languages
Japanese (ja)
Other versions
JPH0426708U (en
Inventor
宏 大房
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP1990067474U priority Critical patent/JP2526738Y2/en
Publication of JPH0426708U publication Critical patent/JPH0426708U/ja
Application granted granted Critical
Publication of JP2526738Y2 publication Critical patent/JP2526738Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

【考案の詳細な説明】[Detailed description of the invention] 【産業上の利用分野】[Industrial applications]

この考案は半導体等のウエハ、石英、セラミック等の
硬脆物質に切り溝を入れたり、切断するためのダイシン
グ機において、超高速回転を行う外周刃ブレードを安全
に保持するためのフランジの保持部分の洗浄装置に係る
ものである。
This invention is a dicing machine for cutting and cutting hard brittle materials such as semiconductors, wafers, quartz, ceramics, etc., and a flange holding part for safely holding an outer blade rotating at ultra high speed. The cleaning device according to the above.

【従来技術】[Prior art]

第1図、2図において、約30,000rpmの超高速回転す
る外周刃ブレードは軸2に取り付けられ、軸はモータ3
の内部において空気軸受けによって支持されて回転す
る。尚、外周刃ブレード1は前後からフランジ4,5によ
って挟まれて軸2に取り付けられる。ここで第1図の下
側のフランジ4を外側フランジ、上側のモータ側のフラ
ンジ5を内側フランジとする。 そして切削対象物体6に外周刃ブレード1が接触する
点に向かって切削水を吹き付けるノズル7を設け、これ
によって切り粉(スラッジ)を荒い流す。 ここで従来この装置をもって切削作業を連続して行う
と、回転体(主としてフランジ)がスラッジで汚れて回
転バランスが崩れ振動が発生し、高精度切削ができなく
なり、場合によっては、外周刃が破損、飛散する危険が
ある。そこで、回転バランスの崩れを検知し、事故が起
こる前にブレード取り付け機構を分解、清掃し、バラン
スの再調整を行う必要があった。この作業は超高速回転
で、かつ精密切削であるため、非常に難しく、特種技術
者が時間と労力を費やし調整が行なわれ、切削作業のロ
スと考えられて、その解決が望まれていた。しかし、ど
うして部分的に汚れが発生するか不明であった。
In FIGS. 1 and 2, the outer peripheral blade which rotates at a high speed of about 30,000 rpm is attached to the shaft 2 and the shaft is a motor 3.
Is rotated by being supported by an air bearing inside. The outer peripheral blade 1 is attached to the shaft 2 by being sandwiched between the flanges 4 and 5 from front and rear. The lower flange 4 in FIG. 1 is an outer flange, and the upper motor-side flange 5 is an inner flange. Then, a nozzle 7 for spraying cutting water toward a point where the outer peripheral blade 1 comes into contact with the object 6 to be cut is provided, and thereby the cutting powder (sludge) flows roughly. Here, if the cutting operation is continuously performed using the conventional apparatus, the rotating body (mainly the flange) is contaminated with sludge, the rotational balance is lost, and vibration occurs, and high-precision cutting cannot be performed. In some cases, the outer peripheral blade is damaged. There is a risk of splashing. Therefore, it was necessary to detect the rotation balance collapse, disassemble and clean the blade mounting mechanism before the accident occurred, and readjust the balance. This work is very difficult because it is an ultra-high-speed rotation and precision cutting, and a special engineer spends time and effort to make adjustments, which is considered to be a loss of the cutting work, and a solution has been desired. However, it was not clear why the stain was partially generated.

【本考案の問題解決方法】[Problem solving method of the present invention]

この不具合の発生を丁寧に多数回観察すると、内側フ
ランジ5の表面が特に部分的に汚れ、外側フランジ4は
汚れが少ない事が判明した。そこで、その理由を考察す
る。 第1図において、モータ3には空気軸受けが採用され
ており、高圧空気がモータの狭い間隔を通過して、モー
タ外周体と回転軸2との隙間から、矢印8の方向に噴出
する。この排出される空気はモータの高速回転により加
熱された乾燥空気であって、これが内側フランジ5の外
側に向かって、空気膜の流れを作り、ノズル7から吹き
付けられる切削水が内側フランジ5の表面に直接あたる
ことを妨害、遮断している。そしてこの空気膜流は渦流
をなして、切削部から飛散するスラッジ微粉末を巻き込
んで、その一部を内側フランジ5の表面に付着させて汚
れを発生すると考えられる。この汚れが主として内側フ
ランジ5に発生し、外側フランジには少ない理由である
ことが判明した。そこで空気軸受けの排気流の膜を突破
して、内側フランジ5の表面に向かって洗浄水を噴射す
れば問題は解決すると判断した。
By carefully observing the occurrence of this problem many times, it was found that the surface of the inner flange 5 was particularly partially contaminated, and that the outer flange 4 was less contaminated. Therefore, the reason is considered. In FIG. 1, an air bearing is employed for the motor 3, and high-pressure air passes through a narrow space between the motors and is ejected from a gap between the motor outer peripheral body and the rotating shaft 2 in a direction of an arrow 8. The discharged air is dry air heated by the high-speed rotation of the motor, which forms a flow of an air film toward the outside of the inner flange 5, and the cutting water blown from the nozzle 7 is discharged from the surface of the inner flange 5. Obstructs and blocks direct hits. Then, it is considered that this air film flow forms a vortex, entrains the sludge fine powder scattered from the cutting portion, and causes a part thereof to adhere to the surface of the inner flange 5 to generate dirt. It has been found that this stain mainly occurs on the inner flange 5 and less on the outer flange. Therefore, it was determined that the problem would be solved if the cleaning water was sprayed toward the surface of the inner flange 5 by breaking through the exhaust flow film of the air bearing.

【実施例】【Example】

第3図において、従来の洗浄水用ノズル7とは別に、
内側フランジ5の表面に向かって、フランジ用洗浄水を
噴射するノズル9を設ける。そして、その噴流の圧力を
空気軸受けの排出空気の流膜を突破して、洗浄水が直接
フランジ表面にあたる程度の強さとする。
In FIG. 3, apart from the conventional cleaning water nozzle 7,
A nozzle 9 for injecting the flange cleaning water toward the surface of the inner flange 5 is provided. Then, the pressure of the jet flow breaks through the flow film of the discharged air from the air bearing, and the cleaning water has such a strength that the cleaning water directly hits the flange surface.

【効果】【effect】

上記の内側フランジ表面専用の洗浄水噴射を使用する
事により、長時間の安全な切削作業が可能となり、稼働
率を向上させることができる。
By using the above-described cleaning water jet dedicated to the inner flange surface, a long-time safe cutting operation can be performed, and the operation rate can be improved.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本考案の対象とする従来のダイシング機の切削
部の平面図、第2図はその側面図、第3図は考案の実施
例を示す平面図。 1……円形ブレード、2……回転軸 3……モータ、4……外側フランジ 5……内側フランジ、7……切削水ノズル 8……排気流方向、9……洗浄水ノズル
FIG. 1 is a plan view of a cutting portion of a conventional dicing machine to which the present invention is applied, FIG. 2 is a side view thereof, and FIG. 3 is a plan view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 ... Circular blade 2 ... Rotating shaft 3 ... Motor 4 ... Outer flange 5 ... Inner flange 7 ... Cutting water nozzle 8 ... Exhaust flow direction 9 ... Washing water nozzle

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】空気軸受けにより支持される回転軸に、外
周刃ブレードを内外両側から狭持固定し、該ブレードで
脆性材料を切削するダイシング機において、切削対象物
に該ブレードが接触するする点に向かって切削水を吹き
付けるノズルと、フランジのモータ側の内側フランジ表
面に対して洗浄水を噴射するノズルを配設してなるダイ
シング機の洗浄装置。
1. A dicing machine for cutting a brittle material with an outer peripheral blade fixed to both sides of an outer peripheral blade on a rotating shaft supported by an air bearing and contacting the blade with an object to be cut. A cleaning device for a dicing machine, comprising: a nozzle for spraying cutting water toward the nozzle; and a nozzle for injecting cleaning water to the inner flange surface on the motor side of the flange.
JP1990067474U 1990-06-26 1990-06-26 Cleaning equipment for dicing machine Expired - Lifetime JP2526738Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990067474U JP2526738Y2 (en) 1990-06-26 1990-06-26 Cleaning equipment for dicing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990067474U JP2526738Y2 (en) 1990-06-26 1990-06-26 Cleaning equipment for dicing machine

Publications (2)

Publication Number Publication Date
JPH0426708U JPH0426708U (en) 1992-03-03
JP2526738Y2 true JP2526738Y2 (en) 1997-02-19

Family

ID=31601080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990067474U Expired - Lifetime JP2526738Y2 (en) 1990-06-26 1990-06-26 Cleaning equipment for dicing machine

Country Status (1)

Country Link
JP (1) JP2526738Y2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217135A (en) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd Dicing saw
JP6298724B2 (en) * 2014-06-13 2018-03-20 株式会社ディスコ Cutting equipment
JP2019181584A (en) * 2018-04-03 2019-10-24 株式会社ディスコ Processing device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61148004A (en) * 1985-11-27 1986-07-05 株式会社日立製作所 Dicing device
JPS6480506A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Dicer
JPH01210314A (en) * 1988-02-18 1989-08-23 Nec Corp Dicing of semiconductor wafer

Also Published As

Publication number Publication date
JPH0426708U (en) 1992-03-03

Similar Documents

Publication Publication Date Title
JP6094696B2 (en) Dicing machine
KR101533931B1 (en) Method and apparatus for cleaning of three dimensional wafer surface
US6220771B1 (en) Wafer backside protection apparatus
KR102353654B1 (en) Cleaning apparatus
JP2887408B2 (en) Wafer cleaning equipment
JP2526738Y2 (en) Cleaning equipment for dicing machine
JP2017222003A (en) Spindle unit
US6766813B1 (en) Apparatus and method for cleaning a wafer
JP7464467B2 (en) Wafer Cleaning Equipment
JP2017127910A (en) Cutting device
JP4550465B2 (en) Underwater polishing equipment
US6308361B1 (en) Cleaning apparatus
TW202000329A (en) Cutter wheel cleaning mechanism and scribe device capable of removing dusts or cutting residuals attached to the cutter tip or gap between the holder and the cutter in a short time without using manual operation
JP6489453B2 (en) Liquid curtain forming device
JPH05206266A (en) Wafer dicing apparatus
JP6439608B2 (en) Chamfering method and chamfering apparatus
JP4330209B2 (en) Substrate cleaning method
JP2001212758A (en) Polishing machine and removing method for polishing powder
JPS63109978A (en) Manufacturing device for semiconductor device
JPH09320994A (en) Dicing equipment
JP2000021822A (en) Maintenance method of cutting device
JPH0290523A (en) Substrate cleaning equipment
JPH06270138A (en) Cooler of circular saw
JP2021094636A (en) Pallet exchange device of machine tool
JPH04206725A (en) Cleaning and device for semiconductor wafer