JP2024151796A - SUBSTRATE HOLDING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR DETERMINING CHUCK PIN POSITION - Patent application - Google Patents

Abstract

To provide a technique capable of highly precisely determining a positional state of a chuck pin.SOLUTION: A substrate holding device 2 includes a plurality of chuck pins 22, a first rotary magnet 33a, a first magnetic sensor 40a, and a control part 90. Each of the plurality of chuck pins 22 is provided to be rotatable between a holding position in contact with a periphery of a substrate W and an open position away from the periphery of the substrate W. The first rotary magnet 33a has a pair of magnetic pole faces radially intersecting a first drive axis Q2a around which a first chuck pin 22a among the plurality of chuck pins 22 rotates. The first rotary magnet 33a is fixed to the first chuck pin 22a and auto-rotates integrally with the first chuck pin 22a. The first magnet sensor 40a measures a magnet field angle indicating the direction of a magnetic field due to the first rotary magnet 33a at a position aligned with the first rotary magnet 33a in a direction along the first drive axis Q2a. The control part 90 determines a positional state of the first chuck pin 22a based on the magnetic field angle.SELECTED DRAWING: Figure 3

Description

This disclosure relates to a substrate holding device, a substrate processing device, and a method for determining the position of a chuck pin.

Substrate processing apparatuses for processing substrates have been proposed in the past (for example, Patent Document 1). In Patent Document 1, the substrate processing apparatus includes a spin unit and a nozzle. The spin unit holds the substrate in a horizontal position and rotates the substrate around a predetermined rotation axis. The rotation axis is an axis that passes through the center of the substrate and is aligned in the vertical direction. The nozzle supplies a processing fluid (processing liquid or processing gas) to a main surface of the substrate held by the spin unit. The processing fluid acts on the main surface of the substrate, thereby performing a process (for example, a cleaning process or an etching process, etc.) according to the processing fluid on the main surface of the substrate.

The spin unit includes multiple holding members arranged along the periphery of the substrate and a drive unit that drives the multiple holding members. The multiple holding members are rotated by the drive unit and stop at an open position, a holding position, and a closed position. The holding positions are positions where each holding member abuts against the periphery of the substrate. The multiple holding members can hold the substrate when positioned at their respective holding positions. The open position is a position where the holding members are away from the periphery of the substrate and is farther from the axis of rotation than the holding positions. The closed position is a position where the holding members can stop when no substrate is loaded and is closer to the axis of rotation than the holding positions.

In Patent Document 1, a position detection unit is provided that detects the position of the holding member. The position detection unit includes an arm, a metal detectable member, a first magnetic sensor, a second magnetic sensor, and a third magnetic sensor. The arm moves together with the holding member. The detectable member is attached to the arm. Therefore, when the holding member rotates to the closed position, the holding position, and the open position, the detectable member moves to the first position, the second position, and the third position, respectively. When the detectable member is located at the first position, the first magnetic sensor detects the detectable member and outputs a detection signal. The second magnetic sensor detects the detectable member located at the second position, and the third magnetic sensor detects the detectable member located at the third position. This allows the position detection unit to indirectly detect the position of the detectable member as the position of the holding member.

JP 2018-133515 A

In Patent Document 1, the position detection unit detects the presence or absence of a member to be detected at each of the first position, the second position, and the third position. For this reason, it is not possible to detect the rotational position of the holding member (hereinafter referred to as the chuck pin) more precisely. Therefore, for example, when the holding position of the holding member fluctuates due to various factors such as individual differences in the substrate, the position detection unit cannot necessarily detect the rotational position of the holding member with high accuracy.

Therefore, the present disclosure aims to provide a technology that can determine the position state of the chuck pin with high accuracy.

The first aspect is a substrate holding device, comprising: a plurality of chuck pins spaced apart from one another along the periphery of the substrate, each of which is rotatable between a holding position in contact with the periphery of the substrate and an open position spaced from the periphery of the substrate; a first rotating magnet having a pair of magnetic pole faces that intersect in the radial direction of a first drive axis about which a first chuck pin of the plurality of chuck pins rotates, and fixed to the first chuck pin and rotating integrally with the first chuck pin; a first magnetic sensor that measures a magnetic field angle indicating the direction of a magnetic field generated by the first rotating magnet at a position aligned with the first rotating magnet in a direction along the first drive axis; and a control unit that determines the position state of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor.

The second aspect is a substrate holding device according to the first aspect, in which the first chuck pin, the first rotating magnet, and the first magnetic sensor are arranged in this order on the first drive axis.

A third aspect is a substrate holding device according to the second aspect, in which the first magnetic sensor includes a magnetoresistive effect sensor.

The fourth aspect is a substrate holding device according to the second aspect, in which the first magnetic sensor includes a Hall sensor.

A fifth aspect is a substrate holding device according to any one of the first to fourth aspects, comprising a storage unit that stores data defining a first correspondence between the rotational position of the first chuck pin and the magnetic field angle of the first rotating magnet, and the control unit determines the rotational position of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor and the first correspondence.

A sixth aspect is a substrate holding device according to the fifth aspect, comprising a second rotating magnet having a pair of magnetic pole faces that intersect in the radial direction of a second drive axis about which a second chuck pin of the plurality of chuck pins rotates, fixed to the second chuck pin and rotating integrally with the second chuck pin around the second drive axis, and a second magnetic sensor that is arranged alongside the second rotating magnet on the second drive axis and measures a magnetic field angle that indicates the direction of the magnetic field generated by the second rotating magnet, the memory unit stores data that defines a second correspondence between the rotational position of the second chuck pin and the magnetic field angle of the second rotating magnet, and the control unit determines the rotational position of the second chuck pin based on the magnetic field angle measured by the second magnetic sensor and the second correspondence.

The seventh aspect is a substrate holding device according to the sixth aspect, in which the control unit determines the position state of the first chuck pin based on a comparison between the rotational position of the first chuck pin and a predetermined range, determines the position state of the second chuck pin based on a comparison between the rotational position of the second chuck pin and the predetermined range, and uses the same angle range as the predetermined range for the first chuck pin and the second chuck pin.

The eighth aspect is a substrate holding device according to any one of the first to fourth aspects, further comprising a movably provided driving magnet, and a magnet driving unit that is controlled by the control unit and moves the driving magnet so that the distance between the driving magnet and the first rotating magnet changes, thereby rotating the first chuck pin by the magnetic force between the driving magnet and the first rotating magnet, and in a holding state in which the substrate is loaded and the driving magnet is located at a first position, the first chuck pin is located at the holding position, and in an open state in which the driving magnet is located at a second position, the first chuck pin is located at the open position.

A ninth aspect is a substrate holding device according to the eighth aspect, comprising a storage unit that stores data defining a first A correspondence relationship between the rotational position of the first chuck pin and the magnetic field angle of the first rotating magnet when the drive magnet is located at a first position, and the control unit calculates a calculated value of the rotational position of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor and the first A correspondence relationship.

A tenth aspect is a substrate holding device according to the ninth aspect, in which the control unit determines that the first chuck pin is located at the holding position when the calculated value of the first chuck pin is within a holding range for the predetermined holding position.

The eleventh aspect is a substrate holding device according to the tenth aspect, in which, in a closed state in which the substrate is not loaded and the drive magnet is located at the first position, the first chuck pin is located at a closed position opposite the open position with respect to the holding position, and the control unit determines that the first chuck pin is located at the closed position when the calculated value of the first chuck pin obtained in the closed state is on the closed position side with respect to the holding range.

A twelfth aspect is a substrate holding device according to the tenth or eleventh aspect, in which the control unit determines that the first chuck pin is in the open position when the calculated value of the first chuck pin obtained in the open state is on the open position side of the holding range.

A thirteenth aspect is a substrate holding device according to any one of the tenth to twelfth aspects, in which the control unit determines that a climbing abnormality has occurred when the calculated value of the first chuck pin obtained in the holding state is on the opposite side of the holding range from the open position.

A fourteenth aspect is a substrate holding device according to any one of the tenth to thirteenth aspects, in which the control unit determines that a sticking abnormality has occurred when the calculated value of the first chuck pin obtained in the holding state is on the open position side of the holding range.

A fifteenth aspect is a substrate holding device according to any one of the tenth to fourteenth aspects, in which the control unit determines that a sticking abnormality has occurred when the calculated value of the first chuck pin obtained in the open state is not on the open position side of the holding range.

A sixteenth aspect is a substrate holding device according to any one of the ninth to eleventh aspects, in which the memory unit also stores data defining a first B correspondence relationship between the rotational position of the first chuck pin in the open state and the magnetic field angle of the first rotating magnet, and the control unit obtains the calculated value of the rotational position of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor in the holding state and the first A correspondence relationship, and determines whether the calculated value of the first chuck pin is within a holding range for the holding position that is preset, and obtains the calculated value of the rotational position of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor in the open state and the first B correspondence relationship, and determines whether the calculated value of the first chuck pin is within a predetermined opening range for the open state.

A seventeenth aspect is a substrate holding device according to any one of the first to sixteenth aspects, comprising a memory unit, and the control unit stores, as the holding position, the rotational position of the first chuck pin determined based on the magnetic field angle measured by the first magnetic sensor in a holding state in which the multiple chuck pins are in contact with the periphery of the substrate, and causes the memory unit to store history data indicating changes in the holding position over time.

The eighteenth aspect is a substrate processing apparatus comprising a substrate holding device according to any one of the first to seventeenth aspects and a nozzle that ejects a processing liquid toward a main surface of the substrate held by the substrate holding device.

The 19th aspect is a method for determining the position of a chuck pin, comprising a measurement step in which a first magnetic sensor measures a magnetic field angle indicating the direction of the magnetic field of a first rotating magnet that rotates integrally with a first chuck pin among a plurality of chuck pins, each of which rotates around a drive axis between a holding position in contact with the peripheral edge of a substrate and an open position spaced apart from the peripheral edge of the substrate, at a position aligned on the drive axis, and a determination step in which the position state of the first chuck pin is determined based on the magnetic field angle measured by the first magnetic sensor.

The 20th aspect is a chuck pin position determination method according to the 19th aspect, which includes a first pre-measurement step performed before the measurement step, in which the first magnetic sensor measures the magnetic field angle of the first rotating magnet in a closed state in which the substrate is not loaded and each of the chuck pins is located at a closed position inside the holding position in the circumferential direction about the drive axis, and a second pre-measurement step performed before the measurement step, in which the first magnetic sensor measures the magnetic field angle of the first rotating magnet in a holding state in which each of the chuck pins is located at the holding position. In the determination step, the rotational position of the first chuck pin is determined based on the magnetic field angle measured in the measurement step and a correspondence relationship defined by the magnetic field angle corresponding to the closed position measured in the first pre-measurement step and the magnetic field angle corresponding to the holding position measured in the second pre-measurement step, and the magnetic field angle measured in the measurement step, and the position state of the first chuck pin is determined based on the rotational position.

According to the first, fourth and nineteenth aspects, the direction of the magnetic field (magnetic field angle) generated by the first rotating magnet reflects the rotational position of the first chuck pin with high accuracy. This allows the control unit to determine the position state of the first chuck pin with higher accuracy.

According to the second aspect, a pair of magnetic pole faces of the first rotating magnet intersect in the radial direction with respect to the first drive axis, and the first magnetic sensor is aligned with the first rotation axis at the first drive axis. Therefore, the magnetic flux passing through the first magnetic sensor rotates together with the rotation of the first chuck pin. Therefore, the first magnetic sensor can easily measure the direction of the magnetic field generated by the first rotating magnet.

According to the third aspect, the size of the first magnetic sensor (the size in the direction along the first drive axis) can be reduced.

According to the fifth aspect, the control unit can determine the rotational position of the first chuck pin through simple processing.

According to the sixth aspect, the control unit can absorb the individual differences between the first chuck pin and the second chuck pin and determine the rotational positions of the first chuck pin and the second chuck pin with high accuracy.

According to the seventh aspect, the operator only needs to set a common angle range for the first chuck pin and the second chuck pin, making the setting work by the operator easier.

According to the eighth aspect, the first rotating magnet is also used as one element of the pin drive unit that rotates the first chuck pin. This makes it possible to reduce the manufacturing cost and size of the substrate holding device compared to when a magnet for detecting the rotational position of the first chuck pin and a magnet for rotating the first chuck pin are provided separately.

According to the ninth aspect, the calculated value of the rotational position of the first chuck pin can be easily calculated.

According to the tenth aspect, the position state of the holding position can be easily determined.

According to the eleventh aspect, the rotational position of the first chuck pin is determined by comparing the calculated value with the holding range. This eliminates the need to set a predetermined range (closed range) for the closed position, simplifying the setting work by the operator.

According to the twelfth aspect, the rotational position of the first chuck pin is determined by comparing the calculated value with the holding range. This eliminates the need to set a predetermined range (open range) for the open position, simplifying the setting work by the operator.

According to the thirteenth aspect, it is possible to detect run-up abnormalities with high accuracy.

According to the 14th aspect, it is possible to easily detect sticking abnormalities.

According to the fifteenth aspect, it is possible to easily detect sticking abnormalities.

According to the sixteenth aspect, the actual rotational position of the first chuck pin can be obtained even in the open state. Therefore, the control unit can determine the position state of the first chuck pin with higher accuracy even in the open state.

According to the seventeenth aspect, the amount of wear on the chuck pin can be grasped.

According to the 18th aspect, a substrate processing apparatus can be realized using a substrate holding device that can determine the position state of the chuck pin with high accuracy.

According to the twentieth aspect, data indicating the correspondence can be obtained in advance. Then, the rotation position is calculated based on the correspondence, so that the rotation position can be calculated easily.

1 is a plan view illustrating an example of a configuration of a substrate processing apparatus. FIG. 2 is a block diagram illustrating an example of the configuration of a control unit. FIG. 2 is a vertical cross-sectional view illustrating an example of the configuration of a processing unit. 1 is a plan view illustrating an example of a configuration of a substrate holding device. FIG. 4 is a diagram illustrating an example of a cross section taken along line VV in FIG. 3. FIG. 2 is a diagram illustrating an example of a magnetic flux generated by a rotating magnet. 6A and 6B are diagrams for explaining an example of a position state of a chuck pin. 1 is a diagram illustrating an example of a relationship between a magnetic field angle measured by a magnetic sensor and a rotation angle (pin angle) of a chuck pin. FIG. 13 is a flowchart showing a first example of a pre-registration process. FIG. 13 is a diagram showing an example of a plurality of graphs each corresponding to a plurality of chuck pins. FIG. 2 is a functional block diagram showing a first example of the internal configuration of a control unit. 13 is a flowchart showing a first example of a substrate holding process in the processing unit. 13 is a flowchart showing a second example of a substrate holding process in the processing unit. FIG. 2 is a diagram for explaining each abnormality. FIG. 2 is a diagram for explaining each abnormality. 13 is a diagram for explaining the magnetic field angle when a sticking abnormality (holding position) occurs. FIG. 11 is a table showing the presence or absence of a substrate, the position of a drive magnet, the determination conditions, and the determination results. FIG. 13 is a diagram showing an example of a state in which a pin body is worn; 11 is a graph showing a schematic example of a change in a holding position over time. 13 is a flowchart showing a third example of a substrate holding process in the processing unit. 13 is a flowchart illustrating a second example of the advance registration process. FIG. 11 is a functional block diagram showing a second example of the internal configuration of the control unit. 13 is a flowchart showing a fourth example of a substrate holding process in the processing unit. FIG. 13 is a diagram illustrating an example of a configuration of a magnetic sensor according to a sixth embodiment.

The following describes the embodiments in detail with reference to the drawings. In the drawings, the dimensions and numbers of each part are exaggerated or simplified as necessary for ease of understanding. In the following description, similar components are illustrated with the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions of them may be omitted to avoid duplication.

In addition, even if ordinal numbers such as "first" or "second" are used in the following description, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and are not limited to the ordering that may result from these ordinal numbers.

When an expression indicating a relative or absolute positional relationship (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) is used, the expression not only strictly indicates the positional relationship, but also indicates a state in which the angle or distance is relatively displaced within a range in which a tolerance or similar function is obtained, unless otherwise specified. When an expression indicating an equal state (e.g., "same," "equal," "homogeneous," etc.) is used, the expression not only strictly indicates a quantitatively equal state, but also indicates a state in which a difference exists in which a tolerance or similar function is obtained, unless otherwise specified. When an expression indicating a shape (e.g., "square shape" or "cylindrical shape," etc.) is used, the expression not only strictly indicates the shape geometrically, but also indicates a shape having, for example, unevenness or chamfering, within a range in which a similar effect is obtained, unless otherwise specified. When an expression "comprises," "has," "includes," "includes," or "has" is used for one component, the expression is not an exclusive expression that excludes the presence of other components. When the expression "at least one of A, B, and C" is used, the expression includes only A, only B, only C, any two of A, B, and C, and all of A, B, and C.

First Embodiment
<Overall configuration of substrate processing apparatus>
1 is a plan view illustrating an example of the configuration of a substrate processing apparatus 100. The substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W one by one.

The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic electroluminescence (EL), a substrate for a flat panel display (FPD), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for a solar cell. The substrate W has a thin, flat plate shape. In the following, the substrate W is assumed to be a semiconductor wafer. The substrate W has, for example, a disk shape. The diameter of the substrate W is, for example, about 300 mm, and the film thickness of the substrate W is, for example, about 0.5 mm or more and about 3 mm or less.

In the example of FIG. 1, the substrate processing apparatus 100 includes an indexer block 110, a processing block 120, and a control unit 90. The processing block 120 is a section that mainly processes substrates W, and the indexer block 110 is a section that mainly transports substrates W between the outside of the substrate processing apparatus 100 and the processing block 120.

The indexer block 110 includes a load port 111 and a first transport section 112. A substrate container (hereinafter referred to as a carrier) C that is brought in from the outside is placed on the load port 111. The carrier C accommodates a plurality of substrates W, for example, arranged at intervals from each other in the vertical direction. In the example of FIG. 1, a plurality of load ports 111 are arranged.

The first transport unit 112 is a transport robot and can remove an unprocessed substrate W from a carrier C placed on each load port 111. The first transport unit 112 can also be called an indexer robot. The first transport unit 112 transports the unprocessed substrate W removed from the carrier C to the processing block 120. The processing block 120 can process the unprocessed substrate W. The first transport unit 112 can also receive a processed substrate W from the processing block 120 and transport the processed substrate W to a carrier C in the load port 111.

In the example of FIG. 1, the processing block 120 includes a plurality of processing units 1 and a second transport section 122. The second transport section 122 is a transport robot and can transport substrates W between the first transport section 112 and the plurality of processing units 1. In the example of FIG. 1, the processing block 120 also includes a placement section 123. The placement section 123 is, for example, a shelf on which a plurality of substrates W can be placed in a vertically aligned state. The first transport section 112 places an unprocessed substrate W on the placement section 123. The second transport section 122 removes the unprocessed substrate W from the placement section 123 and transports the substrate W to the processing unit 1. The processing unit 1 processes the substrate W. The configuration of the processing unit 1 will be described later. The second transport section 122 removes the processed substrate W from the processing unit 1 and transports the substrate W to the placement section 123. The first transport section 112 removes the substrate W from the placement section 123 and transports the substrate W to the carrier C of the load port 111.

In the example of FIG. 1, multiple (e.g., four) processing units 1 are arranged to surround the second transport section 122 in a plan view. This second transport section 122 may also be called a center robot. Multiple processing units 1 may be stacked vertically at each position in a plan view. In other words, multiple towers TW (four in the figure) composed of multiple processing units 1 stacked vertically may be arranged to surround the second transport section 122.

The control unit 90 controls the substrate processing apparatus 100 in an integrated manner. Specifically, the control unit 90 controls the first transport unit 112, the second transport unit 122, and the processing unit 1. FIG. 2 is a block diagram showing an example of the configuration of the control unit 90. The control unit 90 is an electronic circuit, and has, for example, a data processing unit 91 and a storage unit 92. In the specific example of FIG. 2, the data processing unit 91 and the storage unit 92 are connected to each other via a bus 93. The data processing unit 91 may be, for example, an arithmetic processing device such as a CPU (Central Processor Unit). The storage unit 92 may have a non-transient storage unit (for example, a ROM (Read Only Memory)) 921 and a temporary storage unit (for example, a RAM (Random Access Memory)) 922. The non-transient storage unit 921 may store, for example, a program that specifies the processing to be performed by the control unit 90. The data processing unit 91 executes this program, so that the control unit 90 can execute the processing specified in the program. Of course, a part or all of the processing to be executed by the control unit 90 may be executed by hardware such as a dedicated logic circuit.

As shown in FIG. 2, the control unit 90 may be electrically connected to a storage unit 94. The storage unit 94 is a non-transitory storage unit, and may be, for example, a memory or a hard disk. In the example of FIG. 2, data D1 is stored in the storage unit 94. Data D1 will be described in detail later.

<Processing unit>
Fig. 3 is a vertical cross-sectional view showing an example of the configuration of a processing unit 1. It is not necessary that all processing units 1 belonging to the substrate processing apparatus 100 have the configuration shown in Fig. 3. It is sufficient that at least one processing unit 1 has the configuration shown in Fig. 3. The processing unit 1 includes a substrate holding device 2 and a nozzle 6.

The substrate holding device 2 holds the substrate W. In the example of FIG. 3, the substrate holding device 2 holds the substrate W in a horizontal position. The horizontal position here means that the thickness direction of the substrate W is along the vertical direction. The substrate holding device 2 may also have a function of rotating the substrate W around a rotation axis Q1. The rotation axis Q1 is an axis that passes through the center of the substrate W and is along the vertical direction. Such a substrate holding device 2 may also be called a spin chuck. An example of a specific configuration of the substrate holding device 2 will be described in detail later.

The nozzle 6 ejects a processing fluid (e.g., a processing liquid) toward the main surface of the substrate W held by the substrate holding device 2. In the example of FIG. 3, the nozzle 6 is provided vertically above the substrate W held by the substrate holding device 2, and ejects the processing liquid toward the upper surface of the substrate W. The processing liquid may be a chemical liquid, a rinsing liquid, or a charge removing liquid. The chemical liquid may be a cleaning liquid for removing foreign matter on the substrate W, or an etching liquid for removing a target film. As the chemical liquid, for example, a hydrofluoric nitric acid solution obtained by mixing hydrofluoric acid, nitric acid, and water, a hydrofluoric acid-hydrogen peroxide solution (FPM) obtained by mixing hydrofluoric acid, hydrogen peroxide, and water, tetramethylammonium hydroxide (TMAH), a mixture of sulfuric acid and hydrogen peroxide (SPM), ammonia water, a mixture of ammonia, hydrogen peroxide, and water (SC-1), and a mixture of hydrogen chloride, hydrogen peroxide, and water (SC-2) can be used. The chemical liquid may be a single liquid instead of a mixture. For example, a single liquid such as hydrofluoric acid (HF), hydrogen peroxide, or sulfuric acid can be used as the chemical liquid. The rinse liquid may be pure water (i.e., deionized water) or an organic solvent such as isopropyl alcohol, which is more volatile than pure water. The charge removing liquid is a liquid for removing electric charges from the substrate W, and may be carbon dioxide water. Carbon dioxide water may be used as the rinse liquid.

In the example of FIG. 3, the downstream end of the liquid supply pipe 62 is connected to the nozzle 6. The upstream end of the liquid supply pipe 62 is commonly connected to the downstream ends of the first supply pipe 62a and the second supply pipe 62b. The upstream end of the first supply pipe 62a is connected to a chemical liquid supply source, and the upstream end of the second supply pipe 62b is connected to a rinse liquid supply source. The chemical liquid supply source supplies the chemical liquid to the upstream end of the first supply pipe 62a, and the rinse liquid supply source supplies the rinse liquid to the upstream end of the second supply pipe 62b. In the example of FIG. 3, a first supply valve 63a and a first flow rate adjustment valve 64a are interposed in the first supply pipe 62a, and a second supply valve 63b and a second flow rate adjustment valve 64b are interposed in the second supply pipe 62b. The first supply valve 63a switches the opening and closing of the first supply pipe 62a, and the first flow rate adjustment valve 64a adjusts the flow rate of the chemical liquid flowing through the first supply pipe 62a. The second supply valve 63b switches the second supply pipe 62b between open and closed states, and the second flow rate adjustment valve 64b adjusts the flow rate of the rinse liquid flowing through the second supply pipe 62b. The first flow rate adjustment valve 64a and the second flow rate adjustment valve 64b may be mass flow controllers. The first supply valve 63a, the second supply valve 63b, the first flow rate adjustment valve 64a, and the second flow rate adjustment valve 64b are controlled by, for example, the control unit 90.

The processing unit 1 may include a nozzle movement drive unit (not shown) that moves the nozzle 6. The nozzle movement drive unit moves the nozzle 6 between a processing position and a standby position, which will be described below. The processing position is a position where the nozzle 6 ejects processing liquid toward the main surface of the substrate W held by the substrate holding device 2, and is, for example, a position vertically opposite the center of the substrate W. The example of FIG. 3 shows the nozzle 6 positioned at the processing position. The standby position is a position where the nozzle 6 does not eject processing liquid toward the main surface of the substrate W, and is, for example, a position radially outward from the substrate W. The nozzle movement mechanism has, for example, a linear motion mechanism such as an arm rotation mechanism having a motor or a ball screw mechanism having a motor.

When the nozzle 6 is positioned at the processing position and the chemical liquid is ejected toward the main surface of the rotating substrate W, the chemical liquid lands on the main surface of the substrate W. The chemical liquid flows radially outward due to the centrifugal force caused by the rotation of the substrate W. At this time, the chemical liquid acts on the main surface of the substrate W, and chemical processing according to the type of chemical liquid is performed on the substrate W.

After the chemical processing, when the nozzle 6 ejects rinsing liquid toward the main surface of the rotating substrate W, the rinsing liquid lands on the main surface of the substrate W. The rinsing liquid flows radially outward due to the centrifugal force associated with the rotation of the substrate W, and splashes outside the periphery of the substrate W. This performs a rinsing process in which the rinsing liquid pushes the chemical liquid on the main surface of the substrate W radially outward. The rinsing process replaces the processing liquid on the main surface of the substrate W from the chemical liquid to the rinsing liquid.

After the rinsing process, the substrate holding device 2 can increase the rotation speed of the substrate W to dry the substrate W.

Although not shown in the example of FIG. 3, the processing unit 1 may be provided with a guard to prevent splashes from the periphery of the substrate W, and may be provided with various other structures necessary for processing the substrate W.

<Substrate holding device 2>
Fig. 4 is a plan view showing a schematic example of the configuration of the substrate holding device 2. In Fig. 4, the substrate W is indicated by a two-dot chain line. Fig. 5 is a view showing a schematic example of a cross section taken along line VV in Fig. 3.

As shown in FIG. 3, the substrate holding device 2 includes a plurality of chuck pins 22, a rotary magnet 33, and a magnetic sensor 40. In the example of FIG. 3, the substrate holding device 2 also includes a spin base 21 and a rotary drive unit 50.

As shown in FIG. 4, the multiple chuck pins 22 are arranged at intervals along the periphery of the substrate W. That is, the multiple chuck pins 22 are arranged along a virtual circle (not shown) centered on the rotation axis Q1. The multiple chuck pins 22 are provided, for example, at equal intervals. In the example of FIG. 4, the multiple chuck pins 22 are shown as a first chuck pin 22a, a second chuck pin 22b, a third chuck pin 22c, and a fourth chuck pin 22d.

Each chuck pin 22 is rotatable in the forward and reverse directions around the drive axis Q2. That is, the first chuck pin 22a is rotatable around the first drive axis Q2a, the second chuck pin 22b is rotatable around the second drive axis Q2b, the third chuck pin 22c is rotatable around the third drive axis Q2c, and the fourth chuck pin 22d is rotatable around the fourth drive axis Q2d. In the example of FIG. 4, each drive axis Q2 is located slightly radially outward from the periphery of the substrate W.

Each chuck pin 22 can rotate between a holding position Pc2 and an open position Pc3, which will be described next. The holding position Pc2 is a position where the chuck pin 22 (specifically, the pin body 221) abuts against the peripheral edge of the substrate W. In the example of FIG. 4, the chuck pin 22 positioned at the holding position Pc2 is shown in solid lines. By positioning the multiple chuck pins 22 at their respective holding positions Pc2, the multiple chuck pins 22 can hold the substrate W. The open position Pc3 is a position where the chuck pin 22 (specifically, the pin body 221) is separated from the peripheral edge of the substrate W. In the example of FIG. 4, the chuck pin 22 positioned at the open position Pc3 is shown in dashed lines. When the multiple chuck pins 22 are positioned at their respective open positions Pc3, the substrate W is released from the holding by the multiple chuck pins 22.

In the examples of Figures 3 and 4, the chuck pin 22 includes a pin body 221 and a pin base 222. For example, the pin base 222 has a cylindrical shape and is provided with its central axis aligned in the vertical direction. In the example of Figure 4, the pin base 222 is provided with its central axis offset from the drive axis Q2.

The pin body 221 protrudes vertically upward from the upper surface of the pin base 222. The pin body 221 has, for example, a cylindrical shape, and is disposed with its central axis aligned along the vertical direction. The pin body 221 is disposed radially outward from the periphery of the substrate W, at a position offset from the drive axis Q2. Therefore, when the chuck pin 22 rotates around the drive axis Q2, the pin body 221 moves in the circumferential direction about the drive axis Q2.

When the chuck pin 22 is in the holding position Pc2, the side of the pin body 221 abuts against the peripheral edge of the substrate W, and when the chuck pin 22 is in the open position Pc3, the pin body 221 moves away from the peripheral edge of the substrate W.

In the examples of Figures 3 and 4, the substrate holding device 2 also includes a spin base 21, and the chuck pins 22 are rotatably arranged relative to the spin base 21. The spin base 21 has, for example, a plate-like shape and is arranged with its thickness direction along the vertical direction. In the example of Figure 4, the spin base 21 has a circular shape centered on the rotation axis Q1 in a plan view. The diameter of the spin base 21 is, for example, larger than the diameter of the substrate W. The spin base 21 has through holes 21a (see Figure 3) for each chuck pin 22 formed therein.

In the example of FIG. 3, the upper end of the shaft 31 is connected to the lower end of the chuck pin 22 (here, the lower end of the pin base 222). The shaft 31 has a cylindrical shape with the drive axis Q2 as its central axis. The shaft 31 extends vertically, and a part of it is located inside the through hole 21a. The shaft 31 is engaged with the inner ring of the bearing 32 in the through hole 21a. The outer ring of the bearing 32 is engaged with the spin base 21. This allows the shaft 31 and the chuck pin 22 to rotate together around the drive axis Q2 relative to the spin base 21.

As shown in FIG. 3, a rotary magnet 33 is provided corresponding to each chuck pin 22. That is, a first rotary magnet 33a is provided for the first chuck pin 22a, a second rotary magnet 33b is provided for the second chuck pin 22b, a third rotary magnet 33c is provided for the third chuck pin 22c, and a fourth rotary magnet 33d is provided for the fourth chuck pin 22d (see also FIG. 5).

The rotary magnet 33 is, for example, a permanent magnet, and rotates integrally with the chuck pin 22 around the drive axis Q2. Here, for example, the rotary magnet 33 is provided at a position penetrated by the drive axis Q2. The rotary magnet 33 rotates integrally with the chuck pin 22 around the drive axis Q2. In the example of FIG. 3, the shaft 31 extends vertically downward beyond the bearing 32, and the rotary magnet 33 is provided at the lower end of the shaft 31. A magnet holder (not shown) that holds the rotary magnet 33 may be provided at the lower end of the shaft 31.

In the examples of Figures 3 and 5, the rotary magnet 33 has a rod-like shape extending horizontally and is magnetized in its longitudinal direction. In other words, both longitudinal end faces of the rotary magnet 33 correspond to the magnetic pole surface 33N and the magnetic pole surface 33S, respectively. The pair of magnetic pole surfaces 33N, 33S are surfaces of the surface of the rotary magnet 33 that intersect with the radial direction of the drive axis Q2. The magnetic pole surface 33N forms a first magnetic pole (e.g., a north pole), and the magnetic pole surface 33S forms a second magnetic pole (e.g., a south pole) different from the first magnetic pole. In the example of Figure 5, the drive axis Q2 is located between the magnetic pole surface 33N and the magnetic pole surface 33S.

The rotary magnet 33 can be used in the pin drive unit 30 that rotates the chuck pin 22. The pin drive unit 30 is a drive mechanism that applies to the chuck pin 22 a drive force for rotating the chuck pin 22 to the holding position Pc2 (hereinafter referred to as a holding drive force) and a drive force for rotating the chuck pin 22 to the open position Pc3 (hereinafter referred to as an opening drive force). In the example of FIG. 3, the pin drive unit 30 includes a shaft 31, a bearing 32, a rotary magnet 33, a fixed magnet 34, a drive magnet 35, and a magnet drive unit 36.

The fixed magnets 34 are, for example, permanent magnets, and are provided in correspondence with the rotating magnets 33. That is, the first fixed magnet 34a is provided in correspondence with the first rotating magnet 33a, the second fixed magnet 34b is provided in correspondence with the second rotating magnet 33b, the third fixed magnet 34c is provided in correspondence with the third rotating magnet 33c, and the fourth fixed magnet 34d is provided in correspondence with the fourth rotating magnet 33d. The fixed magnets 34 exert a magnetic force on the corresponding rotating magnets 33. For example, the fixed magnets 34 bias the rotating magnet 33 toward the holding position Pc2 in the circumferential direction about the drive axis Q2. As a specific example, the first fixed magnet 34a exerts a magnetic attraction force on the first rotating magnet 33a, biasing the first rotating magnet 33a toward the holding position Pc2.

In the example of FIG. 5, the fixed magnet 34 is provided on one side of the rotating magnet 33 in the circumferential direction about the rotation axis Q1. In other words, the corresponding rotating magnets 33 and fixed magnets 34 are lined up in the circumferential direction about the rotation axis Q1. Note that in the example of FIG. 3, the fixed magnet 34 is shown radially outward of the rotating magnet 33, but this is because the fixed magnet 34 is shown diagrammatically. The fixed magnet 34 is fixed to the spin base 21. Therefore, the fixed magnet 34 revolves around the rotation axis Q1 as the spin base 21 rotates.

The fixed magnet 34 has a pair of magnetic pole faces 34N, 34S. The magnetic pole faces 34N and 34S are faces of the surface of the fixed magnet 34 that intersect in the horizontal direction, with the magnetic pole face 34N forming a first magnetic pole and the magnetic pole face 34S forming a second magnetic pole. In the example of FIG. 5, the fixed magnet 34 is disposed such that the magnetic pole face 34N faces the magnetic pole face 33S of the corresponding rotating magnet 33. In the example of FIG. 5, a magnetic attraction force acts between the magnetic pole face 33S of the rotating magnet 33 and the magnetic pole face 34N of the fixed magnet 34. This magnetic attraction force biases the rotating magnet 33 toward the holding position Pc2 in the circumferential direction about the drive axis Q2.

The driving magnet 35 is, for example, a permanent magnet, and is provided so as to be movable by the magnet driving unit 36. The magnet driving unit 36 moves the driving magnet 35 so that the distance between the driving magnet 35 and the rotary magnet 33 changes. In the example of FIG. 3, the magnet driving unit 36 raises and lowers the driving magnet 35 between a lower position (corresponding to a first position) and an upper position (corresponding to a second position). In the example of FIG. 3, the driving magnet 35 located in the lower position is shown by a solid line, and the driving magnet 35 located in the upper position is shown by a dashed line.

When the driving magnet 35 is in the lower position, the distance between the driving magnet 35 and the rotating magnet 33 is long. Therefore, the magnetic force between the driving magnet 35 and the rotating magnet 33 is small, and the rotating magnet 33 is biased toward the holding position Pc2 by the fixed magnet 34. In other words, the holding driving force by the pin driving unit 30 corresponds to the magnetic force acting between the fixed magnet 34 and the rotating magnet 33 when the driving magnet 35 is in the lower position.

On the other hand, when the driving magnet 35 is in the upper position, the distance between the driving magnet 35 and the rotating magnet 33 is short. In this state, the magnetic force between the driving magnet 35 and the rotating magnet 33 is greater than the magnetic force between the fixed magnet 34 and the rotating magnet 33. Therefore, when the driving magnet 35 is in the upper position, it biases the rotating magnet 33 toward the open position Pc3 in the circumferential direction about the driving axis Q2.

3 and 5, the driving magnet 35 is provided on the rotation axis Q1 side (i.e., radially inward) of the rotating magnet 33. In the example of FIG. 5, the driving magnet 35 is provided individually for each rotating magnet 33. That is, the first driving magnet 35a is provided corresponding to the first rotating magnet 33a, the second driving magnet 35b is provided corresponding to the second rotating magnet 33b, the third driving magnet 35c is provided corresponding to the third rotating magnet 33c, and the fourth driving magnet 35d is provided corresponding to the fourth rotating magnet 33d. Each driving magnet 35 has an arc shape centered on the rotation axis Q1 in a plan view. Each driving magnet 35 has a pair of magnetic pole faces 35N, 35S that intersect with the radial direction about the rotation axis Q1. The magnetic pole face 35N forms a first magnetic pole, and the magnetic pole face 35S forms a second magnetic pole. In the example of FIG. 5, the magnetic pole surface 35N is a surface that is more inward than the magnetic pole surface 35S in the radial direction about the rotation axis Q1. The drive magnet 35 is disposed such that the magnetic pole surface 35S faces the rotating magnet 33 in a plan view.

When the driving magnet 35 is in the upper position, the magnetic pole surface 35S of the driving magnet 35 exerts a magnetic attraction force on the magnetic pole surface 33N of the rotating magnet 33. When the driving magnet 35 is in the upper position, the magnetic attraction force between the driving magnet 35 and the rotating magnet 33 is greater than the magnetic attraction force between the fixed magnet 34 and the rotating magnet 33. Therefore, the rotating magnet 33 rotates around the driving axis Q2 to the open position Pc3. In other words, the opening driving force by the pin driving unit 30 corresponds to the magnetic force acting between the driving magnet 35 and the rotating magnet 33 when the driving magnet 35 is in the upper position. In the example of FIG. 5, the rotating magnet 33 in the open position Pc3 is shown by a dashed line.

In the example of FIG. 3, the magnet driving unit 36 includes, for example, a piston rod 361 and an air cylinder 362. The piston rod 361 has a rod-like shape and is arranged with its longitudinal direction aligned along the vertical direction. A driving magnet 35 is provided at the upper end of the piston rod 361. A magnet holder (not shown) that holds the driving magnet 35 may be provided at the upper end of the piston rod 361. The air cylinder 362 raises and lowers the piston rod 361 between an upper position and a lower position. As a result, the driving magnet 35 rises and lowers together with the piston rod 361. The magnet driving unit 36 is controlled by the control unit 90.

Here, the magnet driving unit 36 is fixed to the processing unit 1 (e.g., the bottom) via a fixing member (not shown). In this case, the driving magnet 35 and the magnet driving unit 36 do not revolve around the rotation axis Q1 even when the spin base 21 rotates. Therefore, when the pin driving unit 30 drives the chuck pin 22, the rotation driving unit 50 adjusts the rotational position of the spin base 21 so that the driving magnet 35 faces the rotating magnet 33.

The processing unit 1 may be provided with a drive sensor 363 that measures the position of the drive magnet 35. In the example of FIG. 3, the drive sensor 363 is built into the magnet drive unit 36. The drive sensor 363 is, for example, an encoder that measures the position of the piston rod 361 and outputs an electrical signal indicating the measurement result to the control unit 90. The control unit 90 can grasp the position of the drive magnet 35 based on the measurement result of the drive sensor 363.

The rotation drive unit 50 rotates the spin base 21 around the rotation axis Q1. In the example of FIG. 3, the rotation drive unit 50 includes a shaft 51 and a motor 52. The upper end of the shaft 51 is connected to the lower surface of the spin base 21. The shaft 51 has a cylindrical shape with the rotation axis Q1 as its central axis. The motor 52 is controlled by the control unit 90 and rotates the shaft 51 around the rotation axis Q1. As a result, the shaft 51, spin base 21, chuck pins 22 and substrate W rotate together around the rotation axis Q1.

As shown in FIG. 3, the processing unit 1 is provided with a magnetic sensor 40 corresponding to each rotating magnet 33. That is, a first magnetic sensor 40a is provided corresponding to the first rotating magnet 33a, a second magnetic sensor 40b is provided corresponding to the second rotating magnet 33b, a third magnetic sensor 40c is provided corresponding to the third rotating magnet 33c, and a fourth magnetic sensor 40d is provided corresponding to the fourth rotating magnet 33d. The multiple magnetic sensors 40 are provided at approximately equal intervals around the rotation axis Q1. The magnetic sensors 40 measure the direction of the magnetic flux from the rotating magnet 33, as will be described in detail later.

The magnetic sensor 40 is aligned with the rotary magnet 33 in a direction along the drive axis Q2 (here, the vertical direction). In the example of FIG. 3, the corresponding chuck pins 22, rotary magnets 33, and magnetic sensor 40 are aligned in this order on the drive axis Q2. In other words, in the example of FIG. 3, the chuck pins 22, rotary magnets 33, and magnetic sensor 40 are positioned in a state in which they are penetrated by the drive axis Q2. For example, the first chuck pin 22a, the first rotary magnet 33a, and the first magnetic sensor 40a are aligned in this order on the first drive axis Q2a. In the example of FIG. 3, the magnetic sensor 40 is positioned directly below the corresponding rotary magnet 33.

The magnetic sensor 40 may be fixed to the processing unit 1 (e.g., the bottom) via a fixing member (not shown). In this case, even if the spin base 21 rotates, the magnetic sensor 40 does not revolve around the rotation axis Q1. Therefore, when the magnetic sensor 40 measures the direction of the magnetic flux of the rotary magnet 33, the rotation drive unit 50 adjusts the rotational position of the spin base 21 so that the chuck pin 22, the rotary magnet 33, and the magnetic sensor 40 are aligned on the drive axis Q2. Here, with the chuck pin 22, the rotary magnet 33, and the magnetic sensor 40 aligned on the drive axis Q2, the drive magnet 35 faces the rotary magnet 33 in the radial direction. Hereinafter, the rotational position of the spin base 21 at this time is also referred to as the drive measurement position.

Figure 6 is a schematic diagram showing an example of the magnetic flux generated by the rotary magnet 33. For simplicity, only the rotary magnet 33 and the magnetic sensor 40 are shown here. As shown in Figure 6, the magnetic flux from the rotary magnet 33 passes through the magnetic sensor 40 in a direction closer to horizontal. The direction of the magnetic flux passing through the magnetic sensor 40 (hereinafter also referred to as the magnetic field direction) depends on the rotational position of the rotary magnet 33 around the drive axis Q2. In other words, when the rotary magnet 33 rotates around the drive axis Q2, the magnetic flux passing through the magnetic sensor 40 also rotates around the drive axis Q2 in synchronization with the rotation. The magnetic sensor 40 measures the magnetic field direction from this rotary magnet 33.

The magnetic sensor 40 includes, for example, a magnetoresistance effect sensor. The magnetoresistance effect sensor includes, for example, a giant magnetoresistance effect sensor or a tunnel magnetic effect sensor. In the example of FIG. 6, the magnetic sensor 40 includes a first sensor element 41 and a second sensor element 42. Each of the first sensor element 41 and the second sensor element 42 outputs a measurement value (for example, a voltage) according to the direction of the magnetic flux passing through it (i.e., the magnetic field direction). As a specific example, each of the first sensor element 41 and the second sensor element 42 has a laminated structure in which a pinned layer made of a ferromagnetic material, an insulating layer, and a free layer made of a ferromagnetic material are laminated. The first sensor element 41 and the second sensor element 42 are provided in a position in which the thickness direction of the laminated structure is along the vertical direction, and are adjacent to each other in the horizontal direction. In the example of FIG. 6, the first sensor element 41 and the second sensor element 42 are provided on opposite sides of each other with respect to the drive axis Q2. The first sensor element 41 and the second sensor element 42 are arranged in such a manner that the magnetization directions of the pinned layers intersect each other in a plan view. As a specific example, the first sensor element 41 and the second sensor element 42 are arranged in such a manner that the magnetization directions of the pinned layers intersect each other at right angles.

The first sensor element 41 and the second sensor element 42 output a voltage according to the direction of the magnetic flux passing through them. If the angle around the drive axis Q2 (hereinafter referred to as the magnetic field angle) is used as the magnetic field direction, the first sensor element 41 and the second sensor element 42 output a sinusoidal voltage with the magnetic field angle as a variable. However, since the magnetization directions of the pinned layers cross each other, a phase difference occurs between the output voltage of the first sensor element 41 and the output voltage of the second sensor element 42. When the magnetization directions are orthogonal, the phase difference is 90 degrees.

For example, the magnetic sensor 40 calculates the arctangent of the ratio between the output voltage of the first sensor element 41 and the output voltage of the second sensor element 42 as the magnetic field angle (i.e., the magnetic field direction). The magnetic sensor 40 outputs an electrical signal indicating the measured magnetic field angle to the control unit 90. The magnetic sensor 40 may also output the output voltage of the first sensor element 41 and the output voltage of the second sensor element 42 to the control unit 90. In this case, the control unit 90 calculates the magnetic field angle based on both output voltages. It can be said that the magnetic field angle calculation function of the control unit 90 belongs to the magnetic sensor 40.

The control unit 90 determines the position state of the chuck pin 22 based on the magnetic field angle (i.e., the magnetic field direction) measured by the magnetic sensor 40. Figure 7 is a diagram for explaining an example of the position state of the chuck pin 22.

In FIG. 7, the driving magnet 35 in the upper position is shown by a solid line, and the driving magnet 35 in the lower position is shown by a dashed line. When the magnet driving unit 36 has raised the driving magnet 35 to the upper position, a magnetic attraction force acts on the magnetic pole surface 33N of the rotating magnet 33 toward the magnetic pole surface 35S of the driving magnet 35, causing the rotating magnet 33 to rotate. This causes the chuck pin 22 to rotate to the open position Pc3. Hereinafter, the state in which the driving magnet 35 is in the upper position is also referred to as the open state. The open position Pc3 is the rotational position at which the chuck pin 22 normally stops in the open state.

When the magnet driving unit 36 lowers the driving magnet 35 to the lower position, the magnetic force between the driving magnet 35 and the rotating magnet 33 is almost completely eliminated. Therefore, the rotating magnet 33 rotates due to the magnetic attraction force between the magnetic pole surface 33S of the rotating magnet 33 and the magnetic pole surface 34N of the fixed magnet 34. When the substrate W is loaded into the processing unit 1, the chuck pins 22 come into contact with the periphery of the substrate W and therefore stop at the holding position Pc2. Hereinafter, the state in which the substrate W is loaded and the driving magnet 35 is in the lower position is also referred to as the holding state. The holding position Pc2 is the rotational position at which the chuck pins 22 normally stop in the holding state.

In the example of FIG. 7, not only the holding position Pc2 and the open position Pc3 but also the closed position Pc1 is shown. The closed position Pc1 is a rotational position where the chuck pin 22 stops normally when the substrate W has not been loaded into the processing unit 1 and the drive magnet 35 is located in the upper position. The closed position Pc1 is a position opposite the open position Pc3 with respect to the holding position Pc2 in the circumferential direction about the drive axis Q2. In other words, the closed position Pc1, the holding position Pc2 and the open position Pc3 are arranged in this order in the circumferential direction about the drive axis Q2. Hereinafter, the state where the substrate W has not been loaded and the drive magnet 35 is located in the lower position is also referred to as the closed state. The closed position Pc1 is a rotational position where the chuck pin 22 stops normally in the closed state.

As shown in FIG. 7, the closed position Pc1, the holding position Pc2, and the open position Pc3 are expressed by angles relative to a reference line L1 that passes through the drive axis Q2. By setting the reference line L1 in the same way for multiple chuck pins 22, the angle values indicating each position can be made the same for multiple chuck pins 22. For example, the design value (angle) of the holding position Pc2 can be made the same for multiple chuck pins 22. In the example of FIG. 7, each position is expressed by an angle with the counterclockwise direction from the reference line L1 being positive.

When the chuck pin 22 rotates around the drive axis Q2, the rotary magnet 33 also rotates together with the chuck pin 22. Therefore, there is a correlation between the rotational position of the chuck pin 22 and the magnetic field angle measured by the magnetic sensor 40. However, the magnetic field angle measured by the magnetic sensor 40 depends not only on the rotational position of the rotary magnet 33 but also on the position of the drive magnet 35. This is because when the position of the drive magnet 35 changes, the degree of the magnetic effect of the drive magnet 35 on the rotary magnet 33 changes. Therefore, even if the rotary magnet 33 is stopped, when the position of the drive magnet 35 changes, the magnetic field angle measured by the magnetic sensor 40 also fluctuates.

Figure 8 is a diagram showing an example of the relationship between the magnetic field angle Pm measured by the magnetic sensor 40 and the rotation angle of the chuck pin 22 (hereinafter referred to as the pin angle Pc). In Figure 8, graphs G1 and G2 are shown. Graph G1 shows the correspondence relationship (corresponding to the 1A correspondence relationship) between the magnetic field angle Pm and the pin angle Pc when the drive magnet 35 is located in the lower position. Graph G2 shows the correspondence relationship (corresponding to the 1B correspondence relationship) between the magnetic field angle Pm and the pin angle Pc when the drive magnet 35 is located in the upper position. In the example of Figure 8, for the same pin angle Pc, the magnetic field angle Pm on graph G1 is smaller than the magnetic field angle Pm on graph G2. In addition, in the example of Figure 8, graphs G1 and G2 are approximately linear. Figure 8 also shows the design values (angles) of the closed position Pc1, the holding position Pc2, and the open position Pc3.

If the control unit 90 can determine the pin angle Pc of the chuck pin 22 based on the measurement results of the magnetic sensor 40, it can determine the position state of the chuck pin 22. Here, as an example, the control unit 90 determines whether or not the chuck pin 22 is located at the holding position Pc2 in the holding state based on the measurement results of the magnetic sensor 40.

For example, data D1 for defining graph G1 is stored in storage unit 94 (see also FIG. 2). This data D1 can be stored in storage unit 94 by a pre-registration process. FIG. 9 is a flow chart showing a first example of the pre-registration process. The pre-registration process is performed, for example, when the substrate processing apparatus 100 is installed. First, the rotation drive unit 50 adjusts the rotation position of the spin base 21 so that the rotation position of the spin base 21 becomes the drive measurement position (not shown).

Next, the pin driving unit 30 positions all the chuck pins 22 in their respective closed positions Pc1 (step S1). Specifically, in a state in which the substrate W has not been loaded, the magnet driving unit 36 positions each of the driving magnets 35 in the lower position. As a result, each of the chuck pins 22 is positioned in the closed position Pc1.

Next, all the magnetic sensors 40 measure the magnetic field angle Pm of the corresponding rotary magnet 33 (step S2: first pre-measurement step). That is, each magnetic sensor 40 measures the magnetic field angle Pm of the rotary magnet 33 at a position aligned with the corresponding chuck pin 22 and rotary magnet 33, and outputs the magnetic field angle Pm to the control unit 90. This allows the control unit 90 to obtain the magnetic field angle Pm corresponding to the closed position Pc1 for each chuck pin 22.

Next, the pin driving unit 30 rotates all of the chuck pins 22 to their respective open positions Pc3 (step S3). Specifically, the magnet driving unit 36 raises each driving magnet 35 to the upper position. This raise rotates each chuck pin 22 to the open position Pc3.

Next, the second transport section 122 transports the substrate W into the processing unit 1 (step S4). As a result, the substrate W is placed on the pin bases 222 of the multiple chuck pins 22. In other words, the pin bases 222 of the multiple chuck pins 22 support the substrate W.

Next, the pin driver 30 rotates all of the chuck pins 22 to their respective holding positions Pc2 (step S5). Specifically, the magnet driver 36 lowers the drive magnet 35 to the lower position. This lowering rotates each of the chuck pins 22 to the holding position Pc2, and each of the pin bodies 221 presses the periphery of the substrate W toward the rotation axis Q1. In other words, the multiple chuck pins 22 hold the periphery of the substrate W.

Next, all the magnetic sensors 40 measure the magnetic field angle Pm of the corresponding rotating magnet 33 (step S6: second pre-measurement step). Each magnetic sensor 40 outputs the magnetic field angle Pm to the control unit 90. This allows the control unit 90 to obtain the magnetic field angle Pm corresponding to the holding position Pc2 for each chuck pin 22.

Next, the pin driver 30 rotates all of the chuck pins 22 to their respective open positions Pc3 (step S7). Specifically, the magnet driver 36 raises the drive magnet 35 to the upper position. This releases the substrate W from its grip.

Next, the second transport section 122 transports the substrate W out of the processing unit 1 (step S8).

Next, the control unit 90 stores data D1, which includes the actual measured value Pm1 of the magnetic field angle Pm corresponding to the closed position Pc1 measured in step S2 and the actual measured value Pm2 of the magnetic field angle Pm corresponding to the holding position Pc2 measured in step S6, in the memory unit 94 for each chuck pin 22 (step S9).

As shown in FIG. 8, coordinate point P1 including the closed position Pc1 and the measured value Pm1 of the magnetic field angle Pm, and coordinate point P2 including the held position Pc2 and the measured value Pm2 of the magnetic field angle Pm are located on graph G1. Therefore, data D1 including coordinate point P1 and coordinate point P2 can be said to be data for defining graph G1.

By the above-mentioned pre-registration process, data D1 for defining the graph G1 is stored in the storage unit 94 for each chuck pin 22. FIG. 10 is a diagram showing an example of multiple graphs G1 corresponding to multiple chuck pins 22. In FIG. 10, as the graph G1, a graph G1a (corresponding to a first correspondence) corresponding to the first chuck pin 22a and a graph G1b (corresponding to a second correspondence) corresponding to the second chuck pin 22b are shown. The graphs G1a and G1b may be different from each other. For example, the coefficients of the graphs G1a and G1b may be different from each other, and the intercepts of the graphs G1a and G1b may also be different from each other. This is due to various factors for each chuck pin 22, such as assembly errors of the chuck pin 22, the rotating magnet 33, and the magnetic sensor 40.

<Functions of the control unit 90>
Next, the functional parts of the control unit 90 related to the determination of the position state of the chuck pin 22 will be described. FIG. 11 is a functional block diagram showing a first example of the internal configuration of the control unit 90. As shown in FIG. 11, the control unit 90 includes a magnetic angle calculation unit 90a, a pin angle calculation unit 90b, a correction unit 90c, and a position state determination unit 90d. The output voltage of the first sensor element 41 and the output voltage of the second sensor element 42 of each magnetic sensor 40 are input to the magnetic angle calculation unit 90a. Although only one magnetic sensor 40 is shown in FIG. 11 for simplicity, the output voltages from all the magnetic sensors 40 are input to the magnetic angle calculation unit 90a. The magnetic angle calculation unit 90a calculates the magnetic field angle Pm of each rotating magnet 33 based on the output voltage from each magnetic sensor 40. That is, the magnetic angle calculation unit 90a calculates the magnetic field angle Pm of the first rotating magnet 33a, the magnetic field angle Pm of the second rotating magnet 33b, the magnetic field angle Pm of the third rotating magnet 33c, and the magnetic field angle Pm of the fourth rotating magnet 33d.

The correction unit 90c reads out data D1 from the memory unit 94. Based on the data D1, the correction unit 90c obtains a function formula (e.g., a linear function) that indicates graph G1 for each chuck pin 22. The correction unit 90c obtains graph G1a based on coordinate points P1 and P2 for the first chuck pin 22a, and obtains graph G1b based on coordinate points P1 and P2 for the second chuck pin 22b. The same applies to the others. As a specific example, the correction unit 90c obtains a straight line connecting coordinate points P1 and P2 as graph G1.

The pin angle calculation unit 90b receives the magnetic field angle Pm for each chuck pin 22 from the magnetic angle calculation unit 90a, the measurement results from the drive sensor 363, and the graph G1 for each chuck pin 22 from the correction unit 90c. In the holding state, the pin angle calculation unit 90b determines the pin angle Pc for each chuck pin 22 based on the magnetic field angle Pm and the graph G1. Information on whether or not the substrate W has been loaded may also be input to the pin angle calculation unit 90b. The information is specified by, for example, a control signal from the control unit 90 to the second transport unit 122. The pin angle calculation unit 90b can determine whether or not the current state is the holding state based on the information and the measurement results from the drive sensor 363. The control unit 90 controls the magnet drive unit 36, so the position of the drive magnet 35 may be determined based on the control signal to the magnet drive unit 36.

The pin angle calculation unit 90b substitutes the magnetic field angle Pm measured by the magnetic sensor 40 in the holding state into the graph G1 (e.g., a function formula) to determine the pin angle Pc. That is, the pin angle calculation unit 90b determines the pin angle Pc of the first chuck pin 22a based on the magnetic field angle Pm from the first magnetic sensor 40a and the graph G1a, and determines the pin angle Pc of the second chuck pin 22b based on the magnetic field angle Pm from the second magnetic sensor 40b and the graph G1b. Similarly, the pin angle calculation unit 90b determines the pin angle Pc of the third chuck pin 22c and the pin angle Pc of the fourth chuck pin 22d.

The position state determination unit 90d determines the position state of each chuck pin 22 based on a comparison between the calculated value of the pin angle Pc calculated by the magnetic angle calculation unit 90a and a predetermined range (e.g., holding range R2 (see also FIG. 8)). In other words, the position state determination unit 90d determines the position state of the first chuck pin 22a based on a comparison between the calculated value of the pin angle Pc of the first chuck pin 22a and a predetermined range, and determines the position state of the second chuck pin 22b based on a comparison between the calculated value of the pin angle Pc of the second chuck pin 22b and a predetermined range. Similarly, the position state determination unit 90d determines the position state of the third chuck pin 22c and the position state of the fourth chuck pin 22d.

Specifically, the position state determination unit 90d determines for each chuck pin 22 whether the calculated value of the pin angle Pc is located within the holding range R2. The holding range R2 is a range that includes the design value of the holding position Pc2, and is set, for example, in advance. The holding range R2 can also be said to be an allowable range for the holding position Pc2. Range data indicating the holding range R2 may be stored in the memory unit 94. Here, the same angle range is used as the holding range R2 corresponding to each of the multiple chuck pins 22.

When the calculated value of the pin angle Pc is within the holding range R2, the position state determination unit 90d determines that the chuck pin 22 is normally located at the holding position Pc2. On the other hand, when the calculated value of the pin angle Pc is outside the holding range R2, the position state determination unit 90d determines that the chuck pin 22 is not located at the holding position Pc2. In other words, the position state determination unit 90d determines that an abnormality has occurred regarding the position of the chuck pin 22 (hereinafter referred to as a position abnormality).

<Example of processing unit operation>
12 is a flow chart showing a first example of the substrate holding process in the processing unit 1. This substrate holding process is executed after the pre-registration process. In addition, it is assumed here that the spin base 21 is initially positioned at the drive measurement position. This point is the same for various substrate holding processes to be described later.

First, the pin drive unit 30 rotates all the chuck pins 22 to their respective open positions Pc3 (step S11). Specifically, the magnet drive unit 36 raises the drive magnet 35 to the upper position. The control unit 90 may check the position of the drive magnet 35 based on the measurement result of the drive sensor 363. Next, the second transport unit 122 carries the substrate W into the processing unit 1 (step S12), and the pin drive unit 30 rotates all the chuck pins 22 to their respective holding positions Pc2 (step S13). Specifically, the magnet drive unit 36 lowers the drive magnet 35 to the lower position. Similarly, the control unit 90 may check the position of the drive magnet 35 based on the measurement result of the drive sensor 363.

If no abnormality occurs when the drive magnet 35 descends, the multiple chuck pins 22 can rotate normally to the holding position Pc2, and the substrate holding device 2 can hold the substrate W. On the other hand, if an abnormality occurs, any of the chuck pins 22 cannot rotate appropriately to the holding position Pc2, and the substrate holding device 2 cannot properly hold the substrate W.

Then, all the magnetic sensors 40 measure the magnetic field angle Pm of the corresponding rotary magnet 33 (step S14: measurement process). For example, the first sensor element 41 and the second sensor element 42 of the magnetic sensor 40 output an output voltage to the control unit 90, and the control unit 90 calculates the magnetic field angle Pm based on both output voltages. Next, the control unit 90 determines the pin angle Pc for each chuck pin 22 based on the magnetic field angle Pm measured by the magnetic sensor 40 and the graph G1 (step S15). Next, the control unit 90 determines whether the chuck pin 22 is located at the holding position Pc2 (step S16: determination process). Specifically, the control unit 90 determines whether the calculated value of the pin angle Pc is within the holding range R2.

When the calculated value of the pin angle Pc for all chuck pins 22 is within the holding range R2, the control unit 90 determines that all chuck pins 22 are normally positioned at the holding position Pc2 (step S17). On the other hand, when the calculated value of the pin angle Pc for at least one chuck pin 22 is outside the holding range R2, the control unit 90 determines that a position abnormality has occurred (step S18). When it is determined that a position abnormality has occurred, the processing unit 1 may re-hold the substrate W or may interrupt processing of the substrate W.

<Action and effect>
As described above, the magnetic sensor 40 measures the magnetic field angle Pm of the rotating magnet 33, and the control unit 90 determines the position state of the chuck pin 22 based on the magnetic field angle Pm. The magnetic field angle Pm reflects the pin angle Pc of the chuck pin 22 in more detail and with higher accuracy, so the control unit 90 can determine the position state of the chuck pin 22 with higher accuracy. In addition, since the position of the chuck pin 22 is measured magnetically, the control unit 90 can appropriately determine the position of the chuck pin 22 even if the inside of the processing unit 1 is dark.

In the above example, data D1 for defining the correspondence between the magnetic field angle Pm and the pin angle Pc (i.e., graph G1) is stored in the memory unit 94. Specifically, the actual measurement value Pm1 of the magnetic field angle Pm corresponding to the closed position Pc1 and the actual measurement value Pm2 of the magnetic field angle Pm corresponding to the holding position Pc2 are measured in advance, and these are stored in the memory unit 94 as data D1. Therefore, the control unit 90 can determine the pin angle Pc based on the correspondence based on the actual measurement values, and can determine the pin angle Pc with higher accuracy. Therefore, the control unit 90 can determine the position state of the chuck pin 22 with even higher accuracy.

In the above example, the graph G1 is set for each chuck pin 22. Therefore, the control unit 90 can absorb the individual differences between the chuck pins 22 and determine the pin angle Pc with high accuracy. Moreover, the same angle range of holding range R2 can be used for multiple chuck pins 22. This can reduce the processing load on the control unit 90 compared to when different angle ranges are used for multiple chuck pins 22. Also, the setting work by the operator can be simplified.

In addition, in the above example, the rotating magnet 33 is used not only to measure the pin angle Pc of the chuck pin 22, but also to drive the chuck pin 22. Therefore, compared to a structure in which a permanent magnet for measuring the pin angle Pc and a permanent magnet for driving the chuck pin 22 are separately provided, the manufacturing cost of the substrate holding device 2 can be reduced, and the size of the substrate holding device 2 can be reduced.

In addition, in the above example, a magnetoresistive effect sensor is used as the magnetic sensor 40. Because the vertical size of the magnetoresistive effect sensor is small, the size of the space vertically below the magnetic sensor 40 can be made larger. This allows this space to be used to place other components.

In the above example, the substrate holding device 2 is mounted on the substrate processing apparatus 100 (specifically, the processing unit 1). Therefore, the substrate processing apparatus 100 can be realized using the substrate holding device 2 that can determine the position state of the chuck pin 22 with high accuracy. In the substrate processing apparatus 100, the substrate W needs to be rotated around the rotation axis Q1 in order to process the substrate W using a processing liquid. In order to rotate the substrate W appropriately, the substrate holding device 2 needs to hold the substrate W appropriately. In this embodiment, the substrate holding device 2 can determine with high accuracy whether the chuck pin 22 is located at the holding position Pc2 or not, so that the substrate W can start rotating while appropriately holding the substrate W. Therefore, the substrate holding device 2 is particularly suitable for the substrate processing apparatus 100.

Second Embodiment
An example of the configuration of the processing unit 1 according to the second embodiment is similar to that of the first embodiment. In the second embodiment, the processing unit 1 determines the position state of the chuck pins 22 not only in the holding state but also in the open state.

The pin angle Pc shown in Figure 8 is shown as an angle when the counterclockwise direction about the drive axis Q2 in Figure 7 is considered positive. For this reason, in Figure 8, the design value (angle) of the closed position Pc1 is the smallest, the design value (angle) of the holding position Pc2 is the next smallest, and the design value (angle) of the open position Pc3 is the largest.

In the held state, the drive magnet 35 is located in the lower position. Therefore, as described above, when determining the position state of the held position Pc2, the control unit 90 calculates the pin angle Pc using the graph G1 when the drive magnet 35 is located in the lower position (step S15). Then, the control unit 90 determines the position state of the held position Pc2 based on the pin angle Pc (step S16).

In the second embodiment, we consider the magnetic field angle Pm and the virtual pin angle Pc calculated from graph G1 when the drive magnet 35 is in the upper position. In other words, even though the drive magnet 35 is in the upper position, we consider the virtual pin angle Pc calculated using graph G1 corresponding to the lower position, rather than graph G2 corresponding to the upper position.

When the drive magnet 35 is in the upper position, the chuck pin 22 is in the open position Pc3 unless an abnormality occurs. In the example of FIG. 8, the open range R3 for the open position Pc3 is also shown. The open range R3 is an angle range that includes the design value (angle) of the open position Pc3, and is set, for example, in advance. The open range R3 can also be said to be an allowable range for the open position Pc3. In other words, if the pin angle Pc of the chuck pin 22 in the open state is within the open range R3, the chuck pin 22 is normally located in the open position Pc3.

Here, we consider the case where the pin angle Pc is the lower limit angle P31 of the open range R3. When the magnetic sensor 40 measures the magnetic field angle Pm with the chuck pin 22 stopped at the lower limit angle P31, the actual measured value Pm31 of the magnetic field angle Pm is obtained. Ideally, the actual measured value Pm31 is the magnetic field angle Pm obtained from the lower limit angle P31 and graph G2. The control unit 90 calculates the calculated value P31v of the virtual pin angle Pc based on this actual measured value Pm31 and graph G1. In the example of FIG. 8, the calculated value P31v is also shown. Note that the "calculated value of the pin angle Pc" in this embodiment means the value of the pin angle Pc calculated based on the magnetic field angle Pm, regardless of whether the chuck pin 22 is actually located at that pin angle Pc.

In the example of FIG. 8, the calculated value P31v is greater than the upper limit angle P22 of the holding range R2. In other words, the calculated value P31v is greater than the upper limit angle P22 of the holding range R2. Conversely, the open position Pc3 is set so that the calculated value P31v is greater than the upper limit angle P22 of the holding range R2.

If the chuck pin 22 stops at a pin angle Pc within the open range R3 that is greater than the lower limit angle P31, as can be seen from FIG. 8, the calculated value of the virtual pin angle Pc at that time will always be greater than the calculated value P31v. Therefore, if the chuck pin 22 is located within the open range R3, the calculated value of the virtual pin angle Pc obtained at that time will always be greater than the upper limit angle P22 of the holding range R2. Conversely, when the calculated value of the pin angle Pc obtained in the open state is greater than the upper limit angle P22 of the holding range R2, it can be considered that the chuck pin 22 is located at the open position Pc3. This determination is valid because it is unlikely that the chuck pin 22 will stop at an intermediate position between the holding position Pc2 and the open position Pc3.

Figure 13 is a flowchart showing a second example of the substrate holding process in the processing unit 1. First, the pin driving unit 30 rotates all the chuck pins 22 to their respective open positions Pc3 (step S21). If no abnormality occurs, the chuck pins 22 rotate appropriately to the open position Pc3. If an abnormality occurs, the chuck pins 22 cannot rotate to the open position Pc3. Therefore, all the magnetic sensors 40 measure the magnetic field angles Pm of the corresponding rotary magnets 33 (step S22). Next, the control unit 90 determines a virtual pin angle Pc for each chuck pin 22 based on the magnetic field angle Pm measured by the magnetic sensor 40 and the graph G1 (step S23). Next, the control unit 90 determines whether the chuck pin 22 is located at the open position Pc3 for each chuck pin 22 (step S24: determination process). Specifically, the position state determination unit 90d of the control unit 90 determines for each chuck pin 22 whether the virtual pin angle Pc is greater than the upper limit angle P22 of the holding range R2.

The position state determination unit 90d determines that a position abnormality has occurred when the calculated value of the virtual pin angle Pc for at least one chuck pin 22 is equal to or less than the upper limit angle P22 of the holding range R2 (step S32).

On the other hand, when the calculated value of the virtual pin angle Pc for all the chuck pins 22 is greater than the upper limit angle P22 of the holding range R2, the position state determination unit 90d determines that all the chuck pins 22 are normally positioned at the open position Pc3. Next, the control unit 90 executes steps S25 to S31. Steps S25 to S31 are similar to steps S12 to S18, respectively.

As described above, in the second embodiment, the control unit 90 calculates the virtual pin angle Pc based on the magnetic field angle Pm and graph G1, and determines the position state for the open position Pc3 based on the calculated value of the pin angle Pc. Therefore, there is no need to set the data that defines graph G2 in advance, which reduces the setting work of the operator.

In addition, the upper limit angle P22 of the holding range R2 is used to determine the position state of the open position Pc3 of the chuck pin 22. This upper limit angle P22 is also used to determine the position state of the holding position Pc2. Therefore, the operator can easily set the reference angle compared to when these angles are set individually.

<Closed position>
In the above example, the determination of the position state of the chuck pin 22 in each of the holding state and the open state has been described. The processing unit 1 may further determine the position state of the chuck pin 22 in the closed state. For example, after the processed substrate W is unloaded, the pin driver 30 may rotate the chuck pin 22 to the closed position Pc1. That is, the magnet driver 36 may lower the drive magnet 35 to the lower position. In this closed state, the controller 90 may determine whether the chuck pin 22 is located at the closed position Pc1.

In the example of FIG. 8, the closed range R1 for the closed position Pc1 is also shown. The closed range R1 is an angle range that includes the design value (angle) of the closed position Pc1, and is set, for example, in advance. The closed range R1 can also be said to be an allowable range for the closed position Pc1. In other words, if the pin angle Pc of the chuck pin 22 calculated in the closed state is within the closed range R1, the chuck pin 22 is normally located at the closed position Pc1. As can be seen from FIG. 8, if the chuck pin 22 is located within the closed range R1, the pin angle Pc is naturally smaller than the lower limit angle P21 of the holding range R2.

The control unit 90 may therefore determine the pin angle Pc based on the magnetic field angle Pm measured by the magnetic sensor 40 in the closed state and on the graph G1. The calculated value of this pin angle Pc indicates the actual pin angle Pc of the chuck pin 22. The control unit 90 determines whether or not the calculated value of this pin angle Pc is smaller than the lower limit angle P21 of the holding range R2. The control unit 90 may determine that the chuck pin 22 is located in the closed position Pc1 when the pin angle Pc is smaller than the lower limit angle P21. This determination is valid because it is unlikely that the chuck pin 22 will stop at an intermediate position between the closed position Pc1 and the holding position Pc2.

In the above example, the lower limit angle P21 of the holding range R2 is used to determine the position state of the closed position Pc1 of the chuck pin 22. This lower limit angle P21 is also used to determine the position state of the holding position Pc2. Therefore, compared to when these angles are set separately, the operator can easily set the reference angle.

<Summary of position state determination>
The control unit 90 may determine that the chuck pin 22 is located at the closed position Pc1 when the calculated value of the pin angle Pc obtained based on the measurement results of the magnetic sensor 40 is smaller than the lower limit angle P21 of the holding range R2, may determine that the chuck pin 22 is located at the holding position Pc2 when the calculated value of the pin angle Pc is within the holding range R2, and may determine that the chuck pin 22 is located at the open position Pc3 when the calculated value of the pin angle Pc is larger than the upper limit angle P22 of the holding range R2. The control unit 90 may determine that a position abnormality has occurred when the position state of the chuck pin 22 grasped based on the control signal or the like differs from the position state determined based on the measurement results of the magnetic sensor 40.

Third Embodiment
An example of the configuration of the processing unit 1 according to the third embodiment is similar to that of the first or second embodiment. In the third embodiment, the processing unit 1 detects the type of abnormality in the chuck pin 22.

<Determining the type of abnormality>
The positional abnormality regarding the position of the chuck pin 22 includes a riding abnormality and a sticking abnormality, which will be described below. Figures 14 and 15 are diagrams for explaining each abnormality. In Figures 14 and 15, the driving magnet 35 located in the lower position is indicated by a broken line, and the driving magnet 35 located in the upper position is indicated by a solid line.

<Running abnormality>
The first row in Fig. 14 shows a riding abnormality. The riding abnormality is an abnormality that can occur in the holding state. That is, the riding abnormality can occur when the magnet driving unit 36 lowers the driving magnet 35 to the lower position in a state in which the substrate W is loaded. Specifically, the riding abnormality is an abnormality in which, when each chuck pin 22 rotates to the holding position Pc2, one of the pin bodies 221 slips under the lower surface of the substrate W, and the substrate W rides up on the pin body 221. When the riding abnormality occurs, the pin body 221 cannot abut against the periphery of the substrate W, and the substrate holding device 2 cannot hold the substrate W.

When a climbing abnormality occurs, the chuck pin 22 rotates beyond the holding position Pc2 toward the closed position Pc1. In other words, the chuck pin 22 stops at a rotational position smaller than the lower limit angle P21 of the holding range R2. Conversely, when the substrate W has been loaded and the driving magnet 35 is in a holding state in which it is positioned at the lower position, and the pin angle Pc is smaller than the lower limit angle P21, it can be determined that a climbing abnormality has occurred.

The processing unit 1 may detect a climbing abnormality. Specifically, in the holding state, the magnetic sensor 40 measures the magnetic field angle Pm of the rotating magnet 33, and the control unit 90 calculates the pin angle Pc of the chuck pin 22 based on the magnetic field angle Pm and graph G1, and determines whether the calculated value of the pin angle Pc is smaller than the lower limit angle P21. The control unit 90 determines that a climbing abnormality has occurred when the calculated value of the pin angle Pc is smaller than the lower limit angle P21. In other words, the control unit 90 determines that a climbing abnormality has occurred when the calculated value of the pin angle Pc obtained in the holding state is on the opposite side of the holding range R2 from the open position Pc3. This determination may be made, for example, in step S18 of FIG. 12.

<Adhesion Abnormality>
Next, the sticking abnormality will be described. The sticking abnormality is an abnormality in which the chuck pin 22 does not rotate. For example, as shown in the second row of FIG. 14, the chuck pin 22 may continue to stop at the holding position Pc2 in the open state. In this case, although the driving magnet 35 is located at the upper position, the chuck pin 22 stops at the holding position Pc2. This is because, for example, the recess formed on the side of the chuck pin 22 catches on the periphery of the substrate W. In this case, the chuck pin 22 may not be able to rotate from the holding position Pc2 to the open position Pc3. In FIG. 14, the abnormality is indicated as "sticking abnormality (holding position)". This sticking abnormality (holding position) becomes a problem when releasing the holding of the substrate W. For example, when the processing unit 1 finishes the processing of the substrate W, the substrate holding device 2 releases the holding of the substrate W. That is, the magnet driving unit 36 raises the driving magnet 35 to the upper position. At this time, if a sticking abnormality (holding position) occurs, the chuck pins 22 continue to stop at the holding position Pc2, and the substrate W cannot be released from its hold appropriately.

Next, consider the magnetic field angle Pm measured by the magnetic sensor 40 when a sticking abnormality (holding position) occurs. FIG. 16 is a diagram for explaining the magnetic field angle Pm when a sticking abnormality (holding position) occurs. Here, a case is explained in which the chuck pin 22 continues to stop at the upper limit angle P22 of the holding range R2. Since the drive magnet 35 is located in the upper position, the magnetic field angle Pm is based on graph G2. Therefore, the magnetic field angle Pm measured by the magnetic sensor 40 is ideally the upper limit angle P22 and the actual measured value Pm2s obtained from graph G2.

When the pin angle Pc is calculated based on the actual measurement value Pm2s and the graph G1, the calculated value P22v of the pin angle Pc is calculated. This calculated value P22v does not indicate the actual position of the chuck pin 22, but is a virtual pin angle. In the example of FIG. 16, the calculated value P22v is smaller than the upper limit angle P22 of the holding range R2. Therefore, when the chuck pin 22 is located within the holding range R2 in the open state, the pin angle Pc calculated based on the actual measurement value of the magnetic field angle Pm and the graph G1 is always smaller than the upper limit angle P22 of the holding range R2. Conversely, as described in the second embodiment, if the chuck pin 22 is appropriately located within the open range R3 in the open state, the pin angle Pc calculated based on the actual measurement value of the magnetic field angle Pm and the graph G1 at that time is larger than the upper limit angle P22. In other words, when the substrate W is loaded and the drive magnet 35 is in the upper position, if the pin angle Pc is smaller than the upper limit angle P22 of the holding range R2, it can be determined that a sticking abnormality (holding position) has occurred in the chuck pin 22.

The processing unit 1 may detect a sticking abnormality (holding position). Specifically, in the open state in which the substrate W is loaded, the magnetic sensor 40 measures the magnetic field angle Pm of the rotating magnet 33, and the control unit 90 calculates a virtual pin angle Pc of the chuck pin 22 based on the magnetic field angle Pm and graph G1, and determines whether the calculated value of the virtual pin angle Pc is smaller than the upper limit angle P22. The control unit 90 determines that a sticking abnormality (holding position) has occurred when the calculated value of the pin angle Pc is smaller than the upper limit angle P22. In other words, the control unit 90 determines that a sticking abnormality has occurred when the calculated value of the pin angle Pc obtained in the open state is on the opposite side of the holding range R2 from the open position Pc3.

The sticking abnormality may also occur when the chuck pin 22 is stopped at the closed position Pc1. In the first row of FIG. 15, the chuck pin 22 is stopped at the closed position Pc1 in the open state. That is, even though the drive magnet 35 is in the upper position, the chuck pin 22 does not rotate to the open position Pc3 and remains in the closed position Pc1. This sticking abnormality may occur, for example, when a processing liquid enters between the chuck pin 22 and the spin base 21. Specifically, when the processing liquid between the chuck pin 22 and the spin base 21 dries, the processing liquid may function as an adhesive. In this case, the chuck pin 22 may stick to the spin base 21. In FIG. 15, this state is shown as "sticking abnormality (closed position)". This sticking abnormality (closed position) may become a problem when the substrate W is loaded. For example, when the substrate W is loaded, the magnet drive unit 36 raises the drive magnet 35 from the lower position to the upper position. At this time, if a sticking abnormality (closed position) occurs, the chuck pins 22 continue to stop at the closed position Pc1. As a result, the second transport unit 122 cannot properly place the substrate W on the pin base 222.

Next, the magnetic field angle Pm measured by the magnetic sensor 40 when a sticking abnormality (closed position) occurs will be described. Here, a case will be described where the chuck pin 22 continues to stop at the upper limit angle P12 of the closed range R1 (see also FIG. 16). Since the drive magnet 35 is located in the upper position, the magnetic field angle Pm is based on graph G2. Therefore, the magnetic field angle Pm measured by the magnetic sensor 40 is ideally the upper limit angle P12 and the actual measured value Pm1s obtained from graph G2.

When the pin angle Pc is calculated based on the actual measurement value Pm1s and the graph G1, the calculated value P12v of the pin angle Pc is calculated. This calculated value P12v is a virtual pin angle, not an actual position of the chuck pin 22. In the example of FIG. 16, the calculated value P12v is smaller than the upper limit angle P22 of the holding range R2. Therefore, when the chuck pin 22 is located within the closed range R1 in the open state, the pin angle Pc calculated based on the actual measurement value of the magnetic field angle Pm and the graph G1 is always smaller than the upper limit angle P22 of the holding range R2. In other words, when the substrate W is not loaded and the drive magnet 35 is located in the upper position, if the pin angle Pc is smaller than the upper limit angle P22 of the holding range R2, it can be determined that the chuck pin 22 has a sticking abnormality (closed position).

The processing unit 1 may therefore detect a sticking abnormality (closed position). Specifically, in an open state in which the substrate W has not been loaded, the magnetic sensor 40 measures the magnetic field angle Pm of the rotating magnet 33, and the control unit 90 calculates a virtual pin angle Pc of the chuck pin 22 based on the magnetic field angle Pm and graph G1, and determines whether the calculated value of the pin angle Pc is smaller than the upper limit angle P22. The control unit 90 determines that a sticking abnormality (closed position) has occurred when the calculated value of the pin angle Pc is smaller than the upper limit angle P22. This determination may be made, for example, in step S24 of FIG. 13.

Furthermore, as can be understood from the above description, when a sticking abnormality occurs, the virtual pin angle Pc calculated in the open state is smaller than the upper limit angle P22, regardless of whether the substrate W is present or not. Therefore, the control unit 90 may determine that a sticking abnormality occurs when the calculated value of the virtual pin angle Pc calculated based on the measurement results of the magnetic sensor 40 in the open state is smaller than the upper limit angle P22, regardless of whether the substrate W is present or not. In other words, the control unit 90 may determine that a sticking abnormality occurs when the calculated value of the pin angle Pc calculated in the open state is not on the open position Pc3 side with respect to the holding range R2.

A sticking abnormality may also occur when the chuck pin 22 is stopped in the open position Pc3. In the second row of FIG. 15, the chuck pin 22 continues to be stopped in the open position Pc3 even though the drive magnet 35 is in the lower position. In FIG. 15, this state is indicated as a "sticking abnormality (open position)." This sticking abnormality (open position) becomes a problem when holding the substrate W or when rotating the chuck pin 22 from the open position Pc3 to the closed position Pc1. This is because if a sticking abnormality (holding position) occurs at this time, the chuck pin 22 continues to be stopped in the open position Pc3.

Next, the magnetic field angle Pm measured by the magnetic sensor 40 when a sticking abnormality (open position) occurs will be described. Here, a case will be described where the chuck pin 22 continues to stop at the lower limit angle P31 of the open range R3 (see also FIG. 16). Since the drive magnet 35 is located in the lower position, the magnetic field angle Pm is based on graph G1. Therefore, the magnetic field angle Pm measured by the magnetic sensor 40 is ideally the actual measured value Pm31 obtained from the lower limit angle P31 and graph G1.

When the pin angle Pc is calculated based on the actual measurement value Pm31 and the graph G1, the pin angle Pc is calculated to be the same as the lower limit angle P31. This calculated value is the actual pin angle of the chuck pin 22. In the example of FIG. 16, the lower limit angle P31 is naturally greater than the upper limit angle P22 of the holding range R2. As can be seen from FIG. 16, the pin angle Pc calculated based on the actual measurement value of the magnetic field angle Pm measured when the drive magnet 35 is in the lower position and the chuck pin 22 is in the open range R3 and the graph G1 is always greater than the upper limit angle P22 of the holding range R2. In other words, when the pin angle Pc calculated when the drive magnet 35 is in the lower position is greater than the upper limit angle P22 of the holding range R2, it can be determined that the chuck pin 22 has a sticking abnormality (open position).

The processing unit 1 may therefore detect a sticking abnormality (open position). Specifically, the magnetic sensor 40 measures the magnetic field angle Pm of the rotating magnet 33 when the drive magnet 35 is in the lower position. The control unit 90 calculates the pin angle Pc of the chuck pin 22 based on the magnetic field angle Pm and graph G1, and determines whether the pin angle Pc is greater than the upper limit angle P22. The control unit 90 determines that a sticking abnormality (open position) has occurred when the pin angle Pc is greater than the upper limit angle P22. This determination may be made, for example, in step S18 of FIG. 12.

In the second embodiment, the control unit 90 determines that the chuck pin 22 is normally located at the closed position Pc1 when the calculated value of the pin angle Pc in the closed state is smaller than the lower limit angle P21. If a sticking abnormality (open position) occurs, as is clear from the above explanation, the calculated value of the pin angle Pc becomes larger than the lower limit angle P21. Therefore, the control unit 90 may determine that the chuck pin 22 is normally located at the closed position Pc1 when the calculated value of the pin angle Pc in the closed state is smaller than the lower limit angle P21, and may determine that a sticking abnormality (open position) occurs when the calculated value of the pin angle Pc is larger than the lower limit angle P21. This allows the control unit 90 to determine the position state in the closed state by simpler processing. In other words, the control unit 90 may determine that a sticking abnormality (open position) occurs when the calculated value of the pin angle Pc obtained in the closed state or the holding state is on the open position Pc3 side with respect to the holding range R2.

Here, the above-mentioned judgments are summarized. FIG. 17 is a table showing the presence or absence of a substrate, the position of the drive magnet, the judgment conditions, and the judgment results. FIG. 16 also illustrates the judgment results. As shown in FIG. 16 and FIG. 17, the control unit 90 can judge the position state of the chuck pin 22 as normal, a riding abnormality, or a sticking abnormality.

Moreover, in the above example, the pin angle Pc is calculated using graph G1 regardless of the position of the drive magnet 35. This allows the control unit 90 to calculate the pin angle Pc through simple processing. The control unit 90 also detects various abnormalities using the lower limit angle P21 and upper limit angle P22 that define the holding range R2 of the holding position Pc2. This eliminates the need for the operator to set the closed range R1 of the closed position Pc1 and the open range R3 of the open position Pc3. This reduces the burden on the operator.

<Fourth embodiment>
An example of the configuration of the processing unit 1 according to the fourth embodiment is similar to that of the first to third embodiments. In the fourth embodiment, the processing unit 1 calculates the amount of wear of the chuck pin 22.

<Wear of the chuck pin 22>
The pin body 221 of the chuck pin 22 collides with the peripheral edge of the substrate W when rotating to the holding position Pc2, and this collision may cause wear on the side surface of the pin body 221. When the pin body 221 of the chuck pin 22 is made of a resin such as polyether ether ketone, the side surface of the pin body 221 is relatively easily worn.

18 is a diagram showing an example of the state when the pin body 221 is worn. As shown in FIG. 18(a), a recess 221a may be formed on the side of the pin body 221 as a result of wear. This recess 221a is formed by the side of the pin body 221 colliding with the periphery of the substrate W each time the substrate W is held. In FIG. 18(a) and FIG. 18(b), the chuck pin 22 before the recess 221a is formed is shown by a two-dot chain line. The depth of the recess 221a (hereinafter referred to as the amount of wear) gradually increases as the side of the pin body 221 repeatedly collide with the periphery of the substrate W. Therefore, the holding position Pc2 at which the pin body 221 abuts against the periphery of the substrate W changes as the amount of wear of the recess 221a increases. In the example of FIG. 18(b), the holding position Pc2 (angle) gradually decreases. This change in the holding position Pc2 due to wear occurs gradually over time, unlike abnormalities such as riding abnormalities and sticking abnormalities.

Figure 19 is a graph that shows a schematic example of the change over time in the holding position Pc2. In the graph in Figure 19, some points are shown as black circles, but in reality there are many more plot points. Also, to make it easier to illustrate, the amount of change in the holding position Pc2 is exaggerated. As shown in Figure 19, the holding position Pc2 (angle) gradually decreases as the number of processed substrates W increases.

In the present embodiment, the rotary magnet 33 rotates together with the chuck pin 22 directly below the chuck pin 22. Therefore, the magnetic field angle Pm of the rotary magnet 33 reflects the pin angle Pc of the chuck pin 22 with high accuracy. The magnetic sensor 40 measures the magnetic field angle Pm of the rotary magnet 33, and the control unit 90 calculates the pin angle Pc of the chuck pin 22 based on the magnetic field angle Pm. Therefore, the control unit 90 can obtain the pin angle Pc more precisely and with higher accuracy. Therefore, the control unit 90 can recognize the change over time in the holding position Pc2. For example, the control unit 90 can grasp the amount of wear of the chuck pin 22 by storing the history data of the holding position Pc2 in the memory unit 94.

Figure 20 is a flowchart showing a third example of the substrate holding process in the processing unit 1. First, the pin driving unit 30 rotates all the chuck pins 22 to their respective open positions Pc3 (step S31). Next, the second transport unit 122 carries the substrate W into the processing unit 1 (step S32). Next, the pin driving unit 30 rotates all the chuck pins 22 to their respective holding positions Pc2 (step S33). Next, all the magnetic sensors 40 measure the magnetic field angles Pm of the corresponding rotary magnets 33 (step S34). Next, the control unit 90 determines the pin angle Pc for each chuck pin 22 based on the magnetic field angle Pm measured by the magnetic sensor 40 and the graph G1 (step S35). Next, the control unit 90 determines whether the chuck pin 22 is normally positioned at the holding position Pc2 for each chuck pin 22 (step S36). Specifically, the position state determination unit 90d of the control unit 90 determines whether the calculated value of the pin angle Pc is within the holding range R2 for each chuck pin 22. When the calculated value of the pin angle Pc for at least one chuck pin 22 is outside the holding range R2, the control unit 90 determines that a position abnormality has occurred in the chuck pin 22 (step S37).

On the other hand, when the calculated value of the pin angle Pc for all chuck pins 22 is within the holding range R2, the control unit 90 updates the history data indicating the change over time in the holding position Pc2 for each chuck pin 22 (step S38). Specifically, the control unit 90 adds the calculated value of the pin angle Pc to the history data as the holding position Pc2, and stores the updated history data in the memory unit 94.

Next, the control unit 90 calculates the amount of wear for each chuck pin 22 based on the history data (step S39). For example, the control unit 90 may calculate the difference between the initial position Pc2[0] of the holding position Pc2 included in the history data and the calculated value of the pin angle Pc calculated in step S35 as the amount of wear. Alternatively, the control unit 90 may set the average value of the holding position Pc2 within a predetermined initial period in the history data as the initial position, set the average value of the holding position Pc2 within a predetermined period including the present as the measured value, and calculate the difference between the initial position and the measured value as the amount of wear.

Next, the control unit 90 determines whether the amount of wear is equal to or greater than a reference value for each chuck pin 22 (step S40). The reference value is, for example, a value indicating when to replace the chuck pin 22, and is set in advance. When the amount of wear is less than the reference value, the chuck pin 22 is determined to be normal, and the holding of the substrate W by the substrate holding device 2 is completed.

On the other hand, when the amount of wear is equal to or greater than the reference value, the control unit 90 may request the user to replace the chuck pin 22 (step S41). For example, the control unit 90 causes a notification unit, such as a display and speaker (not shown), to notify the user that the chuck pin 22 needs to be replaced. This allows the user to more appropriately recognize when it is time to replace the chuck pin 22.

The control unit 90 may update the lower limit angle P21 and the upper limit angle Pc22 of the holding range R2 according to the amount of wear. Specifically, the control unit 90 determines whether the calculated amount of wear is equal to or greater than a predetermined value. The predetermined value is set to be smaller than a reference value. When the amount of wear is equal to or greater than the predetermined value, the control unit 90 may update the lower limit angle P21 by subtracting an update amount (e.g., a predetermined value) from the lower limit angle P21, and update the upper limit angle P22 by subtracting an update amount from the upper limit angle P22. This allows the control unit 90 to reset the holding range R2 to an appropriate value according to the amount of wear.

Fifth embodiment
An example of the configuration of the processing unit 1 according to the fifth embodiment is the same as that of the first to fourth embodiments. In the above example, the control unit 90 calculates the pin angle Pc using the graph G1 regardless of the position of the drive magnet 35. Therefore, in the open state in which the drive magnet 35 is located at the upper position, the control unit 90 calculates the virtual pin angle Pc instead of the actual pin angle Pc. In the fifth embodiment, the control unit 90 calculates the actual pin angle Pc of the chuck pin 22 in the open state based on the magnetic field angle Pm and the graph G2.

Here, data D2 for defining graph G2 is stored in advance in storage unit 94. FIG. 21 is a flowchart showing a second example of this pre-registration process. Steps S51 to S58 are the same as steps S1 to S8, respectively.

Next, all the magnetic sensors 40 measure the magnetic field angle Pm of the corresponding rotary magnet 33 (step S59). This allows the control unit 90 to obtain the actual measured value Pm3 (see FIG. 8) of the magnetic field angle Pm corresponding to the open position Pc3 for each chuck pin 22.

Next, the chuck pin 22 is stopped at a predetermined position Pc4 (see FIG. 8) other than the open position Pc3 by a predetermined tool (not shown) (step S60). The driving magnet 35 may remain in the upper position. The predetermined tool is, for example, a ring member centered on the rotation axis Q1, and the predetermined tool is arranged so that the inner surface of the ring member abuts against the side of the pin body 221 of the multiple chuck pins 22 stopped at the predetermined position Pc4. In other words, the pin body 221 is located at the predetermined position Pc4 in a state of abutting against the predetermined tool. As an example of a specific operation, the pin driving unit 30 rotates the chuck pin 22 to the closed position Pc1 and arranges the predetermined tool, and then the pin driving unit 30 applies an open driving force to the chuck pin 22. As a result, the chuck pin 22 rotates to the predetermined position Pc4 in which it abuts against the inner peripheral surface of the tool.

Next, all the magnetic sensors 40 measure the magnetic field angle Pm of the corresponding rotating magnet 33 (step S59). This allows the control unit 90 to obtain the actual measured value Pm4 of the magnetic field angle Pm corresponding to the predetermined position Pc4 for each chuck pin 22.

Next, the control unit 90 stores not only data D1 but also data D2, which will be described next, in the memory unit 94 (step S62). Data D2 is, for example, data indicating the actual measured value Pm3 of the magnetic field angle Pm corresponding to the open position Pc3 and the actual measured value Pm4 of the magnetic field angle corresponding to the predetermined position Pc4. Coordinate point P3 including the open position Pc3 and the actual measured value Pm3, and coordinate point P4 including the predetermined position Pc4 and the actual measured value Pm4 are located on graph G2. For this reason, data D2 including coordinate point P3 and coordinate point P4 can be said to be data for defining graph G2.

<Functions of the control unit 90>
22 is a functional block diagram showing a second example of the internal configuration of the control unit 90. The correction unit 90c reads out data D1 when the drive magnet 35 is located at the lower position, and reads out data D2 when the drive magnet 35 is located at the upper position. In the example of FIG. 22, the measurement result of the drive sensor 363 is input to the correction unit 90c. The correction unit 90c may read out data D1 or data D2 from the storage unit 94 based on the measurement result of the drive sensor 363. When the correction unit 90c reads out data D1, the correction unit 90c obtains a function formula of the graph G1 for each chuck pin 22 based on the data D1, and when the correction unit 90c reads out data D2, the correction unit 90c obtains a function formula of the graph G2 for each chuck pin 22 based on the data D2.

The pin angle calculation unit 90b receives the magnetic field angle Pm for each chuck pin 22 from the magnetic angle calculation unit 90a, the measurement results from the drive sensor 363, and the graph G1 or graph G2 for each chuck pin 22 from the correction unit 90c. When the drive magnet 35 is in the lower position, the pin angle calculation unit 90b calculates the pin angle Pc for each chuck pin 22 based on the magnetic field angle Pm and the graph G1. Information on whether or not the substrate W has been loaded may also be input to the pin angle calculation unit 90b. The information is specified, for example, by a control signal from the control unit 90 to the second transport unit 122. The pin angle calculation unit 90b can distinguish between the closed state and the held state based on the information and the measurement results from the drive sensor 363. This allows the control unit 90 to calculate the pin angle Pc in the closed state and the pin angle Pc in the held state.

The pin angle calculation unit 90b also determines the pin angle Pc for each chuck pin 22 based on the magnetic field angle Pm and graph G2 when the drive magnet 35 is in the upper position. This makes it possible to calculate the pin angle Pc in the open state. This pin angle Pc indicates the actual pin angle of the chuck pin 22.

As described above, the pin angle calculation unit 90b can determine the actual pin angle Pc of the chuck pin 22 regardless of the position of the drive magnet 35.

The position state determination unit 90d determines the position state of the chuck pin 22 based on the pin angle Pc calculated by the pin angle calculation unit 90b. For example, the storage unit 94 stores range data indicating the closed range R1, the holding range R2, and the open range R3. The position state determination unit 90d determines whether the calculated value of the pin angle Pc is within the closed range R1 in the closed state. The position state determination unit 90d may determine that the calculated value of the pin angle Pc is normal when it is within the closed range R1, and may determine that a position abnormality has occurred when the calculated value of the pin angle Pc is outside the closed range R1. Similarly, the position state determination unit 90d determines whether the calculated value of the pin angle Pc is within the holding range R2 in the holding state, and determines whether the calculated value of the pin angle Pc is within the open range R3 in the open state.

Figure 23 is a flowchart showing a fourth example of the substrate holding process in the processing unit 1. First, the pin driving unit 30 rotates all the chuck pins 22 to their respective open positions Pc3 (step S71). Specifically, the magnet driving unit 36 raises the driving magnet 35 to the upper position. Next, all the magnetic sensors 40 measure the magnetic field angles Pm of the corresponding rotary magnets 33 (step S72). Next, the control unit 90 calculates the pin angle Pc for each chuck pin 22 based on the magnetic field angle Pm measured by the magnetic sensor 40 and the graph G2 (step S73). In this way, when the driving magnet 35 is located in the upper position, the graph G2 is used to calculate the pin angle Pc. Therefore, the control unit 90 can calculate the actual pin angle Pc, not the virtual pin angle Pc, in the open state. Next, the control unit 90 determines whether the chuck pin 22 is located in the open position Pc3 for each chuck pin 22 (step S74). Specifically, the position state determination unit 90d of the control unit 90 determines whether the calculated value of the pin angle Pc is within the open range R3 for each chuck pin 22.

The position state determination unit 90d determines that a pin abnormality has occurred when the calculated value of the pin angle Pc for at least one chuck pin 22 is outside the open range R3 (step S81).

On the other hand, when the calculated value of the pin angle Pc for all the chuck pins 22 is within the open range R3, the position state determination unit 90d determines that all the chuck pins 22 are normally positioned at the open position Pc3. Then, the second transport unit 122 transports the substrate W into the processing unit 1 (step S75).

Next, the control unit 90 executes steps S75 to S81. Steps S75 to S81 are similar to steps S25 to S31, respectively.

As described above, the control unit 90 calculates the pin angle Pc in the open state based on the magnetic field angle Pm and graph G2, and determines the position state based on the pin angle Pc. Therefore, the control unit 90 can determine with higher accuracy whether the chuck pin 22 is located at the open position Pc3 in the open state.

In the above specific flow, the control unit 90 determines the position state of the chuck pin 22 in the open state and the holding state, but may also determine the position state of the chuck pin 22 in the closed state. For example, after the processed substrate W is removed, the magnet driving unit 36 rotates the chuck pin 22 to the closed position Pc1. In this closed state, the magnetic sensor 40 measures the magnetic field angle Pm, and the control unit 90 calculates the pin angle Pc based on the magnetic field angle Pm and graph G1, and may determine the position state of the chuck pin 22 based on a comparison between the calculated value of the pin angle Pc and the closed range R1.

Sixth embodiment
An example of the configuration of the processing unit 1 according to the sixth embodiment is similar to that of the first to fifth embodiments. However, the specific configuration of the magnetic sensor 40 is different from that of the magnetic sensor 40 according to the first to fifth embodiments.

In the sixth embodiment, the magnetic sensor 40 is a Hall sensor. FIG. 24 is a diagram showing an example of the configuration of the magnetic sensor 40 according to the sixth embodiment. In FIG. 24, the magnetic sensor 40 and the rotary magnet 33 are shown. In the example of FIG. 24, the magnetic sensor 40 is also provided in a region where the magnetic flux from the rotary magnet 33 passes in a direction close to the horizontal direction. Specifically, the magnetic sensor 40 is aligned with the rotary magnet 33 on the drive axis Q2 and is provided directly below the rotary magnet 33.

24, the magnetic sensor 40 includes a first sensor element 43 and a second sensor element 44. The first sensor element 43 and the second sensor element 44 are Hall elements formed of, for example, semiconductors. The first sensor element 43 and the second sensor element 44 each have a plate-like shape and are provided with their thickness direction along the horizontal direction. The first sensor element 43 and the second sensor element 44 are adjacent to each other in the horizontal direction. In the example of FIG. 24, the first sensor element 43 and the second sensor element 44 are provided on opposite sides of the drive axis Q2. The first sensor element 43 and the second sensor element 44 are provided with their thickness directions intersecting each other in a plan view. As a specific example, the first sensor element 43 and the second sensor element 44 are provided with their thickness directions perpendicular to each other.

Each of the first sensor element 43 and the second sensor element 44 outputs a voltage according to the direction of the magnetic flux passing through it (i.e., the magnetic field direction). Specifically, the first sensor element 43 and the second sensor element 44 output a sinusoidal voltage with the magnetic field angle Pm as a variable. However, since the thickness directions of the first sensor element 43 and the second sensor element 44 cross each other, a phase difference occurs between the output voltage of the first sensor element 43 and the output voltage of the second sensor element 44. When the thickness directions of the first sensor element 43 and the second sensor element 44 are perpendicular to each other, the phase difference is 90 degrees.

The magnetic sensor 40 calculates the magnetic field angle Pm based on the output voltage of the first sensor element 43 and the output voltage of the second sensor element 44. As a specific example, the magnetic sensor 40 calculates the arctangent of the ratio of the output voltage of the first sensor element 43 to the output voltage of the second sensor element 44 as the magnetic field angle Pm. The magnetic sensor 40 outputs an electric signal indicating the measured magnetic field angle Pm to the control unit 90. The magnetic sensor 40 may also output the output voltage of the first sensor element 43 and the output voltage of the second sensor element 44 to the control unit 90. The control unit 90 calculates the magnetic field angle Pm based on both output voltages. In this case, it can be said that the magnetic field angle calculation function of the control unit 90 belongs to the magnetic sensor 40.

As described above, the substrate holding device 2, the substrate processing apparatus 100, and the method for determining the position of the chuck pin 22 have been described in detail, but the above description is merely an example in all respects, and the method for determining the position of the substrate holding device 2, the substrate processing apparatus 100, and the chuck pin 22 is not limited thereto. It is understood that countless modified examples not exemplified can be envisioned without departing from the scope of this disclosure. The configurations described in each of the above embodiments and each of the above modified examples can be combined or omitted as appropriate as long as they are not mutually contradictory.

For example, in the above example, the rotary magnet 33 belongs to the pin driving unit 30, but this is not necessarily limited to this. For example, the rotary magnet 33 may be a dedicated magnet for position measurement. In this case, the pin driving unit 30 includes, for example, a driving source and a link mechanism that transmits the driving force from the driving source to the chuck pin 22. The driving source includes, for example, an air cylinder. For example, JP 2008-34553 A can be applied to such a pin driving unit 30.

In the above example, when the driving magnet 35 is in the lower position, the pin driving unit 30 applies the holding driving force to the chuck pin 22, and when the driving magnet 35 is in the upper position, the pin driving unit 30 applies the opening driving force to the chuck pin 22. However, these may be reversed. That is, when the driving magnet 35 is in the upper position, the pin driving unit 30 may apply the holding driving force to the chuck pin 22, and when the driving magnet 35 is in the lower position, the pin driving unit 30 may apply the opening driving force to the chuck pin 22. This pin driving unit 30 can be realized, for example, by making the shape of the driving magnet 35 a ring shape centered on the rotation axis Q1, reversing the magnetic pole faces 35S and 35N of the driving magnet 35 to each other, and reversing the magnetic pole faces 34S and 34B of the fixed magnet 34 to each other.

In the above example, the multiple (four) rotatably mounted chuck pins 22 are arranged at intervals along the periphery of the substrate W. The multiple chuck pins 22 are not limited to four rotatable ones, and may be a combination of rotatably mounted chuck pins 22 and non-rotatably mounted chuck pins. For example, two rotatably mounted chuck pins and two non-rotatably mounted chuck pins may be alternately arranged at intervals along the periphery of the substrate W. The magnetic sensor 40 may be provided in correspondence with the rotatably mounted chuck pins.

100 Substrate processing apparatus 2 Substrate holding apparatus 22 Chuck pin 22a First chuck pin 22b Second chuck pin 33a First rotating magnet 33b Second rotating magnet 33N, 33S Magnetic pole surface 40a First magnetic sensor 40b Second magnetic sensor 6 Nozzle 90 Control unit 94 Memory unit G1 First A correspondence relationship G1a First correspondence relationship, First A correspondence relationship (graph)
G1b Second Correspondence, First A Correspondence (Graph)
G2 1B Correspondence (graph)
Pc1: Closed position Pc2: Holding position Pc3: Open position Q2: Drive axis Q2a: First drive axis Q2b: Second drive axis W: Base plate

Claims (20)

a plurality of chuck pins spaced apart from one another along a peripheral edge of the substrate, each of the chuck pins being rotatable between a holding position in contact with the peripheral edge of the substrate and an open position spaced apart from the peripheral edge of the substrate;
a first rotary magnet having a pair of magnetic pole faces that intersect in a radial direction of a first drive axis about which a first chuck pin of the plurality of chuck pins rotates, the first rotary magnet being fixed to the first chuck pin and rotating integrally with the first chuck pin;
a first magnetic sensor arranged to be aligned with the first rotary magnet in a direction along the first drive axis and configured to measure a magnetic field angle indicating a direction of a magnetic field generated by the first rotary magnet;
a control unit that determines a position state of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor. 2. The substrate holding device according to claim 1,
A substrate holding device, wherein the first chuck pin, the first rotary magnet, and the first magnetic sensor are aligned in this order on the first drive axis. 3. The substrate holding device according to claim 2,
The substrate holding device, wherein the first magnetic sensor includes a magnetoresistive effect sensor. 3. The substrate holding device according to claim 2,
The substrate holding device, wherein the first magnetic sensor includes a Hall sensor. A substrate holding device according to any one of claims 1 to 4,
a storage unit configured to store data defining a first correspondence relationship between a rotational position of the first chuck pin and the magnetic field angle of the first rotary magnet;
The control unit determines the rotational position of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor and the first correspondence relationship. 6. The substrate holding device according to claim 5,
a second rotary magnet having a pair of magnetic pole faces that intersect in a radial direction of a second drive axis about which a second chuck pin of the plurality of chuck pins rotates, the second rotary magnet being fixed to the second chuck pin and rotating integrally with the second chuck pin about the second drive axis;
a second magnetic sensor provided alongside the second rotary magnet on the second drive axis and configured to measure a magnetic field angle indicating a direction of a magnetic field generated by the second rotary magnet;
Equipped with
the storage unit stores data defining a second correspondence relationship between a rotational position of the second chuck pin and the magnetic field angle of the second rotary magnet;
The control unit determines the rotational position of the second chuck pin based on the magnetic field angle measured by the second magnetic sensor and the second correspondence relationship. 7. The substrate holding device according to claim 6,
The control unit determines the position state of the first chuck pin based on a comparison between the rotational position of the first chuck pin and a predetermined range, determines the position state of the second chuck pin based on a comparison between the rotational position of the second chuck pin and the predetermined range, and uses the same angular range as the predetermined range for the first chuck pin and the second chuck pin. A substrate holding device according to any one of claims 1 to 4,
A movably provided drive magnet;
a magnet driving unit that is controlled by the control unit and moves the driving magnet so that a distance between the driving magnet and the first rotary magnet changes, thereby rotating the first chuck pin by a magnetic force between the driving magnet and the first rotary magnet,
in a holding state in which the substrate is carried in and the driving magnet is located at a first position, the first chuck pin is located at the holding position;
The substrate holding device, in an open state in which the drive magnet is located at a second position, the first chuck pin is located at the open position. 9. The substrate holding device according to claim 8,
a storage unit configured to store data defining a first A correspondence relationship between a rotational position of the first chuck pin and a magnetic field angle of the first rotary magnet when the drive magnet is located at a first position,
The control unit calculates a calculation value of the rotational position of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor and the first A correspondence relationship. 10. The substrate holding device according to claim 9,
A substrate holding device, wherein the control unit determines that the first chuck pin is located at the holding position when the calculated value of the first chuck pin is within a holding range for the predetermined holding position. The substrate holding device according to claim 10,
in a closed state in which the substrate is not loaded and the drive magnet is located at the first position, the first chuck pin is located at a closed position opposite to the open position with respect to the holding position,
The control unit determines that the first chuck pin is located at the closed position when the calculated value of the first chuck pin obtained in the closed state is on the closed position side of the holding range. The substrate holding device according to claim 10,
The control unit determines that the first chuck pin is located in the open position when the calculated value of the first chuck pin obtained in the open state is on the open position side of the holding range. The substrate holding device according to claim 10,
The control unit determines that a climbing abnormality has occurred when the calculated value of the first chuck pin obtained in the holding state is on the opposite side of the holding range from the open position. The substrate holding device according to claim 10,
The control unit determines that a sticking abnormality has occurred when the calculated value of the first chuck pin obtained in the holding state is on the open position side of the holding range. The substrate holding device according to claim 10,
The control unit determines that a sticking abnormality has occurred when the calculated value of the first chuck pin obtained in the open state is not on the open position side of the holding range. 10. The substrate holding device according to claim 9,
the storage unit also stores data defining a first B correspondence relationship between the rotational position of the first chuck pin and the magnetic field angle of the first rotary magnet in the open state;
The control unit is
determining the calculated value of the rotational position of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor in the holding state and the first A correspondence relationship, and determining whether or not the calculated value of the first chuck pin is within a holding range for the holding position that is set in advance;
A substrate holding device that calculates the calculated value of the rotational position of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor in the open state and the first B correspondence relationship, and determines whether the calculated value of the first chuck pin is within a predetermined open range for the open state. A substrate holding device according to any one of claims 1 to 4,
A memory unit is provided,
The control unit is
a rotational position of the first chuck pin determined based on the magnetic field angle measured by the first magnetic sensor in a holding state in which the multiple chuck pins are in contact with the peripheral edge of the substrate, the rotational position of the first chuck pin being stored as the holding position, and history data indicating changes in the holding position over time being stored in the memory unit. A substrate holding device according to any one of claims 1 to 4,
a nozzle configured to eject a processing liquid toward a main surface of the substrate held by the substrate holding device. a measuring step in which a first magnetic sensor measures a magnetic field angle indicating a direction of a magnetic field of a first rotating magnet rotating integrally with a first chuck pin among a plurality of chuck pins, each of which rotates about a drive axis between a holding position in contact with a peripheral edge of the substrate and an open position spaced apart from the peripheral edge of the substrate, at a position aligned with the first chuck pin on the drive axis;
and determining a position state of the first chuck pin based on the magnetic field angle measured by the first magnetic sensor. 20. A method for determining a position of a chuck pin according to claim 19, comprising the steps of:
a first pre-measurement step that is executed before the measurement step, in which the first magnetic sensor measures the magnetic field angle of the first rotary magnet in a closed state in which the substrate has not been loaded and each of the plurality of chuck pins is located at a closed position that is located inside the holding position in a circumferential direction about the drive axis;
a second pre-measurement step that is executed before the measurement step, and in which the first magnetic sensor measures the magnetic field angle of the first rotary magnet in a holding state in which each of the plurality of chuck pins is located at the holding position,
In the determination step,
A chuck pin position determination method, comprising: determining a rotational position of the first chuck pin based on a correspondence relationship defined by the magnetic field angle corresponding to the closed position measured in the first pre-measurement process and the magnetic field angle corresponding to the holding position measured in the second pre-measurement process, and the magnetic field angle measured in the measurement process; and determining a position state of the first chuck pin based on the rotational position.

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