JP2022188901A - Light source device - Google Patents

Abstract

A light source device having a package structure capable of achieving both airtightness and active alignment is provided. A light source device (1) includes a base body (3) having a support portion (10) and a frame body (20) provided on the support portion (10); and a semiconductor laser element 2 disposed in a sealed space 1a formed by a lid 4, a base 3, and a sealing material 7. The lid 4 is a laser beam emitted from the semiconductor laser element 2. The lid 4 and the frame 20 are bonded via a bonding material 8 on the opposite side of the sealing material 7 from the sealing space 1a side, including an optical element 4a that imparts an optical effect to light. [Selection drawing] Fig. 1B

Description

The present disclosure relates to a light source device including a semiconductor laser element.

2. Description of the Related Art Semiconductor laser devices have advantages such as long life, high efficiency, and small size, so they are used as light sources for various products such as projectors, optical discs, vehicle-mounted headlamps, lighting devices, and laser processing devices. 2. Description of the Related Art In recent years, as a semiconductor laser element, research and development of a nitride-based semiconductor laser element covering a wavelength band from ultraviolet to blue has been advanced.

A semiconductor laser element is packaged as a light source device and mounted on various products. Specifically, the light source device includes a semiconductor laser element and a package that houses the semiconductor laser element. Conventionally, as this type of light source device, a light source device including a package in which a semiconductor laser element is hermetically sealed is known (for example, Patent Document 1).

In the light source device disclosed in Patent Document 1, the package is hermetically sealed using a coating material made of ethylene-polyvinyl alcohol copolymer (EVOH). EVOH is a resin material with excellent gas barrier properties. Therefore, even when a volatile organic gas is generated from a member existing in the internal space of the package, the EVOH covering material can prevent the volatile organic gas from leaking out of the package. Conversely, the coating material made of EVOH can also prevent low-molecular-weight siloxane, volatile organic gas, or the like existing outside (in the atmosphere) of the light source device from entering the interior space of the package. By using EVOH in this way, it is possible to hermetically seal the internal space of the package in which the semiconductor laser element is housed.

JP 2012-38819 A

A package for housing a semiconductor laser element includes, for example, a metal housing having an opening such as a frame, a translucent optical member covering the opening of the housing, and a metal supporting the housing. It is known to have a support made of For example, a TO-CAN package includes a metal cap as a housing, a metal stem base as a support, and a glass plate arranged to cover the opening of the cap.

In such a package, the housing to which the optical member is attached and the support are fixed by resistance welding. For example, when a frame body is used as a housing, the frame body and the support body are fixed by joining the connecting portion between the frame body to which the optical member is attached and the support body by resistance welding.

At this time, if an optical member having a lens function is used as the optical member attached to the frame, it is necessary to align the optical member and the semiconductor laser element. Specifically, the optical member and the semiconductor laser element are aligned so that the laser light emitted from the semiconductor laser element passes through the optical axis of the optical member.

As for alignment between the optical member and the semiconductor laser element, active alignment is sometimes used in which the semiconductor laser element and the optical member are aligned while the semiconductor laser element is driven to emit a laser beam.

However, with the package structure of the conventional light source device, it is difficult to perform active alignment while ensuring airtightness. In other words, in the conventional light source device, it is necessary to separate the maintenance of the airtightness of the package from the active alignment, and it is difficult to achieve both the maintenance of the airtightness of the package and the active alignment.

The present disclosure has been made to solve such problems, and aims to provide a light source device having a package structure capable of achieving both airtightness and active alignment.

In order to achieve the above object, one aspect of the light source device according to the present disclosure is a base having a support portion and a frame body provided on the support portion, and a base body that is in close contact with the frame body via a sealing material. and a nitride-based semiconductor laser element disposed in a sealed space formed by the lid, the substrate, and the sealing material, wherein the lid includes the nitride An optical element that imparts an optical effect to a laser beam emitted from the semiconductor laser element is included, and the lid body and the frame body are provided with a bonding material on the side of the sealing material opposite to the sealing space side. are joined through

According to the present disclosure, it is possible to realize a light source device having a package structure capable of achieving both airtightness and active alignment.

1A is a top view of a light source device according to Embodiment 1. FIG. 1B is a cross-sectional view of the light source device according to Embodiment 1. FIG. FIG. 2 is a top view of the light source device according to Embodiment 1 when the lid and the bonding material are omitted. 3A and 3B are diagrams for explaining the method for manufacturing the light source device according to the first embodiment. FIG. 4A is a top view of a light source device according to Embodiment 2. FIG. 4B is a cross-sectional view of the light source device according to Embodiment 2. FIG. 5A is a top view of a light source device according to Embodiment 3. FIG. 5B is a cross-sectional view of the light source device according to Embodiment 3. FIG. 6A is a top view of a light source device according to Embodiment 4. FIG. 6B is a cross-sectional view of the light source device according to Embodiment 4. FIG. 7A is a top view of a light source device according to Embodiment 5. FIG. 7B is a cross-sectional view of the light source device according to Embodiment 5. FIG. FIG. 8 is a top view of the light source device according to Embodiment 5 when the lid and the bonding material are omitted. 9 is a cross-sectional view of a light source device according to a modification of Embodiment 5. FIG. 10 is a cross-sectional view of a light source device according to Embodiment 6. FIG. 11A and 11B are diagrams for explaining the method for manufacturing the light source device according to the sixth embodiment. 12 is a cross-sectional view of a light source device according to a modification of Embodiment 6. FIG. FIG. 13 is a cross-sectional view of a light source device according to a modification.

Embodiments of the present disclosure will be described below with reference to the drawings. It should be noted that each of the embodiments described below is a specific example of the present disclosure. Therefore, numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps (processes), order of steps, and the like shown in the following embodiments are examples and limit the present disclosure. It's not the gist of it. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest concept of the present disclosure will be described as optional constituent elements.

Each figure is a schematic diagram and is not necessarily strictly illustrated. Therefore, scales and the like are not always the same in each drawing. In each figure, the same reference numerals are assigned to substantially the same configurations, and duplicate descriptions are omitted or simplified.

(Embodiment 1)
First, the configuration of the light source device 1 according to Embodiment 1 will be described with reference to FIGS. 1A, 1B and 2. FIG. FIG. 1A is a top view of light source device 1 according to Embodiment 1. FIG. FIG. 1B is a cross-sectional view of the light source device 1. FIG. FIG. 2 is a top view of the same light source device 1 when the lid 4 and the bonding material 8 are omitted. In other words, FIG. 2 shows a state in which the bonding material 8 and the lid 4 are removed from the light source device 1 . In the plan views of FIGS. 1A and 2, the same hatching is given to the same members as in FIG. 1A for the sake of convenience. The hatching in this plan view is the same for subsequent drawings.

As shown in FIGS. 1A, 1B and 2, the light source device 1 is a semiconductor laser light emitting device having a semiconductor laser element 2. As shown in FIG. The light source device 1 includes a semiconductor laser element 2 , a base 3 having a support portion 10 and a frame 20 , and a lid 4 fixed to the base 3 . Light source device 1 in the present embodiment further includes mirror 5 that reflects laser light emitted from semiconductor laser element 2 .

In the light source device 1, a package is constituted by the substrate 3 and the lid 4, and the semiconductor laser element 2 is accommodated in this package. As shown in FIG. 1B, the internal space of the package formed by the base 3 and the lid 4 is a sealed space 1a that is hermetically sealed. Therefore, the semiconductor laser element 2 is arranged in the sealing space 1a. In this embodiment, a plurality of semiconductor laser elements 2 are arranged in the sealing space 1a.

The semiconductor laser element 2 is a laser chip that emits laser light. In this embodiment, the semiconductor laser device 2 is a nitride semiconductor laser device made of a nitride semiconductor material. As an example, the semiconductor laser device 2 is a GaN-based semiconductor laser device that emits blue laser light.

A semiconductor laser element 2 is arranged on a base 3 together with a mirror 5 . In this embodiment, the semiconductor laser element 2 is arranged on the substrate 3 via the submount 6 . The submount 6 functions as a base for supporting the semiconductor laser element 2 and also functions as a heat sink for dissipating heat generated in the semiconductor laser element 2 . As an example, the submount 6 is made of a ceramic material such as aluminum nitride (AlN) or a metal material such as copper.

The base 3 is a housing on which the semiconductor laser element 2 and the mirror 5 are mounted. In this embodiment, a plurality of semiconductor laser elements 2 and a plurality of mirrors 5 are mounted on the substrate 3 . Specifically, the plurality of semiconductor laser elements 2 and the plurality of mirrors 5 are mounted on the supporting portion 10 of the base 3 . A plurality of semiconductor laser elements 2 and a plurality of mirrors 5 are arranged in a matrix. As shown in FIG. 2, as an example, 16 semiconductor laser elements 2 and 16 mirrors 5 are arranged in 4 rows and 4 columns, respectively.

The 16 semiconductor laser elements 2 are electrically connected in a 4-series-4-parallel arrangement. Power is supplied to the four semiconductor laser elements 2 connected in series by a pair of lead pins 2a. One of the pair of lead pins 2a is a cathode terminal and the other is an anode terminal. The four semiconductor laser elements 2 connected in series are electrically connected to each other by, for example, gold wires (not shown).

A support portion 10 on the base 3 is a support for supporting the semiconductor laser element 2 , the mirror 5 and the submount 6 . Specifically, the support portion 10 is a mounting substrate for mounting the semiconductor laser element 2, the mirror 5, and the submount 6 thereon. Each of the plurality of semiconductor laser elements 2 is mounted on the supporting portion 10 via the submount 6 . Each semiconductor laser element 2 is mounted parallel to the upper surface of the support portion 10 . Therefore, the optical axis of the laser light emitted from each semiconductor laser element 2 is parallel to the upper surface of the support portion 10 .

As the supporting portion 10, for example, a metal substrate made of a metal material, a ceramic plate made of a ceramic material, a glass plate made of a glass material, or a resin substrate made of a resin material can be used. can. In order to efficiently conduct the heat generated by the semiconductor laser element 2 to the supporting portion 10, the supporting portion 10 is preferably made of a material having a high thermal conductivity such as a metal material. Examples of metal materials that have high thermal conductivity and are practical as mounting substrates include copper and aluminum. The shape of the support portion 10 is flat as a whole, and the top view shape of the support portion 10 is substantially rectangular, but the shape is not limited to this.

Further, the base 3 includes a frame 20 in addition to the support portion 10 . As shown in FIG. 2, the frame 20 is a frame-shaped member whose top view shape is substantially rectangular. The frame 20 is provided on the support portion 10 . Specifically, the frame 20 is fixed to the support 10 so as to surround all the semiconductor laser elements 2 . In addition, as shown in FIG. 1B , the frame body 20 is provided so as to be fitted into the support portion 10 , but may be provided on the upper surface of the support portion 10 .

As shown in FIGS. 1B and 2, the frame 20 has a frame-shaped frame main body 21 and a frame-shaped partition 22 . The frame main body 21 is fixed to the support portion 10 . The cross-sectional shape of the frame main body 21 is substantially rectangular. As shown in FIG. 2, the upper surface of the frame body 21 is provided with a recess 21a. The concave portion 21 a is a groove formed over the entire circumference of the frame body 21 . The top view shape of the concave portion 21a is a rectangular frame shape. The screen part 22 is provided so as to stand on the upper surface of the frame body 21 . The screen part 22 is provided outside the recessed part 21a. Specifically, the screen portion 22 is provided so that the outer side wall surface of the screen portion 22 is aligned with the outer surface of the frame main body 21 .

The frame 20 is made of, for example, a metal material such as copper or aluminum, but is not limited to this. Also, the frame main body 21 and the screen portion 22 are integrally formed, but they may be separate.

The lid 4 is fixed to the frame 20 . The lid 4 is fixed to the frame 20 so as to close the opening of the frame 20 .

The lid 4 is an example of an optical member, and includes an optical element 4 a (optical element) that imparts an optical effect to the laser beam emitted from the semiconductor laser element 2 . In this embodiment, the optical element 4a is a lens having lens action. In other words, the optical element 4a refracts the laser light emitted from the semiconductor laser element 2, thereby imparting a lens effect to the laser light. Specifically, the optical element 4a is a convex lens that collects light. Therefore, laser light emitted from the semiconductor laser element 2 is condensed by the optical element 4a.

The lid 4 includes a plurality of optical elements 4a. Each of the plurality of optical elements 4 a is provided corresponding to each of the plurality of semiconductor laser elements 2 . In other words, the plurality of optical elements 4a, mirrors 5, and semiconductor laser elements 2 are provided in one-to-one correspondence. In the present embodiment, each optical element 4a is a convex lens, so laser light emitted from each semiconductor laser element 2 is focused by each optical element 4a.

As shown in FIGS. 1A and 1B, the lid body 4 is composed of a flat plate-like translucent flat plate portion 30a and a plurality of convex portions 30b provided on the flat plate portion 30a. Each of the plurality of convex portions 30b is part of the optical element 4a, which is a convex lens. Specifically, each optical element 4a is composed of a flat plate portion 30a and a convex portion 30b.

In this embodiment, the plurality of convex portions 30b are provided on the outer surface of the flat plate portion 30a. Therefore, each of the plurality of convex portions 30b has a convex surface that protrudes in the direction opposite to the sealing space 1a side. The convex surface of each convex portion 30b is a curved surface such as a spherical surface.

A light incident surface of each optical element 4a on which laser light is incident forms part of the sealing space 1a. In the present embodiment, the light incident surface of each optical element 4a on which laser light is incident is the inner surface of the flat plate portion 30a.

The flat plate portion 30a and the plurality of convex portions 30b are integrally formed. Therefore, the flat plate portion 30a and the plurality of convex portions 30b are made of the same translucent material. In the present embodiment, the lid body 4 is a light-transmitting member composed only of the flat plate portion 30a and the convex portion 30b. Therefore, the entire lid 4 is made of translucent material. As an example, the lid 4 is made of a transparent material such as a transparent resin material or glass. In this embodiment, the lid 4 is made of glass.

The lid 4 is arranged on the frame 20 so as to close the opening of the frame 20 . Specifically, as shown in FIG. 1B, the lid 4 is fixed to the frame 20 so that the peripheral portion of the flat plate portion 30a of the lid 4 is placed on the upper surface of the frame main body 21 of the frame 20. be done. The flat plate portion 30a of the lid 4 is surrounded by the screen portion 22 of the frame 20, and the side surface (end surface) of the flat plate portion 30a and the inner side surface of the screen portion 22 face each other with a gap therebetween.

It is preferable that the height of the light emitting surface of the optical element 4a of the lid 4 from which the laser beam is emitted is lower than the height of the upper surface of the frame 20 with the support 10 as a reference. Specifically, the maximum height of the convex surface of the convex portion 30 b that is the light exit surface of the optical element 4 a of the lid 4 is lower than the height of the upper end surface of the screen portion 22 that is the upper surface of the frame 20 . Good.

The lid 4 is fixed in close contact with the frame 20 via the sealing material 7 . That is, the lid 4 and the frame 20 are fixed with the sealing material 7 interposed between the lid 4 and the frame 20 . The sealing material 7 is an example of a joining member that joins the lid 4 and the frame 20 together.

As shown in FIG. 1B , the sealing material 7 is formed in a thin layer between the frame body 21 of the frame 20 and the lid 4 . As shown in FIG. 2, in the present embodiment, the sealing member 7 is formed in an annular shape when viewed from above. Specifically, the sealing material 7 extends over the entire circumference of the lid 4 and the frame 20 between the inner surface of the peripheral portion of the flat plate portion 30a of the lid 4 and the upper surface of the frame main body 21 of the frame 20. filled in the gap. The thickness of the sealing material 7 is, for example, 1 mm or less. In this embodiment, the thickness of the sealing material 7 is 0.2 mm. As shown in FIG. 1B, the sealing material 7 is also filled in the recess 21a formed in the frame main body 21, but the recess 21a may not be filled with the sealing material 7. FIG. The sealing material 7 melts and spreads in the horizontal direction, but since the concave portion 21a is provided, the sealing material 7 that melts and spreads toward the inside of the frame 20 enters the concave portion 21a. Thereby, it is possible to prevent the melted sealing material 7 from reaching the support portion 10 .

By bringing the frame 20 and the lid 4 into close contact with each other through the sealing material 7 in this way, the airtightness in the sealed space 1a is maintained. That is, the base 3, the lid 4, and the sealing material 7 form a hermetically sealed sealed space 1a.

The sealing material 7 is preferably made of a material that does not contain silicone. Moreover, the sealing material 7 is preferably made of a soft material. Ethylene-vinyl alcohol copolymer (EVOH) or indium can be used as such a sealing material 7 . In this embodiment, the sealing material 7 is made of EVOH.

Moreover, as shown in FIG. 1B, the lid 4 and the frame 20 are joined by a joining material 8 . Specifically, the lid body 4 and the frame body 20 are joined via the joining material 8 on the opposite side of the sealing material 7 from the sealing space 1a side. The bonding material 8 is filled between the screen portion 22 of the frame 20 and the end face of the flat plate portion 30a of the lid 4 . The bonding material 8 is an example of a bonding member that bonds the lid 4 and the frame 20 together.

In this way, by joining the lid 4 and the frame 20 using the bonding material 8 in addition to the sealing material 7, the lid 4 and the frame 20 can be firmly fixed. The bonding material 8 is made of resin. A thermosetting adhesive can be used as the bonding material 8 . As an example, the resin forming the bonding material 8 is an epoxy resin. For example, as the bonding material 8, a thermosetting adhesive made of an epoxy resin that cures at a temperature of room temperature to 160° C. can be used. Note that the bonding material 8 may be a photocurable adhesive such as an ultraviolet curable adhesive made of resin or the like instead of a thermosetting adhesive.

In the present embodiment, the bonding material 8 has bonding strength higher than that of the sealing material 7 . In other words, the adhesive strength of the bonding material 8 is greater than the adhesive strength of the sealing material 7 . By using the bonding material 8 having a bonding strength higher than that of the sealing material 7 in this way, even when using the sealing material 7 having a relatively weak bonding strength such as EVOH, the lid 4 and the frame can be easily separated from each other. The body 20 can be firmly fixed.

A laser beam emitted from the semiconductor laser element 2 is incident on the lid 4 through the mirror 5 . The mirror 5 reflects the laser light emitted from the semiconductor laser element 2 to enter the optical element 4a. As shown in FIG. 1B, in this embodiment, the semiconductor laser element 2 is mounted in parallel with the upper surface of the support portion 10, so that the laser light emitted from the semiconductor laser element 2 is directed to the optical element 4a located above. Move laterally instead of in the direction of For this reason, the mirror 5 is configured to reflect the laser beam traveling in the lateral direction so that the laser beam rises upward. In other words, the mirror 5 is a rising mirror, and has a reflecting surface that reflects the incident light so that it rises upward.

A reflecting surface of the mirror 5 is an inclined surface that is inclined with respect to the upper surface of the support portion 10 . As an example, the inclination angle of the reflecting surface of the mirror 5 with respect to the upper surface of the supporting portion 10 is 45 degrees. In this case, the laser light of the semiconductor laser element 2 emitted in the direction parallel to the upper surface of the support 10 is reflected by the reflecting surface of the mirror 5 and travels in the direction perpendicular to the upper surface of the support 10. , enter the optical element 4 a of the lid 4 . Each of the plurality of mirrors 5 is arranged so that the optical axis of the laser beam reflected by each mirror 5 and the optical axis of the optical element 4a of the lid 4 are aligned.

Next, a method for manufacturing the light source device 1 according to this embodiment will be described with reference to FIG. 3A and 3B are diagrams for explaining a method for manufacturing the light source device 1 according to the first embodiment.

First, as shown in (a) of FIG. 3, the base 3 having the support portion 10 and the frame 20 is prepared. Next, as shown in FIG. 3B, the semiconductor laser element 2 and the mirror 5 are mounted on the upper surface of the supporting portion 10 of the base 3. Next, as shown in FIG. In the present embodiment, a plurality of semiconductor laser elements 2 and a plurality of mirrors 5 are mounted on support portion 10 . Specifically, each semiconductor laser element 2 is mounted on a support portion 10 via a submount 6 . In this case, the submount 6 to which the semiconductor laser element 2 is bonded is mounted on the supporting portion 10 .

Next, as shown in (c) of FIG. 3, the sealing material 7S, which is a sheet material, is arranged on the frame 20 of the base 3. Next, as shown in FIG. Specifically, the sealing material 7S is arranged on the upper surface of the frame main body 21 over the entire circumference of the frame 20 . As the sealing material 7S, for example, a resin sheet made of resin can be used. In this embodiment, an annular EVOH sheet made of EVOH is used as the sealing material 7S. An indium sheet made of indium may be used as the sheet-like sealing material 7S. Also, the sealing material 7S may be a plurality of separated sheet pieces instead of a sheet material made of an annular integral body. In this case, it is preferable that a plurality of sheet pieces are arranged continuously or intermittently in an annular shape and arranged on the frame main body 21 .

Next, as shown in (d) of FIG. 3, the cover 4 prepared in advance is placed on the frame 20 on which the sealing material 7S is placed. Specifically, the lid 4 is arranged on the frame main body 21 of the frame 20 so as to cover the opening of the frame 20 . At this time, the lid 4 is placed on the sealing material 7S. As a result, the sealing material 7</b>S is sandwiched between the peripheral portion of the flat plate portion 30 a of the lid 4 and the frame main body 21 of the frame 20 . By interposing the sealing material 7S between the lid body 4 and the frame body 20 in this manner, the internal space surrounded by the base body 3 and the lid body 4 becomes a hermetically sealed sealed space 1a. . At this point, the lid 4 and the frame 20 are not fixed with the sealing material 7S.

Further, when the lid 4 is arranged on the frame main body 21 , a gap exists between the side surface (end surface) of the flat plate portion 30 a of the lid 4 and the inner surface of the screen portion 22 .

Next, as shown in (e) of FIG. 3, the lid body 4 placed on the frame body 20 is aligned with the sealing material 7S interposed therebetween. That is, the lid 4 is aligned with the internal space surrounded by the base 3 and the lid 4 being the sealed space 1a.

In the present embodiment, the lid 4 is aligned by active alignment with the inner space surrounded by the base 3 and the lid 4 being the sealed space 1a. Specifically, the position of the lid 4 is adjusted so that the laser beam passes through the optical axis of the optical element 4 a of the lid 4 while the semiconductor laser element 2 is driven to emit a laser beam. In this case, the position of the lid 4 can be adjusted by moving the lid 4 in a direction (horizontal direction) parallel to the upper surface of the support portion 10 .

At this time, since the sealing material 7S is not yet melted, even if the sealing material 7S is sandwiched between the lid 4 and the frame 20, the lid 4 can be horizontally displaced. That is, the position of the lid 4 can be adjusted. Further, when aligning the lid 4, a sheet material made of EVOH, indium, or the like, which is a soft material, is used as the sealing material 7S, thereby reducing distortion caused when aligning the lid 4. be able to.

In this embodiment, the lid 4 is surrounded by the screen portion 22 of the frame 20, but there is a gap between the side surface of the flat plate portion 30a of the lid 4 and the inner side surface of the screen portion 22. Since it exists, the lid 4 can be moved horizontally. In other words, this gap is a space for positioning the lid 4 .

After positioning the lid 4, the sealing material 7S is melted by heating. Since the EVOH sheet is used as the sealing material 7S in the present embodiment, the sealing material 7S can be melted by heating at about 220.degree.

At this time, the sealing material 7S melts and spreads in the horizontal direction, but since the frame main body 21 is provided with the concave portion 21a, the sealing material 7S is melted and the frame body 7S is expanded as shown in FIG. The sealing material 7S that spreads toward the inside of the 20 enters the concave portion 21a. As a result, it is possible to prevent the melted sealing material 7S from reaching the support portion 10 . That is, the recess 21a is a release recess for releasing the melted sealing material 7S.

After that, the sealing material 7S is cured by stopping the heating. As a result, the lid 4 and the frame 20 are fixed by the sealing material 7 . Specifically, the flat plate portion 30 a of the lid 4 and the frame main body 21 of the frame 20 are fixed by the sealing material 7 . Thus, the sealing material 7 is interposed between the lid 4 and the frame 20. As shown in FIG. The sealing material 7S may be hardened by positively cooling the sealing material 7. FIG.

Next, as shown in (g) of FIG. 3, the joint material 8 is inserted between the lid 4 and the frame 20 to fix the lid 4 and the frame 20 together. Specifically, the bonding material 8 is inserted between the side surface of the flat plate portion 30a of the lid 4 and the inner surface of the screen portion 22 so as to fill the gap. In this embodiment, a thermosetting adhesive made of epoxy resin is used as the bonding material 8 . In this case, the fluid bonding material 8 is applied to the gap between the side surface of the flat plate portion 30 a of the lid 4 and the partition portion 22 of the frame 20 . After that, the bonding material 8 is cured by heating the bonding material 8 .

When heating the bonding material 8 , the bonding material 8 may be heated using a heating device such as a heater, or the bonding material 8 may be heated by driving the semiconductor laser element 2 . That is, the bonding material 8 may be heated by heat generated from the semiconductor laser element 2 without using a separate heating device. By driving the semiconductor laser element 2, the ambient temperature can be raised to about 160.degree.

By heating and hardening the bonding material 8 in this manner, the lid body 4 and the frame body 20 are bonded by the bonding material 8 . That is, the lid 4 and the frame 20 are fixed with the bonding material 8 . Thus, the light source device 1 is completed.

Instead of actively heating the bonding material 8, the bonding material 8 may be hardened by natural drying. Also, as the bonding material 8, an ultraviolet curable adhesive may be used instead of the thermosetting adhesive. In this case, the bonding material 8, which is an ultraviolet curable adhesive, can be applied to the gap between the lid 4 and the frame 20, and the bonding material 8 can be cured by irradiating ultraviolet rays.

Further, when the semiconductor laser element 2 is driven to thermally cure the bonding material 8, the bonding material 8 may be applied and cured while the lid body 4 is being aligned by active alignment. .

As described above, the light source device 1 according to the present embodiment includes the base 3 having the support portion 10 and the frame 20, the lid 4 including the optical element 4a, the lid 4, the base 3, and the sealing material 7. The lid body 4 is fixed in close contact with the frame body 20 via the sealing material 7, and the sealing material 7 is sealed. The lid body 4 and the frame body 20 are joined via a joining material 8 on the side opposite to the stop space 1a side.

As described above, in the present embodiment, the joining member that joins the lid 4 and the frame 20 is functionally separated instead of the functionally separated lid 4 which is an optical member. Specifically, the lid 4 has both the function of covering the opening of the frame 20 to ensure the airtightness of the package and the function of the optical action (such as light collecting ability) by the optical element 4a. As joining members for joining the lid 4 and the frame 20, the lid 4 and the frame 20, the sealing material 7 for securing the airtightness of the package composed of the lid 4 and the base 3, are used. A bonding material 8 is used for fixing.

With this configuration, before the lid 4 and the frame 20 are fixed, the internal space of the package composed of the lid 4 and the base 3 is hermetically sealed with the sealing material 7 to form a sealed space 1a. In this state, the lid 4 can be aligned by active alignment. That is, it is possible to perform active alignment of the lid 4 including the optical element 4a while ensuring airtightness of the package composed of the lid 4 and the base 3 . Therefore, it is possible to realize the light source device 1 having a package structure capable of achieving both airtightness and active alignment.

Further, as described above, the lid 4 can be used as a single component having both functions of securing airtightness and optical action without being separated. Thereby, the structure of the light source device 1 can also be simplified.

Moreover, in the present embodiment, since the lid 4 and the frame 20 are bonded using two bonding members, the sealing material 7 and the bonding material 8, the lid 4 and the frame 20 are firmly attached. can also be fixed to

Furthermore, in the present embodiment, no member is required between the optical element 4a (lens) and the semiconductor laser element 2, so the distance between the semiconductor laser element 2 and the optical element 4a can be shortened. As a result, it is also possible to reduce the size and height of the light source device 1 .

Moreover, in the light source device 1 according to the present embodiment, the bonding material 8 has a bonding strength higher than that of the sealing material 7 .

When performing active alignment with the sealing material 7 sandwiched between the lid 4 and the frame 20, the sealing material 7 is preferably made of a soft material. If the bonding strength of the bonding material 8 is lower than that of the sealing material 7 , the desired bonding strength may not be obtained even if the lid 4 and the frame 20 are bonded with the bonding material 8 . Therefore, by using the bonding material 8 having a bonding strength higher than that of the sealing material 7, the bonding strength between the lid body 4 and the frame body 20 is improved even when the sealing material 7 made of a soft material is used. be able to.

In addition, in the light source device 1 according to the present embodiment, the light incident surface of the optical element 4a of the lid 4 on which the laser beam of the semiconductor laser element 2 is incident forms part of the sealing space 1a.

In this way, the light incident surface of the optical element 4a forms part of the sealed space 1a, so that the tweezers effect in which the laser light emitted from the semiconductor laser element 2 traps a minute object can be suppressed. .

Moreover, in the light source device 1 according to the present embodiment, the optical element 4a of the lid 4 is a lens.

With this configuration, the light distribution of the laser light emitted from the semiconductor laser element 2 can be controlled by the optical element 4a. For example, by using a convex lens as the optical element 4a, the laser light from the semiconductor laser element 2 can be focused.

Moreover, in the light source device 1 according to the present embodiment, the sealing material 7 is made of a material that does not contain silicone.

With this configuration, it is possible to suppress the phototweezers effect due to the photochemical reaction of siloxane contained in silicone.

Moreover, in the light source device 1 according to the present embodiment, the sealing material 7 is made of ethylene-vinyl alcohol copolymer (EVOH).

Since EVOH does not contain siloxane, the sealing material 7 made of EVOH can suppress the optical tweezers effect due to the photochemical reaction of siloxane. Moreover, since EVOH is a resin material having a high gas permeation prevention ability and an excellent gas barrier property, it is possible to prevent siloxane existing outside (in the air) of the light source device 1 from flowing into the sealed space 1a. The optical tweezers effect due to the photochemical reaction of siloxane can be suppressed.

Moreover, in the light source device 1 according to the present embodiment, the bonding material 8 is made of resin. Specifically, the resin forming the bonding material 8 is an epoxy resin.

As a result, the lid 4 and the frame 20 can be fixed with the resin, so that the lid 4 and the frame 20 can be joined together by other joining methods such as seam welding at a lower cost and in mass production. The light source device 1 can be manufactured with good efficiency. In addition, since the curing temperature of the resin bonding material is generally lower than the operating temperature of the semiconductor laser element 2, by forming the bonding material 8 from a resin such as an epoxy resin, it is possible to align the lid 4 by active alignment. The joint material 8 can be cured to join the lid member 4 and the frame member 20 while performing the above.

Further, in the light source device 1 according to the present embodiment, a plurality of semiconductor laser elements 2 are arranged in the sealed space 1a, and a plurality of optical elements 4a of the lid 4 are provided for each of the plurality of semiconductor laser elements 2. is provided.

By arranging a plurality of semiconductor laser elements 2 in this manner, the light output of the light source device 1 as a whole can be increased. In addition, when a plurality of semiconductor laser elements 2 are arranged, the difference in size between the lid 4 and the frame 20 increases as the sizes of the lid 4 and the frame 20 increase, and the airtightness may deteriorate. Since airtightness can be ensured in the present embodiment as described above, even when a plurality of semiconductor laser elements 2 are arranged, deterioration of airtightness can be effectively suppressed.

Further, the light source device 1 according to the present embodiment further includes a mirror 5 that reflects the laser light emitted from the semiconductor laser element 2 and causes it to enter the optical element 4a. mounted parallel to the top surface of the

By mounting the semiconductor laser element 2 in parallel with the upper surface of the support portion 10 in this manner, the heat generated in the semiconductor laser element 2 can be efficiently conducted to the support portion 10, and heat dissipation of the semiconductor laser element 2 can be achieved. can improve sexuality. Further, even if the semiconductor laser element 2 is mounted parallel to the upper surface of the support section 10, the laser light emitted from the semiconductor laser element 2 can be deflected by the mirror, so that the upper surface of the support section 10 and the optical element 4a are aligned. Geometric interference can be suppressed.

It is preferable that the height of the light emitting surface of the optical element 4a of the lid 4 from which the laser beam is emitted is lower than the height of the upper surface of the frame 20 with the support portion 10 as a reference.

With this configuration, it is possible to prevent an external object from hitting the optical element 4a when the light source device 1 is moved, so that it is possible to prevent damage to the optical element 4a.

(Embodiment 2)
Next, a light source device 1A according to Embodiment 2 will be described with reference to FIGS. 4A and 4B. FIG. 4A is a top view of light source device 1A according to Embodiment 2, and FIG. 4B is a cross-sectional view of light source device 1A.

A light source device 1A according to the present embodiment differs from the light source device 1 according to the first embodiment in the shape of a lid body 4A. Specifically, in the first embodiment, the convex portion 30b constituting each optical element 4a in the lid 4 is provided on the outer surface of the flat plate portion 30a. A convex portion 30b constituting each optical element 4a in 4A is provided on the inner surface of the flat plate portion 30a.

Therefore, in the present embodiment, the convex portion 30b of each optical element 4a has a convex surface that protrudes toward the sealing space 1a side. That is, the convex portion 30b protrudes toward the support portion 10. As shown in FIG. Also in this embodiment, each optical element 4a is a convex lens, and the convex surface of the convex portion 30b is a curved surface such as a spherical surface. All the convex portions 30b are provided on the inner surface of the flat plate portion 30a.

Also in the present embodiment, the light incident surface of each optical element 4a on which the laser beam is incident forms part of the sealing space 1a. Since it is provided on the inner surface of 30a, the light incident surface of each optical element 4a on which the laser beam is incident includes the convex surface of the convex portion 30b.

The configuration of the light source device 1A according to the present embodiment is the same as that of the light source device 1 according to the above embodiment except for the configuration of the lid member 4A.

Therefore, also in the light source device 1A according to the present embodiment, as in the first embodiment, the base body 3 having the support portion 10 and the frame body 20, the lid body 4A including the optical element 4a, the lid body 4A and the base body 3 and a semiconductor laser element 2 arranged in a sealing space 1a formed by a sealing material 7. A lid body 4A is fixed in close contact with a frame body 20 with the sealing material 7 interposed therebetween. , the lid body 4A and the frame body 20 are joined via a joining material 8 on the opposite side of the sealing material 7 from the sealing space 1a side.

Accordingly, the light source device 1A according to the present embodiment has the same effect as the light source device 1 according to the first embodiment. Specifically, it is possible to perform active alignment of the lid 4A including the optical element 4a while ensuring the airtightness of the package composed of the lid 4A and the base 3. There is an effect such as realizing the light source device 1A having a package structure capable of achieving both.

Further, in the light source device 1A according to the present embodiment, the convex portions 30b forming each optical element 4a are provided not on the outer surface of the flat plate portion 30a but on the inner surface of the flat plate portion 30a. Therefore, the lower end of the lid 4A is closer to the support 10 than the upper end of the frame 20 is. Specifically, the apex of the convex portion 30b, which is the lower end of the lid 4A, is located closer to the support portion 10 than the upper edge of the screen portion 22, which is the upper end of the frame 20. As shown in FIG. In the present embodiment, the apex of the convex portion 30b is located closer to the support portion 10 than the upper surface of the frame main body 21 is.

With this configuration, an external object does not hit the optical element 4a when the light source device 1A is moved, so damage to the optical element 4a can be suppressed. In particular, since the convex portion 30b of the optical element 4a, which is a convex lens, is provided on the inner surface of the flat plate portion 30a and is not exposed to the outside, it is possible to prevent the convex portion 30b from being damaged.

Also in the present embodiment, the height of the light emitting surface of the optical element 4a of the lid 4A from which the laser beam is emitted is lower than the height of the upper surface of the frame 20 with the support portion 10 as a reference. . Specifically, in the present embodiment, the plane that is the outer surface of the flat plate portion 30a that is the light emitting surface of the optical element 4a of the lid 4A is higher than the upper end surface of the screen portion 22 that is the upper surface of the frame 20. getting low. As a result, it is possible to prevent the outer surface of the lid 4A from hitting and being damaged by an external object. As an example, the height difference between the outer surface of the flat plate portion 30a and the upper end surface of the screen portion 22 is approximately 0.8 mm to 1.0 mm.

(Embodiment 3)
Next, a light source device 1B according to Embodiment 3 will be described with reference to FIGS. 5A and 5B. FIG. 5A is a top view of a light source device 1B according to Embodiment 3, and FIG. 5B is a cross-sectional view of the same light source device 1B.

In the light source device 1 according to the first embodiment, the sealing material 7 is obtained by once melting the sealing material 7S, which is a sheet material, and then curing it. In 1B, the sealing material 7B is made of liquid metal. The sealing material 7B, which is a liquid metal, is a liquid metal that does not solidify above a predetermined temperature. Indium gallium (InGa) made of indium and gallium can be used as the sealing material 7B, which is a liquid metal. Indium gallium used in this embodiment is liquid at 50° C. or higher and solid at lower than 50° C. In other words, indium gallium is solid at room temperature.

Also, the sealing material 7B is arranged in a recess 23 provided in the frame 20 . In the present embodiment, recess 23 is provided in frame body 21 of frame 20 . Specifically, the recess 23 is provided in a portion of the frame body 21 that faces the lid 4 . A recessed portion of the recess 23 is a cavity between the frame 20 and the lid 4 .

The concave portion 23 is a groove formed over the entire circumference of the frame body 21 . Therefore, the recess 23 is formed in an annular shape. As an example, the top view shape of the recess 23 is a rectangular frame shape. The sealing material 7</b>B placed in the recess 23 exists over the entire circumference of the recess 23 . Therefore, the sealing material 7B is arranged in an annular shape. Specifically, the top view shape of the sealing material 7B is a rectangular frame shape.

The sealing material 7</b>B arranged in the recess 23 supports the lid 4 . Therefore, the upper surface of the sealing material 7B arranged in the recess 23 is in contact with the inner surface of the flat plate portion 30a of the lid 4. As shown in FIG. In addition, although the upper part of the sealing material 7B protrudes from the recessed part 23, it is not restricted to this.

The light source device 1B configured in this manner can be manufactured according to the manufacturing method of the light source device 1 according to the first embodiment.

Specifically, first, the base 3 having the support portion 10 and the frame 20 is prepared in the same manner as in the first embodiment. At this time, as the frame 20, a frame main body 21 in which a concave portion 23 is formed is used. Next, the semiconductor laser element 2 and the mirror 5 are mounted on the upper surface of the support portion 10 of the substrate 3 in the same manner as in the first embodiment.

Next, a liquid sealing material 7B is placed on the frame 20 of the base 3 . A liquid metal is used as the sealing material 7B. Specifically, the recess 23 provided in the frame body 21 of the frame 20 is coated with the liquid sealing material 7B. At this time, the sealing material 7B is applied to the concave portion 23 so that the upper portion of the sealing material 7B protrudes from the concave portion 23 due to surface tension. It should be noted that the sealing material 7B made of liquid metal is heated as necessary to make it liquefied (liquid).

Next, similarly to the first embodiment, the previously prepared lid body 4 is placed on the frame body 20 on which the sealing material 7B is placed. At this time, the lid 4 is placed on the sealing material 7B. As a result, the sealing material 7B is interposed between the lid member 4 and the frame member 20, and the internal space surrounded by the base member 3 and the lid member 4 becomes an airtight sealed space 1a. In this embodiment, lid 4 is placed on frame 20 at room temperature. At this time, the sealing material 7B may be solid or liquid.

Next, as in the first embodiment, the lid 4 placed on the frame 20 is aligned with the sealing material 7B interposed therebetween. That is, the lid 4 is aligned with the internal space surrounded by the base 3 and the lid 4 being the sealed space 1a. In this embodiment as well, the lid 4 is aligned by active alignment with the internal space surrounded by the base 3 and the lid 4 being the sealed space 1a. In this embodiment, the active alignment of the lid 4 is performed at room temperature. At this time, the sealing material 7B may be solid or liquid as long as it can support the lid 4 . At this time, the sealing material 7B spreads laterally, but since the frame main body 21 is provided with the recess 21a, the sealing material 7B spreading toward the inside of the frame 20 enters the recess 21a. Become. Thereby, it is possible to prevent the sealing material 7B from reaching the support portion 10 . That is, the recess 21a is a release recess for releasing the sealing material 7B.

Next, as in the first embodiment, the joint material 8 is inserted between the lid 4 and the frame 20 to fix the lid 4 and the frame 20 together. As a result, the lid 4 and the frame 20 are joined with the joining material 8 . That is, the lid 4 and the frame 20 are fixed with the bonding material 8 . As described above, the light source device 1B is completed.

As described above, in the light source device 1B according to the present embodiment, as in the first embodiment, the base body 3 having the support portion 10 and the frame body 20, the lid body 4 including the optical element 4a, and the lid body 4 and a semiconductor laser element 2 arranged in a sealing space 1a formed by a base 3 and a sealing material 7B. The lid body 4 and the frame body 20 are joined via the joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7B.

Thus, the light source device 1B according to the present embodiment has the same effect as the light source device 1 according to the first embodiment. Specifically, since the lid 4 including the optical element 4a can be actively aligned while ensuring the airtightness of the package composed of the lid 4 and the base 3, airtightness is maintained and active alignment is performed. There is an effect such as realizing the light source device 1B having a package structure capable of achieving both.

Further, in the light source device 1B of the present embodiment, there is a cavity between the frame 20 and the lid 4, and the sealing material 7B is arranged in this cavity. Specifically, the frame 20 has a recess 23 in a portion facing the lid 4 , and the cavity between the frame 20 and the lid 4 is the recessed portion of the recess 23 .

With this configuration, when the lid 4 is aligned by active alignment, it is possible to prevent the sealing material 7B from moving more than a specified value due to a change in the positional relationship between the frame 20 and the lid 4. can be done. Thereby, the sealing effect of the sealing space 1a by the sealing material 7B can be increased. That is, it is possible to ensure the airtightness of the sealed space 1a.

Moreover, in the light source device 1B according to the present embodiment, the sealing material 7B is a liquid metal made of indium gallium.

Since indium gallium does not contain siloxane, the optical tweezers effect due to the photochemical reaction of siloxane can be suppressed by forming the sealing material 7B from indium gallium. In addition, since the liquid metal is a liquid that can be changed into any shape while maintaining the contact state with the object, using the liquid metal as the sealing material 7B makes it possible to align the lid 4 by active alignment. It is possible to suppress the deterioration of the airtightness. In addition, indium gallium is solid at room temperature and becomes liquid when the temperature exceeds 50°C. Alignment can be easily performed.

In addition, in this embodiment, the lid 4A in the second embodiment may be used instead of the lid 4. FIG.

(Embodiment 4)
Next, a light source device 1C according to Embodiment 4 will be described with reference to FIGS. 6A and 6B. FIG. 6A is a top view of light source device 1C according to Embodiment 4, and FIG. 6B is a cross-sectional view of light source device 1C.

A light source device 1C according to the present embodiment has a configuration in which a sealing member 7C made of a ring wire is used instead of the sealing member 7B made of liquid metal in the light source device 1B according to the third embodiment. there is Also in the present embodiment, the sealing material 7C, which is a ring wire, is preferably made of a soft material. A metal wire having a wire diameter of about 1 mm can be used as the sealing material 7C, which is an annular wire. The sealing material 7C is, for example, a metal wire containing indium. A metal wire containing indium is a soft wire. As such a sealing material 7C, an indium metal wire, an indium alloy wire made of an indium alloy, or the like can be used.

The sealing material 7</b>C is arranged in a recess 23 provided in the frame 20 . Since the sealing material 7C is a ring wire, the sealing material 7C arranged in the recess 23 exists over the entire circumference of the recess 23. As shown in FIG. In this case, the sealing material 7C, which is a ring-shaped wire, may be a ring-shaped one that is not interrupted in the middle, or a string-shaped metal wire that is routed around the entire circumference of the recess 23. good too. The sealing material 7C, which is a ring-shaped wire arranged in the concave portion 23 in such a state, functions as a packing. Thereby, the airtightness of the sealing space 1a can be ensured.

A sealing material 7</b>C placed in the recess 23 supports the lid 4 . Therefore, the upper surface of the sealing material 7C arranged in the recess 23 is in contact with the inner surface of the flat plate portion 30a of the lid 4. As shown in FIG. Although the upper portion of the sealing material 7C protrudes from the recess 23 in the present embodiment, the present invention is not limited to this. In addition, when the sealing material 7C is a metal wire containing indium, the sealing material 7C is plastically deformed by being pressed against the lid 4 .

The configuration other than the sealing material 7C is the same as that of the light source device 1B according to the third embodiment. Further, the light source device 1C according to the present embodiment can be manufactured according to the manufacturing method of the light source device 1B according to the third embodiment.

Therefore, also in the light source device 1C according to the present embodiment, as in the third embodiment, the substrate 3 having the support portion 10 and the frame 20, the lid 4 including the optical element 4a, and the lid 4 The semiconductor laser element 2 is arranged in the sealing space 1a formed by the substrate 3 and the sealing material 7C, and the lid 4 is tightly fixed to the frame 20 via the sealing material 7C. The lid body 4 and the frame body 20 are joined via the joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7C.

Thus, the light source device 1C according to the present embodiment has the same effect as the light source device 1B according to the third embodiment. Specifically, since the lid 4 including the optical element 4a can be actively aligned while ensuring the airtightness of the package composed of the lid 4 and the base 3, airtightness is maintained and active alignment is performed. There is an effect such as realizing a light source device 1C having a package structure that is compatible with the above.

Moreover, in the light source device 1C according to the present embodiment, the sealing material 7C is a ring wire.

With this configuration, the sealing material 7C can be arranged without gaps over the entire circumference of the sealing space 1a, so that the airtightness of the sealing space 1a can be easily ensured.

Further, in the light source device 1C according to the present embodiment, specifically, the sealing material 7C is made of indium.

Since indium does not contain siloxane, the optical tweezers effect due to the photochemical reaction of siloxane can be suppressed by forming the sealing material 7C with indium.

Also in this embodiment, instead of the lid 4, the lid 4A in the second embodiment may be used.

(Embodiment 5)
Next, a light source device 1D according to Embodiment 5 will be described with reference to FIGS. 7A, 7B and 8. FIG. FIG. 7A is a top view of a light source device 1D according to Embodiment 5, and FIG. 7B is a cross-sectional view of the same light source device 1D. FIG. 8 is a top view of the light source device 1D when the lid 4 and the bonding material 8 are omitted.

In the light source device 1D according to the present embodiment, the base 3D has the supporting portion 10 and the frame body 20D as in the light source device 1 according to the first embodiment. , the shape of the frame 20D is different from that of the light source device 1 according to the first embodiment.

Specifically, in light source device 1D according to the present embodiment, frame 20D includes side frame 21D and inner frame 22D positioned inside side frame 21D. As shown in FIG. 8, each of the side frame 21D and the inner frame 22D has a rectangular frame shape when viewed from above. The side frame 21D and the inner frame 22D are made of a metal material such as copper or aluminum.

The frame 20</b>D is provided on the support section 10 . Specifically, as shown in FIG. 7B, the side frame 21D of the frame 20D is provided on the upper surface of the support portion 10. As shown in FIG. In the present embodiment, the side frame 21D is placed on the upper surface of the support section 10 and fixed to the support section 10 so as to stand on the support section 10 .

The inner frame 22D has an outer peripheral portion 22Da outside the lid 44 (including the fixing portion) in top view, and an inner peripheral portion 22Db positioned inside the outer peripheral portion 22Da. The outer peripheral portion 22Da of the inner frame 22D is fixed to the upper end portion of the side frame 21D. Therefore, there is an opening through which the laser beam is transmitted inside the inner peripheral portion 22Db. The inner frame 22D has a recess 23. As shown in FIG. In the present embodiment, recess 23 is provided in inner peripheral portion 22Db of inner frame 22D.

As shown in FIG. 7B, the recess 23 is provided in a portion of the inner frame 22D that faces the lid 4. As shown in FIG. A concave portion of the concave portion 23 is a cavity between the frame 20D and the lid 4. As shown in FIG.

The recess 23 is a groove formed over the entire circumference of the inner frame 22D. Therefore, as shown in FIG. 8, the recess 23 is formed in an annular shape. As an example, the top view shape of the recess 23 is a rectangular frame shape.

A sealing material 7</b>D is arranged in the recess 23 . The sealing material 7</b>D arranged in the concave portion 23 exists over the entire circumference of the annular concave portion 23 . Therefore, the sealing material 7D is arranged in an annular shape. Specifically, the top view shape of the sealing material 7D is a rectangular frame shape.

A gap exists between the upper end surface of the outer wall portion of the recess 23 and the flat plate portion 30 a of the lid 4 . As a result, the lid 4 can be easily displaced when the lid 4 is aligned by active alignment. At this time, the sealing material 7D spreads in the lateral direction, but since the frame main body 22D is provided with the recess 22Dc, the sealing material 7D spreading toward the inside of the frame 22D enters the recess 22Dc. Become. Thereby, it is possible to prevent the sealing material 7D from reaching the support portion 10 . That is, the recess 22Dc is a release recess for releasing the sealing material 7D.

In addition, as shown in FIG. 7B, the inner frame 22D has a bent portion 24. As shown in FIG. The cross-sectional shape of the bent portion 24 is, for example, a crank-like bent shape having two right angles. Since the inner frame 22D has the bent portion 24 in this manner, the frame 20D has flexibility in a direction (horizontal direction) crossing the direction in which the lid 4 covers the frame 20D. That is, the frame 20D has flexibility in the direction parallel to the inner surface of the flat plate portion 30a of the lid 4 (the direction parallel to the upper surface of the support portion 10).

The lid 4 is arranged on the frame 20D so as to close the opening of the frame 20D. In this embodiment, the lid 4 is supported by the inner frame 22D of the frame 20D. Specifically, the lid 4 is fixed to the inner peripheral portion 22Db of the inner frame 22D.

Further, in the present embodiment, as in the first embodiment, the height of the light emitting surface of the optical element 4a of the lid 4 from which the laser beam is emitted is equal to the upper surface of the frame 20D, with the support portion 10 as a reference. should be lower than the height of Specifically, the maximum height of the convex surface of the convex portion 30b, which is the light exit surface of the optical element 4a of the lid 4, is preferably lower than the height of the upper end surface of the frame 20D.

Also in the present embodiment, the lid body 4 is fixed in close contact with the frame body 20D via the sealing material 7D. That is, the lid 4 and the frame 20D are fixed with the sealing material 7D interposed between the lid 4 and the frame 20D. In this manner, by bringing the inner peripheral portion 22Db of the frame 20D and the lid 4 into close contact with each other through the sealing material 7D, the airtightness in the sealed space 1a is maintained. That is, a sealed space 1a hermetically sealed is formed by the base 3D, the lid 4, and the sealing material 7D.

The sealing material 7D is preferably made of a material that does not contain silicone. As the sealing material 7D, a sheet material made of EVOH or indium may be used as in the first embodiment, or a liquid metal made of indium gallium may be used as in the third embodiment. Alternatively, an annular wire such as a metal wire containing indium may be used as in the fourth embodiment.

Also in this embodiment, the lid 4 and the frame 20</b>D are joined with the joining material 8 . Specifically, the lid body 4 and the frame body 20D are joined via the joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7D. More specifically, the joining material 8 joins the inner peripheral portion 22Db of the frame 20D and the end portion of the flat plate portion 30a of the lid 4 . As a result, the lid 4 can be prevented from slipping, and the lid 4 and the frame 20D can be fixed.

Here, the bent portion 24 of the inner frame 22D is formed in the outer peripheral portion 22Da and is formed inside the position where the side frame 21D and the inner frame 22D are fixed. In other words, it is positioned between the side frame and the lid when viewed from above. That is, the bent portion 24 is formed in a substantially annular shape inside the side frame 21D (on the sealing space 1a side) and outside the inner peripheral portion 22Db.

The light source device 1D according to the present embodiment can be manufactured according to the manufacturing method of the light source devices 1 to 1C according to the first to fourth embodiments according to the material of the sealing material 7D.

As described above, the light source device 1D according to the present embodiment includes the base body 3D having the supporting portion 10 and the frame body 20D, the lid body 4 including the optical element 4a, the lid body 4 and the base body, as in the first embodiment. A semiconductor laser element 2 is arranged in a sealing space 1a formed by 3D and a sealing material 7D. A lid 4 is fixed in close contact with a frame 20D via the sealing material 7D. , the lid 4 and the frame 20D are joined via a joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7D.

Thus, the light source device 1D according to the present embodiment has the same effect as the light source device 1 according to the first embodiment. Specifically, the lid 4 including the optical element 4a can be actively aligned while ensuring the airtightness of the package composed of the lid 4 and the base 3D. There is an effect such as realizing a light source device 1D having a package structure that is compatible with the above.

In light source device 1D according to the present embodiment, frame 20D includes side frame 21D and inner frame 22D positioned inside side frame 21D. It is fixed to the body 22D.

With this configuration, in the metal frame 20D, a bent portion can be provided by the side frame 21D and the inner frame 22D. In this embodiment, the bent portion 24 is provided in the inner frame 22D. Thereby, the stress due to the difference in thermal expansion coefficient between the lid 4 and the frame 20D can be relaxed.

Further, in the light source device 1D according to the present embodiment, the frame 20D has flexibility in a direction crossing the direction in which the lid 4 covers the frame 20D.

When the lid 4 including the optical element 4a is joined to the metal frame 20D, stress such as thermal strain is generated. occurs in Therefore, by configuring the frame body 20D so as to have flexibility in a direction intersecting the direction in which the frame body 20D is covered with the lid body 4, stress such as thermal strain can be alleviated.

In the present embodiment, a bent portion 24 is provided in the inner frame 22D, and the bent portion 24 allows the frame 20D to have flexibility. That is, the bent portion 24 functions as a stress absorbing structure. In addition, by reducing the thickness of the inner frame 22D forming the bent portion 24, the flexibility of the bent portion 24 can be increased.

In addition, in the light source device 1D according to the present embodiment, the inner frame 22D has an outer peripheral portion 22Da and an inner peripheral portion 22Db located inside the outer peripheral portion 22Da, and the lid 4 has an inner peripheral portion 22Db. is fixed to

With this configuration, it is possible to prevent an external object from hitting the optical element 4a when the light source device 1D is moved, so that it is possible to prevent damage to the optical element 4a.

As in the light source device 1E shown in FIG. 9, the lid 4A in the second embodiment may also be used in place of the lid 4 in the present embodiment.

(Embodiment 6)
Next, a light source device 1F according to Embodiment 6 will be described with reference to FIG. FIG. 10 is a cross-sectional view of a light source device 1F according to Embodiment 6. FIG.

The light source device 1F according to the present embodiment differs from the light source device 1 according to the first embodiment in the shape of the frame 20F and the shape of the lid 4F in the base 3F.

The frame 20F is a frame-shaped member whose top view shape is substantially rectangular. The frame 20</b>F is provided on the support section 10 . Specifically, the frame 20</b>F is provided on the upper surface of the support portion 10 . The frame 20F is fixed to the support portion 10 . The frame 20F is made of a metal material such as copper or aluminum.

A concave portion 23 is provided on the upper surface of the frame 20F. The recess 23 is a groove formed over the entire circumference of the frame 20F. Therefore, the recess 23 is formed in an annular shape. As an example, the top view shape of the recess 23 is a rectangular frame shape. In addition, although the bottom surface of the recess 23 is a curved surface in the present embodiment, it may be a flat surface.

The recess 23 is provided in a portion of the frame 20F facing the lid 4F. Specifically, the recess 23 is provided in a portion of the frame 20F that faces the outer edge lid 32 of the lid 4F. A concave portion of the concave portion 23 is a cavity between the frame 20F and the lid 4F.

A sealing material 7</b>F is arranged in the recess 23 . The sealing material 7</b>F arranged in the recess 23 exists over the entire circumference of the recess 23 . Therefore, the sealing material 7F is arranged in an annular shape. Specifically, the top view shape of the sealing material 7F is a rectangular frame shape.

The lid 4F is arranged on the frame 20F so as to close the opening of the frame 20F. The lid 4F is fixed to the frame 20F. Specifically, the lid 4F is fixed to the upper end of the frame 20F.

In the present embodiment, the lid 4</b>F includes a lid body 31 including the optical element 4 a and an outer edge lid 32 located outside the lid body 31 . The outer edge lid 32 of the lid 4F is supported by the frame 20F. Specifically, the outer edge lid 32 is fixed in close contact with the frame 20F via the sealing material 7F. Further, the lid body main body 31 and the outer edge portion lid body 32 are joined by a joining material 33 . As an example, the lid main body 31 is made of glass, and the outer edge lid 32 is made of a metal material such as copper or aluminum. In this case, low-melting-point glass may be used as the bonding material 33 . The outer edge lid 32 has an outer peripheral portion 32Da outside the lid main body 31 (including the fixing portion) in top view, and an inner peripheral portion 32Db positioned inside the outer peripheral portion 32Da. Therefore, there is an opening through which the laser beam is transmitted inside the inner peripheral portion 32Db. Specifically, the lid main body 31 is fixed to the inner peripheral portion 32Db.

The lid body 31 has the same configuration as the lid 4 in the first embodiment. Therefore, the lid main body 31 has a flat plate portion 30a and a plurality of convex portions 30b provided on the flat plate portion 30a. Also, the plurality of convex portions 30b are provided on the outer surface of the flat plate portion 30a.

A gap is provided between the inner surface of the frame 20F and the surface of the outer edge lid 32 facing the inner surface of the frame 20F. Specifically, the outer edge cover 32 has a bent portion 34, and a gap is provided between the bent portion 34 and the frame 20F.

The cross-sectional shape of the bent portion 34 is, for example, a U-shaped bent shape. Since the lid 4F has the bent portion 34 in this manner, the lid 4F has flexibility in a direction (horizontal direction) crossing the direction in which the lid 4F covers the frame 20F. That is, the lid 4F has flexibility in the direction parallel to the inner surface of the flat plate portion 30a of the lid body 31 (the direction parallel to the upper surface of the support portion 10).

In the lid body 4F, the maximum height of the convex surface of the convex portion 30b, which is the light emitting surface of the optical element 4a of the lid body 31, is preferably lower than the height of the upper surface of the outer edge lid body 32. Thereby, it is possible to suppress damage to the optical element 4a due to collision with an external object.

The lid 4F is arranged on the frame 20F so as to close the opening of the frame 20F. Specifically, the lid 4F is fixed to the frame 20F so that the outer edge lid 32 is placed on the upper surface of the frame 20F.

Also in the present embodiment, the lid 4F is fixed in close contact with the frame 20F via the sealing material 7F. That is, the lid 32 of the outer edge of the lid 4F and the frame 20F are fixed with the sealing material 7F interposed between the lid 4F and the frame 20F.

The sealing material 7F is preferably made of a material that does not contain silicone. As the sealing material 7F, a sheet material made of EVOH or indium may be used as in the first embodiment, or a liquid metal made of indium gallium may be used as in the third embodiment. . At this time, the sealing material 7F spreads in the lateral direction, but since the frame main body 20F is provided with the recess 20Fa, the sealing material 7F spreading toward the inside of the frame 20F enters the recess 20Fa. Become. Thereby, it is possible to prevent the sealing material 7F from reaching the support portion 10 . That is, the recess 20Fa is a release recess for releasing the sealing material 7F. Also, as in the fourth embodiment, a ring wire such as a metal wire containing indium may be used.

By bringing the frame 20F and the outer peripheral portion 32Da of the lid 4F into close contact with each other through the sealing material 7F, airtightness in the sealed space 1a is maintained. That is, a sealed space 1a hermetically sealed is formed by the base 3F, the lid 4F, and the sealing material 7F. In this case, by using a soft material such as EVOH as the material of the sealing material 7F and providing the bent portion 34 in the outer edge lid 32, the stress generated in the lid 4F is relieved and the lid main body 31 and the outer edge are separated. The airtightness of the low-melting-point glass portion, which is the joint with the lid 32, can be maintained. That is, by using low-melting glass as the bonding material 33 for bonding the lid main body 31 and the outer edge lid 32 , the lid body 31 and the outer edge lid 32 are bonded together by using a metal material or a ceramic material as the bonding material 33 . The stress generated in the lid body 4F can be relaxed as compared with the case of fixing with a metal material or a ceramic material.

Also in the present embodiment, the lid body 4F and the frame body 20F are joined by the joining material 8. As shown in FIG. Specifically, the lid body 4F and the frame body 20F are bonded via the bonding material 8 on the side opposite to the sealing space 1a side of the sealing material 7F. More specifically, the joint material 8 joins the frame 20F and the end of the outer peripheral portion 32Da.

Here, the bent portion 34 of the outer edge lid 32 is formed in the outer peripheral portion 32Da and is formed inside the position where the outer edge lid 32 and the frame 20F are fixed by the sealing material 7F. In other words, it is located between the frame body 20F and the lid body 31 in top view. That is, the bent portion 24 is located inside the position where the outer edge lid 32 and the frame 20F are fixed by the sealing material 7F (closer to the sealing space 1a) and where the lid main body 31 and the outer edge lid 32 are joined. It is formed in a substantially annular shape outside the position where it is joined by the material 33 .

Next, a method for manufacturing the light source device 1F according to this embodiment will be described with reference to FIG. 11A and 11B are diagrams for explaining the manufacturing method of the light source device 1F according to the sixth embodiment. The light source device 1F according to the present embodiment can be manufactured according to the manufacturing method of the light source device 1 according to the first embodiment.

First, as shown in (a) of FIG. 11, a base 3F having a support portion 10 and a frame 20F is prepared. Next, as shown in FIG. 11(b), the semiconductor laser element 2 and the mirror 5 are mounted on the upper surface of the support portion 10 of the base 3F. Incidentally, the semiconductor laser element 2 is mounted on the supporting portion 10 via the submount 6 .

Next, as shown in (c) of FIG. 11, the sealing material 7F is arranged in the concave portion 23 of the frame 20F of the base 3F. At this time, the sealing material 7F is arranged in the recess 23 so that the upper part of the sealing material 7F protrudes from the recess 23. Next, as shown in FIG.

Next, as shown in FIG. 11D, a lid body 4F is prepared in advance by bonding the lid body 31 and the outer edge lid body 32 with a bonding material 33 made of low-melting glass. , the lid 4F is placed on the frame 20F on which the sealing material 7F is placed. Specifically, the lid 4F is arranged on the frame 20F so as to cover the opening of the frame 20F. At this time, the lid body 4F is arranged so that the outer edge lid body 32 is placed on the sealing material 7F. As a result, the sealing material 7F is interposed between the lid body 4F and the frame body 20F, so that the internal space surrounded by the base body 3F and the lid body 4F becomes the hermetically sealed space 1a. Become.

Next, as shown in (e) of FIG. 11, the lid 4F placed on the frame 20F is aligned with the sealing material 7F interposed therebetween. That is, the lid 4F is aligned with the internal space surrounded by the base 3F and the lid 4F being the sealed space 1a. In the present embodiment as well, the lid 4F is aligned by active alignment with the internal space surrounded by the base 3F and the lid 4F being the sealed space 1a. At this time, the sealing material 7F spreads in the lateral direction, but since the frame main body 20F is provided with the concave portion 22Fa, the sealing material 7F spreads toward the inside of the frame 20F as shown in FIG. 11(f). The stopper material 7F enters into the concave portion 20Fa. Thereby, it is possible to prevent the sealing material 7F from reaching the support portion 10 . That is, the recess 20Fa is a release recess for releasing the melted sealing material 7F.

Next, as shown in (f) of FIG. 11 , a bonding material 8 is applied and cured to bond the lid 4F and the frame 20F with the bonding material 8 . As a result, the lid 4F and the frame 20F are fixed with the bonding material 8. As shown in FIG. This completes the light source device 1F.

As described above, the light source device 1F according to the present embodiment includes a base body 3F having a support portion 10 and a frame body 20F, a lid body 4F including an optical element 4a, a lid body 4F and a base body, as in the first embodiment. 3F and a semiconductor laser element 2 arranged in a sealing space 1a formed by a sealing material 7F. , the lid 4F and the frame 20F are joined via a joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7F.

Thus, the light source device 1F according to the present embodiment has the same effect as the light source device 1 according to the first embodiment. Specifically, the lid 4F including the optical element 4a can be actively aligned while ensuring the airtightness of the package composed of the lid 4F and the base 3F. There is an effect such as realizing a light source device 1F having a package structure capable of achieving both.

Further, in the light source device 1F according to the present embodiment, the lid body 4F includes a lid body body 31 including the optical element 4a and an outer edge lid body 32 positioned outside the lid body body 31. The body 32 is fixed to the frame 20F.

With this configuration, by bonding the lid body 31 including the optical element 4a and the outer edge lid 32 with an adhesive such as low-melting glass, the lid body 31 and the outer edge lid 32 can be firmly bonded. Active alignment of the lid body 4F can be performed in this state.

Further, the light source device 1F according to the present embodiment has a gap between the inner side surface of the frame 20F and the surface of the outer edge lid 32 of the lid 4F facing the inner side of the frame 20F.

With this configuration, a margin for position adjustment can be provided between the frame 20F and the lid 4F when the lid 4F is aligned by active alignment. In other words, the gap between the frame 20F and the outer edge lid 32 can be used as an adjustment gap when performing active alignment of the lid 4F.

In addition, in the light source device 1F according to the present embodiment, the lid 4F has flexibility in a direction crossing the direction in which the lid 4F covers the frame 20F.

When the lid 4F including the optical element 4a is joined to the metal frame 20F, stress such as thermal strain is generated. occurs in Therefore, by configuring the frame body 20F so as to have flexibility in a direction crossing the direction in which the frame body 20F is covered with the lid body 4F, stress such as thermal strain can be alleviated.

In the present embodiment, the outer edge portion lid 32 of the lid 4F has a bent portion 34, and the bent portion 34 allows the lid 4F to have flexibility. That is, the bent portion 34 functions as a stress absorbing structure. In addition, by reducing the thickness of the outer edge lid 32 forming the bent portion 34, the flexibility of the bent portion 34 can be increased.

In addition, since the outer edge lid 32 of the lid 4F has the bent portion 34, the stress due to the difference in thermal expansion coefficient between the lid 4F and the frame 20D can be relieved.

A lid 4G may be used instead of the lid 4F as in the light source device 1G shown in FIG. In the lid main body 31G of the lid 4G in this modified example, the convex portion 30b constituting the optical element 4a is provided on the inner surface of the flat plate portion 30a. Therefore, the convex portion 30b in the optical element 4a has a convex surface that protrudes toward the sealing space 1a side.

(Modification)
Although the light source device according to the present disclosure has been described above based on Embodiments 1 to 6, the present disclosure is not limited to Embodiments 1 to 6 above.

For example, in Embodiment 1, the upper end of the screen portion 22 of the frame 20 of the base 3 is positioned above the upper surface of the flat plate portion 30a of the lid 4, but the present invention is not limited to this. Specifically, as in the light source device 1H shown in FIG. 13, even if the upper end portion of the screen portion 22H of the frame 20H in the base 3H is positioned below the upper surface of the flat plate portion 30a of the lid 4. good. In this case, as shown in FIG. 13, the bonding material 8 may be formed so as to ride on the screen portion 22H.

Further, in Embodiments 1 to 6 above, the optical element 4a (optical element) in the lids 4, 4A and 4F is a lens, but it is not limited to this. For example, the optical element 4a may be a deflecting element such as a mirror or a prism having a concave or flat inclined surface. In other words, the optical element 4a is not particularly limited as long as it is a light distribution control element capable of controlling the light distribution of the laser light emitted from the semiconductor laser element 2. FIG.

Further, in the third embodiment, the cavity between the frame 20 and the lid 4 (that is, the portion where the sealing material 7B is arranged) is the concave portion of the recess 23 provided in the frame 20. However, it is not limited to this. For example, the cavity between the frame 20 and the lid 4 may be a recessed portion of a recess provided in the lid 4 . In other words, the recess forming the cavity between the frame 20 and the lid 4 may be provided in either the frame 20 or the lid 4, or may be provided in both the frame 20 and the lid 4. may have been Note that this may also be applied to the fourth to sixth embodiments.

Further, in Embodiments 5 and 6 described above, the bent portion 34 is provided in order to relieve the stress due to the difference in the coefficient of thermal expansion between the lid 4F and the frame 20D, but the present invention is not limited to this. For example, stress relief structures such as bellows may be provided to relieve stress.

In addition, forms obtained by applying various modifications that a person skilled in the art can think of for each embodiment and modifications, and components and functions in each embodiment and modifications arbitrarily within the scope of the present disclosure The present disclosure also includes forms realized by combining.

The light source device according to the present disclosure is used for products in various fields such as image display devices such as projectors, automotive parts such as in-vehicle headlamps, lighting fixtures such as spotlights, or industrial equipment such as laser processing devices. Useful as a light source.

Reference Signs List 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H light source device 1a sealing space 2 semiconductor laser element 2a lead pin 3, 3D, 3F, 3H substrate 4, 4A, 4F, 4G lid 4a optical element 5 Mirror 6 Submount 7, 7S, 7B, 7C, 7D, 7F Sealing material 8 Bonding material 10 Supporting part 20, 20D, 20F, 20H Frame 21 Frame main body 21a, 22Dc, 20Fa Recess 21D Side frame 22, 22H Screen portion 22D Internal frame 22Da Outer peripheral portion 22Db Inner peripheral portion 23 Concave portion 24 Bent portion 30a Flat plate portion 30b Protruding portion 31, 31G Lid body main body 32 Outer edge lid 33 Joining material 34 Bent portion

Claims (26)

a base body having a support portion and a frame provided on the support portion;
a lid body fixed in close contact with the frame body via a sealing material;
a nitride-based semiconductor laser element disposed in a sealed space formed by the lid, the base, and the sealing material;
the lid includes an optical element that imparts an optical effect to laser light emitted from the nitride semiconductor laser element,
The lid body and the frame body are joined to each other via a joining material on the side opposite to the sealing space side of the sealing material,
Light source device. The bonding material has a bonding strength higher than that of the sealing material,
The light source device according to claim 1. A light incident surface of the optical element on which the laser light is incident forms part of the sealed space.
The light source device according to claim 1 or 2. wherein the optical element is a lens;
The light source device according to any one of claims 1 to 3. the lens has a convex surface protruding toward the sealing space;
The light source device according to claim 4. The lower end of the lid is closer to the support than the upper end of the frame,
The light source device according to any one of claims 1 to 5. With the support portion as a reference, the height of the light emitting surface of the optical element from which the laser beam is emitted is lower than the height of the upper surface of the frame.
The light source device according to any one of claims 1-6. The sealing material is made of a material that does not contain silicone,
The light source device according to any one of claims 1-7. The sealing material is composed of an ethylene-vinyl alcohol copolymer,
The light source device according to any one of claims 1-7. The sealing material is composed of a liquid metal,
The light source device according to any one of claims 1-7. wherein the encapsulant is a circular wire;
The light source device according to any one of claims 1-7. The annular wire is made of indium,
The light source device according to claim 11. Having a cavity between the frame and the lid,
the encapsulant is disposed within the cavity;
The light source device according to any one of claims 1-12. The frame has a recess in a portion facing the lid,
The cavity is a recessed portion of the recess,
The light source device according to claim 13. The lid includes a lid body including the optical element and an outer edge lid located outside the lid body,
The outer edge cover is supported by the frame,
The light source device according to any one of claims 1-14. A gap is provided between the inner surface of the frame and a surface of the outer edge lid that faces the inner surface.
The light source device according to claim 15. The outer edge portion lid has an outer peripheral portion and an inner peripheral portion located inside the outer peripheral portion,
The lid body is fixed to the inner periphery,
The frame is fixed to the outer peripheral portion,
17. The light source device according to claim 15 or 16. The outer peripheral portion has a bent portion inside a position where the frame is fixed to the outer peripheral portion,
The light source device according to claim 17. The frame includes a side frame and an inner frame positioned inside the side frame,
The lid is supported by the inner frame,
The light source device according to any one of claims 1-13. The inner frame has an outer peripheral portion and an inner peripheral portion located inside the outer peripheral portion,
The lid is fixed to the inner periphery,
The side frame is fixed to the outer peripheral portion,
The light source device according to claim 19. The outer peripheral portion has a bent portion inside a position where the side frame is fixed to the outer peripheral portion,
The light source device according to claim 20. At least one of the frame and the lid has flexibility in a direction intersecting a direction in which the lid covers the frame,
The light source device according to any one of claims 1-21. The bonding material is made of resin,
The light source device according to any one of claims 1-22. The resin is an epoxy resin,
24. The light source device according to claim 23. a plurality of the nitride-based semiconductor laser elements are arranged in the sealing space,
A plurality of the optical elements are provided for each of the plurality of nitride semiconductor laser elements,
The light source device according to any one of claims 1-24. a mirror for reflecting laser light emitted from the nitride-based semiconductor laser element to enter the optical element;
The nitride-based semiconductor laser element is mounted parallel to the upper surface of the support,
The light source device according to any one of claims 1-25.

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