CN203733832U - Led packaging structure - Google Patents
Led packaging structure Download PDFInfo
- Publication number
- CN203733832U CN203733832U CN201320865978.5U CN201320865978U CN203733832U CN 203733832 U CN203733832 U CN 203733832U CN 201320865978 U CN201320865978 U CN 201320865978U CN 203733832 U CN203733832 U CN 203733832U
- Authority
- CN
- China
- Prior art keywords
- lens
- storage tank
- encapsulating structure
- led
- led encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 6
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000002844 melting Methods 0.000 claims abstract description 16
- 230000008018 melting Effects 0.000 claims abstract description 16
- 238000003860 storage Methods 0.000 claims description 40
- 238000000465 moulding Methods 0.000 claims description 17
- 239000012530 fluid Substances 0.000 claims description 15
- 239000000565 sealant Substances 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 239000007767 bonding agent Substances 0.000 claims description 8
- 239000006071 cream Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 230000006978 adaptation Effects 0.000 claims description 5
- 210000002421 cell wall Anatomy 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 10
- 239000000741 silica gel Substances 0.000 abstract description 8
- 229910002027 silica gel Inorganic materials 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 230000005494 condensation Effects 0.000 abstract 1
- 238000009833 condensation Methods 0.000 abstract 1
- 239000012943 hotmelt Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 206010023126 Jaundice Diseases 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008635 plant growth Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides an LED packaging structure which comprises a substrate, an LED chip and a lens. The substrate is provided with an accommodating tank which is internally provided with an anode board and a cathode board that are communicated with outside. The LED chip is arranged in the accommodating tank and is electrically connected with the anode board and the cathode board. The lens covers the opening of the accommodating tank. The lens is a planoconvex lens and is a sphere with defects. The lens has a bottom surface and a curved surface, wherein the bottom surface is a plane. The circumference of the opening of the accommodating tank is provided with a step. The step is composed of a horizontal step surface and a step wall which is vertical to the step surface. The bottom surface of the lens is connected with the step surface through jointing. A clearance between the curved surface and the step wall of the lens is provided with a closed member which is formed through cooling condensation forming of hotmelt material after melting. The closed member is adhered with the curved surface and the step wall of the lens. According to the LED packaging structure, through arranging the closed member, firm connection and no disengagement between the lens and the substrate are realized, and simultaneously a packaging function is performed. Furthermore no silica gel is required for packaging according to the LED packaging structure.
Description
Technical field
The utility model belongs to LED technical field, relates in particular to a kind of LED encapsulating structure.
Background technology
LED, as new generation of green light source, has the advantages such as light efficiency is high, life-span length, energy-saving and environmental protection, and it is widely used at numerous areas.For the LED chip of protection as light source, conventionally need to encapsulate it.LED encapsulating structure of the prior art is such: storage tank is set on substrate, and LED chip is placed in storage tank, and lens are covered on storage tank, and recycle silicon glue seals bonding to lens and substrate.When the LED chip of existing LED encapsulating structure is luminous, a part of light is incident upon on silica gel, silica gel by light long-term irradiation after easily jaundice, aging, embrittlement, destroyed the sealing of silica gel, shorten the useful life of LED encapsulating structure.
Especially, along with the development of LED technology, ultraviolet LED also starts to be widely used, such as for fields such as indoor and outdoor sterilization, backlight, UV printing, medical treatment, food and drink, plant growths.In the prior art, ultraviolet LED also adopts above-mentioned LED encapsulating structure to encapsulate, like this, silica gel by ultraviolet light long-term irradiation after especially easily jaundice, aging, embrittlement, destroy the sealing of fluid sealant, had a strong impact on the reliability of ultraviolet LED, shortened the useful life of LED encapsulating structure.
Utility model content
The purpose of this utility model is to overcome the defect of prior art, provides that a kind of bright dipping is effective, the LED encapsulating structure of long service life, and this LED encapsulating structure is without adopting silica gel to encapsulate.
The utility model is to realize like this, a kind of LED encapsulating structure, comprise substrate, LED chip and lens, described substrate is provided with a storage tank, is provided with and is communicated to outside positive plate and negative plate in described storage tank, described LED chip is located in described storage tank and is electrically connected to described positive plate and described negative plate, described lens are covered on the notch of described storage tank, and described lens are planoconvex spotlight, and it is segment shape, described lens have bottom surface and curved surface, and described bottom surface is plane; Be provided with the step with the bottom surface adaptation of described lens the notch ring week of described storage tank, described step consists of the step surface of level and the step wall vertical with described step surface; The bottom surface of described lens and the laminating of described step surface; Gap between the curved surface of described lens and described step wall is provided with the obturator by cooled and solidified moulding after the melting of heat molten type material, and the curved surface of described obturator and described lens and described step wall are bonding.
Further, between the bottom surface of described lens and the step surface of described step, be folded with bonding agent, the step surface of bonding agent and described step is bonding described in the underrun of described lens.
Further, between the step wall top edge of the curved surface of described lens and described step, be provided with fluid sealant, described fluid sealant covers described obturator.
Preferably, described obturator be tin cream by the mode melting of Reflow Soldering after the tin metal body of cooled and solidified moulding.
Particularly, the notch ring week around described storage tank on described substrate is provided with becket, and the internal diameter of described becket is greater than the notch of described storage tank, and the madial wall of described becket forms the step wall of described step.
Further, the lens that described lens are quartzy material.
Further, described LED chip is ultraviolet LED chip.
Especially, described negative plate is located at described storage tank bottom, and described LED chip is located on described negative plate.
Particularly, described negative plate surface-coated has reflector layer.
Further, the cell wall of described storage tank is coated with reflector layer.
LED encapsulating structure provided by the utility model has following technique effect:
The utility model is the step with the bottom surface adaptation of lens by the notch ring week setting at storage tank, the obturator of cooled and solidified moulding after the curved surface of lens and the gap between step wall arrange by the melting of heat molten type material again, form one and lens card can be fixed in to the retaining structure in step, make lens can firmly be connected with substrate and not come off, its long service life, meanwhile, obturator can play the effect of packaged LED, water proof and dust proof again.In addition, obturator by the melting of heat molten type material after cooled and solidified moulding, its moulding process is simply easy, can effectively enhance productivity, and reduces manufacturing cost.
Accompanying drawing explanation
Fig. 1 is the cutaway view that in the utility model embodiment, LED encapsulating structure is provided with fluid sealant;
Fig. 2 is the schematic diagram of lens in the utility model embodiment;
Fig. 3 is that in the utility model embodiment, substrate does not cover lensed cutaway view;
Fig. 4 is the cutaway view that in the utility model embodiment, LED encapsulating structure is not established obturator;
Fig. 5 is the cutaway view that in the utility model embodiment, LED encapsulating structure is not provided with fluid sealant.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Referring to Fig. 1 or Fig. 5, the utility model embodiment provides a kind of LED encapsulating structure, comprise substrate 1, LED chip 2 and lens 3, described substrate 1 is provided with a storage tank 11, in described storage tank 11, be provided with and be communicated to outside positive plate 4 and negative plate 5, described LED chip 2 is located in described storage tank 11 and is electrically connected to described positive plate 4 and described negative plate 5, described lens 3 are covered on the notch of described storage tank 11, described lens 3 are planoconvex spotlight, it is segment shape, referring to Fig. 2, described lens 3 have bottom surface 31 and curved surface 32, and described bottom surface 31 is plane; Referring to Fig. 3, be provided with the step 12 with bottom surface 31 adaptations of described lens 3 the notch ring week of described storage tank 11, described step 12 consists of the step surface 121 of level and the step wall 122 vertical with described step surface 121; The bottom surface 31 of described lens 3 and described step surface 121 laminatings; Continuation is referring to Fig. 1 and Fig. 5, and curved surface 32 and the gap between described step wall 122 of described lens 3 are provided with the obturator 6 by cooled and solidified moulding after the melting of heat molten type material, and described obturator 6 is bonding with curved surface 32 and the described step wall 122 of described lens 3.
Lens 3 are covered on the notch of storage tank 11, form the storage tank 11 of a sealing, and LED chip 2 is positioned at the storage tank 11 of this sealing, can be effectively protected, and avoids being subject to extraneous interference, also play the effect of water proof and dust proof simultaneously.After lens 3 are covered on the notch of storage tank 11, between the curved surface 32 of lens and step wall 122, there is gap, obturator 6 by cooled and solidified moulding after the melting of heat molten type material is set in this gap, the obturator 6 of cooled and solidified moulding is bonding with curved surface 32 and the step wall 122 of lens 3, like this, in fact obturator 6 has formed a retaining structure, and lens 3 are arranged in step 12, and lens 3 can be fixedly connected with substrate 1.In addition, positive plate 4 is electrically connected to the circuit that negative plate 5 causes extraneous rear language outside, but positive plate 4 is not limited to shown in accompanying drawing with the form that arranges of negative plate 5.
The utility model is the step with the bottom surface adaptation of lens by the notch ring week setting at storage tank, the obturator of cooled and solidified moulding after the curved surface of lens and the gap between step wall arrange by the melting of heat molten type material again, form one and lens card can be fixed in to the retaining structure in step, make lens can firmly be connected with substrate and not come off, its long service life, meanwhile, obturator can play the effect of packaged LED, water proof and dust proof again.In addition, obturator by the melting of heat molten type material after cooled and solidified moulding, its moulding process is simply easy, can effectively enhance productivity, and reduces manufacturing cost.
In conjunction with Fig. 4, in order to prevent the utility model lens play Shang Xia 3 when the curved surface 32 of lens 3 and the gap between step wall 122 arrange obturator 6, bottom surface 31 and the gap between step surface 121 by lens 3 when preventing that heat molten type material is melt into liquid state flow in storage tank 11, the utility model embodiment is folded with bonding agent 7 between the bottom surface 31 of described lens 3 and the step surface 121 of described step 12, and the bottom surface 31 of described lens 3 is bonding with the step surface 121 of described step 12 by described bonding agent 7.
Referring to Fig. 1, as a kind of optional execution mode of the present utility model, between step wall 122 top edges of the curved surface 32 of described lens 3 and described step 12, can be provided with fluid sealant 8, described fluid sealant 8 covers described obturator 6.The LED encapsulating structure better tightness that fluid sealant 8 can make the utility model embodiment provide, further strengthens its sealing effectiveness.Fluid sealant 8 belongs to can select technical characterictic, and the utility model also can not arrange fluid sealant 8 according to specific needs.
Referring to Fig. 5, as a kind of preferred implementation of the present utility model, described obturator 6 for tin cream by the mode melting of Reflow Soldering after the tin metal body of cooled and solidified moulding.In other words, described heat molten type material is tin cream, and described obturator 6 be by tin cream by the mode melting of Reflow Soldering after the tin metal body of cooled and solidified moulding.Tin cream has good welding performance, and it is easy to weld melting, the metal surface smooth and beautiful appearance after cooling forming, and also adhesive effect is good, is highly suitable for the utility model.On the other hand, the technology mode of Reflow Soldering is easy to control temperature, and welding process can be avoided oxidation, and process costs is low, and the density metal after melt molding is more even.
Referring to Fig. 3, the notch ring week around described storage tank 11 on described substrate 1 is provided with becket 9, and the internal diameter of described becket 9 is greater than the notch of described storage tank 11, and the madial wall of described becket 9 forms the step wall 122 of described step 12.The mode that the utility model embodiment arranges by split, utilizes becket 9 and the upper surface of substrate 1 to form step 12, and it is simple in structure, is easy to processing and handling.Certainly, also can use the cycle object alternative metals ring 9 of other materials, or, in the notch ring week of storage tank 11, directly process and offer step 12.
In the utility model embodiment, the lens that described lens 3 are quartzy material.Quartz has the advantages such as light transmittance is high, hardness strong, be difficult for scratching, and light transmittance can reach 94%, and it is highly suitable for the lens material as the utility model embodiment.Yet the material of lens 3 is not limited in quartz, it also can be by other materials moulding.
In the utility model embodiment, described LED chip 2 is ultraviolet LED chip.The utility model embodiment has adopted ultraviolet LED chip, and from ultraviolet physical property, it can be used for indoor and outdoor sterilization, backlight, UV printing, medical treatment, food and drink, plant growth etc.On the other hand, because the utility model is without adopting silica gel to encapsulate, therefore can there is not the problem because silica gel turns to be yellow, aging, embrittlement causes LED encapsulating structure to lose efficacy.
As a kind of execution mode of the present utility model, described negative plate 5 is located at described storage tank 11 bottoms, and described LED chip 2 is located on described negative plate 5.The utility model can adopt the mode of adhesive or eutectic weldering that LED chip 2 is located on negative plate 5.LED chip 2 also can be located on positive plate 4, and it is not limited to be arranged on negative plate 5.
Particularly, described negative plate 5 surfaces can be coated with reflector layer.If have reflector layer in negative plate 5 surface-coated, the light that can utilize more fully LED chip 2 to launch, by light retroeflection to lens 3.Certainly, also can in negative plate 5 surface-coated, not have reflector layer, it is determined as the case may be.
As a kind of optimal way of the present utility model, the cell wall of described storage tank 11 is coated with reflector layer.Like this, the utility model can the comprehensive light that utilizes more fully LED chip 2 to launch.
The utility model is adopted and is manufactured with the following method above-mentioned LED encapsulating structure, and it comprises the following steps:
Described LED chip 2 is located in the storage tank 11 of described substrate 1;
The pin of described LED chip 2 is electrically connected to (in the utility model embodiment, the pin of LED chip 2 is electrically connected to positive plate 4 by wire 21) with described positive plate 4 and described negative plate 5;
On the step surface 121 of described step 12, apply bonding agent 7(referring to Fig. 2);
Described lens 3 are covered on the notch of described storage tank 11, and bonding agent 7 is adhered on the step surface 121 of described step 12 described in the underrun of described lens 3;
Heat molten type material is injected in curved surface 32 and the gap between step wall 122 at described lens, and by its melting, treat that its cooled and solidified forms obturator 6(in the utility model embodiment, tin cream is injected in curved surface 32 and the gap between step wall 122 at described lens, by the mode melting tin cream of Reflow Soldering, treat that its cooled and solidified forms solid-state tin metal);
Remove scaling powder and other waste material foreign material;
Between the curved surface 32 of described lens and step wall 122 top edges of described step 12, fluid sealant is set, described fluid sealant 8 covers the solid-state tin metal of described obturator 6().
Above-mentioned steps can be adjusted and select to the process that the utility model embodiment provides as required, for example, when LED encapsulating structure is when arranging fluid sealant 8, can omit the step described in the last item, the enforcement of not selecting this step.
The foregoing is only the utility model preferred embodiment; its structure is not limited to the above-mentioned shape of enumerating; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. a LED encapsulating structure, comprise substrate, LED chip and lens, described substrate is provided with a storage tank, in described storage tank, be provided with and be communicated to outside positive plate and negative plate, described LED chip is located in described storage tank and is electrically connected to described positive plate and described negative plate, and described lens are covered on the notch of described storage tank, it is characterized in that: described lens are planoconvex spotlight, it is segment shape, and described lens have bottom surface and curved surface, and described bottom surface is plane; Be provided with the step with the bottom surface adaptation of described lens the notch ring week of described storage tank, described step consists of the step surface of level and the step wall vertical with described step surface; The bottom surface of described lens and the laminating of described step surface; Gap between the curved surface of described lens and described step wall is provided with the obturator by cooled and solidified moulding after the melting of heat molten type material, and the curved surface of described obturator and described lens and described step wall are bonding.
2. LED encapsulating structure as claimed in claim 1, is characterized in that: between the bottom surface of described lens and the step surface of described step, be folded with bonding agent, the step surface of bonding agent and described step is bonding described in the underrun of described lens.
3. LED encapsulating structure as claimed in claim 1, is characterized in that: between the step wall top edge of the curved surface of described lens and described step, be provided with fluid sealant, described fluid sealant covers described obturator.
4. LED encapsulating structure as claimed in claim 1, is characterized in that: described obturator be tin cream by the mode melting of Reflow Soldering after the tin metal body of cooled and solidified moulding.
5. LED encapsulating structure as claimed in claim 1, it is characterized in that: the notch ring week around described storage tank on described substrate is provided with becket, the internal diameter of described becket is greater than the notch of described storage tank, and the madial wall of described becket forms the step wall of described step.
6. the LED encapsulating structure as described in claim 1-5 any one, is characterized in that: the lens that described lens are quartzy material.
7. the LED encapsulating structure as described in claim 1-5 any one, is characterized in that: described LED chip is ultraviolet LED chip.
8. the LED encapsulating structure as described in claim 1-5 any one, is characterized in that: described negative plate is located at described storage tank bottom, and described LED chip is located on described negative plate.
9. LED encapsulating structure as claimed in claim 8, is characterized in that: described negative plate surface-coated has reflector layer.
10. the LED encapsulating structure as described in claim 1-5 any one, is characterized in that: the cell wall of described storage tank is coated with reflector layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320865978.5U CN203733832U (en) | 2013-12-25 | 2013-12-25 | Led packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320865978.5U CN203733832U (en) | 2013-12-25 | 2013-12-25 | Led packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733832U true CN203733832U (en) | 2014-07-23 |
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| CN201320865978.5U Expired - Lifetime CN203733832U (en) | 2013-12-25 | 2013-12-25 | Led packaging structure |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016119477A (en) * | 2014-12-23 | 2016-06-30 | エルジー イノテック カンパニー リミテッド | Light emitting device and lighting system |
| KR20160076606A (en) * | 2014-12-23 | 2016-07-01 | 엘지이노텍 주식회사 | Light emitting device |
| KR20160094213A (en) * | 2015-01-30 | 2016-08-09 | 엘지이노텍 주식회사 | Light emitting device package and lighiting device |
| CN105864685A (en) * | 2015-01-23 | 2016-08-17 | 欧司朗有限公司 | Illuminating module and illuminating device comprising same |
| CN107990925A (en) * | 2017-12-01 | 2018-05-04 | 合肥芯欣智能科技有限公司 | A kind of high leakproofness optical window |
| WO2018121103A1 (en) * | 2016-12-30 | 2018-07-05 | 江苏稳润光电有限公司 | Ultraviolet led packaging method |
| CN109103319A (en) * | 2018-08-21 | 2018-12-28 | 华中科技大学鄂州工业技术研究院 | A kind of deep ultraviolet LED encapsulation structure and its packaging method |
| CN111029335A (en) * | 2019-12-20 | 2020-04-17 | 圆融光电科技股份有限公司 | deep ultraviolet light-emitting device |
| WO2020102948A1 (en) * | 2018-11-19 | 2020-05-28 | 泉州三安半导体科技有限公司 | Package element of ultraviolet light source |
| CN111739990A (en) * | 2020-05-20 | 2020-10-02 | 天津中环电子照明科技有限公司 | UV LED packaging method and UV LED packaging |
| CN112652695A (en) * | 2021-01-14 | 2021-04-13 | 泉州三安半导体科技有限公司 | LED light-emitting device and manufacturing method thereof |
| CN112802945A (en) * | 2021-02-04 | 2021-05-14 | 梅州市展至电子科技有限公司 | Semiconductor ceramic packaging substrate and packaging process thereof |
| CN112864298A (en) * | 2021-01-08 | 2021-05-28 | 厦门市信达光电科技有限公司 | Small-angle LED packaging structure and preparation method thereof |
| CN113113524A (en) * | 2021-03-30 | 2021-07-13 | 佛山市国星光电股份有限公司 | Deep ultraviolet LED device and manufacturing method thereof |
| CN113302757A (en) * | 2021-03-03 | 2021-08-24 | 泉州三安半导体科技有限公司 | LED packaging device and preparation method thereof |
| WO2022259889A1 (en) * | 2021-06-10 | 2022-12-15 | ヌヴォトンテクノロジージャパン株式会社 | Light source device |
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2013
- 2013-12-25 CN CN201320865978.5U patent/CN203733832U/en not_active Expired - Lifetime
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016119477A (en) * | 2014-12-23 | 2016-06-30 | エルジー イノテック カンパニー リミテッド | Light emitting device and lighting system |
| KR20160076606A (en) * | 2014-12-23 | 2016-07-01 | 엘지이노텍 주식회사 | Light emitting device |
| KR102282945B1 (en) * | 2014-12-23 | 2021-07-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Light emitting device |
| CN105864685A (en) * | 2015-01-23 | 2016-08-17 | 欧司朗有限公司 | Illuminating module and illuminating device comprising same |
| KR20160094213A (en) * | 2015-01-30 | 2016-08-09 | 엘지이노텍 주식회사 | Light emitting device package and lighiting device |
| KR102309671B1 (en) | 2015-01-30 | 2021-10-07 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Light emitting device package and lighiting device |
| WO2018121103A1 (en) * | 2016-12-30 | 2018-07-05 | 江苏稳润光电有限公司 | Ultraviolet led packaging method |
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| WO2020102948A1 (en) * | 2018-11-19 | 2020-05-28 | 泉州三安半导体科技有限公司 | Package element of ultraviolet light source |
| CN111029335A (en) * | 2019-12-20 | 2020-04-17 | 圆融光电科技股份有限公司 | deep ultraviolet light-emitting device |
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Effective date of registration: 20170103 Address after: 322000 Zhejiang city in Jinhua Province town of Yiwu City, Su Fuk Road No. 126 Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: Shenzhen Nanshan District City, Guangdong province 518000 White Pine Road Baiwang letter Industrial Park two District Sixth. Patentee before: Shenzhen Refond Optoelectronics Co.,Ltd. |
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