JP2022185157A - Packages for mounting electronic components, electronic devices and electronic modules - Google Patents

Abstract

An object of the present invention is to provide an electronic component mounting package with improved high frequency characteristics. An object of the present invention is to provide an electronic device and an electronic module having good high frequency characteristics. An electronic component mounting package includes a coaxial line (11) having a signal line (11p) and an outer conductor (11o), and a signal wiring (20) that bends from an extension direction of the coaxial line in a direction crossing the extension direction. ), and the signal wiring (20) includes a first portion (21), which is the end connected to one end of the signal line (11p), and the extending direction. and a third portion (23) located between the first portion (21) and the second portion (22), the width (L1) of the first portion is wider than the width (La1) of the signal line and the width (L11) of the second portion, and the edge of the third portion (23) on the outer peripheral side of the signal line is an outwardly convex curve. [Selection drawing] Fig. 3

Description

The present disclosure relates to an electronic component mounting package, an electronic device, and an electronic module.

Patent Document 1 discloses a TO (Transistor Outline)-CAN type semiconductor laser device. This device includes a structure in which a coaxial line and a microstrip line are connected.

Japanese Patent Application Laid-Open No. 2004-356233

Further improvement in high-frequency characteristics is desired in an electronic component mounting package having a structure in which a signal line of a coaxial line and a signal line of a microstrip substrate are connected.

An object of the present disclosure is to provide an electronic component mounting package with improved high frequency characteristics. A further object of the present disclosure is to provide an electronic device and an electronic module that have good high frequency characteristics.

The electronic component mounting package of the present disclosure is
a coaxial line having a signal line and an outer conductor;
a microstrip substrate having a signal wiring that bends from the extension direction of the coaxial line to a direction crossing the extension direction,
The signal wiring is
a first portion that is an end connected to one end of the signal line;
a second portion extending in a direction intersecting with the extension direction;
a third portion located between the first portion and the second portion;
has
the width of the first portion is wider than the width of the signal line and the width of the second portion;
An edge of the third portion on the outer peripheral side of the signal wiring is an outwardly convex curve.

an electronic device according to the present disclosure;
the electronic component mounting package;
an electronic component connected to the signal wiring;
Prepare.

An electronic module according to the present disclosure includes:
the electronic device described above;
a module substrate on which the electronic device is mounted;
Prepare.

According to the present disclosure, it is possible to provide an electronic component mounting package with improved high frequency characteristics. Furthermore, according to the present disclosure, it is possible to provide an electronic device and an electronic module having good high frequency characteristics.

1 is a plan view showing part of an electronic component mounting package according to Embodiment 1 of the present disclosure; FIG. FIG. 2 is a cross-sectional view taken along line AA of FIG. 1; FIG. 3 is a cross-sectional view of the electronic component mounting package taken along line BB of FIG. 2; FIG. 4 is a plan view for explaining a signal wiring pattern of a microstrip substrate; FIG. 4 is a plan view for explaining a signal wiring pattern of a microstrip substrate; FIG. 4 is a plan view for explaining a signal wiring pattern of a microstrip substrate; 7 is a graph showing simulation results of high-frequency characteristics of a plurality of signal wiring patterns of the embodiment and Comparative Example 1; FIG. 10 is a plan view showing the configuration of Comparative Example 1; 9 is a graph showing simulation results of reflection loss between the signal wiring pattern of Embodiment 1 and Comparative Example 2. FIG. 7 is a graph showing simulation results of insertion loss between the signal wiring pattern of Embodiment 1 and Comparative Example 2. FIG. FIG. 11 is a plan view showing a pattern of signal wiring in Comparative Example 2; FIG. 5 is a plan view showing part of an electronic component mounting package according to Embodiment 2 of the present disclosure; 1 is a partially broken side view showing an electronic device and an electronic module according to an embodiment of the present disclosure; FIG.

Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a plan view showing part of an electronic component mounting package according to Embodiment 1 of the present disclosure. FIG. 2 is a cross-sectional view taken along line AA of FIG. 3 is a cross-sectional view taken along line BB of FIG. 2. FIG. In FIG. 3, the joining members E1 and E2 are omitted.

In the following, each direction of the electronic component mounting package 1 is shown using three axial directions of XYZ orthogonal to each other. The Y direction is the direction in which the central axis Oa (FIG. 3) of the coaxial line 11 extends, the X direction is the direction parallel to the first main surface 20Na of the microstrip substrate 20N and orthogonal to the Y direction, and the Z direction is the first main surface 20Na. is the direction perpendicular to The Y direction corresponds to the extending direction of the coaxial line 11, the X direction corresponds to the direction crossing the Y direction, and the Z direction corresponds to the direction perpendicular to the microstrip substrate 20N. Further, the edge along the outside of the bent portion of the signal wiring is called the outer peripheral side, and the edge along the inside of the bent portion is called the inner peripheral side. Further, "outward" means the direction from the inner peripheral side to the outer peripheral side of the signal wiring 20 on the XY plane, and "inward" means the direction from the outer peripheral side to the inner peripheral side of the signal wiring 20 on the XY plane. means the direction to face.

The electronic component mounting package 1 of Embodiment 1 is a package in which an electronic element driven at a high frequency or an electronic element to which a high frequency signal is input or output is mounted. The electronic component mounting package 1 includes coaxial lines 11 and 12 and a microstrip substrate 20N. The coaxial lines 11, 12 include pin-shaped signal lines 11p, 12p and outer conductors 11o, 12o having cylindrical inner surfaces surrounding the signal lines 11p, 12p. The outer conductor 11 o is a conductor that surrounds the signal line 11 p in the radial direction of the signal line 11 p and means a conductor that shields the electric field component of the signal transmitted to the coaxial line 11 . The shape outside the inner surface of the cylinder is not particularly limited. The signal line 11p and the inner surface of the outer conductor 11o are coaxial, and an insulator such as glass or a dielectric is interposed between the signal line 11p and the outer conductor 11o. That is, the outer circumference of the signal line 11p and the inner surface of the outer conductor 11o are in contact with an insulator or dielectric. The same applies to the other signal line 12p and the outer conductor 12o. The microstrip substrate 20N has a signal wiring 20 located on the first main surface 20Na and a ground conductor 28 located on the second main surface 20Nb opposite to the first main surface 20Na.

The electronic component mounting package 1 further includes a base block 2 and a stage block 3 . The electronic component mounting package 1 is a TO-CAN type package, and the base block 2 is made of metal and may be called a stem. The stage block 3 is made of metal integrated with the base block 2 and may function as a heat sink. Electrode pins 61 a , 61 b and a ground pin 61 c ( FIG. 1 ) connected to other electronic components for monitoring the electronic component 71 may be fixed to the base block 2 . The electronic component mounting package 1 may include a cap 65 ( FIG. 13 ) that is joined to the base block 2 and covers the stage block 3 .

Coaxial lines 11 and 12 are located in base block 2 . The outer conductors 11 o and 12 o of the coaxial lines 11 and 12 may be integrated with the base block 2 . That is, in this embodiment, the base block 2 has two cylindrical inner surfaces of the outer conductors 11o and 12o. The central axes Oa and Ob (FIG. 3) of the coaxial lines 11 and 12 are substantially parallel to the first main surface 20Na of the microstrip substrate 20N and are located away from the first main surface 20Na in the Z direction (FIG. 2). ). The central axis Oa of the coaxial line 11 and the central axis Ob of the coaxial line 12 may be parallel.

The microstrip substrate 20N is mounted on the stage block 3. As shown in FIG. One end 21e of the signal wiring 20 faces one coaxial line 11 and is connected to the signal line 11p via a conductive joint member E1. The other end 24e of the signal wiring 20 faces the other coaxial line 12 and is connected to the signal line 12p via a conductive joint member E2.

The signal wiring 20 (or its signal path) bends in the X direction from the Y direction parallel to the axial direction of the coaxial line 11 from one end 21e to the other end 24e, and further extends from the X direction to the coaxial line 12. Bend in the -Y direction parallel to the axial direction. The signal wiring 20 has a dividing portion 20K in the middle, and two terminals of the electronic component 71 (FIG. 13) are electrically connected to one and the other of the dividing portion 20K, respectively. In the dividing portion 20K, a signal flows through the electronic component 71 so as to straddle the dividing portion 20K. The high-frequency characteristics of the signal wiring 20 when the electronic component 71 is mounted are proportional to the high-frequency characteristics of the signal wiring 20 when the divided portion 20K is filled with conductors without the electronic component 71 mounted. Below, the characteristics will be described for the case where the dividing portion 20K is filled with a conductor.

<Signal wiring pattern>
4 to 6 are plan views for explaining patterns of the signal wiring 20. FIG. In FIGS. 4 and 6, the tips of the coaxial lines 11 and 12 are indicated by phantom lines. The signal wiring 20 has a first portion 21 , a second portion 22 and a third portion 23 . The first portion 21 is the end connected to the coaxial line 11 . The second portion 22 extends in the X direction orthogonal to the extension direction (Y direction) of the coaxial line 11 . The third portion 23 is located between the first portion 21 and the second portion 22 . Further, the signal wiring 20 has a fourth portion 24 which is the end connected to the coaxial line 12 and a fifth portion 25 positioned between the fourth portion 24 and the second portion 22 . Next, configurations (A) to (H1) of each portion are listed. Here, the configuration is a concept including a shape, a size relationship, an arrangement relationship, or a plurality thereof.

(A) The width L1 of the first portion 21 is wider than the width La1 of the signal line 11p of the coaxial line 11 (see FIG. 4). The width of the signal lines 11p and 12p and the width of the signal wiring 20 mean the length in the direction along the XY plane and in the direction perpendicular to the traveling direction of the signal. For example, the width La1 of the signal line 11p of the coaxial line 11 may be the length in the direction along the XY plane and in the direction perpendicular to the axial direction of the signal line 11p. L1 may be the length in the direction along the XY plane and in the direction perpendicular to the axial direction of the signal line 11p. In this embodiment, since the signal line 11p has a columnar shape with a circular cross section, the width La1 of the signal line 11p is constant. The width L1 of the first portion 21 may be wider than the inner diameter La2 of the outer conductor 11o of the coaxial line 11 .

(A1) The width L1 of the first portion 21 has a length that makes the impedance of the first portion 21 larger than the impedance of the coaxial line 11 . For example, the coaxial line 11 is 25Ω. Where the width that makes the impedance of the first portion 21 25Ω is 665 μm, the width L1 of the first portion 21 may be 750 μm. That is, the impedance of the first portion 21 may be 92% to 100% of the impedance of the coaxial line 11, such as 21.5Ω to 24.5Ω.

(A2) The width L1 of the first portion 21 is greater than the widths L11, L12, and L13 of the second portion 22; The width L1 of the first portion 21 may be larger than the minimum widths L11 and L13 of the second portion 22, and may be larger than the maximum width L12 of the second portion 22. The width of the second portion 22 means, for example, the length in the direction orthogonal to the signal traveling direction. More specifically, in the embodiment shown in FIG. 4, the width of the second portion 22 is the length of the second portion 22 along the Y direction.

(B) The edge F23 on the outer peripheral side of the third portion 23 is an outwardly convex curve (see FIG. 5). A curved line may mean a line that does not contain corners and straight lines. A corner means a portion where a line is bent. For example, the corner may be a portion where straight lines intersect, or a portion where curved lines intersect. The fact that the edge of the signal wiring 20 on the outer peripheral side is an outwardly convex curve means that the signal wiring 20 has an outwardly convex curve, more specifically, an outwardly convex curve. It means that it is a convex curve from the peripheral side to the outer peripheral side. The outwardly convex curve in each portion to be described later can also be understood in the same way.

(C) The widths L1 to L6 of the signal wiring 20 in the X direction gradually narrow from the first portion 21 to the third portion 23 (see FIG. 4). More specifically, in the embodiment shown in FIG. 4, the width L of the signal wiring 20 in the X direction is gradually narrowed from the first portion 21 to the third portion 23 . In the third portion 23, the width L of the signal wiring 20 in the X direction may be gradually narrowed from the starting end to the terminal end along the signal path.

(D) The edge F21 on the outer peripheral side of the first portion 21 is an outwardly convex curve (see FIG. 5). Further, the outer edges F21 and F23 of the first portion 21 and the third portion 23 may be positioned on one curve with continuous curvature (for example, an arc or an elliptical outline). An edge of a portion lying on a curve means, for example, that substantially all edges of the portion overlap a curve.

(E) The edge F22 on the outer peripheral side of the second portion 22 is an outwardly convex curve (see FIG. 5). Each edge F21, F23, and F22 on the outer peripheral side of the first portion 21, the third portion 23, and the second portion 22 may be positioned on one curve with continuous curvature (for example, an arc or an elliptical outline). good.

(E1) The second portion 22 has a width L12 in the middle of the signal path that is wider than widths L11 and L13 at the start and end along the signal path (see FIG. 4). The width of the second portion 22 means, for example, the length in the direction orthogonal to the signal traveling direction. More specifically, in the embodiment shown in FIG. 4, the width of second portion 22 is the length of second portion 22 along the Y direction. The impedance at the middle width L12 is matched with the impedance of the coaxial lines 11 and 12 .

(F) Edges I21, I23, and I22 on the inner peripheral side of the first portion 21, the third portion 23, and the second portion 22 include straight lines d1 and d2 and an inwardly convex corner portion a1 (see FIG. 5). reference). For example, the inner edges I21 and I23 of the first portion 21 and the third portion 23 may include a straight line d1 parallel to the Y direction. The second portion 22 may include a straight line d2 parallel to the X direction. The second portion 22, the third portion 23, or the inner peripheral edges I22, I23 therebetween may include an inwardly convex right angle portion a1. That is, the inwardly convex corner a1 may be positioned between the straight lines d1 and d2. Here, the fact that the inner peripheral edge of the signal wiring 20 includes an inwardly convex corner means that a part of the inner peripheral edge of the signal wiring 20 has a corner that is convex toward the inside of the signal wiring 20 . , more specifically, means including outwardly convex corners, ie, corners that are convex from the inner circumference to the outer circumference. Convex corners, which will be described later, can also be understood in the same way.

(G) When viewed from the Z direction, the central axis Oa of the signal line 11p is located on the outer peripheral side of the widthwise central line x1 of the first portion 21 (see FIG. 6). A difference δ1 between the central axis Oa and the central line x1 in the Z direction may be within 15% of the width of the signal line 11p.

(G1) One end p11 on the outer peripheral side of the inner surface of the outer conductor 11o is positioned further outward than the one end p1 on the outer peripheral side of the first portion 21, and one end p2 on the inner peripheral side of the first portion 21 is located on the outer conductor 11o. may be located inward of the one end p12 on the inner peripheral side of the inner surface of the (see FIG. 6). The terms "outer" and "inner" are as described above, and more specifically, "outer" means the direction from the inner circumference to the outer circumference of the first portion 21 on the XY plane. However, the term "inward" means the direction from the outer peripheral side to the inner peripheral side of the first portion 21 on the XY plane.

(G2) Although different from FIGS. 1 to 6, when viewed from the Z direction, the outer end p13 of the signal line 11p (see FIG. 6) is aligned with the outer end p1 of the first portion 21 in the X direction. They may be at the same position, or the one end p13 may be positioned further outward than the one end p1.

(H) The fourth portion 24 and the fifth portion 25 of the signal wiring 20 have the same configurations as (A) to (G2) above. However, when applied to the fourth portion 24 and the fifth portion 25, in the descriptions of (A) to (G2) above, the first portion 21 is the fourth portion 24, the second portion 22 is the fifth portion 25, and the coaxial The line 11 can be read as the coaxial line 12 .

(H1) Each edge F21, F23, F22, F25, F24 on the outer peripheral side of the first portion 21, the third portion 23, the second portion 22, the fifth portion 25, and the fourth portion 24 of the signal wiring 20 has a curvature of Located on one continuous curve (eg, on the circumference of a circle, on the outline of an ellipse, etc.) (see FIG. 5).

<Action of each configuration>
By adopting the configuration {(A), (A2) and (B)} or {(A1), (A2) and (B)} for the signal wiring 20, the impedance in the microstrip substrate 20N is reduced to It is possible to reduce the power loss of the signal caused by the discontinuity between the coaxial line 11 and the microstrip substrate 20N and the curved shape of the signal path that follows the discontinuity when the matching value is obtained. has the effect of That is, the signal propagation mode is switched between the coaxial line 11 and the microstrip substrate 20N, and normally the capacitance component of the signal wiring 20 is insufficient. Therefore, by adopting the configuration of (A2) and the configuration of (A) or (A1), the impedance in the second portion is brought closer to the matching value to reduce the amount of reflection caused by the impedance mismatch, By increasing the capacitive component of the signal wiring 20 at the portion where the propagation mode is switched, the power loss of the signal due to the switching of the propagation mode can be reduced. Furthermore, when the configuration (A) or (A1) is adopted and the width of the signal wiring 20 is widened, the power loss of the signal tends to increase on the outer peripheral side of the bend. However, in the signal wiring 20 of the present embodiment, by additionally adopting the configuration (B), it is possible to reduce the increase in the power loss of the signal on the outer peripheral side. As a result, in the electronic component mounting package 1, the power loss of signals can be reduced overall.

According to the configuration (C), the mismatch between the impedance of the coaxial line 11 and the impedance of the first portion 21 caused by adopting the configuration (A) or (A1) can be gradually eliminated, and To reduce sudden changes in impedance when obtaining desired impedance at a portion of signal wiring 20 where an electronic component 71 is mounted. Furthermore, since the location where the width in the X direction gradually narrows starts from the first portion 21, the section where the impedances do not match can be shortened. Therefore, it is possible to reduce the reflection of signals due to the impedance mismatch, and reduce the deterioration of the reflection characteristics.

According to the configuration (D), since the path (signal path) through which the signal is transmitted becomes gentler on the outer peripheral side, it is possible to further reduce the power loss caused by the bending of the signal path. Furthermore, according to the configuration (E), since the outer peripheral side of the path through which the signal is transmitted from the third portion 23 to the second portion 22 is also gentle, the power loss caused by the bending of the signal path in this portion is also reduced. can. Further, according to the configuration (E), by making the curvature of the outer peripheral edge of each portion constant, the rate of shape change of the signal wiring 20 becomes constant, so that the reflection loss can be further reduced.

In the configuration (E1) as well, the same effect as that of the configuration (E) can be obtained.

According to the configuration (F), while reducing the occurrence of signal power loss on the inner peripheral side of the signal wiring 20, the configuration (C) (the width in the X direction between the first portion 21 and the third portion 23 is gradually narrowed), and the difference in impedance can be eliminated in a shorter section. At this time, the effect of the angular edge of the transmission line is less on the inner peripheral side of the signal wiring 20 than on the outer peripheral side. high-frequency characteristics can be improved. In particular, if the straight line on the inner peripheral side from the first portion 21 to the third portion 23 is nearly parallel to the extending direction of the coaxial line 11 and has an angle of 90° or more, the influence of the inner peripheral edge of the transmission line is less, and the configuration of (C) can be realized in a short section while the curves on the outer peripheral side of the configurations of (B) and (D) are gentle. As a result, the degree of freedom in design increases, and miniaturization of the microstrip substrate 20N can be achieved.

According to (G), (G1), (G2), or a plurality of these configurations, when the width L1 of the signal wiring 20 is increased to reduce the power loss of the signal when the signal transmission mode is switched, It is possible to reduce the increase in the overall size of the microstrip substrate 20N due to the spread of the signal wiring 20 to the outer peripheral side.

According to the configuration (H), (H1), or both, the effects described above can be obtained in the fourth portion 24 and the fifth portion 25 of the signal wiring 20 as well. When differential signals having opposite phases are input to the two coaxial lines 11 and 12, the signal characteristics of the first portion 21, the third portion 23, and the second portion 22 of the signal wiring 20 are the same as those of the signal wiring 20. substantially match the signal characteristics of the fourth portion 24, the fifth portion 25 and the second portion 22 of .

<Simulation 1>
FIG. 7 is a graph showing simulation results of high-frequency characteristics of a plurality of signal wiring patterns of the embodiment and Comparative Example 1; 8 is a partially broken plan view showing the configuration of Comparative Example 1. FIG.

In simulation 1, signal wiring patterns of a plurality of embodiments having different radii of circles (represented by "R" in the legend of the figure) in which the outer edges F21, F23, F20, F25, and F24 of the signal wiring 20 are located. , and the signal wiring pattern of Comparative Example 1 shown in FIG. In the pattern of the plurality of signal wirings of the embodiment, 1000 μm to 1500 μm is adopted as the radius R of the circle. The patterns of the plurality of signal wirings have the same configuration as in FIGS. 1 to 3 except that the radii of the circles are different.

In the package 201 of Comparative Example 1, the signal wiring 220 of the microstrip substrate 220N bends from the Y direction parallel to the axial direction of one of the coaxial lines 211 to the X direction, and furthermore, bends from the X direction to the X direction as in the first embodiment. It bends in the -Y direction parallel to the axial direction of one coaxial line 212 . On the other hand, unlike the first embodiment, the signal wiring 220 of the comparative example 1 employs a curved pattern having straight lines and corners, and does not include a curved line at the edge on the outer peripheral side. Further, the signal wiring 220 of Comparative Example 1 has substantially the same width along the signal path, so that the impedance of the signal wiring 220 is matched with the impedance of the coaxial lines 211 and 212 over the entire length of the signal wiring 220. ing.

As shown in FIG. 7, the electronic component mounting package 1 according to the first embodiment has better reflection loss characteristics than the first comparative example. In particular, in a high frequency band such as around 50 GHz, a reduction in reflection loss of about 10 dB or more compared to Comparative Example 1 was confirmed.

<Simulation 2>
9 and 10 are graphs showing simulation results of high-frequency characteristics of the signal wiring pattern of the first embodiment and the signal wiring pattern of the comparative example 2 shown in FIGS. 1 to 3. FIG. Specifically, FIG. 9 is a graph showing simulation results of reflection loss between the signal wiring pattern of the first embodiment and the second comparative example. FIG. 10 is a graph showing simulation results of insertion loss between the signal wiring pattern of the first embodiment and the second comparative example. FIG. 11 is a plan view showing a signal wiring pattern of Comparative Example 2. FIG.

In Simulation 2, the pattern of the signal wiring 20 of Embodiment 1 and the pattern of the signal wiring 250 of Comparative Example 2 of FIG. 11 were compared in reflection loss and insertion loss. The signal wiring 250 of Comparative Example 2 has an edge F250 on the outer peripheral side similar to that of the first embodiment, but has a curved edge I250 with a large radius on the inner peripheral side so that the width of the signal wiring 250 is constant. That is, the signal wiring 250 of Comparative Example 2 has the configurations (A), (A1), and (B) described above, but the configuration (C) described above (a configuration in which the widths L1 to L6 gradually narrow, 4). In Comparative Example 2, the joint structure and relative position between the coaxial line and the microstrip substrate 250N are the same as in the first embodiment.

As shown in FIG. 10, in the high frequency band of 50 GHz or higher, Comparative Example 2 improves the insertion loss by the amount that the edge I250 on the inner circumference side is gentle. However, compared with the first embodiment, the improvement in insertion loss is small (for example, about 0.5 dB at 55 GHz and about 1.9 dB at 60 GHz). On the other hand, as shown in FIG. 9, in the high frequency band of 50 GHz or higher, the pattern of Embodiment 1 has significantly improved reflection loss compared to the pattern of Comparative Example 2 (for example, about 2.8 dB at 55 GHz, at about 4.3 dB). Therefore, it is confirmed that the pattern of the first embodiment can obtain overall better high-frequency characteristics than the pattern of the second comparative example.

The patterns that can be used for the electronic component mounting package 1 of Embodiment 1 and the signal wiring 20 of the package 1 have been described above with reference to FIGS. 1 to 11. FIG.

In addition, as shown in FIG. 4, the third portion 23 may include a portion having a minimum width L8 between the start end and the end along the signal path. Even with the third portion 23 having such a very small width L8, the signal line can be gradually thinned, and the narrow section in the middle of the signal wiring 20 allows additional capacity can be canceled.

Also, the width L1 of the first portion 21 may be constant from the start end to the end along the signal path. With such a shape, it is possible to further compensate for the lack of capacity in the conversion section.

Furthermore, in the embodiments shown in FIGS. 4-6, the widths L11-L13 of the second portion 22 increase from the beginning to the middle along the signal path and then decrease toward the end. The shape of the portion 22 is not limited to this. For example, the width of the second portion 22 may also be constant from beginning to end along the signal path. Even with such a shape, the width of the third portion 23 can be gradually reduced, and the reflection loss can be improved.

(Embodiment 2)
FIG. 12 is a plan view showing part of an electronic component mounting package according to Embodiment 2 of the present disclosure. The electronic component mounting package 1A of the second embodiment differs from the first embodiment in that the inner edges of the signal wirings 20A of the microstrip substrate 20N include curves c1 and c2 with small radii. Components similar to those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

The edge on the inner peripheral side of the signal wiring 20A of the second embodiment includes inwardly convex curves c1 and c2. The curvature centers p21 and p23 of the curves c1 and c2 are closer to the signal wiring 20A than the curvature centers p22 and p24 of the edges on the outer peripheral side, respectively. More specifically, the center of curvature p21 of the curve c1 is closer to the signal wiring 20A than the center of curvature p22 of the edges F21, F23, and F22 on the outer peripheral side. With this configuration, while the straight lines d1 and d2 are included in the edges I21, I23, and I22 on the inner peripheral side, the configuration of (C) of Embodiment 1 (the configuration in which the widths L1 to L6 gradually narrow, see FIG. 4) is the same. A configuration is realized. The same applies to the edges I24 and I25 on the inner peripheral side of the fourth portion 24 and the fifth portion 25, respectively. Here, the center of curvature means the center of the circle where the target curve and the circumference overlap. In the present embodiment, the corners are excluded from the edge on the inner peripheral side of the signal wiring 20A, thereby improving the insertion loss of the signal path.

(Electronic device and electronic module)
FIG. 13 is a partially broken side view showing an electronic device and an electronic module according to an embodiment of the present disclosure; An electronic device 60 according to an embodiment of the present disclosure includes an electronic component mounting package 1 and an electronic component 71 mounted on a microstrip substrate 20N. The electronic component 71 is mounted on the second portion 22 of the signal wiring 20 . The electronic component 71 is, for example, a laser diode, but may be a light-emitting diode, a device that is driven at a high frequency, or a device that inputs or outputs a high frequency signal. The cap 65 has a window 65s through which light rays from the electronic component 71 are output.

An electronic module 100 according to an embodiment of the present disclosure is configured by mounting an electronic device 60 on a module board 110 . In addition to the electronic device 60 , other electronic devices, electronic elements, electric elements, and the like may be mounted on the module substrate 110 . In the electronic device 60, signal lines 11p and 12p, electrode pins 61a and 61b, and a ground pin 61c are joined to a module substrate 110, and impedance-matched signal lines are joined to coaxial lines 11 and 12. FIG. In this manner, the electronic device 60 is supported by the signal lines 11p and 12p, the electrode pins 61a and 61b, and the ground pin 61c when mounted on the module substrate 110. FIG. The module substrate 110 may be an FPC (Flexible printed circuits) substrate, an inflexible substrate, or both.

According to the electronic device 60 and the electronic module 100 of the present embodiment, good high frequency characteristics can be obtained due to the improved high frequency characteristics of the electronic component mounting package 1 .

The embodiments of the present disclosure have been described above. However, the present invention is not limited to the above embodiments.

For example, in the above embodiments, a TO-CAN type package was shown, but the package type is not limited as long as it has a coaxial line and a microstrip substrate.

Further, in the above-described embodiment, an example in which the two coaxial lines 11 and 12 are joined to the signal wiring 20 of the microstrip substrate 20N is shown. good. Also, the two coaxial lines do not have to be parallel to each other in their axial directions.

In the above embodiment, the signal line 11p has a columnar shape with a constant width, but the shape of the signal line 11p is not limited to this, and may be a circular shape with a variable width. . In this case, the width L1 of the first portion 21 should be wider than the width La1 of the signal line 11p at the end portion of the signal line 11p that is joined to the signal wiring 20 . The same applies to the signal line 12p.

In the above embodiment, the inner surface of the outer conductor 11o has a cylindrical shape with a constant diameter, but the shape of the inner surface of the outer conductor 11o is not limited to this. There may be. In this case, the positional relationship with the first portion 21 described above may be satisfied at the end of the inner surface of the outer conductor 11o located on the signal wiring 20 side. The same applies to the outer conductor 12o.

Other details shown in the embodiments can be changed as appropriate without departing from the scope of the invention.

1 electronic component mounting package 2 base block 3 stage block 11, 12 coaxial lines 11p, 12p signal lines 11o, 12o outer conductor 20 signal wiring 20N microstrip substrate 21 first portion 21e one end 22 second portion 23 third portion 24 third 4 part 24e other end 25 5th part 28 ground conductors E1, E2 joining members F21 to F25 outer peripheral edges I21 to I25 inner peripheral edges L1 to L6, L8, L11, L12, L13, La1 width La2 inner diameter d1, d2 Straight line a1 Inwardly convex corner (inwardly convex right angle)
c1, c2 Inwardly convex curves p21, p22 Curvature center Oa, Ob Central axis x1 Center line p1 One end of the first portion on the outer peripheral side p2 One end of the first portion on the inner peripheral side p11 One end on the outer peripheral side of the inner surface of the outer conductor p12 One end on the inner peripheral side of the inner surface of the external conductor p13 One end on the outer peripheral side of the signal line c1, c2 Curves 60 Electronic device 71 Electronic component 100 Electronic module 110 Board for module

Claims (19)

a coaxial line having a signal line and an outer conductor;
a microstrip substrate having a signal wiring that bends from the extension direction of the coaxial line to a direction crossing the extension direction,
The signal wiring is
a first portion that is an end connected to one end of the signal line;
a second portion extending in a direction intersecting with the extension direction;
a third portion located between the first portion and the second portion;
has
the width of the first portion is wider than the width of the signal line and the width of the second portion;
An edge of the third portion on the outer peripheral side of the signal wiring is an outwardly convex curve,
A package for mounting electronic components. The width of the first portion is wider than the inner diameter of the outer conductor,
The electronic component mounting package according to claim 1 . The width of the signal wiring in a direction orthogonal to the extending direction of the coaxial line gradually narrows from the first portion to the third portion.
The electronic component mounting package according to claim 1 or 2. The edge of the first portion on the outer peripheral side is an outwardly convex curve,
The electronic component mounting package according to any one of claims 1 to 3. The edge of the first portion on the outer peripheral side and the edge of the third portion on the outer peripheral side are positioned on one curve with continuous curvature,
The electronic component mounting package according to claim 4 . The edge of the first portion on the outer peripheral side and the edge of the third portion on the outer peripheral side are positioned on the same circumference,
The electronic component mounting package according to claim 5 . The edge of the second portion on the outer peripheral side is an outwardly convex curve,
The electronic component mounting package according to any one of claims 1 to 6. Each edge of the first portion, the third portion, and the second portion on the outer peripheral side is positioned on one curve with continuous curvature;
The electronic component mounting package according to claim 7 . Each edge of the first portion, the third portion, and the second portion on the outer peripheral side is positioned on the same circumference,
The electronic component mounting package according to claim 8 . Edges of the first portion, the third portion, and the second portion on the inner peripheral side of the signal wiring include straight lines and inwardly convex corners,
The electronic component mounting package according to any one of claims 1 to 9. edges of the first portion and the third portion on the inner peripheral side include a straight line parallel to the extending direction of the coaxial line;
11. The electronic component mounting package according to claim 10. The inwardly convex corner portion is an inwardly convex right angle portion located at the edge of the second portion or the third portion on the inner peripheral side,
The electronic component mounting package according to claim 10 or 11. an edge of the second portion or the third portion on the inner peripheral side of the signal wiring includes an inwardly convex curve;
the center of curvature of the inwardly convex curve is closer to the signal wiring than the center of curvature of the outwardly convex curve;
The electronic component mounting package according to any one of claims 1 to 9. When viewed from a direction perpendicular to the microstrip substrate, the center line of the signal line is positioned closer to the outer periphery than the center of the first portion in the width direction.
The electronic component mounting package according to any one of claims 1 to 13. one end of the inner surface of the outer conductor on the outer peripheral side is positioned further outward than one end of the first portion on the outer peripheral side;
one end of the first portion on the inner peripheral side is positioned inward from one end of the inner peripheral side of the inner surface of the outer conductor;
15. The electronic component mounting package according to claim 14. The coaxial line includes a first coaxial line connected to the first portion and a second coaxial line,
The signal wiring further has a fourth portion, which is an end of the second coaxial line connected to the signal line, and a fifth portion located between the second portion and the fourth portion. death,
The fourth portion and the fifth portion are curves with edges convex outward on the outer peripheral side,
Edges of the first portion, the third portion, the second portion, the fifth portion, and the fourth portion on the outer peripheral side are positioned on one curve with continuous curvature,
The electronic component mounting package according to any one of claims 1 to 15. 17. The electronic component mounting package according to claim 16, wherein edges of said first portion, said third portion, said second portion, said fifth portion and said fourth portion on said outer peripheral side are positioned on the same circumference. An electronic component mounting package according to any one of claims 1 to 17;
an electronic component connected to the signal wiring;
An electronic device comprising an electronic device according to claim 18;
a module substrate on which the electronic device is mounted;
electronic module with

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