JP2021140000A - Electronic components and manufacturing methods for electronic components - Google Patents

Abstract

To provide an electronic component applicable to a mount component for a camera module or the like and having excellent economical efficiency, capable of preventing the adhesion of dust on the mount component by a simple method and simplifying the manufacturing process, and a manufacturing method for the electronic component.SOLUTION: An electronic component includes a mount component 2 on a substrate 1, and a protection film 3 covering a protected surface 2A of the mount component 2. The protection film 3 includes a film main body 4 covering the protected surface 2A, and an extension piece 6 that is connected to the film main body 4 and extends to a position outside a holder 5 that covers the mount component 2.SELECTED DRAWING: Figure 1

Description

The present invention relates to economically efficient electronic components and methods for manufacturing electronic components, which are applied to mounting components such as camera modules and can simplify the manufacturing process.

CMOS (Complementary Metal Oxide Semiconductor) sensors are used as image sensors (electronic components) in digital cameras and scanners.
The substrate on which the CMOS sensor is mounted is assembled and screwed to the lens ASSY (Assembly) in a clean room.

When assembling these substrates and the lens ASSY, air blow is performed on both the substrate and the lens ASSY so that minute dust is not mixed.
After that, the CMOS sensor visually confirms the presence or absence of dust adhering by an operator using a microscope.
Further, in the method of assembling the image sensor as described above, since the inspection of the adhesion of dust depends on the visual confirmation by the operator, there is a problem that the inspection is troublesome and the production efficiency is lowered. In addition, it is not realistic to carry out all the processes in a clean room in order to completely prevent the adhesion of dust, which entails enormous equipment costs.

On the other hand, the following Patent Documents 1 and 2 have been proposed as techniques related to such an image sensor.
The camera module shown in Patent Document 1 includes an image sensor such as CMOS in which a flip chip is mounted on one surface of a substrate via a bump, and a lens mounted on the other surface of the substrate and facing a through hole of the substrate. A lens unit having a tubular lens frame along the peripheral edge of the through hole, and a sealing resin filled around the lens frame of the lens unit.

In the small module camera shown in Patent Document 2, an infrared cut filter and an optical system accommodating portion for accommodating a lens are installed above a through hole formed in LTCC (Low Temperature Co-fired Ceramics). Moreover, an image pickup element accommodating portion is installed below the through hole.
In the image sensor accommodating portion, the image sensor in which the light receiving portion is arranged is flip-chip mounted on the outside of the support portion, and then the vicinity of the flip chip mounting portion is sealed with resin.

Japanese Unexamined Patent Publication No. 2009-201000 Japanese Unexamined Patent Publication No. 2008-20737

Further, even in such Patent Documents 1 and 2, there is still a problem that dust adheres to the image sensor, and there is a problem that it is necessary to take time and effort to remove these dust and confirm the presence or absence of dust adhesion. It was occurring.

The present invention has been made in view of the above circumstances, and is applied to a mounting component such as a camera module, and can be manufactured by a simple method to prevent dust from adhering to the mounting component. Provided are an economical electronic component and a method for manufacturing the electronic component, which can simplify the process.

In order to solve the above problems, the present invention proposes the following means.
The electronic component shown in the first aspect of the present invention has a mounting component and a protective film covering the protected surface of the mounting component, and the protective film includes a film main body portion covering the protected surface and the film. It is characterized by having a tension piece that is connected to the main body and extends to a position outside the holder that covers the mounting component.

The electronic component shown in the second aspect of the present invention includes a substrate, a mounting component mounted on the board, and a holder mounted on the board so as to cover the mounting component, and the mounted component is protected. It is characterized in that a film extraction port for extracting the protective film covering the surface is provided in a sealed state.

In the method for manufacturing an electronic component shown in the third aspect of the present invention, a step of covering a protected surface of a mounting component with a protective film, a mounting component covered with the protective film, and a holder covering the entire mounting component are subjected to a substrate. The protective film has a step of pulling out the protective film through a film extraction port provided in the holder, and the protective film has a film main body portion that covers the protected surface of the mounting component in the holder. It is characterized by having a tension piece connected to the film body and reaching the outside of the holder.

In the present invention, a protective film having a simple structure composed of a film body and a tension piece can prevent dust from adhering to the mounting component, and by pulling the tension piece, the protective film can be removed from the mounting component. Can be easily removed.
Thereby, in the present invention, it is possible to realize an economically economical electronic component capable of simplifying the manufacturing process.

It is a schematic block diagram which shows the minimum structure of the electronic component which concerns on this invention. It is external drawing of the electronic component which concerns on embodiment. It is a regular cross-sectional view taken along the line III-III of FIG. It is a top view of FIG.

The minimum configuration of the electronic component 10 according to the present invention will be described with reference to FIG.
The electronic component 10 has a mounting component 2 mounted on the substrate 1 and a protective film 3 covering the protected surface 2A of the mounting component 2.
The protective film 3 has a film main body 4 that covers the protected surface 2A of the mounting component 2, and a tension piece 6 that is connected to the film main body 4 and extends to a position outside the holder 5.

Then, according to the electronic component 10 configured as described above, the protective film 3 covering the protected surface 2A of the mounting component 2 is placed in the holder 5, and the film main body portion covering the protected surface 2A of the mounting component 2 is provided. 4 and a tension piece 6 connected to the film main body 4 and reaching the outside of the holder 5.
As a result, in the electronic component 10, when the holder 5 is installed on the substrate 1, the protected surface 2A of the mounting component 2 is covered in advance with the film body 4 of the protective film 3, and then on the substrate 1. When the installation of the holder 5 is completed, the protective film 3 can be peeled off from the protected surface 2A of the mounting component 2 by pulling the tension piece 6 extending from the film main body 4 of the protective film 3 to the outside of the holder 5. can.

As a result, in the electronic component 10, the process of preventing dust from adhering to the mounting component 2 during the holder installation work and the process of peeling the film body 4 from the mounting component 2 after the holder is installed are performed by pulling the film body 4 and the film body 4. Both can be realized by the protective film 3 made of the piece 6.
That is, in the electronic component 10, the protective film 3 having a simple structure composed of the film main body 4 and the tension piece 6 can prevent dust from adhering to the mounting component 2, and simplifies the manufacturing process. It is possible to realize an electronic component having excellent economic efficiency.

(Embodiment)
The electronic component 100 according to the embodiment of the present invention will be described with reference to FIGS. 2 to 4.
FIG. 2 is an external view of the electronic component 100 according to the embodiment, FIG. 3 is a normal cross-sectional view of FIG. 2, and FIG. 4 is a plan view of FIG.

The electronic component 100 covers the mounting component 12 mounted on the camera board 11, the lens holder 13 installed on the camera board 11 for accommodating the mounting component 12, and the protected surface 12a of the mounting component 12. It has a protective film 14.
The mounting component 12 and the lens holder 13 are mounted on the camera board 11 by SMT (Surface mount technology).

Further, a discard substrate 20 (see FIG. 4) is connected to the camera substrate 11 used in this example. The discarded substrate 20 is separated from the main body of the camera substrate 11 before the protective film 14 is removed.
Further, what is indicated by reference numeral 21A in the camera board 11 is a marking of the center point, which is used as an alignment mark of the camera board 11.
Further, what is indicated by reference numeral 21B in the lens holder 13 is a marking of the center point, which is used as a mark for adjusting the optical axis of the lens 30.

When the lens holder 13 is fixed on the camera substrate 11 by SMT mounting, it is necessary to adjust the optical axis of the camera before mounting the SMT.
At that time, the variation of the optical axis is measured in advance for each individual lens, and the marking 21B is attached to the center point of the lens holder 13.
On the other hand, an alignment mark 21A is also attached to the camera board 11 as a center point of the CMOS sensor that is the mounting component 12.
Then, in the SMT mounting, these two marks 21A and 21B are recognized by image recognition and the lens holder 13 is positioned with respect to the camera substrate 11, whereby the center point of the CMOS sensor lens (indicated by reference numeral O in FIG. 4). Assembling that matches the above is carried out.

The mounting component 12 is an image sensor 12A composed of a CMOS sensor, and is mounted on a camera substrate 11 (for example, a central portion).
Further, the lens holder 13 has a lens 30 for guiding light to a CMOS sensor serving as an image sensor 12A in the center thereof, and when the lens 30 is installed on the camera substrate 11, the lens 30 is directly above the image sensor 12A. To be located in.
Further, pins 31 for positioning and fixing the lens 30 with respect to the image sensor 12A are installed at the four corners of the lower surface of the lens holder 13 by being inserted into the through holes of the camera substrate 11.

As shown in FIGS. 3 and 4, a protective film 14 that covers the protected surface 12a serving as an image pickup unit is attached to the image pickup device 12A made of a CMOS sensor.
The protective film 14 includes a film body 15 that covers the protected surface 12a of the image sensor 12A inside the lens holder 13, and a tension piece 16 that is connected to the film body 15 and extends to a position outside the lens holder 13. And have.
Further, the tension piece 16 of the protective film 14 is overlapped with the film main body portion 15 on the protected surface 12a of the image pickup element 12A by bending the tension piece 16 near the end portion (left end portion in the drawing) of the image pickup element 12A. It is arranged in the state. The bent portion of the protective film 14 is indicated by reference numeral 17 in FIGS. 3 and 4.

Further, the lens holder 13 is provided with a film extraction port 13A for allowing the tension piece 16 of the protective film 14 to reach the outside of the lens holder 13.
The film extraction port 13A is provided at the lower part of the lens holder 13 on the side (right side in the drawing) opposite to the bent portion 17 of the tension piece 16 of the protective film 14.
The film extraction port 13A of the lens holder 13 is a gap formed between the lower surface of the lens holder 13 and the camera substrate 11, and only the tension piece 16 of the protective film 14 and the film body 15 pass through. It has a width dimension and a minute height interval (about 0.08 mm).
Further, the film extraction port 13A of the lens holder 13 is provided in a sealed state with an adhesive after the protective film 14 is extracted.

Although the film extraction port 13A is formed in the lower part of the lens holder 13, it may be provided by forming a recess in the lower part of the lens holder 13, or the lens holder 13 is mounted on the substrate 11. At this time, a minute gap may be intentionally formed between the substrate 11 and the lens holder 13, and the gap may be used for the film extraction port 13A.

Then, the electronic component 100 configured as described above is manufactured by the following procedure.
First, in the first step, the protected surface 12a of the image pickup device 12A is covered with the protective film 14. Although this first step is usually carried out by the image sensor manufacturer, it may be carried out on-site immediately before the following second and third steps.
In the next second step, the image sensor 12A covered with the protective film 14 and the lens holder 13 covering the entire image sensor 12A are mounted on the camera substrate 11.

Further, in the next third step, the protective film 14 is extracted through the film extraction port 13A provided in the lens holder 13.
At this time, the tension piece 16 of the protective film 14 pulled by the operator is bent near the end of the image sensor 12A so that the tension piece 16 is overlapped with the film body 15 on the protected surface 12a of the image sensor 12A. It is arranged.
Further, the film extraction port 13A is provided in the lens holder 13 on the side opposite to the bent portion 17 of the tension piece 16 of the protective film 14.

Thereby, in the present embodiment, as shown by the arrow S, the protective film 14 can be easily removed from the protected surface 12a of the image pickup device 12A by the operator pulling the tension piece 16 of the protective film 14. can.
After that, the film extraction port 13A of the lens holder 13 is sealed with an adhesive after the protective film 14 is extracted.

On the other hand, in the second step, as described above, the image sensor 12A and the lens holder 13 are attached to the camera substrate 11 by SMT mounting.
At that time, by mounting the image sensor 12A and the lens holder 13 on the camera substrate 11 in the clean room, the possibility of dirt adhering due to manual intervention can be eliminated, and the assembly process can be further reduced.
Further, by sealing the CMOS sensor to be the image sensor 12A with the protective film 14 in the first step of the previous step, there is no chance of dust adhering to the image sensor 12A, and a clean room is used in the subsequent step. The work of moving to is also possible to omit as appropriate.

Since the focus depends on the optical characteristics of the lens, the focus is adjusted by adhering and fixing the lens 30 and the holder 13 at a predetermined position before mounting the holder 13. As a result, it is possible to prevent dust from being generated by threading the lens and the lens holder 13 as before in the focus adjustment process.
Further, regarding the optical axis adjustment step of the camera, since the central axis of the substrate and the lens ASSY is determined by the SMT tolerance at the time of SMT, it is possible to omit the optical axis adjustment step in the subsequent stage.
That is, in the present embodiment, it is possible to manufacture without the need for a clean room, and the items of lens holder assembly, focus adjustment, and optical axis adjustment, which have been performed in the assembly process in the clean room, can be omitted, and the process can be reduced. Can be planned.

Then, according to the electronic component 100 according to the present embodiment configured as described above, the protective film 14 covering the protected surface 12a of the image sensor 12A is placed in the lens holder 13 to cover the protected surface of the image sensor 12A. It was composed of a film main body 15 that covers 12a and a tension piece 16 that is connected to the film main body 15 and reaches the outside of the lens holder 13.
As a result, in the electronic component 100, when the lens holder 13 is installed on the camera substrate 11, the protected surface 12a of the image sensor 12A is covered with the film body 15 of the protective film 14 (first step), and then When the installation of the lens holder 13 on the camera substrate 11 is completed (second step), the image sensor is pulled by pulling the tension piece 16 from the film body 15 of the protective film 14 to the outside of the lens holder 13. The protective film 14 can be peeled off from the protected surface 12a of 12A (third step).

As a result, in the electronic component 100, the process of preventing dust from adhering to the image sensor 12A during the holder installation work and the process of peeling the film body 15 from the image sensor 12A after the holder is installed are performed by pulling the film body 15 and the film body 15. Together, it can be realized by the protective film 14 composed of the pieces 16.
That is, in the electronic component 100, the protective film 14 having a simple structure including the film main body 15 and the tension piece 16 can prevent dust from adhering to the image pickup element 12A, and as a result, a clean room can be created. It is possible to realize highly economical electronic components that can be manufactured without the need and can simplify the manufacturing process.
Further, the electronic component 100 has an effect that the manufacturing process can be simplified and also an effect that dirt adhesion can be avoided without human intervention.

(Modification example)
In the above embodiment, an image pickup device (electronic component) using a camera substrate 11 as a substrate and an image sensor 12A composed of a CMOS sensor as a mounting component 12 has been described, but the application is not limited to the camera, and the use is not limited to the camera, and the scanner and projector. It may be applied to optical devices such as.
Further, the present invention may be applied as a dust shield when a CPU (Central Processing Unit) is used as the mounting component 12 and the CPU (Central Processing Unit) is sealed with a holder.

Although the embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and design changes and the like within a range not deviating from the gist of the present invention are also included.

The present invention relates to an economically efficient electronic component and a method for manufacturing an electronic component, which is applied to a mounting component such as a camera module and can simplify a manufacturing process.

1 Board 2 Mounting parts 2A Protected surface 3 Protective film 4 Film body 5 Holder 6 Tension piece 10 Electronic parts 11 Board 12 Mounting parts 12A Image sensor 12a Protected surface 13 Holder 13A Film extraction port 14 Protective film 15 Film body 16 Welding helmet 30 Lens 100 Electronic components

Claims (10)

Mounting parts and
It has a protective film that covers the protected surface of the mounting component.
The protective film is
An electronic component characterized by having a film body portion that covers the protected surface, and a tension piece that is connected to the film body portion and extends to a position outside the holder that covers the mounting component. Claim 1 is characterized in that the tension piece of the protective film is bent in the vicinity of the end portion of the mounting component so as to be arranged in a state of being overlapped with the film main body portion on the protected surface of the mounting component. Electronic components described in. With the board
The mounting components mounted on this board and
It has a holder that covers the mounting component and is mounted on the board.
An electronic component characterized in that a film extraction port for extracting a protective film covering a protected surface of the mounting component is provided in a sealed state. The protective film has a film main body portion that covers the protected surface, and a tension piece that is connected to the film main body portion and extends to a position outside the holder that covers the mounting component.
3. The third aspect of the present invention is that the tension piece of the protective film is bent in the vicinity of the end portion of the mounting component so as to be arranged in a state of being overlapped with the film main body portion on the protected surface of the mounting component. Electronic components described in. The electronic component according to any one of claims 3 or 4, wherein the film extraction port of the holder is provided in the holder on the side opposite to the bent portion of the protective film. The electronic component according to any one of claims 3 to 5, wherein the film extraction port of the holder is provided in a sealed state with an adhesive after the protective film is removed. The mounting component is an image sensor.
The invention according to any one of claims 3 to 6, wherein a lens for guiding light is installed in the image sensor at the center of the holder and above the image sensor on the substrate. Electronic components. The process of covering the protected surface of the mounted component with a protective film,
The process of mounting the mounting component covered with the protective film and the holder covering the entire mounting component on the substrate, and
It has a step of pulling out a protective film through a film pull-out port provided in the holder.
The protective film is
A method for manufacturing an electronic component, which comprises a film main body portion that covers a protected surface of the mounting component in the holder, and a tension piece that is connected to the film main body portion and reaches the outside of the holder. 8. The protective film tension piece is bent in the vicinity of the end portion of the mounting component so as to be arranged in a state of being overlapped with the film main body portion on the protected surface of the mounting component. The method for manufacturing an electronic component described in. The method for manufacturing an electronic component according to any one of claims 8 or 9, wherein the film extraction port is provided in the holder on the side opposite to the bent portion of the tension piece of the protective film.

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