JP2020092251A - Light-emitting device and manufacturing method thereof - Google Patents

Abstract

To provide a light-emitting device having better light extraction and better adhesion, and a method of manufacturing the same.SOLUTION: A light-emitting device 10 includes: a base body 20; a light-emitting element 40; a resin frame 50; and a first resin 30 located inside the resin frame 50 to cover a part of side surfaces of the light-emitting element 40, a part of an inner side surface of the resin frame 50, and the upper surface of the base body 20, the first resin containing a reflective material. The first resin 30 includes a reflective material layer 32 that contains the reflective material, and a resin layer 31 that is located on an upper surface of the reflective material layer 32 and does not contain the reflective material. In the reflective material layer 32, the reflective material is arranged to cover the upper surface of the base body 20, and the upper surface of the resin layer 31, as seen in cross section, includes a flat region 31A and a sloped region 31B where a height h1 from the upper surface of the base body 20 is gradually elevated as the upper surface of the resin layer approaches the inner side surface of the resin frame 50.SELECTED DRAWING: Figure 1C

Description

The present disclosure relates to a light emitting device and a method for manufacturing the same.

A light emitting device using a light emitting element such as a light emitting diode or a laser diode is used in many fields including general lighting such as indoor lighting, an in-vehicle light source, a backlight of a liquid crystal display, and the like. The performance required for these light emitting devices is increasing day by day, and further improvement in reliability is required.

The light emitting device includes a light emitting element mounted on the upper surface of the lead, a frame body provided on the upper surface of the lead so as to surround the light emitting element, and a reflecting member that covers the side surface of the frame body and the side surface of the light emitting element. A light emitting device is known (for example, refer to Patent Document 1).

JP, 2016-072412, A

However, in the light emitting device, as the applications are expanded, it is required to further improve the light extraction property and further improve the adhesion of the reflection member to the frame body and the leads.
Therefore, it is an object of the embodiment according to the present disclosure to provide a light emitting device having excellent light extraction properties and adhesion, and a method for manufacturing the same.

In order to solve the above problems, a light emitting device according to an embodiment of the present disclosure includes a base body in which a first lead and a second lead are supported by a resin member, and a light emitting element mounted on an upper surface of the base body. A resin frame provided on an upper surface of the base so as to surround the light emitting element, a part of a side surface of the light emitting element, a part of an inner side surface of the resin frame, and the base provided on the inside of the resin frame. A first resin containing a reflecting material, the first resin covering the upper surface of the reflecting material, the first resin containing the reflecting material, and the first resin containing the reflecting material provided on the upper surface of the reflecting material layer. And a resin layer that does not exist, the reflector is arranged so that the reflector covers the upper surface of the base, and the upper surface of the resin layer has a flat region and a top surface of the base in a cross-sectional view. Has an inclined region whose height increases toward the inner surface of the resin frame.

In order to solve the above problems, a light emitting device according to an embodiment of the present disclosure provides a base material having a base material, a wiring layer formed on an upper surface of the base material, and light emission placed on the upper surface of the base material. An element, a resin frame provided on the upper surface of the base so as to surround the light emitting element, a part of a side surface of the light emitting element and a part of an inner side surface of the resin frame, the resin frame being provided inside the resin frame. And a first resin containing a reflective material, the first resin covering the upper surface of the base and the reflective material layer containing the reflective material, and the first resin provided on the upper surface of the reflective material layer. A resin layer containing no material, the reflecting material layer is arranged such that the reflecting material covers the upper surface of the base body, and the upper surface of the resin layer has a flat region in a cross-sectional view and the base body. And an inclined region whose height from the upper surface increases as it approaches the inner side surface of the resin frame.

A method of manufacturing a light emitting device according to an embodiment of the present disclosure includes a first step of mounting a light emitting element on an upper surface of a base body and a second step of forming a resin frame on the upper surface of the base body so as to surround the light emitting element. And injecting a first resin containing a reflecting material into the inside of the resin frame so that the first resin forms a part of a side surface of the light emitting element, a part of an inner side surface of the resin frame, and an upper surface of the base body. And a centrifugal force by revolving the base to separate the first resin into a reflective material layer containing the reflective material and a resin layer not containing the reflective material. And a fourth step.

According to the light emitting device and the method for manufacturing the same according to the embodiment of the present disclosure, it is possible to obtain a light emitting device that is excellent in light extraction properties and adhesion of each member of the light emitting device.

It is a top view which shows typically the structure of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing in the IB-IB line of FIG. 1A. It is sectional drawing which partially expanded FIG. 1B. FIG. 3 is a plan view of the light emitting device according to the first embodiment with the resin frame and the first resin omitted. FIG. 3 is a plan view of the light emitting device according to the first embodiment with the first resin omitted. 4 is a flowchart showing a flow of a method for manufacturing the light emitting device according to the first embodiment. FIG. 9 is a cross-sectional view taken along the line VA-VA in FIG. 2, and is a cross-sectional view schematically showing the base body on which the light emitting element is mounted in the first step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5 is a cross-sectional view taken along line VB-VB of FIG. 3, and is a cross-sectional view schematically showing a base body on which a resin frame is formed in the second step of the method for manufacturing the light emitting device according to the first embodiment. It is sectional drawing which shows typically the base|substrate which inject|poured the 1st resin in the 3rd process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows typically the method of isolate|separating a 1st resin into a resin layer and a reflective material layer in the 4th process of the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 2nd Embodiment typically. 6 is a flowchart showing a flow of a method for manufacturing a light emitting device according to a second embodiment. It is a perspective view which shows typically the structure of the light-emitting device which concerns on 3rd Embodiment. It is a top view which shows typically the structure of the light-emitting device which concerns on 3rd Embodiment. It is sectional drawing which shows the cross section in the VIIIC-VIIIC line of FIG. 8B typically.

Embodiments will be described below with reference to the drawings. However, the following embodiments are examples of the light emitting device for embodying the technical idea of the present embodiment, and are not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention thereto, unless there is a specific description, and are merely illustrative examples. Nothing more. Note that the size, positional relationship, etc. of the members shown in each drawing may be exaggerated for clarity of explanation. In the following description, the same names and reference numerals indicate members having the same function or the same quality, and detailed description thereof will be appropriately omitted.

[First Embodiment]
<Light emitting device>
First, the light emitting device according to the first embodiment will be described.
FIG. 1A is a plan view schematically showing the configuration of the light emitting device according to the first embodiment. 1B is a cross-sectional view taken along the line IB-IB in FIG. 1A. FIG. 1C is a partially enlarged cross-sectional view of FIG. 1B. FIG. 2 is a plan view of the light emitting device according to the first embodiment with the resin frame and the first resin omitted. FIG. 3 is a plan view of the light emitting device according to the first embodiment with the first resin omitted.

As shown in FIGS. 1A to 1C, a light emitting device 10 includes a base body 20 in which a first lead 20A and a second lead 20B are supported by a resin member 20C, and a light emitting element 40 placed on the upper surface of the base body 20. A resin frame 50 provided on the upper surface of the base 20 so as to surround the light emitting element 40, a part of a side surface of the light emitting element 40 and a part of an inner side surface of the resin frame 50, which are provided inside the resin frame 50. A first resin 30 containing a reflective material, which covers the upper surface of the base body 20. The first resin 30 includes a reflective material layer 32 containing the reflective material, and a reflective material provided on the upper surface of the reflective material layer 32. And a resin layer 31 that does not include a reflective material layer 32. The reflective material layer 32 has a reflective material disposed so as to cover the upper surface of the base body 20, and the upper surface of the resin layer 31 has a flat region 31A and a base body 20 in cross section. The height h1 from the upper surface of the inclined region 31B increases as it approaches the inner side surface of the resin frame 50. Hereinafter, each configuration will be described.

(Base)
As shown in FIG. 2, the base body 20 has a first lead 20A, a second lead 20B, and a resin member 20C that supports the first lead 20A and the second lead 20B in a separated state. ..
The first lead 20A is, for example, a mounting portion 21A which is formed in a substantially polygonal shape in the center of the base body 20 and on which the light emitting element 40 is mounted, a terminal portion 23A arranged on one end side of the base body 20, and a mounting portion 21A. And a connecting portion 22A that connects the terminal portion 23A with the terminal portion 23A. The width W22 of the connecting portion 22A is smaller than the width W21 of the placing portion 21A and the width W23 of the terminal portion 23A. The width W23 of the terminal portion 23A is wider than the width W21 of the mounting portion 21A and is equal to the base body 20. The connecting portion 22A has a region to which the wire 60 of the light emitting element 40 is connected. Here, in the first lead 20A and the second lead 20B, the width means the maximum length in a direction orthogonal to a straight line connecting the center of the mounting portion 21A and the center of the connecting portion 22A.
The mounting portion 21A is formed into a substantially octagonal shape. Then, the mounting portion 21A has a first side 21A1 having the same length as the width W22 of the connecting portion 22A, a second side 21A2 parallel to and facing the first side 21A1, and a first side 21A1 and a second side 21A2. And a fourth side 21A4 orthogonal to the first side 21A1 and the second side 21A2 and facing the third side 21A3, and an inclined fifth connecting the first side 21A1 and the third side 21A3. The side 21A5, the inclined sixth side 21A6 connecting the first side 21A1 and the fourth side 21A4, the inclined seventh side 21A7 connecting the second side 21A2 and the third side 21A3, the second side 21A2 and the And an inclined eighth side 21A8 connecting the four sides 21A4. Further, the mounting portion 21A has convex portions formed on the third side 21A3 and the fourth side 21A4 so as to project from the side.

The second lead 20B is arranged in such a shape that the intervals between the second side 21A2 and the sixth side 21A6 and the seventh side 21A7 of the mounting portion 21A are substantially constant. The second lead 20B has a width substantially the same as the width W23 of the terminal portion 23A, and one end portion and the other end portion in the longitudinal direction are bent toward the mounting portion 21A side so that the connecting end portion is widened. 20B1, 20B2, etc. are formed. One connection end portion 20B1 has a region on which the protection element 80 is placed. The other connection end portion 20B2 has a region to which the wire 60 of the light emitting element 40 is connected.

In plan view, the area of the first lead 20A is preferably larger than the area of the second lead 20B. Since the light emitting element 40 is mounted on the upper surface of the mounting portion 21A of the first lead 20A, the heat generated by the light emitting element 40 is generated by the first lead due to the large area of the mounting portion 21A of the first lead 20A. It becomes easy to conduct to 20A. Thereby, the temperature rise of the light emitting element 40 can be suppressed, so that the reliability of the light emitting device 10 can be improved.

It is preferable that the end portions of the first lead 20A and/or the second lead 20B have a concave portion or a convex portion. By providing the first lead 20A and/or the second lead 20B and the resin member 20C with a concave portion or a convex portion at a position where the resin member 20C contacts, the first lead 20A and/or the second lead 20B and the resin member 20C, The contact area can be increased. Thereby, the adhesiveness between the first lead 20A and/or the second lead 20B and the resin member 20C can be improved.

The first lead 20A and the second lead 20B are used to apply a voltage from an external power source to electronic components such as the light emitting element 40. The first lead 20A and the second lead 20B are preferably made of a material having a relatively high thermal conductivity. For example, by using a material having a thermal conductivity of about 200 W/(m·K) or more, it becomes easy to conduct the heat generated in the light emitting element 40 to the first lead 20A.

It is preferable that the first lead 20A and the second lead 20B are formed of a material having high strength that is easy to punch and cut. For example, a single layer or a laminated body of a metal such as copper, aluminum, gold, silver, tungsten, iron, nickel or an alloy thereof, phosphor bronze, copper containing iron or the like can be used as the base material. The metal layer of this laminated body may be provided on the entire surfaces of the first lead 20A and the second lead 20B, or may be provided partially. Further, it may be provided only on one of the leads.

The first lead 20A and the second lead 20B may have a reflective film on their surfaces. For the reflective film, one or more metals such as aluminum, copper and gold can be used. In particular, it is preferable to use silver for the reflective film. By doing so, the light extraction efficiency of the light emitting device 10 can be improved.

As a method of forming the reflective film on the first lead 20A and the second lead 20B, various methods such as a plating method, a vapor deposition method, a sputtering method, an ion beam assisted vapor deposition method and the like can be mentioned. The film thickness may be any film thickness that can effectively reflect the light from the light emitting element 40, and is, for example, about 20 nm to 10 μm, preferably about 50 nm to 5 μm, and more preferably about 100 nm to 3 μm. The thickness and shape of the first lead 20A and the second lead 20B can be appropriately set within the range known in the art.

The resin member 20C is provided around the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B. And the second lead 20B. The resin member 20C is, for example, a region (a resin injection area) in which the distance becomes wider as the distance from the connecting portion 22A between the terminal portion 23A and the two inclined fifth sides 21A5 and the sixth side 21A6 of the mounting portion 21A increases. Molding resin is injected into the periphery of the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B. It is formed by filling. In this way, by injecting the molding resin from the resin injecting portion, it is possible to easily fill the molding resin in a region apart from the resin injecting portion, for example, between the second lead 20B and the first lead 20A. it can. Further, since the mounting portion 21A of the first lead 20A has a substantially polygonal shape and the fifth side 21A5, the sixth side 21A6, the seventh side 21A7 and the eighth side 21A8 which are inclined at the corners are provided, It is easy to guide the molding resin around the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B.

Examples of the material of the resin member 20C include epoxy resin, silicone resin, BT resin, polyamide resin, polyimide resin, nylon resin, unsaturated polyester and the like. These resin materials may contain colorants, fillers, reinforcing fibers and the like known in the art. When a white filler such as titanium oxide or zinc oxide is used as the colorant, the light extraction efficiency of the light emitting device can be improved. Further, by containing a black filler such as carbon black having a large thermal radiation coefficient in these resin materials, heat from the light emitting element 40 can be efficiently released. Examples of the filler include silicon oxide and aluminum oxide. Examples of the reinforcing fiber include glass, calcium silicate, potassium titanate and the like.

(Light emitting element 40)
The light emitting element 40 is mounted on the upper surface of the mounting portion 21A of the first lead 20A. The light emitting element 40 is a semiconductor element that emits light by applying a voltage, and has a light emitting surface on the upper surface. The light emitting element 40 preferably includes an element substrate 41 made of sapphire or the like arranged on the base 20 side, and a semiconductor layer 42 provided on the element substrate 41 and made of a nitride semiconductor or the like. The emission wavelength of the light emitting device 40 can be selected from the ultraviolet region to the infrared region depending on the composition of the nitride semiconductor, including the visible region (380 to 780 nm). For example, the light emitting element 40 of the peak wavelength 430 to 490 nm, it can be used as a nitride _{semiconductor, In X Al Y Ga 1-} XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) and the like. Further, the light emitting element 40 may be arranged on the upper surface of the first lead 20A via the submount.

The shape of the light emitting element 40 may be any shape such as a triangle, a quadrangle, a polygon such as a hexagon, or a shape similar to these in a top view. Further, the light emitting element 40 has a single-sided electrode structure in which the n-electrode 43 and the p-electrode 44 are formed on the same surface, or the n-electrode 43 and the p-electrode 44 are formed on two different surfaces (for example, the upper surface and the lower surface). It may have a double-sided electrode structure. The n-electrode 43 and the p-electrode 44 of the light emitting element 40 are connected to the first lead 20A and the second lead 20B via the wires 60, respectively. The n electrode 43 and the p electrode 44 of the light emitting element 40 may be directly connected to the second lead 20B and the first lead 20A, respectively. For the wire 60, a metal material having excellent conductivity such as gold, aluminum, copper or silver can be used.

When the light emitting element 40 is a single-sided electrode, it is mounted face-up on the upper surface of the first lead 20A. The face-up mounting is a mode in which the surface of the light emitting element 40 opposite to the electrode forming surface is mounted on the base body 20. The joint member between the light emitting element 40 and the first lead 20A may be an insulating joint member or a conductive joint member, and a known joint member can be used. For example, the insulating joining member may be an epoxy resin, a silicone resin or a modified resin thereof, and the electrically conductive joining member may be a conductive paste such as silver, gold or palladium, or an Au—Sn eutectic. Examples thereof include solder and brazing material such as low melting point metal.
When the light emitting element 40 is a double-sided electrode, a known joining member may be used as the joining member between the light emitting element 40 and the first lead 20A as long as it is a conductive joining member. For example, as the conductive joining member, a conductive paste such as silver, gold, or palladium, a solder such as Au—Sn eutectic, a brazing material such as a low melting point metal, or the like can be given.

(Resin frame)
As shown in FIG. 3, the resin frame 50 is an annular frame body provided on the upper surface of the base 20 so as to surround the light emitting element 40. The shape of the inner edge and the outer edge of the resin frame 50 may be various shapes such as a circular shape, an elliptical shape, a polygonal shape such as a square shape, a hexagonal shape, an octagonal shape, and a chamfered corner portion of the polygonal shape in a top view. .. Since the resin frame 50 is provided so as to surround the light emitting element 40, the uncured raw material serving as the first resin 30 provided inside the resin frame 50 can be stopped inside the resin frame 50. The resin frame 50 is formed by arranging an uncured raw material, which is a source of the resin frame 50, in a region where the resin frame 50 is to be formed, and curing the raw material.

The resin frame 50 covers the connecting portion between the first lead 20A and the resin member 20C, that is, only the mounting portion 21A of the first lead 20A is exposed inside the resin frame 50, and the resin member 20C is not exposed. It is preferable to be provided as follows. Since the resin member 20C is not exposed inside the resin frame 50, light transmitted through the first resin 30 is not absorbed by the black filler or the like contained in the resin member 20C. As a result, the light transmitted through the first resin 30 is reflected on the upper surface of the mounting portion 21A, and the light extraction property of the light emitting device 10 is improved.
The cross-sectional diameter D (see FIG. 3) of the resin frame 50 is such that the mounting portion 21A of the first lead 20A is exposed inside the resin frame 50 and the first lead 20A is outside the resin frame 50. Also, it is appropriately set so that a part of the second lead 20B and a part of the resin member 20C are exposed.

The cross-sectional shape of the resin frame 50 (see FIG. 1C) is a circular shape including a partial circle, an elliptical shape including a partial ellipse, a rectangular shape, etc., if the first resin 30 in an uncured state can be stopped inside the resin frame 50. Can have various shapes. The cross-sectional shape of the resin frame 50 includes a partial circle having a curved shape in which the inner side surface of the resin frame 50 faces the light emitting element 40 and is convex, and the apex of this convex, that is, the innermost point P of the resin frame 50. A circular shape is preferable. Since the cross-sectional shape of the resin frame 50 is a circular shape including the apex P of the partial circle, the reflector layer 32 of the first resin 30 containing the reflector is formed below the resin frame 50.
Then, the reflective material layer 32 is in a state of entering the lower side of the apex P of the resin frame 50. As a result, the light from the light emitting element 40 that dips into the lower portion of the resin frame 50 is reflected upward by the reflecting material layer 32, which is the light extraction direction, and thus the light extraction performance of the light emitting device 10 is improved.

Examples of the material of the resin frame 50 include phenol resin, epoxy resin, BT resin, PPA and silicone resin. In particular, as the material of the resin frame 50, a silicone resin having excellent light resistance is preferable. In the resin frame 50, it is preferable that the base material resin that is the base material of the resin frame 50 is the same material as the base material resin of the first resin 30. This improves the adhesion between the resin frame 50 and the first resin 30.

The resin frame 50 efficiently disperses powder such as a reflecting material having a larger refractive index than that of the base material resin into the base material resin so that the light from the light emitting element 40 is not easily absorbed. It can reflect light. As the reflecting member, for example, titanium oxide, aluminum oxide, zirconium oxide, or magnesium oxide can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. The resin frame 50 is a member having a reflectance of 60% or more, preferably 70% or more, with respect to the light from the light emitting element 40. By doing so, the light reaching the resin frame 50 is less likely to be absorbed by the resin frame 50, and the light extraction property of the light emitting device 10 is improved.

(First resin)
The first resin 30 is provided inside the resin frame 50, that is, in a region surrounded by the resin frame 50, and forms a part of a side surface of the light emitting element 40, a part of an inner side surface of the resin frame 50, and an upper surface of the base body 20. It is a resin layer which covers and contains a reflective material. Since the first resin 30 covers a part of the side surface of the light emitting element 40 and does not cover the entire side surface, the light emitted laterally from the light emitting element 40 is not blocked and the light extraction property of the light emitting device 10 is reduced. improves. Since the first resin 30 covers a part of the side surface of the resin frame 50, the adhesion between the first resin 30 and the resin frame 50 is improved.

The first resin 30 is a resin that is composed only of a reflective material layer 32 that contains a reflective material, and a base material resin that is provided on the upper surface of the reflective material layer 32 and does not contain a reflective material, that is, a base material resin that is a base of the first resin 30. And a layer 31. The reflecting material layer 32 is formed by sinking the reflecting material in the resin layer 31, and does not have an interface with the resin layer 31. Therefore, the first resin 30 does not consist of two members, the resin layer 31 and the reflector layer 32. Further, for convenience, the portion of the reflective layer 32 that is separated from the resin layer 31 may be referred to as the “upper surface of the reflective layer 32”.

In the reflective material layer 32, a reflective material is arranged so as to cover the upper surface of the base body 20 between the resin frame 50 and the light emitting element 40. As a result, the first resin 30 and the base body 20 are bonded to each other by the reflecting material made of metal particles and the first lead 20A of the base body 20 made of a metal material, so that the first resin 30 and the base body 20 are bonded to each other. Adhesion is improved. Further, when the surface of the first lead 20A forming the base 20 is Ag-plated, the Ag-plated layer is covered with the reflective material layer 32, so that sulfuration of Ag is suppressed.

In the cross-sectional view, the resin layer 31 has a flat area 31A and an inclined area 31B in which the height h1 on the resin frame 50 side from the upper surface of the base body 20 increases as the inner surface of the resin frame 50 approaches. Have. Preferably, the entire side surface of the resin layer 31 on the resin frame 50 side is in contact with the inner side surface of the resin frame 50. Further, it is preferable that the upper surface of the resin layer 31 also has an inclined region 31</b>B in which the height h<b>2 on the light emitting element 40 side from the upper surface of the base body 20 becomes higher as it approaches the side surface of the light emitting element 40 in a cross-sectional view.

In the first resin 30, the upper surface of the resin layer 31 has the inclined region 31B on the resin frame 50 side, and the entire side surface of the resin layer 31 on the resin frame 50 side is in contact with the inner side surface of the resin frame 50. The contact area with the resin layer 31 is increased, and the adhesion between the resin frame 50 and the first resin 30 is improved. Further, in the first resin 30, since the upper surface of the resin layer 31 has the inclined region 31B on the light emitting element 40 side, the contact area between the light emitting element 40 and the resin layer 31 increases, and the light emitting element 40 and the first resin 30. The adhesion with is improved. Further, the inclined regions 31B on the resin frame 50 side and the light emitting element 40 side are preferably curved. When the inclined region 31B has a curved shape, there is no portion where stress concentrates, and the adhesiveness is further improved.
The height h1 of the resin layer 31 from the base body 20 is preferably higher than the height h2 of the resin layer 31 from the base body 20. As a result, the contact area between the resin frame 50 and the resin layer 31 is further increased, and thus the adhesion between the resin frame 50 and the first resin 30 is further improved.
The inclination degree of the inclined region 31B of the resin layer 31 on the resin frame 50 side is preferably an inclination angle of 30 to 60 degrees. The same applies to the degree of inclination of the inclined region 31B on the light emitting element 40 side. When the inclination degree of the inclined region 31B is as described above, the contact area between the first resin 30 and the resin frame 50 or the light emitting element 40 is increased, so that the adhesion is improved.

The upper surface of the reflective material layer 32 is preferably flat in a sectional view. That is, it is preferable that the upper surface of the reflector layer 32 has a constant thickness along the upper surface of the base body 20. The reflective material layer 32 contains a reflective material having poor adhesion to the resin frame 50. On the other hand, since the base of the resin layer 31 is made of resin, the resin layer 31 has excellent adhesion to the resin frame 50. Therefore, when the upper surface of the reflective material layer 32 is flat, the reflective material layer 32 enters between the partial circle and the upper surface of the base body 20 below the apex P of the resin frame 50. As a result, the end portion of the reflective material layer 32 enters the lower portion of the resin frame 50, and the reflective material layer 32 is less likely to peel off. Further, if the upper surface of the reflective material layer 32 is flat in a sectional view, the reflective surface becomes higher as the upper surface of the reflective material layer 32 gets closer to the inner side surface of the resin frame 50 like the upper surface of the resin layer 31. The area where the material layer 32 contacts the resin frame 50 can be reduced. Therefore, since the resin layer 31 can increase the area in contact with the resin frame 50, the adhesion between the first resin 30 and the resin frame 50 is improved.

When the light emitting element 40 includes the element substrate 41 arranged on the base 20 side and the semiconductor layer 42 provided on the element substrate 41, the upper surface of the first resin 30 covering the side surface of the light emitting element 40, that is, the light emitting element 40. The height h2 of the upper surface of the side inclined region 31B from the base 20 is preferably lower than the lower surface of the semiconductor layer 42. As a result, the light emitted laterally from the light emitting element 40 is not blocked, so that the light extraction properties of the light emitting device 10 are further improved.

When the inner surface of the resin frame 50 has a curved shape that is convex toward the side facing the light emitting element 40, the upper surface of the inclined region 31</b>B of the first resin 30 that covers the inner surface of the resin frame 50 is located above the base body 20. The height h1 is preferably lower than the apex P of the curved shape. As a result, the lifting of the first resin 30 from the base 20 can be suppressed, so that the adhesion between the first resin 30 and the base 20 is further improved.

The first resin 30 is a resin layer in which a base material resin contains a reflective material. Examples of the base material resin include phenol resin, epoxy resin, BT resin, PPA, and silicone resin. In particular, the base material resin is preferably a silicone resin having excellent light resistance. For the resin frame 50 and the first resin 30, it is preferable that the base resin that is the base of the first resin 30 is the same material as the base resin of the resin frame 50. This improves the adhesion between the resin frame 50 and the first resin 30.

The first resin 30 efficiently disperses powder such as a reflective material having a larger refractive index than that of the base material resin in the base material resin so that the light from the light emitting element 40 is not absorbed. The light of can be reflected. As the reflecting material, for example, titanium oxide, aluminum oxide, zirconium oxide, or magnesium oxide can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. The reflective material is a material having a reflectance of 60% or more, preferably 70% or more, with respect to the light from the light emitting element 40. By doing so, the light reaching the first resin 30 is less likely to be absorbed by the first resin 30, and the light extraction property of the light emitting device 10 is improved.

In the description of the light emitting device 10, the light emitting device 10 including one light emitting element 40 has been described. However, in the light emitting device 10 of the embodiment, a plurality of light emitting elements 40 may be used and the resin frame 50 may be formed so as to collectively surround the plurality of light emitting elements 40. Further, as shown in FIG. 1A, the light emitting device 10 of the embodiment may include a protection element 80.
The protection element 80 blocks a current flowing in the reverse direction when a reverse voltage is applied to the light emitting element 40, or when a forward voltage higher than the operating voltage of the light emitting element 40 is applied, for example. In addition, it prevents an overcurrent from flowing through the light emitting element 40. Examples of the protection element 80 include a protection circuit and an electrostatic protection element, and specifically, a Zener diode can be used.

In the light emitting device 10, since the light emitted from the light emitting element 40 to the side is reflected upward in the light extraction direction by providing the first resin 30 containing the reflection material, the light extraction performance is improved. improves. Since the first resin 30 covers a part of the side surface of the light emitting element 40, the light emitted from the light emitting element 40 is not blocked, so that the light extraction property is further improved. Further, the first resin 30 has the reflecting material layer 32, and the reflecting material is arranged by the reflecting material layer 32 so as to cover the upper surface of the base body, so that the reflecting material layer 32 and the base body 20 are metal-metal bonded. Since the reflector layer 32 plays a role of an intervening layer with respect to the base body 20, the adhesion between the first resin 30 and the base body 20 is improved. Further, since the first resin 30 has the resin layer 31 and the upper surface of the resin layer 31 has the inclined region 31B, the contact area between the resin layer 31 and the inner side surface of the resin frame 50 increases, so The adhesion between the resin 30 and the resin frame 50 is improved.

<Method of manufacturing light emitting device>
Next, a method of manufacturing the light emitting device according to the first embodiment will be described.
FIG. 4 is a flowchart showing the flow of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5A is a cross-sectional view taken along the line VA-VA in FIG. 2, and is a cross-sectional view schematically showing the base body on which the light emitting element is mounted in the first step of the method for manufacturing the light emitting device according to the first embodiment. .. FIG. 5B is a cross-sectional view taken along the line VB-VB of FIG. 3, and is a cross-sectional view schematically showing the base body on which the resin frame is formed in the second step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5C is a cross-sectional view schematically showing the base body into which the first resin has been injected in the third step of the method for manufacturing the light emitting device according to the first embodiment. FIG. 5D is a cross-sectional view schematically showing a method of separating the first resin into a resin layer and a reflective material layer in the fourth step of the method for manufacturing the light emitting device according to the first embodiment.

As shown in FIGS. 4 and 5A to 5D, in the method for manufacturing the light emitting device 10, the light emitting element 40 is mounted on the upper surface of the base body 20 in which the first lead 20A and the second lead 20B are supported by the resin member 20C. And a second step S2 of forming a resin frame 50 on the upper surface of the base 20 so as to surround the light emitting element 40, and the first resin 30 forms a part of the side surface of the light emitting element 40 and the resin frame 50. A third step S3 of injecting the first resin 30 containing a reflecting material into the inside of the resin frame 50 so as to cover a part of the inner side surface and the upper surface of the base body 20, and a centrifugal force due to revolution is applied to the base body 20. And a fourth step S4 of separating the first resin 30 into a reflective material layer 32 containing a reflective material and a resin layer 31 not containing a reflective material.

(First step)
As shown in FIG. 5A, the first step S1 is a step of placing the light emitting element 40 on the upper surface of the base body 20 in which the first lead 20A and the second lead 20B are supported by the resin member 20C. Preferably, the light emitting element 40 is mounted on the mounting portion 21A of the first lead 20A.
In the first step S1, the light emitting element 40 is mounted on the base body 20 by a known method, and the lower surface of the light emitting element 40 on the element substrate 41 side and the upper surface of the base body 20 are bonded using a known bonding member. Next, the n electrode 43 of the light emitting element 40 is electrically connected to the first lead 20A via the wire 60. Although not shown, the p electrode 44 of the light emitting element 40 is electrically connected to the second lead 20B via the wire 60. The protection element 80 (not shown) may be electrically connected to the first lead 20A via the wire 60. As a wire bonding method, a known method such as ball bonding or wedge bonding may be used.

(Second step)
As shown in FIG. 5B, the second step S2 is a step of forming the resin frame 50 on the upper surface of the base 20 so as to surround the light emitting element 40. In the second step S2, the base material resin, which is the base material of the resin frame 50, is placed in an uncured state on the upper surface of the base body 20 in a region where the resin frame 50 is to be formed by a known method, and the base material resin is cured. Thus, the resin frame 50 is formed. The viscosity of the base material resin is adjusted in advance so that the resin frame 50 has a frame shape after being cured.

(Third step)
As shown in FIG. 5C, in the third step S3, the resin frame 50 is formed so that the first resin 30 covers a part of the side surface of the light emitting element 40, a part of the inner side surface of the resin frame 50, and the upper surface of the base body 20. Is a step of injecting the first resin 30 containing the reflecting material into the inside of the.
In the third step S3, the base material resin that is the base material of the first resin 30 is injected into the inside of the resin frame 50 in an uncured state by potting, spraying, or the like. The injection amount of the base material resin is adjusted so as not to reach the semiconductor layer of the light emitting element 40. After that, the base material resin is cured after performing the following fourth step. In addition, in the third step S3, when injecting the uncured base material resin into the inside of the resin frame 50, the nozzle 90 is arranged directly above the resin frame 50, and the uncured base material resin is stored in the resin frame 50. It is preferable to inject so as to flow along the inner side surface to the upper surface of the substrate 20 and the side surface of the light emitting element 40. The injection of the uncured base material resin may be performed from the center of the upper surface of the base body 20.

When the base material resin is injected from the resin frame 50 side in this way, the upper surface of the base material resin is different due to the difference in wettability with respect to the base material resin between the upper surface of the base body 20 and the inner side surfaces of the resin frame 50 and the side surfaces of the light emitting element 40. In addition, the inclined regions 31B that creep up with respect to the inner surface of the resin frame 50 and the side surfaces of the light emitting element 40 are formed on both sides of the flat region 31A formed immediately above the base 20, that is, on the resin frame 50 side and the light emitting element 40 side. To be done. The inner side surface of the resin frame 50 and the side surface of the light emitting element 40 have higher wettability than the upper surface of the base body 20 which is a metal surface, that is, the first lead 20A due to a difference in glossiness and the like. Further, the inner side surface of the resin frame 50 may be dipped in an organic solvent before injecting the uncured base material resin. By preliminarily immersing the inner surface of the resin frame 50 with the organic solvent, the creeping up of the inclined region 31B can be promoted. The shape and the like of the inclined region 31B is adjusted by the viscosity and the like of the base material resin to be injected.

(Fourth step)
As shown in FIG. 5D, in the fourth step S4, a centrifugal force due to revolution is applied to the base body 20, and the first resin 30 is provided with a reflecting material layer 32 containing a reflecting material, a resin layer 31 not containing the reflecting material, It is a step of separating into.
In the fourth step S4, the substrate 20 is revolved so that the upper surface of the substrate 20 has the rotation axis S. Centrifugal force is applied to the rotation axis S so that the upper surface of the base body 20 is located inside. The rotation axis S on the upper surface side of the base body 20 is parallel to the upper surface of the base body 20, crosses the resin frame 50, and is located above the base body 20. Due to the revolution of the base 20, the reflecting material contained in the first resin 30 is forcibly settled on the upper surface side of the base 20. That is, the reflective material is arranged in layers so as to cover the upper surface of the base body 20. The shape of the upper surface of the reflective material layer 32 can be adjusted by the magnitude of centrifugal force determined by the rotation speed and the like, and the upper surface of the reflective material layer 32 is preferably flat. In the fourth step S4, the base body 20 may be rotated in the rotation direction so that the base body 20 has a rotation axis in a direction perpendicular to the center of the length direction of the base body 20 after the rotation in the revolution direction. By this rotation in the rotation direction, the heights h1 and h2 (see FIG. 1C) of the inclined region 31B of the resin layer 31 from the base body 20 can be formed higher.
Further, the rising of the inclined region 31B also occurs when the first resin 30 is cured after the fourth step S4.

In the method of manufacturing the light emitting device 10, the resin frame is formed by performing the third step S3 of injecting the first resin 30 and the fourth step S4 of separating the first resin 30 into the reflective material layer 32 and the resin layer 31. Since the first resin 30 having the resin layer 31 that covers the inclined region 31</b>B that covers a part of the inner side surface of the reflector 50 and the reflector layer 32 that has the reflector disposed so as to cover the upper surface of the base body 20 can be formed. It is possible to manufacture the light emitting device 10 having excellent take-out property and adhesion. Hereinafter, each step will be described.
[Second Embodiment]
<Light emitting device>
First, the light emitting device according to the second embodiment will be described. FIG. 6 is a cross-sectional view schematically showing the configuration of the light emitting device according to the second embodiment. The same components as those of the light emitting device according to the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

10 A of light-emitting devices are provided with the 2nd resin 70 which covers the upper surface of the light emitting element 40 and the upper surface of the 1st resin 30 in addition to the same structure as the said light-emitting device 10. Further, in the light emitting device 10A, the second resin 70 preferably contains a phosphor.

(Second resin 70)
The second resin 70 is a resin layer that covers the upper surface of the semiconductor layer 42 of the light emitting element 40 and the upper surface of the resin layer 31 of the first resin 30, and has a height that does not exceed the height of the resin frame 50 in a sectional view. It is provided so as to contact the inner surface of 50.
As the material of the second resin 70, a resin material having a light-transmitting property, a glass material, or the like can be used. In particular, it is preferable to use a resin material as the material of the second resin 70. Since the first resin 30 and the resin frame 50 each contain a resin material, the second resin 70 is also a resin material, so that the adhesion between the second resin 70 and the first resin 30 and the second resin The adhesion between 70 and the resin frame 50 can be improved. As the resin material of the second resin 70, a polycarbonate resin, an epoxy resin, a phenol resin, a silicone resin, an acrylic resin, a polymethylpentene resin, a polynorbornene resin, or a modified resin thereof or a hybrid resin containing at least one of these resins is used. Etc. can be used. In particular, as the material of the second resin 70, a dimethyl-based silicone resin and a phenyl-based silicone resin having excellent light resistance are preferable. The second resin 70 preferably contains a phosphor and may contain a light diffusing agent. When the second resin 70 contains a phosphor, the shape of the upper surface of the second resin 70 is such that the center is downward so that the distance between the phosphor and the light emitting element 40 is close in consideration of light emission efficiency. A curved shape is preferable.

(Phosphor)
As the phosphor, particles of a phosphor that can be excited by light from the light emitting element 40 and convert the wavelength of light emitted from the light emitting element 40 or reflected by the first resin 30 are used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, a cerium-activated yttrium-aluminum-garnet-based phosphor (YAG:Ce), a cerium-activated lutetium-aluminum-garnet-based phosphor (LAG: Ce), europium and / or chromium activated nitrogen containing calcium aluminosilicate-based phosphor _{(CaO-Al 2 O 3 -SiO} 2: Eu, Cr), activated with europium silicate phosphor (( Sr,Ba) ₂ SiO ₄ :Eu), β-sialon phosphors, CASN-based phosphors, nitride-based phosphors such as SCASN-based phosphors; fluoride-based phosphors such as KSF-based phosphors, sulfide-based phosphors , Chloride-based phosphors, silicate-based phosphors, phosphate-based phosphors, quantum dot phosphors, and the like. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, the light emitting device 10 with various wavelengths can be manufactured.

(Light diffuser)
As the material of the light diffusing agent, titanium oxide, zirconium oxide, aluminum oxide, silicon oxide or the like can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index.

By providing the second resin 70 in the light emitting device 10A, it is possible to prevent dust and the like from entering the light emitting device 10A from the outside, and improve reliability. Further, in the light emitting device 10A, since the second resin 70 contains the phosphor, the wavelength of the light emitted from the light emitting element 40 or reflected by the first resin 30 can be converted, so that the color tone of the extracted light can be adjusted. In particular, when the first resin 30 has the inclined region 31B, the distance between the phosphor of the second resin 70 and the light emitting element 40 becomes short, so that the luminous efficiency is improved. Further, when the resin frame 50 has a curved cross-sectional shape and the resin layer 31 is formed right below the apex P of the resin frame 50, the phosphor of the second resin 70 does not enter the lower portion of the resin frame 50. Therefore, the emission efficiency of the extracted light is improved.

<Method of manufacturing light emitting device>
Next, a method of manufacturing the light emitting device according to the second embodiment will be described. FIG. 7 is a flowchart showing the flow of the method for manufacturing the light emitting device according to the second embodiment. Note that the same steps as those in the method for manufacturing the light emitting device according to the first embodiment are denoted by the same reference numerals as those in the first embodiment, and description thereof will be omitted.

The manufacturing method of the light emitting device 10A further includes a fifth step S5 of injecting the second resin, in addition to the same steps S1 to S4 as those of the manufacturing method of the light emitting device 10. In the method for manufacturing the light emitting device 10A, by including the fifth step S5, the reliability of the light emitting device 10A and the color tone adjustability of the extracted light are improved.

(Fifth step)
The fifth step S5 is a step of injecting the second resin 70 inside the resin frame 50 so that the second resin 70 covers the upper surface of the light emitting element 40 and the upper surface of the resin layer 31 of the first resin 30. Preferably, the second resin 70 is injected so that the inner surface of the resin frame 50 contacts the second resin 70. The method of injecting the second resin 70 is performed by potting, spraying or the like as in the case of the first resin 30.
Although the second resin 70 is described as being formed so that the center thereof is curved downward, as an example, the second resin 70 may be formed to have the same height. Further, the second resin 70 may be formed such that the center thereof is curved upward so that the second resin 70 becomes higher directly above the light emitting element 40.

[Third Embodiment]
<Light emitting device>
Next, the light emitting device according to the third embodiment will be described. FIG. 8A is a perspective view schematically showing the configuration of the light emitting device according to the third embodiment. FIG. 8B is a plan view schematically showing the configuration of the light emitting device according to the third embodiment. FIG. 8C is a sectional view schematically showing a section taken along line VIIIC-VIIIC of FIG. 8B.
The light emitting device 10B includes a base material 200 having a base material 201 and a wiring layer 202 formed on the top surface of the base material 201, a light emitting element 40 mounted on the top surface of the base material 200, and surrounding the light emitting element 40. A resin frame 50 provided on the upper surface of the base body 200, a part of the side surface of the light emitting element 40, a part of the inner side surface of the resin frame 50, and the upper surface of the base body 200, which are provided inside the resin frame 50. A first resin 30 containing a reflective material. The first resin 30 has a reflective material layer 32 containing a reflective material, and a resin layer 31 provided on the upper surface of the reflective material layer 32 and containing no reflective material. Further, in the reflector layer 32, a reflector is arranged so as to cover the upper surface of the base body 200, and the upper surface of the resin layer 31 has a flat region 31A and a height from the upper surface of the base body 200 in the resin frame 50 in a cross-sectional view. And an inclined region 31B that becomes higher toward the inner surface of the.
The light emitting device 10B basically has the same configuration as the light emitting device 10, and the configuration of the base body 200 is different. Therefore, different parts will be mainly described, and other already described parts will be appropriately omitted.

The base body 200 has a base material 201 formed of ceramic or the like, and a wiring layer 202 formed on the upper surface of the base material. The light emitting elements 40 are arranged in alignment with the mounting area at the center of the base body 200. A wiring layer 202 is formed around the light emitting element 40, and a resin frame 50 is provided so as to cover a circular portion of the wiring layer 202.
The base material 201 is formed of an insulating member in a plate shape. Here, the base material 201 is preferably a material having a high heat dissipation property, and more preferably a material having a high light-shielding property and substrate strength. Specifically, ceramics such as alumina, aluminum nitride and mullite, phenol resin, epoxy resin, polyimide resin, resin such as BT resin (bismaleimide triazine resin) and polyphthalamide (PPA), metal (aluminum, copper, etc.), Further, a composite material composed of a resin and a metal or a ceramic may be mentioned. When a material having high transparency is used as the base material 201, a known light shielding material is contained so as to have a light shielding property.

The wiring layer 202 surrounds an arrangement region in which the plurality of light emitting elements 40 are arranged in a ring shape, and has a positive electrode pad wiring electrode 202A1 on the anode side and a negative electrode pad wiring electrode 202B1 on the cathode side that electrically connect to the outside. Are formed on the base material 201 so as to have The positive electrode pad wiring electrode 202A1 and the negative electrode pad wiring electrode 202B1 are formed in a rectangular shape and have a wiring area larger than that of other wiring portions so as to be easily electrically connected from the outside. Then, the extension wiring 202A2 is continuously formed on the positive electrode pad wiring electrode 202A1, and further, the first connection wiring 202A3 is formed in an arc shape continuously from the extension wiring 202A2. Similarly, the extended wiring 202B2 is continuously formed on the negative electrode pad wiring electrode 202B1, and the second connection wiring 202B3 is formed in an arc shape continuously from the extended wiring 202B2. Then, the first connection wiring 202A3 and the second connection wiring 202B3 are intermittently arranged in an annular shape with a plurality of other third connection wirings 202C1 to 202C4 formed in an arc shape. The third connection wirings 202C1 to 202C4 are formed in four arc-shaped wirings here. The third connection wirings 202C1 to 202C4 may be an intermittent wiring as a whole together with the first connection wiring 202A3 and the second connection wiring 202B3, and the first connection wiring 202A3 and the second connection wiring 202B3. Depending on the length of the arc shape, one may be formed or a state in which none is formed. The wiring layer 202 (the positive electrode pad wiring electrode 202A1, the extended wiring 202A2, the first connection wiring 202A3, the negative electrode pad wiring electrode 202B1, the extended wiring 202B2, the second connection wiring 202B3, the third connection wirings 202C1 to 202C4) is, for example, It can be formed using a metal such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe or Ni, or an alloy containing these. Such wiring can be formed by printing, electrolytic plating, electroless plating, vapor deposition, sputtering or the like. When the base material 201 is a metal, an insulating layer such as glass epoxy may be formed between the base material 201 and the wiring layer 202.

The resin frame 50 is formed in an annular shape and covers the upper surfaces of the first connection wiring 202A3, the second connection wiring 202B3, and the third connection wirings 202C1 to 202C4. The resin frame 50 has the same structure and material as those already described.
The first resin 30 is provided inside the resin frame 50, that is, in a region surrounded by the resin frame 50, and forms a part of a side surface of the light emitting element 40, a part of an inner side surface of the resin frame 50, and an upper surface of the base body 200. It is a resin layer which covers and contains a reflective material. The first resin 30 is also formed with the structure and material already described.
A plurality of light emitting elements 40 are installed in the resin frame 50 of the base body 200, and are connected to any of the first wiring electrode 202A3, the second wiring electrode 202B3, or the third wiring electrodes 202C1 to 202C4 by a wire.
Furthermore, on the upper surface of the base body 200, an electrode identification mark M10 for distinguishing between the cathode and the anode may be formed, and a plurality of reference marks M11 to be a reference when the resin frame 50 is provided may be formed.
Note that other configurations, for example, the second resin 70 may be provided so as to cover the light emitting element 40 and the first resin 30 in the resin frame 50, are the same as the configurations already described.
The light emitting device 10B thus formed has the same effects as the light emitting devices 10 and 10A described above.

<Method of manufacturing light emitting device>
Next, a method of manufacturing the light emitting device 10B will be described. The light emitting device 10B is manufactured by the same manufacturing process as the manufacturing method already described with reference to FIG.
The manufacturing method of the light emitting device 10B includes a first step S1 of mounting the light emitting element 40 on the upper surface of the base body 200, and a first connection wiring 202A3 and a second connection wiring on the upper surface of the base body 200 so as to surround the light emitting element 40. The second step S2 of forming the resin frame 50 so as to cover the upper surfaces of the 202B3 and the third connection wirings 202C1 to 202C4 in an annular shape, and injecting the first resin 30 containing the reflecting material into the inner side surface of the resin frame 50. A third step in which the first resin 30 covers a part of the side surface of the light emitting element 40, a part of the inner side surface of the resin frame 50, and the upper surface of the base body 200, and a centrifugal force due to revolution is applied to the base body 200. It is formed so as to include a fourth step S4 of separating the first resin 30 into a reflective material layer 32 containing a reflective material and a resin layer 31 not containing the reflective material. In the first step of mounting the light emitting element 40, the light emitting element 40, the first connection wiring 202A3, the second connection wiring 202B3, and the third connection wirings 202C1 to 202C4 are connected via wires so that they can be electrically connected. Will be done. Then, since each step performs the same operation as each step already described, the description thereof will be omitted.

In the above-described embodiment, the mode for carrying out the invention was described more specifically, but the gist of the present invention is not limited to these descriptions, and based on the description of the claims of the present invention. It must be widely interpreted. Further, it goes without saying that various changes and modifications based on these descriptions are also included in the spirit of the present invention.

10, 10A, 10B Light emitting device 20, 200 Base 20A First lead 21A Mounting portion 21A1 First side 21A2 Second side 21A3 Third side 21A4 Fourth side 21A5 Fifth side 21A6 Sixth side 21A7 Seventh side 21A8 Eighth Side 22A Connection portion 23A Terminal portion 20B Second lead 20C Resin member 30 First resin 31 Resin layer 31A Flat area 31B Slope area 32 Reflective material layer 40 Light emitting element 41 Element substrate 42 Semiconductor layer 43 n electrode 44 p electrode 50 Resin frame 60 Wire 70 Second resin 80 Protective element 201 Base material 202 Wiring layer S1 First step S2 Second step S3 Third step S4 Fourth step S5 Fifth step

Claims (13)

A base body in which the first lead and the second lead are supported by a resin member,
A light emitting element mounted on the upper surface of the base;
A resin frame provided on the upper surface of the base so as to surround the light emitting element,
A first resin that is provided inside the resin frame and covers a part of a side surface of the light emitting element, a part of an inner side surface of the resin frame, and an upper surface of the base body;
The first resin has a reflective material layer containing the reflective material, and a resin layer provided on the upper surface of the reflective material layer and not containing the reflective material,
The reflective material layer is arranged such that the reflective material covers the upper surface of the base.
A light emitting device having an upper surface of the resin layer, in a cross-sectional view, having a flat area and an inclined area whose height from the upper surface of the base body increases as the height approaches the inner side surface of the resin frame. A base having a base material and a wiring layer formed on the upper surface of the base material;
A light emitting element mounted on the upper surface of the base;
A resin frame provided on the upper surface of the base so as to surround the light emitting element,
A first resin that is provided inside the resin frame and covers a part of a side surface of the light emitting element, a part of an inner side surface of the resin frame, and an upper surface of the base body;
The first resin has a reflective material layer containing the reflective material, and a resin layer provided on the upper surface of the reflective material layer and not containing the reflective material,
The reflective material layer is arranged such that the reflective material covers the upper surface of the base.
A light emitting device having an upper surface of the resin layer, in a cross-sectional view, having a flat area and an inclined area whose height from the upper surface of the base body increases as the height approaches the inner side surface of the resin frame. The light emitting device according to claim 1, wherein the entire side surface of the resin layer on the resin frame side is in contact with the resin frame. The light emitting element includes an element substrate arranged on the base side, and a semiconductor layer provided on the element substrate,
The upper surface of the first resin that covers the side surface of the light emitting element has a height from the base that is lower than a height of a lower surface of the semiconductor layer in cross-section, according to any one of claims 1 to 3. Light emitting device. The light emitting device according to claim 1, further comprising: a second resin that covers an upper surface of the light emitting element and an upper surface of the first resin. The light emitting device according to claim 5, wherein the second resin contains a phosphor. The light emitting device is mounted on the upper surface of the first lead,
The light emitting device according to claim 1, wherein the resin frame is provided so as to cover a connecting portion between the first lead and the resin member. The light emitting device according to claim 1, wherein the reflective material is titanium oxide. The light emitting device according to claim 1, wherein the resin frame and the first resin contain a base material resin of the same material. The light emitting device according to claim 1, wherein an inner side surface of the resin frame has a curved shape that is convex toward a side facing the light emitting element in a cross-sectional view. The light emitting device according to claim 10, wherein an upper surface of the first resin covering an inner side surface of the resin frame has a height from an upper surface of the base body lower than a position of an apex of the curved shape in a cross-sectional view. A first step of mounting the light emitting element on the upper surface of the substrate,
A second step of forming a resin frame on the upper surface of the base so as to surround the light emitting element;
A first resin containing a reflecting material is injected into the inside of the resin frame, and the first resin covers a part of a side surface of the light emitting element, a part of an inner side surface of the resin frame, and an upper surface of the base. And the third step,
A fourth step of applying a centrifugal force to the substrate by revolution to separate the first resin into a reflective material layer containing the reflective material and a resin layer not containing the reflective material. Production method. 13. The method of manufacturing a light emitting device according to claim 12, further comprising a fifth step of injecting a second resin on the upper surface of the light emitting element and the upper surface of the resin layer after the fourth step.

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