JP2020022287A - Power conversion device - Google Patents

Abstract

To provide a power conversion device capable of suppressing thermal interference between heating components, even if the power conversion device is reduced in height, and downsized.SOLUTION: A power conversion device 5 has a cooling mechanism cooling a plurality of heating components (a capacitor unit 102, a semiconductor module 110, and a reactor unit 120) which heat during an operation. Further, power terminals 114 and 130 provided for the semiconductor module 110 and the reactor unit 120 respectively project from sides other than sides facing each other, and are provided so that respective projection directions may be different. Since a length of a bus bar connecting the power terminals 114 and 130 of the semiconductor module 110 and the reactor unit 120 can be made long, mutual thermal interference can be suppressed.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a power converter that converts a DC current into an AC current while transforming a voltage from a DC power supply.

  An example of the above-described power conversion device is disclosed in Patent Document 1, for example. In the power conversion device of Patent Document 1, a stacked body in which a plurality of semiconductor modules in which semiconductor elements are sealed and a cooling pipe are stacked is housed in a case. The laminate is fixed to the bottom surface of the case, and the power terminals (positive terminal, negative terminal, and AC terminal) of each semiconductor module are projected from the side opposite to the fixed side, and these power terminals are connected to bus bars. It is electrically connected to a capacitor and a reactor via the same.

Japanese Patent No. 6119419

  Here, in order to improve the mountability of the power conversion device on a vehicle or the like, demands for a reduction in height and a reduction in size have been increasing. When the height and size of the power converter are reduced, the space between components that generate heat during operation, such as a semiconductor module, a capacitor, and a reactor, is reduced. As a result, there is a problem that the components that generate heat are susceptible to mutual heat generation (thermal interference), making it difficult to perform sufficient heat radiation.

  The present invention has been made in view of the above points, and provides a power conversion device capable of suppressing thermal interference between heat-generating components even when the power conversion device is reduced in height and size. Aim.

In order to achieve the above object, a power converter (5) according to the present invention converts a DC current into an AC current while transforming a voltage from a DC power supply,
A case (100) for accommodating a plurality of electric components constituting the power converter,
A cooling mechanism that cools a plurality of heat-generating components (102, 110, 120) out of the plurality of electric components during operation.
At least the first heat generating component (110) and the second heat generating component (120) among the plurality of heat generating components are arranged in the case along a direction orthogonal to the depth direction of the case, and each of the first heat generating component (110) and the second heat generating component (120) is arranged in the case. Having power terminals (114, 130) protruding from the heat-generating component;
A bus bar (136) for connecting power terminals of the first and second heat generating components;
At least one of the power terminals of the first and second heat generating components protrudes from a side other than the sides of the first and second heat generating components opposite to each other. It is different.

  As described above, the power converter according to the present invention includes the cooling mechanism that cools the plurality of heat-generating components that generate heat during operation. Therefore, even if the first and second heat-generating components generate heat during operation, the heat itself can be reduced.

  As described above, the first and second heat generating components are cooled by the cooling mechanism, but still do not stop generating heat during operation. When heat is generated in one of the heat-generating components, the heat is transmitted to the other heat-generating components through the power terminal and the bus bar, which are easily transferred. However, in the power converter according to the present invention, at least one of the power terminals of the first and second heat generating components protrudes from a side other than the side facing each other, and the power terminal protruding direction of the first and second heat generating components. Are provided differently. For this reason, even if the first and second heat generating components are arranged in the case along a direction orthogonal to the depth direction of the case, the power terminals of the first and second heat generating components are connected. The length of the bus bar can be increased. As a result, heat transfer between the first and second heat generating components can be suppressed, and thermal interference can be suppressed.

  Furthermore, in the power converter according to the present invention, at least one of the power terminals of the first and second heat generating components protrudes from a side other than the side facing each other, and the respective power terminals protrude in different directions. Local temperature rise inside the case due to radiant heat from each power terminal can also be suppressed.

  The reference numbers in the parentheses are merely an example of a correspondence relationship with a specific configuration in the embodiment described later in order to facilitate understanding of the present disclosure, and are intended to limit the scope of the invention. It was not done.

  Further, technical features described in each claim of the claims other than the above-described features will be apparent from the description of the embodiments and the accompanying drawings described later.

It is a figure showing the schematic structure of the drive system of the vehicle to which the power converter concerning an embodiment is applied. It is a cross-sectional view of a power converter. FIG. 3 is a cross-sectional view along the line III-III in FIG. 2.

  Hereinafter, a power converter according to an embodiment of the present invention will be described with reference to the drawings. The power converter according to the present embodiment is applicable to vehicles such as an electric vehicle (EV) and a hybrid vehicle (HV). Hereinafter, an example applied to a hybrid vehicle will be described.

<Vehicle drive system>
First, a schematic configuration of a vehicle drive system 1 to which the power converter 5 is applied will be described with reference to FIG. As shown in FIG. 1, the vehicle drive system 1 includes a DC power supply 2, motor generators 3 and 4, and a power conversion device 5 that performs power conversion between the DC power supply 2 and the motor generators 3 and 4. I have.

  The DC power supply 2 is a chargeable / dischargeable secondary battery such as a lithium ion battery or a nickel hydride battery. Motor generators 3 and 4 are three-phase AC type rotating electric machines. The motor generator 3 functions as a generator (alternator) that is driven by an engine (not shown) to generate power and a motor (starter) that starts the engine. The motor generator 4 functions as a traveling drive source of the vehicle, that is, an electric motor. Also, it functions as a generator during regeneration. The vehicle includes an engine and a motor generator 4 as a traveling drive source.

<Circuit configuration of power converter>
Next, a circuit configuration of the power conversion device 5 will be described. As shown in FIG. 1, the power conversion device 5 includes a converter 6, inverters 7 and 8, a control circuit unit 9, a smoothing capacitor C1, a filter capacitor C2, and the like. The converter 6 and the inverters 7 and 8 are power conversion units. Converter 6 is a DC-DC converter that converts a DC voltage into a DC voltage having a different value, and inverters 7 and 8 are DC-AC converters. These power converters include upper and lower arm circuits 10, respectively.

  The upper and lower arm circuit 10 has switching elements Q1, Q2 and diodes D1, D2. In the present embodiment, n-channel IGBTs are used as the switching elements Q1 and Q2. The upper arm 10U includes a switching element Q1 and a reflux diode D1 connected in anti-parallel. The lower arm 10L includes a switching element Q2 and a reflux diode D2 connected in anti-parallel. Note that the switching elements Q1 and Q2 are not limited to IGBTs. For example, a MOSFET can be employed. Parasitic diodes can also be used as the diodes D1 and D2.

  The upper arm 10U and the lower arm 10L are connected in series between the VH line 12H and the N line 13 with the upper arm 10U facing the VH line 12H. The P line 12, which is a power line on the high potential side, has a VL line 12L in addition to the VH line 12H described above. The VL line 12L is connected to the positive terminal of the DC power supply 2. The converter 6 is provided between the VL line 12L and the VH line 12H, and the potential of the VH line 12H is equal to or higher than the potential of the VL line 12L. The N line 13 is connected to the negative electrode of the DC power supply 2 and is a low-potential-side power line, which is also called a ground line. As described above, the upper arm 10U and the lower arm 10L are connected in series between the power lines on the high potential side and the low potential side, and the upper / lower arm circuit 10 is configured. Each of the semiconductor modules 110 described below includes one upper and lower arm circuit 10.

  The collector electrode of the switching element Q1 is connected to the VH line 12H, and the emitter electrode of the switching element Q2 is connected to the N line 13. The emitter electrode of switching element Q1 and the collector electrode of switching element Q2 are connected.

  The filter capacitor C2 is connected between the VL line 12L and the N line 13. The filter capacitor C2 is connected in parallel to the DC power supply 2. Filter capacitor C2 removes power supply noise from DC power supply 2, for example. Since the filter capacitor C2 is arranged on a lower voltage side than the smoothing capacitor C1, it is also referred to as a low voltage side capacitor. A system main relay (SMR) (not shown) is provided between at least one of the N line 13 and the VL line 12L between the DC power supply 2 and the filter capacitor C2.

  Converter 6 has upper and lower arm circuit 10 described above and reactor R1. The upper and lower arm circuits 10 are connected between the VH line 12H and the N line 13. One end of reactor R1 is connected to VL line 12L, and the other end is connected to a connection point between upper arm 10U and lower arm 10L via boost wiring 14. That is, the reactor R1 is arranged between the VL line 12L and the connection point of the upper and lower arm circuits 10.

  The converter 6 converts the DC voltage into a DC voltage having a different value according to switching control by the control circuit unit 9. Converter 6 has a function of boosting a DC voltage supplied from DC power supply 2. Further, it also has a step-down function of charging the DC power supply 2 using the charge of the smoothing capacitor C1.

  The smoothing capacitor C1 is connected between the VH line 12H and the N line 13. The smoothing capacitor C1 is provided between the converter 6 and the inverters 7 and 8, and is connected in parallel with the converter 6 and the inverters 7 and 8. Smoothing capacitor C1 smoothes the DC voltage boosted by converter 6, for example, and accumulates the charge of the DC voltage. The voltage between both ends of the smoothing capacitor C1 becomes a high DC voltage for driving the motor generators 3, 4. The voltage across the smoothing capacitor C1 is equal to or higher than the voltage across the filter capacitor C2. Since the smoothing capacitor C1 is arranged on the higher voltage side than the filter capacitor C2, it is also called a high voltage side capacitor.

  Inverter 7 is connected to converter 6 via smoothing capacitor C1. The inverter 7 has three sets of the upper and lower arm circuits 10 described above. That is, the inverter 7 has the upper and lower arm circuits 10 for three phases. A connection point of the U-phase upper and lower arm circuits 10 is connected to a U-phase winding provided on a stator of the motor generator 3. Similarly, the connection point of the V-phase upper and lower arm circuits 10 is connected to the V-phase winding of the motor generator 3. The connection point of the W-phase upper and lower arm circuits 10 is connected to the W-phase winding of the motor generator 3. The connection point of the upper and lower arm circuits 10 of each phase is connected to the winding of the corresponding phase via the output wiring 15 provided for each phase.

  Inverter 7 converts a DC voltage into a three-phase AC voltage according to switching control by control circuit unit 9 and outputs the three-phase AC voltage to motor generator 3. Thereby, motor generator 3 is driven to generate a predetermined torque. The inverter 7 can also convert the three-phase AC voltage generated by the motor generator 3 in response to the output of the engine into a DC voltage according to switching control by the control circuit unit 9 and output the DC voltage to the VH line 12H. Thus, inverter 7 performs bidirectional power conversion between converter 6 and motor generator 3.

  Similarly, the inverter 8 is connected to the converter 6 via the smoothing capacitor C1. The inverter 8 also has three sets of the upper and lower arm circuits 10 described above. That is, the inverter 8 includes the upper and lower arm circuits 10 for three phases. A connection point of the U-phase upper and lower arm circuits 10 is connected to a U-phase winding provided on a stator of the motor generator 4. The connection point of the V-phase upper and lower arm circuits 10 is connected to the V-phase winding of the motor generator 4. The connection point of the W-phase upper and lower arm circuits 10 is connected to the W-phase winding of the motor generator 4. The connection point of the upper and lower arm circuits 10 of each phase is connected to the winding of the corresponding phase via the output wiring 15 provided for each phase.

  Inverter 8 converts a DC voltage into a three-phase AC voltage according to switching control by control circuit unit 9 and outputs the three-phase AC voltage to motor generator 4. Thereby, motor generator 3 is driven to generate a predetermined torque. In addition, during regenerative braking of the vehicle, the inverter 8 converts the three-phase AC voltage generated by the motor generator 4 by receiving the rotational force from the wheels into a DC voltage according to switching control by the control circuit unit 9, and the VH line 12H Can also be output to Thus, inverter 8 performs bidirectional power conversion between converter 6 and motor generator 4.

  The control circuit unit 9 includes, for example, a microcomputer (microcomputer). The control circuit unit 9 generates a drive command for operating the switching elements of the inverters 7 and 8, and outputs the drive command to a drive circuit unit (driver) (not shown). The control circuit unit 9 specifically outputs a PWM signal as a drive command. The control circuit unit 9 generates a drive command based on a torque request input from a host ECU (not shown) and signals detected by various sensors.

  The various sensors include a current sensor for detecting a phase current flowing through each phase winding of the motor generators 3 and 4, a rotation angle sensor for detecting a rotation angle of a rotor of the motor generators 3 and 4, and a voltage across the smoothing capacitor C1. A voltage sensor that detects the voltage of the VH line 12H, a voltage sensor that detects the voltage across the filter capacitor C2, that is, a voltage sensor that detects the voltage of the VL line 12L, a current sensor that is provided on the booster wiring 14 and detects the current flowing through the reactor R1. There is a temperature sensor for detecting the temperature of the reactor R1. The power conversion device 5 has these sensors (not shown).

  The drive circuit section generates a drive signal based on a drive command from the control circuit section 9 and outputs the drive signal to the gate electrodes of the corresponding switching elements Q1 and Q2 of the upper and lower arm circuits 10. Thus, the switching elements Q1 and Q2 are driven, that is, turned on and turned off. In the present embodiment, a drive circuit section is provided for each of the upper and lower arm circuits 10.

<Structure of power converter>
Next, a structure of the power conversion device 5 according to the present embodiment will be described with reference to FIGS. FIG. 2 is a cross-sectional view of the power converter 5, and FIG. 3 is a cross-sectional view along the line III-III in FIG. In the following description, the depth direction of the power converter 5 is orthogonal to the Z direction and the Z direction, and the stacking direction of the plurality of semiconductor modules 110 and the cooling pipes 106 is an X direction. A direction orthogonal to both the Z direction and the X direction is referred to as a Y direction.

  As shown in FIGS. 2 and 3, the power converter 5 mainly includes a capacitor unit 102, a stacked body 104 of a cooling pipe 106 and a semiconductor module 110, a reactor unit 120, a terminal block 134, a control circuit board 140, and the like. Consists of These components are housed in the case 100. The case 100 includes an upper cover 100a, a main case 100b, a lower case 100c, and a lower cover 100d.

  The capacitor unit 102 has a substantially rectangular parallelepiped shape as a whole, and includes the above-described smoothing capacitor C1 and filter capacitor C2. For example, the capacitor unit 102 has a plurality of film capacitors housed in a case. The capacitor unit 102 is fixed to the main case 100b by screwing or the like.

  2 and 3, the bus bar 128 connected to the positive terminal (power terminal) of the filter capacitor C2 in the capacitor unit 102 protrudes from the side surface of the capacitor unit 102 on the reactor unit 120 side. Is only connected to one power terminal 126 of the reactor R1 of FIG. However, actually, the terminals of the smoothing capacitor C1 and the filter capacitor C2 other than the positive terminal of the filter capacitor C2 are connected to the power terminals (positive terminal, negative terminal) of the semiconductor module 110 via bus bars (not shown). Connected. These busbars are provided so as to protrude from the side surface of the capacitor unit 102 on the reactor unit 120 side (the stacked body 104 side), similarly to the busbar connected to the positive terminal of the filter capacitor C2. The bus bar is formed by, for example, pressing a metal plate having excellent conductivity such as copper.

  Each of the semiconductor modules 110 constituting the stacked body 104 includes one upper and lower arm circuit 10 as described above. That is, one semiconductor module 110 incorporates the switching element Q1 and the return diode D1 forming the upper arm 10U, and the switching element Q2 and the return diode D2 forming the lower arm 10L. As described above, the upper and lower arm circuits 10 are used in the converter 6 and the inverters 7 and 8, respectively. The converter 6 and the upper and lower arm circuits 10 of the inverters 7 and 8 are all modularized as a semiconductor module 110.

  Each semiconductor module 110 is obtained by sealing a semiconductor chip constituting the upper arm 10U and the lower arm 10L with a sealing resin body. As shown in FIGS. 2 and 3, a control terminal 112 and a power terminal 114 protrude from the semiconductor module 110 from opposite end surfaces in the Z direction. More specifically, a plurality of control terminals 112 protrude from an upper surface close to control circuit board 140, and a plurality of power terminals 114 protrude from a lower surface opposite to the upper surface.

  In each of the semiconductor modules 110, five control terminals 112 protrude from the upper arm 10U and the lower arm 10L as the control terminals 112. These five control terminals 112 are for a gate electrode, for a Kelvin emitter for detecting the potential of an emitter electrode, for current sensing, and for an anode potential and a cathode potential of a temperature sensor (temperature sensing diode) for detecting the temperature of a semiconductor chip. Used as As shown in FIG. 3, the control terminals 112 protruding from each semiconductor module 110 are fastened to the control circuit board 140 while penetrating the control circuit board 140.

  On the other hand, as the power terminals 114, three power terminals 114 protrude in each semiconductor module 110. These three power terminals are connected to a positive terminal connected to the VH line 12H, a negative terminal connected to the N line 13, and an output wiring 15 to each phase of the reactor R1 and the motor generators 3, 4. AC terminal.

  The cooling pipe 106 is formed using a metal material having excellent heat conductivity, for example, an aluminum-based material. For example, at least one of a pair of plates (a thin metal plate) is processed into a shape expanded in the X direction by pressing. Thereafter, the outer peripheral edges of the pair of plates are fixed by caulking or the like, and are joined to each other by brazing or the like all around. Accordingly, a flow path through which the refrigerant can flow is formed between the pair of plates, and can be used as the cooling pipe 106.

  In this embodiment, in order to cool the semiconductor module 110 that generates heat during operation, the semiconductor module 110 and the cooling pipe 106 are alternately stacked to form the stacked body 104. The stacked body 104 is provided with two cooling pipes 108 that communicate with the flow paths of the plurality of stacked cooling pipes 106. By supplying the coolant to one cooling pipe 108 by a pump (not shown), the coolant flows in the flow path in the stacked cooling pipes 106. Thereby, each semiconductor module 110 of the stacked body 104 is cooled by the refrigerant.

  Further, in the present embodiment, the refrigerant is configured to flow in a closed space formed between the lower case 100c and the lower cover 100d. In order to allow the refrigerant to flow in the closed space between the cooling pipe 106 of the stacked body 104 and the lower case 100c and the lower cover 100d, for example, a connector provided with one cooling pipe 108 provided in the stacked body 104 outside the case 100 ( (Not shown), it may be communicated with a space formed between the lower case 100c and the lower cover 100d. Alternatively, in the case 100, the flow path in the laminated body 104 may communicate with a space formed between the lower case 100c and the lower cover 100d. Alternatively, the space formed between the refrigerant flow path of the stacked body 104 and the lower case 100c and the lower cover 100d may be two independent systems, and the coolant may be supplied to the two systems from a pump (not shown). As described above, the power conversion device 5 according to the present embodiment includes the cooling mechanism that causes the refrigerant to flow through the cooling pipe 106 of the stacked body 104 and the closed space formed between the lower case 100c and the lower cover 100d.

  An elastic member 116 is provided between the stacked body 104 and the first partition wall 118 provided on the main case 100b. The laminate 104 is pressed against the inner wall of the main case 100b by the elastic member 116. As a result, the stacked body 104 is held at a fixed position in the case 100.

  The reactor unit 120 has a substantially rectangular parallelepiped shape as a whole, like the capacitor unit 102, and includes the reactor R1. Reactor unit 120 is fixed to case 100 while being sandwiched between second partition wall 122 and third partition wall 124 provided in lower case 100c.

  The reactor unit 120 has a first terminal 126 and a second terminal 130 as power terminals. The first terminal 126 is a terminal electrically connected to the positive terminal of the filter capacitor C2 via the bus bar 128. The second terminal 130 is a terminal that is electrically connected to a power terminal (AC terminal) of the semiconductor module 110 configuring the converter 6 via a bus bar 136 formed on a terminal block 134 described later.

  As shown in FIG. 3, the first terminal 126 and the second terminal 130 extend from the upper surface of the reactor unit 120 between the second and third partition walls 122 and 124 toward the control circuit board 140 along the Z direction. Protruding. The protruding height of the first terminal 126 and the second terminal 130 is lower than the upper surface of the semiconductor module 110 of the stacked body 104 as shown in FIG. Therefore, when the first terminal 126 and the second terminal 130 of the reactor unit 120 are projected in the X direction, the control terminal 112 projecting from the upper surface of the semiconductor module 110 and the first terminal 126 projecting from the upper surface of the reactor The two terminals 130 do not overlap.

  Further, as shown in FIG. 2, the first terminal 126 and the second terminal 130 of the reactor unit 120 are both substantially rectangular in cross section. The surface corresponding to the long side of the substantially rectangular cross section is joined to one end of the above-described bus bar 128 or 136 as a main surface of the first terminal 126 or the second terminal 130. Both the first terminal 126 and the second terminal 130 are arranged in the direction of the main surface parallel to the X direction and parallel to the Y direction, in which the control terminals 112 of the respective semiconductor modules 110 of the stacked body 104 are arranged. Are provided in the reactor unit 120 so as to be orthogonal to.

  Further, reactor unit 120 is provided with a temperature sensor for detecting the temperature of reactor R1. A connection terminal 132 connected to the temperature sensor extends from the upper surface of reactor unit 120 along the Z direction. As shown in FIG. 3, the connection terminal 132 of the temperature sensor is fastened to the control circuit board 140 while penetrating the control circuit board 140.

  The second partition wall 122 and the third partition wall 124 sandwiching the reactor unit 120 have cavities 122a and 124a formed therein as shown in FIGS. A gap 125 is formed between the lower case 100c and the lower cover 100d below the lower case 100c on which the reactor unit 120 is placed. The cavity 122a of the second partition wall 122 and the cavity 124a of the third partition wall 124 communicate with each other via a gap 125 between the lower case 100c and the lower cover 100d. Further, although not shown, a gap 125 between the lower case 100c and the lower cover 100d extends to a lower portion of the lower case 100c on which the capacitor unit 102 is mounted, and the capacitor unit 102 is connected via a heat radiation sheet (not shown). And is in contact with the lower case 100c.

  For this reason, when the refrigerant flows through the cooling pipe 106 of the stacked body 104 and the enclosed space formed between the lower case 100c and the lower cover 100d by the above-described cooling mechanism, the refrigerant adds the refrigerant to the semiconductor module 110. , Reactor unit 120 and condenser unit 102 are also cooled. In particular, regarding the reactor unit 120, the cavities 122a and 124a through which the refrigerant flows are provided in the second partition wall 122 and the third partition wall 124 that sandwich the reactor unit 120, respectively, so that the reactor unit 120 is cooled more effectively. be able to.

  The terminal block 134 is provided in a plurality of bus bars 136 and a plurality of terminals connected to the power terminals of the plurality of semiconductor modules 110, a housing holding these, and a housing, and detects a current flowing through the power terminals of each semiconductor module 110. And the like. Terminal block 134 is provided with connection terminals for connecting to motor generators 3 and 4. The connection terminals of terminal block 134 are connected to the three-phase windings of motor generators 3 and 4 via an opening of case 100 (not shown).

  The control circuit section 9 and the drive circuit section described above are formed on the control circuit board 140. That is, the control circuit board 140 has various electronic components including a microcomputer mounted on a printed circuit board. On the control circuit board 140, a connector for connecting to a host ECU or the like is also mounted.

<Technical features of power converters>
Next, technical features of the power conversion device 5 according to the present embodiment will be described. In order to reduce the height and size of the power converter 5 in order to improve the mountability, for example, the interval between components that generate heat during operation, such as the stacked body 104 having the semiconductor module 110, the capacitor unit 102, and the reactor unit 120, is increased. It will narrow. As a result, the components that generate heat are susceptible to mutual heat generation (thermal interference), which causes a problem that it is difficult to perform sufficient heat radiation.

  To cope with such a problem, the power converter 5 according to the present embodiment includes a cooling mechanism that cools a plurality of heat-generating components (semiconductor module 110, reactor R1, capacitors C1, C2) that generate heat during operation. For this reason, even if these heat generating components generate heat during operation, the heat generation itself can be reduced.

  However, even if the heat-generating component is cooled by the cooling mechanism, it does not mean that no heat is generated during operation. For example, the semiconductor module 110 as a heat-generating component and the reactor unit 120 are connected through a power terminal and a bus bar, and when one heat-generating component generates heat, the heat is transmitted through the power terminal and the bus bar, which are easily transferred, to the other heat-generating component. Conveyed to. However, in the power converter 5 according to the present embodiment, at least one of the power terminals 114 and 130 of each of the semiconductor module 110 and the reactor unit 120 protrudes from a side other than the side where the semiconductor module 110 and the reactor unit 120 face each other. At the same time, the power terminals 114 and 130 are provided so that the protruding directions thereof are different. More specifically, power terminals 114 and 130 of semiconductor module 110 and reactor unit 120, which are connected to each other via a bus bar, project in opposite directions. However, it is not always necessary to project in the opposite direction. For example, the power terminals of the reactor unit 120 may project from a side surface of the power converter 5 having a surface along the depth direction (Z direction).

  As a result, it is possible to increase the length of the bus bar connecting the semiconductor module 110 and the power terminals 114 and 130 of the reactor unit 120. As a result, heat transfer between semiconductor module 110 and reactor unit 120 can be suppressed, and thermal interference can be suppressed.

  Furthermore, in the power converter 5 according to the present embodiment, at least one of the power terminals 114 and 130 of the semiconductor module 110 and the reactor unit 120 projects from a side other than the side facing each other. Project in different directions, it is also possible to suppress a local temperature rise inside case 100 due to radiant heat from respective power terminals 114 and 130.

  The relationship between the protruding directions of the power terminals is not limited to the semiconductor module 110 and the reactor unit 120 only. For example, as described above, since the protruding directions of the power terminals of the semiconductor module 110 and the capacitor unit 102 are also different, the same effects can be obtained. Further, the capacitor unit 102 has an XY plane (a plane orthogonal to the Z direction) so that the direction in which the power terminals protrude from the capacitor unit 102 is opposite to the direction in which the power terminals protrude from the semiconductor module 110. The power terminals may project from the upper surface. In addition, since the heat generation of the reactor unit 120 and the capacitor unit 102 is smaller than that of the semiconductor module 110 among the plurality of heat generating components, the power terminals of the reactor unit 120 and the capacitor unit 102 may project in the same direction. I do not care.

  When projecting the power terminal from the side surface of reactor unit 120 and / or capacitor unit 102, the projecting portion is determined based on the center line of reactor unit 120 and / or capacitor unit 102 in the Z direction as the power of semiconductor module 110. Preferably, it is provided on the side away from the terminal 114. That is, since the power terminal 114 of the semiconductor module 110 is provided below the center line of the semiconductor module 110 in the Z direction in FIG. 3, the power terminals of the reactor unit 120 and / or the capacitor unit 102 are respectively Above the center line in the Z direction. In this case, the portion where the power terminal of one of the heat generating components protrudes and the portion where the power terminal of the other heat generating component protrudes are provided on opposite sides of the center line in the Z direction of each heat generating component. Become. Thereby, the length of the bus bar connecting the power terminal 114 of the semiconductor module 110 and the power terminal of the reactor unit 120 and / or the capacitor unit 102 can be made as long as possible. In the configuration shown in FIGS. 2 and 3, the portion where the power terminal of one of the heat generating components protrudes and the portion where the power terminal of the other heat generating component protrudes sandwich the center line of each heat generating component in the Z direction. At the opposite side.

  Further, in power conversion device 5 according to the present embodiment, reactor unit 120 is cooled from three surfaces of second partition wall 122, third partition wall 124, and the inner surface of case 100 on which reactor unit 120 is placed. . Conversely, in the power converter 5 according to the present embodiment, since the power terminals of the semiconductor module 110 and the reactor unit 120 do not protrude from the lower surface on the same side in the same direction, the lower surface of the reactor unit 120 is also a cooling target. can do. As described above, the cooling mechanism also cools the lower surface of reactor unit 120 on the same side as the lower surface on which power terminals 114 protrude from semiconductor module 110, so that a local temperature increase inside case 100 can be suppressed more effectively. it can.

  In the power conversion device 5 according to the present embodiment, when the power terminals (the first terminal 126 and the second terminal 130) projecting from the reactor unit 120 are projected in the X direction, the control terminals projecting from the upper surface of the semiconductor module 110. The position relationship does not overlap with 112. That is, the control terminal 112 of the semiconductor module 110 and the power terminal of the reactor unit 120 are provided in different height ranges in the Z direction. For this reason, a noise component due to magnetic flux generated when a current flows through the power terminal of the reactor unit 120 does not easily reach the control terminal 112 of the semiconductor module 110. As a result, it is possible to make it difficult for the noise derived from the reactor unit 120 to be superimposed on various signals transmitted through the control terminal 112 of the semiconductor module 110.

  Furthermore, in the power conversion device 5 according to the present embodiment, the first terminals 126 and the second terminals 130 of the reactor unit 120 have the respective main surfaces in the direction (X direction) of the respective semiconductor modules 110 of the stacked body 104. Are provided in the reactor unit 120 so as to be orthogonal to the arrangement direction (Y direction) of the control terminals 112. In other words, the first terminals 126 and the second terminals 130 of the reactor unit 120 are provided such that the side surfaces orthogonal to the main surface face the respective control terminals 112 of the plurality of semiconductor modules 110.

  When a current flows through the first terminal 126 and the second terminal 130 of the reactor unit 120, most of the magnetic flux generated by the current is radiated from the main surface. In the present embodiment, since the side surface orthogonal to the main surface of the first terminal 126 and the second terminal 130 faces the control terminal 112 of the plurality of semiconductor modules 110, the magnetic flux of the semiconductor module 110 toward the control terminal 112 is reduced. The amount can be reduced. Therefore, also from this point, it is possible to make it difficult for the noise derived from the reactor unit 120 to be superimposed on various signals transmitted through the control terminal 112 of the semiconductor module 110.

  In the power converter 5 according to the present embodiment, the connection terminal 132 connected to the temperature sensor that detects the temperature of the reactor R1 is fastened to the control circuit board 140 while penetrating the control circuit board 140. As described above, since a harness or the like is not used for connecting the temperature sensor to the control circuit board, the assembling becomes easy and the manufacturing cost can be reduced.

  The preferred embodiment of the present invention has been described above. However, the present invention is not limited to the above-described embodiment, and can be variously modified and implemented without departing from the gist of the present invention. It is.

  For example, in the above-described embodiment, a water cooling mechanism using a refrigerant is employed as a cooling mechanism for cooling a plurality of heat generating components. However, an air cooling mechanism may be used as the cooling mechanism.

  Further, in the power converter 5 according to the above-described embodiment, the power terminals of the reactor unit 120 and the semiconductor module 110 are connected using the bus bar 136 provided on the terminal block 134. However, the power terminals of the reactor unit 120 and the semiconductor module 110 may be connected by a bus bar independent of the terminal block 134.

  Further, in the power conversion device 5 according to the above-described embodiment, the reactor unit 120 has three cooling surfaces. However, the cooling surface may be one surface or two surfaces. Alternatively, five surfaces other than the upper surface from which the power terminals protrude may be used as cooling surfaces.

  Further, in the power conversion device 5 according to the above-described embodiment, the case 100 is configured by the four parts of the upper cover 100a, the main case 100b, the lower case 100c, and the lower cover 100d, but the case 100 includes three parts. Or two. Alternatively, it may be composed of five or more parts.

  In the power converter 5 according to the present embodiment, the converter 6 includes one set of the reactor R1 and the upper and lower arm circuits 10. However, the converter 6 may include a plurality of sets of the reactor R1 and the upper and lower arm circuits 10. . When a plurality of reactors R1 and upper and lower arm circuits 10 are provided, they are connected in parallel with each other. Then, the number of sets to be driven is switched according to the magnitude of the voltage required to charge the smoothing capacitor C1 in order to drive the motor generators 3, 4. In this case, reactor unit 120 incorporates a plurality of reactors in a stacked state. At this time, a cooling pipe may be interposed between the plurality of reactors, similarly to the semiconductor module 110. Then, the power terminals of the stacked reactors protrude from the reactor unit in the same direction.

1: drive system, 2: DC power supply, 3, 4: motor generator, 5: power converter, 6: converter, 7, 8: inverter, 9: control circuit section, 10: upper and lower arm circuit, 10L: lower arm, 10U: upper arm, 12: P line, 13: N line, 14: boost wiring, 15: output wiring, 100: case, 100a: upper cover, 100b: main case, 100c: lower case, 100d: lower cover, 102: capacitor Unit, 104: laminated body, 106: cooling pipe, 108: cooling pipe, 110: semiconductor module, 112: control terminal, 114: power terminal, 116: elastic member, 118: first partition wall, 120: reactor unit, 122 : Second partition wall, 124: third partition wall, 134: terminal block, 140: control circuit board

Claims (8)

A power converter (5) for converting a DC current to an AC current while transforming a voltage from a DC power supply,
A case (100) for accommodating a plurality of electric components constituting the power converter,
A cooling mechanism that cools a plurality of heat-generating components (102, 110, 120) out of the plurality of electric components during operation.
At least a first heat generating component (110) and a second heat generating component (120) of the plurality of heat generating components are arranged in the case along a direction orthogonal to a depth direction of the case. , Having power terminals (114, 130) protruding from the respective heat-generating components,
A bus bar (136) for connecting power terminals of the first and second heat generating components;
At least one of the power terminals of the first and second heat-producing components projects from a side other than the sides of the first and second heat-generating components opposite to each other. A power conversion device characterized by different projection directions.   The portion of the first heat generating component from which the power terminal protrudes and the portion of the second heat generating component from which the power terminal protrudes are provided on opposite sides of the center line in the depth direction of each heat generating component. The power converter according to claim 1, wherein:   3. The power converter according to claim 1, wherein a direction in which the power terminal of the first heat generating component protrudes is opposite to a direction in which the power terminal of the second heat generating component protrudes. 4.   The power converter according to any one of claims 1 to 3, wherein the first heat-generating component is a semiconductor module having a power terminal protruding from a main body having a built-in power semiconductor element.   The said semiconductor module is arrange | positioned in the said case as a laminated body (104) in which several semiconductor modules were laminated | stacked, and a power terminal protrudes in the same direction from these semiconductor modules. Power converter.   The power converter according to any one of claims 1 to 5, wherein the second heat generating component is a reactor.   The power converter according to claim 6, wherein the reactor is disposed in the case as a stacked body in which a plurality of reactors are stacked, and power terminals protrude from the plurality of reactors in the same direction.   The electric power according to any one of claims 1 to 7, wherein the cooling mechanism also cools a surface of the second heat generating component on the same side as a surface on which a power terminal protrudes from the first heat generating component. Conversion device.

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