JP7211337B2 - power converter - Google Patents

Description

The disclosure provided herein relates to a power converter with a switch circuit board.

The power conversion device described in Patent Document 1 includes a structure including a semiconductor module including a plurality of semiconductor elements and a cooler, a DC-DC converter, and a case that accommodates the structure and the DC-DC converter. ing. The DC-DC converter has a converter control section and a plurality of MOS transistors housed in a main housing.

Japanese Patent No. 6308109

The case has an outer wall forming an outer shell and a partition formed inside integrally with the outer wall. A space partitioned by the outer wall portion and the partition wall portion accommodates the converter control portion and the structure.

The converter control unit and the structure are accommodated in the case side by side away from the partition wall. Therefore, dust generated in the structure (electric parts group) tends to adhere to the converter control section. If the dust is conductive, a short circuit may occur in the converter control section (switch circuit board).

Therefore, an object of the disclosure described in this specification is to provide a power conversion device in which dust generated in an electric component group is prevented from adhering to a switch circuit board.

One of the disclosures is
a plurality of first switches (541, 542), a switch circuit board (350) electrically connected to the plurality of first switches, and electrical components (321, 522) electrically connected to the plurality of first switches ), a first electrical component group (860) comprising
a second electrical component group (870) comprising a plurality of second switches (531, 532, 651, 652);
a case (800, 900) for housing the first electrical component group and the second electrical component group;
The case protrudes from the annular outer wall (820, 910) and the inner wall surface (820b) of the outer wall, so that the space of the outer wall serves as a first storage space (660) for storing the first electric component group. A second storage space (940) for storing the second electrical component group is divided into a first mounting surface (810a) for mounting the first electrical component group and a second mounting surface (832a) for mounting the second electrical component group. a mounting portion (810, 830) comprising:
A communication space (1000) that communicates the first storage space and the second storage space is formed by separating the mounting portion and the outer wall portion of the case,
The switch circuit board has a main surface (350a) facing the first mounting surface with a gap therebetween in the direction in which the first mounting surface and the second mounting surface are aligned,
The main surface is positioned closer to the first mounting surface in the arranging direction than the arranging surfaces (321a, 522a) located on the side away from the first mounting surface of the electrical components in the arranging direction.

According to this, dust generated in the second electrical component group (870) moves through the communication space (1000) to the first storage space (660). The distance between the first mounting surface (810a) and the main surface (350a) in the alignment direction is shorter than the distance between the first mounting surface (810a) and the alignment surfaces (321a, 522a) in the alignment direction. Dust generated in the second electrical component group (870) is less likely to enter the space between the first mounting surface (810a) and the main surface (350a) in the alignment direction through the communication space (1000). Therefore, dust generated in the second electrical component group (870) is less likely to adhere to the main surface (350a). If the dust is conductive, short circuiting of the switch circuit board (350) is likely to be suppressed.

It should be noted that the reference numbers in parentheses above merely indicate the correspondence with the configurations described in the embodiments described later, and do not limit the technical scope in any way.

1 is a circuit diagram showing an in-vehicle system; FIG. FIG. 4 is a cross-sectional view showing a housing form in which a group of electrical components is housed in a case; FIG. 4 is a plan view showing a housing configuration in which a group of electrical components are housed in a first case; FIG. 11 is a plan view showing a housing configuration in which a group of electrical components are housed in a second case; It is a sectional view for explaining the 1st modification.

Embodiments will be described below with reference to the drawings.

(First embodiment)
First, based on FIG. 1, the vehicle-mounted system 100 provided with the power converter 300 will be described. This in-vehicle system 100 constitutes a system for an electric vehicle. In-vehicle system 100 has battery 200 , power converter 300 , and motor 400 .

In-vehicle system 100 also includes a plurality of ECUs (not shown). These multiple ECUs transmit and receive signals to and from each other via bus wiring. A plurality of ECUs cooperate to control the electric vehicle. A plurality of ECUs control regeneration and power running of motor 400 according to the SOC of battery 200 . SOC is an abbreviation for state of charge. ECU is an abbreviation for electronic control unit.

Battery 200 has a plurality of secondary batteries. These secondary batteries constitute a battery stack connected in series. The SOC of this battery stack corresponds to the SOC of battery 200 . A lithium-ion secondary battery, a nickel-hydrogen secondary battery, an organic radical battery, or the like can be used as the secondary battery.

The power conversion device 300 converts power between the battery 200 and the motor 400 . The power conversion device 300 converts the DC power of the battery 200 into AC power having a voltage level suitable for powering the motor 400 . Power conversion device 300 converts AC power generated by power generation (regeneration) of motor 400 into DC power at a voltage level suitable for charging battery 200 .

Motor 400 is connected to an output shaft of an electric vehicle (not shown). The rotational energy of motor 400 is transmitted to the running wheels of the electric vehicle via the output shaft. Conversely, the rotational energy of the running wheels is transmitted to motor 400 via the output shaft.

The motor 400 is driven by AC power supplied from the power converter 300 . As a result, a driving force is applied to the running wheels. Also, the motor 400 is regenerated by rotational energy transmitted from the running wheels. The AC power generated by this regeneration is converted into DC power and stepped down by the power conversion device 300 . This DC power is supplied to battery 200 . The DC power is also supplied to various electrical loads mounted on the electric vehicle.

<Power converter>
Next, the power conversion device 300 will be described. Power converter 300 includes first converter 550 , second converter 560 , and inverter 600 . First converter 550 and second converter 560 boost the DC power of battery 200 to a voltage level suitable for powering motor 400 . Inverter 600 converts this DC power to AC power. This AC power is supplied to the motor 400 . Inverter 600 converts AC power generated by motor 400 into DC power. First converter 550 and second converter 560 step down this DC power to a voltage level suitable for charging battery 200 .

Each of first converter 550, second converter 560, and inverter 600 includes a semiconductor element such as a switch, which will be described later.

In this embodiment, an n-channel IGBT is used as the switch. However, MOSFETs can be used instead of IGBTs for these switches. If a MOSFET is used as the switch, the diode may be omitted.

These switches can be made from semiconductors such as Si and wide-gap semiconductors such as SiC. The constituent material of the semiconductor element is not particularly limited.

<Converter circuit configuration>
First converter 550 is electrically connected to battery 200 via first power supply bus bar 301 and second power supply bus bar 302 . The first power supply busbar 301 is connected to the positive electrode of the battery 200 . The second power supply busbar 302 is connected to the negative electrode of the battery 200 . First converter 550 is electrically connected to inverter 600 via third power supply bus bar 303 and second power supply bus bar 302 .

First converter 550 has first capacitor 310 , first reactor 510 , and first A-phase leg 530 . One of the two electrodes of first capacitor 310 is connected to first power supply bus bar 301 . The other of the two electrodes of first capacitor 310 is connected to second power supply bus bar 302 . First reactor 510 is connected to first power supply bus bar 301 . First reactor 510 and first A-phase leg 530 are electrically connected via first connection bus bar 511 . First A-phase leg 530 is connected in series between third power supply bus bar 303 and second power supply bus bar 302 .

Second converter 560 is electrically connected to third power supply bus bar 303 and second power supply bus bar 302 via fourth power supply bus bar 304 and fifth power supply bus bar 305, respectively. Second converter 560 is electrically connected to inverter 600 via third power supply bus bar 303 and second power supply bus bar 302 .

Second converter 560 has second capacitor 320 , second reactor 520 , and second A-phase leg 540 . One of the two electrodes of second capacitor 320 is connected to third power supply bus bar 303 via fourth power supply bus bar 304 . The other of the two electrodes of second capacitor 320 is connected to second power supply bus bar 302 via fifth power supply bus bar 305 . Second reactor 520 is connected to fourth power supply bus bar 304 . Second reactor 520 and second A-phase leg 540 are electrically connected via second connection bus bar 521 . Second A-phase leg 540 is connected in series between sixth power supply bus bar 306 and fifth power supply bus bar 305 .

As shown in FIG. 1, the first A-phase leg 530 has a first high-side switch 531 and a first low-side switch 532 as switches. Also, the first A-phase leg 530 has a first high-side diode 531a and a first low-side diode 532a as diodes. The first high-side switch 531 and the first low-side switch 532 correspond to second switches.

A collector electrode of the first high-side switch 531 is connected to the third power supply bus bar 303 . An emitter electrode of the first high-side switch 531 and a collector electrode of the first low-side switch 532 are connected. An emitter electrode of the first low-side switch 532 is connected to the second power supply busbar 302 . As a result, the first high-side switch 531 and the first low-side switch 532 are serially connected in order from the third power supply bus bar 303 toward the second power supply bus bar 302 .

Also, the collector electrode of the first high-side switch 531 is connected to the cathode electrode of the first high-side diode 531a. The emitter electrode of the first high-side switch 531 is connected to the anode electrode of the first high-side diode 531a. As a result, the first high-side diode 531 a is connected in anti-parallel to the first high-side switch 531 .

Similarly, the collector electrode of the first low-side switch 532 is connected to the cathode electrode of the first low-side diode 532a. The emitter electrode of the first low-side switch 532 is connected to the anode electrode of the first low-side diode 532a. As a result, the first low-side diode 532 a is connected in anti-parallel to the first low-side switch 532 .

The above-described first reactor 510 is connected to the middle point between the first high-side switch 531 and the first low-side switch 532 via the first connecting bus bar 511 . As described above, first reactor 510 is connected to the positive electrode of battery 200 and the midpoint between first high-side switch 531 and first low-side switch 532 of first A-phase leg 530 .

As shown in FIG. 1, the second A-phase leg 540 has a second high-side switch 541 and a second low-side switch 542 as switches. The second A-phase leg 540 also has a second high-side diode 541a and a second low-side diode 542a as diodes. The second high side switch 541 and the second low side switch 542 correspond to the first switch.

A collector electrode of the second high-side switch 541 is connected to the sixth power supply bus bar 306 . An emitter electrode of the second high side switch 541 and a collector electrode of the second low side switch 542 are connected. An emitter electrode of the second low-side switch 542 is connected to the fifth power supply busbar 305 . Thereby, the second high-side switch 541 and the second low-side switch 542 are serially connected in order from the sixth power supply bus bar 306 toward the fifth power supply bus bar 305 .

Also, the collector electrode of the second high side switch 541 is connected to the cathode electrode of the second high side diode 541a. The emitter electrode of the second high side switch 541 is connected to the anode electrode of the second high side diode 541a. As a result, the second high-side diode 541 a is connected in anti-parallel to the second high-side switch 541 .

Similarly, the collector electrode of the second low-side switch 542 is connected to the cathode electrode of the second low-side diode 542a. The emitter electrode of the second low-side switch 542 is connected to the anode electrode of the second low-side diode 542a. Thereby, the second low-side diode 542 a is connected in anti-parallel to the second low-side switch 542 .

The above-described second reactor 520 is connected to the middle point between the second high side switch 541 and the second low side switch 542 of the second A-phase leg 540 via the second connecting bus bar 521 . As described above, the second reactor 520 is connected to the middle point between the third power supply bus bar 303 and the second high side switch 541 and the second low side switch 542 .

The first high-side switch 531 and the first low-side switch 532 of the first A-phase leg 530 and the second high-side switch 541 and the second low-side switch 542 of the second A-phase leg 540 shown so far are controlled by the ECU and the gate driver. be done.

Specifically, when the DC power of battery 200 is boosted, the high-side switch and the low-side switch of first A-phase leg 530 and second A-phase leg 540 are alternately opened and closed by a control signal from the ECU.

On the contrary, when stepping down the DC power supplied from inverter 600, the ECU fixes the control signal to be output to the low-side switch provided for each of first A-phase leg 530 and second A-phase leg 540 at a low level. At the same time, the ECU sequentially switches the control signals to be output to the high-side switches of the first A-phase leg 530 and the second A-phase leg 540 between high and low levels.

<Inverter configuration circuit>
Inverter 600 has third capacitor 330 and switch leg group 610 . One of the two electrodes of third capacitor 330 is connected to third power supply bus bar 303 . The other of the two electrodes of third capacitor 330 is connected to second power supply bus bar 302 . The switch leg group 610 is connected to each of the third power supply busbar 303 and the second power supply busbar 302 .

Switch leg group 610 has U-phase leg 620 , V-phase leg 630 and W-phase leg 640 . Each of these three phase legs has two switches connected in series.

Each of the U-phase leg 620 to W-phase leg 640 has a third high-side switch 651 and a third low-side switch 652 as switches. Each of the U-phase leg 620 to W-phase leg 640 has a third high-side diode 651a and a third low-side diode 652a as diodes. The third high-side switch 651 and the third low-side switch 652 correspond to second switches.

As shown in FIG. 1, the collector electrode of the third high-side switch 651 is connected to the third power supply busbar 303 . An emitter electrode of the third high side switch 651 and a collector electrode of the third low side switch 652 are connected. An emitter electrode of the third low-side switch 652 is connected to the second power supply busbar 302 . Thereby, the third high-side switch 651 and the third low-side switch 652 are serially connected in order from the third power supply bus bar 303 toward the second power supply bus bar 302 .

A midpoint between the third high-side switch 651 and the third low-side switch 652 of the U-phase leg 620 is connected to the U-phase stator coil of the motor 400 . A midpoint between the third high-side switch 651 and the third low-side switch 652 of the V-phase leg 630 is connected to the V-phase stator coil of the motor 400 . A midpoint between the third high-side switch 651 and the third low-side switch 652 of the W-phase leg 640 is connected to the W-phase stator coil of the motor 400 .

Also, the collector electrode of the third high-side switch 651 is connected to the cathode electrode of the third high-side diode 651a. The emitter electrode of the third high-side switch 651 is connected to the anode electrode of the third high-side diode 651a. As a result, the third high-side diode 651a is connected to the third high-side switch 651 in anti-parallel.

Similarly, the collector electrode of the third low-side switch 652 is connected to the cathode electrode of the third low-side diode 652a. The emitter electrode of the third low-side switch 652 is connected to the anode electrode of the third low-side diode 652a. As a result, the third low-side diode 652 a is connected in anti-parallel to the third low-side switch 652 .

When the motor 400 is powered, the high-side switch and the low-side switch included in the switch leg group 610 are PWM-controlled by control signals from the ECU. As a result, inverter 600 generates a three-phase alternating current. When the motor 400 generates (regenerates) power, the ECU stops outputting the control signal, for example. As a result, AC power generated by power generation of motor 400 passes through diodes provided in three-phase switch leg group 610 . As a result, AC power is converted to DC power.

<Configuration of power converter>
Next, the configuration of the power converter 300 will be described. The three orthogonal directions are hereinafter referred to as the x direction, the y direction, and the z direction. The x direction corresponds to the horizontal direction. The z direction corresponds to the alignment direction.

In addition to the components described above, the power conversion device 300 includes a plurality of substrates, a plurality of connectors, a cable 740, a plurality of cases, a plurality of covers, a plurality of capacitor cases, a plurality of reactor cases, a cooler 700, and a plate 810. have.

The plurality of boards are the control circuit board 340 and the switch circuit board 350 . The plurality of connectors are the first connector 720 provided on the switch circuit board 350 and the second connector 730 provided on the control circuit board 340 . The plurality of cases are a first case 800 that houses a first electrical component group 860 to be described later and a second case 900 that houses a second electrical component group 870 to be described later. The plurality of covers are a first cover 840 connected to the first case 800 and a second cover 920 connected to the second case 900 . The first connector 720 corresponds to the connector.

The plurality of capacitor cases are specifically the first capacitor case 311 , the second capacitor case 321 and the third capacitor case 331 . The plurality of reactor cases are specifically the first reactor case 512 and the second reactor case 522 .

A first capacitor 310 is housed in a first capacitor case 311 . A second capacitor 320 is housed in a second capacitor case 321 . A third capacitor 330 is housed in a third capacitor case 331 . First reactor 510 is housed in first reactor case 512 . Second reactor 520 is housed in second reactor case 522 . The second capacitor case 321 and the second reactor case 522 correspond to electrical components. Cooler 700 and plate 810 are described in more detail below.

The control circuit board 340 is mounted with an ECU and a gate driver for controlling the first converter 550 and the inverter 600 . The second connector 730 is provided on the control circuit board 340 as described above. One end of cable 740 is electrically connected to second connector 730 .

An ECU and a gate driver for controlling the second converter 560 are mounted on the switch circuit board 350 . The switch circuit board 350 is provided with the first connector 720 as described above. The other end of cable 740 is electrically connected to first connector 720 . Control circuit board 340 and switch circuit board 350 are electrically connected via cable 740 . 2 to 4, the description of the power supply bus bar that electrically connects the constituent elements described so far is omitted.

<First switch module>
First A-phase leg 530 and U-phase leg 620 to W-phase leg 640 of first converter 550 and inverter 600 are each covered with first resin member 701 to form first switch module 702 . As shown in FIG. 1, the first switch module 702 has a flat shape with a thin thickness in the x direction. A power module 710 is configured by housing the first switch module 702 in the cooler 700 .

Portions of terminals connected to emitter electrodes and collector electrodes of the plurality of switches inside the first resin member 701 are exposed from the first resin member 701 in the z-direction. These terminals are connected to the first capacitor 310 and the first reactor 510 via power supply busbars.

A part of the terminal connected to the gate electrode of each of the plurality of switches inside the first resin member 701 is exposed from the first resin member 701 in the z-direction. These terminals are connected to the control circuit board 340 that controls the first switch module 702 .

<Second switch module>
A second A-phase leg 540 provided in the second converter 560 is covered with a second resin member 561 to constitute a second switch module 562 . The second resin member 561 has a flat shape with a thin thickness in the z direction, having a first resin surface 561a and a second resin surface 561b arranged in the z direction.

A part of the switch control terminal 563 connected to the gate electrode of each of the plurality of switches inside the second resin member 561 is exposed in the z-direction from the second resin surface 561b. A plurality of switch control terminals 563 exposed from the second resin surface 561 b are connected to the switch circuit board 350 that controls the second switch module 562 . The form of connection between these switch control terminals 563 and the switch circuit board 350 will be described later in detail. The second resin member 561 corresponds to the coating resin.

<First case>
As shown in FIG. 3, the first case 800 includes a first frame portion 820 extending in the circumferential direction around the z-direction, and a first fastening portion 825 connected to a first frame outer surface 820a outside the first frame portion 820. , and a support portion 830 connected to the first frame inner surface 820 b inside the first frame portion 820 . The support portion 830 protrudes away from the first frame inner surface 820b in the x direction. The first frame portion 820 and a second frame portion 910, which will be described later, correspond to the outer wall portion. The first frame inner surface 820b corresponds to the inner wall surface.

The first frame portion 820 has a first side wall 821 and a third side wall 823 spaced apart from each other in the x direction and a second side wall 822 and a fourth side wall 824 spaced apart from each other in the y direction. The first side wall 821, the second side wall 822, the third side wall 823, and the fourth side wall 824 are annularly connected in order in the circumferential direction.

As shown in FIG. 2, the first fastening portion 825 is connected to the first flange portion 821a and the second flange portion 821b connected to the first frame outer surface 820a of the first side wall 821, and to the first frame outer surface 820a of the third side wall 823. It has a third flange portion 823a and a fourth flange portion 823b that are connected.

The first flange portion 821a and the third flange portion 823a are connected to the first frame outer surface 820a on the first end surface 820c side of one end of the first frame portion 820 in the z direction. The second flange portion 821b and the fourth flange portion 823b are connected to the first frame outer surface 820a on the second end surface 820d side of the other end of the first frame portion 820 in the z direction. The first flange portion 821a and the second flange portion 821b extend away from the first frame outer surface 820a of the first side wall 821 in the x direction. The third flange portion 823a and the fourth flange portion 823b extend away from the first frame outer surface 820a of the third side wall 823 in the x direction. In FIG. 2, the first end surface 820c and the second end surface 820d are indicated by dashed lines.

The support portion 830 is connected to the first frame inner surface 820 b of the first side wall 821 . The support portion 830 includes a first support wall portion 831 and a second support wall portion 832 that are thin in the z direction, and a connecting portion 833 that connects the first support wall portion 831 and the second support wall portion 832 in the z direction. , have The first supporting wall portion 831 and the second supporting wall portion 832 are arranged apart in the z direction. The connecting portion 833 and the third side wall 823 are separated in the x direction. In FIG. 3, the first frame outer surface 820a is indicated by a dashed line.

The first support wall portion 831 has a first support surface 831a on the side of the first end surface 820c and a second support surface 831b on the side of the second end surface 820d arranged in the z direction. A through hole is formed in the first support wall portion 831 to penetrate the first support surface 831a and the second support surface 831b. A plate 810 having a thin thickness in the z-direction is welded to the second support surface 831b side of the first support wall portion 831 . The support portion 830 and the plate 810 correspond to the mounting portion.

A cooling channel 874 is formed in a space defined by the first supporting wall portion 831 , the connecting portion 833 , the second supporting wall portion 832 and the plate 810 . A coolant flows through the cooling flow path 874 from the outside. Therefore, the plate 810 and the like defining the cooling channel 874 are actively cooled.

<Second case>
As shown in FIGS. 2 and 4, the second case 900 includes a second frame portion 910 annularly connected in the z direction and a second fastening portion connected to a second frame outer surface 910a outside the second frame portion 910. 915 and.

The second frame portion 910 has a fifth side wall 911 and a seventh side wall 913 spaced apart from each other in the x direction and a sixth side wall 912 and an eighth side wall 914 spaced apart from each other in the y direction. The fifth side wall 911, the sixth side wall 912, the seventh side wall 913, and the eighth side wall 914 are annularly connected in order in the circumferential direction in the z direction.

The second fastening portion 915 has a fifth flange portion 911a and a sixth flange portion 911b connected to the fifth side wall 911, and a seventh flange portion 913a and an eighth flange portion 913b connected to the seventh side wall 913. . The fifth flange portion 911a is connected to the second frame outer surface 910a on the third end surface 910c side of one end of the fifth side wall 911 in the z direction. The sixth flange portion 911b is connected to the second frame inner surface 910b on the fourth end surface 910d side of the other end of the fifth side wall 911 in the z direction. The seventh flange portion 913a is connected to the second frame outer surface 910a of the seventh side wall 913 on the third end surface 910c side. The eighth flange portion 913b is connected to the second frame inner surface 910b of the seventh side wall 913 on the fourth end surface 910d side. In FIG. 2, the third end surface 910c and the fourth end surface 910d are indicated by broken lines. In FIG. 4, the second frame outer surface 910a is indicated by a dashed line.

<First cover>
The first cover 840 includes a first bottom portion 841 that is thin in the z direction, a third frame portion 850 annularly erected in the z direction from the end of the first inner bottom surface 841a of the first bottom portion 841, and the third frame portion 850. and a third fastening portion 853 connected to the outer frame outer surface of the. The third frame portion 850 has a ninth sidewall 851 and an eleventh sidewall 852 spaced apart from each other in the x direction and tenth sidewalls and a twelfth sidewall spaced apart from each other in the y direction. The ninth side wall 851, the tenth side wall, the eleventh side wall 852, and the twelfth side wall are annularly connected in order in the circumferential direction in the z direction.

The third fastening portion 853 has a ninth flange portion 851a and an eleventh flange portion 852a spaced apart from each other in the x direction and a tenth flange portion and a twelfth flange portion spaced apart from each other in the y direction. The ninth flange portion 851a, the tenth flange portion, the eleventh flange portion 852a, and the twelfth flange portion are annularly connected in order in the circumferential direction in the z direction.

A ninth flange portion 851a is connected to the frame outer surface of the ninth side wall 851 described above. An eleventh flange portion 852a is connected to the frame outer surface of the eleventh side wall 852 described above. The ninth flange portion 851a and the eleventh flange portion 852a each extend away from the outer surface of the frame in the x direction.

<Second cover>
The second cover 920 includes a second bottom portion 921 having a thin thickness in the z direction, a fourth frame portion 930 annularly erected in the z direction from an end portion of a second inner bottom surface 921a of the second bottom portion 921, and a fourth frame portion 930. and a fourth fastening portion 933 connected to the outer frame outer surface of the. The fourth frame portion 930 has a 13th sidewall 931 and a 15th sidewall 932 spaced apart from each other in the x direction and a 14th sidewall and a 16th sidewall spaced apart from each other in the y direction. The 13th side wall 931, the 14th side wall, the 15th side wall 932, and the 16th side wall are annularly connected in order in the z direction in the circumferential direction.

The fourth fastening portion 933 has a thirteenth flange portion 931a and a fifteenth flange portion 932a spaced apart from each other in the x direction and a fourteenth flange portion and a fifteenth flange portion 932a spaced apart from each other in the y direction. The 13th flange portion 931a, the 14th flange portion, the 15th flange portion 932a, and the 16th flange portion are annularly connected in order in the circumferential direction in the z direction.

A thirteenth flange portion 931a is connected to the frame outer surface of the thirteenth side wall 931 described above. A fifteenth flange portion 932a is connected to the frame outer surface of the fifteenth side wall 932 described above. Each of the thirteenth flange portion 931a and the fifteenth flange portion 932a extends away from the outer surface of the frame in the x direction.

<Storage space>
The second flange portion 821b and the ninth flange portion 851a are arranged in the z direction. The fourth flange portion 823b and the eleventh flange portion 852a are arranged in the z direction. The second flange portion 821b and the ninth flange portion 851a are connected by bolts (not shown) or the like. The fourth flange portion 823b and the eleventh flange portion 852a are connected by a bolt or the like (not shown). The first case 800 and the first cover 840 are thereby connected.

The first flange portion 821a and the fifth flange portion 911a are arranged in the z direction. The third flange portion 823a and the seventh flange portion 913a are arranged in the z direction. The first flange portion 821a and the fifth flange portion 911a are connected by a bolt or the like (not shown). The third flange portion 823a and the seventh flange portion 913a are connected by bolts (not shown) or the like. Thereby, the first case 800 and the second case 900 are connected. The first case 800 and the second case 900 correspond to cases.

The sixth flange portion 911b and the thirteenth flange portion 931a are arranged in the z direction. The eighth flange portion 913b and the fifteenth flange portion 932a are arranged in the z direction. The sixth flange portion 911b and the thirteenth flange portion 931a are connected by a bolt or the like (not shown). The eighth flange portion 913b and the fifteenth flange portion 932a are connected by a bolt or the like (not shown). Thereby, the second case 900 and the second cover 920 are connected.

Hereinafter, the storage space of the first case 800 on the side of the first cover 840 in the z-direction with respect to the support portion 830 will be referred to as a first storage space 660 . A storage space for the first case 800 and the second case 900 on the side of the second cover 920 in the z-direction with respect to the support portion 830 is referred to as a second storage space 940 . A space positioned closer to the third side wall 823 and the seventh side wall 913 in the x direction than the support portion 830 is referred to as a communication space 1000 . The communication space 1000 communicates the first storage space 660 and the second storage space 940 in the z direction. In FIG. 2, the boundary between the first storage space 660 and the communication space 1000 is indicated by a dashed line. A boundary between the second storage space 940 and the communication space 1000 is indicated by a dashed line.

<First storage space>
A part of the second switch module 562 , the second capacitor case 321 , the second reactor case 522 , the switch circuit board 350 , and the third capacitor case 331 are housed in the first housing space 660 . As shown in FIGS. 2 and 3, the second switch module 562, the second capacitor case 321, and the second reactor case 522 are mounted on the plate surface 810a side of the plate 810 on the first cover 840 side. The plate surface 810a corresponds to the first mounting surface.

As shown in FIG. 3, the second switch module 562 and the second capacitor case 321 are arranged in the y direction. The second switch module 562 is located closer to the fourth side wall 824 than the second capacitor case 321 is.

The second reactor case 522 is aligned in the x direction with the second switch module 562 and the second capacitor case 321 aligned in the y direction. The second reactor case 522 is located closer to the first side wall 821 in the x direction than the second switch module 562 and the second capacitor case 321 respectively.

A portion of the third capacitor case 331 is located closer to the third side wall 823 in the x direction than the second switch module 562 , the second capacitor case 321 , and the second reactor case 522 mounted on the plate 810 . The rest of the third capacitor case 331 is located in the communication space 1000 and the second storage space 940 respectively.

As shown in FIG. 2, the switch circuit board 350 is positioned away from the plate surface 810a in the z direction toward the first cover 840 side. The switch circuit board 350 has a flat shape having a first principal surface 350a and a second principal surface 350b arranged in the z direction and having a thin thickness in the z direction. The switch circuit board 350 is fixed by fastening portions formed on the plate 810 and bolts (not shown). The first main surface 350a corresponds to the main surface.

The switch circuit board 350 is located closer to the first cover 840 in the z direction than the second resin member 561 of the second switch module 562 mounted on the plate 810 . A second resin member 561 is positioned between the plate 810 and the switch circuit board 350 in the z-direction.

The first main surface 350a of the switch circuit board 350 and the second resin surface 561b of the second resin member 561 face each other with a gap in the z-direction. The second main surface 350b of the switch circuit board 350 is located on the first cover 840 side.

As shown in FIG. 2, the plurality of switch control terminals 563 exposed from the second resin surface 561b extend toward the switch circuit board 350 in the z-direction. A plurality of through holes are formed in the switch circuit board 350 so as to penetrate the first main surface 350a and the second main surface 350b in the z-direction. The multiple switch control terminals 563 exposed from the second resin surface 561b are passed through these through holes. The switch control terminal 563 passed through the through hole and the switch circuit board 350 are connected by soldering or the like. In FIG. 3, the through holes of the switch circuit board 350 and the switch control terminals 563 passed through the through holes are omitted.

As described above, the second switch module 562 as well as the second capacitor case 321 and the second reactor case 522 are mounted on the plate surface 810a side of the plate 810 . Hereinafter, the main surface of the second capacitor case 321 on the first cover 840 side will be referred to as a third main surface 321a. A main surface of the second reactor case 522 on the first cover 840 side is indicated as a fourth main surface 522a. The third main surface 321a and the fourth main surface 522a correspond to a side-by-side surface.

A separation distance L1 in the z direction between the plate surface 810a and the second main surface 350b of the switch circuit board 350 is shorter than a separation distance L2 in the z direction between the plate surface 810a and the third main surface 321a. A z-direction separation distance L1 between the plate surface 810a and the second main surface 350b is shorter than a z-direction separation distance L3 between the plate surface 810a and the fourth main surface 522a.

A z-direction separation distance L4 between the plate surface 810a and the first main surface 350a on the back side of the second main surface 350b is shorter than a z-direction separation distance L2 between the plate surface 810a and the third main surface 321a. . A separation distance L4 in the z direction between the plate surface 810a and the first main surface 350a is shorter than a separation distance L3 in the z direction between the plate surface 810a and the fourth main surface 522a.

The first connector 720 described above is provided on the second main surface 350b. The first connector 720 is located on the third side wall 823 side of the second main surface 350b. Furthermore, the other end of the cable 740 is connected to the third side wall 823 side of the first connector 720 .

The cable 740 extends in the z-direction from the first storage space 660 through the communication space 1000 toward the second storage space 940 . A portion of the cable 740 extending in the z-direction faces the space between the plate surface 810a and the first major surface 350a in the x-direction.

<Second storage space>
As shown in FIGS. 2 and 4, the power module 710, the first reactor case 512, the first capacitor case 311, the control circuit board 340, and part of the third capacitor case 331 are housed in the second housing space 940. FIG. The first reactor case 512 and the first capacitor case 311 are mounted on the second cover 920 side of the second support wall portion 832 on the side of the third support surface 832a. The power module 710 is fixed to the second case 900 while being separated from the third support surface 832a in the z direction. The power module 710 is sandwiched between an urging body (not shown) and the fifth side wall 911 in the x direction. The third support surface 832a corresponds to the second mounting surface.

The third capacitor case 331 is positioned closer to the seventh side wall 913 in the x direction than the first reactor case 512 , the first capacitor case 311 , and the power module 710 . A holding portion 331 a is formed in a portion of the third capacitor case 331 located in the second housing space 940 .

As shown in FIGS. 2 and 4, the power module 710 and the first reactor case 512 are arranged in the x direction. The first reactor case 512 is located closer to the seventh side wall 913 than the power module 710 in the x direction. The first capacitor case 311 is aligned in the y direction with the power module 710 and the first reactor case 512 aligned in the x direction. The first capacitor case 311 is located closer to the sixth side wall 912 in the y direction than the power module 710 and the first reactor case 512 are.

As shown in FIG. 2, the control circuit board 340 is positioned on the second cover 920 side in the z direction. The control circuit board 340 has a flat shape that is thin in the z-direction and has a first control surface 340a and a second control surface 340b that are aligned in the z-direction. The control circuit board 340 is located closer to the second cover 920 in the z direction than the power module 710, the first reactor case 512, and the first capacitor case 311, respectively.

The second connector 730 described above is provided on the first control surface 340a. The second connector 730 is located on the seventh side wall 913 side of the first control surface 340a. One end of cable 740 is connected to second connector 730 . The cable 740 is held by a holding portion 331a formed in the third capacitor case 331 while extending in the z-direction toward the first storage space 660 side.

<Communication space>
As shown in FIG. 2, the communication space 1000 communicates the first storage space 660 and the second storage space 940 in the z direction. The remaining portion of the third capacitor case 331 is housed in the communication space 1000 . A cable 740 connected to the first connector 720 passes through the communication space 1000 and is connected to the second connector 730 .

<Cooling channel>
The coolant flows through the cooling channels 874 defined by the first supporting wall portion 831 , the connecting portion 833 , the second supporting wall portion 832 , and the plate 810 as described above. A first electrical component group 860 including a second switch module 562 , a second capacitor case 321 and a second reactor case 522 is mounted on the plate 810 . First electrical component group 860 is actively cooled by a coolant.

As shown in FIG. 3, a first cooling channel 871 and a third cooling channel 873 extending in the x direction in the cooling channel 874 and a second cooling channel connecting the first cooling channel 871 and the third cooling channel 873 872 are formed.

The first cooling channel 871 is located closer to the second side wall 822 than the third cooling channel 873 is. A coolant supplied from the outside flows through the first cooling channel 871 . After passing through the first cooling channel 871 , the coolant passes through the second cooling channel 872 and then through the third cooling channel 873 . The coolant that has flowed through the third cooling flow path 873 passes through piping (not shown) and flows into the cooler 700 provided in the power module 710 .

These cooling channels 874 are indicated by dashed lines in FIG. A boundary between the first cooling channel 871 and the second cooling channel 872 is indicated by a dashed line. A boundary between the second cooling channel 872 and the third cooling channel 873 is indicated by a chain double-dashed line.

<Power module>
As previously shown, power module 710 includes cooler 700 and first switch module 702 . The cooler 700 has a supply pipe 703, a discharge pipe 705, and a plurality of relay pipes 704 connecting the supply pipe 703 and the discharge pipe 705, as shown in FIG. The supply pipe 703 and the discharge pipe 705 extend in the x direction and are exposed from the fifth sidewall 911 . Supply pipe 703 and discharge pipe 705 are spaced apart in the y-direction. Each of the plurality of relay pipes 704 extends from the supply pipe 703 toward the discharge pipe 705 along the y direction.

A coolant supplied from the cooling flow path 874 described above through a pipe (not shown) flows through the supply pipe 703 . The refrigerant flowing through the supply pipe 703 flows through a plurality of relay pipes 704 to the discharge pipe 705 . The refrigerant flowing into the discharge pipe 705 is discharged to the outside.

The first switch module 702 is housed in the cooler 700 as described above. The first switch module 702 is sandwiched between the fifth side wall 911 and an urging member (not shown) in the x direction, and positively contacts the relay pipe 704 . Heat generated in the first switch module 702 can be radiated to the coolant through the relay pipe 704 .

The power module 710, the first reactor case 512, the first capacitor case 311, the control circuit board 340, and part of the third capacitor case 331 housed in the second housing space 940 are appropriately referred to as a second electrical component group 870.

<Effect>
The first storage space 660 and the second storage space 940 are arranged side by side in the z direction via the support portion 830 and the plate 810 . The second storage space 940 is located closer to the second cover 920 in the z direction than the first storage space 660 is. The first storage space 660 and the second storage space 940 communicate with each other in the z direction via the communication space 1000 .

A first electrical component group 860 is stored in the first storage space 660 . A second electrical component group 870 is stored in the second storage space 940 . As described above, the z-direction separation distance L4 between the plate surface 810a and the first main surface 350a in the first storage space 660 is greater than the z-direction separation distance L2 between the plate surface 810a and the third main surface 321a. is also shorter. A z-direction separation distance L4 between the plate surface 810a and the first main surface 350a is shorter than a z-direction separation distance L3 between the plate surface 810a and the fourth main surface 522a.

Therefore, the airflow resistance in the space between the plate surface 810a and the first main surface 350a is greater than the airflow resistance between the plate surface 810a and the third main surface 321a. The airflow resistance in the space between the plate surface 810a and the first main surface 350a is greater than the airflow resistance between the plate surface 810a and the fourth main surface 522a.

Dust generated from the second electrical component group 870 provided in the second storage space 940 is less likely to pass through the communication space 1000 and adhere to the first main surface 350a. If the dust generated from the second electrical component group 870 is conductive, the short circuit of the switch circuit board 350 is easily suppressed.

As previously shown, a portion of cable 740 extending in the z-direction faces the space between plate surface 810a and first major surface 350a in x-direction. Therefore, the ventilation resistance between the plate surface 810a and the first main surface 350a tends to increase.

Even if dust generated from second electrical component group 870 moves to first storage space 660 through communication space 1000, cable 740 tends to prevent dust from adhering to first main surface 350a. there is Dust is less likely to adhere to the first main surface 350a.

As described above, the first connector 720 is provided on the third side wall 823 side of the switch circuit board 350 . A second connector 730 is provided on the seventh side wall 913 side of the control circuit board 340 . The length of the cable 740 that connects the switch circuit board 350 and the control circuit board 340 through the communication space 1000 tends to be shortened. Intrusion of noise into the cable 740 is easily suppressed.

As previously shown, the second resin member 561 of the second switch module 562 is positioned between the plate 810 and the switch circuit board 350 in the z-direction. The distance between the first main surface 350a of the switch circuit board 350 and the second resin surface 561b of the second resin member 561 is shorter than the distance between the first main surface 350a and the plate surface 810a.

The airflow resistance between the first main surface 350a and the second resin surface 561b tends to be greater than the airflow resistance between the first main surface 350a and the plate surface 810a. Even if dust generated from the second electrical component group 870 moves through the communication space 1000 to the first storage space 660, the dust is less likely to adhere to the first main surface 350a.

Although the preferred embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present disclosure.

(First modification)
As shown in FIG. 5, the plate 810 may not be connected to the first support wall portion 831 . In that case, the first electrical component group 860 may be mounted on the second support surface 831b side of the first support wall portion 831 . A z-direction separation distance L5 between the second support surface 831b and the second main surface 350b is shorter than a z-direction separation distance L6 between the second support surface 831b and the third main surface 321a. A z-direction separation distance L5 between the second support surface 831b and the second main surface 350b is shorter than a z-direction separation distance L7 between the second support surface 831b and the fourth main surface 522a.

In the first storage space 660, the separation distance L8 in the z direction between the second support surface 831b and the first main surface 350a on the back side of the second main surface 350b is is shorter than the separation distance L6. A z-direction separation distance L8 between the second support surface 831b and the first main surface 350a is shorter than a z-direction separation distance L7 between the second support surface 831b and the fourth main surface 522a.

The airflow resistance of the space between the second support surface 831b and the first main surface 350a is greater than the airflow resistance between the second support surface 831b and the third main surface 321a. The airflow resistance of the space between the second support surface 831b and the first main surface 350a is greater than the airflow resistance between the second support surface 831b and the fourth main surface 522a. Therefore, dust generated from second electrical component group 870 is less likely to pass through communication space 1000 and adhere to first main surface 350a.

By mounting the first electrical component group 860 on the first support wall portion 831, a cooling flow is formed in the space defined by the first support wall portion 831, the second support wall portion 832, and the connecting portion 833. It is actively cooled by coolant passed through passage 874 .

(Other modifications)
In this embodiment, an example in which the power conversion device 300 is included in the vehicle-mounted system 100 for an electric vehicle is shown. However, application of the power converter 300 is not particularly limited to the above example. For example, a configuration in which power conversion device 300 is included in a hybrid system that includes a motor and an internal combustion engine can also be adopted.

In this embodiment, an example in which one motor 400 is connected to the power converter 300 is shown. However, a configuration in which a plurality of motors 400 are connected to power converter 300 can also be adopted. In this case, the power conversion device 300 has a plurality of three-phase switch modules for configuring an inverter.

321... Second capacitor case 321a... Third main surface 350... Switch circuit board 350a... First main surface 350b... Second main surface 522... Second reactor case 522a... Fourth main surface 531... First high side switch 532 First low side switch 541 Second high side switch 542 Second low side switch 561 Second resin member 651 Third high side switch 652 Third low side switch 660... First storage space 720... First connector 730... Second connector 740... Cable 800... First case 810... Plate 810a... Plate surface 820... First frame 820b... First frame Inner surface 830 Support portion 831 First support wall portion 832 Second support wall portion 832a Third support surface 860 First electrical component group 870 Second electrical component group 900 Second Case 910...Second frame portion 940...Second storage space 1000...Communication space

Claims (3)

a plurality of first switches (541, 542), a switch circuit board (350) electrically connected to the plurality of first switches, and an electrical component (321) electrically connected to the plurality of first switches , 522); and
a second electrical component group (870) comprising a plurality of second switches (531, 532, 651, 652);
a case (800, 900) for housing the first electrical component group and the second electrical component group;
The case protrudes from an annular outer wall portion (820, 910) and an inner wall surface (820b) of the outer wall portion so that the space of the outer wall portion is a first storage space for storing the first electrical component group. (660) and a second storage space (940) for storing the second electrical component group, and the first mounting surface (810a) for mounting the first electrical component group and the second electrical component group are mounted. a mounting portion (810, 830) comprising a second mounting surface (832a) for
A communication space (1000) that communicates the first storage space and the second storage space is formed in the case by separating the mounting portion and the outer wall portion,
The switch circuit board has a main surface (350a) facing the first mounting surface with a gap therebetween in the direction in which the first mounting surface and the second mounting surface are aligned,
The main surface is positioned closer to the first mounting surface in the arranging direction than the arranging surfaces (321a, 522a) positioned away from the first mounting surface of the electrical component in the arranging direction. Power converter. a connector (720) provided on the switch circuit board;
a cable (740) connected to the connector;
the cable extends from the switch circuit board through the communication space toward the second storage space;
2. The power converter according to claim 1, wherein a portion of said cable faces the space between said first mounting surface and said main surface in a horizontal direction orthogonal to said arrangement direction. The first electrical component group has a covering resin (561) covering the plurality of first switches,
The power converter according to claim 1 or 2, wherein the coating resin is positioned between the first mounting surface and the main surface in the alignment direction.

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