JP2019071432A - Electronic device - Google Patents

Abstract

A method of effectively releasing heat of a mobile terminal is provided.
The electronic device comprises a heat emitting element, the heat emitting element being disposed on a circuit board PCB. The electronic device further comprises a heat pipe group. The heat pipe group comprises at least two heat pipes 101, 102, the heat pipe group being located on the heat emitting element. The plurality of heat pipes in the heat pipe group have at least one different characteristic parameter. The optimal working areas of the heat pipes in the heat pipe group are different. The plurality of heat resistance ranges of at least two heat pipes in the heat pipe group is 0.05 to 1 ° C., when the plurality of heat pipes in the heat pipe group operate in the corresponding optimum plurality of operating regions. / W.
[Selected figure] Figure 1

Description

  The present invention relates to the field of heat dissipation techniques, and in particular to electronic devices.

  With the rapid spread of Long Term Evolution (LTE) technology, mobile Internet is providing high precision and high performance multimedia applications. As a result, mobile data services are rapidly growing and power consumption of mobile terminals significantly increases, which is an unprecedented challenge for heat dissipation design in a limited space.

  The high temperature surface area for heat dissipation during operation of the mobile terminal corresponds to the position of the main CPU on the L-shaped printed circuit board (PCB). Since power consumption is concentrated on a central processing unit (CPU) and a graphic processing unit (GPU), the temperature distribution in thermal design has a large difference. Originally, a magnesium alloy for die-casting (thermal conductivity coefficient k is “k ≦ 70 W / m−K”) and a graphite film (thickness t is “t = 0.02—that connect a low temperature region and a high temperature region The thermal conductivity performance of “0.1 mm” and the thermal conductivity coefficient k is “k = −1200 W / m−K” can not meet the user's higher thermal design requirements. Therefore, how to effectively dissipate the heat of the mobile terminal is an urgent issue that needs to be resolved in the industry.

  The present invention solves the technical problem in the prior art that the heat dissipation performance of the electronic device is poor, and provides an electronic device that improves the heat dissipation performance of the electronic device.

  According to a first aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a heat emitting element, the heat emitting element being arranged on a circuit board PCB, the electronic device being a heat pipe group The heat pipe group has at least two heat pipes, the heat pipe group is located on the heat emitting element, and the heat pipes in the heat pipe group have at least one different characteristic parameter, The optimum working areas of the heat pipes in the heat pipe group are different, and when the heat pipes in the heat pipe group operate in the corresponding optimum working areas, the heat pipes in the heat pipe group The plurality of heat resistance ranges of the heat pipe of is further provided with a heat pipe group, which is 0.05-1 ° C / W .

  Referring to the first aspect, in the first possible mounting method, the characteristic parameters are: pipe diameter of heat pipe, capillary layer cross sectional area of heat pipe, working material mass of heat pipe, type of working material of heat pipe, heat One or more of the pipe material of the pipe or the pipe material thickness of a plurality of heat pipes of the same pipe material.

  Referring to the first possible implementation mode of the first aspect or the first aspect, in the second possible implementation mode, the thermal interface material is disposed between the heat emitting element and the heat pipe group.

  Referring to any one of the first possible implementations for the first aspect or the second possible implementation of the first aspect, in the third possible implementation, the heat emitting element is a CPU , GPU, or CPU and GPU.

Referring to the first possible mounting method, in the fourth possible mounting method, the heat pipe group has two heat pipes, and the characteristic parameter is the pipe diameter of the heat pipe, and in the two heat pipes The pipe diameter of the first heat pipe is different from that of the second heat pipe, and the first heat pipe and the second heat pipe have the same plurality of other characteristic parameters except for the pipe diameter of the heat pipe And if the diameter of the first heat pipe is larger than the diameter of the second heat pipe, the first heat pipe is a high temperature efficiency heat pipe and the second heat pipe is low A temperature efficient heat pipe, or
The characteristic parameter is the capillary layer cross section of the heat pipe,
In the two heat pipes, the capillary layer cross sectional area of the first heat pipe is different from that of the second heat pipe, and the first heat pipe and the second heat pipe exclude the capillary pipe cross sectional area of the heat pipe The first heat pipe has high temperature efficiency if it has the same plurality of other characteristic parameters and the capillary layer cross-sectional area of the first heat pipe is larger than the capillary layer cross-sectional area of the second heat pipe The second heat pipe is a low temperature efficiency heat pipe, or the characteristic parameter is the working mass of the heat pipe,
In the two heat pipes, the working mass of the first heat pipe is different from that of the second heat pipe, and the first heat pipe and the second heat pipe are identical except for the working substance of the heat pipe The quantity of working substance injected into the first heat pipe is equal to the actual capillary demand and the quantity of working substance injected into the second heat pipe, with several other characteristic parameters. The first heat pipe is a high temperature efficiency heat pipe, and the second heat pipe is a low temperature efficiency heat pipe if the actual capillary demand is less than that of the heat pipe or the characteristic parameter is the heat pipe Is a working substance,
In the two heat pipes, the working material of the first heat pipe is different from that of the second heat pipe, and the first heat pipe and the second heat pipe have the same plurality other than the latent heat of the heat pipe. And the first heat pipe is a high temperature efficiency heat pipe, if the latent heat of the working material of the first heat pipe is greater than the latent heat of the working material of the second heat pipe, The second heat pipe has two heat pipes, which are low temperature efficiency heat pipes.

  According to a second aspect, an electronic device is provided, the electronic device comprising a heat emitting element, the heat emitting element being disposed on the circuit board PCB, the electronic device being a heat pipe and the heat pipe being at least The heat pipe has two independent heat conduction paths, the heat pipe is located on the heat emitting element, and the plurality of heat conduction paths in the heat pipe have at least one different characteristic parameter, and the plurality of heats in the heat pipe The optimal working areas of the conduction path are different, and when the thermal conduction paths in the heat pipe operate in the corresponding optimal working areas, the thermal conduction paths in the heat pipe are The heat resistance range further includes a heat pipe, which is 0.05-1 ° C./W.

  Referring to the second aspect, in the second possible implementation manner, the characteristic parameters are the diameter of the heat conduction path, the capillary layer cross-sectional area of the heat conduction path, the working material mass of the heat conduction path, and the heat conduction path One or more of the type of working substance, the tube material of the heat transfer path, or the tube thickness of the heat transfer path.

  Referring to the second possible implementation mode of the second aspect or the second aspect, in the second possible implementation mode, the thermal interface material is disposed between the heat emitting element and the heat pipe.

  According to a third aspect, an electronic device is provided, the electronic device comprising a heat emitting element, the heat emitting element being disposed on a circuit board PCB, the electronic device being a first heat pipe and a second heat pipe The first heat pipe and the heat emitting element are arranged on the same side of the PCB, the first heat pipe is connected to the heat emitting element, and the second heat pipe is at the second position of the PCB The second heat pipe is connected to the heat emitting element using a heat conductive metal, the heat emitting element is arranged on the back of the second position of the PCB, and the first heat pipe is Unlike the second heat pipe by at least one characteristic parameter, the optimum plurality of working areas of the first heat pipe and the second heat pipe differ, the first heat pipe and the second heat pipe being The first heat pipe, wherein the plurality of heat resistance ranges of the first heat pipe and the second heat pipe are 0.05 to 1 ° C./W when operating in the corresponding optimum plurality of operation regions. And a second heat pipe.

Referring to the third aspect, in the first possible implementation manner, the fact that the first heat pipe is connected to the heat emitting element is specifically:
The first heat pipe is located on the heat emitting element, and the thermal interface material is disposed between the first heat pipe and the heat emitting element, or the first heat pipe is made of a heat conductive metal. Used to connect to the heat emitting element, the thermally conductive metal is the copper layer of the PCB.

  Referring to the third aspect, in the second possible mounting mode, the characteristic parameters are: pipe diameter of heat pipe, capillary layer cross-sectional area of heat pipe, working material mass of heat pipe, working material of heat pipe One or more of the type and the pipe material of the heat pipe or the pipe material thickness of a plurality of heat pipes of the same pipe material.

  One or more of the aforementioned technical solutions in the embodiments of the present application have at least the following beneficial effects. In the solutions provided in the embodiments of the invention, a heat pipe is used to implement the heat dissipation of the mobile electronic device, in the solution provided in the invention, the corresponding heat pipe group is a thermal The heat of the emitting element is arranged on the same heat emitting element by the characteristic that it changes with different operating states of the electronic device, wherein the heat pipe group comprises at least two heat pipes and the heats The optimum working areas of the pipes are different, ie the maximum heat transfer rates of the heat pipes are different, whereby the heat pipes with different characteristic parameters have different heat emitting elements Heat dissipation can be performed depending on the operating state of the

It is a schematic structure figure of the electronic device by method 1 in Embodiment 1 of this application. FIG. 1 is a schematic structural view of an electronic device according to method 2 in Embodiment 1 of the present application. It is a schematic structure figure of the electronic device by Embodiment 2 of this application. It is a schematic structure figure of the electronic device by method 1 in Embodiment 3 of this application. It is a schematic structure figure of the electronic device by method 2 in Embodiment 3 of this application.

  Heat pipes are an effective heat transfer element. The heat pipe has a high thermal conductivity and generally includes a pipe housing, a pipe core, and a working substance (working medium). Heat pipes (heat transfer coefficient k is "k> 5000 W / mK") become the main option as a solution for overheating of the chips of the mobile terminal.

  The heat release of the mobile terminal is not constant and changes at any time depending on the application running on the mobile terminal. The range of change is relatively large. Thus, if there is a relatively large difference between the heat dissipated at high power consumption and the heat dissipated at low power consumption of the mobile terminal, then one heat pipe is the lower power of the mobile terminal. It is difficult to perform heat dissipation both in the area of consumption and in the high power consumption. As a result, it is difficult to achieve the desired heat dissipation effect. For example, when the mobile terminal starts the application with high power consumption (maximum power consumption “Qmax_DP> 8 W” and DP represents design output) using CPU at full load, heat dissipation is performed The maximum heat transfer amount is “Qmax_HP ≧ 8 W” in order to do that, and HP needs to use a heat pipe representing a heat pipe. However, generally, when the user uses a mobile terminal, power consumption (Qnormal_DP) is generally as follows. "Qnormal_DP <3W". Accordingly, a heat pipe with "Qmax_HPHP3W" may be used to perform heat dissipation. Thus, if one heat pipe is used and there is a relatively large difference between the heat emitted by the mobile terminal's high power consumption and the heat emitted by the low power consumption, the heat pipe generally The desired heat dissipation effect can not be achieved.

  BRIEF DESCRIPTION OF DRAWINGS To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, reference will now be made to the accompanying drawings of the embodiments of the present invention. The technical solutions in the embodiments of the present invention will be clearly described. It is obvious that the embodiments to be described are not all but some of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall be included within the protection scope of the present invention.

  In the heat pipe, different characteristics of the heat pipe correspond to different maximum heat transfer amounts (Qmax_HP) of the heat pipe. The features of the heat pipe include the size, diameter, length, etc. of the heat pipe. Qmax_HP corresponding to each heat pipe acquired after being designed is a fixed value. When the heat pipe operates in the optimal working area (lowest thermal resistance), the heat pipe has optimal heat transfer performance. When the heat emitting element operates with low power consumption, the heat pipe has a relatively large thermal resistance value because the operation is not sufficiently initiated. When the heat emitting element operates at high power consumption (above Qmax_HP), the working material of the heat pipe can not be added in time, and therefore the requirements of the high temperature area for operation can not be fulfilled, This results in multiple challenges in that the hot end of the heat pipe is dried due to boiling and the temperature of the heat emitting element (e.g. CPU or GPU) rises continuously.

  The heat emitting elements referred to in embodiments of the present invention refer to, for example, elements that emit heat to the surrounding environment in the actuation process, CPUs and GPUs that are most common in electronic devices . However, the heat emitting element mentioned in the embodiments of the present invention is not limited to the two elements of CPU and GPU.

In view of the above-mentioned properties and problems that may arise when one heat pipe is used to release the heat of the electronic device, the above-mentioned problems and properties of the heat pipe are mentioned Embodiments of the present invention provide an electronic device after the plurality of properties of are comprehensively analyzed. Electronic devices
A heat emitting element, disposed on the circuit board PCB, a heat emitting element, a heat pipe group, the heat pipe group having at least two heat pipes, the heat pipe group being a heat emitting element Located above, the plurality of heat pipes in the heat pipe group have at least one different characteristic parameter, and the optimum plurality of working areas of the plurality of heat pipes in the heat pipe group are different; The heat resistance range of the at least two heat pipes of the heat pipe group is 0.05-1 ° C./W, when the heat pipes operate in the corresponding optimum operating regions. And a pipe group.

  The characteristic parameters include the pipe diameter of the heat pipe, the capillary layer cross-sectional area, the working substance mass (ie, the loading amount of the working substance), the type of working substance, and the pipe material of the heat pipe (multiple embodiments of the present invention The pipe material of the heat pipe in can be copper or aluminum), or at least one or more of the pipe material thickness of a plurality of heat pipes of the same pipe material.

  It can be understood that the optimum working area may mean the following. When the power dissipation of the heat dissipating element is relatively high (e.g. the power consumption is at least about 10 W), one heat pipe in the heat pipe group performs heat dissipation on the heat dissipating element, in this case: The heat resistance of the heat pipe is relatively low or lowest, where the heat resistance of the heat pipe is relatively low or lowest means that, in another case, the heat pipe dissipates heat on the heat emitting element Against the heat resistance of the heat pipe, and if the power consumption of the heat emitting element is relatively low (eg, the power consumption is approximately 2-3 W), Heat pipe performs heat dissipation on the heat emitting element, where the heat resistance of the other heat pipe is relatively low or lowest, where the heat resistance of the other heat pipe is relatively low It is that the lowest, in another case, the heat pipe, when running radiator on thermal emission element, is with respect to the thermal resistance of the heat pipe. If the heat resistance of each heat pipe in the heat pipe group is relatively low or lowest, the fact that each heat pipe in the heat pipe group performs heat dissipation on the heat emitting element means that each heat in the heat pipe group is different. The pipe is to operate in the corresponding optimum operating area.

  In view of the feature that the heat of the heat emitting element changes with different operating states of the electronic device, in the solutions provided in the embodiments of the invention, the corresponding heat pipe groups are identical And the heat pipe group has at least two heat pipes. The optimal working areas of the heat pipes may be different, ie the maximum heat transfer rates of the heat pipes may be different. Thus, a plurality of heat pipes with different characteristic parameters can perform the heat dissipation process with different operating states of the heat emitting element.

  Several possible implementation schemes of several embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Embodiment 1
Referring to the figures, this embodiment of the present application provides an electronic device. Electronic devices
A heat emitting element, disposed on the circuit board PCB, a heat emitting element, a heat pipe group, the heat pipe group having at least two heat pipes, the heat pipe group being a heat emitting element Located above, the plurality of heat pipes in the heat pipe group have at least one different characteristic parameter, and the optimum plurality of working areas of the plurality of heat pipes in the heat pipe group are different; Heat pipes in which at least two heat pipes of a heat pipe group have a heat resistance range of 0.05-1 ° C./W, when the heat pipes operate in a corresponding optimum working area And a group.

  In this embodiment of the present invention, when the heat pipe operates in the optimum working area, the heat resistance of the heat pipe may be 1 ° C./W (degree Celsius / Watt). In a specific application, when the heat pipe operates in the optimum operating area, the heat resistance of the heat pipe is generally comprised within the range of 0.05-1 ° C./W (degrees Celsius / Watt).

  In this embodiment of the present invention, the characteristic parameters are: pipe diameter of heat pipe, capillary layer cross-sectional area, working substance mass (ie, working substance loading amount), working substance type, heat pipe pipe material (in the present invention) In this embodiment, the pipe material of the heat pipe may be copper or aluminum) or one or more of the pipe material thicknesses of multiple heat pipes of the same pipe material. As the heat pipe characteristic parameters change, the optimum working area or maximum heat transfer of the heat pipe changes accordingly. Thus, the plurality of characteristic parameters of the plurality of heat pipes in the heat pipe group are set to a plurality of different values, whereby the optimum plurality of working areas of the plurality of heat pipes in the heat pipe group do not overlap. The heat pipes in the heat pipe group are each in an optimum operating area with different power consumption, which may satisfy the heat transfer requirements of the heat emitting element in different conditions.

  In this embodiment of the invention, the heat pipe group may have a plurality of heat pipes, and the optimal plurality of working areas of the plurality of heat pipes are different. The heat pipe characteristic parameters determine the optimal working area of the heat pipe. There are several characteristic parameters that determine the optimal working area of the heat pipe. The optimal working area of the heat pipe can be changed by changing any one of a plurality of characteristic parameters. Thus, the plurality of heat pipes in this embodiment of the invention differ from one another according to the characteristic parameters, and different optimal operation areas of the plurality of heat pipes can be implemented in a plurality of manners. In order to describe the solution provided in this embodiment of the invention in more detail, three relatively general types of pipe diameter of heat pipe, parameters of capillary layer cross section, working substance mass, working substance type The solution in this embodiment of the invention will be described below by means of various characteristic parameters. The arbitrary plurality of implementation methods include the following plurality of methods.

  For ease of explanation, the following embodiments use an example where the heat pipe group has two heat pipes. In a specific implementation, the heat pipe group may also have multiple heat pipes, for example three heat pipes or four heat pipes. As a plurality of heat pipe mounting methods, two heat pipe mounting methods may be referred to.

  Method 1 changes the characteristic parameter of the pipe diameter of the heat pipe among the plurality of characteristic parameters. The implementation scheme corresponding to this embodiment of the invention is as follows (the specific structure is shown in FIG. 1).

  In the two heat pipes, the pipe diameter of the first heat pipe 101 is different from that of the second heat pipe 102. The first heat pipe and the second heat pipe have the same plurality of other characteristic parameters except for the pipe diameter of the heat pipe, and the pipe diameter of the first heat pipe is the second heat pipe The first heat pipe is a high temperature efficiency heat pipe, and the second heat pipe is a low temperature efficiency heat pipe.

  In this embodiment of the invention, where the heat pipes in the heat pipe group are heat pipes with different diameters, the high temperature efficiency heat pipe is a heat pipe with a large diameter, The low temperature efficiency heat pipe is a heat pipe with a small diameter. Heat pipes (which are normal parameter designs) have different optimal working areas or heat transfer rates due to different diameters of heat pipes. By using multiple heat pipes of different pipe diameters, it is possible to ensure that the optimal multiple working areas of the two heat pipes do not overlap. In this case, the heat transfer requirements of the heat emitting element (e.g., CPU and / or GPU) in different situations may be met.

  Method 2 changes the characteristic parameter of the capillary layer cross-sectional area of the heat pipe among the plurality of characteristic parameters. The implementation scheme corresponding to this embodiment of the invention is as follows (the specific structure is shown in FIG. 2).

  In the two heat pipes, the capillary layer cross-sectional area of the first heat pipe 201 is different from that of the second heat pipe 202. The first heat pipe and the second heat pipe have the same plurality of other characteristic parameters except for the capillary layer cross-sectional area of the heat pipe, and the capillary layer cross-sectional area of the first heat pipe 201 is If the second heat pipe 202 is larger than the capillary layer cross section, the first heat pipe 201 is a high temperature efficiency heat pipe, and the second heat pipe 202 is a low temperature efficiency heat pipe.

  Different capillary layer cross sections can affect the heat transfer capacity of the heat pipe. The capillary layer cross-sectional area of the low temperature efficiency heat pipe is smaller than the capillary layer cross sectional area of the high temperature efficiency heat pipe. The capillary structure may be a sintered copper powder structure, a mesh structure, a fiber structure, or a groove structure.

  The amount of heat transfer of the low temperature efficiency heat pipe is relatively small. Thus, when the power consumption of the heat emitting element (which may be CPU and / or GPU) is relatively low (power consumption is around 2-3 W), the low temperature efficient heat pipe is fully activated Operating in the optimum operating area, this has the effect of effectively releasing the heat of the heat emitting element with low power consumption.

  However, when the power consumption of the heat emitting elements (CPU and / or GPU) is relatively high (power consumption is at least about 10 W), the high temperature efficiency heat pipe is fully initiated and the high temperature efficiency heat pipe is Operating in the optimum operating area, this has the effect of effectively releasing the heat of the heat emitting element with high power consumption.

  The capillary layer cross-sectional area is varied so that the optimal multiple working areas of the low temperature efficient heat pipe and the high temperature efficient heat pipe do not overlap. Thus, in different operating situations (corresponding to different power consumption of the heat emitting element), multiple heat dissipation requirements of the heat emitting element (which may be CPU and / or GPU) are ensured.

  Method 3 changes the characteristic parameter of the working substance mass among the plurality of characteristic parameters. The implementation scheme corresponding to this embodiment of the invention is as follows.

  In the two heat pipes, the working mass of the first heat pipe is different from that of the second heat pipe. The first heat pipe and the second heat pipe have the same plurality of other characteristic parameters except for the working mass of the heat pipe, and the amount of working substance injected into the first heat pipe is The first heat pipe is a high temperature efficiency heat pipe and the first heat pipe is a high temperature efficiency heat pipe if the actual capillary demand is equal and the amount of working substance injected into the second heat pipe is less than the actual capillary demand. The second heat pipe is a low temperature efficient heat pipe.

  The working mass is varied so that the optimal working areas of the low temperature efficient heat pipe and the high temperature efficient heat pipe do not overlap. In a specific operation, the first heat pipe is filled with an amount of working substance equal to the actual capillary demand, so that if the power consumption of the heat emitting element is relatively high (the high temperature efficient heat pipe The optimal working area of the first heat pipe moves to higher power consumption and the working substance of the first heat pipe works well to achieve the heat dissipation effect. As a low temperature efficiency heat pipe, the second heat pipe is injected with a smaller amount of working substance than the actual capillary requirements of the heat pipe, and the optimum working area of the second heat pipe to relatively low power consumption The working material of the second heat pipe works well if the power consumption of the heat emitting element is relatively low. Thus, the high temperature efficiency heat pipe transfers heat when the power consumption is relatively high, and the low temperature efficiency heat pipe starts transferring heat sufficiently when the power consumption is low. It is certain that the heat pipe group can always meet the heat transfer requirements of the heat emitting elements (CPU and / or GPU) in different operating situations (different power consuming states of the heat emitting elements) .

  Method 4 changes the characteristic parameter of the type of working material of the heat pipe among the plurality of characteristic parameters. The implementation scheme corresponding to this embodiment of the invention is as follows.

  In the two heat pipes, the type of working substance of the first heat pipe is different from that of the second heat pipe. The first heat pipe and the second heat pipe have the same plurality of other characteristic parameters except for the latent heat of the heat pipe, and the latent heat of the working material of the first heat pipe is the second heat If greater than the latent heat of the working material of the pipe, the first heat pipe is a high temperature efficiency heat pipe and the second heat pipe is a low temperature efficiency heat pipe.

  The heat transfer capacity of the heat pipe is related to the latent heat of the working substance. In the two heat pipes, the type of working substance of the first heat pipe is such that, in the two heat pipes, the optimum working area of the first heat pipe is different from that of the second heat pipe. Different from that of 2 heat pipes. For example, a working substance having a relatively low latent heat of methanol, R134A, acetone is added to the low temperature efficiency heat pipe, for example, a working substance having a relatively high latent heat of water is added to the high temperature efficiency heat pipe The two heat pipes have different heat transfer capabilities. Thus, when the heat emitting element (e.g., CPU or GPU) is in a low power consumption operating condition, the heat pipe (i.e., low temperature efficiency heat pipe) filled with a working material with low latent heat is the optimal operation A heat pipe (i.e., a high temperature efficiency heat pipe) that starts up in the region and is filled with a working material with high latent heat such as water (i.e. a high temperature efficiency heat pipe) is not fully initiated. When the heat releasing element is in a high power consumption operating condition, the heat pipe filled with a high latent heat working material such as water (ie, high temperature efficiency heat pipe) is fully activated. It is ensured that in different operating situations (different power consumption states of the heat emitting element), the heat transfer requirements of the heat emitting element are fulfilled.

  The previously described methods of designing the heat pipe separately describe the influence of only one characteristic parameter of the heat pipe on the optimum working area of the heat pipe. However, in practical applications, the characteristic parameters of the heat pipes in the heat pipe group may be set to different values, whereby the optimum plural corresponding to the heat pipes in the heat pipe group The working area of is different. The solution provided in this embodiment of the present invention will be further described below with reference to a plurality of specific examples, wherein the solution specifically includes the following content.

  The following embodiments use an example in which the heat pipe group has two heat pipes. In a specific implementation, the heat pipe group may have a plurality of heat pipes, and the mounting scheme of the plurality of heat pipes is identical to that of the two heat pipes. If the heat pipe diameter characteristic parameters are changed, the optimal plurality of working areas of the two heat pipes will be different. The high temperature efficiency heat pipe is a large diameter heat pipe, and the low temperature efficiency heat pipe is a small diameter heat pipe. However, based on practical needs, the optimal multiple working areas of the two heat pipes need to be further adjusted, and the corresponding multiple implementations may be further as follows. (1) In the heat pipe group, the capillary layer cross-sectional area of the first heat pipe is different from that of the second heat pipe. In general, the heat transfer capacity of the heat pipe decreases as the diameter of the heat pipe decreases, the main reason being that the capillary layer cross-sectional areas designed in the heat pipes differ. Thus, the relatively small diameter heat pipe is designed as a low temperature efficiency heat pipe, and the relatively large diameter heat pipe is designed as a high temperature efficiency heat pipe, where the optimal multiple working areas of the two heat pipes May be completely different. In addition, the capillary layer cross-sectional area of the low temperature efficiency heat pipe can be further reduced, which moves the optimal working area of the low temperature efficiency heat pipe to lower power consumption, thereby making the two heat pipes The optimal plurality of operating areas of can be more reliably not overlapping. Thus, multiple heat transfer requirements of the heat emitting element (which may be a CPU or GPU) are implemented in different power consumption situations. (2) In the heat pipe group, the working mass of the first heat pipe is different from that of the second heat pipe. Due to the different tube diameters, the working mass of the low temperature efficiency heat pipe is reduced (at the same time, the working mass of the high temperature efficiency heat pipe may or may not be increased), whereby the tube diameter Based on changing, the optimal multiple working areas of the two heat pipes are further separated. Thus, multiple heat transfer requirements of the heat emitting element in different situations are implemented. (3) In the heat pipe group, the working substance of the first heat pipe is different from that of the second heat pipe. Based on the different tube diameters, the working substance filled in the low temperature efficiency heat pipe is changed to a working substance having a relatively low latent heat of, for example, methanol, tetrafluoroethane (R-134A), or acetone. Thus, the optimal working area of the low temperature efficiency heat pipe moves towards the low power consumption area. Thus, multiple heat transfer requirements of the device in different situations are implemented.

  The previously mentioned schemes (1), (2) and (3) are described using an example in which two characteristic parameters affect the optimum working area of the heat pipe. In practical applications, more parameters may be used in combination to achieve the purpose of different optimal operating areas of the heat pipes in the heat pipe group. For example, the first heat pipe and the second heat pipe are heat pipes of different diameters. Designed for low temperature efficiency heat pipes with smaller capillary layer cross-sectional area (less than normal cross-sectional area) but with lesser working mass than in the normal design and additional working material with low latent heat Thus, the low temperature efficiency heat pipe reaches the optimum operating area with lower power consumption of the heat emitting element. Thus, the optimal working areas of the two heat pipes with different diameters do not overlap at all and it is certain that the heat pipe group can meet the heat conduction requirements of the heat emitting element for a wide range of heat dissipation obtain.

  In the foregoing embodiments, the heat pipe group may be attached to the heat emitting element in a plurality of manners. In a specific application, a thermal interface material is disposed between the heat pipe group and the heat emitting element to achieve a better heat transfer effect.

  In the previous embodiments, the heat pipe groups are generally disposed on any heat emitting element. In a specific application, at least two heat pipes in the heat pipe group can be fixed to the heat emitting element by using specific fixing elements. In addition, in this embodiment, each heat pipe operates separately, so when the heat pipe group is arranged, a plurality of heat pipes with different characteristic parameters are arranged on the same heat emitting element If so, at least two heat pipes may be present separately.

Second Embodiment
As shown in FIG. 3, this embodiment of the present invention further provides another electronic device. The electronic device comprises a heat emitting element 301, which is arranged on the circuit board PCB. The electronic device is a heat pipe 302, the heat pipe having at least two independent heat conduction paths 302a, the heat pipe being located on the heat emitting element, and the plurality of heat conduction paths 302a in the heat pipe being The optimum operating regions of the heat conduction paths 302a in the heat pipe are different, and the heat conduction paths 302a in the heat pipe have corresponding optimum pluralities, having at least one different characteristic parameter. When operating in the working region, the plurality of heat resistance ranges of the plurality of heat conduction paths 302a in the heat pipe further comprises a heat pipe 302, which is 0.05-1 C / W.

  In this embodiment of the invention, the characteristic parameters include the diameter of the heat transfer path, the capillary layer cross section of the heat transfer path, the working mass of the heat transfer path, the type of working material of the heat transfer path, and the heat transfer. The tubing of the passageway (the tubing of the heat pipe in this embodiment of the invention may be copper or aluminum), or it may be one or more of the tubing thickness of the heat conducting pathway. As the heat pipe characteristic parameters change, the optimum working area or maximum heat transfer of the heat pipe changes accordingly. Thus, the plurality of characteristic parameters of the plurality of heat conduction paths in the heat pipe may be set to a plurality of different values, such that the optimum plurality of working areas of the plurality of heat conduction paths in the heat pipe are overlapping. Rather, the plurality of heat conduction paths in the heat pipe are each in a plurality of working areas that are optimal for different power consumption of the heat emitting element, which means that the heat conduction requirements of the heat emitting element in different circumstances Can meet

  In this embodiment of the invention, the at least two independent heat conduction paths differ from one another by at least one or more of diameter, capillary layer cross section, type of working substance and / or working substance mass.

  In this embodiment of the invention, the heat pipe comprises a plurality of heat transfer paths with different working areas. Thus, comparing the heat pipe provided in this embodiment of the present invention to a heat pipe having only one heat conduction path, the coverage area of the optimum working area of the heat pipe provided in the present invention is approximately 2 It is a double. When the heat pipe provided in this embodiment of the invention is used to perform heat dissipation on any heat emitting element, the multiple heat dissipation requirements of the heat emitting element at different power consumption can be maximized It can be satisfied.

  In the foregoing embodiments, the heat pipe group may be attached to the heat emitting element in a plurality of manners. In a specific application, a thermal interface material is disposed between the heat pipe group and the heat emitting element to achieve a better heat transfer effect.

Third Embodiment
As shown in FIG. 4, this embodiment of the present invention further provides another electronic device. The electronic device comprises a heat emitting element 401, which is arranged on the circuit board PCB. The electronic device further comprises a first heat pipe 402 and a second heat pipe 403.

  The first heat pipe 402 and the heat release element 401 are disposed on the same side surface of the PCB, and the first heat pipe 402 is connected to the heat release element 401.

  The second heat pipe 403 is arranged at the second position of the PCB, and the second heat pipe is connected to the heat emitting element using the heat conductive metal, and the heat emitting element 401 is the second of the PCB It is arranged on the back of the 2 position.

  The first heat pipe 402 differs from the second heat pipe 403 with respect to the characteristic parameters. The optimal plurality of working areas of the first heat pipe 402 and the second heat pipe 403 are different. When the first heat pipe 402 and the second heat pipe 403 operate in the corresponding optimal plurality of operation areas, the plurality of thermal resistance ranges of the first heat pipe 402 and the second heat pipe 403 are: It is 0.05-1 ° C / W.

In this embodiment of the invention, the first heat pipe 402 may be connected to the heat emitting element 401 in a plurality of specific mounting manners. Two optional schemes are provided below. In the first scheme, as shown in FIG.
The first heat pipe 402 is located on the heat emitting element 401, and the thermal interface material is disposed between the first heat pipe and the heat emitting element. In the second scheme, as shown in FIG.
The first heat pipe 402 is connected to the heat emitting element 401 using a heat conductive metal, which is the copper layer of the PCB.

  In this embodiment, by disposing the heat pipe beside the heat emitting element, the influence of the heat pipe on the thickness of the electronic device can be further reduced to the maximum.

  In this embodiment of the present invention, the first heat pipe 402 may be a low temperature efficiency heat pipe, and the second heat pipe 403 may be a high temperature efficiency heat pipe, in order to further achieve the heat dissipation effect.

  In this embodiment of the present invention, the characteristic parameters are: pipe diameter of heat pipe, capillary layer cross sectional area of heat pipe, working material mass of heat pipe, type of working material of heat pipe, pipe material of heat pipe (in the present invention) The pipe material of the heat pipe in this embodiment may be copper or aluminum) or one or more of the pipe material thicknesses of multiple heat pipes of the same pipe material.

  The characteristic parameters of the high temperature efficiency heat pipe and that of the low temperature efficiency heat pipe are set in the same manner as in the first embodiment in the second and third embodiments described above. In detail, the description of Embodiment 1 may be referred to, but the details are not described herein.

  One or more embodiments of the present invention may achieve at least the following technical effects.

  In the solutions provided in embodiments of the present invention, corresponding heat pipe groups are arranged on the same heat emitting element. The heat pipe group includes at least two heat pipes, and the optimum plurality of operating areas of the plurality of heat pipes may be different, ie, the plurality of maximum heat transfer amounts of the plurality of heat pipes may be different. As a result, heat pipes with different characteristic parameters can perform the heat dissipation process on the heat emitting element in different operating states. Therefore, the technical problem in the prior art that the heat dissipation performance of the electronic device is poor is solved, and the heat dissipation performance of the electronic device is improved.

  One heat pipe in the heat pipe group is started to carry out heat dissipation on the heat dissipating element when the power dissipation of the heat dissipating element is relatively high (e.g. the power consumption is at least about 10 W) Can be understood. In this case, the heat pipe is referred to as a high temperature efficiency heat pipe, where "high temperature" means that the heat pipe performs heat dissipation on the heat emitting element if the power consumption of the heat emitting element is relatively high It may mean that "efficiency" may mean that the heat pipe can effectively release the heat of the heat emitting element if the power consumption of the heat emitting element is relatively high. When the power dissipation of the heat emitting element is relatively low (e.g., the power consumption is around 2-3 W), another heat pipe in the heat pipe group starts to carry out heat dissipation on the heat emitting element . In this case, another heat pipe is referred to as a low temperature efficiency heat pipe, where "low temperature" means that if the heat dissipation element's power consumption is relatively low, another heat pipe is on the heat dissipation element. It can mean that the heat dissipation is performed, and “efficiency” means that another heat pipe can effectively release the heat of the heat dissipation element if the power consumption of the heat dissipation element is relatively low. It can.

  In addition, the solutions provided in embodiments of the present invention avoid the following problems. When high power consumption heat pipes are used with low power consumption, the thermal resistance is high and the heat transfer performance is poor. Boiling phenomena occur when low power consumption heat pipes are used at high power consumption, so the heat pipes stop and the heat transfer capability is poor.

  The electronic device may be any electronic device such as a mobile phone, a tablet computer, or a game console.

  The hybrid heat pipes provided in embodiments of the present invention can be flexibly arranged by the function of the compact arrangement of the mobile phone product, thereby implementing compact volume and PCB arrangement limitations, and multiple designs. Reduce constraints and, in particular, demonstrate the performance of low temperature efficient heat pipes.

  While preferred embodiments of the present invention have been described, one of ordinary skill in the art, given the basic inventive concepts, may make variations and modifications to these embodiments. Accordingly, the following claims are intended to be construed to cover the plurality of preferred embodiments and all variations and modifications that fall within the scope of the present invention.

  Clearly, one of ordinary skill in the art can make various variations and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. The present invention is intended to cover the modifications and variations provided that they fall within the scope defined by the following claims and their equivalents.

Claims (11)

An electronic device, the electronic device comprising a heat emitting element, the heat emitting element being disposed on a circuit board PCB, the electronic device comprising
A heat pipe group, wherein the heat pipe group includes at least two heat pipes, the heat pipe group is located on the heat emitting element, and a plurality of heat pipes in the heat pipe group is at least The optimal plurality of working areas of the plurality of heat pipes in the heat pipe group having one different characteristic parameter are different, and the plurality of heat pipes in the heat pipe group correspond to the optimal plurality An electronic device further comprising a heat pipe group, wherein the plurality of heat resistance ranges of the plurality of heat pipes in the heat pipe group is 0.05-1 ° C / W when operating in the operation area of   The characteristic parameters include the pipe diameter of the heat pipe, the capillary layer cross-sectional area of the heat pipe, the working material mass of the heat pipe, the type of working material of the heat pipe, the pipe material of the heat pipe, or the same pipe material The electronic device according to claim 1, wherein the thickness of the tube material of the plurality of heat pipes is one or more.   The electronic device according to claim 1 or 2, wherein a thermal interface material is disposed between the heat emitting element and the heat pipe group.   The electronic device according to any one of claims 1 to 3, wherein the heat emitting element is a CPU, a GPU, or a CPU and a GPU. The heat pipe group has two heat pipes, the characteristic parameter is the diameter of the heat pipe,
In the two heat pipes, the pipe diameter of the first heat pipe is different from that of the second heat pipe, and the first heat pipe and the second heat pipe exclude the pipe diameter of the heat pipe. If the tube diameter of the first heat pipe is larger than the tube diameter of the second heat pipe, the first heat pipe has a high temperature, having the same plurality of other characteristic parameters Efficiency heat pipe, the second heat pipe is a low temperature efficiency heat pipe, or the characteristic parameter is the capillary layer cross-sectional area of the heat pipe,
In the two heat pipes, the capillary layer cross-sectional area of the first heat pipe is different from that of the second heat pipe, and the first heat pipe and the second heat pipe cut the capillary layer of the heat pipe. If the capillary layer cross-sectional area of the first heat pipe is larger than the capillary layer cross-sectional area of the second heat pipe, the first heat pipe has a plurality of other characteristic parameters that are the same except for the area; 1 heat pipe is a high temperature efficiency heat pipe, the second heat pipe is a low temperature efficiency heat pipe, or the characteristic parameter is the working mass of the heat pipe,
In the two heat pipes, the working substance mass of the first heat pipe is different from that of the second heat pipe, and the first heat pipe and the second heat pipe carry the working substance mass of the heat pipe Actuating material having the same plurality of other characteristic parameters except that is injected into the first heat pipe equal to the actual capillary demand, injected into the second heat pipe The first heat pipe is a high temperature efficiency heat pipe and the second heat pipe is a low temperature efficiency heat pipe if the substance is less than the actual capillary demand, or
The characteristic parameter is the type of heat pipe working substance,
In the two heat pipes, the working substance of the first heat pipe is different from that of the second heat pipe, and the first heat pipe and the second heat pipe exclude the working substance of the heat pipe The first heat pipe having the same plurality of other characteristic parameters and when the latent heat of the working substance of the first heat pipe is greater than the latent heat of the working substance of the second heat pipe The electronic device according to claim 2, wherein is a high temperature efficiency heat pipe, and the second heat pipe is a low temperature efficiency heat pipe. An electronic device, the electronic device comprising a heat emitting element, the heat emitting element being disposed on a circuit board PCB, the electronic device comprising
A heat pipe, said heat pipe having at least two independent heat conduction paths, said heat pipe being located on said heat emitting element, and a plurality of heat conduction paths in said heat pipe being at least one The optimum operating regions of the heat transfer paths in the heat pipe having different characteristic parameters are different, and the heat transfer paths in the heat pipe correspond to the optimum plurality of heat transfer paths corresponding to the heat pipe. The electronic device further comprising a heat pipe, wherein when operating in an operating region, the plurality of thermal resistance ranges of the plurality of heat conduction paths in the heat pipe is 0.05-1 C / W.   The characteristic parameters include the diameter of the heat transfer path, the capillary layer cross-sectional area of the heat transfer path, the working substance mass of the heat transfer path, the type of working substance of the heat transfer path, and the tube material of the heat transfer path 7. The electronic device of claim 6, wherein the heat transfer path is one or more of a tube thickness.   The electronic device according to claim 6 or 7, wherein a thermal interface material is disposed between the heat emitting element and the heat pipe. An electronic device, the electronic device comprising a heat emitting element, the heat emitting element being disposed on a circuit board PCB, the electronic device comprising
A first heat pipe and a second heat pipe, wherein the first heat pipe and the heat emitting element are arranged on the same side of the PCB, and the first heat pipe is connected to the heat emitting element And
The second heat pipe is arranged at a second position of the PCB, the second heat pipe is connected to the heat emitting element using a heat conductive metal, and the heat emitting element is Placed on the back of the second position of the PCB,
The first heat pipe differs from the second heat pipe with respect to at least one characteristic parameter, and the optimum plurality of working areas of the first heat pipe and the second heat pipe differ. The plurality of heat resistance ranges of the first heat pipe and the second heat pipe may be 0. 0. when the heat pipe of the second heat pipe and the second heat pipe operate in the corresponding plurality of optimum operating regions. The electronic device further provided with the 1st heat pipe and the 2nd heat pipe which are 05-1 ° C / W. Specifically, the first heat pipe is connected to the heat emitting element.
The first heat pipe is located on the heat emitting element, and a thermal interface material is disposed between the first heat pipe and the heat emitting element, or
The electronic device according to claim 9, wherein the first heat pipe is connected to the heat emitting element using the thermally conductive metal, and the thermally conductive metal is a copper layer of the PCB.   The characteristic parameters include the pipe diameter of the heat pipe, the capillary layer cross-sectional area of the heat pipe, the working material mass of the heat pipe, the type of working material of the heat pipe, the pipe material of the heat pipe, or the same pipe material The electronic device according to claim 9 or 10, which is one or more of the tube material thickness of the plurality of heat pipes.

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